US20110006105A1 - Power capacitor - Google Patents
Power capacitor Download PDFInfo
- Publication number
- US20110006105A1 US20110006105A1 US12/834,080 US83408010A US2011006105A1 US 20110006105 A1 US20110006105 A1 US 20110006105A1 US 83408010 A US83408010 A US 83408010A US 2011006105 A1 US2011006105 A1 US 2011006105A1
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- United States
- Prior art keywords
- solder
- equipment according
- shaft
- tip
- equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 239000003990 capacitor Substances 0.000 title claims abstract description 60
- 229910000679 solder Inorganic materials 0.000 claims abstract description 86
- 238000000034 method Methods 0.000 claims abstract description 14
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 5
- 239000010959 steel Substances 0.000 claims abstract description 5
- 230000006835 compression Effects 0.000 claims description 7
- 238000007906 compression Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 description 37
- 239000005030 aluminium foil Substances 0.000 description 16
- 229920006254 polymer film Polymers 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000000725 suspension Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
- H01G9/151—Solid electrolytic capacitors with wound foil electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
Definitions
- the present invention relates to a method for manufacturing a capacitor for temporary storage of electrical energy comprising at least one capacitor element comprising a roll of alternate dielectric films and electrode films, wherein the roll has two first and second end surfaces, facing away from each other, in which said electrode films are connectably exposed. More particularly, the present invention relates to a method for manufacturing power capacitors. The invention also relates to equipment for carrying out such a method.
- a power capacitor is usually composed of a plurality of parallel-connected strings of a number of sub-capacitors, so-called capacitor elements.
- Each string comprises a plurality of series-connected capacitor elements.
- Each capacitor element comprises a number of very thin layers of electrodes of thin aluminium foils separated by films of dielectric material, usually in the form of polymer films wound into a roll which is flattened to be capable of being optimally stacked into a package.
- the package is placed in a capacitor container filled with an electrically insulating liquid.
- the capacitor elements are interconnected in a matrix and are connected to two insulating bushings, whereby the number of series-connected and parallel-connected capacitor elements, respectively, is determined by the capacitance desired in the capacitor.
- a fuse is connected in series with each element.
- the capacitor also comprises special resistors for discharge of residual charges.
- the capacitor elements are arranged such that the aluminium foil of the first electrode at the first end surface of the capacitor element projects outside the edge of the polymer films, whereas at the same first end surface of the capacitor element, the edge of the second adjacent aluminium foil, serving as an opposite electrode, is arranged with its edge inside the edge of the polymer films.
- the aluminium foil of the second electrode is arranged such that, at the second end surface of the capacitor element, it projects outside the edge of the polymer films, whereas the edge of the aluminium foil of the first electrode at the second end surface is arranged with its edge inside the edge of the polymer films.
- the capacitor elements are arranged with leads connected to the respective electrode at the respective end surface.
- the leads in their turn, are connected to fuses, discharge resistors, busbars, or other devices for interconnection of the capacitor elements or for connection to the insulated bushings.
- the leads are connected to the aluminium foils, which constitute electrodes, by soldering.
- a first pre-soldering is required.
- the object of the first pre-soldering is to remove the aluminium oxide that constitutes the surface layer of the aluminium foil, and to create a surface on the capacitor element against which the lead may be soldered with an acceptable soldering result.
- the solder that is used in the pre-soldering consists, for example, of 75% tin and 25% zinc.
- a second pre-soldering is usually carried out.
- a solder cake is created on the first pre-soldering, into which the lead may be soldered.
- the solder used during the second pre-soldering consists, for example, of 50% tin and 50% lead.
- solder tip tends to be coated and oxidized. For this reason, it has not been possible to automate the first pre-soldering but it has been necessary to use a manual method that permits an operator to adapt the soldering to the degree of coating and oxidation of the soldering tip, and, where necessary, to clean the solder tip.
- the manual method also becomes operator-dependent and therefore runs the risk of resulting in a non-uniform quality.
- the object of the invention is to make possible an automated manufacturing method for an automatic first pre-soldering of a capacitor element that entails a uniform quality.
- This object is achieved according to the invention by a method and by equipment for carrying out the method.
- the roll When manufacturing a power capacitor comprising at lest one capacitor element, wherein the capacitor element comprises a roll of alternate dielectric films and electrode films, the roll has first and second end surfaces, facing away from each other, in which said electrode films are connectably exposed.
- a solder tip is heated to a suitable temperature in a pot with a preheated solder and solder adheres to the solder tip by capillary forces. Thereafter, the solder tip applies the solder to at least one of the end surfaces of capacitor elements by causing the solder tip with solder to be brought into contact with said end surface. The contact between the solder tip and the end surface is brought to cease. Thereafter, at least one lead is fixed by soldering to said end surface.
- the object of the invention is achieved by means of equipment for carrying out the method described above, wherein the equipment comprises a solder pot and a solder head that is arranged with a first linear module for movements in the x-direction (horizontally) and a second linear module for movements in the y-direction (vertically).
- the equipment also comprises a press unit for fixing the capacitor elements.
- the solder pot, the solder head, the first and second linear modules and the press unit are arranged on a steel frame.
- solder tip Since the solder tip is immersed into the solder pot until it reaches a temperature suitable for the chosen first pre-soldering process, and the solder tip is simultaneously coated with solder, the solder tip is oxidized to a considerably smaller extent than when applying the prior art. This means that the need of operator interference is reduced and that therefore the first pre-soldering may be automated.
- An automatic first pre-soldering entails lower costs and ensures a uniform quality.
- FIG. 1 is a perspective sketch of a capacitor element with leads fixed by soldering
- FIG. 2 shows equipment for an automated first pre-soldering of capacitor elements
- FIG. 3 shows the shape of the solder head
- FIG. 4 shows an alternative embodiment of the solder head
- FIG. 5 shows alternative embodiments of the solder tip
- FIG. 6 shows the movement of the solder tip along the end surface of the capacitor element.
- FIG. 1 shows how a capacitor element 1 for a capacitor is wound from a first electrically conducting aluminium foil 2 and a second electrically conducting aluminium foil 3 , which constitute the electrodes of the capacitor element.
- the foils are separated by electrically insulating films 4 of a dielectric material, preferably a polymer material.
- the capacitor element 1 comprises very long foils and films, respectively, which are wound into a roll with a flattened cross section.
- the first aluminium foil 2 which constitutes the first electrode, is arranged at the first end surface of the capacitor element such that it projects outside the edge of the polymer films 4 .
- the edge of the adjacent second aluminium foil 3 acting as an opposite electrode, is arranged with its edge inside the edge of the polymer films 4 .
- the first end 5 of the capacitor element is thus in the form of a flattened roll of the aluminium foil 2 only.
- the aluminium foil 3 of the second electrode is arranged such that the second end 6 of the capacitor element consists of a flattened roll of the second aluminium foil 3 only.
- a first lead 7 is connected to the aluminium foil 2 by a first solder 8 .
- a second lead 9 is connected by means of a second solder (not shown) at the second end 6 of the capacitor element.
- FIG. 2 shows equipment 10 for an automatic first pre-soldering of the capacitor element.
- the equipment comprises a welded steel frame 11 on which the various functional components are mounted.
- the functions are controlled by a Programmable Logic Controller (PLC) and the equipment has a control panel from which the equipment is operated.
- PLC Programmable Logic Controller
- the soldering is carried out by a solder head 12 , the detailed design of which is clear from FIG. 3 .
- the movement of the solder head in the x-direction is controlled by a linear module 13 provided with a ball screw.
- the movement of the solder head in the y-direction is controlled by a linear module 14 applied to the linear module 13 and provided with a ball screw.
- the equipment 10 has a press unit 15 that fixes the capacitor elements 1 .
- the press unit 15 comprises a pneumatic cylinder 16 and a ball-mounted press plate 17 .
- a turning unit 18 with a press plate 19 is arranged so as to be able to fix the capacitor elements 1 in three different positions, 0°, 90°, and 180°.
- the ball-mounted press plate 17 is connected to the press plate 19 by a guide plunger 28 .
- the equipment 10 is provided with a solder pot 20 in which the solder required for the pre-soldering is kept liquid.
- the temperature of the solder in the solder pot 20 may be preset in a stepless manner.
- the capacitor elements 1 are loaded manually in the equipment 10 when the press unit 15 is in the “open” position and in the turn position 90°. A capacitor element is brought down between the plates 17 and 19 until the long side of the capacitor element contacts a stop provided on the press plates. Then, the capacitor element is pushed along the press plates until that element is in the correct position for pre-soldering, whereby the end surface breaks a photocell. When the capacitor element is in the right position, it is fixed with the aid of the pneumatic press plate 17 .
- FIG. 3 shows the fundamental design of the solder head 12 .
- a solder tip 21 is fixedly arranged on a shaft 22 by means of an openable joint.
- the solder tip is arranged with an active tip 26 .
- the active tip 26 transfers solder to that end of the capacitor element which is to be coated with solder.
- the shaft 22 is journalled in a bearing housing 23 .
- the bearing housing 23 permits axial movement of the shaft 22 .
- the shaft 22 is connected to a turning device 25 via an insulating shaft 24 .
- the connection between the solder tip 21 , the shaft 22 , the insulating shaft 24 and the turning device 25 is designed such that the rotating movement of the turning device 25 is transmitted to the solder tip 21 .
- the joint between the shaft 22 and the insulating shaft 24 is arranged to permit a relative axial movement, here designated “partially floating suspension”.
- the relative axial movement may be blocked by a device therefor.
- This type of suspension is here designated “fixed suspension”.
- the total weight of the solder tip 21 and the shaft 22 and the friction in the bearing housing 23 will determine the contact pressure between the active tip 26 and that end 5 or 6 of the capacitor element which is to be coated with solder.
- the first pre-soldering will occur at that unambiguous axial level at which the active tip 26 is arranged.
- the shape of the solder head 12 permits the solder tip 21 to be replaced and permits solder tips 21 of various shapes to be used.
- the turning device 25 is arranged so that a rotating movement may be transmitted to the solder tip during the first pre-soldering. The rotating movement may be reversing.
- FIG. 4 shows an alternative embodiment of the solder head.
- a compression spring 27 is arranged between the turning device 25 and the shaft 22 .
- the contact pressure between the active tip 26 and the capacitor element 10 will be determined by the total weight of the solder tip 21 , the shaft 22 and the compression spring 27 and by the friction in the bearing box 23 plus the compression of the compression spring.
- This type of suspension is here designated “floating suspension with compression spring”.
- FIG. 5 shows alternative embodiments of the active tip 26 .
- the active tip 26 is arranged with a rotationally symmetrical cross section.
- the active tip 26 is arranged with a smooth end surface.
- the active tip 26 is arranged with an end surface with circular recesses which, for example, are produced by turning.
- the active tip 26 is arranged with recesses so that a grid-like pattern is formed on the end surface.
- the active tip 26 is arranged with a cup-shaped recess on the end surface.
- the active tip 26 is arranged with a rectangular cross section.
- the shape of the active tip is not limited to these embodiments but a plurality of other embodiments are feasible.
- the dimensions of the active tip, for an optimum first pre-soldering, are adapted to the geometry of the capacitor element 1 .
- the object of the first pre-soldering is to remove the aluminium oxide from the aluminium foil 2 , 3 and hence create a surface against which the leads 7 , 9 may be soldered with an acceptable soldering result.
- the solder that is used for the first pre-soldering consists, for example, of Sn 75%, Zn 25%, but other solders with different compositions are also feasible.
- the solder is preheated in the solder pot to an operating temperature adapted to the current solder and the chosen first pre-soldering process, for example 355° C., but other temperatures in the interval of 300° C. to 400° C. are also feasible.
- the solder tip 21 is immersed into the solder pot 20 to a depth of about 10 mm below the solder level. Levels both larger and smaller than 10 mm are also feasible.
- the solder tip 21 remains immersed into the solder pot 20 until it has reached a temperature in the interval of 300° C. to 400° C., suitable for the chosen first pre-soldering process.
- the active tip 26 is coated with liquid solder by the capillary force.
- the solder head is moved with the aid of the linear modules 13 and 14 to the preselected position for the first pre-soldering.
- the solder tip 21 is lowered to the level that brings the active tip 26 into contact with the end, 5 or 6 , of the capacitor element, whereby the contact pressure is determined by the level and the suspension of the contact head: partially floating, fixed, or floating with spring.
- the solder tip 21 is moved along the first 5 or second 6 end of the capacitor element.
- a proposed movement pattern is illustrated in FIG. 6 .
- the initial contact occurs at a starting point P 1 .
- the solder tip is then moved to a second position P 2 , where it changes is direction of movement and is moved to a third position P 3 .
- the movement pattern thereafter comprises one or more further cycles with movements between the second P 2 and third P 3 positions, whereupon the tip is moved to an end point P 4 , from where the solder tip 21 is lifted from the first 5 or second 6 end of the capacitor element.
- the solder tip 21 Simultaneously with the solder tip 21 being moved according to the movement pattern described above, it is brought to rotate by the turning device 25 .
- the rotational movement is reversing between two end positions, whereby the rotation in each direction is less than one complete turn.
- the first pre-soldering may, of course, be carried out in accordance with other movement diagrams comprising movements in both the x- and y-directions and with or without rotation.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Equipment for carrying out a method for manufacturing a power capacitor including at least one capacitor element. The equipment includes a solder pot. A solder head includes a first linear module for movements in the x-direction (horizontally) and a second linear module for movements in the y-direction (vertically). A press unit fixes the capacitor elements. The solder pot, the solder head, the first and second linear modules and the press unit are arranged on a steel frame.
Description
- This application is a divisional application of co-pending U.S. patent application Ser. No. 10/539,276 filed Jan. 30, 2006, which is the national phase under 35 U.S.C. §371 of PCT/SE2003/001970 filed 16 Dec. 2003 and which claims priority to Swedish patent application 0203748-9 filed 17 Dec. 2002.
- The present invention relates to a method for manufacturing a capacitor for temporary storage of electrical energy comprising at least one capacitor element comprising a roll of alternate dielectric films and electrode films, wherein the roll has two first and second end surfaces, facing away from each other, in which said electrode films are connectably exposed. More particularly, the present invention relates to a method for manufacturing power capacitors. The invention also relates to equipment for carrying out such a method.
- A power capacitor is usually composed of a plurality of parallel-connected strings of a number of sub-capacitors, so-called capacitor elements. Each string comprises a plurality of series-connected capacitor elements. Each capacitor element comprises a number of very thin layers of electrodes of thin aluminium foils separated by films of dielectric material, usually in the form of polymer films wound into a roll which is flattened to be capable of being optimally stacked into a package. The package is placed in a capacitor container filled with an electrically insulating liquid. The capacitor elements are interconnected in a matrix and are connected to two insulating bushings, whereby the number of series-connected and parallel-connected capacitor elements, respectively, is determined by the capacitance desired in the capacitor. Usually, also a fuse is connected in series with each element. In addition to elements and fuses, the capacitor also comprises special resistors for discharge of residual charges.
- In certain commercially available capacitors, the capacitor elements are arranged such that the aluminium foil of the first electrode at the first end surface of the capacitor element projects outside the edge of the polymer films, whereas at the same first end surface of the capacitor element, the edge of the second adjacent aluminium foil, serving as an opposite electrode, is arranged with its edge inside the edge of the polymer films. In a corresponding way, the aluminium foil of the second electrode is arranged such that, at the second end surface of the capacitor element, it projects outside the edge of the polymer films, whereas the edge of the aluminium foil of the first electrode at the second end surface is arranged with its edge inside the edge of the polymer films.
- The capacitor elements are arranged with leads connected to the respective electrode at the respective end surface. The leads, in their turn, are connected to fuses, discharge resistors, busbars, or other devices for interconnection of the capacitor elements or for connection to the insulated bushings.
- Usually, the leads are connected to the aluminium foils, which constitute electrodes, by soldering. To make possible this soldering, a first pre-soldering is required. The object of the first pre-soldering is to remove the aluminium oxide that constitutes the surface layer of the aluminium foil, and to create a surface on the capacitor element against which the lead may be soldered with an acceptable soldering result. The solder that is used in the pre-soldering consists, for example, of 75% tin and 25% zinc.
- After the first pre-soldering, a second pre-soldering is usually carried out. During the second pre-soldering, a solder cake is created on the first pre-soldering, into which the lead may be soldered. The solder used during the second pre-soldering consists, for example, of 50% tin and 50% lead.
- In known methods for supplying solder, for example in the form of pellets or wire, for the above-described first pre-soldering, the solder tip tends to be coated and oxidized. For this reason, it has not been possible to automate the first pre-soldering but it has been necessary to use a manual method that permits an operator to adapt the soldering to the degree of coating and oxidation of the soldering tip, and, where necessary, to clean the solder tip. The manual method also becomes operator-dependent and therefore runs the risk of resulting in a non-uniform quality.
- The object of the invention is to make possible an automated manufacturing method for an automatic first pre-soldering of a capacitor element that entails a uniform quality.
- This object is achieved according to the invention by a method and by equipment for carrying out the method.
- When manufacturing a power capacitor comprising at lest one capacitor element, wherein the capacitor element comprises a roll of alternate dielectric films and electrode films, the roll has first and second end surfaces, facing away from each other, in which said electrode films are connectably exposed. A solder tip is heated to a suitable temperature in a pot with a preheated solder and solder adheres to the solder tip by capillary forces. Thereafter, the solder tip applies the solder to at least one of the end surfaces of capacitor elements by causing the solder tip with solder to be brought into contact with said end surface. The contact between the solder tip and the end surface is brought to cease. Thereafter, at least one lead is fixed by soldering to said end surface.
- The object of the invention is achieved by means of equipment for carrying out the method described above, wherein the equipment comprises a solder pot and a solder head that is arranged with a first linear module for movements in the x-direction (horizontally) and a second linear module for movements in the y-direction (vertically). The equipment also comprises a press unit for fixing the capacitor elements. The solder pot, the solder head, the first and second linear modules and the press unit are arranged on a steel frame.
- Since the solder tip is immersed into the solder pot until it reaches a temperature suitable for the chosen first pre-soldering process, and the solder tip is simultaneously coated with solder, the solder tip is oxidized to a considerably smaller extent than when applying the prior art. This means that the need of operator interference is reduced and that therefore the first pre-soldering may be automated. An automatic first pre-soldering entails lower costs and ensures a uniform quality.
- The invention will be described in greater detail in the following with reference to the accompanying drawings, wherein
-
FIG. 1 is a perspective sketch of a capacitor element with leads fixed by soldering, -
FIG. 2 shows equipment for an automated first pre-soldering of capacitor elements, -
FIG. 3 shows the shape of the solder head, -
FIG. 4 shows an alternative embodiment of the solder head, -
FIG. 5 shows alternative embodiments of the solder tip, and -
FIG. 6 shows the movement of the solder tip along the end surface of the capacitor element. -
FIG. 1 shows how acapacitor element 1 for a capacitor is wound from a first electrically conductingaluminium foil 2 and a second electrically conductingaluminium foil 3, which constitute the electrodes of the capacitor element. The foils are separated by electrically insulating films 4 of a dielectric material, preferably a polymer material. Thecapacitor element 1 comprises very long foils and films, respectively, which are wound into a roll with a flattened cross section. Thefirst aluminium foil 2, which constitutes the first electrode, is arranged at the first end surface of the capacitor element such that it projects outside the edge of the polymer films 4. At the same first end surface of the capacitor element, the edge of the adjacentsecond aluminium foil 3, acting as an opposite electrode, is arranged with its edge inside the edge of the polymer films 4. Thefirst end 5 of the capacitor element is thus in the form of a flattened roll of thealuminium foil 2 only. In a corresponding way, thealuminium foil 3 of the second electrode is arranged such that the second end 6 of the capacitor element consists of a flattened roll of thesecond aluminium foil 3 only. At thefirst end 5 of the capacitor element, a first lead 7 is connected to thealuminium foil 2 by afirst solder 8. In a corresponding way, a second lead 9 is connected by means of a second solder (not shown) at the second end 6 of the capacitor element. -
FIG. 2 showsequipment 10 for an automatic first pre-soldering of the capacitor element. The equipment comprises awelded steel frame 11 on which the various functional components are mounted. The functions are controlled by a Programmable Logic Controller (PLC) and the equipment has a control panel from which the equipment is operated. The soldering is carried out by asolder head 12, the detailed design of which is clear fromFIG. 3 . The movement of the solder head in the x-direction is controlled by alinear module 13 provided with a ball screw. The movement of the solder head in the y-direction is controlled by alinear module 14 applied to thelinear module 13 and provided with a ball screw. Theequipment 10 has apress unit 15 that fixes thecapacitor elements 1. Thepress unit 15 comprises apneumatic cylinder 16 and a ball-mountedpress plate 17. A turningunit 18 with apress plate 19 is arranged so as to be able to fix thecapacitor elements 1 in three different positions, 0°, 90°, and 180°. The ball-mountedpress plate 17 is connected to thepress plate 19 by aguide plunger 28. Theequipment 10 is provided with asolder pot 20 in which the solder required for the pre-soldering is kept liquid. The temperature of the solder in thesolder pot 20 may be preset in a stepless manner. - The
capacitor elements 1 are loaded manually in theequipment 10 when thepress unit 15 is in the “open” position and in the turn position 90°. A capacitor element is brought down between theplates pneumatic press plate 17. -
FIG. 3 shows the fundamental design of thesolder head 12. Asolder tip 21 is fixedly arranged on ashaft 22 by means of an openable joint. The solder tip is arranged with anactive tip 26. During the first pre-soldering, theactive tip 26 transfers solder to that end of the capacitor element which is to be coated with solder. Theshaft 22 is journalled in a bearinghousing 23. The bearinghousing 23 permits axial movement of theshaft 22. Theshaft 22 is connected to aturning device 25 via an insulatingshaft 24. The connection between thesolder tip 21, theshaft 22, the insulatingshaft 24 and theturning device 25 is designed such that the rotating movement of theturning device 25 is transmitted to thesolder tip 21. The joint between theshaft 22 and the insulatingshaft 24 is arranged to permit a relative axial movement, here designated “partially floating suspension”. The relative axial movement may be blocked by a device therefor. This type of suspension is here designated “fixed suspension”. When a relative axial movement is allowed, the total weight of thesolder tip 21 and theshaft 22 and the friction in the bearinghousing 23 will determine the contact pressure between theactive tip 26 and thatend 5 or 6 of the capacitor element which is to be coated with solder. When a relative movement is not possible, the first pre-soldering will occur at that unambiguous axial level at which theactive tip 26 is arranged. The shape of thesolder head 12 permits thesolder tip 21 to be replaced and permits soldertips 21 of various shapes to be used. The turningdevice 25 is arranged so that a rotating movement may be transmitted to the solder tip during the first pre-soldering. The rotating movement may be reversing. -
FIG. 4 shows an alternative embodiment of the solder head. In this embodiment, acompression spring 27 is arranged between the turningdevice 25 and theshaft 22. When the relative axial movement is not blocked, the contact pressure between theactive tip 26 and thecapacitor element 10 will be determined by the total weight of thesolder tip 21, theshaft 22 and thecompression spring 27 and by the friction in thebearing box 23 plus the compression of the compression spring. This type of suspension is here designated “floating suspension with compression spring”. - The device described above may be modified and varied in different ways within the scope of the basic concept of the invention.
-
FIG. 5 shows alternative embodiments of theactive tip 26. InFIGS. 5 a-d, theactive tip 26 is arranged with a rotationally symmetrical cross section. InFIG. 5 a, theactive tip 26 is arranged with a smooth end surface. InFIG. 5 b, theactive tip 26 is arranged with an end surface with circular recesses which, for example, are produced by turning. InFIG. 5 c, theactive tip 26 is arranged with recesses so that a grid-like pattern is formed on the end surface. InFIG. 5 d, theactive tip 26 is arranged with a cup-shaped recess on the end surface. InFIG. 5 e, theactive tip 26 is arranged with a rectangular cross section. The shape of the active tip is not limited to these embodiments but a plurality of other embodiments are feasible. The dimensions of the active tip, for an optimum first pre-soldering, are adapted to the geometry of thecapacitor element 1. - The object of the first pre-soldering is to remove the aluminium oxide from the
aluminium foil Zn 25%, but other solders with different compositions are also feasible. The solder is preheated in the solder pot to an operating temperature adapted to the current solder and the chosen first pre-soldering process, for example 355° C., but other temperatures in the interval of 300° C. to 400° C. are also feasible. - The
solder tip 21 is immersed into thesolder pot 20 to a depth of about 10 mm below the solder level. Levels both larger and smaller than 10 mm are also feasible. Thesolder tip 21 remains immersed into thesolder pot 20 until it has reached a temperature in the interval of 300° C. to 400° C., suitable for the chosen first pre-soldering process. Simultaneously with thesolder tip 21 being preheated, theactive tip 26 is coated with liquid solder by the capillary force. - After the
solder tip 21 has been preheated to the preselected temperature and theactive trip 26 has been coated with solder, the solder head is moved with the aid of thelinear modules solder tip 21 is lowered to the level that brings theactive tip 26 into contact with the end, 5 or 6, of the capacitor element, whereby the contact pressure is determined by the level and the suspension of the contact head: partially floating, fixed, or floating with spring. - After contact has been established, the
solder tip 21 is moved along the first 5 or second 6 end of the capacitor element. A proposed movement pattern is illustrated inFIG. 6 . The initial contact occurs at a starting point P1. The solder tip is then moved to a second position P2, where it changes is direction of movement and is moved to a third position P3. The movement pattern thereafter comprises one or more further cycles with movements between the second P2 and third P3 positions, whereupon the tip is moved to an end point P4, from where thesolder tip 21 is lifted from the first 5 or second 6 end of the capacitor element. - Simultaneously with the
solder tip 21 being moved according to the movement pattern described above, it is brought to rotate by the turningdevice 25. The rotational movement is reversing between two end positions, whereby the rotation in each direction is less than one complete turn. - In addition to the movement pattern described above in combination with the rotational movement, the first pre-soldering may, of course, be carried out in accordance with other movement diagrams comprising movements in both the x- and y-directions and with or without rotation.
Claims (14)
1-14. (canceled)
15. Equipment for carrying out the method according to claim 1, the equipment comprising:
a solder pot,
a solder head, comprising a first linear module for movements in the x-direction (horizontally) and a second linear module for movements in the y-direction (vertically),
a press unit for fixing the capacitor elements, and
a steel frame on which the solder pot, the solder head, the first and second linear modules and the press unit are arranged on a steel frame.
16. The equipment according to claim 15 , wherein the solder head comprises a solder tip including an active tip, said solder tip being arranged on a shaft and a turning device, whereby the shaft is connected to the turning device with an insulating shaft and whereby the shaft is journaIled in a bearing housing.
17. The equipment according to claim 16 , wherein the shaft and the insulating shaft are arranged so that a guide pin prevents relative axial movement.
18. The equipment according to claim 16 , wherein the shaft and the insulating shaft are arranged so that a guide pin, running in an axial slit, makes possible a relative axial movement.
19. The equipment according to claim 18 , wherein a compression spring is arranged between the shaft and the turning device, whereby the compression spring counteracts the shaft being moved in a direction towards the turning device.
20. The equipment according to claim 16 , wherein the turning device is arranged so that a rotating movement is transmitted to the solder tip.
21. The equipment according to claim 16 , wherein the active tip is arranged with a rotationally symmetrical cross section.
22. The equipment according to claim 21 , wherein the active tip is arranged with a smooth end surface.
23. The equipment according to claim 21 , wherein the active tip is arranged with an end surface with turned circular recesses.
24. The equipment according to claim 21 , wherein the active tip is arranged with recesses so as to form a grid-like pattern on the end surface.
25. The equipment according to claim 21 , wherein the active tip is arranged with a cupped end surface.
26. The equipment according to claim 16 , wherein the active tip is arranged with a rectangular cross section.
27. The equipment according to claim 15 , wherein the equipment comprises a programmable logic controller and a control panel for controlling the solder pot, the solder head, the first and second linear modules, and the press unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/834,080 US20110006105A1 (en) | 2002-12-17 | 2010-07-12 | Power capacitor |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0203748-9 | 2002-12-17 | ||
SE0203748A SE524422C2 (en) | 2002-12-17 | 2002-12-17 | Method and equipment for connecting conductors to a capacitor element |
PCT/SE2003/001970 WO2004055842A1 (en) | 2002-12-17 | 2003-12-16 | Power capacitor |
US10/539,276 US7780066B2 (en) | 2002-12-17 | 2003-12-16 | Power capacitor |
US12/834,080 US20110006105A1 (en) | 2002-12-17 | 2010-07-12 | Power capacitor |
Related Parent Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SE2003/001970 Division WO2004055842A1 (en) | 2002-12-17 | 2003-12-16 | Power capacitor |
US11/539,276 Division US7473543B2 (en) | 2004-06-22 | 2006-10-06 | Thrombin compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110006105A1 true US20110006105A1 (en) | 2011-01-13 |
Family
ID=20289901
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/539,276 Active 2026-01-29 US7780066B2 (en) | 2002-12-17 | 2003-12-16 | Power capacitor |
US12/834,080 Abandoned US20110006105A1 (en) | 2002-12-17 | 2010-07-12 | Power capacitor |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/539,276 Active 2026-01-29 US7780066B2 (en) | 2002-12-17 | 2003-12-16 | Power capacitor |
Country Status (8)
Country | Link |
---|---|
US (2) | US7780066B2 (en) |
EP (1) | EP1573756B1 (en) |
CN (1) | CN1726567B (en) |
AU (1) | AU2003287143B2 (en) |
CA (1) | CA2510684A1 (en) |
ES (1) | ES2399235T3 (en) |
SE (1) | SE524422C2 (en) |
WO (1) | WO2004055842A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104002049A (en) * | 2013-12-19 | 2014-08-27 | 宁波南车新能源科技有限公司 | Supercapacitor current guide terminal cell welding device and method |
CN113953619A (en) * | 2021-09-27 | 2022-01-21 | 泗阳群鑫电子有限公司 | Capacitor tin immersion equipment and tin immersion process thereof |
US11642495B2 (en) | 2016-05-16 | 2023-05-09 | Gyrus Acmi, Inc. | Flexible and/or pushable tubular device |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102284799B (en) * | 2010-06-17 | 2013-09-25 | 大亚科技股份有限公司 | Double-zero aluminum foil connector welding method |
CN105499738B (en) * | 2016-01-21 | 2017-12-29 | 深圳市科美达自动化设备有限公司 | The tin-soldering method of carbon brush motor rotor commutator pin |
CN107731573B (en) * | 2017-10-29 | 2020-08-14 | 西安空间无线电技术研究所 | Pulse energy storage capacitor packaging method and packaging structure |
CN107900579B (en) * | 2017-11-01 | 2019-08-20 | 唐山龙泉机械有限公司 | Lead bonding device is used in a kind of processing of capacitor |
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- 2003-12-16 WO PCT/SE2003/001970 patent/WO2004055842A1/en not_active Application Discontinuation
- 2003-12-16 CA CA002510684A patent/CA2510684A1/en not_active Abandoned
- 2003-12-16 AU AU2003287143A patent/AU2003287143B2/en not_active Ceased
- 2003-12-16 US US10/539,276 patent/US7780066B2/en active Active
- 2003-12-16 CN CN200380106360XA patent/CN1726567B/en not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
---|---|
WO2004055842A8 (en) | 2004-10-21 |
CA2510684A1 (en) | 2004-07-01 |
EP1573756B1 (en) | 2012-11-28 |
EP1573756A1 (en) | 2005-09-14 |
CN1726567A (en) | 2006-01-25 |
CN1726567B (en) | 2010-06-16 |
SE0203748D0 (en) | 2002-12-18 |
AU2003287143A1 (en) | 2004-07-09 |
AU2003287143B2 (en) | 2009-09-24 |
US7780066B2 (en) | 2010-08-24 |
US20060126262A1 (en) | 2006-06-15 |
SE524422C2 (en) | 2004-08-10 |
ES2399235T3 (en) | 2013-03-26 |
SE0203748L (en) | 2004-06-18 |
WO2004055842A1 (en) | 2004-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |
|
AS | Assignment |
Owner name: ABB POWER GRIDS SWITZERLAND AG, SWITZERLAND Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ABB SCHWEIZ AG;REEL/FRAME:052916/0001 Effective date: 20191025 |