CN107731573B - Pulse energy storage capacitor packaging method and packaging structure - Google Patents
Pulse energy storage capacitor packaging method and packaging structure Download PDFInfo
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- CN107731573B CN107731573B CN201711028702.0A CN201711028702A CN107731573B CN 107731573 B CN107731573 B CN 107731573B CN 201711028702 A CN201711028702 A CN 201711028702A CN 107731573 B CN107731573 B CN 107731573B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
Abstract
The invention provides a pulse energy storage capacitor packaging method and a pulse energy storage capacitor packaging structure, and belongs to the technical field of energy storage capacitors. The method comprises the following steps: stacking a plurality of pulse energy storage capacitors together and fixing the pulse energy storage capacitors in parallel through a lead to form a pulse energy storage capacitor group; arranging at least one positive terminal lead and at least one negative terminal lead for the capacitor bank; and encapsulating the pulse energy storage capacitor group in the encapsulation shell through encapsulation glue solution to enable the positive terminal lead and the negative terminal lead to leak out of the encapsulation shell. Through putting a yard single pulse energy storage electric capacity, encapsulate a plurality of pulse energy storage electric capacities after putting a yard to just, negative pole lead wire through outer hourglass is connected with other parts, fixes the encapsulation casing through the mounting, has both realized pulse energy storage electric capacity's three-dimensional spatial arrangement, has improved space utilization, has simplified the fixed mounting mode of electric capacity again, makes pulse energy storage electric capacity hardly atress, has improved amplifier work's fail safe nature greatly.
Description
Technical Field
The invention relates to a secondary packaging method and a secondary packaging structure of a pulse energy storage capacitor for a space, and belongs to the technical field of energy storage capacitors.
Background
The pulse traveling wave tube amplifier has the advantages of high efficiency, light weight, low cost and the like, is widely applied to radar satellites, and has the main functions of amplifying pulse power of downlink signals of a user link, adjusting the amplitude and phase of a radio frequency channel and sending the signals to a post-stage antenna subsystem. In order to realize the normal work of a radio frequency link in a pulse traveling wave tube amplifier, the traveling wave tube power supply has stable output required by the changing power and reaches hundreds of watts, and the power supply needs to adopt an electronic power regulator (EPC) to carry out voltage reduction and conversion on a primary bus of a satellite so as to meet the voltage and current requirements required by the radio frequency link. In order to convert the satellite bus voltage into the voltage required by the radio frequency link, the circuit design is usually utilized to pre-stabilize the voltage by using an energy storage capacitor, and the energy storage capacitor mainly serves as energy storage in the power conversion topology, keeps continuous current in the charging and discharging processes of an inductor and filters pulse power current.
In space application, due to the limitation of selectable devices of the energy storage capacitor, in the application of a satellite platform with primary bus voltage of 25V, 10 non-solid electrolyte full-tantalum capacitors with models of CAK38-125V-82uF-K are combined to form the energy storage capacitor for use. As shown in fig. 1, since the all-tantalum capacitor can only be directly mounted on the printed circuit board, the all-tantalum capacitor needs to be bent and shaped during mounting, and is manually welded and fixed on the surface of the PCB by using a soldering iron, the fixing difficulty is high, when the circuit needs to handle hundreds of watts of power, more tantalum electrolytic capacitors need to be combined, the design and mounting of the printed circuit board can not meet the requirement of satellite space miniaturization, and the application range of the capacitor is restricted.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a pulse energy storage capacitor packaging method and a packaging structure, wherein a single pulse energy storage capacitor is stacked, a plurality of stacked pulse energy storage capacitors are packaged and connected with other parts through outer-leakage positive and negative leads, and a packaging shell is fixed through a fixing piece, so that three-dimensional spatial arrangement of the pulse energy storage capacitors is realized, the space utilization rate is improved, the fixed mounting mode of the capacitors is simplified, the pulse energy storage capacitors are hardly stressed, and the safety and reliability of amplifier work are greatly improved.
The invention comprises the following technical scheme:
a pulse energy storage capacitor packaging method comprises the following steps:
and 3, encapsulating the pulse energy storage capacitor group in an encapsulation shell through encapsulation glue solution to enable the positive terminal lead and the negative terminal lead to be leaked outside the encapsulation shell.
In an alternative embodiment, the stacking a plurality of pulse storage capacitors together in step 1 includes: and stacking the pulse energy storage capacitors together in a manner that the pin at the positive end is positioned at the same side and the pin at the negative end is positioned at the other side.
In an optional embodiment, before the stacking the plurality of pulse storage capacitors together in step 1, the method further includes:
and trimming the pins of the pulse energy storage capacitor to enable the length of the trimmed pins to be 2-4 mm.
In an optional embodiment, after stacking a plurality of pulse energy storage capacitors together in step 1, at least two layers and two columns of structures are formed, and the pulse energy storage capacitors are fixed in parallel by a conducting wire, including:
the homopolar pins of the pulse energy storage capacitors in the same layer in each row are fixed in series through wires, and the homopolar pins of the two corresponding pulse energy storage capacitors in the two adjacent layers in each row are fixed in series through wires.
In an optional embodiment, the package housing is a housing structure with an opening on an upper surface, and the step 3 of packaging the pulse energy storage capacitor bank in the package housing through potting adhesive includes:
arranging a 1-2mm encapsulating layer at the bottom of an encapsulating shell by using encapsulating glue, and placing the pulse energy storage capacitor bank on the encapsulating layer in the encapsulating shell to ensure that the distance between the pulse energy storage capacitor bank and the inner side surface of the encapsulating shell is not less than 1.5mm, thereby obtaining a structure to be encapsulated;
and preheating the structure to be encapsulated, then injecting the encapsulating glue solution, and curing so as to encapsulate the pulse energy storage capacitor group in the encapsulating shell.
In an alternative embodiment, the preheating of step 3 includes:
and (3) preserving the heat of the structure to be encapsulated for 4-5h at the temperature of 60-70 ℃, then preserving the heat for 6-7h at the temperature of 80-90 ℃, and then cooling to 70-80 ℃ and preserving the heat for 7.5-8.5 h.
And 3, pouring the encapsulating glue solution and curing, wherein the pouring and curing process comprises the following steps:
keeping the structure to be encapsulated for 1-1.5 hours at the temperature of 70-75 ℃ under the pressure of 100-130 Pa, and then injecting the encapsulating glue solution into the encapsulating shell until the liquid level of the glue solution is flush with the opening end face of the encapsulating shell, and keeping the temperature and the pressure for at least 10 min; and then, recovering to normal pressure, heating to 100-105 ℃, keeping for 5-6 h, heating to 120-125 ℃, and keeping for 28-32 h for curing.
In an optional embodiment, the preparation method of the potting adhesive comprises the following steps:
mixing the preheated formula resin A and the preheated formula resin B according to the mass ratio of 2-3:1 under the air pressure of 190-240 Pa;
then returning to normal pressure, adding the dried superfine silica powder according to the mass ratio of the superfine silica powder to the formula resin A to the formula resin B of 0.5-1.5:2-3:1, vacuumizing again to 190-240 Pa, and carrying out vacuum mixing and degassing for 2-3 h to obtain an encapsulating glue solution;
the formula resin A is prepared from 128 epoxy resin and bisphenol A epoxy resin according to a mass ratio of 1: 1.5-2, and degassing, wherein the formula resin B is prepared from phthalic anhydride, polyazelaic anhydride and liquid carboxyl nitrile rubber according to the mass ratio of 12-17: 8-10: 1, and degassing.
In an alternative embodiment, the method for preheating the formula resin A and the formula resin B comprises the following steps:
and (3) preserving the heat of the formula resin A at 70-75 ℃ for 1-1.5 h, and preserving the heat of the formula resin B at 50-55 ℃ for 1-1.5 h.
The lead is a silver-plated copper wire with the diameter of 0.5-0.9 mm.
The pulse energy storage capacitor packaging structure manufactured by the packaging method.
Compared with the prior art, the invention has the following advantages:
(1) according to the pulse energy storage capacitor packaging method provided by the embodiment of the invention, the single pulse energy storage capacitor is stacked, the stacked pulse energy storage capacitors are packaged, the pulse energy storage capacitors are connected with other parts through the leaked positive and negative leads, and the packaging shell is fixed through the fixing piece, so that the three-dimensional spatial arrangement of the pulse energy storage capacitors is realized, the space utilization rate is improved, the fixed mounting mode of the capacitors is simplified, the pulse energy storage capacitors are hardly stressed, and the safety and reliability of the working of an amplifier are greatly improved;
(2) when the distance between the pulse energy storage capacitor group and the inner side surface of the packaging shell is 1.5mm, the volume of the packaging structure is minimized, and meanwhile, each capacitor can be stably fixed in the packaging shell for a long time, so that the use requirement of the space complex environment is met;
(3) preheating the structure to be encapsulated according to the preheating temperature gradient provided by the invention can effectively protect the expansion change rate between the tantalum capacitor bank and each structure, ensure that the performance of the tantalum capacitor bank is not changed in the encapsulating process, and wait for encapsulating after preheating is finished;
(4) after the glue solution is poured, the pouring glue solution can be fully infiltrated by keeping the pouring glue solution for at least 10 minutes under the vacuum condition, and the curing temperature curve provided by the invention can effectively relieve the internal stress generated in the curing process and ensure that the device is not damaged by the internal stress;
(5) the pouring sealant used in the embodiment of the invention has excellent mechanical property, good heat dissipation, no heat accumulation and low density, so that the product quality requirement is high, and the space requirement is met;
(6) the full tantalum capacitor packaging structure provided by the embodiment can ensure the capacity of processing a power output power supply of hundreds of watts by the full tantalum capacitor on the premise of meeting the requirements of miniaturization and high reliability of aerospace products.
Drawings
FIG. 1 is a schematic diagram of a conventional pulse energy storage capacitor mounting structure;
fig. 2 is a flowchart of a method for packaging a pulse energy storage capacitor according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a single all-tantalum capacitor trimming pin according to an embodiment of the present invention;
fig. 4 is a schematic side view of a pulse energy storage capacitor bank according to an embodiment of the present invention;
fig. 5 is a schematic side view of another pulse energy storage capacitor bank structure according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a pulse energy storage capacitor package structure according to an embodiment of the present invention;
fig. 7a is a side cross-sectional view of a potting housing provided in an embodiment of the invention;
fig. 7b is a top view of a potting housing according to an embodiment of the present invention.
Detailed Description
The invention will now be further described with reference to the accompanying drawings.
Referring to fig. 2, an embodiment of the present invention provides a pulse energy storage capacitor packaging method, including the following steps:
specifically, in the embodiment of the invention, the pulse energy storage capacitor is preferably a cylindrical all-tantalum capacitor (as shown in fig. 3) in which the positive terminal pin and the negative terminal pin are respectively located at two ends of the capacitor body, and particularly is a CAK38-125V-82uF-K non-solid electrolyte all-tantalum capacitor;
the stacking mode of the pulse energy storage capacitors can be staggered stacking of two adjacent layers of pulse energy storage capacitors (as shown in fig. 4), or stacking of each layer of pulse energy storage capacitors in a one-to-one correspondence manner (as shown in fig. 5), and the specific stacking mode can be determined according to the use requirement, which is not limited in the invention;
specifically, when the pulse energy storage capacitors are stacked into a row and multiple layers, the pins at the positive ends of the pulse energy storage capacitors can be fixed in series through the same wire, and the pins at the negative ends of the pulse energy storage capacitors can be fixed in series through the other wire, so that the pulse energy storage capacitors are fixed in parallel; when the pulse energy storage capacitors are stacked into a plurality of layers and a plurality of columns, as shown in fig. 5, preferably, homopolar pins of the pulse energy storage capacitors in the same layer in each column are fixed in series through a conducting wire, and homopolar pins of two corresponding pulse energy storage capacitors in two adjacent layers in each column are fixed in series through a conducting wire, so that the stability of capacitor connection is ensured, and current distribution is more uniform; and adjacent pins of the two adjacent columns of pulse energy storage capacitors share one wire. In the embodiment of the invention, the pins and the lead are fixed preferably in a welding mode, so that the welding is convenient and the installation space is further saved, in the embodiment of the invention, a plurality of pulse energy storage capacitors are stacked together in a mode that the pins at the positive end are positioned at the same side and the pins at the negative end are positioned at the other side, and the pins of the pulse energy storage capacitors are trimmed between the pins and the lead for fixing, so that the length of the trimmed pins is 2-4 mm;
specifically, in the embodiment of the present invention, the positive terminal lead is connected to the positive terminal lead, the negative terminal lead is connected to the negative terminal lead, and the number of leads can be determined according to the use requirement;
and 3, encapsulating the pulse energy storage capacitor group in an encapsulation shell through encapsulation glue solution to enable the positive terminal lead and the negative terminal lead to be leaked outside the encapsulation shell.
Specifically, in the embodiment of the invention, the packaging shell is provided with a threaded hole for fixing the packaging shell by adopting connecting pieces such as screws, bolts and the like; in other embodiments, the package housing may further be provided with a mortise and tenon structure, a clamping structure, and the like, and is connected with other components in a mortise and tenon, clamping, and the like, which is not limited in the present invention;
according to the pulse energy storage capacitor packaging method provided by the embodiment of the invention, the single pulse energy storage capacitor is stacked, the stacked pulse energy storage capacitors are packaged, the pulse energy storage capacitors are connected with other parts through the leaked positive and negative leads, and the packaging shell is fixed through the fixing piece, so that the three-dimensional spatial arrangement of the pulse energy storage capacitors is realized, the space utilization rate is improved, the fixed mounting mode of the capacitors is simplified, the pulse energy storage capacitors are hardly stressed, and the safety and reliability of the working of the amplifier are greatly improved.
As shown in fig. 6, the package housing is a housing structure with an opening on the upper surface, and the step 3 of packaging the pulse energy storage capacitor bank in the package housing through the potting adhesive solution includes:
arranging a 1-2mm encapsulating layer at the bottom of an encapsulating shell by using encapsulating glue, and placing the pulse energy storage capacitor bank on the encapsulating layer in the encapsulating shell to ensure that the clearance between the pulse energy storage capacitor bank and the inner side surface of the encapsulating shell is not less than 1.5mm, thereby obtaining a structure to be encapsulated; when the gap between the pulse energy storage capacitor group and the inner side surface of the packaging shell is 1.5mm, the volume of the encapsulating structure is minimized, and meanwhile, each capacitor can be stably fixed in the packaging shell for a long time, so that the use requirement of the space complex environment is met;
and preheating the structure to be encapsulated, then injecting the encapsulating glue solution, and curing so as to encapsulate the pulse energy storage capacitor group in the encapsulating shell.
Specifically, in the embodiment of the invention, when the structure to be encapsulated is preheated, the component to be encapsulated is subjected to heat preservation for 4-5h at the temperature of 60-70 ℃, then is subjected to heat preservation for 6-7h at the temperature of 80-90 ℃, and then is cooled to the temperature of 70-80 ℃ and is subjected to heat preservation for 7.5-8.5 h; preheating is carried out according to the temperature gradient, so that the expansion change rate between the tantalum capacitor bank and each structure is effectively protected, and the performance of the tantalum capacitor bank is ensured not to change in the encapsulating process.
And 3, pouring the encapsulating glue solution and curing, wherein the pouring and curing process comprises the following steps:
keeping the structure to be encapsulated for 1-1.5 hours at the temperature of 70-75 ℃ under the pressure of 100-130 Pa, and then injecting the encapsulating glue solution into the encapsulating shell until the liquid level of the glue solution is flush with the opening end face of the encapsulating shell, and keeping the temperature and the pressure for at least 10 min; and then, recovering to normal pressure, heating to 100-105 ℃, keeping for 5-6 h, heating to 120-125 ℃, and keeping for 28-32 h for curing.
By keeping the temperature for at least 10 minutes under the vacuum condition, the encapsulation glue solution can be fully infiltrated, and the internal stress generated in the curing process can be effectively relieved by using the curing temperature curve, so that the device is prevented from being damaged by the internal stress.
Specifically, the potting adhesive solution provided by the embodiment of the invention is prepared by the following method:
mixing the preheated formula resin A and the preheated formula resin B according to the mass ratio of 2-3:1 under the air pressure of 190-240 Pa;
then returning to normal pressure, adding the dried superfine silica powder according to the mass ratio of the superfine silica powder to the formula resin A to the formula resin B of 0.5-1.5:2-3:1, vacuumizing again to 190-240 Pa, and carrying out vacuum mixing and degassing for 2-3 h to obtain an encapsulating glue solution;
the formula resin A is prepared from 128 epoxy resin and bisphenol A epoxy resin according to a mass ratio of 1: 1.5-2, and degassing; the formula resin B is prepared from phthalic anhydride, polyazelaic anhydride and liquid carboxyl nitrile rubber according to the mass ratio of 12-17: 8-10: 1, and degassing; the superfine silicon powder is preferably 800-1000 mesh superfine silicon powder.
The encapsulating glue solution prepared by the method has excellent mechanical property, good heat dissipation, no heat accumulation and low density, so that the product quality requirement is high, and the space requirement is met and the weight is light.
In the embodiment of the invention, during preheating, the formula resin A is subjected to heat preservation for 1-1.5 hours at the temperature of 70-75 ℃, and the formula resin B is subjected to heat preservation for 1-1.5 hours at the temperature of 50-55 ℃, so that the two ingredients are mixed more uniformly, and the performance of the encapsulating material is better.
In the embodiment of the invention, the lead is a silver-plated copper wire with the diameter of 0.5-0.9mm, and the silver layer can be continuously and firmly attached to the surface of the copper wire, so that the lead has high corrosion resistance and good conductivity.
The following is a specific embodiment of the present invention:
the tantalum capacitor in the embodiment is a CAK38-125V-82uF-K axial non-solid electrolyte all-tantalum capacitor.
Step 1: taking 16 tantalum capacitors 1, trimming the positive terminal pin and the negative terminal pin of each tantalum capacitor to ensure that the trimmed pin is 3mm long and the welding spot on the positive terminal pin cannot be damaged during trimming;
step 2: as shown in fig. 5 and 6, according to the principle that the same poles are located on the same side, the trimmed 16 tantalum capacitors are stacked into a two-layer two-column structure, in which 8 tantalum capacitors are arranged on each layer, and 8 tantalum capacitors are arranged on each column; welding homopolar pins positioned on the left side in the two-layer two-column structure on a silver-plated copper wire with the diameter of 0.7mm according to the mode shown in figure 5, forming an inverted-mesh-shaped structure by the welded silver-plated copper wire, and welding homopolar pins positioned on the right side on the silver-plated copper wire with the diameter of 0.7mm according to the mode shown in figure 4, forming the inverted-mesh-shaped structure by the welded silver-plated copper wire; similarly, welding 16 middle pins (8 positive terminal pins and 8 negative terminal pins) on the silver-plated copper wire 3 with the diameter of 0.7mm to obtain a tantalum capacitor bank;
as shown in fig. 5, two positive terminal leads and two negative terminal leads are provided for the tantalum capacitor group;
and step 3: preparing encapsulating glue solution:
adding 800-mesh superfine silicon powder into a drying tank, and removing moisture in vacuum for 26 hours under the conditions that the air pressure is 120Pa and the temperature is 110 ℃;
preheating the formula resin A at 70 ℃ for 1 hour to reduce the viscosity of the formula resin A;
keeping the formula resin B at 50 ℃ for 1 hour;
adjusting the vacuum degree of a mixing tank to be 190Pa, pouring the formula resin B into the mixing tank, then pouring the formula resin A into the mixing tank, mixing and stirring for 1 hour according to the mass ratio of the formula resin A to the formula resin B of 2.5: 1;
after the materials are mixed uniformly, the material mixing tank is restored to normal pressure, the feeding port of the material mixing tank is opened, the superfine silicon powder is added according to the mass ratio of the superfine silicon powder to the formula resin A to the formula resin B being 0.1:2.5:1, the material mixing tank is vacuumized to 190Pa again, and vacuum material mixing and degassing are carried out for 2 hours to obtain encapsulating glue solution; the formula resin A is prepared from E-51 and NPEL-128E epoxy resins according to the mass ratio of 1: 1.8, and the formula resin B is prepared by mixing phthalic anhydride, polyazelaic anhydride and liquid carboxyl nitrile rubber according to the mass ratio of 60: 36: 4, mixing and degassing;
loading the prepared encapsulating glue solution on a manipulator of vacuum infusion equipment;
and 4, step 4: encapsulating and curing:
forming a 1.5mm potting layer in the potting shell 2 by using the potting adhesive solution prepared in the step 3, wherein the potting shell 2 is an aluminum alloy shell with an opening at the upper end as shown in fig. 5, the external dimension (length, width and height) is 84 x 35 x 32.5mm, the length and width of the cavity are 82 x 28mm, in order to meet the placing length and width of the tantalum capacitor, the wall thickness of the potting shell 2 is 1mm, and three pairs of M3 x 6 fixing threaded holes 21 (as shown in fig. 7a and 7 b) are formed in the side wall of the potting shell and are used for fixing the potting shell by fixing pieces;
placing the tantalum capacitor bank obtained in the step (2) on a potting layer in a potting shell (2), and adjusting the position of the tantalum capacitor bank to enable the tantalum capacitor bank to have a clearance of more than 1.5mm with each inner side wall of the potting shell (2) so as to obtain a structure to be potted;
putting the structure to be encapsulated into a warm box, heating to 65 ℃ and keeping for 4.5 hours, then continuing heating to 85 ℃ and keeping for 6 hours, and then cooling to 75 ℃ and keeping for 8 hours; preheating is carried out according to the temperature gradient, so that the expansion change rate between the tantalum capacitor bank and each structure is effectively protected, the performance of the tantalum capacitor bank is ensured not to change in the encapsulating process, and the encapsulation is waited after the preheating is finished;
placing the structure to be encapsulated on a bottom layer supporting plate of vacuum infusion equipment, aligning the position to be encapsulated with the position of a manipulator, keeping the position at 100Pa and 70 ℃ for 1h, then infusing the encapsulating glue solution into the encapsulating shell until the liquid level of the glue solution is flush with the opening end face of the encapsulating shell, and keeping the temperature and the pressure for 10 min; and then, the temperature is returned to normal pressure, the temperature is raised to 100 ℃, the temperature is maintained for 5 hours, the temperature is raised to 125 ℃, the temperature is maintained for 32 hours, and the curing is carried out, so that the all-tantalum capacitor packaging structure shown in the figure 6 is obtained.
The full-tantalum capacitor packaging structure provided by the embodiment can ensure the capability of processing a power output power supply with hundreds of watts by the full-tantalum capacitor on the premise of meeting the requirements of miniaturization and high reliability of aerospace products; the energy storage capacitor with the structure is simple and easy to install and high in space utilization rate, and meanwhile, the full-tantalum capacitor inside the encapsulation is hardly stressed, so that the working reliability of the amplifier is greatly improved.
The invention has not been described in detail in part of the common general knowledge of those skilled in the art. The specific embodiments described are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (2)
1. A pulse energy storage capacitor packaging method is characterized by comprising the following steps:
step 1, trimming pins of pulse energy storage capacitors to enable the trimmed pins to be 2-4mm in length, stacking a plurality of pulse energy storage capacitors together to form at least two layers and two columns according to the mode that pins of positive ends are located on the same side and pins of negative ends are located on the other side, wherein the pins of the same poles of the pulse energy storage capacitors in the same layer in each column are welded and fixed in series through conducting wires, the pins of the same poles of two corresponding pulse energy storage capacitors in two adjacent layers in each column are welded and fixed in series through conducting wires, the adjacent pins of two adjacent columns of pulse energy storage capacitors share one conducting wire to form a pulse energy storage capacitor group, the conducting wire is a silver-plated copper wire with the diameter of 0.5-0.9mm, the pulse energy storage capacitors are cylindrical all-tantalum capacitors and are non-solid electrolyte all-tantalum capacitors with the model number of CAK38-125V-82 uF-K;
step 2, arranging at least one positive terminal lead and at least one negative terminal lead for the capacitor bank;
step 3, encapsulating the pulse energy storage capacitor group in an encapsulation shell through encapsulation glue solution to enable the positive terminal lead and the negative terminal lead to be leaked outside the encapsulation shell;
the encapsulation casing is upper surface open-ended shell structure, step 3 will through embedment glue solution pulse energy storage capacitor group encapsulates in the encapsulation casing, include:
arranging a 1-2mm encapsulating layer at the bottom of an encapsulating shell by using encapsulating glue, and placing the pulse energy storage capacitor bank on the encapsulating layer in the encapsulating shell to ensure that the clearance between the pulse energy storage capacitor bank and the inner side surface of the encapsulating shell is not less than 1.5mm, thereby obtaining a structure to be encapsulated;
preheating the structure to be encapsulated, then injecting the encapsulating glue solution, and curing to encapsulate the pulse energy storage capacitor group in the encapsulating shell;
the preheating in step 3 comprises:
preserving heat of the structure to be encapsulated for 4-5h at 60-70 ℃, then preserving heat for 6-7h at 80-90 ℃, and then cooling to 70-80 ℃ and preserving heat for 7.5-8.5 h;
and 3, pouring the encapsulating glue solution and curing, wherein the pouring and curing process comprises the following steps:
keeping the structure to be encapsulated for 1-1.5 hours at the temperature of 70-75 ℃ under the pressure of 100-130 Pa, and then injecting the encapsulating glue solution into the encapsulating shell until the liquid level of the glue solution is flush with the opening end face of the encapsulating shell, and keeping the temperature and the pressure for at least 10 min; then, recovering to normal pressure, heating to 100-105 ℃, keeping for 5-6 hours, heating to 120-125 ℃, keeping for 28-32 hours, and curing;
the preparation method of the encapsulating glue solution comprises the following steps:
mixing the preheated formula resin A and the preheated formula resin B according to the mass ratio of 2-3:1 under the air pressure of 190-240 Pa;
then returning to normal pressure, adding the dried superfine silica powder according to the mass ratio of the superfine silica powder to the formula resin A to the formula resin B of 0.5-1.5:2-3:1, vacuumizing again to 190-240 Pa, and carrying out vacuum mixing and degassing for 2-3 h to obtain an encapsulating glue solution;
the formula resin A is prepared from 128 epoxy resin and bisphenol A epoxy resin according to a mass ratio of 1: 1.5-2, and degassing, wherein the formula resin B is prepared from phthalic anhydride, polyazelaic anhydride and liquid carboxyl nitrile rubber according to the mass ratio of 12-17: 8-10: 1, and degassing; the superfine silicon powder is 800-;
the preheating method of the formula resin A and the formula resin B comprises the following steps:
and (3) preserving the heat of the formula resin A at 70-75 ℃ for 1-1.5 h, and preserving the heat of the formula resin B at 50-55 ℃ for 1-1.5 h.
2. The pulse energy storage capacitor packaging structure manufactured by the packaging method provided by claim 1.
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| CN206003767U (en) * | 2016-08-25 | 2017-03-08 | 南通华达微电子集团有限公司 | A kind of Ultrathin packaging device |
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| CN1726567A (en) * | 2002-12-17 | 2006-01-25 | Abb技术有限公司 | Power capacitor |
| JP2012199590A (en) * | 2005-05-17 | 2012-10-18 | Vishay Sprague Inc | Surface mount capacitor and manufacturing method of the same |
| CN201327777Y (en) * | 2008-11-11 | 2009-10-14 | 佛山市顺德区创格电子实业有限公司 | Capacitor with high heat radiation power |
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