US20100028580A1 - Heat resistant thermoplastic articles - Google Patents
Heat resistant thermoplastic articles Download PDFInfo
- Publication number
- US20100028580A1 US20100028580A1 US12/512,195 US51219509A US2010028580A1 US 20100028580 A1 US20100028580 A1 US 20100028580A1 US 51219509 A US51219509 A US 51219509A US 2010028580 A1 US2010028580 A1 US 2010028580A1
- Authority
- US
- United States
- Prior art keywords
- poly
- group
- hexamethylene
- terephthalamide
- polyamides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229920001169 thermoplastic Polymers 0.000 title claims abstract description 47
- 239000004416 thermosoftening plastic Substances 0.000 title claims abstract description 47
- 239000004952 Polyamide Substances 0.000 claims abstract description 103
- 229920002647 polyamide Polymers 0.000 claims abstract description 103
- 239000000203 mixture Substances 0.000 claims abstract description 74
- 238000012360 testing method Methods 0.000 claims abstract description 41
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 23
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 19
- 239000003381 stabilizer Substances 0.000 claims abstract description 18
- 230000014759 maintenance of location Effects 0.000 claims abstract description 17
- 150000004982 aromatic amines Chemical group 0.000 claims abstract description 16
- 150000001412 amines Chemical class 0.000 claims abstract description 9
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 7
- 239000004611 light stabiliser Substances 0.000 claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 125000000524 functional group Chemical group 0.000 claims abstract description 6
- 230000002787 reinforcement Effects 0.000 claims abstract description 6
- 239000012745 toughening agent Substances 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- 150000003839 salts Chemical class 0.000 claims abstract description 4
- -1 aliphatic diamine Chemical class 0.000 claims description 148
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 claims description 59
- 125000004432 carbon atom Chemical group C* 0.000 claims description 44
- PGGROMGHWHXWJL-UHFFFAOYSA-N 4-(azepane-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCCCC1 PGGROMGHWHXWJL-UHFFFAOYSA-N 0.000 claims description 35
- 238000002844 melting Methods 0.000 claims description 30
- 230000008018 melting Effects 0.000 claims description 30
- LKWSTQPRPRGLDP-UHFFFAOYSA-N 4-(azacycloundecane-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCCCCCCCC1 LKWSTQPRPRGLDP-UHFFFAOYSA-N 0.000 claims description 27
- 239000000178 monomer Substances 0.000 claims description 23
- 125000001931 aliphatic group Chemical group 0.000 claims description 18
- OCBDCKOLSAYNMN-UHFFFAOYSA-N 4-(azacyclotridecane-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCCCCCCCCCC1 OCBDCKOLSAYNMN-UHFFFAOYSA-N 0.000 claims description 15
- CSJJNGBTPIRXBE-UHFFFAOYSA-N 6-(azepan-1-yl)-6-oxohexanamide Chemical compound NC(=O)CCCCC(=O)N1CCCCCC1 CSJJNGBTPIRXBE-UHFFFAOYSA-N 0.000 claims description 13
- 239000004014 plasticizer Substances 0.000 claims description 13
- 229920000572 Nylon 6/12 Polymers 0.000 claims description 11
- CELROVGXVNNJCW-UHFFFAOYSA-N 11-aminoundecanamide Chemical compound NCCCCCCCCCCC(N)=O CELROVGXVNNJCW-UHFFFAOYSA-N 0.000 claims description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- 229920000933 poly (ε-caprolactam) Polymers 0.000 claims description 10
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 9
- FTZSDHHWPWGCDI-UHFFFAOYSA-N dodecanediamide Chemical compound NC(=O)CCCCCCCCCCC(N)=O FTZSDHHWPWGCDI-UHFFFAOYSA-N 0.000 claims description 9
- 150000003951 lactams Chemical class 0.000 claims description 9
- SNNMLPUQKZGXOJ-UHFFFAOYSA-N 12-aminododecanamide Chemical compound NCCCCCCCCCCCC(N)=O SNNMLPUQKZGXOJ-UHFFFAOYSA-N 0.000 claims description 8
- FQLAJSQGBDYBAL-UHFFFAOYSA-N 3-(azepane-1-carbonyl)benzamide Chemical compound NC(=O)C1=CC=CC(C(=O)N2CCCCCC2)=C1 FQLAJSQGBDYBAL-UHFFFAOYSA-N 0.000 claims description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 8
- 229920000577 Nylon 6/66 Polymers 0.000 claims description 8
- 229920003231 aliphatic polyamide Polymers 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 7
- 229920006139 poly(hexamethylene adipamide-co-hexamethylene terephthalamide) Polymers 0.000 claims description 7
- 238000002411 thermogravimetry Methods 0.000 claims description 7
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 6
- 239000004953 Aliphatic polyamide Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- VDBXLXRWMYNMHL-UHFFFAOYSA-N decanediamide Chemical compound NC(=O)CCCCCCCCC(N)=O VDBXLXRWMYNMHL-UHFFFAOYSA-N 0.000 claims description 6
- 230000004580 weight loss Effects 0.000 claims description 6
- OECUQWQIGXMPAN-UHFFFAOYSA-N 6-oxo-6-pyrrolidin-1-ylhexanamide Chemical compound NC(=O)CCCCC(=O)N1CCCC1 OECUQWQIGXMPAN-UHFFFAOYSA-N 0.000 claims description 5
- 230000009477 glass transition Effects 0.000 claims description 5
- 229920006012 semi-aromatic polyamide Polymers 0.000 claims description 5
- WXBUUJNOVQVTFV-UHFFFAOYSA-N 10-(azacycloundec-1-yl)-10-oxodecanamide Chemical compound NC(=O)CCCCCCCCC(=O)N1CCCCCCCCCC1 WXBUUJNOVQVTFV-UHFFFAOYSA-N 0.000 claims description 4
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 claims description 4
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 claims description 4
- BPWIZTGMTWYMFO-UHFFFAOYSA-N 6-(3-methylpiperidin-1-yl)-6-oxohexanamide Chemical compound CC1CCCN(C(=O)CCCCC(N)=O)C1 BPWIZTGMTWYMFO-UHFFFAOYSA-N 0.000 claims description 4
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims description 4
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims description 4
- 229920006143 PA616 Polymers 0.000 claims description 4
- 239000000446 fuel Substances 0.000 claims description 4
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 claims description 4
- 229960002920 sorbitol Drugs 0.000 claims description 4
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 235000010355 mannitol Nutrition 0.000 claims description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000811 xylitol Substances 0.000 claims description 3
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 claims description 3
- 235000010447 xylitol Nutrition 0.000 claims description 3
- 229960002675 xylitol Drugs 0.000 claims description 3
- MXAOILAHPVJWBS-UHFFFAOYSA-N 10-(azepan-1-yl)-10-oxodecanamide Chemical compound NC(=O)CCCCCCCCC(=O)N1CCCCCC1 MXAOILAHPVJWBS-UHFFFAOYSA-N 0.000 claims description 2
- ANDAQSIUDBVMNP-UHFFFAOYSA-N 12-(azepan-1-yl)-12-oxododecanamide Chemical compound NC(=O)CCCCCCCCCCC(=O)N1CCCCCC1 ANDAQSIUDBVMNP-UHFFFAOYSA-N 0.000 claims description 2
- PUMFLNDRVQSSKY-UHFFFAOYSA-N 14-(azepan-1-yl)-14-oxotetradecanamide Chemical compound NC(=O)CCCCCCCCCCCCC(=O)N1CCCCCC1 PUMFLNDRVQSSKY-UHFFFAOYSA-N 0.000 claims description 2
- 229920000393 Nylon 6/6T Polymers 0.000 claims description 2
- 238000001479 atomic absorption spectroscopy Methods 0.000 claims description 2
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 description 22
- 230000032683 aging Effects 0.000 description 17
- 239000004615 ingredient Substances 0.000 description 16
- 229920001577 copolymer Polymers 0.000 description 14
- 239000000126 substance Substances 0.000 description 14
- 229920006115 poly(dodecamethylene terephthalamide) Polymers 0.000 description 13
- 239000012760 heat stabilizer Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- HLPFMOOKIBJIQT-UHFFFAOYSA-N 4-(pyrrolidine-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCC1 HLPFMOOKIBJIQT-UHFFFAOYSA-N 0.000 description 10
- 229920006153 PA4T Polymers 0.000 description 10
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 230000007774 longterm Effects 0.000 description 9
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 8
- 150000004985 diamines Chemical class 0.000 description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 7
- 239000005977 Ethylene Substances 0.000 description 7
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 5
- 229920001519 homopolymer Polymers 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 5
- 229920006180 poly(hexamethylene terephthalamide)-poly(2-methyl pentamethylene diamine) Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- JLZIIHMTTRXXIN-UHFFFAOYSA-N 2-(2-hydroxy-4-methoxybenzoyl)benzoic acid Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1C(O)=O JLZIIHMTTRXXIN-UHFFFAOYSA-N 0.000 description 4
- NPKDHUPJIUWYFG-UHFFFAOYSA-N 4-(azecane-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCCCCCCC1 NPKDHUPJIUWYFG-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- IPRJXAGUEGOFGG-UHFFFAOYSA-N N-butylbenzenesulfonamide Chemical compound CCCCNS(=O)(=O)C1=CC=CC=C1 IPRJXAGUEGOFGG-UHFFFAOYSA-N 0.000 description 4
- 239000001361 adipic acid Substances 0.000 description 4
- 235000011037 adipic acid Nutrition 0.000 description 4
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- 125000001841 imino group Chemical group [H]N=* 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 4
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 229940124530 sulfonamide Drugs 0.000 description 3
- NJPUGXZMKBZIQZ-UHFFFAOYSA-N 1,5-dioxaspiro[5.5]undecane-3,3-dicarboxylic acid Chemical compound O1CC(C(=O)O)(C(O)=O)COC11CCCCC1 NJPUGXZMKBZIQZ-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- RLHGFJMGWQXPBW-UHFFFAOYSA-N 2-hydroxy-3-(1h-imidazol-5-ylmethyl)benzamide Chemical compound NC(=O)C1=CC=CC(CC=2NC=NC=2)=C1O RLHGFJMGWQXPBW-UHFFFAOYSA-N 0.000 description 2
- GUCMKIKYKIHUTM-UHFFFAOYSA-N 3,3,5,5-tetramethyl-1-[2-(3,3,5,5-tetramethyl-2-oxopiperazin-1-yl)ethyl]piperazin-2-one Chemical compound O=C1C(C)(C)NC(C)(C)CN1CCN1C(=O)C(C)(C)NC(C)(C)C1 GUCMKIKYKIHUTM-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-KAZBKCHUSA-N D-altritol Chemical compound OC[C@@H](O)[C@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KAZBKCHUSA-N 0.000 description 2
- SRBFZHDQGSBBOR-IOVATXLUSA-N D-xylopyranose Chemical compound O[C@@H]1COC(O)[C@H](O)[C@H]1O SRBFZHDQGSBBOR-IOVATXLUSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229920003314 Elvaloy® Polymers 0.000 description 2
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 2
- FMRHJJZUHUTGKE-UHFFFAOYSA-N Ethylhexyl salicylate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1O FMRHJJZUHUTGKE-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- 101000576320 Homo sapiens Max-binding protein MNT Proteins 0.000 description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- 229920000305 Nylon 6,10 Polymers 0.000 description 2
- BTZVDPWKGXMQFW-UHFFFAOYSA-N Pentadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCC(O)=O BTZVDPWKGXMQFW-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 229920005657 Surlyn® 9320 Polymers 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- JWUXJYZVKZKLTJ-UHFFFAOYSA-N Triacetonamine Chemical compound CC1(C)CC(=O)CC(C)(C)N1 JWUXJYZVKZKLTJ-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- PYMYPHUHKUWMLA-UHFFFAOYSA-N arabinose Natural products OCC(O)C(O)C(O)C=O PYMYPHUHKUWMLA-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- SRBFZHDQGSBBOR-UHFFFAOYSA-N beta-D-Pyranose-Lyxose Natural products OC1COC(O)C(O)C1O SRBFZHDQGSBBOR-UHFFFAOYSA-N 0.000 description 2
- 125000002619 bicyclic group Chemical group 0.000 description 2
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 150000001720 carbohydrates Chemical class 0.000 description 2
- 150000001723 carbon free-radicals Chemical class 0.000 description 2
- 239000007859 condensation product Substances 0.000 description 2
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000002950 monocyclic group Chemical group 0.000 description 2
- NATWUQFQFMZVMT-UHFFFAOYSA-N n-ethyl-2-methylbenzenesulfonamide Chemical compound CCNS(=O)(=O)C1=CC=CC=C1C NATWUQFQFMZVMT-UHFFFAOYSA-N 0.000 description 2
- OHPZPBNDOVQJMH-UHFFFAOYSA-N n-ethyl-4-methylbenzenesulfonamide Chemical compound CCNS(=O)(=O)C1=CC=C(C)C=C1 OHPZPBNDOVQJMH-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000002530 phenolic antioxidant Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 239000012744 reinforcing agent Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 150000003456 sulfonamides Chemical class 0.000 description 2
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 2
- HQHCYKULIHKCEB-UHFFFAOYSA-N tetradecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCC(O)=O HQHCYKULIHKCEB-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical group O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- ZWVMLYRJXORSEP-UHFFFAOYSA-N 1,2,6-Hexanetriol Chemical compound OCCCCC(O)CO ZWVMLYRJXORSEP-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- HOLZCMFSCBLOLX-UHFFFAOYSA-N 1-octadecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCCCCCCCN1C(=O)C=CC1=O HOLZCMFSCBLOLX-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- ZDVRPQIPVMARSE-UHFFFAOYSA-N 11-aminododecanoic acid Chemical compound CC(N)CCCCCCCCCC(O)=O ZDVRPQIPVMARSE-UHFFFAOYSA-N 0.000 description 1
- VDVUCLWJZJHFAV-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidin-4-ol Chemical compound CC1(C)CC(O)CC(C)(C)N1 VDVUCLWJZJHFAV-UHFFFAOYSA-N 0.000 description 1
- WXSVCGWHWWPQKF-UHFFFAOYSA-N 2,3-bis(2-hydroxyethyl)cyclohexan-1-ol Chemical compound OCCC1CCCC(O)C1CCO WXSVCGWHWWPQKF-UHFFFAOYSA-N 0.000 description 1
- PLPYCSBZHKTQPB-UHFFFAOYSA-N 2-(2-hydroxyethoxy)hexane-1,2-diol Chemical compound CCCCC(O)(CO)OCCO PLPYCSBZHKTQPB-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- WUIXEIPAPIJUGW-UHFFFAOYSA-N 2-[1,1-bis(2-hydroxyphenyl)propyl]phenol Chemical compound C=1C=CC=C(O)C=1C(C=1C(=CC=CC=1)O)(CC)C1=CC=CC=C1O WUIXEIPAPIJUGW-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- PJQMIKVOOXOOHX-UHFFFAOYSA-N 2-[2-hydroxyethyl-(2,2,6,6-tetramethylpiperidin-1-yl)amino]ethanol Chemical compound CC1(C)CCCC(C)(C)N1N(CCO)CCO PJQMIKVOOXOOHX-UHFFFAOYSA-N 0.000 description 1
- VKQPHJLIVKHAQA-UHFFFAOYSA-N 2-[3-(2-hydroxyethyl)-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]ethanol Chemical compound C1OC(CCO)OCC21COC(CCO)OC2 VKQPHJLIVKHAQA-UHFFFAOYSA-N 0.000 description 1
- SCYXIBCYTMZXAC-UHFFFAOYSA-N 2-[5,5-bis(2-hydroxyphenyl)-3-methylpentyl]phenol Chemical compound C=1C=CC=C(O)C=1C(C=1C(=CC=CC=1)O)CC(C)CCC1=CC=CC=C1O SCYXIBCYTMZXAC-UHFFFAOYSA-N 0.000 description 1
- LQBBMXROIIPPEK-UHFFFAOYSA-N 2-[5-(3,5-ditert-butyl-4-hydroxyphenyl)-4,4-bis(1,2,2,6,6-pentamethylpiperidin-3-yl)pentyl]propanedioic acid Chemical compound CC1(CCC(C(N1C)(C)C)C(CCCC(C(=O)O)C(=O)O)(CC2=CC(=C(C(=C2)C(C)(C)C)O)C(C)(C)C)C3CCC(N(C3(C)C)C)(C)C)C LQBBMXROIIPPEK-UHFFFAOYSA-N 0.000 description 1
- JVMWIRPVXLBFOI-UHFFFAOYSA-N 2-cycloundecyl-5-(2,2,6,6-tetramethylpiperidin-4-yl)-1,3-oxazole Chemical compound C1C(C)(C)NC(C)(C)CC1C1=CN=C(C2CCCCCCCCCC2)O1 JVMWIRPVXLBFOI-UHFFFAOYSA-N 0.000 description 1
- YCMLQMDWSXFTIF-UHFFFAOYSA-N 2-methylbenzenesulfonimidic acid Chemical compound CC1=CC=CC=C1S(N)(=O)=O YCMLQMDWSXFTIF-UHFFFAOYSA-N 0.000 description 1
- GAGWMWLBYJPFDD-UHFFFAOYSA-N 2-methyloctane-1,8-diamine Chemical compound NCC(C)CCCCCCN GAGWMWLBYJPFDD-UHFFFAOYSA-N 0.000 description 1
- UFMBOFGKHIXOTA-UHFFFAOYSA-N 2-methylterephthalic acid Chemical compound CC1=CC(C(O)=O)=CC=C1C(O)=O UFMBOFGKHIXOTA-UHFFFAOYSA-N 0.000 description 1
- CMTLRRXPGSGSFF-UHFFFAOYSA-N 2-o,3-o,4-o-tris(1,2,2,6,6-pentamethylpiperidin-4-yl) 1-o-tridecyl butane-1,2,3,4-tetracarboxylate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)C(CC(=O)OCCCCCCCCCCCCC)C(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)CC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 CMTLRRXPGSGSFF-UHFFFAOYSA-N 0.000 description 1
- HNTWDNMNGNBFEA-UHFFFAOYSA-N 3,3,5,5-tetramethylpiperazin-2-one Chemical compound CC1(C)CNC(=O)C(C)(C)N1 HNTWDNMNGNBFEA-UHFFFAOYSA-N 0.000 description 1
- YHXNHYKKDRMEEH-UHFFFAOYSA-N 3-(2-hydroxyethoxy)propane-1,2-diol Chemical compound OCCOCC(O)CO YHXNHYKKDRMEEH-UHFFFAOYSA-N 0.000 description 1
- WQYPVEKEHDLOBS-UHFFFAOYSA-N 3-(2-hydroxypropoxy)propane-1,2-diol Chemical compound CC(O)COCC(O)CO WQYPVEKEHDLOBS-UHFFFAOYSA-N 0.000 description 1
- KQXMFSOXJUGYBW-UHFFFAOYSA-N 3-[4,4-bis(2,3-dihydroxyphenyl)butyl]benzene-1,2-diol Chemical compound OC1=CC=CC(CCCC(C=2C(=C(O)C=CC=2)O)C=2C(=C(O)C=CC=2)O)=C1O KQXMFSOXJUGYBW-UHFFFAOYSA-N 0.000 description 1
- FBIXXCXCZOZFCO-UHFFFAOYSA-N 3-dodecyl-1-(2,2,6,6-tetramethylpiperidin-4-yl)pyrrolidine-2,5-dione Chemical compound O=C1C(CCCCCCCCCCCC)CC(=O)N1C1CC(C)(C)NC(C)(C)C1 FBIXXCXCZOZFCO-UHFFFAOYSA-N 0.000 description 1
- UJAWGGOCYUPCPS-UHFFFAOYSA-N 4-(2-phenylpropan-2-yl)-n-[4-(2-phenylpropan-2-yl)phenyl]aniline Chemical compound C=1C=C(NC=2C=CC(=CC=2)C(C)(C)C=2C=CC=CC=2)C=CC=1C(C)(C)C1=CC=CC=C1 UJAWGGOCYUPCPS-UHFFFAOYSA-N 0.000 description 1
- STEYNUVPFMIUOY-UHFFFAOYSA-N 4-Hydroxy-1-(2-hydroxyethyl)-2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CC(O)CC(C)(C)N1CCO STEYNUVPFMIUOY-UHFFFAOYSA-N 0.000 description 1
- BRPSWMCDEYMRPE-UHFFFAOYSA-N 4-[1,1-bis(4-hydroxyphenyl)ethyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=C(O)C=C1 BRPSWMCDEYMRPE-UHFFFAOYSA-N 0.000 description 1
- NOEIYOLYKBVGGI-UHFFFAOYSA-N 4-[3,3-bis(2,4-dihydroxy-3-methylphenyl)propyl]-2-methylbenzene-1,3-diol Chemical compound CC1=C(O)C=CC(CCC(C=2C(=C(C)C(O)=CC=2)O)C=2C(=C(C)C(O)=CC=2)O)=C1O NOEIYOLYKBVGGI-UHFFFAOYSA-N 0.000 description 1
- WUBBRNOQWQTFEX-UHFFFAOYSA-N 4-aminosalicylic acid Chemical compound NC1=CC=C(C(O)=O)C(O)=C1 WUBBRNOQWQTFEX-UHFFFAOYSA-N 0.000 description 1
- RAEZDADOWHBDJK-UHFFFAOYSA-N 6-(2-hydroxypropoxy)hexane-1,2-diol Chemical compound CC(O)COCCCCC(O)CO RAEZDADOWHBDJK-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FBXFSONDSA-N Allitol Chemical compound OC[C@H](O)[C@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-FBXFSONDSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920000858 Cyclodextrin Polymers 0.000 description 1
- FBPFZTCFMRRESA-ZXXMMSQZSA-N D-iditol Chemical compound OC[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-ZXXMMSQZSA-N 0.000 description 1
- WQZGKKKJIJFFOK-QTVWNMPRSA-N D-mannopyranose Chemical compound OC[C@H]1OC(O)[C@@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-QTVWNMPRSA-N 0.000 description 1
- UNXHWFMMPAWVPI-QWWZWVQMSA-N D-threitol Chemical compound OC[C@@H](O)[C@H](O)CO UNXHWFMMPAWVPI-QWWZWVQMSA-N 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 description 1
- 229930091371 Fructose Natural products 0.000 description 1
- 239000005715 Fructose Substances 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- HEBKCHPVOIAQTA-IMJSIDKUSA-N L-arabinitol Chemical compound OC[C@H](O)C(O)[C@@H](O)CO HEBKCHPVOIAQTA-IMJSIDKUSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229920008381 Zytel® 158 NC010 Polymers 0.000 description 1
- 0 [1*]N1C(C)(C)CC([2*])([3*])CC1(C)C.[1*]N1C(C)(C)CN([5*])C(=O)C1(C)C.[1*]ON1C(C)(C)CN([5*])C(=O)C1(C)C.[2*]C1([3*])CC(C)(C)N(O[4*])C(C)(C)C1 Chemical compound [1*]N1C(C)(C)CC([2*])([3*])CC1(C)C.[1*]N1C(C)(C)CN([5*])C(=O)C1(C)C.[1*]ON1C(C)(C)CN([5*])C(=O)C1(C)C.[2*]C1([3*])CC(C)(C)N(O[4*])C(C)(C)C1 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
- WQZGKKKJIJFFOK-PHYPRBDBSA-N alpha-D-galactose Chemical compound OC[C@H]1O[C@H](O)[C@H](O)[C@@H](O)[C@H]1O WQZGKKKJIJFFOK-PHYPRBDBSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- VCNTUJWBXWAWEJ-UHFFFAOYSA-J aluminum;sodium;dicarbonate Chemical compound [Na+].[Al+3].[O-]C([O-])=O.[O-]C([O-])=O VCNTUJWBXWAWEJ-UHFFFAOYSA-J 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- PYMYPHUHKUWMLA-WDCZJNDASA-N arabinose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)C=O PYMYPHUHKUWMLA-WDCZJNDASA-N 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 150000008331 benzenesulfonamides Chemical class 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- CMXLJKWFEJEFJE-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) 2-[(4-methoxyphenyl)methylidene]propanedioate Chemical compound C1=CC(OC)=CC=C1C=C(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)C(=O)OC1CC(C)(C)N(C)C(C)(C)C1 CMXLJKWFEJEFJE-UHFFFAOYSA-N 0.000 description 1
- RSOILICUEWXSLA-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 RSOILICUEWXSLA-UHFFFAOYSA-N 0.000 description 1
- OSIVCXJNIBEGCL-UHFFFAOYSA-N bis(2,2,6,6-tetramethyl-1-octoxypiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)N(OCCCCCCCC)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(OCCCCCCCC)C(C)(C)C1 OSIVCXJNIBEGCL-UHFFFAOYSA-N 0.000 description 1
- GOJOVSYIGHASEI-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) butanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCC(=O)OC1CC(C)(C)NC(C)(C)C1 GOJOVSYIGHASEI-UHFFFAOYSA-N 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 125000002837 carbocyclic group Chemical group 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 125000003262 carboxylic acid ester group Chemical group [H]C([H])([*:2])OC(=O)C([H])([H])[*:1] 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical compound [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229930182830 galactose Natural products 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010102 injection blow moulding Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 229940117841 methacrylic acid copolymer Drugs 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
- UKJARPDLRWBRAX-UHFFFAOYSA-N n,n'-bis(2,2,6,6-tetramethylpiperidin-4-yl)hexane-1,6-diamine Chemical compound C1C(C)(C)NC(C)(C)CC1NCCCCCCNC1CC(C)(C)NC(C)(C)C1 UKJARPDLRWBRAX-UHFFFAOYSA-N 0.000 description 1
- DHRXPBUFQGUINE-UHFFFAOYSA-N n-(2-hydroxypropyl)benzenesulfonamide Chemical compound CC(O)CNS(=O)(=O)C1=CC=CC=C1 DHRXPBUFQGUINE-UHFFFAOYSA-N 0.000 description 1
- FDAKZQLBIFPGSV-UHFFFAOYSA-N n-butyl-2,2,6,6-tetramethylpiperidin-4-amine Chemical compound CCCCNC1CC(C)(C)NC(C)(C)C1 FDAKZQLBIFPGSV-UHFFFAOYSA-N 0.000 description 1
- HRRDCWDFRIJIQZ-UHFFFAOYSA-N naphthalene-1,8-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=C2C(C(=O)O)=CC=CC2=C1 HRRDCWDFRIJIQZ-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 229920006119 nylon 10T Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- AJCDFVKYMIUXCR-UHFFFAOYSA-N oxobarium;oxo(oxoferriooxy)iron Chemical compound [Ba]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O AJCDFVKYMIUXCR-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 125000003386 piperidinyl group Chemical class 0.000 description 1
- 125000005936 piperidyl group Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920006131 poly(hexamethylene isophthalamide-co-terephthalamide) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- UOIBLYKRMCDKBM-UHFFFAOYSA-N prop-1-en-2-ylbenzene;1-(2,2,6,6-tetramethylpiperidin-4-yl)pyrrole-2,5-dione Chemical compound CC(=C)C1=CC=CC=C1.C1C(C)(C)NC(C)(C)CC1N1C(=O)C=CC1=O UOIBLYKRMCDKBM-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- HFHDHCJBZVLPGP-UHFFFAOYSA-N schardinger α-dextrin Chemical compound O1C(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(O)C2O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC2C(O)C(O)C1OC2CO HFHDHCJBZVLPGP-UHFFFAOYSA-N 0.000 description 1
- 235000010356 sorbitol Nutrition 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- NQRYJNQNLNOLGT-UHFFFAOYSA-N tetrahydropyridine hydrochloride Natural products C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 1
- NZNAAUDJKMURFU-UHFFFAOYSA-N tetrakis(2,2,6,6-tetramethylpiperidin-4-yl) butane-1,2,3,4-tetracarboxylate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CC(C(=O)OC1CC(C)(C)NC(C)(C)C1)C(C(=O)OC1CC(C)(C)NC(C)(C)C1)CC(=O)OC1CC(C)(C)NC(C)(C)C1 NZNAAUDJKMURFU-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- DXNCZXXFRKPEPY-UHFFFAOYSA-N tridecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCC(O)=O DXNCZXXFRKPEPY-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical group 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/36—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino acids, polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/005—Stabilisers against oxidation, heat, light, ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
- C08K5/053—Polyhydroxylic alcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
- C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
- Y10T428/139—Open-ended, self-supporting conduit, cylinder, or tube-type article
Definitions
- the present invention relates to the field of molded and extruded thermoplastic articles having improved long-term high temperature aging characteristics.
- High temperature resins based on polyamides possess desirable chemical resistance, processability and heat resistance. This makes them particularly well suited for demanding high performance applications including automotive and electrical/electronics applications.
- the mechanical properties generally tend to decrease due to the thermo-oxidation of the polymer. This phenomenon is called heat aging.
- heat stabilizers also referred as antioxidants
- examples of such heat stabilizers include hindered phenol antioxidants, amine antioxidants and phosphorus-based antioxidants.
- heat stabilizers include hindered phenol antioxidants, amine antioxidants and phosphorus-based antioxidants.
- polyamide compositions three types of heat stabilizers are conventionally used to retain the mechanical properties of the composition upon exposure to high temperatures.
- phenolic antioxidants optionally combined with a phosphorus based synergist as previously mentioned
- aromatic amines optionally combined with a phosphorus based synergist
- the third one is the use of copper salts and derivatives.
- Phenolic antioxidants are known to improve the mechanical/physical properties of the thermoplastic composition up to an aging temperature of 120° C.
- EP 1041109 discloses a polyamide composition
- a polyamide composition comprising a polyamide resin, a polyhydric alcohol having a melting point of 150 to 280° C., that has good fluidity and mechanical strength and is useful in injection welding techniques.
- Another problem is the heat ageing performance of polyamide compositions that generally have low levels of reinforcing agents or none at all. Since unreinforced compositions are generally used in applications that require some flexibility; an important attribute of unreinforced thermoplastics is the retention of strain at break upon heat ageing.
- thermoplastic article comprising a polyamide composition comprising
- high-temperature means a temperature of 150° C.
- long-term refers to an aging period equal or longer than 1000 hours (h).
- a polyamide composition, or a molded or extruded article therefrom is deemed to have “high heat stability” when 4 mm test specimens, as disclosed herein, when aged in an oven at an test temperature of 150° C. for a test period of 1000 h, in an atmosphere of air, and tested according to ISO 527-2/1A, have, on average, a retention of strain at break of greater than 80 percent, as compared with a control exposed at said test temperature for 72 h.
- the control herein is identical in composition and shape to that of the 2 mm test bar.
- (meth)acrylate is meant to include acrylate esters and methacrylate esters.
- the polyamide resin used in the present invention has a melting point and/or glass transition.
- melting points and glass transitions are as determined with differential scanning calorimetry (DSC) at a scan rate of 10° C./min in the first heating scan, wherein the melting point is taken at the maximum of the endothermic peak and the glass transition, if evident, is considered the mid-point of the change in enthalpy.
- Polyamides are condensation products of one or more dicarboxylic acids and one or more diamines, and/or one or more aminocarboxylic acids, and/or ring-opening polymerization products of one or more cyclic lactams. Suitable cyclic lactams are caprolactam and laurolactam. Polyamides may be fully aliphatic or semi-aromatic.
- Fully aliphatic polyamides used in the resin composition of the present invention are formed from aliphatic and alicyclic monomers such as diamines, dicarboxylic acids, lactams, aminocarboxylic acids, and their reactive equivalents.
- a suitable aminocarboxylic acid is 11-aminododecanoic acid.
- Suitable lactams are caprolactam and laurolactam.
- the term “fully aliphatic polyamide” also refers to copolymers derived from two or more such monomers and blends of two or more fully aliphatic polyamides. Linear, branched, and cyclic monomers may be used.
- Carboxylic acid monomers comprised in the fully aliphatic polyamides include, but are not limited to aliphatic carboxylic acids, such as for example adipic acid (C6), pimelic acid (C7), suberic acid (C8), azelaic acid (C9), decanedioic acid (C10), dodecanedioic acid (C12), tridecanedioic acid (C13), tetradecanedioic acid (C14), and pentadecanedioic acid (C15).
- aliphatic carboxylic acids such as for example adipic acid (C6), pimelic acid (C7), suberic acid (C8), azelaic acid (C9), decanedioic acid (C10), dodecanedioic acid (C12), tridecanedioic acid (C13), tetradecanedioic acid (C14), and pentadecanedi
- Diamines can be chosen among diamines having four or more carbon atoms, including, but not limited to tetramethylene diamine, hexamethylene diamine, octamethylene diamine, decamethylene diamine, dodecamethylene diamine, 2-methylpentamethylene diamine, 2-ethyltetramethylene diamine, 2-methyloctamethylenediamine; trimethylhexamethylenediamine, meta-xylylene diamine, and/or mixtures thereof.
- the semi-aromatic polyamide is a homopolymer, a copolymer, a terpolymer or more advanced polymers formed from monomers containing aromatic groups.
- One or more aromatic carboxylic acids may be terephthalate or a mixture of terephthalate with one or more other carboxylic acids, such as isophthalic acid, phthalic acid, 2-methyl terephthalic acid and naphthalic acid.
- the one or more aromatic carboxylic acids may be mixed with one or more aliphatic dicarboxylic acids, as disclosed above.
- an aromatic diamine such as meta-xylylene diamine (MXD) can be used to provide a semi-aromatic polyamide, an example of which is MXD6, a homopolymer comprising MXD and adipic acid.
- MXD meta-xylylene diamine
- Preferred polyamides disclosed herein are homopolymers or copolymers wherein the term copolymer refers to polyamides that have two or more amide and/or diamide molecular repeat units.
- the homopolymers and copolymers are identified by their respective repeat units.
- the repeat units are listed in decreasing order of mole % repeat units present in the copolymer. The following list exemplifies the abbreviations used to identify monomers and repeat units in the homopolymer and copolymer polyamides (PA):
- the term “6” when used alone designates a polymer repeat unit formed from -caprolactam.
- the “6” when used in combination with a diacid such as T, for instance 6T, the “6” refers to HMD.
- the diamine In repeat units comprising a diamine and diacid, the diamine is designated first.
- the first “6” refers to the diamine HMD, and the second “6” refers to adipic acid.
- repeat units derived from other amino acids or lactams are designated as single numbers designating the number of carbon atoms.
- Polyamides may have semiaromatic repeat units to the extent that the melting point is less than 210° C. and generally the semiaromatic polyamides of the group have less than 40 mole percent semiaromatic repeat units.
- Semiaromatic repeat units are defined as those derived from monomers selected from one or more of the group consisting of: aromatic dicarboxylic acids having 8 to 20 carbon atoms and aliphatic diamines having 4 to 20 carbon atoms.
- One embodiment is a molded or extruded thermoplastic article wherein said polyamide resin is selected from Group (I) Polyamides and wherein said test temperature is at least 150° C. for a test period of at least 1000 hours and said retention of strain is greater than 80%.
- said polyamide resin is selected from Group (I) Polyamides and wherein said test temperature is at least 150° C. for a test period of at least 1000 hours and said retention of strain is greater than 80%.
- One embodiment is a molded or extruded thermoplastic article wherein said polyamide resin is selected from Group (II) Polyamides and wherein said test temperature is at least 150° C. for a test period of at least 1000 hours and said retention of strain is greater than 80%.
- said polyamide resin is selected from Group (II) Polyamides and wherein said test temperature is at least 150° C. for a test period of at least 1000 hours and said retention of strain is greater than 80%.
- polyamide resin is selected from Group (III)
- Polyamides are selected from the group consisting of poly(tetramethylene hexanediamide/tetramethylene terephthalamide) (PA46/4T), poly(tetramethylene hexanediamide/hexamethylene terephthalamide) (PA46/6T), poly(tetramethylene hexanediamide/2-methylpentamethylene hexanediamide/decamethylene terephthalamide)_PA46/D6/10T), poly(hexamethylene hexanediamide/hexamethylene terephthalamide) (PA66/6T), poly(hexamethylene hexanediamide/hexamethylene isophthalamide/hexamethylene terephthalamide PA66/6I/6T, and poly(hexamethylene hexanediamide/2-methylpentamethylene hexanediamide/hexamethylene terephthalamide
- polyamide resin is selected from Group (IV) Polyamides selected from the group consisting of poly(tetramethylene terephthalamide/hexamethylene hexanediamide) (PA4T/66), poly(tetramethylene terephthalamide/ ⁇ -caprolactam) (PA4T/6), poly(tetramethylene terephthalamide/hexamethylene dodecanediamide) (PA4T/612), poly(tetramethylene terephthalamide/2-methylpentamethylene hexanediamide/hexamethylene hexanediamide) (PA4T/D6/66), poly(hexaamethylene terephthalamide/2-methylpentamethylene terephthalamide/hexamethylene hexanediamide) (PA6T/DT/66), poly(hexamethylene terephthalamide/hexamethylene hexanediamide) PA6T/66, poly(hexamethylene terephthalamide/hexamethylene hexan
- polyamide resin is selected from Group (V) Polyamides selected from the group consisting of poly(tetramethylene terephthalamide/2-methylpentamethylene terephthalamide) PA4T/DT, poly(tetramethylene terephthalamide/hexamethylene terephthalamide) PA4T/6T, poly(tetramethylene terephthalamide/decamethylene terephthalamide) PA4T/10T, poly(tetramethylene terephthalamide/dodecamethylene terephthalamide)PA4T/12T, poly(tetramethylene terephthalamide/2-methylpentamethylene terephthalamide/hexamethylene terephthalamide) (PA4T/DT/6T), poly(tetramethylene terephthalamide/hexamethylene terephthalamide/2-methylpentamethylene terephthalamide) (PA4T/6T/DT), poly(hexamethylene terephthalamide resin is selected from Group (V) Polyamides selected from the group consisting
- the polyamide is a Group (III) Polyamide, Group (IV) Polyamide, Group (V) Polyamide or Group (VI) Polyamide, respectively.
- the polyamides may also be blends of two or more polyamides.
- Preferred blends include those selected from the group consisting of Group (I) and Group (II) Polyamides; Group (I) and (III) Polyamide, Group (I) and Group (VI) Polyamides, Group (II) and Group (III) Polyamides, Group (II) and Group (IV) Polyamides, Group (II) and Group (V) Polyamides, Group (II) and Group (VI) Polyamides, Group (III) and Group (VI) Polyamides, and Group (IV) and Group (V) Polyamides.
- a preferred blend includes Group (II) and Group (V) Polyamides, and a specific preferred blend includes poly(hexamethylene hexanediamide) (PA 66) and poly(hexamethylene terephthalamide/2-methylpentamethylene terephthalamide) (PA 6T/DT).
- Another preferred blend includes Group (II) and Group (III) Polyamides and a specific preferred blend includes poly( ⁇ -caprolactam) (PA6) and poly(hexamethylene hexanediamide/hexamethylene terephthalamide (PA66/6T).
- PA6 poly( ⁇ -caprolactam)
- PA66/6T poly(hexamethylene hexanediamide/hexamethylene terephthalamide
- the molded or extruded thermoplastic article comprises 0.1 to 10 weight percent of one or more polyhydric alcohols having more than two hydroxyl groups and having a number average molecular weight (M n ) of less than 2000 as determined for polymeric materials with gel permeation chromatography (GPC).
- M n number average molecular weight
- Polyhydric alcohols may be selected from aliphatic hydroxylic compounds containing more than two hydroxyl groups, aliphatic-cycloaliphatic compounds containing more than two hydroxyl groups, cycloaliphatic compounds containing more than two hydroxyl groups, aromatic and saccharides.
- An aliphatic chain in the polyhydric alcohol can include not only carbon atoms but also one or more hetero atoms which may be selected, for example, from nitrogen, oxygen and sulphur atoms.
- a cycloaliphatic ring present in the polyhydric alcohol can be monocyclic or part of a bicyclic or polycyclic ring system and may be carbocyclic or heterocyclic.
- a heterocyclic ring present in the polyhydric alcohol can be monocyclic or part of a bicyclic or polycyclic ring system and may include one or more hetero atoms which may be selected, for example, from nitrogen, oxygen and sulphur atoms.
- the one or more polyhydric alcohols may contain one or more substituents, such as ether, carboxylic acid, carboxylic acid amide or carboxylic acid ester groups.
- polyhydric alcohol containing more than two hydroxyl groups include, without limitation, triols, such as glycerol, trimethylolpropane, 2,3-di-(2′-hydroxyethyl)-cyclohexan-1-ol, hexane-1,2,6-triol, 1,1,1-tris-(hydroxymethyl)ethane, 3-(2′-hydroxyethoxy)-propane-1,2-diol, 3-(2′-hydroxypropoxy)-propane-1,2-diol, 2-(2′-hydroxyethoxy)-hexane-1,2-diol, 6-(2′-hydroxypropoxy)-hexane-1,2-diol, 1,1,1-tris-[(2′-hydroxyethoxy)-methyl]-ethane, 1,1,1-tris-[(2′-hydroxypropoxy)-methyl]-propane, 1,1,1-tris-(4′-hydroxyphenyl)-ethane, 1,1,1,
- Preferred polyhydric alcohols include those having a pair of hydroxyl groups which are attached to respective carbon atoms which are separated one from another by at least one atom.
- Especially preferred polyhydric alcohols are those in which a pair of hydroxyl groups is attached to respective carbon atoms which are separated one from another by a single carbon atom.
- the polyhydric alcohol used in the thermoplastic composition is pentaerythritol, dipentaerythritol, tripentaerythritol, di-trimethylolpropane, D-mannitol, D-sorbitol and xylitol. More preferably, the polyhydric alcohol used is dipentaerythritol and/or tripentaerythritol. A most preferred polyhydric alcohol is dipentaerythritol.
- the content of said polyhydric alcohol in the thermoplastic composition is 0.1 to less than 10 weight percent, preferably 0.25-8 weight percent, more preferably 0.25-5 weight percent and most preferably 1-4 weight percent; based on the total weight of said thermoplastic composition.
- the molded or extruded thermoplastic article comprises less than 10 weight percent, preferably 5 weight percent % or less of one or more reinforcement agents.
- the molded or extruded thermoplastic article includes no reinforcement agent.
- a reinforcement agent may be any filler, but is preferably selected from the group consisting calcium carbonate, glass fibers with circular and noncircular cross-section, glass flakes, glass beads, carbon fibers, talc, mica, wollastonite, calcined clay, kaolin, diatomite, magnesium sulfate, magnesium silicate, barium sulfate, titanium dioxide, sodium aluminum carbonate, barium ferrite, potassium titanate and mixtures thereof.
- the molded or extruded thermoplastic article may further comprise 0 to 50 weight percent of a polymeric toughener comprising a reactive functional group and/or a metal salt of a carboxylic acid.
- the molded or extruded thermoplastic article comprises 2 to 20 weight percent polymeric toughener selected from the group consisting of: a copolymer of ethylene, glycidyl(meth)acrylate, and optionally one or more (meth)acrylate esters; an ethylene/ ⁇ -olefin or ethylene/ ⁇ -olefin/diene copolymer grafted with an unsaturated carboxylic anhydride; a copolymer of ethylene, 2-isocyanatoethyl(meth)acrylate, and optionally one or more (meth)acrylate esters; and a copolymer of ethylene and acrylic acid reacted with a Zn, Li, Mg or Mn compound to form the corresponding ionomer.
- the molded or extruded thermoplastic article comprises 0 to 3 weight percent of a co-stabilizer that is useful in combination with the polyhdric alcohol, in affecting the long-term heat stability of article.
- a co-stabilizer that is useful in combination with the polyhdric alcohol, in affecting the long-term heat stability of article.
- Preferred co-stabilizers have a 10% weight loss temperature, as determined by TGA, of greater than 30° C. below said melting point of said polyamide if said melting point is present, or at least 250° C. if said melting point is not present; and said co-stabilizers are selected from the group consisting of secondary aryl amines, hindered amine light stabilizers, and mixtures thereof.
- TGA weight loss will be determined according to ASTM D 3850-94, using a heating rate of 10° C./min, in air purge stream, with an appropriate flow rate of 0.8 mL/second.
- the co-stabilizer preferably has a 10% weight loss temperature, as determined by TGA, of at least 270° C., and more preferably 290° C., 320° C., and 340° C., and most preferably at least 350° C.
- the one or more co-stabilizers preferably are present from at or about 0.1 to 3 weight percent, and more preferably at or about 0.1 to at or about 1 weight percent, or more preferably from at or about 0.1 to at or about 0.7 weight percent, based on the total weight of the polyamide composition.
- Secondary aryl amines useful in the invention are high molecular weight organic compound having low volatility.
- the high molecular weight organic compound will be selected from the group consisting of secondary aryl amines further characterized as having a molecular weight of at least 260 g/mol and preferably at least 350 g/mol, together with a 10% weight loss temperature as determined by TGA of at least 290° C., preferably at least 300° C., 320° C., 340° C., and most preferably at least 350° C.
- secondary aryl amine an amine compound that contains two carbon radicals chemically bound to a nitrogen atom where at least one, and preferably both carbon radicals, are aromatic.
- aromatic substituents such as, for example, a phenyl, naphthyl or heteroaromatic group, is substituted with at least one substituent, preferably containing 1 to about 20 carbon atoms.
- suitable secondary aryl amines include 4,4′di( ⁇ , ⁇ -dimethylbenzyl)diphenylamine available commercially as Naugard 445 from Uniroyal Chemical Company, Middlebury, Conn.; the secondary aryl amine condensation product of the reaction of diphenylamine with acetone, available commercially as Aminox from Uniroyal Chemical Company; and para-(paratoluenesulfonylamido)diphenylamine also available from Uniroyal Chemical Company as Naugard SA.
- Other suitable secondary aryl amines include N,N ⁇ -di-(2-naphthyl)-p-phenylenediamine, available from ICI Rubber Chemicals, Calcutta, India.
- Suitable secondary aryl amines include 4,4′-bis( ⁇ , ⁇ ′-tertiaryoctyl)diphenylamine, 4,4′-bis( ⁇ -methylbenzhydryl)diphenylamine, and others from EP 0509282 B1.
- the molded or extruded thermoplastic article may have at least one co-stabilizer selected from one or more secondary aryl amines.
- the one or more secondary aryl amines is present at about 0.25 to 1.0 weight percent and more preferably 0.25 to about 0.9 weight percent, based on the total weight of the polyamide composition.
- HALS hindered amine light stabilizers
- HALS are compounds of the following general formulas and combinations thereof:
- R 1 up to and including R 5 are independent substituents.
- suitable substituents are hydrogen, ether groups, ester groups, amine groups, amide groups, alkyl groups, alkenyl groups, alkynyl groups, aralkyl groups, cycloalkyl groups and aryl groups, in which the substituents in turn may contain functional groups; examples of functional groups are alcohols, ketones, anhydrides, imines, siloxanes, ethers, carboxyl groups, aldehydes, esters, amides, imides, amines, nitriles, ethers, urethanes and any combination thereof.
- a hindered amine light stabilizer may also form part of a polymer or oligomer.
- the HALS is a compound derived from a substituted piperidine compound, in particular any compound derived from an alkyl-substituted piperidyl, piperidinyl or piperazinone compound, and substituted alkoxypiperidinyl compounds.
- Examples of such compounds are: 2,2,6,6-tetramethyl-4-piperidone; 2,2,6,6-tetrametyl-4-piperidinol; bis-(1,2,2,6,6-pentamethyl piperidyl)-(3′,5′-di-tert-butyl-4′-hydroxybenzyl)butylmalonate; di-(2,2,6,6-tetramethyl-4-piperidyl)sebacate (Tinuvin® 770, MW 481); oligomer of N-(2-hydroxyethyl)-2,2,6,6-tetramethyl-4-piperidinol and succinic acid (Tinuvin® 622); oligomer of cyanuric acid and N,N-di(2,2,6,6-tetramethyl-4-piperidyl)-hexamethylene diamine; bis-(2,2,6,6-tetramethyl-4-piperidinyl)succinate; bis-(1-octyloxy-2,2,6,
- Tinuvin® and Chimassorb® materials are available from Ciba Specialty Chemicals; Cyasorb® materials are available from Cytec Technology Corp.; Uvasil® materials are available from Great Lakes Chemical Corp.; Saduvor®, Hostavin®, and Nylostab® materials are available from Clariant Corp.; Uvinul® materials are available from BASF; Uvasorb® materials are available from Partecipazioni Industriali; and Good-rite® materials are available from B.F. Goodrich Co. Mark® materials are available from Asahi Denka Co.
- Preferred HALS include high-molecular weight oligomeric or polymeric HALS having a molecular weight of more than about 1000, and preferably more than about 2000.
- HALS are selected from the group consisting or di-(2,2,6,6-tetramethyl-4-piperidyl)sebacate (Tinuvin® 770, MW 481) Nylostab® S-EED (Clariant Huningue S.
- the molded or extruded thermoplastic article may have at least one co-stabilizer selected from one or more HALS.
- the one or more HALS is present at about 0.25 to 1.0 weight percent and more preferably 0.25 to about 0.9 weight percent, based on the total weight of the polyamide composition.
- a preferred embodiment comprises at least two co-stabilizers, at least one selected from the secondary aryl amines; and at least one selected from the group of HALS, as disclosed above, wherein the total weight percent of the mixture of co-stabilizers is at least 0.5 weight percent, and preferably at least 0.9 weight percent.
- the polyamide composition may also comprise other additives commonly used in the art, such as other heat stabilizers or antioxidants, antistatic agents, blowing agents, lubricants, plasticizers, and colorant and pigments.
- additives commonly used in the art, such as other heat stabilizers or antioxidants, antistatic agents, blowing agents, lubricants, plasticizers, and colorant and pigments.
- heat stabilizers include copper stabilizers and hindered phenols, and mixtures thereof.
- thermoplastic articles of the invention A significant advantage of the molded or extruded thermoplastic articles of the invention is that high thermal stability, as measured under AOA conditions disclosed herein, is provided without the use of conventional copper heat stabilizers. Copper heat stabilizers tend to act as corrosive agents over long periods of time at elevated temperatures; and in some environments actually cause degradation of semiaromatic polymers.
- another embodiment is molded or extruded thermoplastic article wherein said polyamide composition comprises less than 25 ppm copper as determined with atomic absorption spectroscopy.
- the polyamide composition may comprise plasticizers.
- a plasticizer will preferably be miscible with the polyamide.
- suitable plasticizers include sulfonamides, preferably aromatic sulfonamides such as benzenesulfonamides and toluenesulfonamides.
- Suitable sulfonamides include N-alkyl benzenesulfonamides and toluenesufonamides, such as N-butylbenzenesulfonamide, N-(2-hydroxypropyl)benzenesulfonamide, N-ethyl-o-toluenesulfonamide, N-ethyl-p-toluenesulfonamide, o-toluenesulfonamide, p-toluenesulfonamide, and the like.
- Preferred are N-butylbenzenesulfonamide, N-ethyl-o-toluenesulfonamide, and N-ethyl-p-toluenesulfonamide.
- the plasticizer may be incorporated into the composition by melt-blending the polymer with plasticizer and, optionally, other ingredients, or during polymerization. If the plasticizer is incorporated during polymerization, the polyamide monomers are blended with one or more plasticizers prior to starting the polymerization cycle and the blend is introduced to the polymerization reactor. Alternatively, the plasticizer can be added to the reactor during the polymerization cycle.
- the polyamide composition contains no more than 5 weight percent of plasticizer.
- thermoplastic composition is a mixture by melt-blending, in which all polymeric ingredients are adequately mixed, and all non-polymeric ingredients are adequately dispersed in a polymer matrix.
- Any melt-blending method may be used for mixing polymeric ingredients and non-polymeric ingredients of the present invention.
- polymeric ingredients and non-polymeric ingredients may be fed into a melt mixer, such as single screw extruder or twin screw extruder, agitator, single screw or twin screw kneader, or Banbury mixer, and the addition step may be addition of all ingredients at once or gradual addition in batches.
- thermoplastic composition having a polyhydric alcohol having two or more hydroxyl groups is useful in increasing long-term thermal stability at high temperatures of molded or extruded articles made therefrom.
- the long-term thermal stability of the articles can be assessed by air oven ageing (AOA) of 4 mm thick test samples at various test temperatures for various test periods of time.
- the test temperature for the composition disclosed herein is at 150° C. and for about 1000 hours test period.
- the term “at 150° C.” refers to the nominal temperature of the environment to which the test bars are exposed; with the understanding that the actual temperature may vary by ⁇ 2° C. from the nominal test temperature.
- test samples after air oven ageing, are tested for tensile strength and strain at break, according to ISO 527-2/1A test method; and compared with a control aged at said test temperature for 72 hours. Ageing the control at the test temperature for 72 hours may allow crystallization to equilibrate in the molded test specimens, and thus may allow more reliable measure of AOA performance. The comparison with the controls provides the retention of strain at break, and thus the various compositions can be assessed as to long-term high temperature ageing performance.
- the molded 4 mm test specimens of polyamide composition as disclosed herein, have a retention of strain at break of at least 80% after AOA at 150° C. for 1000 hours and preferably at least 90%, based upon comparison with controls exposed at said test temperature for 72 hours.
- the molded 4 mm test specimens of polyamide composition as disclosed herein, have a retention of strain at break of at least 50% after AOA at 150° C. for about 2000 hours and preferably at least 75%, based upon comparison with controls exposed at said test temperature for 72 hours
- the present invention relates a use of the above disclosed thermoplastic compositions for high temperature applications.
- the present invention relates to a method for manufacturing an article by shaping the thermoplastic composition of the invention.
- articles are films or laminates, automotive parts or engine parts or electrical/electronics parts.
- shaping it is meant any shaping technique, such as for example extrusion, injection moulding, thermoform moulding, compression moulding or blow moulding.
- the article is shaped by injection moulding or blow moulding.
- the molded or extruded thermoplastic articles disclosed herein may have application in automotive and other components that meet one or more of the following requirements: high chemical resistance to polar chemicals such as such as zinc chloride and calcium chloride, high impact requirements; resistance to high temperature; resistance to oil and fuel environment; resistance to chemical agents such as coolants; low permeability to fuels and gases, e.g. carbon dioxide.
- Specific extruded or molded thermoplastic articles are selected from the group consisting of pipes for transporting liquids and gases, inner linings for pipes, fuel lines, air break tubes, coolant pipes, air ducts, pneumatic tubes, hydraulic houses, cable covers, cable ties, connectors, canisters, and push-pull cables.
- Examples 1-3 and comparative examples C-1-C-3 were prepared by melt blending the ingredients listed in the Table in a Buss 55 mm extruder, operating at about 230° C. for PA1010 compositions and 250° C. for PA612 compositions, using a screw speed of about 180 rpm, and a throughput of 100 kg/hour. Ingredient quantities shown in the Table are given in weight percent on the basis of the total weight of the thermoplastic composition.
- the compounded mixture was extruded in the form of laces or strands, cooled in a water bath, chopped into granules and placed into sealed aluminum lined bags in order to prevent moisture pick up.
- the cooling and cutting conditions were adjusted to ensure that the materials were kept below 0.15 wt % of moisture level.
- the thickness of the test specimens was 4 mm and a width of 10 mm according to ISO 527/1A at a testing speed of 50 mm/min (tensile strength and elongation). Tensile Modulus was measured at 50 mm/min.
- test specimens were heat aged in a re-circulating air ovens (Heraeus type UT6060) according to the procedure detailed in ISO 2578. At various heat aging times, the test specimens were removed from the oven, allowed to cool to room temperature and sealed into aluminum lined bags until ready for testing. The tensile mechanical properties were then measured according to ISO 527 using a Zwick tensile instrument. The average values obtained from 5 specimens are given in the Table.
- Retention of strain at break corresponds to the percentage of the strain at break at 1008 hours and 2328 hours heat ageing in comparison with the value of specimens after heat aging for 72 hours considered as being 100%.
- PA612 is Zytel® 158 NC010 resin, having a melting point of about 218° C., available from E. I. du Pont de Nemours and Company, Wilmington, Del.
- PA1010 is Herox® polyamide resin available from E. I. du Pont de Nemours and Company, Wilmington, Del.
- Surlyn®9320 copolymer refers to an ethylene/methacrylic acid copolymer, zinc neutralized, available from E.I. DuPont de Nemours and Company, Wilmington, Del., USA.
- Elvaloy EP4934-4 refers to an ethylene/glycidyl methacrylate copolymer available from E.I. DuPont de Nemours and Company, Wilmington, Del., USA.
- Colloids PE 48/93 refers to a carbon black dispersed in polyethylene available from Colloids Limited.
- DPE refers to dipentaerythritol that was from Perstorp Speciality Chemicals AB, Perstorp, Sweden as Di-Penta 93.
- Cu heat stabilizer refers to a mixture of 7 parts of potassium iodide and 1 part of copper iodide in 0.5 part of a stearate wax binder.
- Irgafos® 168 stabilizer is a heat stabilizer available Ciba Speciality Chemicals Inc, Switzerland.
- Irganox® 1098 stabilizer was available from Ciba Speciality Chemicals Inc, Switzerland.
- Chimassorb® 944 refers to (poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-1,3,5-triazine-2,4-diyl][(2,2,6,6-tetramethyl-4-piperidinyl)-imino]-1,6-hexanediyl[(2,2,6,6-tetramethyl-4-piperidinyl)imino]]), supplied by Ciba Specialty Chemicals.
- Tinuvin® 234 refers to a HALS available from Ciba Specialty Chemicals.
- Unreinforced PA 612 compositions of Examples 3 with DPE and Comparative Example C-3 without DPE are listed in Table 1.
- Tensile properties after AOA at 150° C. at 72 h, 1008 h, and 2328 h, and % retention of strain at break are listed in Table 1.
- the example showed greater than 80% retention of strain at break, after 1008 hours AOA at 150° C., as compared to the 72 h AOA control. These results are significantly better than the comparative examples having no DPE present.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Proteomics, Peptides & Aminoacids (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyamides (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Rigid Pipes And Flexible Pipes (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Abstract
Disclosed is a molded or extruded thermoplastic article including a polyamide composition including (a) a polyamide resin (b) 0.1 to 10 weight percent of one or more polyhydric alcohols (c) 0 to 3 weight percent of a co-stabilizer selected from the group consisting of secondary aryl amines, hindered amine light stabilizers, and mixtures thereof; (d) 0 to less than 10 weight percent of one or more reinforcement agents; and (e) 0 to 50 weight percent polymeric toughener including a reactive functional group and/or a metal salt of a carboxylic acid; and wherein 4 mm test bars prepared from the polyamide composition, and exposed at an test temperature of 150° C. for a test period of about 1000 hours, have, on average, a retention of strain at break of greater than 80 percent compared with a control exposed at the said test temperature for 72 hours.
Description
- This application claims the benefit of priority of U.S. Provisional Application No. 61/137,345, filed on 30 Jul. 2008 and currently pending.
- The present invention relates to the field of molded and extruded thermoplastic articles having improved long-term high temperature aging characteristics.
- High temperature resins based on polyamides possess desirable chemical resistance, processability and heat resistance. This makes them particularly well suited for demanding high performance applications including automotive and electrical/electronics applications. There is a current and general desire in the automotive field to have high temperature resistant structures since temperatures higher than 150° C., even higher than 200° C., are often reached in underhood areas of automobiles. When plastic parts are exposed to such high temperatures for a prolonged period, such as in automotive under-the-hood applications or in electrical/electronics applications, the mechanical properties generally tend to decrease due to the thermo-oxidation of the polymer. This phenomenon is called heat aging.
- In an attempt to improve heat aging characteristics, it has been the conventional practice to add heat stabilizers (also referred as antioxidants) to thermoplastic compositions comprising polyamide resins. Examples of such heat stabilizers include hindered phenol antioxidants, amine antioxidants and phosphorus-based antioxidants. For polyamide compositions, three types of heat stabilizers are conventionally used to retain the mechanical properties of the composition upon exposure to high temperatures. One is the use of phenolic antioxidants optionally combined with a phosphorus based synergist as previously mentioned, the use of aromatic amines optionally combined with a phosphorus based synergist and the third one is the use of copper salts and derivatives. Phenolic antioxidants are known to improve the mechanical/physical properties of the thermoplastic composition up to an aging temperature of 120° C.
- Existing technologies lead not only to a poor improvement of long-term heat aging resistance, but also the improved heat aging characteristics are insufficient for more demanding applications involving exposure to higher temperatures such as for example in automotive under-the-hood applications and in electrical/electronics applications.
- EP 1041109 discloses a polyamide composition comprising a polyamide resin, a polyhydric alcohol having a melting point of 150 to 280° C., that has good fluidity and mechanical strength and is useful in injection welding techniques.
- Another problem is the heat ageing performance of polyamide compositions that generally have low levels of reinforcing agents or none at all. Since unreinforced compositions are generally used in applications that require some flexibility; an important attribute of unreinforced thermoplastics is the retention of strain at break upon heat ageing.
- Unfortunately, with existing technologies, molded articles based on flexible polyamide compositions having low levels of reinforcing agent, or none at all, either suffer from an unacceptable deterioration of their mechanical properties upon long-term high temperature exposure or they are very expensive due to the use of high-cost heat stabilizers.
- There remains a need for low-cost polyamide compositions that are suitable for manufacturing articles and that exhibit good mechanical properties against long-term high temperature exposure.
- Disclosed is a molded or extruded thermoplastic article, comprising a polyamide composition comprising
-
- a) a polyamide resin having a melting point and/or glass transition;
- b) 0.1 to 10 weight percent of one or more polyhydric alcohols having more than two hydroxyl groups and having a number average molecular weight (Mn) of less than 2000;
- c) 0 to 3 weight percent of a co-stabilizer, having a 10% weight loss temperature, as determined by thermogravimetric analysis (TGA), of greater than 30° C. below said melting point of said polyamide if said melting point is present, or at least 250° C. if said melting point is not present; said co-stabilizer selected from the group consisting of secondary aryl amines, hindered amine light stabilizers, and mixtures thereof;
- d) 0 to less than 10 weight percent of one or more reinforcement agents; and
- e) 0 to 50 weight percent polymeric toughener comprising a reactive functional group and/or a metal salt of a carboxylic acid; and
wherein 4 mm test bars prepared from said polyamide composition, and exposed at an test temperature of 150° C. for a test period of about 1000 hours, in an atmosphere of air, and tested according to ISO 527-2/1A, have, on average, a retention of strain at break of greater than 80 percent, as compared with a control exposed at said test temperature for 72 hours; and with the proviso that the polyamide composition contains not more than 5 weight percent of a plasticizer; and, independently, with the further proviso that when said polyamide resin is selected from only a single polyamide having said melting point of at least 260° C., comprising greater than 95 mole percent semiaromatic repeat units derived from monomers selected from the group consisting of: one or more aromatic dicarboxylic acid(s) having 8 to 20 carbon atoms and one or more aliphatic diamine(s) having 4 to 20 carbon atoms; said aliphatic diamine(s) comprise less than 50 mole percent 2-methyl-1,5-pentanediamine.
- For the purposes of the description, unless otherwise specified, “high-temperature” means a temperature of 150° C.
- In the present invention, unless otherwise specified, “long-term” refers to an aging period equal or longer than 1000 hours (h).
- A polyamide composition, or a molded or extruded article therefrom, is deemed to have “high heat stability” when 4 mm test specimens, as disclosed herein, when aged in an oven at an test temperature of 150° C. for a test period of 1000 h, in an atmosphere of air, and tested according to ISO 527-2/1A, have, on average, a retention of strain at break of greater than 80 percent, as compared with a control exposed at said test temperature for 72 h. The control herein is identical in composition and shape to that of the 2 mm test bar.
- The term “(meth)acrylate” is meant to include acrylate esters and methacrylate esters.
- The polyamide resin used in the present invention has a melting point and/or glass transition. Herein melting points and glass transitions are as determined with differential scanning calorimetry (DSC) at a scan rate of 10° C./min in the first heating scan, wherein the melting point is taken at the maximum of the endothermic peak and the glass transition, if evident, is considered the mid-point of the change in enthalpy.
- Polyamides are condensation products of one or more dicarboxylic acids and one or more diamines, and/or one or more aminocarboxylic acids, and/or ring-opening polymerization products of one or more cyclic lactams. Suitable cyclic lactams are caprolactam and laurolactam. Polyamides may be fully aliphatic or semi-aromatic.
- Fully aliphatic polyamides used in the resin composition of the present invention are formed from aliphatic and alicyclic monomers such as diamines, dicarboxylic acids, lactams, aminocarboxylic acids, and their reactive equivalents. A suitable aminocarboxylic acid is 11-aminododecanoic acid. Suitable lactams are caprolactam and laurolactam. In the context of this invention, the term “fully aliphatic polyamide” also refers to copolymers derived from two or more such monomers and blends of two or more fully aliphatic polyamides. Linear, branched, and cyclic monomers may be used.
- Carboxylic acid monomers comprised in the fully aliphatic polyamides include, but are not limited to aliphatic carboxylic acids, such as for example adipic acid (C6), pimelic acid (C7), suberic acid (C8), azelaic acid (C9), decanedioic acid (C10), dodecanedioic acid (C12), tridecanedioic acid (C13), tetradecanedioic acid (C14), and pentadecanedioic acid (C15). Diamines can be chosen among diamines having four or more carbon atoms, including, but not limited to tetramethylene diamine, hexamethylene diamine, octamethylene diamine, decamethylene diamine, dodecamethylene diamine, 2-methylpentamethylene diamine, 2-ethyltetramethylene diamine, 2-methyloctamethylenediamine; trimethylhexamethylenediamine, meta-xylylene diamine, and/or mixtures thereof.
- The semi-aromatic polyamide is a homopolymer, a copolymer, a terpolymer or more advanced polymers formed from monomers containing aromatic groups. One or more aromatic carboxylic acids may be terephthalate or a mixture of terephthalate with one or more other carboxylic acids, such as isophthalic acid, phthalic acid, 2-methyl terephthalic acid and naphthalic acid. In addition, the one or more aromatic carboxylic acids may be mixed with one or more aliphatic dicarboxylic acids, as disclosed above. Alternatively, an aromatic diamine such as meta-xylylene diamine (MXD) can be used to provide a semi-aromatic polyamide, an example of which is MXD6, a homopolymer comprising MXD and adipic acid.
- Preferred polyamides disclosed herein are homopolymers or copolymers wherein the term copolymer refers to polyamides that have two or more amide and/or diamide molecular repeat units. The homopolymers and copolymers are identified by their respective repeat units. For copolymers disclosed herein, the repeat units are listed in decreasing order of mole % repeat units present in the copolymer. The following list exemplifies the abbreviations used to identify monomers and repeat units in the homopolymer and copolymer polyamides (PA):
- HMD hexamethylene diamine (or 6 when used in combination with a diacid)
- T Terephthalic acid
- AA Adipic acid
- DMD Decamethylenediamine
- 6 -Caprolactam
- DDA Decanedioic acid
- DDDA Dodecanedioic acid
- I Isophthalic acid
- MXD meta-xylylene diamine
- TMD 1,4-tetramethylene diamine
- 4T polymer repeat unit formed from TMD and T
- 6T polymer repeat unit formed from HMD and T
- DT polymer repeat unit formed from 2-MPMD and T
- MXD6 polymer repeat unit formed from MXD and AA
- 66 polymer repeat unit formed from HMD and AA
- 10T polymer repeat unit formed from DMD and T
- 410 polymer repeat unit formed from TMD and DDA
- 510 polymer repeat unit formed from 1,5-pentanediamine and DDA
- 610 polymer repeat unit formed from HMD and DDA
- 612 polymer repeat unit formed from HMD and DDDA
- 6 polymer repeat unit formed from -caprolactam
- 11 polymer repeat unit formed from 11-aminoundecanoic acid
- 12 polymer repeat unit formed from 12-aminododecanoic acid
- Note that in the art the term “6” when used alone designates a polymer repeat unit formed from -caprolactam. Alternatively “6” when used in combination with a diacid such as T, for instance 6T, the “6” refers to HMD. In repeat units comprising a diamine and diacid, the diamine is designated first. Furthermore, when “6” is used in combination with a diamine, for instance 66, the first “6” refers to the diamine HMD, and the second “6” refers to adipic acid. Likewise, repeat units derived from other amino acids or lactams are designated as single numbers designating the number of carbon atoms.
- In one embodiment the polyamide composition comprises a one or more polyamides selected from the group consisting of
-
- Group (I) Polyamides having said melting point of less than 210° C., and comprising an aliphatic or semiaromatic polyamide selected from the group poly(pentamethylene decanediamide) (PA510), poly(pentamethylene dodecanediamide) (PA512), poly(ε-caprolactam/hexamethylene hexanediamide) (PA6/66), poly(ε-caprolactam/hexamethylene decanediamide) (PA6/610), poly(ε-caprolactam/hexamethylene dodecanediamide) (PA6/612), poly(hexamethylene tridecanediamide) (PA613), poly(hexamethylene pentadecanediamide) (PA615), poly(ε-caprolactam/tetramethylene terephthalamide) (PA6/4T), poly(ε-caprolactam/hexamethylene terephthalamide) (PA6/6T), poly(ε-caprolactam/decamethylene terephthalamide) (PA6/10T), poly(ε-caprolactam/dodecamethylene terephthalamide) (PA6/12T), poly(hexamethylene decanediamide/hexamethylene terephthalamide) (PA610/6T), poly(hexamethylene dodecanediamide/hexamethylene terephthalamide) (PA612/6T), poly(hexamethylene tetradecanediamide/hexamethylene terephthalamide) (PA614/6T), poly(ε-caprolactam/hexamethylene isophthalamide/hexamethylene terephthalamide) (PA6/6I/6T), poly(ε-caprolactam/hexamethylene hexanediamide/hexamethylene decanediamide) (PA6/66/610), poly(ε-caprolactam/hexamethylene hexanediamide/hexamethylene dodecanediamide) (PA6/66/612), poly(ε-caprolactam/hexamethylene hexanediamide/hexamethylene decanediamide/hexamethylene dodecanediamide) (PA6/66/610/612), poly(2-methylpentamethylene hexanediamide/hexamethylene hexanediamide/hexamethylene terephthamide) (PA D6/66//6T), poly(2-methylpentamethylene hexanediamide/hexamethylene hexanediamide/) (PA D6/66), poly(decamethylene decanediamide) (PA1010), poly(decamethylene dodecanediamide) (PA1012), poly(decamethylene decanediamide/decamethylene terephthalamide) (PA1010/10T) poly(decamethylene decanediamide/dodecamethylene decanediamide/decamethylene terephthalamide/dodecamethylene terephthalamide (PA1010/1210/10T/12T), poly(11-aminoundecanamide) (PA11), poly(11-aminoundecanamide/tetramethylene terephthalamide) (PA11/4T), poly(11-aminoundecanamide/hexamethylene terephthalamide) (PA11/6T), poly(11-aminoundecanamide/decamethylene terephthalamide) (PA11/10T), poly(11-aminoundecanamide/dodecamethylene terephthalamide) (PA11/12T), poly(12-aminododecanamide) (PA12), poly(12-aminododecanamide/tetramethylene terephthalamide) (PA12/4T), poly(12-aminododecanamide/hexamethylene terephthalamide) (PA12/6T), poly(12-aminododecanamide/decamethylene terephthalamide) (PA12/10T) poly(dodecamethylene dodecanediamide) (PA1212), and poly(dodecamethylene dodecanediamide/dodecamethylene dodecanediamide/dodecamethylene terephthalamide)) (PA1212/12T);
- Group (II) Polyamides having said melting point of at least 210° C., and comprising an aliphatic polyamide selected from the group consisting of poly(tetramethylene hexanediamide) (PA46), poly(ε-caprolactam) (PA 6), poly(hexamethylene hexanediamide/(ε-caprolactam/) (PA 66/6) poly(hexamethylene hexanediamide) (PA 66), poly(hexamethylene hexanediamide/hexamethylene decanediamide) (PA66/610), poly(hexamethylene hexanediamide/hexamethylene dodecanediamide) (PA66/612), poly(hexamethylene hexanediamide/decamethylene decanediamide) (PA66/1010), poly(hexamethylene decanediamide) (PA610), poly(hexamethylene dodecanediamide) (PA612), poly(hexamethylene tetradecanediamide) (PA614), poly(hexamethylene hexadecanediamide) (PA616), and poly(tetramethylene hexanediamide/2-methylpentamethylene hexanediamide) (PA46/D6);
- Group (III) Polyamides having said melting point of at least 210° C., and comprising
- (aa) about 20 to about 35 mole percent semiaromatic repeat units derived from monomers selected from one or more of the group consisting of:
- (i) aromatic dicarboxylic acids having 8 to 20 carbon atoms and aliphatic diamines having 4 to 20 carbon atoms; and
- (bb) about 65 to about 80 mole percent aliphatic repeat units derived from monomers selected from one or more of the group consisting of:
- (ii) an aliphatic dicarboxylic acid having 6 to 20 carbon atoms and said aliphatic diamine having 4 to 20 carbon atoms; and
- (iii) a lactam and/or aminocarboxylic acid having 4 to 20 carbon atoms;
- Group (IV) Polyamides comprising
- (cc) about 50 to about 95 mole percent semiaromatic repeat units derived from monomers selected from one or more of the group consisting of:
- (i) aromatic dicarboxylic acids having 8 to 20 carbon atoms and aliphatic diamines having 4 to 20 carbon atoms; and
- (dd) about 5 to about 50 mole percent aliphatic repeat units derived from monomers selected from one or more of the group consisting of:
- (ii) an aliphatic dicarboxylic acid having 6 to 20 carbon atoms and said aliphatic diamine having 4 to 20 carbon atoms; and
- (iii) a lactam and/or aminocarboxylic acid having 4 to 20 carbon atoms;
- Group (V) Polyamides having said melting point of at least 260° C., and comprising
- (ee) greater than 95 mole percent semiaromatic repeat units derived from monomers selected from one or more of the group consisting of:
- (i) aromatic dicarboxylic acids having 8 to 20 carbon atoms and aliphatic diamines having 4 to 20 carbon atoms; and
- (ff) less than 5 mole percent aliphatic repeat units derived from monomers selected from one or more of the group consisting of:
- (ii) an aliphatic dicarboxylic acid having 6 to 20 carbon atoms and said aliphatic diamine having 4 to 20 carbon atoms;
- (iii) a lactam and/or aminocarboxylic acid having 4 to 20 carbon atoms; and
- (aa) about 20 to about 35 mole percent semiaromatic repeat units derived from monomers selected from one or more of the group consisting of:
- Group (VI) Polyamides having no melting point selected from the group consisting of poly(hexamethylene isophthalamide/hexamethylene terephthalamide) (6I/6T) and poly(hexamethylene isophthalamide/hexamethylene terephthalamide/hexamethylene hexanediamide) (6I/6T/66).
- Group (I) Polyamides may have semiaromatic repeat units to the extent that the melting point is less than 210° C. and generally the semiaromatic polyamides of the group have less than 40 mole percent semiaromatic repeat units. Semiaromatic repeat units are defined as those derived from monomers selected from one or more of the group consisting of: aromatic dicarboxylic acids having 8 to 20 carbon atoms and aliphatic diamines having 4 to 20 carbon atoms.
- One embodiment is a molded or extruded thermoplastic article wherein said polyamide resin is selected from Group (I) Polyamides and wherein said test temperature is at least 150° C. for a test period of at least 1000 hours and said retention of strain is greater than 80%.
- One embodiment is a molded or extruded thermoplastic article wherein said polyamide resin is selected from Group (II) Polyamides and wherein said test temperature is at least 150° C. for a test period of at least 1000 hours and said retention of strain is greater than 80%.
- Another embodiment is a molded or extruded thermoplastic article wherein said polyamide resin is selected from Group (III) Polyamides are selected from the group consisting of poly(tetramethylene hexanediamide/tetramethylene terephthalamide) (PA46/4T), poly(tetramethylene hexanediamide/hexamethylene terephthalamide) (PA46/6T), poly(tetramethylene hexanediamide/2-methylpentamethylene hexanediamide/decamethylene terephthalamide)_PA46/D6/10T), poly(hexamethylene hexanediamide/hexamethylene terephthalamide) (PA66/6T), poly(hexamethylene hexanediamide/hexamethylene isophthalamide/hexamethylene terephthalamide PA66/6I/6T, and poly(hexamethylene hexanediamide/2-methylpentamethylene hexanediamide/hexamethylene terephthalamide (PA66/D6/6T); and a most preferred Group (III) Polyamide is PA 66/6T.
- Another embodiment is a molded or extruded thermoplastic article wherein said polyamide resin is selected from Group (IV) Polyamides selected from the group consisting of poly(tetramethylene terephthalamide/hexamethylene hexanediamide) (PA4T/66), poly(tetramethylene terephthalamide/ε-caprolactam) (PA4T/6), poly(tetramethylene terephthalamide/hexamethylene dodecanediamide) (PA4T/612), poly(tetramethylene terephthalamide/2-methylpentamethylene hexanediamide/hexamethylene hexanediamide) (PA4T/D6/66), poly(hexaamethylene terephthalamide/2-methylpentamethylene terephthalamide/hexamethylene hexanediamide) (PA6T/DT/66), poly(hexamethylene terephthalamide/hexamethylene hexanediamide) PA6T/66, poly(hexaamethylene terephthalamide/hexamethylene decanediamide) (PA6T/610), poly(hexamethylene terephthalamide/hexamethylene tetradecanediamide) (PA6T/614), poly(nonamethylene terephthalamide/nonamethylene decanediamide) (PA9T/910), poly(nonamethylene terephthalamide/nonamethylene dodecanediamide) (PA9T/912), poly(nonamethylene terephthalamide/11-aminoundecanamide) (PA9T/11), poly(nonamethylene terephthalamide/12-aminododecanamide) (PA9T/12), poly(decamethylene terephthalamide/11-aminoundecanamide) (PA 10T/11), poly(decamethylene terephthalamide/12-aminododecanamide) (PA10T/12) poly(decamethylene terephthalamide/decamethylene decanediamide) (PA10T/1010), poly(decamethylene terephthalamide/decamethylene dodecanediamide) (PA10T/1012), poly(decamethylene terephthalamide/tetramethylene hexanediamide) (PA10T/46), poly(decamethylene terephthalamide/ε-caprolactam) (PA10T/6), poly(decamethylene terephthalamide/hexamethylene hexanediamide) (PA10T/66), poly(dodecamethylene terephthalamide/dodecamethylene dodecanediamide) (PA12T/1212), poly(dodecamethylene terephthalamide/ε-caprolactam) (PA12T/6), and poly(dodecamethylene terephthalamide/hexamethylene hexanediamide) (PA12T/66); and a most preferred Group (IV) Polyamide is PA6T/66.
- Another embodiment is a molded or extruded thermoplastic article wherein said polyamide resin is selected from Group (V) Polyamides selected from the group consisting of poly(tetramethylene terephthalamide/2-methylpentamethylene terephthalamide) PA4T/DT, poly(tetramethylene terephthalamide/hexamethylene terephthalamide) PA4T/6T, poly(tetramethylene terephthalamide/decamethylene terephthalamide) PA4T/10T, poly(tetramethylene terephthalamide/dodecamethylene terephthalamide)PA4T/12T, poly(tetramethylene terephthalamide/2-methylpentamethylene terephthalamide/hexamethylene terephthalamide) (PA4T/DT/6T), poly(tetramethylene terephthalamide/hexamethylene terephthalamide/2-methylpentamethylene terephthalamide) (PA4T/6T/DT), poly(hexamethylene terephthalamide/2-methylpentamethylene terephthalamide) (PA6T/DT), poly(hexamethylene hexanediamide/hexamethylene isophthalamide) (PA 6T/6I), poly(hexamethylene terephthalamide/decamethylene terephthalamide) PA6T/10T, poly(hexamethylene terephthalamide/dodecamethylene terephthalamide) (PA6T/12T), poly(hexamethylene terephthalamide/2-methylpentamethylene terephthalamide/poly(decamethylene terephthalamide) (PA6T/DT/10T), poly(hexamethylene terephthalamide/decamethylene terephthalamide/dodecamethylene terephthalamide) (PA6T/10T/12T), poly(decamethylene terephthalamide) (PA10T), poly(decamethylene terephthalamide/tetramethylene terephthalamide) (PA10T/4T), poly(decamethylene terephthalamide/2-methylpentamethylene terephthalamide) (PA10T/DT), poly(decamethylene terephthalamide/dodecamethylene terephthalamide) (PA10T/12T), poly(decamethylene terephthalamide/2-methylpentamethylene terephthalamide/(decamethylene terephthalamide) (PA10T/DT/12T), poly(dodecamethylene terephthalamide) (PA12T), poly(dodecamethylene terephthalamide)/tetramethylene terephthalamide) (PA12T/4T), poly(dodecamethylene terephthalamide)/hexamethylene terephthalamide) PA12T/6T, poly(dodecamethylene terephthalamide)/decamethylene terephthalamide) (PA12T/10T), and poly(dodecamethylene terephthalamide)/2-methylpentamethylene terephthalamide) (PA12T/DT); with the proviso that when said Group (V) Polyamide is selected from only a single polyamide having said melting point of at least 260° C., and comprising greater than 95 mole percent semiaromatic repeat units derived from monomers selected from one or more of the group consisting of aromatic dicarboxylic acids having 8 to 20 carbon atoms and aliphatic diamines having 4 to 20 carbon atoms; said aliphatic diamine(s) comprise less than 50 mole percent 2-methyl-1,5-pentanediamine.
- In various embodiments the polyamide is a Group (III) Polyamide, Group (IV) Polyamide, Group (V) Polyamide or Group (VI) Polyamide, respectively.
- The polyamides may also be blends of two or more polyamides. Preferred blends include those selected from the group consisting of Group (I) and Group (II) Polyamides; Group (I) and (III) Polyamide, Group (I) and Group (VI) Polyamides, Group (II) and Group (III) Polyamides, Group (II) and Group (IV) Polyamides, Group (II) and Group (V) Polyamides, Group (II) and Group (VI) Polyamides, Group (III) and Group (VI) Polyamides, and Group (IV) and Group (V) Polyamides.
- A preferred blend includes Group (II) and Group (V) Polyamides, and a specific preferred blend includes poly(hexamethylene hexanediamide) (PA 66) and poly(hexamethylene terephthalamide/2-methylpentamethylene terephthalamide) (PA 6T/DT).
- Another preferred blend includes Group (II) and Group (III) Polyamides and a specific preferred blend includes poly(ε-caprolactam) (PA6) and poly(hexamethylene hexanediamide/hexamethylene terephthalamide (PA66/6T).
- The molded or extruded thermoplastic article comprises 0.1 to 10 weight percent of one or more polyhydric alcohols having more than two hydroxyl groups and having a number average molecular weight (Mn) of less than 2000 as determined for polymeric materials with gel permeation chromatography (GPC).
- Polyhydric alcohols may be selected from aliphatic hydroxylic compounds containing more than two hydroxyl groups, aliphatic-cycloaliphatic compounds containing more than two hydroxyl groups, cycloaliphatic compounds containing more than two hydroxyl groups, aromatic and saccharides.
- An aliphatic chain in the polyhydric alcohol can include not only carbon atoms but also one or more hetero atoms which may be selected, for example, from nitrogen, oxygen and sulphur atoms. A cycloaliphatic ring present in the polyhydric alcohol can be monocyclic or part of a bicyclic or polycyclic ring system and may be carbocyclic or heterocyclic. A heterocyclic ring present in the polyhydric alcohol can be monocyclic or part of a bicyclic or polycyclic ring system and may include one or more hetero atoms which may be selected, for example, from nitrogen, oxygen and sulphur atoms. The one or more polyhydric alcohols may contain one or more substituents, such as ether, carboxylic acid, carboxylic acid amide or carboxylic acid ester groups.
- Examples of polyhydric alcohol containing more than two hydroxyl groups include, without limitation, triols, such as glycerol, trimethylolpropane, 2,3-di-(2′-hydroxyethyl)-cyclohexan-1-ol, hexane-1,2,6-triol, 1,1,1-tris-(hydroxymethyl)ethane, 3-(2′-hydroxyethoxy)-propane-1,2-diol, 3-(2′-hydroxypropoxy)-propane-1,2-diol, 2-(2′-hydroxyethoxy)-hexane-1,2-diol, 6-(2′-hydroxypropoxy)-hexane-1,2-diol, 1,1,1-tris-[(2′-hydroxyethoxy)-methyl]-ethane, 1,1,1-tris-[(2′-hydroxypropoxy)-methyl]-propane, 1,1,1-tris-(4′-hydroxyphenyl)-ethane, 1,1,1-tris-(hydroxyphenyl)-propane, 1,1,3-tris-(dihydroxy-3-methylphenyl)-propane, 1,1,4-tris-(dihydroxyphenyl)-butane, 1,1,5-tris-(hydroxyphenyl)-3-methylpentane, di-trimethylopropane, trimethylolpropane ethoxylates, or trimethylolpropane propoxylates; polyols such as pentaerythritol, dipentaerythritol, and tripentaerythritol; and saccharides, such as cyclodextrin, D-mannose, glucose, galactose, sucrose, fructose, xylose, arabinose, D-mannitol, D-sorbitol, D-or L-arabitol, xylitol, iditol, talitol, allitol, altritol, guilitol, erythritol, threitol, and D-gulonic-y-lactone; and the like.
- Preferred polyhydric alcohols include those having a pair of hydroxyl groups which are attached to respective carbon atoms which are separated one from another by at least one atom. Especially preferred polyhydric alcohols are those in which a pair of hydroxyl groups is attached to respective carbon atoms which are separated one from another by a single carbon atom.
- Preferably, the polyhydric alcohol used in the thermoplastic composition is pentaerythritol, dipentaerythritol, tripentaerythritol, di-trimethylolpropane, D-mannitol, D-sorbitol and xylitol. More preferably, the polyhydric alcohol used is dipentaerythritol and/or tripentaerythritol. A most preferred polyhydric alcohol is dipentaerythritol.
- In various embodiments the content of said polyhydric alcohol in the thermoplastic composition is 0.1 to less than 10 weight percent, preferably 0.25-8 weight percent, more preferably 0.25-5 weight percent and most preferably 1-4 weight percent; based on the total weight of said thermoplastic composition.
- The molded or extruded thermoplastic article comprises less than 10 weight percent, preferably 5 weight percent % or less of one or more reinforcement agents. In a preferred embodiment the molded or extruded thermoplastic article includes no reinforcement agent. When a reinforcement agent is present, it may be any filler, but is preferably selected from the group consisting calcium carbonate, glass fibers with circular and noncircular cross-section, glass flakes, glass beads, carbon fibers, talc, mica, wollastonite, calcined clay, kaolin, diatomite, magnesium sulfate, magnesium silicate, barium sulfate, titanium dioxide, sodium aluminum carbonate, barium ferrite, potassium titanate and mixtures thereof.
- The molded or extruded thermoplastic article may further comprise 0 to 50 weight percent of a polymeric toughener comprising a reactive functional group and/or a metal salt of a carboxylic acid. In one embodiment the molded or extruded thermoplastic article comprises 2 to 20 weight percent polymeric toughener selected from the group consisting of: a copolymer of ethylene, glycidyl(meth)acrylate, and optionally one or more (meth)acrylate esters; an ethylene/α-olefin or ethylene/α-olefin/diene copolymer grafted with an unsaturated carboxylic anhydride; a copolymer of ethylene, 2-isocyanatoethyl(meth)acrylate, and optionally one or more (meth)acrylate esters; and a copolymer of ethylene and acrylic acid reacted with a Zn, Li, Mg or Mn compound to form the corresponding ionomer.
- The molded or extruded thermoplastic article comprises 0 to 3 weight percent of a co-stabilizer that is useful in combination with the polyhdric alcohol, in affecting the long-term heat stability of article. Preferred co-stabilizers have a 10% weight loss temperature, as determined by TGA, of greater than 30° C. below said melting point of said polyamide if said melting point is present, or at least 250° C. if said melting point is not present; and said co-stabilizers are selected from the group consisting of secondary aryl amines, hindered amine light stabilizers, and mixtures thereof.
- For the purposes of this invention, TGA weight loss will be determined according to ASTM D 3850-94, using a heating rate of 10° C./min, in air purge stream, with an appropriate flow rate of 0.8 mL/second. The co-stabilizer preferably has a 10% weight loss temperature, as determined by TGA, of at least 270° C., and more preferably 290° C., 320° C., and 340° C., and most preferably at least 350° C. The one or more co-stabilizers preferably are present from at or about 0.1 to 3 weight percent, and more preferably at or about 0.1 to at or about 1 weight percent, or more preferably from at or about 0.1 to at or about 0.7 weight percent, based on the total weight of the polyamide composition.
- Secondary aryl amines useful in the invention are high molecular weight organic compound having low volatility. Preferably, the high molecular weight organic compound will be selected from the group consisting of secondary aryl amines further characterized as having a molecular weight of at least 260 g/mol and preferably at least 350 g/mol, together with a 10% weight loss temperature as determined by TGA of at least 290° C., preferably at least 300° C., 320° C., 340° C., and most preferably at least 350° C.
- By secondary aryl amine is meant an amine compound that contains two carbon radicals chemically bound to a nitrogen atom where at least one, and preferably both carbon radicals, are aromatic. Preferably, at least one of the aromatic substituents, such as, for example, a phenyl, naphthyl or heteroaromatic group, is substituted with at least one substituent, preferably containing 1 to about 20 carbon atoms.
- Examples of suitable secondary aryl amines include 4,4′di(α,α-dimethylbenzyl)diphenylamine available commercially as Naugard 445 from Uniroyal Chemical Company, Middlebury, Conn.; the secondary aryl amine condensation product of the reaction of diphenylamine with acetone, available commercially as Aminox from Uniroyal Chemical Company; and para-(paratoluenesulfonylamido)diphenylamine also available from Uniroyal Chemical Company as Naugard SA. Other suitable secondary aryl amines include N,Nα-di-(2-naphthyl)-p-phenylenediamine, available from ICI Rubber Chemicals, Calcutta, India. Other suitable secondary aryl amines include 4,4′-bis(α,α′-tertiaryoctyl)diphenylamine, 4,4′-bis(α-methylbenzhydryl)diphenylamine, and others from EP 0509282 B1.
- The molded or extruded thermoplastic article may have at least one co-stabilizer selected from one or more secondary aryl amines. Preferably the one or more secondary aryl amines is present at about 0.25 to 1.0 weight percent and more preferably 0.25 to about 0.9 weight percent, based on the total weight of the polyamide composition.
- The hindered amine light stabilizers (HALS) may be one or more hindered amine type light stabilizers (HALS). HALS are compounds of the following general formulas and combinations thereof:
- In these formulas, R1 up to and including R5 are independent substituents. Examples of suitable substituents are hydrogen, ether groups, ester groups, amine groups, amide groups, alkyl groups, alkenyl groups, alkynyl groups, aralkyl groups, cycloalkyl groups and aryl groups, in which the substituents in turn may contain functional groups; examples of functional groups are alcohols, ketones, anhydrides, imines, siloxanes, ethers, carboxyl groups, aldehydes, esters, amides, imides, amines, nitriles, ethers, urethanes and any combination thereof. A hindered amine light stabilizer may also form part of a polymer or oligomer.
- Preferably, the HALS is a compound derived from a substituted piperidine compound, in particular any compound derived from an alkyl-substituted piperidyl, piperidinyl or piperazinone compound, and substituted alkoxypiperidinyl compounds. Examples of such compounds are: 2,2,6,6-tetramethyl-4-piperidone; 2,2,6,6-tetrametyl-4-piperidinol; bis-(1,2,2,6,6-pentamethyl piperidyl)-(3′,5′-di-tert-butyl-4′-hydroxybenzyl)butylmalonate; di-(2,2,6,6-tetramethyl-4-piperidyl)sebacate (Tinuvin® 770, MW 481); oligomer of N-(2-hydroxyethyl)-2,2,6,6-tetramethyl-4-piperidinol and succinic acid (Tinuvin® 622); oligomer of cyanuric acid and N,N-di(2,2,6,6-tetramethyl-4-piperidyl)-hexamethylene diamine; bis-(2,2,6,6-tetramethyl-4-piperidinyl)succinate; bis-(1-octyloxy-2,2,6,6-tetramethyl-4-piperidinyl)sebacate (Tinuvin® 123); bis-(1,2,2,6,6-pentamethyl-4-piperidinyl)sebacate (Tinuvin® 765); Tinuvin® 144; Tinuvin® XT850; tetrakis-(2,2,6,6-tetramethyl-4-piperidyl)-1,2,3,4-butane tetracarboxylate; N,N′-bis-(2,2,6,6-tetramethyl-4-piperidyl)-hexane-1,6-diamine (Chimasorb® T5); N-butyl-2,2,6,6-tetramethyl-4-piperidinamine; 2,2′-[(2,2,6,6-tetramethyl-piperidinyl)-imino]-bis-[ethanol]; poly((6-morpholine-S-triazine-2,4-diyl)(2,2,6,6-tetramethyl-4-piperidinyl)-iminohexamethylene-(2,2,6,6-tetramethyl-4-piperidinyl)-imino) (Cyasorb® UV 3346); 5-(2,2,6,6-tetramethyl-4-piperidinyl)-2-cyclo-undecyl-oxazole) (Hostavin® N20); 1,1′-(1,2-ethane-di-yl)-bis-(3,3′,5,5′-tetramethyl-piperazinone); 8-acetyl-3-dothecyl-7,7,9,9-tetramethyl-1,3,8-triazaspiro(4,5)decane-2,4-dione; polymethylpropyl-3-oxy-[4(2,2,6,6-tetramethyl)-piperidinyl]siloxane (Uvasil® 299); 1,2,3,4-butane-tetracarboxylic acid-1,2,3-tris(1,2,2,6,6-pentamethyl-4-piperidinyl)-4-tridecylester; copolymer of alpha-methylstyrene-N-(2,2,6,6-tetramethyl-4-piperidinyl)maleimide and N-stearyl maleimide; 1,2,3,4-butanetetracarboxylic acid, polymer with beta,beta,beta′,beta′-tetramethyl-2,4,8,10-tetraoxaspiro[5.5]undecane-3,9-diethanol, 1,2,2,6,6-pentamethyl-4-piperidinyl ester (Mark® LA63); 2,4,8,10-tetraoxaspiro[5.5]undecane-3,9-diethanol, beta,beta,beta′,beta′-tetramethyl-polymer with 1,2,3,4-butanetetracarboxylic acid, 2,2,6,6-tetramethyl-4-piperidinyl ester (Mark® LA68); D-glucitol, 1,3:2,4-bis-O-(2,2,6,6-tetramethyl-4-piperidinylidene)-(HALS 7); oligomer of 7-oxa-3,20-diazadispiro[5.1.11.2]-heneicosan-21-one-2,2,4,4-tetramethyl-20-(oxiranylmethyl) (Hostavin® N30); propanedioic acid, [(4-methoxyphenyl)methylene]-,bis(1,2,2,6,6-pentamethyl-4-piperidinyl)ester (Sanduvor® PR 31); formamide, N,N′-1,6-hexanediylbis[N-(2,2,6,6-tetramethyl-4-piperidinyl (Uvinul® 4050H); 1,3,5-triazine-2,4,6-triamine, N,N′″-[1,2-ethanediylbis[[[4,6-bis[butyl(1,2,2,6,6-pentamethyl-4-piperidinyl)amino]-1,3,5-triazine-2-yl]imino]-3,1-propanediyl]]-bis[N′,N″-dibutyl-N′,N″-bis(1,2,2,6,6-pentamethyl-4-piperidinyl) (Chimassorb® 119 MW 2286); poly[[6-[(1,1,3,33-tetramethylbutyl)amino]-1,3,5-triazine-2,4-diyl][(2,2,6,6-tetramethyl-4-peperidinyl)-imino]-1,6-hexanediyl [(2,2,6,6-tetramethyl-4-piperidinyl)imino]] (Chimassorb® 944 MW 2000-3000); 1,5-dioxaspiro (5,5) undecane 3,3-dicarboxylic acid, bis(2,2,6,6-tetramethyl-4-peridinyl)ester (Cyasorb® UV-500); 1,5-dioxaspiro(5,5)undecane 3,3-dicarboxylic acid, bis(1,2,2,6,6-pentamethyl-4-peridinyl)ester (Cyasorb® UV-516); N-2,2,6,6-tetramethyl-4-piperidinyl-N-amino-oxamide; 4-acryloyloxy-1,2,2,6,6-pentamethyl-4-piperidine. 1,5,8,12-tetrakis[2′,4′-bis(1″,2″,2″,6″,6″-pentamethyl-4″-piperidinyl(butyl)amino)-1′, 3′,5′-triazine-6′-yl]-1,5,8,12-tetraazadodecane; HALS PB-41 (Clariant Huningue S. A.); Nylostab® S-EED (Clariant Huningue S. A.); 3-dodecyl-1-(2,2,6,6-tetramethyl-4-piperidyl)-pyrrolidin-2,5-dione; Uvasorb® HA88; 1,1′-(1,2-ethane-di-yl)-bis-(3,3′,5,5′-tetra-methyl-piperazinone) (Good-rite® 3034); 1,1′1″-(1,3,5-triazine-2,4,6-triyltris((cyclohexylimino)-2,1-ethanediyl)tris(3,3,5,5-tetramethylpiperazinone) (Good-rite® 3150) and; 1,1′,1″-(1,3,5-triazine-2,4,6-triyltris((cyclohexylimino)-2,1-ethanediyl)tris(3,3,4,5,5-tetramethylpiperazinone) (Good-rite® 3159). Tinuvin® and Chimassorb® materials are available from Ciba Specialty Chemicals; Cyasorb® materials are available from Cytec Technology Corp.; Uvasil® materials are available from Great Lakes Chemical Corp.; Saduvor®, Hostavin®, and Nylostab® materials are available from Clariant Corp.; Uvinul® materials are available from BASF; Uvasorb® materials are available from Partecipazioni Industriali; and Good-rite® materials are available from B.F. Goodrich Co. Mark® materials are available from Asahi Denka Co.
- Preferred HALS include high-molecular weight oligomeric or polymeric HALS having a molecular weight of more than about 1000, and preferably more than about 2000.
- Other specific HALS are selected from the group consisting or di-(2,2,6,6-tetramethyl-4-piperidyl)sebacate (Tinuvin® 770, MW 481) Nylostab® S-EED (Clariant Huningue S. A.); 1,3,5-triazine-2,4,6-triamine, N,N′″-[1,2-ethanediylbis[[[4,6-bis[butyl(1,2,2,6,6-pentamethyl-4-piperidinyl)amino]-1,3,5-triazine-2-yl]imino]-3,1-propanediyl]]-bis[N′,N″-dibutyl-N′,N″-bis(1,2,2,6,6-pentamethyl-4-piperidinyl) (Chimassorb® 119 MW 2286); and poly[[6-[(1,1,3,33-tetramethylbutyl)amino]-1,3,5-triazine-2,4-diyl][(2,2,6,6-tetramethyl-4-peperidinyl)-imino]-1,6-hexanediyl[(2,2,6,6-tetramethyl-4-piperidinyl)imino]] (Chimassorb® 944 MW 2000-3000).
- The molded or extruded thermoplastic article may have at least one co-stabilizer selected from one or more HALS. Preferably the one or more HALS is present at about 0.25 to 1.0 weight percent and more preferably 0.25 to about 0.9 weight percent, based on the total weight of the polyamide composition.
- Mixtures of secondary aryl amines and HALS may be used. A preferred embodiment comprises at least two co-stabilizers, at least one selected from the secondary aryl amines; and at least one selected from the group of HALS, as disclosed above, wherein the total weight percent of the mixture of co-stabilizers is at least 0.5 weight percent, and preferably at least 0.9 weight percent.
- In the present invention, the polyamide composition may also comprise other additives commonly used in the art, such as other heat stabilizers or antioxidants, antistatic agents, blowing agents, lubricants, plasticizers, and colorant and pigments.
- Other heat stabilizers include copper stabilizers and hindered phenols, and mixtures thereof.
- A significant advantage of the molded or extruded thermoplastic articles of the invention is that high thermal stability, as measured under AOA conditions disclosed herein, is provided without the use of conventional copper heat stabilizers. Copper heat stabilizers tend to act as corrosive agents over long periods of time at elevated temperatures; and in some environments actually cause degradation of semiaromatic polymers. Thus, another embodiment is molded or extruded thermoplastic article wherein said polyamide composition comprises less than 25 ppm copper as determined with atomic absorption spectroscopy.
- The polyamide composition may comprise plasticizers. A plasticizer will preferably be miscible with the polyamide. Examples of suitable plasticizers include sulfonamides, preferably aromatic sulfonamides such as benzenesulfonamides and toluenesulfonamides. Examples of suitable sulfonamides include N-alkyl benzenesulfonamides and toluenesufonamides, such as N-butylbenzenesulfonamide, N-(2-hydroxypropyl)benzenesulfonamide, N-ethyl-o-toluenesulfonamide, N-ethyl-p-toluenesulfonamide, o-toluenesulfonamide, p-toluenesulfonamide, and the like. Preferred are N-butylbenzenesulfonamide, N-ethyl-o-toluenesulfonamide, and N-ethyl-p-toluenesulfonamide.
- The plasticizer may be incorporated into the composition by melt-blending the polymer with plasticizer and, optionally, other ingredients, or during polymerization. If the plasticizer is incorporated during polymerization, the polyamide monomers are blended with one or more plasticizers prior to starting the polymerization cycle and the blend is introduced to the polymerization reactor. Alternatively, the plasticizer can be added to the reactor during the polymerization cycle.
- If a plasticizer is present in the polyamide composition, the polyamide composition contains no more than 5 weight percent of plasticizer.
- Herein the thermoplastic composition is a mixture by melt-blending, in which all polymeric ingredients are adequately mixed, and all non-polymeric ingredients are adequately dispersed in a polymer matrix. Any melt-blending method may be used for mixing polymeric ingredients and non-polymeric ingredients of the present invention. For example, polymeric ingredients and non-polymeric ingredients may be fed into a melt mixer, such as single screw extruder or twin screw extruder, agitator, single screw or twin screw kneader, or Banbury mixer, and the addition step may be addition of all ingredients at once or gradual addition in batches. When the polymeric ingredient and non-polymeric ingredient are gradually added in batches, a part of the polymeric ingredients and/or non-polymeric ingredients is first added, and then is melt-mixed with the remaining polymeric ingredients and non-polymeric ingredients that are subsequently added, until an adequately mixed composition is obtained. If a reinforcing filler presents a long physical shape (for example, a long glass fiber), drawing extrusion molding may be used to prepare a reinforced composition.
- The thermoplastic composition having a polyhydric alcohol having two or more hydroxyl groups, as disclosed above, is useful in increasing long-term thermal stability at high temperatures of molded or extruded articles made therefrom. The long-term thermal stability of the articles can be assessed by air oven ageing (AOA) of 4 mm thick test samples at various test temperatures for various test periods of time. The test temperature for the composition disclosed herein is at 150° C. and for about 1000 hours test period. The term “at 150° C.” refers to the nominal temperature of the environment to which the test bars are exposed; with the understanding that the actual temperature may vary by ±2° C. from the nominal test temperature.
- The test samples, after air oven ageing, are tested for tensile strength and strain at break, according to ISO 527-2/1A test method; and compared with a control aged at said test temperature for 72 hours. Ageing the control at the test temperature for 72 hours may allow crystallization to equilibrate in the molded test specimens, and thus may allow more reliable measure of AOA performance. The comparison with the controls provides the retention of strain at break, and thus the various compositions can be assessed as to long-term high temperature ageing performance.
- In various embodiments the molded 4 mm test specimens of polyamide composition, as disclosed herein, have a retention of strain at break of at least 80% after AOA at 150° C. for 1000 hours and preferably at least 90%, based upon comparison with controls exposed at said test temperature for 72 hours.
- In another embodiment the molded 4 mm test specimens of polyamide composition, as disclosed herein, have a retention of strain at break of at least 50% after AOA at 150° C. for about 2000 hours and preferably at least 75%, based upon comparison with controls exposed at said test temperature for 72 hours
- In another aspect, the present invention relates a use of the above disclosed thermoplastic compositions for high temperature applications.
- In another aspect, the present invention relates to a method for manufacturing an article by shaping the thermoplastic composition of the invention. Examples of articles are films or laminates, automotive parts or engine parts or electrical/electronics parts. By “shaping”, it is meant any shaping technique, such as for example extrusion, injection moulding, thermoform moulding, compression moulding or blow moulding. Preferably, the article is shaped by injection moulding or blow moulding.
- The molded or extruded thermoplastic articles disclosed herein may have application in automotive and other components that meet one or more of the following requirements: high chemical resistance to polar chemicals such as such as zinc chloride and calcium chloride, high impact requirements; resistance to high temperature; resistance to oil and fuel environment; resistance to chemical agents such as coolants; low permeability to fuels and gases, e.g. carbon dioxide. Specific extruded or molded thermoplastic articles are selected from the group consisting of pipes for transporting liquids and gases, inner linings for pipes, fuel lines, air break tubes, coolant pipes, air ducts, pneumatic tubes, hydraulic houses, cable covers, cable ties, connectors, canisters, and push-pull cables.
- The present invention is further illustrated by the following examples. It should be understood that the following examples are for illustration purposes only, and are not used to limit the present invention thereto.
- Compounding Method
- Examples 1-3 and comparative examples C-1-C-3 were prepared by melt blending the ingredients listed in the Table in a Buss 55 mm extruder, operating at about 230° C. for PA1010 compositions and 250° C. for PA612 compositions, using a screw speed of about 180 rpm, and a throughput of 100 kg/hour. Ingredient quantities shown in the Table are given in weight percent on the basis of the total weight of the thermoplastic composition.
- The compounded mixture was extruded in the form of laces or strands, cooled in a water bath, chopped into granules and placed into sealed aluminum lined bags in order to prevent moisture pick up. The cooling and cutting conditions were adjusted to ensure that the materials were kept below 0.15 wt % of moisture level.
- Physical Properties Measurement
- Mechanical tensile properties, i.e. E-modulus, stress at break (Tensile strength) and strain at break (elongation at break) were measured according to ISO 527-2/1A. Measurements were made on injection molded ISO tensile bar. The mold temperature was 70° C., and melt temperature was 230° C. for PA1010 and 250° C. for PA612 compositions.
- The thickness of the test specimens was 4 mm and a width of 10 mm according to ISO 527/1A at a testing speed of 50 mm/min (tensile strength and elongation). Tensile Modulus was measured at 50 mm/min.
- Air Oven Ageing (AOA)
- The test specimens were heat aged in a re-circulating air ovens (Heraeus type UT6060) according to the procedure detailed in ISO 2578. At various heat aging times, the test specimens were removed from the oven, allowed to cool to room temperature and sealed into aluminum lined bags until ready for testing. The tensile mechanical properties were then measured according to ISO 527 using a Zwick tensile instrument. The average values obtained from 5 specimens are given in the Table.
- Retention of strain at break corresponds to the percentage of the strain at break at 1008 hours and 2328 hours heat ageing in comparison with the value of specimens after heat aging for 72 hours considered as being 100%.
- PA612 is Zytel® 158 NC010 resin, having a melting point of about 218° C., available from E. I. du Pont de Nemours and Company, Wilmington, Del.
- PA1010 is Herox® polyamide resin available from E. I. du Pont de Nemours and Company, Wilmington, Del.
- Surlyn®9320 copolymer refers to an ethylene/methacrylic acid copolymer, zinc neutralized, available from E.I. DuPont de Nemours and Company, Wilmington, Del., USA.
- Elvaloy EP4934-4 refers to an ethylene/glycidyl methacrylate copolymer available from E.I. DuPont de Nemours and Company, Wilmington, Del., USA.
- Colloids PE 48/93 refers to a carbon black dispersed in polyethylene available from Colloids Limited.
- DPE refers to dipentaerythritol that was from Perstorp Speciality Chemicals AB, Perstorp, Sweden as Di-Penta 93.
- Cu heat stabilizer refers to a mixture of 7 parts of potassium iodide and 1 part of copper iodide in 0.5 part of a stearate wax binder.
- Irgafos® 168 stabilizer is a heat stabilizer available Ciba Speciality Chemicals Inc, Switzerland.
- Irganox® 1098 stabilizer was available from Ciba Speciality Chemicals Inc, Switzerland.
- Chimassorb® 944 refers to (poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-1,3,5-triazine-2,4-diyl][(2,2,6,6-tetramethyl-4-piperidinyl)-imino]-1,6-hexanediyl[(2,2,6,6-tetramethyl-4-piperidinyl)imino]]), supplied by Ciba Specialty Chemicals.
- Tinuvin® 234 refers to a HALS available from Ciba Specialty Chemicals.
- Unreinforced PA1010 compositions of Examples 1 and 2 with DPE and Comparative Example C-1 and C-2 without DPE are listed in Table 1. Tensile properties after AOA at 150° C. at 72 h, 1008 h, and 2328 h, and % retention of strain at break are listed in Table 1. The examples showed greater than 80% retention of strain at break, after 1008 hours AOA at 150° C., as compared to the 72 h AOA control. These results are significantly better than the comparative examples having no DPE present.
- Unreinforced PA 612 compositions of Examples 3 with DPE and Comparative Example C-3 without DPE are listed in Table 1. Tensile properties after AOA at 150° C. at 72 h, 1008 h, and 2328 h, and % retention of strain at break are listed in Table 1. The example showed greater than 80% retention of strain at break, after 1008 hours AOA at 150° C., as compared to the 72 h AOA control. These results are significantly better than the comparative examples having no DPE present.
-
TABLE 1 Example C-1 1 C-2 2 C-3 3 PA612 76.4 73.4 PA1010 96.4 93.4 76.4 73.4 Surlyn ® 9320 16 16 16 16 Elvaloy ® EP4934-4 4 4 4 4 Colloids PE 48/93 2 2 2 2 2 2 Irganox ® 1098 0.3 0.3 0.3 0.3 0.3 0.3 Irgafos ® 168 0.3 0.3 0.3 0.3 0.3 0.3 Tinuvin ® 234 0.3 0.3 0.3 0.3 0.3 0.3 Chimassorb ® 944 0.3 0.3 0.3 0.3 0.3 0.3 Copper heat stabilizer 0.4 0.4 0.4 0.4 0.4 0.4 DPE 3 3 3 AOA 150° C., 72 h Tensile Modulus 2070 2110 1420 1380 1561 1552 Stress at Break 43 44 39 37 37 36 Strain at break 51 45 133 122 118 91 AOA 150° C., 1008 h Tensile Modulus 2240 2275 1471 1469 1703 1759 Stress at Break 43 46 39 35 41 45 Strain at break 41 40 76 102 75 75 Retention strain at break (%) 80 89 57 83 64 83 AOA 150° C., 2328 h Tensile Modulus 2243 2216 1492 1446 1679 1699 Stress at Break 58 56 43 46 42 51 Strain at break 15 35 56 63 4 41 Retention strain at break (%) 30 79 42 51 3 45
Claims (15)
1. A molded or extruded thermoplastic article comprising a polyamide composition comprising
(a) a polyamide resin having a melting point and/or glass transition;
(b) 0.1 to 10 weight percent of one or more polyhydric alcohols having more than two hydroxyl groups and having a number average molecular weight (Mn) of less than 2000;
(c) 0 to 3 weight percent of a co-stabilizer, having a 10% weight loss temperature, as determined by thermogravimetric analysis, of greater than 30° C. below said melting point of said polyamide if said melting point is present, or at least 250° C. if said melting point is not present, said co-stabilizer selected from the group consisting of secondary aryl amines, hindered amine light stabilizers, and mixtures thereof;
(d) 0 to less than 10 weight percent of one or more reinforcement agents; and
(e) 0 to 50 weight percent polymeric toughener comprising a
reactive functional group and/or a metal salt of a carboxylic acid; and wherein 4 mm test bars prepared from said polyamide composition, and exposed at an test temperature of 150° C. for a test period of about 1000 hours, in an atmosphere of air, and tested according to ISO 527-2/1A, have, on average, a retention of strain at break of greater than 80 percent, as compared with a control exposed at said test temperature for 72 hours; and with the proviso that the polyamide composition contains not more than 5 weight percent of a plasticizer; and, independently, with the further proviso that when said polyamide resin is selected from only a single polyamide having said melting point of at least 260° C., comprising greater than 95 mole percent semiaromatic repeat units derived from monomers selected from the group consisting of: one or more aromatic dicarboxylic acid(s) having 8 to 20 carbon atoms and one or more aliphatic diamine(s) having 4 to 20 carbon atoms; said aliphatic diamine(s) comprise less than 50 mole percent 2-methyl-1,5-pentanediamine.
2. The molded or extruded thermoplastic article of claim 1 wherein said polyamide composition comprises one or more polyamides independently selected from the group consisting of
Group (I) Polyamides having said melting point of less than 210° C., and comprising an aliphatic or semiaromatic polyamide selected from the group poly(pentamethylene decanediamide) (PA510), poly(pentamethylene dodecanediamide) (PA512), poly(ε-caprolactam/hexamethylene hexanediamide) (PA6/66), poly(ε-caprolactam/hexamethylene decanediamide) (PA6/610), poly(ε-caprolactam/hexamethylene dodecanediamide) (PA6/612), poly(hexamethylene tridecanediamide) (PA613), poly(hexamethylene pentadecanediamide) (PA615), poly(ε-caprolactam/tetramethylene terephthalamide) (PA6/4T), poly(ε-caprolactam/hexamethylene terephthalamide) (PA6/6T), poly(ε-caprolactam/decamethylene terephthalamide) (PA6/10T), poly(ε-caprolactam/dodecamethylene terephthalamide) (PA6/12T), poly(hexamethylene decanediamide/hexamethylene terephthalamide) (PA610/6T), poly(hexamethylene dodecanediamide/hexamethylene terephthalamide) (PA612/6T), poly(hexamethylene tetradecanediamide/hexamethylene terephthalamide) (PA614/6T), poly(ε-caprolactam/hexamethylene isophthalamide/hexamethylene terephthalamide) (PA6/6I/6T), poly(ε-caprolactam/hexamethylene hexanediamide/hexamethylene decanediamide) (PA6/66/610), poly(ε-caprolactam/hexamethylene hexanediamide/hexamethylene dodecanediamide) (PA6/66/612), poly(ε-caprolactam/hexamethylene hexanediamide/hexamethylene decanediamide/hexamethylene dodecanediamide) (PA6/66/610/612), poly(2-methylpentamethylene hexanediamide/hexamethylene hexanediamide/hexamethylene terephthamide) (PA D6/66//6T), poly(2-methylpentamethylene hexanediamide/hexamethylene hexanediamide/) (PA D6/66), poly(decamethylene decanediamide) (PA1010), poly(decamethylene dodecanediamide) (PA1012), poly(decamethylene decanediamide/decamethylene terephthalamide) (PA1010/10T) poly(decamethylene decanediamide/dodecamethylene decanediamide/decamethylene terephthalamide/dodecamethylene terephthalamide (PA1010/1210/10T/12T), poly(11-aminoundecanamide) (PA11), poly(11-aminoundecanamide/tetramethylene terephthalamide) (PA11/4T), poly(11-aminoundecanamide/hexamethylene terephthalamide) (PA11/6T), poly(11-aminoundecanamide/decamethylene terephthalamide) (PA11/10T), poly(11-aminoundecanamide/dodecamethylene terephthalamide) (PA11/12T), poly(12-aminododecanamide) (PA12), poly(12-aminododecanamide/tetramethylene terephthalamide) (PA12/4T), poly(12-aminododecanamide/hexamethylene terephthalamide) (PA12/6T), poly(12-aminododecanamide/decamethylene terephthalamide) (PA12/10T) poly(dodecamethylene dodecanediamide) (PA1212), and poly(dodecamethylene dodecanediamide/dodecamethylene dodecanediamide/dodecamethylene terephthalamide)) (PA1212/12T);
Group (II) Polyamides having said melting point of at least 210° C., and comprising an aliphatic polyamide selected from the group consisting of poly(tetramethylene hexanediamide) (PA46), poly(ε-caprolactam) (PA 6), poly(hexamethylene hexanediamide/(ε-caprolactam/) (PA 66/6) poly(hexamethylene hexanediamide) (PA 66), poly(hexamethylene hexanediamide/hexamethylene decanediamide) (PA66/610), poly(hexamethylene hexanediamide/hexamethylene dodecanediamide) (PA66/612), poly(hexamethylene hexanediamide/decamethylene decanediamide) (PA66/1010), poly(hexamethylene decanediamide) (PA610), poly(hexamethylene dodecanediamide) (PA612), poly(hexamethylene tetradecanediamide) (PA614), poly(hexamethylene hexadecanediamide) (PA616), and poly(tetramethylene hexanediamide/2-methylpentamethylene hexanediamide) (PA46/D6);
Group (III) Polyamides having said melting point of at least 210° C., and comprising
(aa) about 20 to about 35 mole percent semiaromatic repeat units derived from monomers selected from one or more of the group consisting of:
i. aromatic dicarboxylic acids having 8 to 20 carbon atoms and aliphatic diamines having 4 to 20 carbon atoms; and
(bb) about 65 to about 80 mole percent aliphatic repeat units derived from monomers selected from one or more of the group consisting of:
ii. an aliphatic dicarboxylic acid having 6 to 20 carbon atoms and said aliphatic diamine having 4 to 20 carbon atoms; and
iii. a lactam and/or aminocarboxylic acid having 4 to 20 carbon atoms;
Group (IV) Polyamides comprising
(cc) about 50 to about 95 mole percent semiaromatic repeat units derived from monomers selected from one or more of the group consisting of:
(i) aromatic dicarboxylic acids having 8 to 20 carbon atoms and aliphatic diamines having 4 to 20 carbon atoms; and
(dd) about 5 to about 50 mole percent aliphatic repeat units derived from monomers selected from one or more of the group consisting of:
(ii) an aliphatic dicarboxylic acid having 6 to 20 carbon atoms and said aliphatic diamine having 4 to 20 carbon atoms; and
(iii) a lactam and/or aminocarboxylic acid having 4 to 20 carbon atoms;
Group (V) Polyamides having said melting point of at least 260° C., and comprising
(ee) greater than 95 mole percent semiaromatic repeat units derived from monomers selected from one or more of the group consisting of:
i. aromatic dicarboxylic acids having 8 to 20 carbon atoms and aliphatic diamines having 4 to 20 carbon atoms; and
(ff) less than 5 mole percent aliphatic repeat units derived from monomers selected from one or more of the group consisting of:
ii. an aliphatic dicarboxylic acid having 6 to 20 carbon atoms and said aliphatic diamine having 4 to 20 carbon atoms; and
iii. a lactam and/or aminocarboxylic acid having 4 to 20 carbon atoms; and
Group (VI) Polyamides having no melting point and selected from the group consisting of poly(hexamethylene isophthalamide/hexamethylene terephthalamide) (6I/6T) and poly(hexamethylene isophthalamide/hexamethylene terephthalamide/hexamethylene hexanediamide) (6I/6T/66).
3. The molded or extruded thermoplastic article of claim 2 wherein said polyamide resin is selected from Group (I) polyamides.
4. The molded or extruded thermoplastic article of claim 2 wherein said polyamide resin is selected from Group (II) polyamides.
5. The molded or extruded thermoplastic article of claim 2 wherein said polyamide resin is selected from Group (III) polyamides.
6. The molded or extruded thermoplastic article of claim 2 wherein said polyamide resin is selected from Group (IV) polyamides.
7. The molded or extruded thermoplastic article of claim 2 wherein said polyamide resin is selected from Group (V) polyamides.
8. The molded or extruded thermoplastic article of claim 2 wherein said polyamide resin is selected from Group (VI) polyamides.
9. The molded or extruded thermoplastic article of claim 1 wherein the co-stabilizer is present at 0.1 to 3 weight percent.
10. The molded or extruded thermoplastic article of claim 2 wherein said polyamide resin comprises a blend of two or more polyamides selected from the group consisting of Group (I) and Group (II) Polyamides; Group (I) and Group (III) Polyamide, Group (I) and Group (VI) Polyamides, Group (II) and Group (III) Polyamides, Group (II) and Group (IV) Polyamides, Group (II) and Group (V) Polyamides, Group (II) and Group (VI) Polyamides, Group (III) and Group (VI) Polyamides, and Group (IV) and Group (V) Polyamides.
11. The molded or extruded thermoplastic article of claim 10 wherein said polyamide resin comprises a blend of Group (II) and Group (V) Polyamides.
12. The molded or extruded thermoplastic article of claim 10 wherein said polyamide resin comprises a blend of Group (II) and Group (III) Polyamides.
13. The molded or extruded thermoplastic article of claim 1 wherein the polyhydric alcohol is selected from the group consisting of pentaerythritol, dipentaerythritol, tripentaerythritol, di-trimethylopropane, D-mannitol, D-sorbitol and xylitol.
14. The molded thermoplastic article of claim 1 wherein said polyamide composition comprises less than 25 ppm copper as determined with atomic absorption spectroscopy.
15. The molded or extruded thermoplastic article of claim 1 wherein the article is selected from the group consisting of pipes for transporting liquids and gases, inner linings for pipes, fuel lines, air break tubes, coolant pipes, air ducts, pneumatic tubes, hydraulic houses, cable covers, cable ties, connectors, canisters, and push-pull cables.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/512,195 US20100028580A1 (en) | 2008-07-30 | 2009-07-30 | Heat resistant thermoplastic articles |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13734508P | 2008-07-30 | 2008-07-30 | |
| US12/512,195 US20100028580A1 (en) | 2008-07-30 | 2009-07-30 | Heat resistant thermoplastic articles |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20100028580A1 true US20100028580A1 (en) | 2010-02-04 |
Family
ID=41095667
Family Applications (10)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/512,101 Abandoned US20100029820A1 (en) | 2008-07-30 | 2009-07-30 | Long-term heat aging resistant polyamide compositions |
| US12/512,109 Abandoned US20100029819A1 (en) | 2008-07-30 | 2009-07-30 | Heat resistant molded or extruded thermoplastic articles |
| US12/512,062 Abandoned US20100029837A1 (en) | 2008-07-30 | 2009-07-30 | Copolyetherester compositions and articles made from these |
| US12/512,125 Expired - Fee Related US8445574B2 (en) | 2008-07-30 | 2009-07-30 | Heat resistant thermoplastic articles including polyhydroxy polymers |
| US12/512,311 Expired - Fee Related US8445575B2 (en) | 2008-07-30 | 2009-07-30 | Thermoplastic articles including polyhydroxy polymers |
| US12/512,195 Abandoned US20100028580A1 (en) | 2008-07-30 | 2009-07-30 | Heat resistant thermoplastic articles |
| US12/512,172 Abandoned US20100029821A1 (en) | 2008-07-30 | 2009-07-30 | Heat resistant thermoplastic articles including co-stabilizers |
| US13/456,517 Abandoned US20120208954A1 (en) | 2008-07-30 | 2012-04-26 | Copolyetherester compositions and articles made from these |
| US13/615,967 Abandoned US20130072608A1 (en) | 2008-07-30 | 2012-09-14 | Heat resistant thermoplastic articles including polyhydroxy polymers |
| US13/644,536 Abandoned US20130053483A1 (en) | 2008-07-30 | 2012-10-04 | Heat resistant thermoplastic articles including co-stabilizers |
Family Applications Before (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/512,101 Abandoned US20100029820A1 (en) | 2008-07-30 | 2009-07-30 | Long-term heat aging resistant polyamide compositions |
| US12/512,109 Abandoned US20100029819A1 (en) | 2008-07-30 | 2009-07-30 | Heat resistant molded or extruded thermoplastic articles |
| US12/512,062 Abandoned US20100029837A1 (en) | 2008-07-30 | 2009-07-30 | Copolyetherester compositions and articles made from these |
| US12/512,125 Expired - Fee Related US8445574B2 (en) | 2008-07-30 | 2009-07-30 | Heat resistant thermoplastic articles including polyhydroxy polymers |
| US12/512,311 Expired - Fee Related US8445575B2 (en) | 2008-07-30 | 2009-07-30 | Thermoplastic articles including polyhydroxy polymers |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/512,172 Abandoned US20100029821A1 (en) | 2008-07-30 | 2009-07-30 | Heat resistant thermoplastic articles including co-stabilizers |
| US13/456,517 Abandoned US20120208954A1 (en) | 2008-07-30 | 2012-04-26 | Copolyetherester compositions and articles made from these |
| US13/615,967 Abandoned US20130072608A1 (en) | 2008-07-30 | 2012-09-14 | Heat resistant thermoplastic articles including polyhydroxy polymers |
| US13/644,536 Abandoned US20130053483A1 (en) | 2008-07-30 | 2012-10-04 | Heat resistant thermoplastic articles including co-stabilizers |
Country Status (7)
| Country | Link |
|---|---|
| US (10) | US20100029820A1 (en) |
| EP (7) | EP2307503A1 (en) |
| JP (7) | JP2011529993A (en) |
| KR (2) | KR101644200B1 (en) |
| CN (7) | CN102112545A (en) |
| CA (2) | CA2725384A1 (en) |
| WO (7) | WO2010014795A1 (en) |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100120959A1 (en) * | 2008-11-07 | 2010-05-13 | E. I. Du Pont De Nemours And Company | Polymer composition containing heat stabilizer |
| US20100120958A1 (en) * | 2008-11-07 | 2010-05-13 | E. I. Du Pont De Nemours And Company | Heat stabilized polyamide moulding composition |
| WO2012012164A3 (en) * | 2010-06-30 | 2012-04-19 | E. I. Du Pont De Nemours And Company | Injection molded composite wheel for a vehicle |
| WO2012024357A3 (en) * | 2010-08-17 | 2012-05-31 | E. I. Du Pont De Nemours And Company | Salt resistant polyamide compositions |
| WO2012151460A1 (en) * | 2011-05-04 | 2012-11-08 | E. I. Du Pont De Nemours And Company | Polyamide compositions for the inner layer of a multi-layer tubular article and articles incorporating same |
| US20130216751A1 (en) * | 2012-01-30 | 2013-08-22 | Tokai Rubber Industries, Ltd. | Resin hose and method of producing the same |
| JP2013542311A (en) * | 2010-11-10 | 2013-11-21 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Halogen-free flame retardant polyamide composition |
| WO2014017933A1 (en) | 2012-07-23 | 2014-01-30 | Splast Sp. Z O.O. Sp. K. | Composition containing polyamide, silica and silver nanoparticles, and stabilizing additives |
| WO2014041804A1 (en) | 2012-09-14 | 2014-03-20 | 東レ株式会社 | Polyamide resin composition and molded article |
| WO2014078125A1 (en) | 2012-11-19 | 2014-05-22 | E. I. Du Pont De Nemours And Company | Copolyamide compositions |
| WO2014078137A1 (en) | 2012-11-19 | 2014-05-22 | E. I. Du Pont De Nemours And Company | Thermoplastic melt-blended compositions |
| JP2014525506A (en) * | 2011-08-31 | 2014-09-29 | インヴィスタ テクノロジーズ エスアエルエル | Composition comprising polyhydric alcohol and polyamide |
| WO2014160564A1 (en) * | 2013-03-25 | 2014-10-02 | E. I. Du Pont De Nemours And Company | Heat resistant polyamide compositions |
| US20150030929A1 (en) * | 2011-09-30 | 2015-01-29 | Faradion Ltd. | Condensed polyanion electrode |
| EP2821441A4 (en) * | 2012-02-29 | 2015-10-28 | Toray Industries | POLYAMIDE RESIN COMPOSITION HAVING EXCELLENT COLOR NUANCE |
| US9193847B2 (en) | 2008-12-24 | 2015-11-24 | Clariant Production (France) S.A.S. | Polymer compositions with improved barrier properties against the permeation of oxygen |
| EP3235871A4 (en) * | 2014-12-16 | 2018-08-15 | Kuraray Co., Ltd. | Polyamide resin composition and molded article thereof |
| US10450491B2 (en) | 2016-08-08 | 2019-10-22 | Ticona Llc | Thermally conductive polymer composition for a heat sink |
| TWI685527B (en) * | 2015-06-12 | 2020-02-21 | 日商三菱化學股份有限公司 | Resin composition and film and multilayer structure using the resin composition |
| US10927232B2 (en) | 2015-02-20 | 2021-02-23 | Asahi Kasei Kabushiki Kaisha | Polyamide resin composition, method for producing polyamide resin composition, and molded article |
| WO2021170715A1 (en) | 2020-02-26 | 2021-09-02 | Basf Se | Heat-aging resistant polyamide molding compositions |
| US11345780B2 (en) | 2017-06-29 | 2022-05-31 | Toray Industries, Inc. | Thermoplastic polyester resin composition and molded article |
| CN116120743A (en) * | 2022-12-19 | 2023-05-16 | 珠海万通特种工程塑料有限公司 | Glass fiber reinforced polyamide composite material and preparation method and application thereof |
| US12084560B2 (en) | 2018-06-27 | 2024-09-10 | Basf Se | Sinter powder containing a multivalent alcohol for producing moulded bodies |
Families Citing this family (110)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9445581B2 (en) | 2012-03-28 | 2016-09-20 | Kymab Limited | Animal models and therapeutic molecules |
| US20110028621A1 (en) * | 2009-07-30 | 2011-02-03 | E. I. Du Pont De Nemours And Company | Heat aging resistant polyamide compositions including polyhydroxy polymers |
| KR101645267B1 (en) * | 2010-01-15 | 2016-08-04 | 삼성전자 주식회사 | Device and method for processing a measurement for an idle mode device with low mobility in a wireless communication system |
| US8232337B2 (en) | 2010-01-29 | 2012-07-31 | E I Du Pont De Nemours And Company | Polyamide compositions with improved salt resistance and heat stability |
| CN102712810A (en) * | 2010-01-29 | 2012-10-03 | 纳幕尔杜邦公司 | Polyamide compositions with improved salt resistance and heat stability |
| US20110207838A1 (en) * | 2010-02-25 | 2011-08-25 | E.I. Du Pont De Nemours And Company | Recycled thermoplastic with toughener |
| CN102985491B (en) * | 2010-06-15 | 2015-01-28 | 巴斯夫欧洲公司 | Thermal ageing-resistant polyamides |
| JP5776368B2 (en) * | 2010-06-30 | 2015-09-09 | 東レ株式会社 | Polyamide resin composition and method for producing the same |
| EP2606093A1 (en) | 2010-08-17 | 2013-06-26 | E.I. Du Pont De Nemours And Company | Heat stable halogen-free flame retardant copolyester thermoplastic elastomer compositions |
| FR2965565B1 (en) | 2010-10-05 | 2014-05-02 | Rhodia Operations | THERMO-STABILIZED POLYAMIDE COMPOSITION |
| ES2535168T3 (en) * | 2010-10-18 | 2015-05-06 | Dsm Ip Assets B.V. | Composition of heat stabilized polyamide |
| US20120108129A1 (en) * | 2010-10-29 | 2012-05-03 | E. I. Du Pont De Nemours And Company | Polyamide composite structures and processes for their preparation |
| US20120177858A1 (en) * | 2011-01-10 | 2012-07-12 | E.I. Du Pont De Nemours And Company | Polyamide compositions for flow molding |
| US20120196962A1 (en) * | 2011-01-31 | 2012-08-02 | E. I. Du Pont De Nemours And Company | Thermoplastic melt-mixed composition with heat stabilizer |
| US8691911B2 (en) * | 2011-01-31 | 2014-04-08 | E I Du Pont De Nemours And Company | Melt-blended thermoplastic composition |
| FR2974095B1 (en) * | 2011-04-13 | 2014-08-22 | Rhodia Operations | STABILIZED POLYAMIDE |
| FR2974102B1 (en) * | 2011-04-13 | 2014-08-22 | Rhodia Operations | STABILIZED POLYAMIDE COMPOSITION |
| US20120273301A1 (en) | 2011-04-29 | 2012-11-01 | E. I. Du Pont De Nemours And Company | Muffler assembly with mounting adapter(s) and process of manufacture |
| US8424636B2 (en) | 2011-04-29 | 2013-04-23 | E.I. Du Pont De Nemours And Company | Muffler assembly and process of manufacture |
| US8505682B2 (en) | 2011-04-29 | 2013-08-13 | E I Du Pont De Nemours And Company | Lightweight polymeric exhaust components |
| WO2012161064A1 (en) * | 2011-05-20 | 2012-11-29 | 東洋紡株式会社 | Polyamide resin composition for optical components |
| KR101888721B1 (en) * | 2011-06-09 | 2018-09-20 | 솔베이 스페셜티 폴리머즈 유에스에이, 엘.엘.씨. | Polyamides compositions featuring improved thermal stability |
| JP6121995B2 (en) | 2011-06-21 | 2017-04-26 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | Method for producing heat-stabilized polyamide-filled acrylate polymer |
| EP2723811B1 (en) | 2011-06-21 | 2015-08-26 | E. I. du Pont de Nemours and Company | Heat-stabilised polyamide-filled acrylate copolymer and process for its production |
| FR2970970B1 (en) * | 2011-07-11 | 2015-04-03 | Rhodia Operations | STABILIZED POLYAMIDE COMPOSITION |
| CN103717676B (en) | 2011-07-27 | 2016-08-17 | 帝斯曼知识产权资产管理有限公司 | Fire-resistant polyamide composite |
| WO2013028707A2 (en) * | 2011-08-22 | 2013-02-28 | E. I. Du Pont De Nemours And Company | Recycled thermoplastic with toughener |
| FR2980207B1 (en) * | 2011-09-21 | 2013-08-30 | Rhodia Operations | COMPOSITION COMPRISING POLYAMIDE 66 AND POLYAMIDE 610 |
| US20130115401A1 (en) | 2011-11-08 | 2013-05-09 | E I Du Pont De Nemouras And Company | Hydrolytic resistant polyamide compositions comprising polyhydroxy polymers |
| WO2013068326A1 (en) | 2011-11-08 | 2013-05-16 | Solvay Specialty Polymers Usa, Llc | High heat resistant polyamide for down hole oil components |
| US20130158168A1 (en) * | 2011-12-19 | 2013-06-20 | E I Du Pont De Nemours And Company | Aliphatic-aromatic copolyetheresters |
| US20130171394A1 (en) | 2011-12-30 | 2013-07-04 | E. I. Du Pont De Nemours And Company | Polyamide Composition Containing Ionomer |
| US8906479B2 (en) | 2011-12-30 | 2014-12-09 | E I Du Pont De Nemours And Company | Compositions of polyamide and ionomer |
| SG11201403550YA (en) | 2012-01-16 | 2014-09-26 | Promerus Llc | Thermo-oxidatively stable, side chain polyether functionalized polynorbornenes for microelectronic and optoelectronic devices and assemblies thereof |
| CN102627849B (en) * | 2012-03-16 | 2014-06-18 | 深圳市科聚新材料有限公司 | Yellowing high temperature-resistant nylon material and preparation method thereof |
| US20130281589A1 (en) * | 2012-04-23 | 2013-10-24 | E I Du Pont De Nemours And Company | Thermoplastic polyamide composition |
| CN102643534A (en) * | 2012-05-03 | 2012-08-22 | 苏州隆阁新材料有限公司 | Chemical corrosion resistant high impact long carbon chain nylon master batch and preparation method and application thereof |
| EP2847273A1 (en) | 2012-05-07 | 2015-03-18 | DSM IP Assets B.V. | Thermoplastic polymer composition and moulded parts made thereof |
| CN102675869A (en) * | 2012-05-22 | 2012-09-19 | 苏州新区华士达工程塑胶有限公司 | Formula of high-elasticity PA6-GF10HB |
| JP5991033B2 (en) * | 2012-06-07 | 2016-09-14 | 東ソー株式会社 | Polyamide resin composition |
| EP2861668A1 (en) | 2012-06-13 | 2015-04-22 | E. I. Du Pont de Nemours and Company | Thermoplastic melt-mixed composition with epoxy-carboxylic acid compound heat stabilizer |
| WO2013188302A1 (en) | 2012-06-13 | 2013-12-19 | E. I. Du Pont De Nemours And Company | Thermoplastic melt-mixed composition with amino acid heat stabilizer |
| US8871874B2 (en) | 2012-06-13 | 2014-10-28 | E I Du Pont De Nemours And Company | Thermoplastic melt-mixed composition with epoxy-amino acid compound heat stabilizer and processes for their preparation |
| JP2015519463A (en) | 2012-06-13 | 2015-07-09 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | Thermoplastic melt blend composition containing polyetherol thermal stabilizer |
| CN103509633B (en) * | 2012-06-21 | 2015-05-13 | 中国石油天然气股份有限公司 | A kind of preparation method of water-soluble polyether ester lubricating additive |
| JP5971049B2 (en) * | 2012-09-14 | 2016-08-17 | 東レ株式会社 | Polyamide resin composition |
| JP6274782B2 (en) * | 2012-09-27 | 2018-02-07 | ユニチカ株式会社 | Polyamide resin composition and molded body formed by molding the same |
| KR101674242B1 (en) * | 2013-03-15 | 2016-11-08 | 롯데첨단소재(주) | Thermoplastic Resine Composition Having Excellent EMI Shielding Property |
| TW201501794A (en) * | 2013-05-01 | 2015-01-16 | Invista Tech Sarl | Systems and methods for cleaning or maintaining venting system of agitated autoclave |
| EP2829576A1 (en) * | 2013-07-23 | 2015-01-28 | Rhodia Operations | Polyamide composition |
| CN105408424B (en) * | 2013-07-23 | 2018-10-30 | 罗地亚经营管理公司 | Daiamid composition |
| MX382575B (en) | 2013-10-18 | 2025-03-13 | Toray Industries | POLYAMIDE RESIN COMPOSITION, MANUFACTURING METHOD AND MOULDED PRODUCT. |
| CN103554902B (en) * | 2013-10-28 | 2016-04-20 | 徐东 | Nylon composite materials and preparation method thereof |
| EP2881438A1 (en) | 2013-12-05 | 2015-06-10 | LANXESS Deutschland GmbH | Polyamide compositions |
| CN103726919A (en) * | 2013-12-26 | 2014-04-16 | 顺达(芜湖)汽车饰件有限公司 | Novel thermoregulator seat |
| US20160340472A1 (en) * | 2014-01-28 | 2016-11-24 | Radicifil S.P.A. | Three-component copolymers having high transparency and low gas permeability and process for the production thereof |
| US20170022349A1 (en) * | 2014-04-14 | 2017-01-26 | Unitika Ltd. | Semiaromatic polyamide resin composition and formed body obtained by forming same |
| CN106029783A (en) * | 2014-04-30 | 2016-10-12 | 尤尼吉可株式会社 | Semi-aromatic polyamide resin composition and molded article obtained by molding same |
| WO2015178560A1 (en) * | 2014-05-23 | 2015-11-26 | 삼성에스디아이 주식회사 | Copolymerized polyamide resin, method for preparing same, and molded product comprising same |
| CN106661325B (en) * | 2014-06-20 | 2019-09-06 | 罗地亚经营管理公司 | Polyamide moulding compositions, moulded parts obtained therefrom, and uses thereof |
| KR20230006002A (en) * | 2014-07-31 | 2023-01-10 | 이 아이 듀폰 디 네모아 앤드 캄파니 | Furan based polyamides and articles made therefrom |
| JP6657821B2 (en) * | 2014-12-04 | 2020-03-04 | 東レ株式会社 | Polyamide resin composition and method for producing the same |
| WO2016094381A1 (en) * | 2014-12-11 | 2016-06-16 | Ticona Llc | Stabilized flexible thermoplastic composition and products formed therefrom |
| JP6645180B2 (en) * | 2015-01-08 | 2020-02-14 | 東レ株式会社 | Polyamide resin composition and molded article obtained by molding the same |
| JP6750219B2 (en) * | 2015-01-09 | 2020-09-02 | 東レ株式会社 | Modified polyamide resin and method for producing the same |
| KR20160094724A (en) | 2015-02-02 | 2016-08-10 | 현대자동차주식회사 | Carbon fiber reinforced thermoplastic resin composition and molded article using the same |
| JP6724368B2 (en) * | 2015-02-23 | 2020-07-15 | 東レ株式会社 | Molded article and polyamide resin composition |
| EP3093312A1 (en) * | 2015-05-12 | 2016-11-16 | LANXESS Deutschland GmbH | Thermoplastic moulding materials |
| US9878467B2 (en) | 2015-06-19 | 2018-01-30 | The Procter & Gamble Company | Apparatus and process for forming particles |
| CN106317793B (en) * | 2015-06-19 | 2018-08-21 | 江苏裕兴薄膜科技股份有限公司 | PET compounds and preparation method thereof for producing heat-proof aging insulating film |
| EP3115406A1 (en) * | 2015-07-10 | 2017-01-11 | LANXESS Deutschland GmbH | Thermoplastic moulding materials |
| CN106478930B (en) * | 2015-08-24 | 2019-12-27 | 中国石油化工股份有限公司 | Preparation method of thermoplastic polyester elastomer base material |
| JP6197967B1 (en) | 2015-10-30 | 2017-09-20 | 東レ株式会社 | Thermoplastic polyester resin composition and molded article |
| CN105315629A (en) * | 2015-11-06 | 2016-02-10 | 东华大学 | High-flow polyester composition and preparation method thereof |
| CN105440646B (en) * | 2015-12-18 | 2017-08-11 | 天津金发新材料有限公司 | A kind of thermoplastic resin composition and preparation method and application |
| WO2017155891A1 (en) * | 2016-03-08 | 2017-09-14 | Invista North America S.A R.L. | Polyamide copolymer and method of making the same |
| KR101816434B1 (en) | 2016-09-06 | 2018-01-08 | 현대자동차주식회사 | Carbon fiber reinforced thermoplastic resin composition for foam molding and molded article using the same |
| CN110582816B (en) | 2017-03-10 | 2021-04-16 | 艾德凡斯化学公司 | Wire and cable jacketing compositions of PA6/66 copolymer base resin for improved processability and properties |
| JP6913521B2 (en) * | 2017-06-09 | 2021-08-04 | 株式会社アズ | Functional fabric and its manufacturing method |
| US20210079218A1 (en) | 2017-07-13 | 2021-03-18 | Lanxess Deutschland Gmbh | Thermally stabilized compositions |
| CN110891753A (en) * | 2017-07-13 | 2020-03-17 | 朗盛德国有限责任公司 | heat stable composition |
| CA3075401A1 (en) * | 2017-09-28 | 2019-04-04 | Dupont Polymers, Inc. | Polymerization process |
| CA3083050A1 (en) | 2017-11-23 | 2019-05-31 | Basf Se | Polyamide composition for the production of weldable moulded bodies |
| WO2019107096A1 (en) * | 2017-11-30 | 2019-06-06 | ユニチカ株式会社 | Polyamide resin composition and molded article obtained by molding same |
| JP2021507981A (en) * | 2017-12-21 | 2021-02-25 | パフォーマンス ポリアミドス,エスエーエス | Polyamide preparation containing semi-crystalline copolyamide and flat glass fiber |
| EP3746510B1 (en) | 2018-02-02 | 2024-01-31 | Basf Se | Use of polyvalent alcohols for increasing weld line strength after heat ageing in polyamides |
| EP3844220A1 (en) * | 2018-08-30 | 2021-07-07 | Dupont Polymers, Inc. | Copolyetherester formulation with improved heat-stability |
| DE102019200905A1 (en) * | 2019-01-24 | 2020-07-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process for stabilizing halogen-free thermoplastic recycled plastics, plastic composition, stabilizer composition and use of the stabilizer composition |
| BR112021015395A2 (en) * | 2019-02-06 | 2021-10-05 | Ascend Performance Materials Operations Llc | POLYAMIDES THAT HAVE HIGH LEVELS OF AMINE END GROUPS |
| JP7356382B2 (en) * | 2019-04-15 | 2023-10-04 | 旭化成株式会社 | Polyamide compositions and molded products |
| US20220064443A1 (en) | 2019-05-16 | 2022-03-03 | Unitika Ltd. | Polyamide resin composition |
| CN110229515B (en) * | 2019-06-28 | 2021-12-10 | 江苏晋伦塑料科技有限公司 | High-heat-resistance polyamide composition and preparation method thereof |
| US11753505B2 (en) * | 2019-09-09 | 2023-09-12 | Xerox Corporation | Polyamides with pendent optical absorbers and related methods |
| MX2022004816A (en) | 2019-10-24 | 2022-05-16 | Invista Textiles Uk Ltd | Polyamide compositions and articles made therefrom. |
| EP3848410A1 (en) | 2020-01-09 | 2021-07-14 | L. Brüggemann GmbH & Co. KG | Polyamide materials with improved long-term properties |
| JP2023516255A (en) | 2020-01-27 | 2023-04-19 | ビーエーエスエフ ソシエタス・ヨーロピア | Thermoplastic polyamide molding composition with heat resistance |
| CN113372615A (en) * | 2020-03-10 | 2021-09-10 | 双键化工股份有限公司 | Use of stabilizer, plastic composition and plastic product thereof |
| BR112022019115A2 (en) | 2020-03-25 | 2022-11-08 | Basf Se | THERMOPLASTIC MODELING COMPOSITION, COMPOSITION PREPARATION PROCESS, COMPOSITION USE AND FIBER, FOIL OR MODELING |
| FR3111351B1 (en) * | 2020-06-10 | 2022-09-09 | Arkema France | POLYAMIDE COMPOSITIONS HAVING A HIGH MODULUS AND A LOW DIELECTRIC CONSTANT AND THEIR USE |
| CN112011175A (en) * | 2020-09-11 | 2020-12-01 | 广州辰东新材料有限公司 | Metallic copolymerized nylon modified material |
| KR20220046155A (en) | 2020-10-07 | 2022-04-14 | 현대자동차주식회사 | Long glass fiber reinforced thermoplastic resin composition and molded article comprising the same |
| KR102911799B1 (en) * | 2020-10-14 | 2026-01-14 | 주식회사 엘지화학 | Thermoplastic resin composition, method for preparing the same and article prepared therefrom |
| KR102589937B1 (en) * | 2021-04-01 | 2023-10-17 | 현대모비스 주식회사 | Wave guide for radar |
| CN114181522B (en) * | 2021-11-03 | 2024-08-09 | 横店集团得邦工程塑料有限公司 | Alcoholysis-resistant heat-stable PPA composite material and preparation method thereof |
| WO2023100065A1 (en) | 2021-12-01 | 2023-06-08 | Inv Nylon Polymers Americas, Llc | Polyamide compositions and articles made therefrom |
| CN114957973B (en) * | 2022-06-09 | 2023-09-15 | 江门市德众泰尼龙有限公司 | Automobile water chamber material and preparation method thereof |
| CN116396474B (en) * | 2023-04-10 | 2024-06-18 | 宜兴市江山生物科技有限公司 | Hyperbranched polyether ester with multiple purposes and preparation method thereof |
| CN121729444A (en) | 2023-08-31 | 2026-03-24 | Ems-化学公开股份有限公司 | Polyamide molding compound for producing a component having high weld mark strength |
| CN118620518A (en) * | 2024-06-04 | 2024-09-10 | 赵幸凯 | A high temperature resistant environmentally friendly insulating coating for electronic devices and a preparation method thereof |
| WO2026089042A1 (en) * | 2024-10-25 | 2026-04-30 | ユニチカ株式会社 | Semi-aromatic polyamide composition, semi-aromatic polyamide film and production method therefor, electronic material, optical component, and solar power generation module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1041109A2 (en) * | 1999-03-30 | 2000-10-04 | Ube Industries, Ltd. | Polyamide compositions having good fluidity |
| US20020151625A1 (en) * | 2000-10-04 | 2002-10-17 | Sadayuki Yakabe | Flame retardant reinforced polyamide resin composition |
| US20060058432A1 (en) * | 2004-05-04 | 2006-03-16 | General Electric Company | Halogen-free flame retardant polyamide composition with improved electrical and flammability properties |
Family Cites Families (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1041109A (en) * | 1912-03-28 | 1912-10-15 | Stevens Arms & Tool Company J | Magazine-gun. |
| NL103099C (en) | 1957-04-11 | |||
| BE793332A (en) * | 1972-01-26 | 1973-04-16 | Du Pont | THERMOPLASTIC COPOLYESTERS WITH SEGMENTS |
| US4013624A (en) * | 1972-03-20 | 1977-03-22 | E. I. Du Pont De Nemours And Company | Branched thermoplastic copolyesters |
| US4332855A (en) * | 1978-04-14 | 1982-06-01 | Raychem Corporation | Polymeric compositions |
| US4205158A (en) * | 1979-03-28 | 1980-05-27 | E. I. Du Pont De Nemours And Company | Copolyetherester based on ethylene oxide-capped poly(propylene oxide) glycol and branching agent |
| US4351745A (en) * | 1980-01-09 | 1982-09-28 | E. I. Du Pont De Nemours And Company | Electrically conductive polyetherester elastomers |
| GB2170593B (en) | 1985-02-01 | 1988-09-14 | Central Electr Generat Board | Temperature measurement |
| DE3665317D1 (en) * | 1985-05-17 | 1989-10-05 | Akzo Nv | Copolyetherester based on poly(propylene oxide) glycol blocked with ethylene oxide |
| JP2640368B2 (en) * | 1987-12-08 | 1997-08-13 | 旭化成工業株式会社 | Polyamide resin composition |
| US5362777A (en) * | 1988-11-03 | 1994-11-08 | Ivan Tomka | Thermoplastically processable starch and a method of making it |
| JPH048764A (en) * | 1990-04-26 | 1992-01-13 | Toyoda Gosei Co Ltd | Vibration-damping resin-molded article for engine |
| DE4112324A1 (en) | 1991-04-16 | 1992-10-22 | Basf Ag | STABILIZED THERMOPLASTIC PARTICULAR POLYAMIDE MOLDING |
| JPH051223A (en) * | 1991-06-27 | 1993-01-08 | Showa Denko Kk | Polyamide resin composition of excellent light resistance |
| DE4305166A1 (en) | 1993-02-19 | 1994-08-25 | Bayer Ag | Thermostable copper-containing polyamide molding compounds |
| BE1009072A3 (en) * | 1995-02-03 | 1996-11-05 | Dsm Nv | Copolyether ester. |
| JPH08283570A (en) * | 1995-04-17 | 1996-10-29 | Sumitomo Chem Co Ltd | Resin composition |
| JPH09286887A (en) * | 1996-04-18 | 1997-11-04 | Sumitomo Chem Co Ltd | Resin composition |
| JPH10130497A (en) * | 1996-11-01 | 1998-05-19 | Mitsubishi Gas Chem Co Inc | Polyamide resin composition |
| EP1086985B1 (en) * | 1997-09-02 | 2003-10-15 | Ajinomoto Co., Inc. | Thermoplastic resin composition, agent for improving thermal aging resistance of thermoplastic resin, and resin molded article obtained therefrom |
| JPH11189673A (en) * | 1997-12-26 | 1999-07-13 | Ajinomoto Co Inc | Thermoplastic resin composition |
| NL1009288C2 (en) * | 1998-05-29 | 1999-11-30 | Dsm Nv | UV stable polyetherester copolymer composition and foil thereof. |
| JP2000026625A (en) * | 1998-07-15 | 2000-01-25 | Asahi Chem Ind Co Ltd | Adhering heat-resistant wrapping film |
| US6075113A (en) * | 1998-10-05 | 2000-06-13 | Mirror Image Technologies, Inc. | Wheel composition |
| JP2008274305A (en) * | 1999-03-30 | 2008-11-13 | Ube Ind Ltd | Polyamide composition having good fluidity |
| EP1216152B1 (en) * | 1999-09-27 | 2010-12-08 | E.I. Du Pont De Nemours And Company | Extrusion coating process |
| JP2002275370A (en) * | 2001-03-21 | 2002-09-25 | Asahi Kasei Corp | Flame retardant polyamide resin composition |
| KR100448115B1 (en) * | 2000-11-30 | 2004-09-10 | 현대자동차주식회사 | A polyamide resin composition |
| KR100387850B1 (en) * | 2000-12-29 | 2003-06-18 | 현대자동차주식회사 | Polyamide resin composition and synthetic resin product |
| US20040024102A1 (en) * | 2002-07-30 | 2004-02-05 | Hayes Richard Allen | Sulfonated aliphatic-aromatic polyetherester films, coatings, and laminates |
| EP1389633A1 (en) * | 2002-08-14 | 2004-02-18 | The Procter & Gamble Company | Improved thermoplastic hydrophilic adhesive compositions for dry and wet surfaces the compositions having an increased water adhesion stability |
| NL1022859C2 (en) * | 2003-03-06 | 2004-09-07 | Dsm Nv | UV-stabilized polyamide composition. |
| JP4619624B2 (en) * | 2003-03-31 | 2011-01-26 | 旭硝子株式会社 | Laminated hose |
| US20040242737A1 (en) * | 2003-04-14 | 2004-12-02 | Georgios Topulos | Polyamide composition for blow molded articles |
| US7241403B2 (en) * | 2003-05-29 | 2007-07-10 | General Electric Company | Method for making a conductive thermoplastic composition |
| EP1486696A1 (en) * | 2003-06-11 | 2004-12-15 | DSM IP Assets B.V. | Process for making a compression spring member from copolyetherester |
| EP1498445A1 (en) | 2003-07-18 | 2005-01-19 | DSM IP Assets B.V. | Heat stabilized moulding composition |
| EP1658163B1 (en) | 2003-08-19 | 2020-01-01 | Solvay Specialty Polymers USA, LLC. | Impact-modified polyamide hollow body |
| JP2005145996A (en) * | 2003-11-11 | 2005-06-09 | Mitsubishi Engineering Plastics Corp | Polyamide resin composition |
| CA2545529A1 (en) | 2003-11-26 | 2005-06-16 | E.I. Du Pont De Nemours And Company | High flow, toughened, weatherable polyamide compositions containing a blend of stabilizers |
| CN1906246A (en) | 2003-12-25 | 2007-01-31 | Jsr株式会社 | Thermoplastic elastomer composition, method for producing same and formed article |
| DE602005009660D1 (en) * | 2004-02-05 | 2008-10-23 | Dsm Ip Assets Bv | BLOCKCOPOLYETHERESTERELASTOMER AND MANUFACTURING METHOD THEREFOR |
| US7144972B2 (en) * | 2004-07-09 | 2006-12-05 | E. I. Du Pont De Nemours And Company | Copolyetherester compositions containing hydroxyalkanoic acids and shaped articles produced therefrom |
| WO2006006535A1 (en) * | 2004-07-12 | 2006-01-19 | Mitsubishi Engineering-Plastics Corporation | Thermoplastic resin composition |
| EP1683830A1 (en) | 2005-01-12 | 2006-07-26 | DSM IP Assets B.V. | Heat stabilized moulding composition |
| JP4802555B2 (en) * | 2005-05-27 | 2011-10-26 | 横浜ゴム株式会社 | Resin composition for molding |
| DE102005026265A1 (en) | 2005-06-08 | 2006-12-14 | Degussa Ag | Fire-resistant polyamide molding compound |
| US7825176B2 (en) * | 2005-08-31 | 2010-11-02 | Sabic Innovative Plastics Ip B.V. | High flow polyester composition |
| WO2007036929A2 (en) * | 2005-09-29 | 2007-04-05 | Nilit Ltd. | Modified polyamides, uses thereof and process for their preparation |
| DE602006013351D1 (en) * | 2005-11-23 | 2010-05-12 | Du Pont | CARBONIFIED REINFORCED POLYAMIDE RESIN COMPOSITION |
| JP4468295B2 (en) * | 2005-12-15 | 2010-05-26 | ダイセルポリマー株式会社 | Plating resin molding |
| DE602006014736D1 (en) * | 2006-04-25 | 2010-07-15 | Nippon Synthetic Chem Ind | RESIN COMPOSITION AND MULTILAYER STRUCTURE IN WHICH IT IS USED |
| JP5301086B2 (en) * | 2006-05-12 | 2013-09-25 | ディーエスエム アイピー アセッツ ビー.ブイ. | Resin composition for manufacturing automobile exterior parts |
| CN101511944B (en) * | 2006-06-30 | 2011-08-24 | 东丽株式会社 | Thermoplastic resin composition and molded article thereof |
| JP5169037B2 (en) * | 2006-06-30 | 2013-03-27 | 東レ株式会社 | Thermoplastic resin composition, method for producing the same, and molded article comprising the same |
| KR100864605B1 (en) * | 2007-06-29 | 2008-10-23 | 로디아폴리아마이드 주식회사 | Thermoplastic polyamide resin composition with enhanced paint adhesion |
| JP5272715B2 (en) * | 2007-12-26 | 2013-08-28 | 東レ株式会社 | Thermoplastic polyester resin composition |
-
2009
- 2009-07-30 CN CN2009801299747A patent/CN102112545A/en active Pending
- 2009-07-30 US US12/512,101 patent/US20100029820A1/en not_active Abandoned
- 2009-07-30 WO PCT/US2009/052231 patent/WO2010014795A1/en not_active Ceased
- 2009-07-30 CA CA2725384A patent/CA2725384A1/en not_active Abandoned
- 2009-07-30 WO PCT/US2009/052238 patent/WO2010014801A1/en not_active Ceased
- 2009-07-30 JP JP2011521324A patent/JP2011529993A/en active Pending
- 2009-07-30 CN CN2009801299732A patent/CN102112527B/en not_active Expired - Fee Related
- 2009-07-30 CN CN2009801297741A patent/CN102112550A/en active Pending
- 2009-07-30 EP EP09790988A patent/EP2307503A1/en not_active Withdrawn
- 2009-07-30 KR KR1020117004405A patent/KR101644200B1/en not_active Ceased
- 2009-07-30 US US12/512,109 patent/US20100029819A1/en not_active Abandoned
- 2009-07-30 CN CN2009801298157A patent/CN102112525B/en active Active
- 2009-07-30 EP EP20090790995 patent/EP2307481A1/en not_active Withdrawn
- 2009-07-30 CN CN2009801298212A patent/CN102112551B/en not_active Expired - Fee Related
- 2009-07-30 EP EP09790987A patent/EP2307502A1/en not_active Withdrawn
- 2009-07-30 EP EP09791004.6A patent/EP2307482B1/en active Active
- 2009-07-30 CN CN2009801298227A patent/CN102112526B/en active Active
- 2009-07-30 EP EP09803583.5A patent/EP2307499A4/en not_active Withdrawn
- 2009-07-30 US US12/512,062 patent/US20100029837A1/en not_active Abandoned
- 2009-07-30 JP JP2011521310A patent/JP5475777B2/en not_active Expired - Fee Related
- 2009-07-30 US US12/512,125 patent/US8445574B2/en not_active Expired - Fee Related
- 2009-07-30 CN CN2009801297737A patent/CN102112549B/en not_active Expired - Fee Related
- 2009-07-30 US US12/512,311 patent/US8445575B2/en not_active Expired - Fee Related
- 2009-07-30 JP JP2011521311A patent/JP2011529987A/en not_active Withdrawn
- 2009-07-30 US US12/512,195 patent/US20100028580A1/en not_active Abandoned
- 2009-07-30 WO PCT/US2009/052212 patent/WO2010014785A1/en not_active Ceased
- 2009-07-30 JP JP2011521314A patent/JP5677953B2/en not_active Expired - Fee Related
- 2009-07-30 EP EP09790992.3A patent/EP2307504B1/en not_active Not-in-force
- 2009-07-30 WO PCT/US2009/052253 patent/WO2010014810A1/en not_active Ceased
- 2009-07-30 WO PCT/US2009/052219 patent/WO2010014791A1/en not_active Ceased
- 2009-07-30 EP EP09790983.2A patent/EP2307480B1/en not_active Not-in-force
- 2009-07-30 JP JP2011521312A patent/JP5667054B2/en not_active Expired - Fee Related
- 2009-07-30 WO PCT/US2009/052217 patent/WO2010014790A1/en not_active Ceased
- 2009-07-30 JP JP2011521315A patent/JP2011529990A/en active Pending
- 2009-07-30 KR KR1020117004583A patent/KR20110032001A/en not_active Withdrawn
- 2009-07-30 JP JP2011521317A patent/JP6042064B2/en active Active
- 2009-07-30 US US12/512,172 patent/US20100029821A1/en not_active Abandoned
- 2009-07-30 CA CA2726010A patent/CA2726010A1/en not_active Abandoned
- 2009-07-30 WO PCT/US2009/052232 patent/WO2010014796A2/en not_active Ceased
-
2012
- 2012-04-26 US US13/456,517 patent/US20120208954A1/en not_active Abandoned
- 2012-09-14 US US13/615,967 patent/US20130072608A1/en not_active Abandoned
- 2012-10-04 US US13/644,536 patent/US20130053483A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1041109A2 (en) * | 1999-03-30 | 2000-10-04 | Ube Industries, Ltd. | Polyamide compositions having good fluidity |
| US20020151625A1 (en) * | 2000-10-04 | 2002-10-17 | Sadayuki Yakabe | Flame retardant reinforced polyamide resin composition |
| US20060058432A1 (en) * | 2004-05-04 | 2006-03-16 | General Electric Company | Halogen-free flame retardant polyamide composition with improved electrical and flammability properties |
Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100120958A1 (en) * | 2008-11-07 | 2010-05-13 | E. I. Du Pont De Nemours And Company | Heat stabilized polyamide moulding composition |
| US20100120959A1 (en) * | 2008-11-07 | 2010-05-13 | E. I. Du Pont De Nemours And Company | Polymer composition containing heat stabilizer |
| US9193847B2 (en) | 2008-12-24 | 2015-11-24 | Clariant Production (France) S.A.S. | Polymer compositions with improved barrier properties against the permeation of oxygen |
| WO2012012164A3 (en) * | 2010-06-30 | 2012-04-19 | E. I. Du Pont De Nemours And Company | Injection molded composite wheel for a vehicle |
| WO2012024357A3 (en) * | 2010-08-17 | 2012-05-31 | E. I. Du Pont De Nemours And Company | Salt resistant polyamide compositions |
| US8445569B2 (en) | 2010-08-17 | 2013-05-21 | E I Du Pont De Nemours And Company | Salt resistant polyamide compositions |
| JP2013542311A (en) * | 2010-11-10 | 2013-11-21 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Halogen-free flame retardant polyamide composition |
| WO2012151460A1 (en) * | 2011-05-04 | 2012-11-08 | E. I. Du Pont De Nemours And Company | Polyamide compositions for the inner layer of a multi-layer tubular article and articles incorporating same |
| JP2014525506A (en) * | 2011-08-31 | 2014-09-29 | インヴィスタ テクノロジーズ エスアエルエル | Composition comprising polyhydric alcohol and polyamide |
| US20150030929A1 (en) * | 2011-09-30 | 2015-01-29 | Faradion Ltd. | Condensed polyanion electrode |
| US9608269B2 (en) * | 2011-09-30 | 2017-03-28 | Faradion Ltd. | Condensed polyanion electrode |
| US20130216751A1 (en) * | 2012-01-30 | 2013-08-22 | Tokai Rubber Industries, Ltd. | Resin hose and method of producing the same |
| EP2821441A4 (en) * | 2012-02-29 | 2015-10-28 | Toray Industries | POLYAMIDE RESIN COMPOSITION HAVING EXCELLENT COLOR NUANCE |
| WO2014017933A1 (en) | 2012-07-23 | 2014-01-30 | Splast Sp. Z O.O. Sp. K. | Composition containing polyamide, silica and silver nanoparticles, and stabilizing additives |
| WO2014041804A1 (en) | 2012-09-14 | 2014-03-20 | 東レ株式会社 | Polyamide resin composition and molded article |
| US9493611B2 (en) | 2012-09-14 | 2016-11-15 | Toray Industries, Inc. | Polyamide resin composition and molded product |
| WO2014078137A1 (en) | 2012-11-19 | 2014-05-22 | E. I. Du Pont De Nemours And Company | Thermoplastic melt-blended compositions |
| WO2014078125A1 (en) | 2012-11-19 | 2014-05-22 | E. I. Du Pont De Nemours And Company | Copolyamide compositions |
| WO2014160564A1 (en) * | 2013-03-25 | 2014-10-02 | E. I. Du Pont De Nemours And Company | Heat resistant polyamide compositions |
| EP3235871A4 (en) * | 2014-12-16 | 2018-08-15 | Kuraray Co., Ltd. | Polyamide resin composition and molded article thereof |
| US10995197B2 (en) | 2014-12-16 | 2021-05-04 | Kuraray Co., Ltd. | Polyamide resin composition and molded article thereof |
| US10927232B2 (en) | 2015-02-20 | 2021-02-23 | Asahi Kasei Kabushiki Kaisha | Polyamide resin composition, method for producing polyamide resin composition, and molded article |
| TWI685527B (en) * | 2015-06-12 | 2020-02-21 | 日商三菱化學股份有限公司 | Resin composition and film and multilayer structure using the resin composition |
| US10703887B2 (en) | 2015-06-12 | 2020-07-07 | Mitsubishi Chemical Corporation | Resin composition, film produced by using the resin composition, and multilayer structure |
| US10450491B2 (en) | 2016-08-08 | 2019-10-22 | Ticona Llc | Thermally conductive polymer composition for a heat sink |
| US11028304B2 (en) | 2016-08-08 | 2021-06-08 | Ticona Llc | Thermally conductive polymer composition for a heat sink |
| US11345780B2 (en) | 2017-06-29 | 2022-05-31 | Toray Industries, Inc. | Thermoplastic polyester resin composition and molded article |
| US12084560B2 (en) | 2018-06-27 | 2024-09-10 | Basf Se | Sinter powder containing a multivalent alcohol for producing moulded bodies |
| WO2021170715A1 (en) | 2020-02-26 | 2021-09-02 | Basf Se | Heat-aging resistant polyamide molding compositions |
| CN116120743A (en) * | 2022-12-19 | 2023-05-16 | 珠海万通特种工程塑料有限公司 | Glass fiber reinforced polyamide composite material and preparation method and application thereof |
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8445575B2 (en) | Thermoplastic articles including polyhydroxy polymers | |
| US20110028621A1 (en) | Heat aging resistant polyamide compositions including polyhydroxy polymers | |
| EP2841504B1 (en) | Thermoplastic polyamide composition | |
| EP2528972A2 (en) | Polyamide compositions with improved salt resistance and heat stability | |
| US8232337B2 (en) | Polyamide compositions with improved salt resistance and heat stability | |
| US20140066568A1 (en) | Polyamide resin blends |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |
