CN2715342Y

CN2715342Y - A CPU heat sink

Info

Publication number: CN2715342Y
Application number: CN 200420002290
Authority: CN
Inventors: 陶钧炳; 陶松垒
Original assignee: Individual
Current assignee: Individual
Priority date: 2004-02-09
Filing date: 2004-02-09
Publication date: 2005-08-03
Anticipated expiration: 2014-02-09

Abstract

The utility model relates to a CPU heat radiator which is a heat radiation device of a computer and a large-scale integrated circuit and is the combination of a heat pipe technology and the CPU heat radiator, and the CPU heat radiator comprises a fan (1), heat radiation sheets (2), heat radiation cream (4), a fixing device, etc. The utility model is characterized in that at least one closed cavity body is used as a heat radiation pipe (3), and working substances and capillary sucking cores are charged in the cavity body. The circulation is formed by that liquid (6) is gasified at the high-temperature end and is liquefied at the low-temperature end, a CPU (5) has temperature drop, and thus, the heat radiation efficiency of the whole system is higher than the metal direct heat conduction. The utility model has the characteristics of superconductive heat radiation performance, preferable control performance, small size, small weight, low price, etc.

Description

A kind of cpu heat

Technical field: a kind of cpu heat, relate to the heat abstractor of computer CPU (central processing unit) and various large-scale integrated circuits, be the improvement of existing radiator, be hot pipe technique and a kind of new the combining of existing cpu heat.

Background technology: electronic technology develops rapidly in recent years, and the intensive and miniaturization of the high frequency of electronic device, high speed and integrated circuit increases the caloric value of the electronic device of unit volume fast.The normal working temperature of electronic device is-5～+ 65 ℃, surpasses this scope, and element function will significantly descend, and can not influence the stability of moving by steady operation.Yet existing radiating element is but because the restriction heat dispersion of material can't improve again.

Existing fin is based on simple metal system radiating fin.Yet but the CPU contact area is little, the caloric value height, thereby from CPU in the heat transfer of fin and fin from temperature end to around conduction of velocity become the bottleneck of CPU heat radiation, the means of existing increase area of dissipation can not be dealt with problems.Is that peripheral fin make mixed type cooling system as inner core with aluminium with copper, owing to can't closely cooperate and will cause radiating efficiency to descend greatly between copper aluminium.The heat abstractor that adopts boiler water circulation is also arranged, but have problems such as the big energy consumption of volume is big.

Summary of the invention: the utility model designs a kind of computer CPU heat sink at the problems referred to above, is intended to make it that volume is little, in light weight, radiating efficiency is high, price is low, the radiator of environment-friendly type.

The utility model as shown in Figure 1, by fan (1), fin (2), thermal grease (4) and accessory fixture are formed.Its core is fin (2).The profile of fin (2) partly is a radiating fin, according to increasing area of dissipation, promotes the principle of air flows to distribute.Fin (2) center is the airtight cavity (3) of hollow, should keep cavity wall thickness on every side about equally.Be filled with a certain amount of working medium (9) in the cavity (3), boiling point is used for the circulating transfer heat between 30～45 ℃, and the capillary that also can be provided with vertical arrangement is inhaled core (12).

Working medium wherein is to be mixed by one or more lower boiling liquid (as ethanol, acetone etc.), makes working medium under certain air pressure, and lower temperature just can be seethed with excitement.The cavity internal gas pressure can be lower than ambient pressure, also can be identical in ambient pressure.The cavity internal gas pressure increases when liquid boiling, and boiling point of liquid will be risen.And form the system of a balance, make the temperature end temperature have rising that horse back is caused that circulation equates the two ends temperature again slightly.The effect that the capillary that temperature end is vertically arranged is inhaled core is to make the gas-liquid circulation more unimpeded, and guiding liquids flows to temperature end, and is not subjected to gravity effect.

On the low-temperature end of fin or the fin fan is housed, further promotes heat to be spread in the air circulation of air.Temperature end cushions heat-conducting glue and is close on the CPU, and is fixed with fixture.Because the radiating efficiency of central cavity is fine, the heat radiation power size can be adjusted by the surface area that changes radiator.

The utility model operation principle is to utilize liquid in temperature end gasification or boiling, gas-liquid convection, and band is from heat, and gas liquefies in low-temperature end, and formation circulates and is the CPU cooling.When the temperature of CPU is elevated to a regularly working medium boiling of temperature end, part working medium gasification movement is to low-temperature end, and the working medium of low-temperature end condenses into liquid again, flows back to temperature end.On the other hand, in airtight container, because liquid refrigerant becomes gaseous state, volume increases, and pressure increases, and has accelerated condensing of gaseous working medium.The numerical value of the heat of gasification of liquid is bigger, adds that the speed of gas-liquid convection is very fast, so the radiating efficiency of whole system will be much higher than the direct heat conduction of metal.(the conductive coefficient 386w/m of copper ℃, the conductive coefficient 215w/m of aluminium ℃, the conductive coefficient 5500～100000w/m of steam ℃)

Description of drawings: Fig. 1 is embodiment one, the front view of L type radiator; Fig. 2 is embodiment one, the end view of L type radiator; Fig. 3 is embodiment two, the front view of O type radiator; Fig. 4 is embodiment two, the end view of O type radiator

Embodiment:

Embodiment one: L type radiator, and structure such as Fig. 1 Fig. 2 are in series by a plurality of units radiating tubes (3), and about outward-dipping 15 degree of radiating tube epimere, its cross section becomes long narrow shape, is dispelled the heat behind fixing cooling fins (2) and the fan (1).Hypomere is lined with thermal grease (4) and is close to fixing with CPU (5).Suitable level or the vertical CPU that places.Condensed drop flows down automatically because of gravity.If vertical the placement, metal line (6) should be higher than the peak of CPU.

Embodiment two: O type radiator, and structure such as Fig. 3 Fig. 4, cavity one end of tubulose cushion thermal grease (10) and are close to CPU (11), and the other end is equipped with fan (7).The cavity outside is distributed with fin (8), and fin and cavity combine as a whole.The cavity built-in has capillary to inhale core (12), and working medium (9) is the mixing material of 70% acetone, 30% ethanol.Can bleed reduces the cavity internal gas pressure, in order to adjust operating temperature range, reaches better radiating effect.Because axially heat radiation is exceedingly fast, when the CPU heating power strengthened, the length of need only extend cavity and fin got final product.

Advantage of the present utility model: 1. because the heat of gasification numerical value of the quick convection current of steam and liquid is bigger, so the thermal diffusivity of superconduction is arranged, performance is higher tens times than existing radiator.2. because the boiling point of liquid is fixed,, can make the scope that cpu temperature is limited in to be needed so have superior controlledly.Because high heat-sinking capability and interior in cavity, thereby the volume weight that dwindles radiator that can be relative.4. because reducing of volume has bigger economy, can save a large amount of non-ferrous metals.

Claims

1. a cpu heat is made up of fan, fin, thermal grease and accessory fixture, it is characterized in that: the radiator center has an airtight cavity at least, in be filled with working medium and capillary and inhale core.Chamber outer wall is provided with fin.

2. a kind of cpu heat as claimed in claim 1 is characterized in that airtight cavity and fin make one by the higher metal material of conductive coefficient.

3. a kind of cpu heat as claimed in claim 1 is characterized in that the working medium that is provided with in the container is that boiling point is inhaled core at 30～45 ℃ plurality of reagents liquid and the capillary of vertically arranging.

4. a kind of cpu heat as claimed in claim 1 is characterized in that setting in the airtight cavity vacuum degree.

5. a kind of cpu heat as claimed in claim 1 is characterized in that airtight cavity lower end scribbles the thermal grease that can cover whole C PU.

6. a kind of cpu heat as claimed in claim 1 is characterized in that the length by heat radiation power size setting radiator.