US20110088881A1 - Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference - Google Patents
Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference Download PDFInfo
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- US20110088881A1 US20110088881A1 US12/588,468 US58846809A US2011088881A1 US 20110088881 A1 US20110088881 A1 US 20110088881A1 US 58846809 A US58846809 A US 58846809A US 2011088881 A1 US2011088881 A1 US 2011088881A1
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- fluid
- piping
- heat absorbing
- dissipating
- heat
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/047—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag
- F28D1/0477—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being bent in a serpentine or zig-zag
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D7/0066—Multi-circuit heat-exchangers, e.g. integrating different heat exchange sections in the same unit or heat-exchangers for more than two fluids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D7/08—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being otherwise bent, e.g. in a serpentine or zig-zag
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/10—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2210/00—Heat exchange conduits
- F28F2210/02—Heat exchange conduits with particular branching, e.g. fractal conduit arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2210/00—Heat exchange conduits
- F28F2210/10—Particular layout, e.g. for uniform temperature distribution
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/10—Particular pattern of flow of the heat exchange media
- F28F2250/102—Particular pattern of flow of the heat exchange media with change of flow direction
Definitions
- the present invention discloses that the conventional application device transmitting thermal conductive fluid to pass through the heat absorbing or dissipating body for heat absorption or dissipation is improved to be a heat absorbing or dissipating device with piping staggered and uniformly distributed from both sides toward the middle by passed temperature difference fluid, wherein the temperature difference fluid passes through the neighboring piping of the heat absorbing or dissipating device, and the synthetic temperature in the device is more uniform, so as to produce heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article or space thereby forming a more uniform temperature distribution status on the passively heat dissipation or absorption receiving article or space.
- FIG. 6 is a temperature difference distribution diagram formed on the structure shown in FIG. 4 being operated for heat dissipating warming energy discharge device function;
- FIG. 8 is a temperature difference distribution diagram formed on the structure shown in FIG. 7 being operated for heat absorbing cooling energy discharge device function;
- FIG. 10 shows an embodiment, wherein fluid piping 101 shown in FIG. 4 is composed by heat absorbing or dissipating thermal energy transmission body 100 combining with piping structural body transmitting the passively receiving heat absorbing or dissipating thermal conductive fluid 100 ′, according to the present invention
- FIG. 12 shows an embodiment, wherein the fluid piping 101 shown in FIG. 4 is composed by the heat absorbing or dissipating thermal energy transmission body 100 combining with a number of the piping structural body transmitting the passively receiving heat absorbing or dissipating thermal conductive fluid 100 ′, according to the present invention
- FIG. 15 is a sectional drawing of line A-A in FIG. 14 ;
- FIG. 20 is an operation system schematic view, wherein thermal conductive fluid 110 is periodically bi-directionally pumped by a bi-directional fluid pump, according to the present invention.
- the heat absorbing or dissipating device assembly conventionally is composed by the thermal conductive fluid 110 , which is constituted by gaseous or liquid state fluid, or gaseous to liquid state fluid, or liquid to gaseous state fluid, passing through the first fluid piping 101 to combine with the heat absorbing or dissipating thermal energy transmission body 100 for 1) passing through the thermal conductive fluid 110 in the fluid piping 101 to perform cooling or heating functions through the heat absorbing or dissipating thermal energy transmission body 100 onto passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space 200 ; or 2) passing through the thermal conductive fluid 110 in the fluid piping 101 to reversely receive the surrounding cooling or heating energy of the heat absorbing or dissipating thermal energy transmission body 100 to perform cooling or heating functions; wherein the item 1) is often applied in engine cooling water radiators, heat absorbing cooling energy discharge devices utilizing the thermal conductive fluid 110 , or heat dissipating warming energy discharge devices utilizing the thermal conductive
- thermo energy transmission body 100 is in an assembled structure with the fluid piping 101 ;
- the function of the heat absorbing or dissipating thermal energy transmission body 100 is provided by the fluid piping 101 additionally installed with the independent thermal conductive plate 300 ;
- the function of the heat absorbing or dissipating thermal energy transmission body 100 is provided by the common thermal conductive plate 400 connected between the neighboring fluid piping 101 ;
- the function of the heat absorbing or dissipating thermal energy transmission body 100 is provided by the thermal conductive plate 350 with temperature insulating slots connected between the neighboring fluid piping 101 .
- the heat absorbing or dissipating thermal energy transmission body 100 is in an integral structure with the first branching fluid piping 1011 and/or the second branching fluid piping 1012 ;
- the fluid piping also can be parallel or quasi-parallel distributed in a plane structure or three-dimensional structure to construct the piping structural body transmitting the passively receiving heat absorbing or dissipating thermal conductive fluid 100 ′ in place of the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space 200 , by means of the fluid piping 101 transmitting the thermal conductive fluid 110 constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid, the heat absorbing or dissipating thermal energy transmission body 100 transmits thermal energy to the piping structural body transmitting the passively receiving heat absorbing or dissipating thermal conductive fluid 100 ′.
- FIG. 13 shows another embodiment, wherein the fluid piping 101 , first branching fluid piping 1011 , and second branching fluid piping 1012 shown in FIG. 7 are composed by the heat absorbing or dissipating thermal energy transmission body 100 combining with a number of the piping structural body transmitting the passively receiving heat absorbing or dissipating thermal conductive fluid 100 ′, according to the present invention.
- FIG. 16 is a structural schematic view of an embodiment, wherein common thermal conductive plate is installed between the fluid piping 101 , according to the present invention.
- the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference can be applied for various heat absorbing, or dissipating, or cooling heat conducting application devices, such as the cooling water radiators of the engine, or cooling energy discharge device using thermal conductive fluid for heat absorbing, or warming energy discharge device using thermal conductive fluid for heat dissipating, such as thermal energy transfer for warming equipments, heater or thermal energy transfer devices, or heating or cooling for ceilings, walls or floors of the buildings, or cooling of photovoltaic panels, or heating or cooling for electrical machine or power machineries, or heat absorption and dissipation of various machine casings, heat pipe structures, structure casings, various chips or semiconductor components, ventilation devices, or the heat absorption, heat dissipation or thermal energy transfer for information, audio, image devices, various lamp or LED devices, or the heat absorption of the evaporator or heat dissipation or thermal energy transfer of condensers of air conditioning devices, or thermal energy transfer of mechanical devices, or heat dissi
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to the heat absorbing or dissipating device with piping staggered and uniformly distributed from both sides toward the middle by passed temperature difference fluid, wherein the temperature difference fluid passes through the neighboring piping of the heat absorbing or dissipating device, and the synthetic temperature in the device is more uniform, so as to form a more uniform temperature distribution status on the passively heat dissipation or absorption receiving article or space.
Description
- (a) Field of the Invention
- The present invention relates to the heat absorbing or dissipating device with piping staggered and uniformly distributed from both sides toward the middle by passed temperature difference fluid, wherein the temperature difference fluid passes through the neighboring piping of the heat absorbing or dissipating device, and the synthetic temperature in the device is more uniform, so as to produce heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article or space thereby forming a more uniform temperature distribution status on the passively heat dissipation or absorption receiving article or space.
- (b) Description of the Prior
- For the conventional heat absorbing or dissipating devices by passing through thermal conductive fluid as the heat absorbing or dissipating body constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid such as engine cooling water radiators, heat absorbing cooling energy discharge devices utilizing thermal conductive fluid, or heat dissipating warming energy discharge devices such as warming devices, heaters, or the warming energy transfer device, as the flow direction of the thermal conductive fluid is fixed, larger temperature difference is formed at each position on the heat absorbing or dissipating body of the thermal conductive fluid.
- The present invention discloses that the conventional application device transmitting thermal conductive fluid to pass through the heat absorbing or dissipating body for heat absorption or dissipation is improved to be a heat absorbing or dissipating device with piping staggered and uniformly distributed from both sides toward the middle by passed temperature difference fluid, wherein the temperature difference fluid passes through the neighboring piping of the heat absorbing or dissipating device, and the synthetic temperature in the device is more uniform, so as to produce heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article or space thereby forming a more uniform temperature distribution status on the passively heat dissipation or absorption receiving article or space.
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FIG. 1 is a main structural schematic view of a heat absorbing or dissipating device for being passed through by thermal conductive fluid at fixed flow direction being constituted by conventional heat absorbing or dissipating gaseous or liquid state fluid or gaseous to liquid state fluid, or liquid to gaseous state fluid; -
FIG. 2 is a temperature difference distribution diagram ofFIG. 1 being operated for the heat absorbing cooling energy discharge device function; -
FIG. 3 is a temperature difference distribution diagram ofFIG. 1 being operated for the heat dissipating warming energy discharge device function; -
FIG. 4 is a main structural schematic view of an embodiment, according to the present invention; -
FIG. 5 is a temperature difference distribution diagram formed on the structure shown inFIG. 4 being operated for heat absorbing cooling energy discharge device function; -
FIG. 6 is a temperature difference distribution diagram formed on the structure shown inFIG. 4 being operated for heat dissipating warming energy discharge device function; -
FIG. 7 is a main structural schematic view of another embodiment, according to the present invention; -
FIG. 8 is a temperature difference distribution diagram formed on the structure shown inFIG. 7 being operated for heat absorbing cooling energy discharge device function; -
FIG. 9 is a temperature difference distribution diagram formed on the structure shown inFIG. 7 being operated for heat dissipating warming energy discharge device function; -
FIG. 10 shows an embodiment, whereinfluid piping 101 shown inFIG. 4 is composed by heat absorbing or dissipating thermalenergy transmission body 100 combining with piping structural body transmitting the passively receiving heat absorbing or dissipating thermalconductive fluid 100′, according to the present invention; -
FIG. 11 shows another embodiment, wherein thefluid piping 101, first branchingfluid piping 1011, and second branchingfluid piping 1012 shown inFIG. 7 are composed by the heat absorbing or dissipating thermalenergy transmission body 100 combining with the piping structural body transmitting the passively receiving heat absorbing or dissipating thermalconductive fluid 100′, according to the present invention; -
FIG. 12 shows an embodiment, wherein thefluid piping 101 shown inFIG. 4 is composed by the heat absorbing or dissipating thermalenergy transmission body 100 combining with a number of the piping structural body transmitting the passively receiving heat absorbing or dissipating thermalconductive fluid 100′, according to the present invention; -
FIG. 13 shows another embodiment, wherein thefluid piping 101, first branchingfluid piping 1011, and second branchingfluid piping 1012 shown inFIG. 7 are composed by the heat absorbing or dissipating thermalenergy transmission body 100 combining with a number of the piping structural body transmitting the passively receiving heat absorbing or dissipating thermalconductive fluid 100′, according to the present invention; -
FIG. 14 is a structural schematic view of an embodiment, wherein thefluid piping 101 is additionally connected with independent thermalconductive plate 300, according to the present invention; -
FIG. 15 is a sectional drawing of line A-A inFIG. 14 ; -
FIG. 16 is a structural schematic view of an embodiment, wherein common thermalconductive plate 400 is installed between thefluid piping 101, according to the present invention; -
FIG. 17 is a sectional drawing of line B-B inFIG. 16 ; -
FIG. 18 is a structural schematic view of an embodiment, wherein thermalconductive plate 350 with temperature insulating slots is installed between thefluid piping 101, according to the present invention; -
FIG. 19 is a sectional drawing of line C-C inFIG. 18 ; and -
FIG. 20 is an operation system schematic view, wherein thermalconductive fluid 110 is periodically bi-directionally pumped by a bi-directional fluid pump, according to the present invention. -
- 100: Heat absorbing or dissipating thermal energy transmission body
- 100′: Piping structural body transmitting the passively receiving heat absorbing or dissipating thermal conductive fluid
- 101: Fluid piping
- 102: Fluid inlet
- 103: Fluid outlet
- 110: Thermal conductive fluid
- 111: First branching fluid inlet
- 112: First branching fluid outlet
- 121: Second branching fluid inlet
- 122: Second branching fluid outlet
- 200: Passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space
- 300: Independent thermal conductive plate
- 350: Thermal conductive plate with temperature insulating slots
- 400: Common thermal conductive plate
- 500: Control device
- 600: Two-way movement of fluid pumping device
- 1011: First branching fluid piping
- 1012: Second branching fluid piping
-
FIG. 1 is a main structural schematic view of a heat absorbing or dissipating device for being passed through by thermal conductive fluid at fixed flow direction being constituted by conventional heat absorbing or dissipating gaseous or liquid state fluid or gaseous to liquid state fluid, or liquid to gaseous state fluid. As shown inFIG. 1 , the heat absorbing or dissipating device assembly conventionally is composed by the thermalconductive fluid 110, which is constituted by gaseous or liquid state fluid, or gaseous to liquid state fluid, or liquid to gaseous state fluid, passing through thefirst fluid piping 101 to combine with the heat absorbing or dissipating thermalenergy transmission body 100 for 1) passing through the thermalconductive fluid 110 in thefluid piping 101 to perform cooling or heating functions through the heat absorbing or dissipating thermalenergy transmission body 100 onto passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state orspace 200; or 2) passing through the thermalconductive fluid 110 in thefluid piping 101 to reversely receive the surrounding cooling or heating energy of the heat absorbing or dissipating thermalenergy transmission body 100 to perform cooling or heating functions; wherein the item 1) is often applied in engine cooling water radiators, heat absorbing cooling energy discharge devices utilizing the thermalconductive fluid 110, or heat dissipating warming energy discharge devices utilizing the thermalconductive fluid 110 such as warming devices, heaters, evaporators, condensers, or the cooling or warming energy transfer device; the latter item 2) is often applied in cooling or warming energy transfer devices; and in the item 1) application, the thermalconductive fluid 110 is inputting via the inlet of thefluid piping 101 at one side end of the heat absorbing or dissipating thermalenergy transmission body 100 and outputting via another side end thereby forming a larger temperature difference between the inlet and outlet of the thermalconductive fluid 110 of thefluid piping 101 of the heat absorbing or dissipating thermalenergy transmission body 100, and similarly in the item 2) application, it will form a larger temperature difference between the inlet and outlet of the thermalconductive fluid 110 of thefluid piping 101 of the heat absorbing or dissipating thermalenergy transmission body 100, which are the defects of the conventional heat absorbing or dissipating device. -
FIG. 2 is a temperature difference distribution diagram ofFIG. 1 being operated for the heat absorbing cooling energy discharge device function.FIG. 2 shows that the thermalconductive fluid 110 in fixed flow direction as shown inFIG. 1 being operated in the conventional heat dissipating warming energy discharge functions appears in unidirectional flow path distribution, wherein when the thermalconductive fluid 110 passes through thefluid piping 101, a larger temperature difference distribution status forms between the inlet and outlet of the thermalconductive fluid 110 of the heat absorbing or dissipating thermalenergy transmission body 100. -
FIG. 3 is a temperature difference distribution diagram ofFIG. 1 being operated for the heat dissipating warming energy discharge device function.FIG. 3 shows that the thermalconductive fluid 110 in fixed flow direction as shown inFIG. 1 being operated in the conventional heat absorbing cooling energy discharge function appears in unidirectional flow path distribution, wherein when the thermalconductive fluid 110 passes through thefluid piping 101, a larger temperature difference distribution status forms between the inlet and outlet of the thermalconductive fluid 110 of the heat absorbing or dissipating thermalenergy transmission body 100. - Aiming to above the phenomenon, the present invention innovatively discloses a device with fluid piping staggered and uniformly distributed from both sides toward the middle by passed temperature difference fluid, wherein the temperature difference fluid passes through the neighboring piping of the heat absorbing or dissipating device, and the synthetic temperature in the device is more uniform, so as to produce heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article or space thereby forming a more uniform temperature distribution status on the passively heat dissipation or absorption receiving article or space.
-
FIG. 4 is a main structural schematic view of an embodiment, according to the present invention. As shown inFIG. 4 , the assembly structure of the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference mainly comprises the following: -
- Heat absorbing or dissipating thermal energy transmission body 100: made of thermal conductive material in solid, or colloid, or liquid, or gaseous state, wherein the number of the heat absorbing or dissipating bodies (100) can be one or more than one;
- Fluid piping 101: made of good thermal conductive material, wherein the piping staggered and uniformly distributed from both sides toward the middle by passed temperature difference fluid, the temperature difference fluid passes through the neighboring piping of the heat absorbing or dissipating device, and the synthetic temperature in the device is more uniform; and
- the internal part of the
fluid piping 101 is used for passing through the thermalconductive fluid 110 constituted by gaseous or liquid state fluid, or gaseous to liquid state fluid, or liquid to gaseous state fluid, and the thermal energy of the internal part of thefluid piping 101 directly or through the heat absorbing or dissipating thermalenergy transmission body 100 performs heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state orspace 200; - the
fluid inlet 102 of thefluid piping 101 is used for receiving inflow of the thermalconductive fluid 110, and thefluid outlet 103 of thefluid piping 101 is used for outflow of the thermalconductive fluid 110; and - the
fluid piping 101 is parallel or quasi-parallel distributed in a plane structure or three-dimensional structure in the heat absorbing or dissipating thermalenergy transmission body 100 to allow the whole temperature difference of the heat absorbing or dissipating thermalenergy transmission body 100 more uniformly distributed for performing heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state orspace 200.
- The structural relationships between the heat absorbing or dissipating thermal
energy transmission body 100 and thefluid piping 101 as shown inFIG. 4 can be constituted by one or more relationships as following, including: - (1) the heat absorbing or dissipating thermal
energy transmission body 100 is in an assembled structure with thefluid piping 101; - (2) the heat absorbing or dissipating thermal
energy transmission body 100 is in an integral structure with thefluid piping 101; - (3) the function of the heat absorbing or dissipating thermal
energy transmission body 100 is directly provided by thefluid piping 101; - (4) the function of the heat absorbing or dissipating thermal
energy transmission body 100 is provided by thefluid piping 101 additionally installed with the independent thermalconductive plate 300; - (5) the function of the heat absorbing or dissipating thermal
energy transmission body 100 is provided by the common thermalconductive plate 400 connected between the neighboring fluid piping 101; and - (6) the function of the heat absorbing or dissipating thermal
energy transmission body 100 is provided by the thermalconductive plate 350 with temperature insulating slots connected between the neighboringfluid piping 101. -
FIG. 5 is a temperature difference distribution diagram formed on the structure shown inFIG. 4 being operated for heat absorbing cooling energy discharge device function. As shown inFIG. 5 , thefluid piping 101 is used for transmitting two flows of the thermalconductive fluids 110, which are the inputting thermalconductive fluid 110 and the outputting thermalconductive fluid 110 with temperature difference between them, and the heat absorbing or dissipating thermalenergy transmission body 100 demonstrates the middle temperature, which is more uniformly distributed, between the temperatures of the inputting thermalconductive fluid 110 and the outputting thermalconductive fluid 110, for performing the heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state orspace 200 to prevent the local low temperature from being too low. -
FIG. 6 is a temperature difference distribution diagram formed on the structure shown inFIG. 4 being operated for heat dissipating warming energy discharge device function. As shown inFIG. 6 , thefluid piping 101 is used for transmitting two flows of the thermalconductive fluids 110, which are the inputting thermalconductive fluid 110 and the outputting thermalconductive fluid 110 with temperature difference between them, and the heat absorbing or dissipating thermalenergy transmission body 100 demonstrates the middle temperature, which is more uniformly distributed, between the temperatures of the inputting thermalconductive fluid 110 and the outputting thermalconductive fluid 110, for performing the heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state orspace 200 to prevent the local high temperature from being too high. -
FIG. 7 shows another embodiment of the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference according to the present invention, wherein thefluid piping 101 is composed of two or more branching fluid piping, which are sequentially arranged from both sides toward the middle and gather together in thefluid piping 101. For the purpose of clear description, two branching fluid piping are exemplified inFIG. 7 , wherein the two branching fluid piping arranged from both sides toward the middle for transmitting the thermalconductive fluid 110 with temperature difference include first branchingfluid piping 1011 and second branchingfluid piping 1012, which are sequentially arranged from both sides toward the middle and gather together in thefluid piping 101, so as to directly or through the heat absorbing or dissipating thermalenergy transmission body 100 transmit thermal energy to the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state orspace 200, the further structure including: -
- Fluid piping 101: made of good thermal conductive material, wherein the first branching
fluid piping 1011 and the second branchingfluid piping 1012, which are placed between thefluid inlet 102 and thefluid outlet 103 of thefluid piping 101, are sequentially arranged from both sides toward the middle and gather together in thefluid piping 101 for transmitting the thermalconductive fluid 110 constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid, so as to directly or through the heat absorbing or dissipating thermalenergy transmission body 100 transmit thermal energy to the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state orspace 200; and
- Fluid piping 101: made of good thermal conductive material, wherein the first branching
- the first branching
fluid piping 1011 and the second branchingfluid piping 1012 are parallel or quasi-parallel distributed in a plane structure or three-dimensional structure to constitute a common structural body, in which: - between the
fluid inlet 102 and thefluid outlet 103 of thefluid piping 101 are placed with the first branchingfluid piping 1011 and the second branchingfluid piping 1012 or more than two piping, and thefluid inlet 102 and thefluid outlet 103 of thefluid piping 101 are installed at the two sides of the heat absorbing or dissipating thermalenergy transmission body 100 respectively; - the first branching fluid inlet 111 of the first branching
fluid piping 1011 and the second branching fluid inlet 121 of the second branchingfluid piping 1012 are parallel, and the first branching fluid outlet 112 of the first branchingfluid piping 1011 and the second branching fluid outlet 122 of the second branchingfluid piping 1012 are parallel, the above both used for transmitting the thermalconductive fluid 110; and - the first branching
fluid piping 1011 near thefluid inlet 102 and the second branchingfluid piping 1012 near thefluid inlet 102 are placed at the upper and the lower of the common structural body respectively, and the first branching fluid outlet 112 of the first branchingfluid piping 1011 and the second branching fluid outlet 122 of the second branchingfluid piping 1012 are parallel placed at the middle of the common structural body, for operational transmitting the thermalconductive fluid 110 to the common structural body constituted by the first branchingfluid piping 1011 and the second branchingfluid piping 1012 respectively, and then the common structural body with more uniformly distributed whole temperature difference directly or through the heat absorbing or dissipating thermalenergy transmission body 100 performs heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state orspace 200. - The structural relationships between the heat absorbing or dissipating thermal
energy transmission body 100 and the first branchingfluid piping 1011 and/or the second branchingfluid piping 1012 as shown inFIG. 7 can be constituted by one or more relationships as following, including: - (1) the heat absorbing or dissipating thermal
energy transmission body 100 is in an assembled structure with the first branchingfluid piping 1011 and/or the second branchingfluid piping 1012; - (2) the heat absorbing or dissipating thermal
energy transmission body 100 is in an integral structure with the first branchingfluid piping 1011 and/or the second branchingfluid piping 1012; - (3) the function of the heat absorbing or dissipating thermal
energy transmission body 100 is directly provided by the first branchingfluid piping 1011 and/or the second branchingfluid piping 1012; - (4) the function of the heat absorbing or dissipating thermal
energy transmission body 100 is provided by the first branchingfluid piping 1011 and/or the second branchingfluid piping 1012 additionally installed with the independent thermalconductive plate 300 disconnected with the neighboring piping; - (5) the function of the heat absorbing or dissipating thermal
energy transmission body 100 is provided by the common thermalconductive plate 400 connected between the neighboring fluid piping of the neighboring first branchingfluid piping 1011 and/or second branchingfluid piping 1012; and - (6) the function of the heat absorbing or dissipating thermal
energy transmission body 100 is provided by the thermalconductive plate 350 with temperature insulating slots connected between the neighboring fluid piping of the neighboring first branchingfluid piping 1011 and/or second branchingfluid piping 1012. -
FIG. 8 is a temperature difference distribution diagram formed on the structure shown inFIG. 7 being operated for heat absorbing cooling energy discharge device function. -
FIG. 9 is a temperature difference distribution diagram formed on the structure shown inFIG. 7 being operated for heat dissipating warming energy discharge device function. - The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference can be a common structural body directly constituted by the
fluid piping 101, and/or thr first branchingfluid piping 1011, and the second branchingfluid piping 1012, and the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state orspace 200. - As the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, the fluid piping also can be parallel or quasi-parallel distributed in a plane structure or three-dimensional structure to construct the piping structural body transmitting the passively receiving heat absorbing or dissipating thermal
conductive fluid 100′ in place of the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state orspace 200, by means of thefluid piping 101 transmitting the thermalconductive fluid 110 constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid, the heat absorbing or dissipating thermalenergy transmission body 100 transmits thermal energy to the piping structural body transmitting the passively receiving heat absorbing or dissipating thermalconductive fluid 100′. -
FIG. 10 shows an embodiment, wherein fluid piping 101 shown inFIG. 4 is composed by heat absorbing or dissipating thermalenergy transmission body 100 combining with piping structural body transmitting the passively receiving heat absorbing or dissipating thermalconductive fluid 100′, according to the present invention. -
FIG. 11 shows another embodiment, wherein thefluid piping 101, first branchingfluid piping 1011, and second branchingfluid piping 1012 shown inFIG. 7 are composed by the heat absorbing or dissipating thermalenergy transmission body 100 combining with the piping structural body transmitting the passively receiving heat absorbing or dissipating thermalconductive fluid 100′, according to the present invention. -
FIG. 12 shows an embodiment, wherein thefluid piping 101 shown inFIG. 4 is composed by the heat absorbing or dissipating thermalenergy transmission body 100 combining with a number of the piping structural body transmitting the passively receiving heat absorbing or dissipating thermalconductive fluid 100′, according to the present invention. -
FIG. 13 shows another embodiment, wherein thefluid piping 101, first branchingfluid piping 1011, and second branchingfluid piping 1012 shown inFIG. 7 are composed by the heat absorbing or dissipating thermalenergy transmission body 100 combining with a number of the piping structural body transmitting the passively receiving heat absorbing or dissipating thermalconductive fluid 100′, according to the present invention. - As the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, for further improving effects of heat absorption or dissipation, the independent thermal
conductive plate 300 is additionally installed at thefluid piping 101 and/or the piping structural body transmitting the passively receiving heat absorbing or dissipating thermalconductive fluid 100′, so as to improve effects of heat absorption or dissipation. -
FIG. 14 is a structural schematic view of an embodiment, wherein thefluid piping 101 is additionally connected with independent thermalconductive plate 300, according to the present invention. -
FIG. 15 is a sectional drawing of line A-A inFIG. 14 . - As the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, for further improving effects of heat absorption or dissipation, the common thermal
conductive plate 400 is installed between thefluid piping 101 and/or the piping structural body transmitting the passively receiving heat absorbing or dissipating thermalconductive fluid 100′, so as to improve effects of heat absorption or dissipation. -
FIG. 16 is a structural schematic view of an embodiment, wherein common thermal conductive plate is installed between thefluid piping 101, according to the present invention. -
FIG. 17 is a sectional drawing of line B-B inFIG. 16 . - As the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, for further improving effects of heat absorption or dissipation, the thermal
conductive plate 350 with temperature insulating slots is installed between thefluid piping 101 and/or the piping structural body transmitting the passively receiving heat absorbing or dissipating thermalconductive fluid 100′, so as to improve effects of heat absorption or dissipation. -
FIG. 18 is a structural schematic view of an embodiment, wherein thermal conductive plate with temperature insulating slots is installed between thefluid piping 101, according to the present invention. -
FIG. 19 is a sectional drawing of line C-C inFIG. 18 . - As the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, the fluid passing through the
fluid piping 101 and/or the piping structural body transmitting the passively receiving heat absorbing or dissipating thermalconductive fluid 100′ can be controlled bycontrol device 500 to drive two-way movement offluid pumping device 600 for periodic forward/reverse pumping operation, to periodically forward/reverse pump the thermalconductive fluid 110, and to improve effects of uniform temperature. - The two-way movement of
fluid pumping device 600 is used for periodic forward/reverse pumping under the control ofcontrol device 500 composed of electromechanical device, electronic device, or microcomputer and related software. -
FIG. 20 is an operation system schematic view, wherein thermalconductive fluid 110 is periodically bi-directionally pumped by a bi-directional fluid pump, according to the present invention. - For applications of the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, one or more methods based afore the operating principles according to application structural needs and cost considerations can be used to make the following designs, including:
-
- for the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, the fluid piping for the thermal
conductive fluid 110 passing through and the heat absorbing or dissipating thermalenergy transmission body 100 can be constituted by an integral type structure; - for the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, the fluid piping for the thermal
conductive fluid 110 passing through and the heat absorbing or dissipating thermalenergy transmission body 100 can be constituted by an assembled structure; - for the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, the fluid piping for the thermal
conductive fluid 110 passing through can be constituted by the structural unit of the single structural body in plate, block, or multi-fins shape, or the structural unit assembled by fins, and can be constituted by at least one structural unit; - for the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, which is composed of one or more units of the fluid piping for the thermal
conductive fluid 110 passing through, and the combinations of every unit are through series connection, or parallel, or series-parallel connection to be various side by side or superimposed geometric shapes; - for the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, the thermal
conductive fluid 110 passing through the fluid piping can be transported by pumping, evaporation, or heat-cold natural circulation; - for the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, the warming or cooling energy is discharged to the liquid state passively heat dissipation or absorption receiving article or
space 200 through using the cold-heat natural convection of fluid in temperature difference and/or forced fluid pumping to generate thermal transfer function of convection, and/or radiation, and/or conduction; or the warming or cooling energy is discharged to the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state orspace 200 through conduction; - for the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, the thermal
conductive fluid 110 passing through the fluid piping is closed-loop circulated or open-loop released; - for the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, the fluid inlets and the fluid outlets of the various fluid piping can be installed with same or different pointing direction within three-dimensional space; and
- for the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, there are various installation modes of the fluid piping, including that the fluid piping is composed of tubular structure, and/or the fluid piping is composed of plate sheet structure for fluid flow, and/or the pore-like fluid piping is composed of blocky structure for fluid flow.
- for the heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, the fluid piping for the thermal
- The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference can be applied for various heat absorbing, or dissipating, or cooling heat conducting application devices, such as the cooling water radiators of the engine, or cooling energy discharge device using thermal conductive fluid for heat absorbing, or warming energy discharge device using thermal conductive fluid for heat dissipating, such as thermal energy transfer for warming equipments, heater or thermal energy transfer devices, or heating or cooling for ceilings, walls or floors of the buildings, or cooling of photovoltaic panels, or heating or cooling for electrical machine or power machineries, or heat absorption and dissipation of various machine casings, heat pipe structures, structure casings, various chips or semiconductor components, ventilation devices, or the heat absorption, heat dissipation or thermal energy transfer for information, audio, image devices, various lamp or LED devices, or the heat absorption of the evaporator or heat dissipation or thermal energy transfer of condensers of air conditioning devices, or thermal energy transfer of mechanical devices, or heat dissipation of frictional heat loss, or heat dissipation or thermal energy transfer of electric heater or other electric heating home appliances or cooking devices, or heat absorption or thermal energy transfer of flame heating stoves or cooking devices, or heat absorption, heat dissipation or thermal energy transfer of earth layer or water thermal energy, plant or housing building or building material or building structure devices, heat absorbing or dissipation of water tower, or heat absorption, heat dissipation or thermal energy transfer of batteries or fuel cells; and
- applied for thermal energy transfer in home appliances, industrial products, electronic products, electrical machines or mechanical devices, power generation equipments, buildings, air conditioning devices, industrial equipments or industrial manufacturing process.
Claims (17)
1. A heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference, wherein the fluid piping staggered and uniformly distributed from both sides toward the middle by passed temperature difference fluid, the temperature difference fluid passes through the neighboring piping of the heat absorbing or dissipating device, and the synthetic temperature in the device is more uniform, so as to produce heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article or space thereby forming a more uniform temperature distribution status on the passively heat dissipation or absorption receiving article or space, the main components including:
Heat absorbing or dissipating thermal energy transmission body (100): made of thermal conductive material in solid, or colloid, or liquid, or gaseous state, wherein the number of the heat absorbing or dissipating body (100) is one or more than one;
Fluid piping (101): made of good thermal conductive material, wherein the piping staggered and uniformly distributed from both sides toward the middle by passed temperature difference fluid, the temperature difference fluid passes through the neighboring piping of the heat absorbing or dissipating device, and the synthetic temperature in the device is more uniform; and
the internal part of the fluid piping (101) is used for passing through the thermal conductive fluid (110) constituted by gaseous or liquid state fluid, or gaseous to liquid state fluid, or liquid to gaseous state fluid, and the thermal energy of the internal part of the fluid piping (101) directly or through the heat absorbing or dissipating thermal energy transmission body (100) performs heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200);
the fluid inlet (102) of the fluid piping (101) is used for receiving inflow of the thermal conductive fluid (110), and the fluid outlet (103) of the fluid piping (101) is used for outflow of the thermal conductive fluid (110); and
the fluid piping (101) is parallel or quasi-parallel distributed in a plane structure or three-dimensional structure in the heat absorbing or dissipating thermal energy transmission body (100) to allow the whole temperature difference of the heat absorbing or dissipating thermal energy transmission body (100) more uniformly distributed for performing heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200).
2. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 1 , wherein the structural relationships between the heat absorbing or dissipating thermal energy transmission body (100) and the fluid piping (101) are constituted by one or more relationships as following, including:
1) the heat absorbing or dissipating thermal energy transmission body (100) is in an assembled structure with the fluid piping (101);
2) the heat absorbing or dissipating thermal energy transmission body (100) is in an integral structure with the fluid piping (101);
3) the function of the heat absorbing or dissipating thermal energy transmission body (100) is directly provided by the fluid piping (101);
4) the function of the heat absorbing or dissipating thermal energy transmission body (100) is provided by the fluid piping (101) additionally installed with independent thermal conductive plate (300);
5) the function of the heat absorbing or dissipating thermal energy transmission body (100) is provided by common thermal conductive plate (400) connected between the neighboring fluid piping (101); and
6) the function of the heat absorbing or dissipating thermal energy transmission body (100) is provided by thermal conductive plate (350) with temperature insulating slots connected between the neighboring fluid piping (101).
3. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 1 , wherein the fluid piping (101) is composed of two or more branching fluid piping, which are sequentially arranged from both sides toward the middle and gather together in the fluid piping (101).
4. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 3 , wherein the two branching fluid piping arranged from both sides toward the middle for transmitting the thermal conductive fluid (110) with temperature difference include first branching fluid piping (1011) and second branching fluid piping (1012), which are sequentially arranged from both sides toward the middle and gather together in the fluid piping (101), so as to directly or through the heat absorbing or dissipating thermal energy transmission body (100) transmit thermal energy to the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200), the further structure including:
Fluid piping (101): made of good thermal conductive material, wherein the first branching fluid piping (1011) and the second branching fluid piping (1012), which are placed between the fluid inlet (102) and the fluid outlet (103) of the fluid piping (101), are sequentially arranged from both sides toward the middle and gather together in the fluid piping (101) for transmitting the thermal conductive fluid (110) constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid, so as to directly or through the heat absorbing or dissipating thermal energy transmission body (100) transmit thermal energy to the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200); and
the first branching fluid piping (1011) and the second branching fluid piping (1012) are parallel or quasi-parallel distributed in a plane structure or three-dimensional structure to constitute a common structural body, in which:
between the fluid inlet (102) and the fluid outlet (103) of the fluid piping (101) are placed with the first branching fluid piping (1011) and the second branching fluid piping (1012) or more than two piping, and the fluid inlet (102) and the fluid outlet (103) of the fluid piping (101) are installed at the two sides of the heat absorbing or dissipating thermal energy transmission body (100) respectively;
the first branching fluid inlet (111) of the first branching fluid piping (1011) and the second branching fluid inlet (121) of the second branching fluid piping (1012) are parallel, and the first branching fluid outlet (112) of the first branching fluid piping (1011) and the second branching fluid outlet (122) of the second branching fluid piping (1012) are parallel, the above both used for transmitting the thermal conductive fluid (110); and
the first branching fluid piping (1011) near the fluid inlet (102) and the second branching fluid piping (1012) near the fluid inlet (102) are placed at the upper and the lower of the common structural body respectively, and the first branching fluid outlet (112) of the first branching fluid piping (1011) and the second branching fluid outlet (122) of the second branching fluid piping (1012) are parallel placed at the middle of the common structural body, for operational transmitting the thermal conductive fluid (110) to the common structural body constituted by the first branching fluid piping (1011) and the second branching fluid piping (1012) respectively, and then the common structural body with more uniformly distributed whole temperature difference directly or through the heat absorbing or dissipating thermal energy transmission body (100) performs heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200).
5. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 1 , wherein the fluid piping is parallel or quasi-parallel distributed in a plane structure or three-dimensional structure to construct the piping structural body transmitting the passively receiving heat absorbing or dissipating thermal conductive fluid (100′) in place of the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200), by means of the fluid piping (101) transmitting the thermal conductive fluid (110) constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid, the heat absorbing or dissipating thermal energy transmission body (100) transmits thermal energy to the piping structural body transmitting the passively receiving heat absorbing or dissipating thermal conductive fluid (100′).
6. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 1 , wherein the independent thermal conductive plate (300), and/or the common thermal conductive plate (400), and/or the thermal conductive plate (350) with temperature insulating slots are additionally installed at the fluid piping (101) and/or the piping structural body transmitting the passively receiving heat absorbing or dissipating thermal conductive fluid (100′), so as to improve effects of heat absorption or dissipation.
7. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 1 , wherein the fluid passing through the fluid piping (101) and/or the piping structural body transmitting the passively receiving heat absorbing or dissipating thermal conductive fluid (100′) can be controlled by control device (500) to drive two-way movement of fluid pumping device (600) for periodic forward/reverse pumping operation, to periodically forward/reverse pump the thermal conductive fluid (110), and to improve effects of uniform temperature; and
the two-way movement of fluid pumping device (600) is used for periodic forward/reverse pumping under the control of control device (500) composed of electromechanical device, electronic device, or microcomputer and related software.
8. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 1 , wherein the fluid piping for the thermal conductive fluid (110) passing through and the heat absorbing or dissipating thermal energy transmission body (100) can be constituted by an integral type structure.
9. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 1 , wherein the fluid piping for the thermal conductive fluid (110) passing through and the heat absorbing or dissipating thermal energy transmission body (100) can be constituted by an assembled structure.
10. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 1 , wherein the fluid piping for the thermal conductive fluid (110) passing through is constituted by the structural unit of the single structural body in plate, block, or multi-fins shape, or the structural unit assembled by fins, and is constituted by at least one structural unit.
11. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 1 , wherein the device is composed of one or more units of the fluid piping for the thermal conductive fluid (110) passing through, and the combinations of every unit are through series connection, or parallel, or series-parallel connection to be various side by side or superimposed geometric shapes.
12. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 1 , wherein the thermal conductive fluid (110) passing through the fluid piping is transported by pumping, evaporation, or heat-cold natural circulation.
13. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 1 , wherein the warming or cooling energy is discharged to the liquid state passively heat dissipation or absorption receiving article or space (200) through using the cold-heat natural convection of fluid in temperature difference and/or forced fluid pumping to generate thermal transfer function of convection, and/or radiation, and/or conduction; or the warming or cooling energy is discharged to the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200) through conduction.
14. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 1 , wherein the thermal conductive fluid (110) passing through the fluid piping is closed-loop circulated or open-loop released.
15. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 1 , wherein the fluid inlets and the fluid outlets of the various fluid piping are installed with same or different pointing direction within three-dimensional space.
16. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 1 , wherein there are various installation modes of the fluid piping, including that the fluid piping is composed of tubular structure, and/or the fluid piping is composed of plate sheet structure for fluid flow, and/or the pore-like fluid piping is composed of blocky structure for fluid flow.
17. The heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference as claimed in claim 1 , wherein the device is applied for various heat absorbing, or dissipating, or cooling heat conducting application devices, such as the cooling water radiators of the engine, or cooling energy discharge device using thermal conductive fluid for heat absorbing, or warming energy discharge device using thermal conductive fluid for heat dissipating, such as thermal energy transfer for warming equipments, heater or thermal energy transfer devices, or heating or cooling for ceilings, walls or floors of the buildings, or cooling of photovoltaic panels, or heating or cooling for electrical machine or power machineries, or heat absorption and dissipation of various machine casings, heat pipe structures, structure casings, various chips or semiconductor components, ventilation devices, or the heat absorption, heat dissipation or thermal energy transfer for information, audio, image devices, various lamp or LED devices, or the heat absorption of the evaporator or heat dissipation or thermal energy transfer of condensers of air conditioning devices, or thermal energy transfer of mechanical devices, or heat dissipation of frictional heat loss, or heat dissipation or thermal energy transfer of electric heater or other electric heating home appliances or cooking devices, or heat absorption or thermal energy transfer of flame heating stoves or cooking devices, or heat absorption, heat dissipation or thermal energy transfer of earth layer or water thermal energy, plant or housing building or building material or building structure devices, heat absorbing or dissipation of water tower, or heat absorption, heat dissipation or thermal energy transfer of batteries or fuel cells; and
applied for thermal energy transfer in home appliances, industrial products, electronic products, electrical machines or mechanical devices, power generation equipments, buildings, air conditioning devices, industrial equipments or industrial manufacturing process.
Priority Applications (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW098219191U TWM396600U (en) | 2009-10-16 | 2009-10-16 | Heat absorbing or disspating device with piping staggered and uniformly distributed by temperature difference |
CN2009101799928A CN102042774A (en) | 2009-10-16 | 2009-10-16 | Heat absorption or release device with flow paths distributed alternatively and evenly according to temperature difference |
CN200920218696XU CN201715902U (en) | 2009-10-16 | 2009-10-16 | Heat absorbing or releasing device with flow paths staggered and evenly distributed according to temperature difference |
US12/588,468 US20110088881A1 (en) | 2009-10-16 | 2009-10-16 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
SG201007469-8A SG170688A1 (en) | 2009-10-16 | 2010-10-12 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
JP2010230370A JP2011085384A (en) | 2009-10-16 | 2010-10-13 | Heat absorbing or radiating device |
CA2717562A CA2717562A1 (en) | 2009-10-16 | 2010-10-13 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
JP2010006839U JP3165009U (en) | 2009-10-16 | 2010-10-14 | Heat absorption or heat dissipation device |
BRPI1003952-0A BRPI1003952A2 (en) | 2009-10-16 | 2010-10-15 | stepped pipe absorber or heatsink evenly distributed over temperature difference |
RU2010142320/06A RU2010142320A (en) | 2009-10-16 | 2010-10-15 | DEVICE FOR ABSORPTION OR REMOVAL OF HEAT WITH A PIPELINE LOCATED ZIGZAGOALLY AND UNIFORMLY DISTRIBUTED IN ACCORDANCE WITH THE DIFFERENCE OF TEMPERATURES |
AU2010235861A AU2010235861A1 (en) | 2009-10-16 | 2010-10-15 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
EP10187801A EP2314968A3 (en) | 2009-10-16 | 2010-10-15 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
KR1020100110822A KR20120049525A (en) | 2009-10-16 | 2010-11-09 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW098219191U TWM396600U (en) | 2009-10-16 | 2009-10-16 | Heat absorbing or disspating device with piping staggered and uniformly distributed by temperature difference |
US12/588,468 US20110088881A1 (en) | 2009-10-16 | 2009-10-16 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
CN200920218696XU CN201715902U (en) | 2009-10-16 | 2009-10-16 | Heat absorbing or releasing device with flow paths staggered and evenly distributed according to temperature difference |
CN2009101799928A CN102042774A (en) | 2009-10-16 | 2009-10-16 | Heat absorption or release device with flow paths distributed alternatively and evenly according to temperature difference |
KR1020100110822A KR20120049525A (en) | 2009-10-16 | 2010-11-09 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
Publications (1)
Publication Number | Publication Date |
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US20110088881A1 true US20110088881A1 (en) | 2011-04-21 |
Family
ID=51228829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/588,468 Abandoned US20110088881A1 (en) | 2009-10-16 | 2009-10-16 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
Country Status (11)
Country | Link |
---|---|
US (1) | US20110088881A1 (en) |
EP (1) | EP2314968A3 (en) |
JP (1) | JP2011085384A (en) |
KR (1) | KR20120049525A (en) |
CN (2) | CN102042774A (en) |
AU (1) | AU2010235861A1 (en) |
BR (1) | BRPI1003952A2 (en) |
CA (1) | CA2717562A1 (en) |
RU (1) | RU2010142320A (en) |
SG (1) | SG170688A1 (en) |
TW (1) | TWM396600U (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US20160109197A1 (en) * | 2014-10-15 | 2016-04-21 | Hamilton Sundstrand Corporation | Prevention of cooling flow blockage |
US9322723B2 (en) | 2012-07-10 | 2016-04-26 | General Electric Company | Energy harvesting survey apparatus and method of detecting thermal energy |
ITUB20161177A1 (en) * | 2016-02-29 | 2017-08-29 | Torino Politecnico | Prefabricated modular energy concept, a lining for tunnels made with a plurality of such segments and a method for exchanging heat in a tunnel by providing a coating with a plurality of such segments |
US20190129479A1 (en) * | 2016-04-15 | 2019-05-02 | Zheming Zhou | Water cooling plate composed of multi channels |
US20210164738A1 (en) * | 2018-09-04 | 2021-06-03 | Ovh | Thermal transfer device having a fluid conduit |
CN114325590A (en) * | 2021-12-27 | 2022-04-12 | 北京微焓科技有限公司 | Phased array radar cold drawing and phased array radar |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102818467B (en) * | 2012-09-12 | 2014-06-18 | 锘威科技(深圳)有限公司 | Flat plate heating pipe and manufacturing method thereof |
US20140083666A1 (en) * | 2012-09-27 | 2014-03-27 | Tai-Her Yang | Tri-Piece Thermal Energy Body Heat Exchanger Having Multi-Layer Pipeline and Transferring Heat to Exterior Through Outer Periphery of Pipeline |
US9897400B2 (en) * | 2013-10-29 | 2018-02-20 | Tai-Her Yang | Temperature control system having adjacently-installed temperature equalizer and heat transfer fluid and application device thereof |
CN108507184B (en) * | 2018-03-21 | 2021-02-26 | 安徽省宁国市天成电气有限公司 | Resistance wire liquid heater |
CN109404943A (en) * | 2018-10-17 | 2019-03-01 | 上海康恒环境股份有限公司 | Low latitude gas is than high-temp combustion water-cooled grate |
CN111473546A (en) * | 2020-04-23 | 2020-07-31 | 长虹美菱股份有限公司 | Refrigerating device and refrigerator |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2553967A1 (en) * | 1975-12-01 | 1977-06-02 | Gerhard Dipl Ing Pruefling | Floor heating arrangement with polystyrene substrate - having array of circular projections covered by aluminium caps about which are trained plastics heating tubes |
IL55047A0 (en) * | 1977-07-22 | 1978-08-31 | Carrier Corp | Heat exchange system |
FR2549215B1 (en) * | 1983-07-11 | 1988-06-24 | Produits Refractaires | MOLDED HEAT EXCHANGERS IN REFRACTORY MATERIAL |
JPS6113575A (en) * | 1984-06-29 | 1986-01-21 | Fuji Electric Co Ltd | Construction of cooling plate of fuel cell |
JPH08247576A (en) * | 1995-03-14 | 1996-09-27 | Toshiba Corp | Air-conditioner |
NL1001064C1 (en) * | 1995-06-28 | 1995-11-15 | Fasting Corian Verwerking | Cooling device. |
US6066408A (en) * | 1997-08-07 | 2000-05-23 | Plug Power Inc. | Fuel cell cooler-humidifier plate |
US6581224B2 (en) * | 2001-03-06 | 2003-06-24 | Hyun Yoon | Bed heating systems |
US6684941B1 (en) * | 2002-06-04 | 2004-02-03 | Yiding Cao | Reciprocating-mechanism driven heat loop |
US7559356B2 (en) * | 2004-04-19 | 2009-07-14 | Eksident Technologies, Inc. | Electrokinetic pump driven heat transfer system |
DE102007016106A1 (en) * | 2007-04-03 | 2008-10-09 | Lessing, Jürgen | Safety heat exchanger |
DE102007034294A1 (en) * | 2007-07-24 | 2009-01-29 | BSH Bosch und Siemens Hausgeräte GmbH | Refrigerating appliance and evaporator for it |
US8622116B2 (en) * | 2008-10-15 | 2014-01-07 | Tai-Her Yang | Heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids |
US8726979B2 (en) * | 2008-12-23 | 2014-05-20 | Tai-Her Yang | Heat exchange apparatus with automatic heat exchange fluid flow rate exchange modulation |
-
2009
- 2009-10-16 US US12/588,468 patent/US20110088881A1/en not_active Abandoned
- 2009-10-16 TW TW098219191U patent/TWM396600U/en not_active IP Right Cessation
- 2009-10-16 CN CN2009101799928A patent/CN102042774A/en active Pending
- 2009-10-16 CN CN200920218696XU patent/CN201715902U/en not_active Expired - Fee Related
-
2010
- 2010-10-12 SG SG201007469-8A patent/SG170688A1/en unknown
- 2010-10-13 JP JP2010230370A patent/JP2011085384A/en active Pending
- 2010-10-13 CA CA2717562A patent/CA2717562A1/en not_active Abandoned
- 2010-10-15 BR BRPI1003952-0A patent/BRPI1003952A2/en not_active Application Discontinuation
- 2010-10-15 RU RU2010142320/06A patent/RU2010142320A/en not_active Application Discontinuation
- 2010-10-15 EP EP10187801A patent/EP2314968A3/en not_active Withdrawn
- 2010-10-15 AU AU2010235861A patent/AU2010235861A1/en not_active Abandoned
- 2010-11-09 KR KR1020100110822A patent/KR20120049525A/en not_active Application Discontinuation
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Also Published As
Publication number | Publication date |
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CN102042774A (en) | 2011-05-04 |
SG170688A1 (en) | 2011-05-30 |
CA2717562A1 (en) | 2011-04-16 |
KR20120049525A (en) | 2012-05-17 |
EP2314968A2 (en) | 2011-04-27 |
BRPI1003952A2 (en) | 2013-02-13 |
JP2011085384A (en) | 2011-04-28 |
RU2010142320A (en) | 2012-04-20 |
EP2314968A3 (en) | 2011-07-06 |
TWM396600U (en) | 2011-01-21 |
CN201715902U (en) | 2011-01-19 |
AU2010235861A1 (en) | 2011-05-12 |
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