TWM396600U - Heat absorbing or disspating device with piping staggered and uniformly distributed by temperature difference - Google Patents
Heat absorbing or disspating device with piping staggered and uniformly distributed by temperature difference Download PDFInfo
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- TWM396600U TWM396600U TW098219191U TW98219191U TWM396600U TW M396600 U TWM396600 U TW M396600U TW 098219191 U TW098219191 U TW 098219191U TW 98219191 U TW98219191 U TW 98219191U TW M396600 U TWM396600 U TW M396600U
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- heat
- fluid
- temperature
- absorbing
- conducting
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/047—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag
- F28D1/0477—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being bent in a serpentine or zig-zag
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D7/0066—Multi-circuit heat-exchangers, e.g. integrating different heat exchange sections in the same unit or heat-exchangers for more than two fluids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D7/08—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being otherwise bent, e.g. in a serpentine or zig-zag
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/10—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2210/00—Heat exchange conduits
- F28F2210/02—Heat exchange conduits with particular branching, e.g. fractal conduit arrangements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2210/00—Heat exchange conduits
- F28F2210/10—Particular layout, e.g. for uniform temperature distribution
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/10—Particular pattern of flow of the heat exchange media
- F28F2250/102—Particular pattern of flow of the heat exchange media with change of flow direction
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
jl£j 、新型說明: 【新型所屬之技術領域】 本新型為一種藉管路依所通過流體溫差由兩侧向中間作交 錯均佈設’使相鄰流路所流過具溫差流體之流體吸熱或釋熱體裝 置之合成溫度呈較平均,以對被動接受釋熱或吸熱之物體或空 間,產生吸熱或釋熱功能,以使被動接受釋熱或吸熱之物體或空 間形成較平均之溫度分佈狀態者。 【先前技術】 傳統藉導溫流體通過吸熱或釋熱體之氣態流體、或液態流 體、或由氣態轉液態之流體、或由液態轉氣態之流體所構成之導 溫流體,以產生吸熱或釋熱之應用裝置,如引擎冷卻水箱、或藉 導溫流體吸熱之冷能排放裝置,或藉導溫流體釋熱之熱能排放裝 置,如暖具、或加熱裝置、或熱能傳輸裝置,因其導溫流體之流 向固疋’因此導溫流體在吸熱或釋熱體上各位置形成較大之溫度 差落差者。 【新型内容】 本新型為將傳統利用輪送導溫流體通過吸熱或釋熱體以產 生吸熱或釋熱之應用裝置’改良為依所通過流體溫差由兩側向中 門作乂錯均佈設,使相鄰流路所流過具溫差流體之越吸熱或釋 熱2裝置之合成溫度錄平均’㈣被動接受釋熱或吸熱之物體 或二門產生吸熱或釋熱功能,以使被動接受釋熱或吸熱之物體 或空間形錢平均之溫度分佈狀態者。 【實施方式】 圖1所示為傳統藉吸熱或釋熱之氣態流體、或液態流體、 或由乱心轉液紅流體、或由液態轉氣態之流體所構成之導溫流 補充 體’通過定流向之導溫流體構成之吸熱或釋熱裝之主要結構^ 意圖’如® 1所示巾,為傳祕輸賴定流向之氣態流體、或液 心/;iL體或由液態轉氣態、或由氣態轉液態之導溫流體1 1 0 ,通 過"IL體s路1〇1以結合吸熱或釋熱溫能傳輸體100所構成之吸熱 或釋熱裝置總成,以供Ο由通過流體管路1G1之導溫流體110, 經吸熱或_溫能傳輸體1QQ對被祕受釋熱或吸熱之固態、或 膠態、或液態、或氣態物體或空間作致冷或加熱之功能;或 2)由通過流體管路m之導溫流體11()反向接受來自溫能吸熱或 釋熱溫能傳輪體100周圍之冷能或熱能,作致冷或致熱之作用 者;前述之1)常見應用於如引擎冷卻水箱、或藉導溫流體110 吸熱之冷能排放裝置、或藉導溫趙11Q釋熱之減排放裝置, 如暖具、或加熱裝置、或蒸發器或凝結器、或冷能或熱能傳輸裝 置’後者2)常見應用於冷能或熱能傳輸裝置;當1)之應用時, 導溫流體110由吸熱或釋熱溫能傳輸體100之一邊側端之流體管 路101之入〇輸入導溫流體11〇再由另_端輸出,在吸熱或釋熱 溫能傳輸體100流體管路101入口之導溫流體11〇與流體管路 101出口之導溫流體110之間,形成較大之溫度差,同樣的在2) 之應用時,會在流體管路101之入口及流體管路1〇1之出口形成 較大之溫差,為其缺失。 圖2所示為圖1作吸熱之冷能排放裝置功能運作中之溫度差 分佈圖;圖2中所示為圖1所示傳統利用輪送定流向之導溫流體 110作為釋熱之排放熱能運作中’呈單流向之流路佈設,而於導 溫流體110通過流體管路1 〇 1時’在吸熱或釋熱溫能傳輸體1 〇 〇 之導溫流體110入口與導溫流體11 〇出口之間’形成較大溫度差 之分佈狀態。 圖3所示為圖1作為釋熱之熱此排放裂置功能運作中之溫度 M396600 補充| 差分佈圖;圖3所示為圖丨所示傳統利用輸送單流向之導溫流體 110,作為吸熱之排放冷能運作令,呈單流向之流路分佈,而於 導溫流體110通過流體管路m時,在吸熱或釋熱溫能傳輸體1〇〇 之導溫流體110入口與導溫流體110出口之間,形成較大溫度差 之分佈狀態。Jl£j, new description: [New technical field] The new type is a kind of fluid absorbing heat from the two sides to the middle by the temperature difference of the fluid passing through the pipeline, so that the adjacent flow path flows through the fluid with the temperature difference fluid. Or the synthesis temperature of the heat release device is relatively average, to generate an endothermic or heat release function for an object or space that passively receives heat release or heat absorption, so that a passive heat-receiving or heat-absorbing object or space forms a relatively even temperature distribution. State. [Prior Art] Conventionally, a temperature-conducting fluid is formed by a gaseous fluid of a heat-absorbing or heat-releasing body, or a liquid fluid, or a fluid that is converted from a gaseous state to a liquid state, or a fluid that is turned into a gaseous state to generate an endothermic or release. Thermal application device, such as an engine cooling water tank, or a cold energy discharge device that absorbs heat by a temperature-conducting fluid, or a heat energy discharge device that releases heat by a temperature-conducting fluid, such as a warming device, or a heating device, or a thermal energy transmission device, The flow of the warm fluid is fixed to the solid state, so that the temperature-conducting fluid forms a large temperature difference difference at each position on the endothermic or heat-dissipating body. [New content] This new type is an application device that uses the traditional use of the circulating heat transfer fluid to generate heat absorption or heat release through the heat absorption or heat release body, and is improved by the temperature difference of the fluid passing through the two sides to the middle door. The average temperature of the device that allows the adjacent flow path to flow through the heat-absorbing or heat-releasing device with the temperature difference is 'average'. The object that passively accepts the heat release or heat absorption or the two doors generates an endothermic or heat release function to passively accept the heat release or The average temperature distribution state of an object that absorbs heat or space. [Embodiment] FIG. 1 shows a conventional refrigerant flow replenishing body by a gaseous fluid, or a liquid fluid, or a liquid-to-liquid red fluid, or a liquid-to-liquid fluid. The main structure of the heat-absorbing or heat-dissipating device formed by the temperature-conducting fluid is intended to be the same as the one shown in the ®1, for the flow of the gaseous fluid, or the liquid core/iL body or the liquid-to-liquid state, or by The gas-to-liquid temperature-conducting fluid 1 1 0 is passed through the "IL body s road 1〇1 to combine the endothermic or heat-dissipating heat energy transfer body 100 to form an endothermic or heat-dissipating device assembly for supplying the liquid tube through the fluid tube The temperature-conducting fluid 110 of the road 1G1 functions to cool or heat the solid or colloidal, or liquid, or gaseous object or space which is secretly released or absorbed by the endothermic or temperament energy transmitting body 1QQ; or 2 Passing the cold energy or heat energy from the warm energy endothermic or heat-dissipating heat energy transfer wheel 100 through the temperature-conducting fluid 11 () through the fluid line m, acting as a cooling or heating function; ) commonly used in cold water discharge devices such as engine cooling water tanks or by means of heat transfer fluid 110 Cooling or heat transfer devices are commonly used in cold energy or thermal energy transmission devices, such as heating tools, or heating devices, or evaporators or condensers, or cold or thermal energy transmission devices. When applied, the temperature-conducting fluid 110 is input into the temperature-conducting fluid 11 from the inlet of the fluid line 101 at one side of the endothermic or heat-dissipating heat energy transmitting body 100, and then outputted from the other end, at the endothermic or heat release temperature. Between the temperature-conducting fluid 11〇 at the inlet of the fluid line 101 of the fluid transporting body 101 and the temperature-conducting fluid 110 at the outlet of the fluid pipeline 101, a large temperature difference is formed, and in the application of 2), the fluid pipeline is The inlet of 101 and the outlet of the fluid line 1〇1 form a large temperature difference, which is missing. 2 is a temperature difference distribution diagram in the functional operation of the heat absorbing cold discharge device of FIG. 1; FIG. 2 is a view showing the conventional heat transfer energy of the heat transfer fluid 110 as the heat transfer shown in FIG. In operation, the flow path is arranged in a single flow direction, and when the temperature-conducting fluid 110 passes through the fluid line 1 〇1, the inlet and the temperature-conducting fluid 11 of the temperature-conducting fluid 110 in the heat-absorbing or heat-dissipating heat energy transfer body 1 〇 The distribution between the outlets 'forms a large temperature difference. Figure 3 shows the temperature M396600 supplementary | difference distribution diagram of Figure 1 as the heat of heat release operation; Figure 3 shows the traditional use of the single-flow temperature-conducting fluid 110 as the heat absorption shown in Figure 3 The discharge cold energy operation command is distributed in a single flow direction, and when the temperature guiding fluid 110 passes through the fluid line m, the inlet and the temperature guiding fluid of the temperature guiding fluid 110 in the heat absorbing or releasing heat energy transmitting body 1〇〇 Between 110 exits, a distribution of large temperature differences is formed.
針對上述現象,本新型為首創一種將流體管路依所通過流體溫差 由兩側向巾間作交錯均佈設,赌婦流路所流過具溫差流體之 流體吸熱或龍财置之合成溫度呈較平均,以賴動接受釋熱 或吸熱之物體或空間,產生吸熱或釋熱魏,以使獅接受釋熱 或吸熱之物體或空間形成較平均之溫度分佈狀態者。 圖4所不為本新型實施例之—主要結構示意圖;B 4所示中 為此項流路依溫差交錯均佈之吸熱或釋熱裝置總成之主要結 構’其主要構成含: 吸熱或釋熱溫能傳輸體⑽:為由固態、或勝態、或液態、或 氣態導熱材料所構成之吸熱或釋熱結構體,吸熱或釋熱溫能傳輪 體1〇〇可為—個或一個以上所構成者; • ㈣體s路101:為良導熱材料所構成,依所通過流體溫差由兩 . 側向巾間作交錯均佈設’使购•所流過具浪差流體 之流體吸 熱或釋熱體裝置之合成溫度呈較平均者; 1 g路1G1内。(J供流通呈氣態流體、或液態流體、或由氣態轉 液。L體或由液態轉氣悲之流體所構成之導溫流體11〇,導 溫流體U0之溫能供直接或經吸熱或釋熱溫能傳輸體1〇〇,對被 動接又釋”,、或^^之固悲、、或勝態、或液態、成氣態物體或空間 200,作吸熱或作釋熱之功能運作者; 上述流體管路1Q1之流體入0 102為接受導溫流體110之流 入’流體管路101之流體出口 1〇3供導溫流體U0之流出; 5 M396600 4 a、u ' ==101可為呈平行或近似平行之平面^^ ;,差、=熱溫能傳輸體⑽,使吸熱或釋熱溫能傳輸體100 Γ酿二均分佈,以對被動接受釋熱或吸熱之固態、或膠 態、或液態、或氣態物體或空間2⑽吸熱或釋熱者。 / 、圖4所示之吸熱或釋熱溫能傳輸體1〇〇肖流體管路⑻可由 以下一種或一種以上之結構關係所構成者,含: 0由吸熱或釋熱溫能傳輸體⑽與流體管路⑻呈植人之名士 構所構成者; 1 σ ''ΌIn view of the above phenomenon, the present invention is the first to make the fluid pipelines alternately arranged from the two sides to the towel according to the temperature difference of the fluid passing through the body, and the synthetic temperature of the fluid endothermic or Longcai set by the gambling flow path flowing through the temperature difference fluid is More average, to absorb the heat or heat of the object or space, to generate heat absorption or heat release, so that the lion receives the heat release or heat absorption of the object or space to form a more average temperature distribution. Figure 4 is not a schematic diagram of the main structure of the present invention; B 4 is the main structure of the heat-absorbing or heat-dissipating device assembly in which the flow path is staggered uniformly according to the temperature difference. The main components thereof include: endothermic or release The heat and temperature energy transmitting body (10) is an endothermic or heat-releasing structure composed of a solid state, or a singularity, or a liquid or a gas heat conductive material, and the heat absorbing or releasing heat energy transmitting wheel body can be one or one The above consists of: • (4) Body s Road 101: It is composed of a good heat-conducting material. According to the temperature difference of the fluid passing through, the two sides of the towel are staggered and evenly arranged to make the fluid flowing through the fluid with the wave difference or The synthesis temperature of the heat release device is relatively average; 1 g road is within 1G1. (J is used to circulate a gaseous fluid, or a liquid fluid, or a gas-transferred liquid. The L-body or the liquid-conducting fluid consisting of a fluid that flows into a gas, 11 〇, the temperature of the temperature-conducting fluid U0 is available for direct or endothermic or The heat release energy transfer body 1〇〇, the passive connection and release, ", or ^^ the solid sadness, or the victory state, or liquid, into a gaseous object or space 200, as a function of heat absorption or heat release. The fluid inlet 0102 of the fluid line 1Q1 is the fluid outlet 1〇3 of the fluid line 101 that receives the flow of the temperature guiding fluid 110 for the outflow of the temperature guiding fluid U0; 5 M396600 4 a, u ' ==101 can be Parallel or nearly parallel plane ^^;, difference, = thermal temperature energy transfer body (10), so that the endothermic or heat release temperature energy transfer body 100 brewing two even distribution, to passively accept heat release or endothermic solid, or glue State, or liquid, or gaseous object or space 2 (10) endothermic or heat release. /, the endothermic or heat release heat transfer body shown in Figure 4, the fluid line (8) can be one or more of the following structural relationships Constituent, including: 0 by the endothermic or heat release heat transfer body (10) and fluid pipeline (8) Constituted by; 1 σ '' Ό
)由吸熱或釋熱溫能傳輸體⑽與流體管路⑻呈一體之社 構所構成者; 0 3)由机體B路101直接構成吸熱或釋熱溫能傳輸體1〇〇之功 能者; 4) 在流體管路101加設獨立導溫片3〇〇構成吸熱或釋熱溫能 傳輸體100之功能者; 5) 在鄰近流體官路1〇1之間以共同導溫片_相連結構成吸 熱或釋熱溫能傳輸體100之功能者;a body composed of an endothermic or heat-releasing heat transfer body (10) and a fluid line (8); 0 3) a function of the heat-absorbing or heat-dissipating heat transfer body directly constituted by the body B-channel 101 4) Adding an independent temperature guiding sheet 3 to the fluid line 101 to constitute a function of the endothermic or heat-dissipating heat energy transmitting body 100; 5) A common temperature guiding sheet _ phase between the adjacent fluid official roads 1〇1 Connecting the function constituting the endothermic or heat-dissipating heat energy transfer body 100;
6) 在鄰近流體管路101之間以具隔溫槽孔之導溫片350相連 結,構成吸熱或釋熱溫能傳輸體丨⑽之功能者。 圖5所示為圖4所示結構作為吸熱之冷能排放裝置功能運作 中之恤度差分佈® ;圖5中所示中,流體管路1()1供輸送兩路導 溫流體110 ’輸入之導溫流體110與輸出之導溫流體之間具溫度 差’而於吸熱或釋熱溫能傳輸體刪呈現介於輸入導溫流體11〇 與輸出導溫流體11G間之巾間溫度並呈較平均分佈,供對被動接 文釋熱或吸熱之固態、或膠態、或液態、或氣態物體或空間2〇〇 作吸熱或釋熱,避免局·溫過低者。 ® 6所為4所示結構作為釋熱之熱能排放裝置功能運作 6 M396600 岡正| 年月日 流體管路ιοί供輸送導溫流 之導溫流體之間具溫差,而 中之溫度差分佈圖;圖6中所示中, 體110,輸入之導溫流體110與輸出 在吸熱或釋熱溫能傳輸體刚呈現介於輪人導溫流體UG與輸出 導溫流體110間之中間溫度並呈較平均分佈,供對被動接受釋熱 或吸熱之固態、或膠態、或液態、或氣態物體或空間2GQ作釋熱 及排放熱能,避免局部高温過高者。6) Connected between the adjacent fluid lines 101 by the temperature guiding sheets 350 with the temperature-insulated holes, and constitute the function of the heat-absorbing or heat-dissipating heat-transporting body (10). Figure 5 shows the structure shown in Figure 4 as the endothermic distribution of the function of the endothermic cold energy discharge device. In Figure 5, the fluid line 1 () 1 is used to transport two channels of temperature-conducting fluid 110' The temperature difference between the input temperature-conducting fluid 110 and the output temperature-conducting fluid is 'the temperature between the input heat-conducting fluid 11 〇 and the output temperature-conducting fluid 11 G It is evenly distributed for the purpose of heat absorption or heat release in the solid state, or colloidal, or liquid, or gaseous object or space of the passive heat transfer or heat absorption, to avoid the low temperature. ® 6 is the structure shown in Figure 4 as a function of heat release device for heat release. 6 M396600 Gangzheng | In the case shown in Figure 6, the body 110, the input temperature-conducting fluid 110 and the output are at an intermediate temperature between the wheel-heating fluid UG and the output temperature-conducting fluid 110 at the temperature of the heat-absorbing or heat-dissipating heat transfer body and are relatively average. Distribution, for the passive acceptance of heat release or endothermic solid, or colloidal, or liquid, or gaseous objects or space 2GQ for heat release and discharge heat, to avoid local high temperature is too high.
圖7所示為本新型實施例之二,為由此項流路依溫差交錯均 佈之吸熱或釋熱裝置中之流體管路1Q1呈分叉為兩路或兩路以上 之分歧管路由兩側向中間依序排列’而於中間再匯集於流體管路 101者:為便於敘述,圖7中以 兩路分歧管路為例,為由兩側往 中間排列之兩分歧管路輸送呈溫差之導溫流體110,包括第一分 歧流體管路mi及第二分歧流體管路1012由兩側向中間依序排 列,而於中間再μ於流體管路m,以供直接或㈣熱或釋熱 溫能傳輸體100,對被動接受釋熱或吸熱之固態、或膠態、或液 癌、或氣態物體或空間200傳輸溫能者,其進_步之構成含· ―流體管路101 :為良導熱材料所構成,流體管路1〇1之流體入Figure 7 shows the second embodiment of the present invention. The fluid line 1Q1 in the endothermic or heat-dissipating device which is staggered uniformly by the flow path is bifurcated into two or more branches. The lateral middle is arranged in order and is collected in the middle of the fluid pipeline 101. For convenience of description, the two-way bifurcation pipeline in FIG. 7 is taken as an example, and the temperature difference is transmitted between the two divergent pipelines arranged from the two sides to the middle. The temperature guiding fluid 110, including the first diverging fluid line mi and the second diverging fluid line 1012 are sequentially arranged from the two sides to the middle, and in the middle to the fluid line m for direct or (four) heat or release. The heat-temperature-transporting body 100, for passively receiving heat-dissipating or endothermic solid-state, or colloidal, or liquid cancer, or a gaseous object or space 200 to transmit warm energy, the composition of the step-by-step includes - fluid line 101: For the heat conductive material, the fluid line of the fluid line 1〇1
口 102與流體出口 103之間呈分叉為兩路之第—分歧流體管路 1011及第二分歧流體管路1012,由兩側向中間依序排列,而於 中間再匯集於流體管路101 ’以供輸送呈氣態流體、或液態流體、 或由氣態轉液態之流體、或由液態轉氣態之流體所構成之導溫流 體110,藉以直接或經吸熱或釋熱温能傳輸體100傳輸溫能至被 動接受釋熱或吸熱之固態、或膠態、或液態、或氣態物體或空間 200 者; 第一分歧流體管路1〇11與弟一分歧流體管路1012為呈平行 或近似平行之平面形狀或立體形狀佈設而構成共同結構體,其 中: 7 M396600 99. 3. 0 1 年月曰巧丄一 補充| 流體管路101之流體入口 102與流體出口 103之間為呈分歧為第 一分歧流體管路1011及第二分歧流體管路1012或由兩路以上所 構成,流體管路101之流體入口 102及流體出口 103,為分別設 置於吸熱或釋熱溫能傳輸體100之兩側; 上述第一分歧流體管路1011之第一流體分歧入口與第二分 歧流體管路1012之第二流體分歧入口並聯,第一分歧流體管路 1011之第一分歧流體出口為與第二分歧流體管路1012之第二分 歧流體出口並聯,以供傳輸導溫流體110, 上述較接近流體入口 102之第一分歧流體管路1011,與較接 近流體入口 102之第二分歧流體管路1012,分別設置於共同結構 體之上下兩側,而將第一分歧流體管路1011之第一分歧流體出 口,與第二分歧流體管路1012之第二分歧流體出口並聯設置於 共同結構體之中間,以在運作中對設置於其共同結構體第一分歧 流體管路1011與第二分歧流體管路1012,分別輸送導溫流體 110,使其共同結構體之整體溫度差較平均分佈,以直接或經吸 熱或釋熱溫能傳輸體.100對被動接受釋熱或吸熱之固態、或膠 態、或液態、或氣態物體或空間200作吸熱或釋熱者。 圖7所示之吸熱或釋熱溫能傳輸體100與第一分歧流體管路 1011及/或第二分歧流體管路1012可由以下一種或一種以上之 結構關係所構成者,含: 1) 由吸熱或釋熱溫能傳輸體100與第一分歧流體管路1011及 /或第二分歧流體管路1012呈組合之結構所構成者; 2) 由吸熱或釋熱溫能傳輸體100與第一分歧流體管路1011及 /或第二分歧流體管路1012呈一體之結構所構成者; 3) 由第一分歧流體管路1011及/或第二分歧流體管路1012 直接構成吸熱或釋熱溫能傳輸體100之功能者; ’ 8 L_ 補无i 4) 在第一分歧流體管路1011及/或第二 加設與相鄰管路間不相連之獨立導溫片3〇〇,構成吸熱或釋熱溫 能傳輸體100之功能者; 5) 在鄰近第一分歧流體管路1011及/或第二分歧流體管路 1012之鄰近流體管路之間,以共同導溫片400相連結,構成吸熱 或釋熱溫能傳輸體100之功能者; 6) 在鄰近第一分歧流體管路1011及/或第二分歧流體管路 1012之鄰近流體管路之間,以具隔溫槽孔之導溫片35〇相連結, 構成吸熱或釋熱溫能傳輸體100之功能者。 圖8所示為圖7所示結構作為吸熱之冷能排放裝置功能運作 中之溫度差分佈圖; 圖9所示為圖7所示結構作為釋熱之熱能排放裝置功能運作 中之溫度差分佈圖; 此項流路依溫差交錯均佈之吸熱或釋熱裝置,可由流體管路 101及/或第一分歧流體管路1011、第二分歧流體管路1〇12與 被動接受釋熱或吸熱之固態、或膠態、或液態、或氣態物體或空 間200直接構成共同結構體者; 此項流路依溫差交錯均佈之吸熱或釋熱裝置,亦可將流體管路製 成呈平打或接近平行之平面形狀或立體形狀佈設,構成供傳輸被 動接受釋熱或吸熱導溫流體之管路結構體1〇〇,,以取代被動接 S:釋熱或吸熱之固態、或膠態、或液態、或氣態物體或空間200, 而藉由流體管路101傳輸呈或液態流體、或由氣態轉 液態之流體、或由液態轉氣態之流體所構成之導溫流體11〇,以 經吸熱或釋熱溫能傳輸體1〇0傳輸溫能至被動接受釋熱或吸熱導 溫流體之管路結構體100,者; 如圖10所示為本新型由圖4實施例中流體管路經吸熱 補无 或釋熱溫能傳輸體100與供傳輸被動接受釋熱或吸熱導溫流體之 管路結構體100’作組合之應用例之―。 如圖11所示為本新型由圖7實施例中流體管路101、第一分 歧流體管路1011、第二分歧流體管路1012經吸熱或釋熱溫能傳 輸體100與供傳輸被動接受釋熱或吸熱導溫流體之管路結構體 100’作組合之應用例之二。 如圖12所示為本新型由圖4實施例中流體管路ιοί經吸熱或釋 熱溫能傳輸體1〇〇與多組供傳輸被動接受釋熱或吸熱導溫流體之 管路結構體100’作組合之應用例之一。 如圖13所示為本新型由圖7實施例中流體管路101、第一分 歧流體管路1011、第二分歧流體管路1〇12經吸熱或釋熱溫能傳 輸體100與多組由供傳輸被動接受釋熱或吸熱導溫流體之管路結 構體100’作組合之應用例之二。 此項流路依溫差交錯均佈之吸熱或釋熱裝置,為進一步增進吸熱 或釋熱效果,可在流體管路1〇1及/或供傳輸被動接受釋熱或吸 熱導溫流體之流體管路101及/或供傳輸被動接受釋熱或吸熱導 溫流體之管路結構體100,加設獨立之導溫片300,以增進釋熱 或吸熱效果者; 圖14所示為本新型之流體管路101加串獨立導溫片300之 實施例結構示意圖。 圖15所示為圖14之A-A剖視圖。 此項流路依溫差交錯均佈之吸熱或釋熱裝置,為進一步增進吸熱 或釋熱效果’可在流體管路101及/或供傳輸被動接受釋熱或吸 熱導溫流體之管路結構體100’之間,設置共同導溫片4〇〇,以 增進釋熱或°及熱效果者; 圖16所示為本新型之流體管路101之間設置共同導溫片之 M396600 99. 3. 0 —, 補无ί 貫施例結構示意圖。 --1 圖17所示為圖16之β〜β剖視圖。 此項流路依溫差交錯均佈之吸熱或釋熱裝置 ,為進一步增進 吸熱或釋熱絲’可在流體管路⑻及/或供傳輸被動接受釋熱 或吸熱導溫流體之管路結構體剛,之間,設置具隔溫槽孔之導 溫片350,以增進釋熱或吸熱效果者; 圖18所不為本新型之流體管路1〇1之間設置具隔溫槽孔之 導溫片之實施例示意圖。The port 102 and the fluid outlet 103 are bifurcated into two paths - a diverging fluid line 1011 and a second diverging fluid line 1012, which are sequentially arranged from the two sides to the middle, and are collected in the middle of the fluid line 101. 'The temperature-conducting fluid 110 consisting of a gaseous fluid, or a liquid fluid, or a fluid that is converted from a gaseous state to a liquid state, or a fluid that is in a gaseous state, so that the temperature can be transmitted directly or through the heat-absorbing or heat-releasing heat transfer body 100. A solid, or colloidal, or liquid, or gaseous object or space 200 capable of passively receiving heat or heat absorption; the first diverging fluid line 1 11 is parallel or nearly parallel to the divergent fluid line 1012 The planar shape or the three-dimensional shape is laid out to form a common structure, wherein: 7 M396600 99. 3. 0 1 曰 曰 补充 补充 补充 补充 | 流体 流体 流体 流体 流体 流体 流体 流体 流体 流体 流体 流体 流体 流体 流体 流体 流体 流体The diverging fluid line 1011 and the second diverging fluid line 1012 are formed by two or more channels, and the fluid inlet 102 and the fluid outlet 103 of the fluid line 101 are respectively disposed on both sides of the endothermic or heat-dissipating heat energy transmitting body 100. ; The first fluid branch inlet of the first branch fluid line 1011 is connected in parallel with the second fluid branch inlet of the second branch fluid line 1012, and the first branch fluid outlet of the first branch fluid line 1011 is the second branch fluid tube The second divergent fluid outlets of the road 1012 are connected in parallel for transmitting the pilot fluid 110, the first diverging fluid conduit 1011 closer to the fluid inlet 102, and the second diverging fluid conduit 1012 closer to the fluid inlet 102, respectively. On the lower side of the common structure, the first branch fluid outlet of the first branch fluid line 1011 is disposed in parallel with the second branch fluid outlet of the second branch fluid line 1012 in the middle of the common structure to In operation, the first diverging fluid pipeline 1011 and the second diverging fluid pipeline 1012 disposed in the common structure body respectively transport the temperature guiding fluid 110 so that the overall temperature difference of the common structure is evenly distributed to directly or through the heat absorption. Or a heat-dissipating heat transfer medium. 100 pairs of passive, heat-absorbing or endothermic solid, or colloidal, or liquid, or gaseous objects or spaces 200 for heat absorption or heat release. The heat absorbing or tempering heat transfer body 100 and the first branch fluid line 1011 and/or the second branch fluid line 1012 shown in FIG. 7 may be composed of one or more of the following structural relationships, including: 1) a structure in which the endothermic or heat-dissipating heat energy transfer body 100 is combined with the first branch fluid line 1011 and/or the second branch fluid line 1012; 2) the heat-absorbing or heat-dissipating heat energy transfer body 100 and the first The diverging fluid line 1011 and/or the second diverging fluid line 1012 are formed as a single structure; 3) the first diverging fluid line 1011 and/or the second diverging fluid line 1012 directly constitute an endothermic or heat release temperature The function of the transmission body 100; '8 L_ complements no i 4) The first divergent fluid line 1011 and/or the second additional independent temperature guiding piece 3 不 which is not connected with the adjacent line constitutes an endothermic Or the function of the heat release heat transfer body 100; 5) being connected by the common temperature guide sheet 400 between the adjacent fluid lines adjacent to the first branch fluid line 1011 and/or the second branch fluid line 1012, Constituting the function of the endothermic or regenerative warm energy transfer body 100; 6) adjacent to the first divergent flow Between 1011 and / or adjacent the second branching fluid piping 1012 of the fluid conduit line to septate thermal conductive sheet 35〇 temperature of slots linked to form heat absorbing or dissipating thermal energy transmission body 100 by the function. Figure 8 is a temperature difference distribution diagram of the structure shown in Figure 7 as a function of the endothermic cold energy discharge device; Figure 9 is a temperature difference distribution in the functional operation of the structure shown in Figure 7 as a heat release device for heat release Figure: The endothermic heat-dissipating or heat-dissipating device of the flow path may be alternately heated or absorbed by the fluid line 101 and/or the first diverging fluid line 1011 and the second diverging fluid line 1〇12. The solid state, or colloidal, or liquid, or gaseous object or space 200 directly constitutes a common structure; the flow path is evenly distributed by the heat absorption or heat release device, and the fluid pipeline can be made flat or Arranging a nearly parallel planar shape or a three-dimensional shape to constitute a pipeline structure for transmitting a passively-accepting heat-releasing or heat-absorbing temperature-conducting fluid, in place of a passive connection S: a solid or a colloidal state of heat release or heat absorption, or a liquid or gaseous object or space 200, and a fluid in the form of a liquid or a liquid fluid, or a fluid that is converted from a gaseous state to a liquid state, or a liquid in a gaseous state, is used to absorb heat or Heat release temperature The transmission body 1〇0 transmits the warm energy to the pipeline structure 100 passively receiving the heat release or the heat absorption and temperature-conducting fluid. As shown in FIG. 10, the fluid pipeline of the embodiment of FIG. 4 is supplemented or released by the heat absorption. The application of the heat and temperature energy transfer body 100 to a pipe structure 100' for transmitting a passive heat release or heat absorbing heat transfer fluid is used. As shown in FIG. 11, the fluid line 101, the first diverging fluid line 1011, and the second diverging fluid line 1012 of the embodiment of FIG. 7 are passively absorbed by the endothermic or heat-dissipating heat transfer body 100. The second application example of the combination of the heat or endothermic temperature-conducting fluid pipeline structure 100'. As shown in FIG. 12, the pipeline structure 100 of the fluid line ιοί in the embodiment of FIG. 4 absorbs heat or heat-dissipating heat energy transmission body 1 〇〇 and a plurality of groups for passively receiving heat release or heat-absorbing temperature-conducting fluid 'One of the application examples for combination. As shown in FIG. 13 , the fluid pipeline 101 , the first diverging fluid pipeline 1011 , and the second diverging fluid pipeline 1 〇 12 in the embodiment of FIG. 7 are subjected to heat absorbing or releasing heat energy transmission body 100 and a plurality of groups. A second application example for combining a pipeline structure 100' that passively receives a heat release or an endothermic temperature-conducting fluid. The flow path is staggered and evenly distributed by the heat absorption or heat release device, in order to further enhance the heat absorption or heat release effect, the fluid pipe can be transported in the fluid pipeline 1 及 1 and/or for passively receiving the heat release or the heat absorbing heat transfer fluid. The road 101 and/or the pipeline structure 100 for transmitting the heat-receiving or heat-absorbing temperature-conducting fluid is provided with an independent temperature guiding sheet 300 to enhance the heat release or heat absorption effect; A schematic structural view of an embodiment of the pipeline 101 with a series of independent temperature guiding sheets 300. Figure 15 is a cross-sectional view taken along line A-A of Figure 14. The flow path is staggered and evenly distributed by the heat absorption or heat release device, in order to further enhance the heat absorption or heat release effect, the pipeline structure can be passively received in the fluid pipeline 101 and/or for transmitting heat transfer or heat absorption and temperature-conducting fluid. Between 100', the common temperature guiding sheet 4〇〇 is set to improve the heat release or ° and the heat effect; Figure 16 shows the M396600 99 which is a common temperature guiding sheet between the fluid lines 101 of the present invention. 0 —, Complementary structure diagram of the example. --1 Figure 17 is a cross-sectional view taken along the line β to β of Figure 16 . The flow path is staggered and evenly distributed by the heat absorption or heat release device, in order to further enhance the heat absorption or heat release wire, the pipeline structure can be passively received in the fluid pipeline (8) and/or for transmitting heat transfer or heat absorption and temperature transfer fluid. Between the two, a temperature-conducting sheet 350 with a temperature-slot hole is provided to enhance the heat release or heat absorption effect; Figure 18 is not a guide for the temperature-slot hole between the fluid lines 1〇1 of the present invention. Schematic diagram of an embodiment of a warm film.
圖19所示為圖18之C-C剖視 圖 此項抓路u父錯均佈之吸熱或釋熱裝置中,通過流體管 路101及/或供傳輪被動接受釋熱或吸熱導溫流體之管路結構體 之流體’可藉由控制裝置500之操控,以驅動雙向流體聚 動裝置議作週期正反躲動,以雙妓送導溫越11Q 其均溫效果者; 上述雙向流體泵動裝置刚,為接受機電裝置或電子裝置或Figure 19 is a cross-sectional view taken along the line CC of Figure 18, in the endothermic or heat-dissipating device of the grasping path, the pipe that passively receives the heat release or the heat-absorbing temperature-conducting fluid through the fluid line 101 and/or the supply wheel The fluid of the structure can be controlled by the control device 500 to drive the two-way fluid concentrating device to negotiate the cycle forward and backward, and the double-twisting temperature is more than the 11Q temperature uniform effect; the two-way fluid pumping device just described To accept electromechanical devices or electronic devices or
微電腦及械軟體所構成之控姆置_所缝,而作週期正逆 向泵送者; 體i::2Q所τ為本新型.雙向流體泵作雙向週期泵送導溫流 此項流路依溫差交錯均佈之吸誠釋域置在應料, 應用需求結構需要、成本考量,在前述運作原理之基礎下,作以 下一種或一種以上之製作而成,包括: -此項祕依溫Q錯均佈之吸熱轉缝置其供通過導旧 流體Η0之流鮮路,可為與吸熱或釋熱溫能傳輸體⑽^ 式結構者; 體 —此項赫依溫Μ錯料之錄轉缝置,其供通過導溫 M396600 99. 3Γ〇 %ΐ 流體110之流體管路,與吸熱或釋熱溫能傳輸體100,可為組合 式結構所構成者; --此項流路依溫差交錯均佈之吸熱或釋熱裝置,其結合於供通 過流體110之流體管路,可由單一組構體構成而呈板狀、或塊狀、 或多翼狀所構成之結構單元,或與翼片組合而成之結構單元,並 可由至少一個結構單元所構成者。Microcomputer and mechanical software constitute the control of the _ sewing, and the cycle is positive and backward pumping; body i:: 2Q τ is the new. Two-way fluid pump for bidirectional cyclic pumping temperature flow this flow path The temperature difference is evenly distributed and the real release domain is placed in the application. The demand structure needs and cost considerations. Based on the above operating principles, one or more of the following are made, including: - This secret is based on temperature Q The heat-dissipating of the wrong uniform cloth is used to pass the fresh flow path of the old fluid Η0, which can be used as the heat-absorbing or heat-dissipating heat energy transfer body (10)^ structure; the body--the Heyue temperature is wrongly recorded Sewing, which is used to pass the temperature guiding M396600 99. 3Γ〇%ΐ fluid 110 fluid pipeline, and the heat absorbing or releasing heat energy transporting body 100, which can be composed of a combined structure; A staggered uniform endothermic or heat release device that is coupled to a fluid conduit for passage of fluid 110, may be constructed of a single structural body, or be in the form of a plate, block, or multi-wing, or with a wing A structural unit that is combined and can be composed of at least one structural unit.
--此項流路依溫差交錯均佈之吸熱或釋熱裝置,其可由一個或 一個以上所組成,而其個別所屬供通過導溫流體110之流體管路 之間,可為呈串聯、或並聯、或串並聯,並可製成呈並列或疊合 之各種幾何形狀者。 --此項流路依溫差交錯均佈之吸熱或釋熱裝置,其通過相關流 體管路之導溫流體110,含以泵送、及/或蒸發、及/或冷熱自 然對流之方式輸送導溫流體110者。An endothermic or heat-dissipating device in which the flow paths are staggered uniformly according to a temperature difference, which may be composed of one or more, and which are individually connected between the fluid lines for passing the temperature-conducting fluid 110, may be in series, or Parallel, or series and parallel, and can be made into a variety of geometries in parallel or overlapping. - The flow path is a heat-dissipating or heat-dissipating device which is staggered uniformly according to the temperature difference, and is guided by the temperature-conducting fluid 110 of the relevant fluid pipeline, including pumping, and/or evaporation, and/or natural convection of cold and heat. Warm fluid 110.
--此項流路依溫差交錯均佈之吸熱或釋熱裝置,可藉流體冷熱 溫差作自然對流、及/或強制泵動流體以產生對流、及/或輻 射、及/或傳導之熱傳輸功能,以對呈流體狀態之被動接受釋熱 或吸熱之固態、或膠態、或液態、或氣態物體或空間200釋出熱 能或冷能;或藉傳導方式對被動接受釋熱或吸熱之固態、或膠 態、或液態、或氣態之物體或空間200釋出熱能或冷能者; --此項流路依溫差交錯均佈之吸熱或釋熱裝置,其通過相關流 體管路之導溫流體110,含呈封閉流動循環,或作開放式之流動 釋出者; --此項流路依溫差交錯均佈之吸熱或釋熱裝置,其各流體管路 之流體入口與流體出口可設置於三度空間指向中之同指向或不 同指向者; --此項流路依溫差交錯均佈之吸熱或釋熱裝置,其流體管路包 12 M396600 99. 3ΤΙΓ^£-- This flow path is an endothermic or heat-dissipating device that is evenly distributed according to the temperature difference. The cold and hot temperature difference of the fluid can be used for natural convection, and/or the pumping fluid can be forced to generate convection, and/or radiation, and/or conduction heat transfer. Function to release heat or cold energy to a solid, or colloidal, or liquid, or gaseous object or space 200 that passively accepts heat release or absorption in a fluid state; or passively accepts heat release or endothermic solid state by conduction Or a colloidal, or liquid, or gaseous object or space 200 that releases heat or cold energy; - an endothermic or heat-dissipating device that is staggered uniformly across the temperature path, which passes the temperature of the associated fluid line The fluid 110 includes a closed flow cycle or an open flow releaser; the heat transfer or heat release device is alternately arranged according to the temperature difference, and the fluid inlet and the fluid outlet of each fluid line can be set. In the three-dimensional space pointing to the same point or different pointing; - this flow path is evenly distributed by the temperature difference staggered heat absorption or heat release device, its fluid pipeline package 12 M396600 99. 3ΤΙΓ^£
年月 F 括由管狀結構所構成, _____-2^ 及/或由具有供流體流動之流體管路之板 片狀結構所構成,及/式ώ /次由具有供流體流動之孔道狀流體管路孓 塊狀結構所構成者。 此項抓路依,皿差交錯均佈之吸熱或釋熱裝置可供應用於各 種吸熱或韻或致冷之熱傳導應用裝置,例如引擎之冷卻水箱、 或藉導溫流體^之冷能魏裝置,或料溫流體_之熱能排 放裝置 >取暖益具之溫能傳輪、或加熱裝置、或熱能傳輸裝置、The year and month F consists of a tubular structure, _____-2^ and/or consisting of a sheet-like structure having a fluid line for fluid flow, and / / 孔 / times by a fluid tube having a fluid flow for fluid flow The structure of the block structure. This type of heat-absorbing or heat-dissipating device can be applied to various heat-absorbing or rhythmic or cooling heat-conducting applications, such as the cooling water tank of the engine, or the cold energy device by the temperature-conducting fluid. , or a warm energy fluid_heat energy discharge device> a heating energy transfer wheel, or a heating device, or a heat energy transmission device,
或建朱物之天化板、牆、地板之加熱或冷卻,太陽能發電板 (ph却w Panel)之冷卻、電機或動力機械之加熱或冷卻、 各種機殼之吸熱或散熱熱管結體线減散熱、各種結構殼 體之吸熱缝熱 '各種晶以半導體元件之吸滅餘、各種通 風裝置或貝。孔裝置、或音響或影像裝置之吸熱或散熱或溫能傳 輸各種,具或發光一極體(LED)之吸熱或散熱或溫能傳輸、空 為裝置之碰③之吸熱或冷凝器之散熱或溫能傳輸、錢械裝置 之溫能傳輸、或磨擦熱損之散熱、或電暖裝置或其他電熱之家電 震置或電賊具之散熱或溫能傳輸、或火焰加熱之爐具或炊具之Or the heating or cooling of the Tianhua board, the wall and the floor of the Zhuji, the cooling of the solar power board (ph but w panel), the heating or cooling of the motor or power machinery, the heat absorption or the heat dissipation of the various casings Heat dissipation, heat-absorbing seam heat of various structural shells. 'All kinds of crystals are exhausted by semiconductor components, various ventilation devices or shells. The heat absorption or heat dissipation or the heat energy transmission of the hole device or the audio or image device, the heat absorption or heat dissipation or the heat energy transmission of the light emitting body (LED), the heat absorption of the device 3 or the heat dissipation of the condenser or The transmission of warm energy, the transmission of temperature energy of the mechanical device, or the heat dissipation of the friction heat loss, or the heating of the electric heating device or other electric appliances or the heat dissipation or warm energy transmission of the electric thief, or the stove or cooker of the flame heating
吸熱或溫能傳輸、或地層或水巾溫能之吸減散熱或温能傳輸、 廢房或房舍建細或建築材料或建築空狀讀或散熱或溫能 傳輸水b之吸熱或散熱、電瓶或燃料電池之吸熱或散熱或溫能 傳輸者; 以及應用於家電產Qn、工業產品、電子產品、電機或機械裝 置發電s又備、建築體、空調裝置'生產設備或產業製程中之溫 能傳輸應用者。 99.3. 01^] 滴充| 年月 【圖式簡單說明】 - 圖1為傳統藉吸熱或釋熱之氣態流體、或液態流體、或由氣態轉 液態之流體、或由液態轉氣態之流體所構成之導溫流體,通過定 流向導溫流體構成之吸熱或釋熱裝置之主要結構不意圖。 圖2為圖1作為吸熱之冷能排放裝置功能運作中之溫度差分佈 圖。 圖3為圖1作為釋熱之熱能排放裝置功能運作中之溫度差分佈 圖。 圖4為本新型實施例之一主要結構示意圖。 圖5為圖4所示結構作為吸熱之冷能排放裝置功能運作中之溫度 差分佈圖。 圖6為圖4所示結構作為釋熱之熱能排放裝置功能運作中之溫度 差分佈圖。 圖7為本新型貫施例之二之主要結構不意圖。 圖8為圖7所示結構作為吸熱之冷能排放裝置功能運作中之溫度 差分佈圖。 圖9為圖7所示結構作為釋熱之熱能排放裝置功能運作中之溫度 差分佈圖。 圖10所示為本新型由圖4實施例中流體管路101經吸熱或釋熱 溫能傳輸體100與供傳輸被動接受釋熱或吸熱導溫流體之管路結 構體100’作組合之應用例之一。 圖11所示為本新型由圖7實施例中流體管路101、第一分歧流體 管路1011、第二分歧流體管路1012經吸熱或釋熱溫能傳輸體100 與供傳輸被動接受釋熱或吸熱導溫流體之管路結構體100’作組 合之應用例之二。 M396600 99.^Γ〇Τ^ΓHeat absorption or warm energy transmission, or heat dissipation or warm energy transmission of the formation or water towel, heat absorption or heat dissipation of waste house or house construction or building materials or building empty reading or heat dissipation or warm energy transfer water b, Heat or heat or heat transfer of batteries or fuel cells; and temperature applied to home appliances Qn, industrial products, electronic products, electrical or mechanical devices, equipment, buildings, air-conditioning units, production equipment or industrial processes Can transfer the application. 99.3. 01^] Drip Charges | Years and Months [Simple Description] - Figure 1 shows a conventional gaseous or fluid-heated fluid, or a liquid fluid, or a liquid-to-liquid fluid, or a liquid-to-liquid fluid. The main structure of the heat-conducting or heat-dissipating device constituted by the constant-flow temperature-regulating fluid is not intended. Fig. 2 is a graph showing the temperature difference distribution in the functional operation of the heat-absorbing cold discharge device of Fig. 1. Fig. 3 is a graph showing the temperature difference distribution in the functional operation of the heat release device of Fig. 1 as a heat release device. Fig. 4 is a schematic view showing the main structure of one of the embodiments of the present invention. Fig. 5 is a graph showing the temperature difference distribution in the functional operation of the structure shown in Fig. 4 as an endothermic cold energy discharge device. Fig. 6 is a temperature difference distribution diagram of the structure shown in Fig. 4 as a function of heat release of the heat release device. Fig. 7 is a schematic view showing the main structure of the second embodiment of the present invention. Fig. 8 is a graph showing the temperature difference distribution in the functional operation of the structure shown in Fig. 7 as an endothermic cold energy discharge device. Fig. 9 is a temperature difference distribution diagram of the structure shown in Fig. 7 as a function of heat release of the heat release device. FIG. 10 is a view showing the combination of the heat-absorbing or heat-dissipating heat energy transfer body 100 of the fluid line 101 in the embodiment of FIG. 4 and the pipeline structure 100' for transmitting passively receiving heat-dissipating or heat-absorbing temperature-conducting fluid. One of the examples. Figure 11 is a schematic view of the fluid line 101, the first diverging fluid line 1011, and the second diverging fluid line 1012 of the embodiment of Fig. 7 through the endothermic or repellent thermal energy transfer body 100 and passively receiving heat for transmission. Or the application example of the combination of the heat transfer and temperature-conducting fluid pipeline structure 100'. M396600 99.^Γ〇Τ^Γ
圖12所示為本新型由圖4實施例中流體管路101經吸熱或釋熱 温能傳輸體100與多組供傳輸被動接受釋熱或吸熱導溫流體之管 路結構體100’作組合之應用例之一。 圖13所示為本新型由圖7實施例中流體管路101、第一分歧流體 管路1011、第二分歧流體管路1012經吸熱或釋熱溫能傳輸體100 與多組供傳輸被動接受釋熱或吸熱導溫流體之管路結構體100’ 作組合之應用例之二。FIG. 12 is a combination of the heat-absorbing or heat-dissipating heat energy transfer body 100 of the fluid line 101 of the embodiment of FIG. 4 and a plurality of sets of pipeline structures 100' for transmitting passively receiving heat-dissipating or heat-absorbing temperature-conducting fluid. One of the application examples. Figure 13 is a schematic view of the fluid line 101, the first diverging fluid line 1011, and the second diverging fluid line 1012 of the embodiment of Fig. 7 being passively accepted by the heat absorbing or releasing heat transfer body 100 and the plurality of groups. The pipe structure 100' of the heat release or endothermic temperature-conducting fluid is used in combination.
圖14所不為本新型之流體官路101加串獨立導溫片3 0 0之貫施 例結構示意圖。 圖15為圖14之Α-Α剖視圖。 圖16所示為本新型之流體管路101之間設置共同導溫片400之 貫施例結構不意圖。 圖17所示為圖16之Β-Β剖視圖。 圖18所示為本新型之流體管路101之間設置具隔溫槽孔之導溫 片350之實施例結構示意圖。 圖19所示為圖18之C-C剖視圖。Fig. 14 is a schematic view showing the structure of the fluid guide 101 and the series of independent temperature guides 300 of the present invention. Figure 15 is a cross-sectional view taken along line Α-Α of Figure 14. Fig. 16 is a view showing the structure of the embodiment in which the common temperature guiding sheet 400 is disposed between the fluid lines 101 of the present invention. Figure 17 is a cross-sectional view taken along line Β-Β of Figure 16. Fig. 18 is a schematic view showing the structure of an embodiment in which a temperature guiding sheet 350 having a temperature-slotted hole is provided between the fluid lines 101 of the present invention. Figure 19 is a cross-sectional view taken along line C-C of Figure 18.
圖20所示為本新型藉雙向流體泵作雙向週期泵送導溫流體110 之運作系統示意圖。 15 M396600 『9U1修ίFIG. 20 is a schematic view showing the operation system of the bidirectional periodic pumping of the temperature-conducting fluid 110 by the bidirectional fluid pump. 15 M396600 『9U1 repair ί
年月曰’ 【主要元件符號說明】 100 :吸熱或釋熱溫能傳輸體 100’ :供傳輸被動接受釋熱或吸熱導溫流體之管路結構 體 101 :流體管路 10 2 :流體入口 10 3 :流體出口 11 0 :導温流體 200 :被動接受釋熱或吸熱之固態、或膠態、或液態、或 氣態物體或空間 300 :獨立導溫片 350 :具隔溫槽孔之導溫片 4 0 0 .共同導溫片 500 :控制裝置 600 :雙向流體泵動裝置 1 011 :第一分歧流體管路 1 01 2 :第二分歧流體管路 16Year 曰 ' [Main component symbol description] 100 : Endothermic or heat release heat transfer body 100': Pipe structure for transmitting passively receiving heat release or endothermic temperature-conducting fluid 101: Fluid line 10 2 : Fluid inlet 10 3: fluid outlet 11 0: temperature-conducting fluid 200: passively accepting heat-dissipating or endothermic solid, or colloidal, or liquid, or gaseous object or space 300: independent temperature guiding sheet 350: temperature guiding sheet with temperature-insulated hole 4 0 0 . Common temperature guiding sheet 500 : Control device 600 : Two-way fluid pumping device 1 011 : First branching fluid line 1 01 2 : Second branching fluid line 16
Claims (1)
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200920218696XU CN201715902U (en) | 2009-10-16 | 2009-10-16 | Heat absorbing or releasing device with flow paths staggered and evenly distributed according to temperature difference |
US12/588,468 US20110088881A1 (en) | 2009-10-16 | 2009-10-16 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
TW098219191U TWM396600U (en) | 2009-10-16 | 2009-10-16 | Heat absorbing or disspating device with piping staggered and uniformly distributed by temperature difference |
CN2009101799928A CN102042774A (en) | 2009-10-16 | 2009-10-16 | Heat absorption or release device with flow paths distributed alternatively and evenly according to temperature difference |
SG201007469-8A SG170688A1 (en) | 2009-10-16 | 2010-10-12 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
CA2717562A CA2717562A1 (en) | 2009-10-16 | 2010-10-13 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
JP2010230370A JP2011085384A (en) | 2009-10-16 | 2010-10-13 | Heat absorbing or radiating device |
EP10187801A EP2314968A3 (en) | 2009-10-16 | 2010-10-15 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
AU2010235861A AU2010235861A1 (en) | 2009-10-16 | 2010-10-15 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
BRPI1003952-0A BRPI1003952A2 (en) | 2009-10-16 | 2010-10-15 | stepped pipe absorber or heatsink evenly distributed over temperature difference |
RU2010142320/06A RU2010142320A (en) | 2009-10-16 | 2010-10-15 | DEVICE FOR ABSORPTION OR REMOVAL OF HEAT WITH A PIPELINE LOCATED ZIGZAGOALLY AND UNIFORMLY DISTRIBUTED IN ACCORDANCE WITH THE DIFFERENCE OF TEMPERATURES |
KR1020100110822A KR20120049525A (en) | 2009-10-16 | 2010-11-09 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200920218696XU CN201715902U (en) | 2009-10-16 | 2009-10-16 | Heat absorbing or releasing device with flow paths staggered and evenly distributed according to temperature difference |
US12/588,468 US20110088881A1 (en) | 2009-10-16 | 2009-10-16 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
TW098219191U TWM396600U (en) | 2009-10-16 | 2009-10-16 | Heat absorbing or disspating device with piping staggered and uniformly distributed by temperature difference |
CN2009101799928A CN102042774A (en) | 2009-10-16 | 2009-10-16 | Heat absorption or release device with flow paths distributed alternatively and evenly according to temperature difference |
KR1020100110822A KR20120049525A (en) | 2009-10-16 | 2010-11-09 | Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM396600U true TWM396600U (en) | 2011-01-21 |
Family
ID=51228829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098219191U TWM396600U (en) | 2009-10-16 | 2009-10-16 | Heat absorbing or disspating device with piping staggered and uniformly distributed by temperature difference |
Country Status (11)
Country | Link |
---|---|
US (1) | US20110088881A1 (en) |
EP (1) | EP2314968A3 (en) |
JP (1) | JP2011085384A (en) |
KR (1) | KR20120049525A (en) |
CN (2) | CN201715902U (en) |
AU (1) | AU2010235861A1 (en) |
BR (1) | BRPI1003952A2 (en) |
CA (1) | CA2717562A1 (en) |
RU (1) | RU2010142320A (en) |
SG (1) | SG170688A1 (en) |
TW (1) | TWM396600U (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9322723B2 (en) | 2012-07-10 | 2016-04-26 | General Electric Company | Energy harvesting survey apparatus and method of detecting thermal energy |
CN102818467B (en) * | 2012-09-12 | 2014-06-18 | 锘威科技(深圳)有限公司 | Flat plate heating pipe and manufacturing method thereof |
US20140083666A1 (en) * | 2012-09-27 | 2014-03-27 | Tai-Her Yang | Tri-Piece Thermal Energy Body Heat Exchanger Having Multi-Layer Pipeline and Transferring Heat to Exterior Through Outer Periphery of Pipeline |
US9897400B2 (en) * | 2013-10-29 | 2018-02-20 | Tai-Her Yang | Temperature control system having adjacently-installed temperature equalizer and heat transfer fluid and application device thereof |
US10415903B2 (en) * | 2014-10-15 | 2019-09-17 | Hamilton Sundstrand Corporation | Prevention of cooling flow blockage |
ITUB20161177A1 (en) * | 2016-02-29 | 2017-08-29 | Torino Politecnico | Prefabricated modular energy concept, a lining for tunnels made with a plurality of such segments and a method for exchanging heat in a tunnel by providing a coating with a plurality of such segments |
CN105744805A (en) * | 2016-04-15 | 2016-07-06 | 周哲明 | Multi-channel combined water-cooling plate |
CN108507184B (en) * | 2018-03-21 | 2021-02-26 | 安徽省宁国市天成电气有限公司 | Resistance wire liquid heater |
EP3620741B1 (en) * | 2018-09-04 | 2021-01-27 | Ovh | Thermal transfer device having a fluid conduit |
CN109404943A (en) * | 2018-10-17 | 2019-03-01 | 上海康恒环境股份有限公司 | Low latitude gas is than high-temp combustion water-cooled grate |
CN111473546A (en) * | 2020-04-23 | 2020-07-31 | 长虹美菱股份有限公司 | Refrigerating device and refrigerator |
CN114325590B (en) * | 2021-12-27 | 2023-05-30 | 北京微焓科技有限公司 | Phased array radar cold plate and phased array radar |
Family Cites Families (14)
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DE2553967A1 (en) * | 1975-12-01 | 1977-06-02 | Gerhard Dipl Ing Pruefling | Floor heating arrangement with polystyrene substrate - having array of circular projections covered by aluminium caps about which are trained plastics heating tubes |
IL55047A0 (en) * | 1977-07-22 | 1978-08-31 | Carrier Corp | Heat exchange system |
FR2549215B1 (en) * | 1983-07-11 | 1988-06-24 | Produits Refractaires | MOLDED HEAT EXCHANGERS IN REFRACTORY MATERIAL |
JPS6113575A (en) * | 1984-06-29 | 1986-01-21 | Fuji Electric Co Ltd | Construction of cooling plate of fuel cell |
JPH08247576A (en) * | 1995-03-14 | 1996-09-27 | Toshiba Corp | Air-conditioner |
NL1001064C1 (en) * | 1995-06-28 | 1995-11-15 | Fasting Corian Verwerking | Cooling device. |
US6066408A (en) * | 1997-08-07 | 2000-05-23 | Plug Power Inc. | Fuel cell cooler-humidifier plate |
US6581224B2 (en) * | 2001-03-06 | 2003-06-24 | Hyun Yoon | Bed heating systems |
US6684941B1 (en) * | 2002-06-04 | 2004-02-03 | Yiding Cao | Reciprocating-mechanism driven heat loop |
US7559356B2 (en) * | 2004-04-19 | 2009-07-14 | Eksident Technologies, Inc. | Electrokinetic pump driven heat transfer system |
DE102007016106A1 (en) * | 2007-04-03 | 2008-10-09 | Lessing, Jürgen | Safety heat exchanger |
DE102007034294A1 (en) * | 2007-07-24 | 2009-01-29 | BSH Bosch und Siemens Hausgeräte GmbH | Refrigerating appliance and evaporator for it |
US8622116B2 (en) * | 2008-10-15 | 2014-01-07 | Tai-Her Yang | Heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids |
US8726979B2 (en) * | 2008-12-23 | 2014-05-20 | Tai-Her Yang | Heat exchange apparatus with automatic heat exchange fluid flow rate exchange modulation |
-
2009
- 2009-10-16 CN CN200920218696XU patent/CN201715902U/en not_active Expired - Fee Related
- 2009-10-16 US US12/588,468 patent/US20110088881A1/en not_active Abandoned
- 2009-10-16 TW TW098219191U patent/TWM396600U/en not_active IP Right Cessation
- 2009-10-16 CN CN2009101799928A patent/CN102042774A/en active Pending
-
2010
- 2010-10-12 SG SG201007469-8A patent/SG170688A1/en unknown
- 2010-10-13 CA CA2717562A patent/CA2717562A1/en not_active Abandoned
- 2010-10-13 JP JP2010230370A patent/JP2011085384A/en active Pending
- 2010-10-15 EP EP10187801A patent/EP2314968A3/en not_active Withdrawn
- 2010-10-15 AU AU2010235861A patent/AU2010235861A1/en not_active Abandoned
- 2010-10-15 BR BRPI1003952-0A patent/BRPI1003952A2/en not_active Application Discontinuation
- 2010-10-15 RU RU2010142320/06A patent/RU2010142320A/en not_active Application Discontinuation
- 2010-11-09 KR KR1020100110822A patent/KR20120049525A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
BRPI1003952A2 (en) | 2013-02-13 |
AU2010235861A1 (en) | 2011-05-12 |
EP2314968A2 (en) | 2011-04-27 |
EP2314968A3 (en) | 2011-07-06 |
JP2011085384A (en) | 2011-04-28 |
CN201715902U (en) | 2011-01-19 |
CA2717562A1 (en) | 2011-04-16 |
SG170688A1 (en) | 2011-05-30 |
CN102042774A (en) | 2011-05-04 |
US20110088881A1 (en) | 2011-04-21 |
RU2010142320A (en) | 2012-04-20 |
KR20120049525A (en) | 2012-05-17 |
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Legal Events
Date | Code | Title | Description |
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MM4K | Annulment or lapse of a utility model due to non-payment of fees |