US20110100613A1 - Protective cap for coated heat sink and heat sink module having the same - Google Patents
Protective cap for coated heat sink and heat sink module having the same Download PDFInfo
- Publication number
- US20110100613A1 US20110100613A1 US12/825,351 US82535110A US2011100613A1 US 20110100613 A1 US20110100613 A1 US 20110100613A1 US 82535110 A US82535110 A US 82535110A US 2011100613 A1 US2011100613 A1 US 2011100613A1
- Authority
- US
- United States
- Prior art keywords
- heat sink
- flange
- section
- protective cap
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the disclosure relates to a protective cap for enclosing a coating such as thermal grease applied on a heat sink, and to a heat sink module including the heat sink and the protective cap.
- Heat sinks made by aluminum extrusion or with folded fins are popularly used to dissipate heat generated by electronic devices, for example, CPUs (central processing units).
- a conventional heat sink includes a base and a number of fins protruding from a top surface of the base.
- a bottom surface of the base is configured to thermally contact a CPU.
- a thermal grease is applied to the bottom surface of the base to help rapidly transfer the heat generated by the CPU to the heat sink.
- the heat generated by the CPU causes the thermal grease to become viscous thereby filling air gaps between the base of the heat sink and the CPU.
- the thermal grease is applied to the base of the heat sink in advance, prior to assembly of the heat sink with the CPU.
- the thermal grease is not always solid at certain ambient temperatures, and may contaminate surrounding articles.
- the thermal grease may be contaminated by dust or foreign particles before the heat sink is assembled to the CPU.
- FIG. 1 is an isometric, exploded view of a heat sink module including a heat sink and a protective cap in accordance with an exemplary embodiment of the disclosure, showing the heat sink module inverted.
- FIG. 2 is similar to FIG. 1 , but shows the protective cap in the process of being assembled to the heat sink.
- an exemplary heat sink module includes a heat sink 10 , a mounting plate 20 , a thermal interface material 30 and a protective cap 40 .
- the heat sink 10 includes a base 110 , a heat conducting block 120 integrally projecting from a bottom surface of the base 110 , and a fin assembly 130 integrally projecting from a top surface of the base 110 .
- the mounting plate 20 is configured to secure the heat sink 10 to other structures such as a printed circuit board (not shown) of a CPU module (not shown).
- the mounting plate 20 is disposed on the bottom surface of the base 110 , and defines an opening.
- the heat conducting block 120 extends through the opening.
- the mounting plate 20 is secured to the heat sink 10 by a number of screws 50 .
- the heat conducting block 120 includes a bottom surface 121 thermally contacting a CPU of the CPU module, and a number of side surfaces 122 perpendicularly connecting a circumference of the bottom surface 121 .
- the thermal interface material 30 can be thermal grease or phase change material. In the present embodiment, the thermal interface material 30 is thermal grease.
- the thermal interface material 30 is uniformly spread on a central portion of the bottom surface 121 of the heat conducting block 120 by a printing process, for example, a screen printing process.
- the protective cap 40 is removably attached to the heat conducting block 120 to cover the thermal interface material 30 therein. Therefore during transportation or handling of the heat sink 10 , the thermal interface material 30 is apt to not contaminate surrounding articles and not be contaminated by dust or foreign particles.
- the protective cap 40 is made by pressing a plastic sheet to have a predetermined configuration. Thus the protective cap 40 is a single, monolithic body of the same material.
- the protective cap 40 has a cover 41 , and a peripheral, stepped flange 42 extending outwardly from a peripheral edge of the cover 41 .
- the cover 41 includes a bottom wall 411 , and a polygon-shaped side wall 412 perpendicularly extending from a circumference of the bottom wall 411 .
- the bottom wall 411 and the side wall 412 commonly define a hollow, polyhedral protrusion with a corresponding cavity therein to protectively cover the thermal interface material 30 .
- the bottom wall 411 has a first side 4111 (i.e., a front side) and an opposite second side 4112 (i.e., a rear side).
- the flange 42 includes a first section 421 , a second section 422 , and a pair of connection sections 423 connected between the first and second sections 421 , 422 .
- the side wall 412 includes a first portion 4121 and a second portion 4122 .
- the first portion 4121 is connected between the first side 4111 of the bottom wall 411 and the first section 421 of the flange 42 .
- the second portion 4122 is connected between the second side 4112 of the bottom wall 411 and the second section 422 of the flange 42 .
- the first section 421 of the flange 42 extends horizontally and outwardly from a top edge of the first portion 4121 of the side wall 412 .
- the second section 422 of the flange 42 extends horizontally and outwardly from a top edge of the second portion 4122 of the side wall 412 .
- a distance between the first section 421 and the bottom wall 411 is larger than a distance between the second section 422 and the bottom wall 411 . That is, a height of the first portion 4121 is larger than that of the second portion 4122 .
- the connection sections 423 are obliquely connected between the first and second sections 421 , 422 .
- the first section 421 , the second section 422 and the connection sections 423 cooperatively form the stepped flange 42 .
- the shape and size of the side wall 412 of the cover 41 of the protective cap 40 are similar to the shape and size of the combination of the side surfaces 122 of the heat conducting block 120 .
- the flange 42 can fitly clip the side surfaces 122 of the heat conducting block 120 , thereby attaching the protective cap 40 on the heat conducting block 120 .
- a minimum distance between the bottom wall 411 of the cover 41 and the bottom surface of the base 110 is larger than a height (thickness) of the heat conducting block 120 .
- the bottom wall 411 of the cover 41 cannot contact the thermal interface material 30 disposed on the bottom surface 121 of the heat conducting block 120 .
- the minimum distance between the bottom wall 411 of the cover 41 and the bottom surface of the base 110 i.e., a minimum height of the first portion 4121 of the side wall 412 , is larger than the height of the heat conducting block 120 .
- the height of the first portion 4121 of the side wall 412 is larger than that of the second portion 4122 of the side wall 412 . Therefore when the protective cap 40 is attached on the heat conducting block 120 , the first section 421 of the flange 42 contacts the bottom surface of the base 110 of the heat sink 10 , and the second section 422 of the flange 42 and the bottom surface of the base 110 of the heat sink 10 are spaced apart from each other a predetermined distance.
- the second section 422 of the flange 42 functions as an operation part of the protective cap 40 , by which the protective cap 40 can be easily attached to or removed from the heat conducting block 120 .
- the second section 422 of the flange 42 is pressed on a surface of the mounting plate 20 . Due to a difference in height between the first section 421 of the flange 42 and the second section 422 of the flange 42 , the protective cap 40 is initially oblique to the mounting plate 20 . Then the front side of the cover 41 of the protective cap 40 is deformably pulled away from the second section 422 of the flange 42 and then pulled down (as viewed in FIG. 2 ), to enable the protective cap 40 to cover the heat conducting block 120 .
- the front side of the cover 41 is released, thereby also releasing the second section 422 of the flange 42 , and the first and second sections 421 , 422 of the flange 42 surround and clip the side surfaces 122 of the heat conducting block 120 .
- the first section 421 of the flange 42 contacts the bottom surface of the base 110
- the second section 422 of the flange 42 is spaced apart from the bottom surface of the base 110 .
- the thermal interface material 30 disposed on the heat sink 10 can be covered by the protective cap 40 .
- the thermal interface material 30 is apt to not contaminate surrounding articles and not be contaminated by dust or foreign particles before the heat sink 10 is assembled to other structures.
- the protective cap 40 having the stepped flange 42 , the protective cap 40 can be easily assembled to or dissembled from the heat sink 10 .
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An exemplary heat sink module includes a heat sink, a thermal interface material and a protective cap. The heat sink includes a base and a heat conducting block integrally projecting from a bottom surface of the base. The thermal interface material is disposed on a bottom surface of the heat conducting block. The protective cap is removably attached to the heat conducting block to cover the thermal interface material therein. The protective cap includes a cover and a stepped flange extending outwardly from a periphery edge of the cover.
Description
- 1. Technical Field
- The disclosure relates to a protective cap for enclosing a coating such as thermal grease applied on a heat sink, and to a heat sink module including the heat sink and the protective cap.
- 2. Description of Related Art
- Heat sinks made by aluminum extrusion or with folded fins are popularly used to dissipate heat generated by electronic devices, for example, CPUs (central processing units). A conventional heat sink includes a base and a number of fins protruding from a top surface of the base. A bottom surface of the base is configured to thermally contact a CPU. A thermal grease is applied to the bottom surface of the base to help rapidly transfer the heat generated by the CPU to the heat sink. The heat generated by the CPU causes the thermal grease to become viscous thereby filling air gaps between the base of the heat sink and the CPU. The thermal grease is applied to the base of the heat sink in advance, prior to assembly of the heat sink with the CPU. However, the thermal grease is not always solid at certain ambient temperatures, and may contaminate surrounding articles. In addition, in a variety of ambient environments, the thermal grease may be contaminated by dust or foreign particles before the heat sink is assembled to the CPU.
- The above-described considerations also similarly apply with regard to other types of thermal interface materials such as phase change material.
- What is needed, therefore, is a means for controlling thermal interface material applied on a heat sink, which means can overcome the above-described shortcomings. A heat sink module including such means is also desired.
- Many aspects of the present protective cap and heat sink module can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present protective cap and heat sink module. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an isometric, exploded view of a heat sink module including a heat sink and a protective cap in accordance with an exemplary embodiment of the disclosure, showing the heat sink module inverted. -
FIG. 2 is similar toFIG. 1 , but shows the protective cap in the process of being assembled to the heat sink. -
FIG. 3 is an assembled view ofFIG. 1 . - Referring to
FIG. 1 , an exemplary heat sink module includes aheat sink 10, amounting plate 20, athermal interface material 30 and aprotective cap 40. - The
heat sink 10 includes abase 110, aheat conducting block 120 integrally projecting from a bottom surface of thebase 110, and afin assembly 130 integrally projecting from a top surface of thebase 110. Themounting plate 20 is configured to secure theheat sink 10 to other structures such as a printed circuit board (not shown) of a CPU module (not shown). Themounting plate 20 is disposed on the bottom surface of thebase 110, and defines an opening. Theheat conducting block 120 extends through the opening. Themounting plate 20 is secured to theheat sink 10 by a number ofscrews 50. - The
heat conducting block 120 includes abottom surface 121 thermally contacting a CPU of the CPU module, and a number ofside surfaces 122 perpendicularly connecting a circumference of thebottom surface 121. Thethermal interface material 30 can be thermal grease or phase change material. In the present embodiment, thethermal interface material 30 is thermal grease. Thethermal interface material 30 is uniformly spread on a central portion of thebottom surface 121 of theheat conducting block 120 by a printing process, for example, a screen printing process. - The
protective cap 40 is removably attached to theheat conducting block 120 to cover thethermal interface material 30 therein. Therefore during transportation or handling of theheat sink 10, thethermal interface material 30 is apt to not contaminate surrounding articles and not be contaminated by dust or foreign particles. Theprotective cap 40 is made by pressing a plastic sheet to have a predetermined configuration. Thus theprotective cap 40 is a single, monolithic body of the same material. Theprotective cap 40 has acover 41, and a peripheral, steppedflange 42 extending outwardly from a peripheral edge of thecover 41. Thecover 41 includes abottom wall 411, and a polygon-shaped side wall 412 perpendicularly extending from a circumference of thebottom wall 411. Thebottom wall 411 and theside wall 412 commonly define a hollow, polyhedral protrusion with a corresponding cavity therein to protectively cover thethermal interface material 30. Thebottom wall 411 has a first side 4111 (i.e., a front side) and an opposite second side 4112 (i.e., a rear side). Theflange 42 includes afirst section 421, asecond section 422, and a pair ofconnection sections 423 connected between the first andsecond sections side wall 412 includes afirst portion 4121 and asecond portion 4122. Thefirst portion 4121 is connected between thefirst side 4111 of thebottom wall 411 and thefirst section 421 of theflange 42. Thesecond portion 4122 is connected between thesecond side 4112 of thebottom wall 411 and thesecond section 422 of theflange 42. - The
first section 421 of theflange 42 extends horizontally and outwardly from a top edge of thefirst portion 4121 of theside wall 412. Thesecond section 422 of theflange 42 extends horizontally and outwardly from a top edge of thesecond portion 4122 of theside wall 412. A distance between thefirst section 421 and thebottom wall 411 is larger than a distance between thesecond section 422 and thebottom wall 411. That is, a height of thefirst portion 4121 is larger than that of thesecond portion 4122. Thus theconnection sections 423 are obliquely connected between the first andsecond sections first section 421, thesecond section 422 and theconnection sections 423 cooperatively form thestepped flange 42. - The shape and size of the
side wall 412 of thecover 41 of theprotective cap 40 are similar to the shape and size of the combination of theside surfaces 122 of theheat conducting block 120. Thus theflange 42 can fitly clip theside surfaces 122 of theheat conducting block 120, thereby attaching theprotective cap 40 on theheat conducting block 120. A minimum distance between thebottom wall 411 of thecover 41 and the bottom surface of thebase 110 is larger than a height (thickness) of theheat conducting block 120. Thus when theprotective cap 40 is attached on theheat conducting block 120, thebottom wall 411 of thecover 41 cannot contact thethermal interface material 30 disposed on thebottom surface 121 of theheat conducting block 120. - In the present embodiment, the minimum distance between the
bottom wall 411 of thecover 41 and the bottom surface of thebase 110, i.e., a minimum height of thefirst portion 4121 of theside wall 412, is larger than the height of theheat conducting block 120. In addition, the height of thefirst portion 4121 of theside wall 412 is larger than that of thesecond portion 4122 of theside wall 412. Therefore when theprotective cap 40 is attached on theheat conducting block 120, thefirst section 421 of theflange 42 contacts the bottom surface of thebase 110 of theheat sink 10, and thesecond section 422 of theflange 42 and the bottom surface of thebase 110 of theheat sink 10 are spaced apart from each other a predetermined distance. Due to the relationship between thesecond section 422 of theflange 42 and the bottom surface of thebase 110, thesecond section 422 of theflange 42 functions as an operation part of theprotective cap 40, by which theprotective cap 40 can be easily attached to or removed from theheat conducting block 120. - Referring to
FIG. 2 , to assemble theprotective cap 40 to theheat conducting block 120, thesecond section 422 of theflange 42 is pressed on a surface of themounting plate 20. Due to a difference in height between thefirst section 421 of theflange 42 and thesecond section 422 of theflange 42, theprotective cap 40 is initially oblique to themounting plate 20. Then the front side of thecover 41 of theprotective cap 40 is deformably pulled away from thesecond section 422 of theflange 42 and then pulled down (as viewed inFIG. 2 ), to enable theprotective cap 40 to cover theheat conducting block 120. The front side of thecover 41 is released, thereby also releasing thesecond section 422 of theflange 42, and the first andsecond sections flange 42 surround and clip theside surfaces 122 of theheat conducting block 120. As shown inFIG. 3 , after theprotective cap 40 is assembled to theheat sink 10, thefirst section 421 of theflange 42 contacts the bottom surface of thebase 110, and thesecond section 422 of theflange 42 is spaced apart from the bottom surface of thebase 110. - Unlike with a conventional heat sink module, the
thermal interface material 30 disposed on theheat sink 10 can be covered by theprotective cap 40. Thus, thethermal interface material 30 is apt to not contaminate surrounding articles and not be contaminated by dust or foreign particles before theheat sink 10 is assembled to other structures. In addition, due to theprotective cap 40 having the steppedflange 42, theprotective cap 40 can be easily assembled to or dissembled from theheat sink 10. - It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the configurations and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (20)
1. A heat sink module comprising:
a heat sink comprising a base and a heat conducting block projecting from a bottom surface of the base;
a thermal interface material disposed on a bottom surface of the heat conducting block; and
a protective cap removably attached to the heat conducting block to cover the thermal interface material therein, wherein the protective cap comprises a cover and a stepped flange extending outwardly from a peripheral edge of the cover.
2. The heat sink module of claim 1 , wherein the protective cap is a single, monolithic body made of plastic.
3. The heat sink module of claim 1 , wherein the cover comprises a bottom wall and a polygon-shaped side wall extending from a circumference of the bottom wall, and the bottom wall and the side wall commonly define a hollow, polyhedral protrusion with a corresponding cavity therein to protectively cover the thermal interface material.
4. The heat sink module of claim 3 , wherein the flange extends from a top of the side wall and comprises a first section and a second section, the side wall comprises a first portion between the first section of the flange and the bottom wall, and a second portion between the second section of the flange and the bottom wall, and a height of the first portion is larger than that of the second portion.
5. The heat sink module of claim 4 , wherein the first section of the flange contacts the bottom surface of the base, and the second section of the flange is spaced from the bottom surface of the base a predetermined distance.
6. The heat sink module of claim 5 , wherein the height of the first portion of the side wall of the cover is larger than that of the heat conducting block.
7. The heat sink module of claim 1 , wherein the thermal interface material is one of thermal grease and phase change material.
8. The heat sink module of claim 1 , wherein the heat sink further comprises a fin assembly integrally projecting from a top surface of the base.
9. A protective cap comprising:
a cover comprising a bottom wall and a polygon-shaped side wall extending from a circumference of the bottom wall; and
a peripheral, stepped flange extending outwardly from a top of the side wall, the flange comprising a first section and a second section;
wherein the side wall of the cover comprises a first portion between the first section of the flange and the bottom wall, and a second portion between the second section of the flange and the bottom wall, and a height of the first portion is larger than that of the second portion.
10. The protective cap of claim 9 , wherein the protective cap is plastic and has an integral configuration.
11. The protective cap of claim 9 , wherein the bottom wall and the side wall commonly define a hollow, polyhedral protrusion with a corresponding cavity therein.
12. The protective cap of claim 9 , wherein the flange comprises a connection section obliquely connected between the first section and the second section.
13. A heat sink module comprising:
a heat sink comprising a base and a heat conducting block integrally projecting from a bottom surface of the base;
a thermal interface material disposed on a bottom surface of the heat conducting block; and
a protective cap removably attached to the heat conducting block to enclose the thermal interface material therein;
wherein the protective cap comprises a cover and a flange extending outwardly from a top edge of the cover, the cover comprises a bottom wall and a polygon-shaped side wall extending up from a circumference of the bottom wall, the flange comprises a first section and a second section, and a distance between any point of the first section of the flange and the bottom wall is larger than that between any point of the second section of the flange and the bottom wall.
14. The heat sink module of claim 13 , wherein the protective cap is plastic and has an integral configuration.
15. The heat sink module of claim 13 , wherein the bottom wall and the side wall cooperatively define a hollow, polyhedral protrusion with a corresponding cavity therein to protectively cover the thermal interface material.
16. The heat sink module of claim 13 , wherein the side wall comprises a first portion between the first section of the flange and the bottom wall, and a second portion between the second section of the flange and the bottom wall, a height of the first portion of the flange is larger than that of the second portion of the flange.
17. The heat sink module of claim 16 , wherein the first section of the flange contacts the bottom surface of the base, and the second section of the flange spaces the bottom surface of the base for a predetermined distance.
18. The heat sink module of claim 17 , wherein the height of the first portion of the side wall of the cover is larger than that of the heat conducting block.
19. The heat sink module of claim 13 , wherein the thermal interface material is one of thermal grease or phase change material.
20. The heat sink module of claim 13 , wherein a fin assembly integrally projecting from the base away from a top surface of the base.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910309184.9A CN102056460B (en) | 2009-10-30 | 2009-10-30 | Over cap and combination of radiating device |
CN200910309184.9 | 2009-10-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110100613A1 true US20110100613A1 (en) | 2011-05-05 |
Family
ID=43924161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/825,351 Abandoned US20110100613A1 (en) | 2009-10-30 | 2010-06-29 | Protective cap for coated heat sink and heat sink module having the same |
Country Status (2)
Country | Link |
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US (1) | US20110100613A1 (en) |
CN (1) | CN102056460B (en) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6049458A (en) * | 1997-12-01 | 2000-04-11 | Hon Hai Precision Ind. Co., Ltd. | Protective cap for thermal grease of heat sink |
US6952348B2 (en) * | 2003-06-11 | 2005-10-04 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly incorporating mounting frame |
US7349210B2 (en) * | 2005-05-29 | 2008-03-25 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Grease cover for heat dissipating apparatus |
US7365983B2 (en) * | 2005-05-24 | 2008-04-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Grease protecting apparatus for heat sink |
US20080289797A1 (en) * | 2007-05-23 | 2008-11-27 | Foxconn Technology Co., Ltd. | Heat dissipation device having cap for protecting thermal interface material thereon |
US20090067133A1 (en) * | 2007-09-06 | 2009-03-12 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink having protective device for thermal interface material spread thereon |
US20090231814A1 (en) * | 2008-03-11 | 2009-09-17 | Tai-Sol Electronics Co., Ltd. | Protective cap for thermal grease |
US7779895B2 (en) * | 2008-04-14 | 2010-08-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Protective device for protecting thermal interface material and fasteners of heat dissipation device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2370459Y (en) * | 1999-03-25 | 2000-03-22 | 富准精密工业(深圳)有限公司 | Protective lid for thermal delivery medium |
CN2715342Y (en) * | 2004-02-09 | 2005-08-03 | 陶钧炳 | A CPU heat sink |
-
2009
- 2009-10-30 CN CN200910309184.9A patent/CN102056460B/en active Active
-
2010
- 2010-06-29 US US12/825,351 patent/US20110100613A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6049458A (en) * | 1997-12-01 | 2000-04-11 | Hon Hai Precision Ind. Co., Ltd. | Protective cap for thermal grease of heat sink |
US6952348B2 (en) * | 2003-06-11 | 2005-10-04 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly incorporating mounting frame |
US7365983B2 (en) * | 2005-05-24 | 2008-04-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Grease protecting apparatus for heat sink |
US7349210B2 (en) * | 2005-05-29 | 2008-03-25 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Grease cover for heat dissipating apparatus |
US20080289797A1 (en) * | 2007-05-23 | 2008-11-27 | Foxconn Technology Co., Ltd. | Heat dissipation device having cap for protecting thermal interface material thereon |
US20090067133A1 (en) * | 2007-09-06 | 2009-03-12 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink having protective device for thermal interface material spread thereon |
US20090231814A1 (en) * | 2008-03-11 | 2009-09-17 | Tai-Sol Electronics Co., Ltd. | Protective cap for thermal grease |
US7779895B2 (en) * | 2008-04-14 | 2010-08-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Protective device for protecting thermal interface material and fasteners of heat dissipation device |
Also Published As
Publication number | Publication date |
---|---|
CN102056460A (en) | 2011-05-11 |
CN102056460B (en) | 2016-05-11 |
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Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, JIAN;ZHANG, JING;REEL/FRAME:024613/0466 Effective date: 20100627 Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, JIAN;ZHANG, JING;REEL/FRAME:024613/0466 Effective date: 20100627 |
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STCB | Information on status: application discontinuation |
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