US20100155037A1 - Container and a device for indirectly cooling materials and method for producing the container - Google Patents

Container and a device for indirectly cooling materials and method for producing the container Download PDF

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Publication number
US20100155037A1
US20100155037A1 US12/644,568 US64456809A US2010155037A1 US 20100155037 A1 US20100155037 A1 US 20100155037A1 US 64456809 A US64456809 A US 64456809A US 2010155037 A1 US2010155037 A1 US 2010155037A1
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United States
Prior art keywords
container
cooling
layer
heat conductivity
centrifuge
Prior art date
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Abandoned
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US12/644,568
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English (en)
Inventor
Bert-Olaf Grimm
Peter Zehnel
Kai Marschner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eppendorf SE
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Eppendorf SE
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Filing date
Publication date
Application filed by Eppendorf SE filed Critical Eppendorf SE
Priority to US12/644,568 priority Critical patent/US20100155037A1/en
Assigned to EPPENDORF AG reassignment EPPENDORF AG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ZEHNEL, PETER, GRIMM, BERT-OLAF, MARSCHNER, KAI
Publication of US20100155037A1 publication Critical patent/US20100155037A1/en
Priority to US13/539,137 priority patent/US8845967B2/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B04—CENTRIFUGAL APPARATUS OR MACHINES FOR CARRYING-OUT PHYSICAL OR CHEMICAL PROCESSES
    • B04B—CENTRIFUGES
    • B04B15/00—Other accessories for centrifuges
    • B04B15/02—Other accessories for centrifuges for cooling, heating, or heat insulating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006—Thermal coupling structure or interface
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D31/00—Other cooling or freezing apparatus
    • F25D31/006—Other cooling or freezing apparatus specially adapted for cooling receptacles, e.g. tanks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/06—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with the heat-exchange conduits forming part of, or being attached to, the tank containing the body of fluid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2270/00—Thermal insulation; Thermal decoupling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • the present invention relates to a container according to the preamble of claim 1 , a device according to the preamble of claim 5 and a method for producing the container according to the preamble of claim 7 .
  • the present invention relates in particular to laboratory centrifuges, this means centrifuges which are used in chemical, biological, biochemical or biotechnological laboratories.
  • the present invention can also be used advantageously for large scale centrifuges and mechanical stirring devices and for all devices in which a material has to be cooled at least indirectly.
  • the invention can also be used for dedicated cooling devices, like e.g. refrigerators or freezers, in particular laboratory refrigerators or freezers, in which a very deep cooling shall be achieved.
  • the container forms the housing of the interior of the device, into which the material is placed.
  • the invention in particular does not relate to cookware, frying pans or similar containers, which are used for heating materials, which can be disposed in the container.
  • centrifuge operation heat is generated during the rotation of the centrifuge rotor in the centrifuge container through air friction and electrical power dissipation. Since the centrifuge container is closed with a cover, in order to prevent the material to be centrifuged from exiting, this heat import cannot simply be removed and leads to an increase of the temperature of the material to be centrifuged.
  • the ambient air directly at the centrifuge rotor is conducted through the centrifuge container, wherein the rotor acts like a radial fan.
  • the centrifuge cover and/or the centrifuge container comprise a recess close to the axis, and an outlet opening disposed more remote with respect to the axis of rotation.
  • the centrifuge container has to have an outlet opening, which also facilitates material egress.
  • Such containers thus cannot be used for stirring devices or similar, in which materials shall be directly mixed, and which thus have to be configured closed all around.
  • Using the ambient air as a cooling medium is a disadvantage of the direct cooling method, since the material can only be cooled down to the temperature of the ambient air at the most.
  • the rotor is enclosed in the centrifuge container under the centrifuge cover, and no cooling channel or similar is provided.
  • a second medium which is conducted along the outside of the container.
  • This can either be ambient air, which is conducted past the exterior of the container, as implemented e.g. for the centrifuge 5424 of Eppendorf AG.
  • a particular cooling medium is conducted along the container through pipes that contact the container, this means the side walls and the bottom plate of the container in a spiral, in order to remove heat.
  • a cooling of the material to a temperature below the temperature of the ambient air is possible.
  • U.S. Pat. No. 5,477,704 A describes a centrifuge container with copper cooling coils glued to its outer side wall and its base plate with an aluminum filled epoxy resin.
  • the aluminum filled epoxy resin has high heat conductivity and is used for supporting the heat transfer from the centrifuge container.
  • the cooling coils disclosed in U.S. Pat. No. 5,477,704 A, which are glued to the container, have a particular configuration.
  • the side of the cooling coil which contacts the side wall or the base plate is flattened in order to increase the contact surface between the cooling coil and the container.
  • it is difficult to apply epoxy resin to copper coils and a certain curing time is required before such a container can be used or processed further.
  • the container and the interconnection epoxy resin/copper have different thermal expansion coefficients. This means that cracking noises can occur when the temperature changes, which give the user an uncomfortable feeling with respect to the operational safety of the centrifuge.
  • Containers in the sense of the instant invention are all devices in which a material to be cooled can be disposed directly or indirectly through a separate enclosure, and can be cooled through indirect cooling through a cooling device that is in heat conducting contact.
  • the container according to the invention can be configured with various outer shapes. It can be round or kettle shaped. In such case, the container comprises a round base plate from which a side wall rises at the outer rim. The upper side of the container can be closed through a cover that can be opened. In an alternative embodiment, the container has edges; this means it is configured rectangular or square. It then has a rectangular or square base plate from whose outer rim four respective side walls extend. The upper side of the container is closed by an upper plate.
  • either at least one of the side walls is configured as a door that can be opened, or the upper side of the container, this means the upper plate, is configured as a cover that can be opened.
  • a “side wall” is recited infra, this that the term also includes the plural; this means “side walls”.
  • the invention relates to:
  • a container for indirect cooling of materials in a device like a centrifuge, stirring device, cooling device, like a refrigerator or similar wherein the container can be brought into heat conducting contact with a cooling device of the device, and comprises a container body, wherein the container body comprises at least two container layers ( 10 , 11 ) in heat conducting contact with one another and with different thermal conductivity, wherein the layer with higher heat conductivity ( 11 ) is disposed at the outside of the container to be cooled by the cooling device;
  • a device for treatment in particular centrifuging, stirring, cooling or similar of a material, in particular a laboratory centrifuge, a refrigerator, a freezer, in particular a laboratory refrigerator and/or a laboratory freezer or similar, with a container and a cooling device that is only in heat conducting contact with portions of a cooled outer surface of the container for indirect cooling of the material disposed inside the container, wherein the container is configured as a container according to (1);
  • Heat conducting contact in the context of the present invention means that the contact has to be configured, so that the heat transfer can be performed through heat conduction.
  • the materials must be in contact, which, however, does not mean that they have to be in direct contact; between the two layers, one or multiple intermediary layers can also be disposed.
  • Heat transferring contact means in the context of the present invention that the contact has to be configured so that a heat transfer can be performed through one of the three principle heat transfer mechanisms, heat conduction, heat radiation or heat convection. Thus, a physical contact of the materials is not mandatory.
  • Direct contact between two objects means in the context of the present invention that two objects contact one another directly at least in portions and thus touch one another.
  • FIG. 1 illustrates a schematic detail of a conventional centrifuge container in contact with a cooling conduit
  • FIG. 2 illustrates a schematic detail of a centrifuge container according to the invention in contact with a cooling conduit.
  • the container according to the invention comprises a container body, which comprises at least two container layers in heat conducting contact with one another, which have different heat conductivity. Through the two container layers, a large contact surface is provided, which improves heat transfer during cooling. Since the layer with higher heat conductivity is disposed at the outside of the container to be cooled, the heat flow to the cooling device, which is only in heat conducting contact with portions of the container surface to be cooled, is increased. This increases the overall cooling efficiency.
  • the heat conductivities shall differ by a factor greater 10 , preferably greater 20 , and particularly preferably greater 100 .
  • the layer with lower heat conductivity is formed from a material comprising stainless steel, steel, ceramic, glass and/or plastic
  • the layer with higher heat conductivity is made from a material comprising aluminum, gold, carbon including its modifications graphite, diamond, carbon similar to diamond and carbon nano tubes, copper, magnesium, brass, silver and/or silicon and their alloys.
  • a configuration of the layer with higher heat conductivity as a foil is advantageous, e.g. as a pyrolitic graphite foil (PGS), since it can be applied to the layer with lower heat conductivity through simple manufacturing steps.
  • PPS pyrolitic graphite foil
  • nano layers can be used as layers with low heat conductivity, thus a layer that was created through nano technology.
  • such a layer is represented as being made of a nano material.
  • the manufacturing cost can be reduced with good efficiency in that the layer with higher heat conductivity has a small thickness of less than 1 mm, preferably less than 0.5 mm, and in particular less than 0.2 mm.
  • the heat flow decreases when the layers are too thick, and the heat transfer may be impaired when the layers are too thin, so that there is an optimum thickness for each layer material.
  • a person skilled in the art will determine this optimum as a matter of routine.
  • a treatment device in particular for centrifuging, stirring, cooling and similar of a material, in particular a laboratory centrifuge, a refrigerator, a freezer, a laboratory refrigerator, a laboratory freezer or similar with a container and a cooling device that is in heat conducting contact only with portions of a cooled outer surface of the container, for indirect cooling of the material disposed in the interior of the container, wherein the container is configured as the container according to the invention.
  • tubular conduit which is preferably wound about the container in a spiral.
  • tubular comprises round tubes and also tubes with at least one flattened side, in particular also rectangular tubes.
  • Only in portions means in the context of the present invention that the contact surface between the cooling device and the cooled outer surface of the container is smaller than the cooled outer surface of the container.
  • the cooling device can thus also be formed by plural separately operating devices, wherein, however, their entire contact surface shall be smaller than the cooled outer surface of the container.
  • cooling conduits on the base of the container can be omitted.
  • the temperature e.g. in a centrifuge container rises exponentially as a function of the speed of rotation, so that for very high speeds and/or for intended very deep cooling, additional cooling conduits have to be provided at the base of the container.
  • the indirect heat transfer according to the invention can certainly also be coupled with a direct heat transfer, e.g. the known rotor air based centrifuge cooling.
  • independent protection is claimed for the method for producing the container according to the invention, in which the layer with higher heat conductivity is disposed on the layer with lower heat conductivity and vice versa.
  • this can be performed in that a layer, preferably the layer with the higher heat conductivity is plated onto the other layer and the container is then formed or two layers separate from one another are placed on top of one another, e.g. as foils or plates, and the container is formed e.g. through simultaneously forming of the layers, e.g. deep drawing.
  • the layer with higher heat conductivity is applied to the layer with lower heat conductivity after the layer with lower heat conductivity has substantially assumed the shape of the container or vice versa
  • the layer with lower heat conductivity is applied to the layer with higher heat conductivity after the layer with higher heat conductivity has taken substantially the shape of the container.
  • the manufacturing process can be configured more cost effective, wherein e.g. the layer with higher heat conductivity is applied to the layer with lower heat conductivity through a galvanic process or vice versa.
  • the heat flow in a solid object is defined as:
  • ⁇ dot over (Q) ⁇ is the heat flow through the solid object
  • A is the heat conductivity, which is a material constant
  • A is the size of the cross section area of the solid object
  • s is the thickness of the solid object
  • ⁇ T is the temperature difference between the input side and the output side of the heat flow.
  • this principle is described purely schematically for a known centrifuge container, which is shown in detail with a container wall 1 , which container is contact with a cooling conduit 2 .
  • the heat flow which is indicated by arrows and flows from the inside 3 of the container with a temperature T 1 through the container wall 1 , which has a wall thickness of s 1 , through the contact surface A between container wall 1 and cooling conduit 2 with a temperature TA through the material of the cooling conduit 2 , which conducts cooling medium, which cooling conduit has a wall thickness s 2 , wherein the cooling medium comprises the temperature T 2 .
  • the heat flow through the container wall 1 can only occur through the contact surface A, and the following is computed for the heat flow through the container wall 1 :
  • ⁇ dot over (Q) ⁇ 1 ⁇ 1 ⁇ ( T 1 ⁇ T A )
  • ⁇ dot over (Q) ⁇ 2 ⁇ 2 ⁇ ( T A ⁇ T 2 )
  • T 2 is continuously kept low through a coolant. This means in reverse conclusion that the temperature T 1 in the interior of the container will have a much higher temperature difference from the temperature of the contact location TA.
  • the first possibility is technically limited by the functional design of the components and is typically also exhausted, and the second possibility does not apply for reasons of application technology and the particular application since copper or silver are not chemically inert.
  • the solution according to the invention provides an additional heat transfer layer at the outer wall of the container, as shown schematically in FIG. 2 , for the resultant heat flow illustrated through the arrows in a detail. This inserts an additional contact surface with a large contact area.
  • an additional outer container layer 11 with a thickness s 11 made from material with good heat conductivity is applied as an outer wall of the container.
  • the cooling conduit 12 has the thickness s 12 .
  • a contact surface B between the container layers 10 , 11 is provided, which is much larger than the other contact surface A.
  • the heat flow now passes through the three materials of the inner container layer 10 , the outer container layer 11 and the cooling conduit 12 , and through the contact locations A, B, which differ greatly in size.
  • ⁇ 1 ⁇ B ⁇ ( T 1 - T B ) ⁇ 2 ⁇ A 2 ⁇ ( T B - T 2 ) ,
  • T 2 is continuously kept low through the coolant. This, however, means in reverse conclusion, that the temperature T 1 in the interior of the container, however, has to have a greater temperature difference from the temperature TB of the contact location, however, the temperature difference in turn is smaller than described in the context of FIG. 1 , since B>>A.
  • the principle of the invention has been described supra with reference to two container layers with different heat conductivities, it is evident, however, that also three or more layers can be used. These can be in particular layers for corrosion protection, contamination protection or similar. The only important thing is that the layer with higher heat conductivity is disposed at the outer surface of the container to be cooled. However, one or multiple additional layers can be disposed between the layer with higher heat conductivity and the layer with lower heat conductivity, and also on the layer with lower heat conductivity, in order to adapt the container to particular applications.
  • a laboratory centrifuge 5415R of Eppendorf AG was used, which comprises a spiral shaped rectangular tube as a cooling conduit 2 , 12 , which has a width of 9.5 mm, a height of 5 mm and a materials thickness of 0.5 mm.
  • an off the shelf centrifuge container 1 with 185 mm diameter, 70 mm height and a wall thickness of 1 mm (Art. No. 5426 123.101-00) of Eppendorf AG is used, which is made of V2A-stainless steel (heat conductivity approximately 15 W/m*K), and provided with a heat transfer paste (heat conductivity approximately 15 W/m*K) and disposed in the cooling conduit, in order to conduct the exemplary comparison.
  • the off the shelf centrifuge container 10 (Art. No. 5426 123.101-00) of Eppendorf AG is provided with a 0.1 mm thick copper plating 11 (heat conductivity approximately 350 W/m*K), otherwise the setup is the same, this means the centrifuge container is connected to the rectangular cooling conduit 12 through heat transfer paste (heat conductivity approximately 15 W/m*K).
  • centrifuge 5415 R is operated with an off the shelf rotor F45-24-11 of Eppendorf AG for an hour at a maximum of 13,200 RPM.
  • the minimum achievable sample temperature is measured with a temperature measurement device. The results are shown in the table.
  • the copper plating 11 improves the heat conductivity of the centrifuge container 10 , and thus the efficiency of the cooling system.
  • a lower sample temperature is provided at the same electrical energy consumption.
  • the present invention provides a much more efficient indirect cooling from the outside of the container into the inside of the container.
  • the improvement of the heat conductivity and of the heat transfer of centrifuge containers provides cooled centrifuges with a reduction of the required power of the cooling system. Through the increased performance of the centrifuge, a higher speed can be run for the same temperature of the materials to be centrifuged, and/or at the same temperature of the material centrifuged and at the same speed, the power input of the cooling device can be reduced.
  • the principle of the invention is based on the finding that for the indirect cooling of a container surface, which is greater than the contact surface between the container and the cooling device, the cooling effect can be increased when the container, besides a layer with low heat conductivity, comprises a layer with higher heat conductivity, and thus the layer with higher heat conductivity is disposed at the outer container surface to be cooled, and thus is in heat conducting contact with the cooling device.
  • the cooling power is transferred better into the interior of the container and to the material to be cooled therein.
  • An alternative solution is comprised in that the contact surface between the cooling device and the cooled surface of the container has at least the same size as the cooled container surface. This can be implemented in that a portion of the cooling device is a portion of the layer of the container with greater heat conductivity.
  • the second layer is made from a solid material like copper and the cooling device is disposed directly in this layer.
  • the cooling device can be disposed in a liquid, gel or similar which is in heat conducting contact with the layer with low heat conductivity and which comprises a higher heat conductivity itself.
  • the container comprises a layer which comprises a cavity which can be filled with a liquid, gel or similar between itself and the layer with low heat conductivity, in which cavity the cooling device is disposed.
  • the heat conductivity of this additional layer is insignificant because it is disposed on the outside with respect to the cooling device.
  • the container itself does not comprise the liquid, the gel or similar, but it is provided in a device with the cooling disposed therein, in which device the container can be disposed, so that the liquid, the gel or similar is in heat conductive contact with the layer with low heat conductivity.
  • the container in the sense of a bath can be completely submerged in the liquid, the gel or similar like a bath, preferably to the rim or the liquid, the gel or similar is only in contact with a portion of the outer container surface.
  • liquid, gel or similar and the layer with low heat conductivity also an additional layer with higher heat conductivity can be disposed.
  • the liquid, gel or similar with the cooling device can be disposed within a copper enclosure which is either directly integrated into the container or provided in the device, wherein the container can then be brought into direct contact with the copper enclosure.
  • the sealing can be provided.
  • liquids or gels also include Newton liquids and also non Newton liquids, salt solutions, dispersions, suspensions and also any combination of 2 or more of the listed substances.
  • a liquid or gel can be selected from the following group: water, ionic liquids, suspensions of carbon nona tubes, cooling salt solutions, eutectica, or eutectic mixtures and similar materials.
  • antifrogenes this means heat transfer liquids based on glykoles (Antifrogen N, Antifrogen L and Antifrogen SOL) or potassiumformiate (Antifrogen KF).
  • ionic liquids are being used, like e.g.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Centrifugal Separators (AREA)
US12/644,568 2008-12-22 2009-12-22 Container and a device for indirectly cooling materials and method for producing the container Abandoned US20100155037A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/644,568 US20100155037A1 (en) 2008-12-22 2009-12-22 Container and a device for indirectly cooling materials and method for producing the container
US13/539,137 US8845967B2 (en) 2008-12-22 2012-06-29 Container and a device for indirectly cooling materials and method for producing the container

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US13988008P 2008-12-22 2008-12-22
DE102008064178A DE102008064178A1 (de) 2008-12-22 2008-12-22 Behälter und Vorrichtung für mittelbare Gutkühlungen sowie Verfahren zur Herstellung des Behälters
US12/644,568 US20100155037A1 (en) 2008-12-22 2009-12-22 Container and a device for indirectly cooling materials and method for producing the container

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EP (1) EP2199713B1 (de)
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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2021248055A1 (en) * 2020-06-05 2021-12-09 Pepsico, Inc. Chiller for cooling a beverage

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Publication number Priority date Publication date Assignee Title
CN111572980B (zh) * 2020-05-19 2021-07-13 西安交通大学 一种环保型深紫外杀菌智能配送箱

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US8845967B2 (en) 2014-09-30
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DE102008064178A1 (de) 2010-07-01
EP2199713A2 (de) 2010-06-23
US20120264582A1 (en) 2012-10-18
PL2199713T3 (pl) 2019-03-29

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