US20110011148A1 - Method for forming patterned modified metal layer - Google Patents
Method for forming patterned modified metal layer Download PDFInfo
- Publication number
- US20110011148A1 US20110011148A1 US12/585,721 US58572109A US2011011148A1 US 20110011148 A1 US20110011148 A1 US 20110011148A1 US 58572109 A US58572109 A US 58572109A US 2011011148 A1 US2011011148 A1 US 2011011148A1
- Authority
- US
- United States
- Prior art keywords
- metal
- layer
- metal layer
- modified
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/20—Applying plastic materials and superficially modelling the surface of these materials
Definitions
- the present invention relates to a method for forming a modified metal layer and, more particularly, to a method combining direct imprint and surface modification for forming a modified metal layer.
- the patterning methods used to form nano-patterns can be e-beam lithography, ion-beam lithography, DUV (deep ultraviolet)/EUV (extreme ultraviolet) photolithography, soft X-ray lithography, and nanoimprint lithography.
- the nanoimprint technique has advantages of high resolution, rapid manufacturing rate, and low cost, so it is widely applied in various fields.
- FIGS. 1A to 1E are the process scheme for forming a patterned metal layer onto a substrate by using nanoimprint.
- a substrate 10 , and a mold 11 are provided, wherein the substrate is covered with a photoresist layer 101 , and the mold 11 has determined patterns of recesses 111 and protrusions 112 .
- the mold 11 is applied onto the photoresist layer 101 coated on the substrate 10 at elevated temperature, which is usually above the T g of the photoresist.
- the photoresist layer 101 becomes less viscous and easy to flow at this temperature with applying a suitable load, so the photoresist layer 101 can sufficiently fill the recesses 111 of the mold 11 .
- the determined patterns are transferred to the photoresist layer 101 , as shown in FIG. 1C .
- the patterned photoresist layer 101 is used as an etching mask to etch the substrate 10 .
- a patterned substrate 10 is obtained, as shown in FIG. 1D .
- a metal layer 12 is deposited on the surface of the patterned substrate, and a metal layer 12 with patterns is obtained.
- Nanoimprint can prepare a patterned substrate with high resolution in a cheap and rapid way.
- the processes of etching and deposition have to be performed.
- the patterns of the metal layer are different from the original patterns on the mold, which causes the resolution of patterns to decrease and further causes the failure in processes.
- titanium oxide can be applied in electronic devices such as electrode material of dye-sensitized solar cells (DSSCs), photocatalyst, and biomaterials, i.e. bio-implant material.
- DSSCs dye-sensitized solar cells
- biomaterials i.e. bio-implant material.
- the titanium oxide layer i.e. modified metal layer
- the photoelectric conversion efficiency of DSSC or bioactive efficiency of bio-implant can be improved greatly.
- the ordinarily used photocatalyst is mostly in powder form, which could cause damage to respiratory systems. If the patterned titanium oxide layer is used as the photocatalyst, not only the catalytic efficiency of the photocatalyst can be improved, but also the problem of dust in the air can be solved.
- the modified metal layer can be applied to various fields, and the patterned modified metal layer can further increase the efficiency of the products. Therefore, it is desirable to provide a simple method for forming a patterned modified metal layer, especially focusing on the potential of mass production, and reducing the process complexity and cost.
- the object of the present invention is to provide a method for forming a patterned modified metal layer, which can prepare a patterned modified metal layer in a simple way, to decrease both the cost and the complexity of the process and also increase the application or functionality of products.
- the method for forming a patterned modified metal layer of the present invention comprises the following steps: (A) providing a metal base, and a mode with patterns; (B) applying the mold onto the metal base to transfer the patterns of the mold to a surface of the metal base; (C) removing the mold; and (D) modifying the metal base to form a modified metal layer with the patterns.
- the imprinting process is performed to the metal base directly, so the pattern on the mold can be transferred to the metal base without the using of series complex processes, such as pattern exposing and developing, deposition, and etching etc. Hence, the production cost and the complexity of the process can be reduced greatly.
- the patterned metal base is modified to form a patterned modified metal layer in the present invention. Therefore, the method of the present invention combines the metallic direct imprinting process with modification treatment to form a patterned modified metal layer, which can be applied widely to various fields.
- the metal base may be a bulk metal, or a substrate with a metal layer formed/coated thereon (i.e. metal-layer-coated substrate).
- the material of the substrate is unlimited.
- the substrate is a silicon substrate, a glass substrate, or a quartz substrate.
- the material of the bulk metal and the metal layer is unlimited, as long as the material of the bulk metal and the metal layer is soft metal.
- the material of the bulk metal and the metal layer is Al, Ti, Zn, Cu, Ag, Ni, Au, Pt, or an alloy thereof. More preferably, the material of the bulk metal and the metal layer is Al, Zn, Au, or Ti.
- the method of the present invention can pattern the metal base by performing the imprinting process on the metal base directly, due to the flexibility of the soft metal.
- the surface of the metal base which is to be patterned, is not limited to a flat surface.
- the surface of the metal base also can be a curved surface, such as a concave surface, a convex surface, or a wave surface.
- the pattern of the mold may be transferred to the surface of the metal base through a thermal nanoimprint process in the step (B).
- the metal base may be modified by using the well known techniques, such as heat treatment, plasma treatment, laser treatmemt, pulse laser treatment, or rapid thermal annealing/processing (RTA or RTP) etc., in the step (D).
- the plasma treatment may be oxygen-plasma treatment, nitrogen-plasma treatment, or mixture-plasma treatment, such as oxygen-argon plasma treatment and nitrogen-argon plasma treatment.
- the inlet gas can be a single component gas, such as O 2 , N 2 , H 2 , and Ar, or mixture-gases, such as N 2 —Ar, O 2 —Ar, and H 2 —O 2 .
- the heat treatment, laser treatment, laser pulse laser treatment, or rapid thermal annealing/processing can be performed in a vacuum. When the modification is performed under an O 2 atmosphere, a metal oxide layer is obtained. When the modification is performed under an N 2 atmosphere, a metal nitride layer is obtained.
- the modified metal layer formed by the method of the present invention can be an Al 2 O 3 layer, an AlN layer, a TiO 2 layer, a TiN layer, or a ZnO layer.
- the thickness of the metal base is unlimited.
- the modification process in the step (D) could be the whole bulk (i.e. entire modification), or only the surface of the bulk (i.e. partial modification).
- the metal base is a metal-layer-coated substrate
- the modified layer can be either entire metal layer or partial metal layer in the step (D).
- the thickness of the metal layer is unlimited, which can be selected according to the application field.
- the thickness of the metal layer is 1 nm ⁇ 5 ⁇ m.
- the thickness of the modified metal layer is also unlimited, which can be adjusted according to the application field.
- the thickness of the modified metal layer is 1 nm ⁇ 5 ⁇ m. More preferably, the thickness of the modified metal layer is 2 nm ⁇ 2 ⁇ m.
- the prepared modified metal layer has patterns of recesses and protrusions.
- the sizes of the recesses and protrusions of the patterns are unlimited, and can be adjusted according to the application field.
- the modified metal layer may have a nano-scale pattern, or a micro-scale pattern, even or a mixture-scale pattern.
- the depth of the recesses is 1 nm ⁇ 3 ⁇ m, and the width of the recesses is 3 nm ⁇ 300 ⁇ m. More preferably, the depth of the recesses is 2 nm ⁇ 1 ⁇ m, and the width of the recesses is 3 nm ⁇ 10 ⁇ m.
- the patterned modified metal layer which is prepared by the method of the present invention, can be applied in various fields, such as electrode materials of DSSCs, photocatalysts, biomaterials such as bio-implant materials, and device elements with wear-resisting outer surfaces.
- the photoelectric conversion efficiency of the DSSC can be improved.
- the conventional TiO 2 photocatalyst is formed by aggregation of nano-sized TiO 2 particles, so the unbound nano-sized particle may cause damage to the respiratory system.
- the patterned TiO 2 layer prepared by the method of the present invention is used as a photocatalyst, the problem of dust in the air can be solved.
- the patterned TiO 2 layer can increase the reaction surface through patterning, so the catalytic efficiency can also be maintained.
- the contact surface area of the biomedical device can be increased by the nano-sized pattern of the TiO 2 layer or modified Ti layer. Hence, the reaction efficiency and the applicability of the biomedical device can be improved.
- the reflection coefficient can be increased by the pattern of the Al 2 O 3 layer.
- TiN has the property of high hardness, so the patterned TiN layer formed by the method of the present invention can be used to increase the wear-resistance of the outer surface of the device elements in different application fields.
- FIGS. 1A to 1E are the sectional views illustrating the process for forming a patterned metal layer through a nanoimprint process in the art
- FIGS. 2A to 2D are the sectional views illustrating the process for forming a patterned modified metal layer in Embodiment 1 of the present invention.
- FIGS. 3A to 3C are the sectional views illustrating the process for forming a patterned modified metal layer in Embodiment 2 of the present invention.
- FIGS. 2A to 2D are the sectional views illustrating the process for forming a patterned modified metal layer in the present embodiment.
- a metal base 20 is provided, wherein the metal base 20 is a substrate 201 with a metal layer 202 formed thereon. Further, a mold 21 is provided, wherein the mold 21 has a determined pattern of recesses 211 and protrusions 212 .
- the substrate 201 is a silicon substrate; the material of the metal layer 202 is Ti; and the thickness T of the metal layer 202 is 100 nm.
- the mold 21 is applied onto the metal base 20 through a hot embossing nanoimprint process. After removing the mold 21 , the pattern on the mold 21 is transferred to the metal layer 202 of the metal base 20 , as shown in FIG. 2C .
- the protrusions 2021 of the metal layer 202 correspond to the recesses 211 of the mold 21
- the recesses 2022 of the metal layer 202 correspond to the protrusions 212 of the mold 21 .
- the metal layer 202 of the metal base 20 is modified to form a modified metal layer 23 .
- a heat treatment is performed to modify the whole metal layer 202 , and then a metal oxide layer is obtained.
- the material of the metal layer 202 is Ti, so the modified metal layer 23 is a TiO 2 layer.
- the modified metal layer 23 has a pattern of protrusions 231 and recesses 232 , which is the same as the pattern of the metal layer 202 of the metal base 20 .
- the recesses 232 of the modified metal layer 23 have a width W of 10 nm, and a depth D of 50 nm.
- FIGS. 3A to 3C are the sectional views illustrating the process for forming a patterned modified metal layer in the present embodiment.
- the process for forming patterned modified metal layer is similar to that illustrated in Embodiment 1.
- a metal base 20 and a mold 22 with a determined pattern are provided, as shown in FIG. 3A .
- the metal base 20 is a bulk metal
- the material of the metal is Al.
- the mold 22 is applied on the metal base 20 , to transfer the pattern of the mold 22 to the metal base 20 .
- a patterned metal base 20 is obtained, as shown in FIG. 3B .
- the metal base 20 is modified to form a patterned modified metal layer 23 .
- an oxygen plasma treatment is performed to partially modify the surface of the metal base 20 , and then a metal oxide layer is obtained.
- the material of the metal base 20 is Al, so the obtained modified metal layer 23 is an Al 2 O 3 layer.
- the thickness T of the obtained modified metal layer 23 is about 100 nm.
- the modified metal layer 23 has a pattern of protrusions 231 and recesses 232 .
- the recesses 232 of the modified metal layer 23 have a width W of 100 nm, and a depth D of 20 nm. Furthermore, the recesses 232 are in the forms of holes.
- the process for forming patterned modified metal layer in the present embodiment is similar to that illustrated in Embodiment 1, except that the metal layer is modified with nitrogen plasma instead of heat treatment. Hence, a patterned TiN layer is obtained in the present embodiment.
- the patterned metal layer is formed by imprinting the soft metal directly, without performing the process of etching and metal deposition.
- the method of the present invention can form a patterned metal layer in a simpler way, so the production cost and the complexity of the process can be reduced. Also, the applicability of products can be increased.
- the method of the present invention further combines the metallic direct imprinting process with a process of modification, in order to obtain a patterned modified metal layer, which can be applied to various fields.
Landscapes
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a method for forming a modified metal layer and, more particularly, to a method combining direct imprint and surface modification for forming a modified metal layer.
- 2. Description of Related Art
- As progressing in fabrication techniques, several patterning methods have been developed to form micro- or nano-patterns on the surface of the materials. Currently, the patterning methods used to form nano-patterns can be e-beam lithography, ion-beam lithography, DUV (deep ultraviolet)/EUV (extreme ultraviolet) photolithography, soft X-ray lithography, and nanoimprint lithography. Among the aforementioned patterning techniques, the nanoimprint technique has advantages of high resolution, rapid manufacturing rate, and low cost, so it is widely applied in various fields.
-
FIGS. 1A to 1E are the process scheme for forming a patterned metal layer onto a substrate by using nanoimprint. First, as shown inFIG. 1A , asubstrate 10, and amold 11 are provided, wherein the substrate is covered with aphotoresist layer 101, and themold 11 has determined patterns ofrecesses 111 andprotrusions 112. Then, as shown inFIG. 1B , themold 11 is applied onto thephotoresist layer 101 coated on thesubstrate 10 at elevated temperature, which is usually above the Tg of the photoresist. Thephotoresist layer 101 becomes less viscous and easy to flow at this temperature with applying a suitable load, so thephotoresist layer 101 can sufficiently fill therecesses 111 of themold 11. After cooling to the room temperature and then releasing the load and themold 11 is finished, the determined patterns are transferred to thephotoresist layer 101, as shown inFIG. 1C . The patternedphotoresist layer 101 is used as an etching mask to etch thesubstrate 10. After thephotoresist layer 101 is removed, a patternedsubstrate 10 is obtained, as shown inFIG. 1D . Finally, ametal layer 12 is deposited on the surface of the patterned substrate, and ametal layer 12 with patterns is obtained. - Nanoimprint can prepare a patterned substrate with high resolution in a cheap and rapid way. However, when a patterned metal layer is desired, the processes of etching and deposition have to be performed. Sometimes, due to the control of the parameters of these processes being difficult, the patterns of the metal layer are different from the original patterns on the mold, which causes the resolution of patterns to decrease and further causes the failure in processes.
- In addition, metal oxides can be widely applied in various fields. For example, titanium oxide can be applied in electronic devices such as electrode material of dye-sensitized solar cells (DSSCs), photocatalyst, and biomaterials, i.e. bio-implant material. When the titanium oxide layer (i.e. modified metal layer) is finely patterned, the photoelectric conversion efficiency of DSSC or bioactive efficiency of bio-implant can be improved greatly. In addition, the ordinarily used photocatalyst is mostly in powder form, which could cause damage to respiratory systems. If the patterned titanium oxide layer is used as the photocatalyst, not only the catalytic efficiency of the photocatalyst can be improved, but also the problem of dust in the air can be solved.
- In conclusion, the modified metal layer can be applied to various fields, and the patterned modified metal layer can further increase the efficiency of the products. Therefore, it is desirable to provide a simple method for forming a patterned modified metal layer, especially focusing on the potential of mass production, and reducing the process complexity and cost.
- The object of the present invention is to provide a method for forming a patterned modified metal layer, which can prepare a patterned modified metal layer in a simple way, to decrease both the cost and the complexity of the process and also increase the application or functionality of products.
- To achieve the object, the method for forming a patterned modified metal layer of the present invention comprises the following steps: (A) providing a metal base, and a mode with patterns; (B) applying the mold onto the metal base to transfer the patterns of the mold to a surface of the metal base; (C) removing the mold; and (D) modifying the metal base to form a modified metal layer with the patterns.
- According to the method of the present invention, the imprinting process is performed to the metal base directly, so the pattern on the mold can be transferred to the metal base without the using of series complex processes, such as pattern exposing and developing, deposition, and etching etc. Hence, the production cost and the complexity of the process can be reduced greatly. In addition, in order to increase the applications of the metal base, the patterned metal base is modified to form a patterned modified metal layer in the present invention. Therefore, the method of the present invention combines the metallic direct imprinting process with modification treatment to form a patterned modified metal layer, which can be applied widely to various fields.
- According to the method of the present invention, the metal base may be a bulk metal, or a substrate with a metal layer formed/coated thereon (i.e. metal-layer-coated substrate). Herein, the material of the substrate is unlimited. Preferably, the substrate is a silicon substrate, a glass substrate, or a quartz substrate. In addition, the material of the bulk metal and the metal layer is unlimited, as long as the material of the bulk metal and the metal layer is soft metal. Preferably, the material of the bulk metal and the metal layer is Al, Ti, Zn, Cu, Ag, Ni, Au, Pt, or an alloy thereof. More preferably, the material of the bulk metal and the metal layer is Al, Zn, Au, or Ti. Hence, the method of the present invention can pattern the metal base by performing the imprinting process on the metal base directly, due to the flexibility of the soft metal.
- According to the method of the present invention, the surface of the metal base, which is to be patterned, is not limited to a flat surface. The surface of the metal base also can be a curved surface, such as a concave surface, a convex surface, or a wave surface.
- According to the method of the present invention, the pattern of the mold may be transferred to the surface of the metal base through a thermal nanoimprint process in the step (B). In addition, the metal base may be modified by using the well known techniques, such as heat treatment, plasma treatment, laser treatmemt, pulse laser treatment, or rapid thermal annealing/processing (RTA or RTP) etc., in the step (D). Herein, the plasma treatment may be oxygen-plasma treatment, nitrogen-plasma treatment, or mixture-plasma treatment, such as oxygen-argon plasma treatment and nitrogen-argon plasma treatment. When the metal layer is treated with nitrogen plasma or nitrogen-argon plasma, a metal nitride layer is obtained. When the metal layer is treated with oxygen plasma or oxygen-argon plasma, a metal oxide layer is obtained. Furthermore, when the heat treatment, laser treatment, pulse laser treatment, or rapid thermal annealing/processing is used to modify the metal layer, the inlet gas can be a single component gas, such as O2, N2, H2, and Ar, or mixture-gases, such as N2—Ar, O2—Ar, and H2—O2. Also, the heat treatment, laser treatment, laser pulse laser treatment, or rapid thermal annealing/processing can be performed in a vacuum. When the modification is performed under an O2 atmosphere, a metal oxide layer is obtained. When the modification is performed under an N2 atmosphere, a metal nitride layer is obtained. When the modification is performed under an atmosphere of inert gas such as Ar atmosphere, or in a vacuum, the crystalline structure or the micro-structure of the metal layer can be changed. Preferably, the modified metal layer formed by the method of the present invention can be an Al2O3 layer, an AlN layer, a TiO2 layer, a TiN layer, or a ZnO layer.
- According to the method of the present invention, the thickness of the metal base is unlimited. When the metal base is a bulk metal, the modification process in the step (D) could be the whole bulk (i.e. entire modification), or only the surface of the bulk (i.e. partial modification). When the metal base is a metal-layer-coated substrate, the modified layer can be either entire metal layer or partial metal layer in the step (D). In the method of the present invention, the thickness of the metal layer is unlimited, which can be selected according to the application field. Preferably, the thickness of the metal layer is 1 nm˜5 μm. In addition, the thickness of the modified metal layer is also unlimited, which can be adjusted according to the application field. Preferably, the thickness of the modified metal layer is 1 nm˜5 μm. More preferably, the thickness of the modified metal layer is 2 nm˜2 μm.
- According to the method of the present invention, the prepared modified metal layer has patterns of recesses and protrusions. Herein, the sizes of the recesses and protrusions of the patterns are unlimited, and can be adjusted according to the application field. Hence, the modified metal layer may have a nano-scale pattern, or a micro-scale pattern, even or a mixture-scale pattern. Preferably, the depth of the recesses is 1 nm˜3 μm, and the width of the recesses is 3 nm˜300 μm. More preferably, the depth of the recesses is 2 nm˜1 μm, and the width of the recesses is 3 nm˜10 μm.
- The patterned modified metal layer, which is prepared by the method of the present invention, can be applied in various fields, such as electrode materials of DSSCs, photocatalysts, biomaterials such as bio-implant materials, and device elements with wear-resisting outer surfaces.
- When the patterned TiO2 layer or ZnO layer is used as an electrode of DSSC, the photoelectric conversion efficiency of the DSSC can be improved.
- In addition, the conventional TiO2 photocatalyst is formed by aggregation of nano-sized TiO2 particles, so the unbound nano-sized particle may cause damage to the respiratory system. On the contrary, when the patterned TiO2 layer prepared by the method of the present invention is used as a photocatalyst, the problem of dust in the air can be solved. At the same time, the patterned TiO2 layer can increase the reaction surface through patterning, so the catalytic efficiency can also be maintained.
- Furthermore, when the patterned TiO2 layer or the patterned modified Ti layer is used in a biomedical device, the contact surface area of the biomedical device can be increased by the nano-sized pattern of the TiO2 layer or modified Ti layer. Hence, the reaction efficiency and the applicability of the biomedical device can be improved.
- In addition, when the patterned Al2O3 layer is used in light reflection material, the reflection coefficient can be increased by the pattern of the Al2O3 layer.
- TiN has the property of high hardness, so the patterned TiN layer formed by the method of the present invention can be used to increase the wear-resistance of the outer surface of the device elements in different application fields.
-
FIGS. 1A to 1E are the sectional views illustrating the process for forming a patterned metal layer through a nanoimprint process in the art; -
FIGS. 2A to 2D are the sectional views illustrating the process for forming a patterned modified metal layer in Embodiment 1 of the present invention; and -
FIGS. 3A to 3C are the sectional views illustrating the process for forming a patterned modified metal layer in Embodiment 2 of the present invention. - Hereinbelow, the present invention will be described in detail with reference to the Embodiments. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the Embodiments set forth herein. Rather, these Embodiments are provided to fully convey the concept of the invention to those skilled in the art.
-
FIGS. 2A to 2D are the sectional views illustrating the process for forming a patterned modified metal layer in the present embodiment. - First, as shown in
FIG. 2A , ametal base 20 is provided, wherein themetal base 20 is asubstrate 201 with ametal layer 202 formed thereon. Further, amold 21 is provided, wherein themold 21 has a determined pattern ofrecesses 211 andprotrusions 212. In the present embodiment, thesubstrate 201 is a silicon substrate; the material of themetal layer 202 is Ti; and the thickness T of themetal layer 202 is 100 nm. - Next, as shown in
FIG. 2B , themold 21 is applied onto themetal base 20 through a hot embossing nanoimprint process. After removing themold 21, the pattern on themold 21 is transferred to themetal layer 202 of themetal base 20, as shown inFIG. 2C . Herein, theprotrusions 2021 of themetal layer 202 correspond to therecesses 211 of themold 21, and therecesses 2022 of themetal layer 202 correspond to theprotrusions 212 of themold 21. - Then, as shown in
FIG. 2D , themetal layer 202 of themetal base 20 is modified to form a modifiedmetal layer 23. Herein, a heat treatment is performed to modify thewhole metal layer 202, and then a metal oxide layer is obtained. In the present embodiment, the material of themetal layer 202 is Ti, so the modifiedmetal layer 23 is a TiO2 layer. - In addition, the modified
metal layer 23 has a pattern ofprotrusions 231 and recesses 232, which is the same as the pattern of themetal layer 202 of themetal base 20. In the present embodiment, therecesses 232 of the modifiedmetal layer 23 have a width W of 10 nm, and a depth D of 50 nm. -
FIGS. 3A to 3C are the sectional views illustrating the process for forming a patterned modified metal layer in the present embodiment. In the present embodiment, the process for forming patterned modified metal layer is similar to that illustrated in Embodiment 1. - First, a
metal base 20 and amold 22 with a determined pattern are provided, as shown inFIG. 3A . In the present embodiment, themetal base 20 is a bulk metal, and the material of the metal is Al. - Next, the
mold 22 is applied on themetal base 20, to transfer the pattern of themold 22 to themetal base 20. After themold 22 is removed, a patternedmetal base 20 is obtained, as shown inFIG. 3B . - Finally, the
metal base 20 is modified to form a patterned modifiedmetal layer 23. Herein, an oxygen plasma treatment is performed to partially modify the surface of themetal base 20, and then a metal oxide layer is obtained. In the present embodiment, the material of themetal base 20 is Al, so the obtained modifiedmetal layer 23 is an Al2O3 layer. - In the present embodiment, the thickness T of the obtained modified
metal layer 23 is about 100 nm. Herein, the modifiedmetal layer 23 has a pattern ofprotrusions 231 and recesses 232. In the present embodiment, therecesses 232 of the modifiedmetal layer 23 have a width W of 100 nm, and a depth D of 20 nm. Furthermore, therecesses 232 are in the forms of holes. - The process for forming patterned modified metal layer in the present embodiment is similar to that illustrated in Embodiment 1, except that the metal layer is modified with nitrogen plasma instead of heat treatment. Hence, a patterned TiN layer is obtained in the present embodiment.
- In conclusion, according to the method for forming a modified metal layer of the present invention, the patterned metal layer is formed by imprinting the soft metal directly, without performing the process of etching and metal deposition. Hence, as compared with the conventional process, the method of the present invention can form a patterned metal layer in a simpler way, so the production cost and the complexity of the process can be reduced. Also, the applicability of products can be increased. In addition, the method of the present invention further combines the metallic direct imprinting process with a process of modification, in order to obtain a patterned modified metal layer, which can be applied to various fields.
- Although the present invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the scope of the invention as hereinafter claimed.
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW98123861A TWI473726B (en) | 2009-07-15 | 2009-07-15 | Method for forming modified metal layer |
TW098123861 | 2009-07-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110011148A1 true US20110011148A1 (en) | 2011-01-20 |
Family
ID=43464317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/585,721 Abandoned US20110011148A1 (en) | 2009-07-15 | 2009-09-23 | Method for forming patterned modified metal layer |
Country Status (2)
Country | Link |
---|---|
US (1) | US20110011148A1 (en) |
TW (1) | TWI473726B (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110169027A1 (en) * | 2010-01-13 | 2011-07-14 | Korea Institute Of Machinery & Materials | Patterning Method of Metal Oxide Thin Film Using Nanoimprinting, and Manufacturing Method of Light Emitting Diode |
WO2015102620A1 (en) * | 2013-12-31 | 2015-07-09 | Halliburton Energy Services, Inc. | Selective annealing process for perforation guns |
US20150306831A1 (en) * | 2012-12-05 | 2015-10-29 | The Yokohama Rubber Co., Ltd. | Pneumatic Tire with Surface Fastener and Method of Manufacturing Same |
US20160087210A1 (en) * | 2010-04-28 | 2016-03-24 | Koninklijke Philips N.V. | Organic light emitting device with increased light out coupling |
US9778470B2 (en) | 2010-09-22 | 2017-10-03 | Koninklijke Philips Electronics N.V. | Multi-view display device |
US20180117797A1 (en) * | 2016-10-13 | 2018-05-03 | Purdue Research Foundation | Methods of making hydrophobic contoured surfaces and hydrophobic contoured surfaces and devices made therefrom |
KR20200035140A (en) * | 2017-09-28 | 2020-04-01 | 가부시키가이샤 코쿠사이 엘렉트릭 | Method for manufacturing semiconductor device, substrate processing device and recording medium |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9972504B2 (en) * | 2015-08-07 | 2018-05-15 | Lam Research Corporation | Atomic layer etching of tungsten for enhanced tungsten deposition fill |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005305634A (en) * | 2004-03-26 | 2005-11-04 | Fujitsu Ltd | Nano hole structure and its manufacturing method, stamper and its manufacturing method, magnetic recording medium and its manufacturing method, and magnetic recorder and magnetic recording method |
TW200603994A (en) * | 2004-07-23 | 2006-02-01 | Hon Hai Prec Ind Co Ltd | Nano-imprinting stamp and method for making same |
TW200923003A (en) * | 2007-09-11 | 2009-06-01 | Fujifilm Corp | Curable composition for nanoimprint, cured product and production method thereof |
-
2009
- 2009-07-15 TW TW98123861A patent/TWI473726B/en not_active IP Right Cessation
- 2009-09-23 US US12/585,721 patent/US20110011148A1/en not_active Abandoned
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110169027A1 (en) * | 2010-01-13 | 2011-07-14 | Korea Institute Of Machinery & Materials | Patterning Method of Metal Oxide Thin Film Using Nanoimprinting, and Manufacturing Method of Light Emitting Diode |
US8486753B2 (en) * | 2010-01-13 | 2013-07-16 | Korea Institute Of Machinery And Materials | Patterning method of metal oxide thin film using nanoimprinting, and manufacturing method of light emitting diode |
US20160087210A1 (en) * | 2010-04-28 | 2016-03-24 | Koninklijke Philips N.V. | Organic light emitting device with increased light out coupling |
US9748486B2 (en) * | 2010-04-28 | 2017-08-29 | Koninklijke Philips N.V. | Organic light emitting device with increased light out coupling |
US11281020B2 (en) | 2010-09-22 | 2022-03-22 | Koninklijke Philips N.V. | Multi-view display device |
US9778470B2 (en) | 2010-09-22 | 2017-10-03 | Koninklijke Philips Electronics N.V. | Multi-view display device |
US10481406B2 (en) | 2010-09-22 | 2019-11-19 | Koninklijke Philips N.V. | Multi-view display device |
US20150306831A1 (en) * | 2012-12-05 | 2015-10-29 | The Yokohama Rubber Co., Ltd. | Pneumatic Tire with Surface Fastener and Method of Manufacturing Same |
US10184157B2 (en) | 2013-12-31 | 2019-01-22 | Halliburton Energy Services, Inc. | Selective annealing process for perforation guns |
WO2015102620A1 (en) * | 2013-12-31 | 2015-07-09 | Halliburton Energy Services, Inc. | Selective annealing process for perforation guns |
US20180117797A1 (en) * | 2016-10-13 | 2018-05-03 | Purdue Research Foundation | Methods of making hydrophobic contoured surfaces and hydrophobic contoured surfaces and devices made therefrom |
US20210114261A1 (en) * | 2016-10-13 | 2021-04-22 | Purdue Research Foundation | Methods of making hydrophobic contoured surfaces and hydrophobic contoured surfaces and devices made therefrom |
US11000975B2 (en) * | 2016-10-13 | 2021-05-11 | Purdue Research Foundation | Methods of making hydrophobic contoured surfaces and hydrophobic contoured surfaces and devices made therefrom |
KR20200035140A (en) * | 2017-09-28 | 2020-04-01 | 가부시키가이샤 코쿠사이 엘렉트릭 | Method for manufacturing semiconductor device, substrate processing device and recording medium |
KR102452913B1 (en) | 2017-09-28 | 2022-10-11 | 가부시키가이샤 코쿠사이 엘렉트릭 | Semiconductor device manufacturing method, substrate processing apparatus and recording medium |
US11664275B2 (en) * | 2017-09-28 | 2023-05-30 | Kokusai Electric Corporation | Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium |
Also Published As
Publication number | Publication date |
---|---|
TW201102189A (en) | 2011-01-16 |
TWI473726B (en) | 2015-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20110011148A1 (en) | Method for forming patterned modified metal layer | |
EP1290497B1 (en) | Method for the production of a template and the template thus produced | |
US6261938B1 (en) | Fabrication of sub-micron etch-resistant metal/semiconductor structures using resistless electron beam lithography | |
EP1246011A3 (en) | Method of producing a pattern and photomask used in the same | |
TW201502710A (en) | Nano imprinting with reusable polymer template with metallic or oxide coating | |
CN113039486A (en) | Hard mask manufacturing method capable of being used in next generation photoetching | |
KR20050075580A (en) | Fabricating method of larger area stamp with nano imprint lithography | |
JP2008137387A (en) | Soft template with alignment mark | |
TW201123513A (en) | Method for preparing patterned metal oxide layer or patterned metal layer by using solution type precursor or sol-gel precursor | |
TW201513183A (en) | Method for making metal grating | |
JP2019028462A (en) | Pellicle for photomask, reticle including the same, and method of manufacturing pellicle for photomask | |
JP2005133166A (en) | Stamper for pattern transfer, and its production method | |
KR100714218B1 (en) | Micro patterning by decal transfer using elastomer | |
TW201024075A (en) | Double sidewall angle nano-imprint template | |
KR100542464B1 (en) | Fabrication method of extreme ultraviolet radiation mask mirror using atomic force microscope lithography | |
KR20070110208A (en) | Nano imprint blankmask, nano imprint stamp and its manufacturing method | |
KR101563874B1 (en) | Blank Stamp and the Stamp used for Nano Imprint Lithography | |
JP2004013042A (en) | Method for forming thin film pattern | |
KR102222772B1 (en) | Method of Preparing Multi-Component Nanopattern | |
CN110329985B (en) | Diamond surface complex structure and preparation method thereof | |
JP4942131B2 (en) | Stamper and nanostructure transfer method using the same | |
JP2005064289A (en) | Micro-pattern, method for forming the same, method for producing mold for transferring and forming the same, and the mold | |
JP7210370B2 (en) | Glass molding mold manufacturing method | |
JPH0882703A (en) | Production of element having high aspect ratio and fine pattern | |
JP6019967B2 (en) | Pattern formation method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: NATIONAL TSING HUA UNIVERSITY, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, SUN-ZEN;WU, TAI-BOR;CHANG, CHING-WEN;AND OTHERS;REEL/FRAME:023433/0583 Effective date: 20090910 |
|
AS | Assignment |
Owner name: NATIONAL TSING HUA UNIVERSITY, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, SUN-ZEN;WU, TAI-BOR;CHANG, CHING-WEN;AND OTHERS;REEL/FRAME:023434/0527 Effective date: 20090910 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |