US20100012301A1 - Pulsating fluid cooling with frequency control - Google Patents

Pulsating fluid cooling with frequency control Download PDF

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Publication number
US20100012301A1
US20100012301A1 US12/518,296 US51829607A US2010012301A1 US 20100012301 A1 US20100012301 A1 US 20100012301A1 US 51829607 A US51829607 A US 51829607A US 2010012301 A1 US2010012301 A1 US 2010012301A1
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United States
Prior art keywords
transducer
frequency
feedback
variable
fluid
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Abandoned
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US12/518,296
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English (en)
Inventor
Ronaldus Maria Aarts
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Signify Holding BV
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Koninklijke Philips Electronics NV
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Assigned to KONINKLIJKE PHILIPS ELECTRONICS N V reassignment KONINKLIJKE PHILIPS ELECTRONICS N V ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AARTS, RONALDUS MARIA
Publication of US20100012301A1 publication Critical patent/US20100012301A1/en
Assigned to KONINKLIJKE PHILIPS N.V. reassignment KONINKLIJKE PHILIPS N.V. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Assigned to PHILIPS LIGHTING HOLDING B.V. reassignment PHILIPS LIGHTING HOLDING B.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KONINKLIJKE PHILIPS N.V.
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04F—PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED; SIPHONS
    • F04F7/00—Pumps displacing fluids by using inertia thereof, e.g. by generating vibrations therein
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to pulsating fluid cooling, i.e. cooling where a transducer induces an oscillation creating a pulsating fluid stream that can be directed towards an object that is to be cooled. It may be advantageous to drive the system at, or at least close to, its resonance frequency, in order to obtain a high fluid velocity.
  • the need for cooling has increased in various applications due to higher heat flux densities resulting from newly developed electronic devices, being, for example, more compact and/or higher power than traditional devices.
  • improved devices include, for example, higher power semiconductor light-sources, such as lasers or light-emitting diodes, RF power devices and higher performance micro-processors, hard disk drives, optical drives like CDR, DVD and Blue ray drives, and large-area devices such as flat TVs and luminaires.
  • WO 2005/008348 discloses a synthetic jet actuator and a tube for cooling purposes.
  • the tube is connected to a resonating cavity, and a pulsating jet stream is created at the distal end of the tube, and can be used to cool an object.
  • the cavity and the tube form a Helmholtz resonator, i.e. a second order system where the air in the cavity acts as a spring, while the air in the tube acts as the mass.
  • a pulsating fluid stream (typically air stream) of this kind has been found to be more efficient for cooling than laminar flow, as typically used in conventional cooling systems (e.g. cooling fans).
  • the resonance cooling systems further require less space, and generates less noise.
  • Such pulsating cooling systems are preferably driven at a specific working frequency, e.g. the resonance frequency or anti-resonance frequency of the system.
  • a specific working frequency e.g. the resonance frequency or anti-resonance frequency of the system.
  • Prior art cooling devices lack satisfactory means to ensure such efficient driving.
  • conventional pulsating cooling devices lack the ability to adapt and control the working frequency of the transducer based on the conditions and performance of the cooling device.
  • a pulsating fluid cooling device comprising a transducer for generating a pulsating fluid flow, a fluid guiding structure for directing the pulsating flow towards an object to be cooled, a sensor for detecting at least one variable representing a condition of the object, a feedback path for providing a feedback signal indicative of this variable, and control circuitry arranged to receive the feedback signal and to generate a frequency control signal based on said feedback, for controlling a working frequency of the transducer. Control of the working frequency is thus performed based on an external feedback path, which may provide information from the object to be cooled. Such information may include, but is not limited to: a temperature change of the object, a fluid flux in a vicinity of the object, a fluid velocity in a vicinity of the object, etc.
  • the frequency control will thus enable adaptation of the working frequency to the performance of the cooling device.
  • such frequency control can be utilized to ensure satisfactory cooling efficiency.
  • the frequency can be controlled based on actual performance.
  • the performance can be optimized in terms of the measured variable. For example, if the feedback signal includes information about the temperature change of the object, the control circuitry can be arranged to select a working frequency that results in optimal cooling.
  • a pulsating fluid cooling device comprises a transducer for generating a pulsating fluid flow, a fluid guiding structure for directing the pulsating flow towards an object to be cooled, a combination unit for combining a first signal indicative of the phase of the voltage across the transducer and a second signal indicative of the phase of the current through the transducer, so as to generate a phase difference signal, and control circuitry for controlling the frequency of the transducer in accordance with this phase difference signal.
  • the working frequency is the resonance frequency or the anti-resonance frequency of the device (i.e. transducer and guiding structure), and the control unit is arranged to ensure this working frequency.
  • circuitry for ensuring resonance frequency driving, is disclosed in the document WO 2005/027569, but has not been suggested for use in a pulsating fluid cooling device. This combination is therefore novel per se.
  • a control system according to WO 2005/027569 is complemented by the external feedback from the sensor, thereby enabling adjustments of the control strategy based on resonance frequency control in combination with external feedback (such as temperature).
  • FIG. 1 is a schematic view of a pulsating fluid cooling device according to an embodiment of the invention.
  • FIG. 2 is a block diagram of a first alternative of the controller in FIG. 1 .
  • FIG. 3 is a schematic view of a pulsating fluid cooling device according to the invention.
  • FIG. 4 is a block diagram of a second alternative of the controller in FIG. 1 .
  • FIG. 1 shows an embodiment of a pulsating fluid cooling system according to an embodiment of the present invention.
  • the system comprises a transducer 1 , arranged in an enclosure 2 , and a fluid directing structure 3 , here in the form of a tube extending from the cavity.
  • the transducer creates a pulsating fluid flow, that is directed by the fluid directing structure towards an object 4 to be cooled, such as an integrated circuit.
  • the system further comprises a control unit 5 , adapted to control the frequency of the transducer, in order to optimize the cooling process.
  • a feedback path 6 is adapted to provide a feedback signal to the control unit.
  • the feedback signal represents a variable external to the cooling device, and may advantageously be related to a physical quantity the object 4 .
  • the feedback signal can be generated by a sensor 7 .
  • the feedback signal relates to the temperature of the object, and the sensor 7 is designed to generate a signal indicative of the temperature.
  • the senor is arranged to detect a current flowing through an object 4 in the form of an IC. By performing the measurement at a position exposed to a constant voltage difference, the detected current will be indicative of the temperature of the IC.
  • the senor is a more conventional temperature transmitter, providing a voltage proportional to the temperature that the sensor is subjected to.
  • the unit 5 comprises a processing unit 11 , a voltage controlled oscillator (VCO) 12 , and an operational amplifier 13 .
  • the processing unit 11 is connected to the feedback path 6 , and receives the feedback signal, e.g. a temperature indication from a sensor 7 . Based on this feedback, the processing unit 11 determines a frequency suitable for achieving a desired cooling performance, and provides a voltage corresponding to this frequency to the VCO 12 .
  • the VCO 12 oscillates at the requested frequency, and its output is supplied to the operational amplifier 13 , which in turn is connected to the transducer 1 .
  • the processing in the processing unit 11 depends on the feedback provided, and also of the desired performance.
  • the processing unit 11 is adapted to monitor a temperature change of the object 4 in relation to the applied frequency. Form this relationship, an absolute or local minimum can be selected, i.e. a frequency for which the temperature of the object 4 is minimal. This corresponds to the currently most efficient cooling frequency. Note that such feedback ensures that an optimal frequency is maintained also in a dynamic process, i.e. in case the optimal cooling frequency should vary over time.
  • the feedback signal relates to a net fluid flux in close vicinity of the object 4 . The processing unit can then adjust the frequency so as to ensure a maximum net flux, which typically will ensure satisfactory cooling.
  • FIG. 3 A different embodiment of the invention is illustrated in FIG. 3 .
  • the transducer 1 is arranged to be controlled at a working frequency equal to the resonance frequency or anti-resonance frequency of the device. Characteristic for these working frequencies is that they will result in a voltage across the transducer in phase with the current flowing through the transducer. The frequency control can therefore be based on this relationship.
  • the control circuitry in FIG. 3 comprises a voltage controlled oscillator (VCO) 12 , connected to the transducer via an operational amplifier 13 . It further comprises a resistor 23 connected between the transducer coil and ground. The voltage across the resistor V R will thus be in phase with the current through the coil.
  • This voltage V R is connected to a combination unit 24 , e.g. a multiplier, also provided with the drive voltage from the VCO 12 , V VCO .
  • the output of the combination unit 24 is connected to a control unit 25 , which in turn controls the VCO 12 .
  • the output from the combination unit 24 is representative of a phase difference between the voltages V R and V VCO .
  • the control unit 25 provides a control signal to the VCO 12 based on the phase difference, so as to control the VCO 12 to generate a resonance (or anti-resonance) frequency.
  • the details of such control are described in WO 2005/027569, herewith incorporated by reference.
  • FIG. 4 the control schemes of FIGS. 2 and 3 may be combined.
  • the resulting control will thus combine external feedback control, as shown in FIG. 2 , with a phase difference control, as described in FIG. 4 .
  • Most elements in FIG. 4 correspond to the elements in FIGS. 2 and 3 , and have therefore been given identical reference numerals and will only be described in terms of their function.
  • the control unit 31 is here adapted to receive two feedback signals; one external, from the sensor 7 , and one internal, from the combination unit 24 . Just as in FIG. 3 , the control unit 31 is adapted to perform frequency control based on the phase difference signal from the combination unit 24 . However, the target phase difference does not need to be zero, as in FIG. 3 . Instead, a target phase difference is determined by the control unit based on the external feedback, thus allowing an optimization of the cooling process, as outlined above with reference to FIG. 2 .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
US12/518,296 2006-12-15 2007-12-10 Pulsating fluid cooling with frequency control Abandoned US20100012301A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06126250.7 2006-12-15
EP06126250 2006-12-15
PCT/IB2007/054981 WO2008075245A2 (fr) 2006-12-15 2007-12-10 Refroidissement par fluide pulsé à commande de fréquence

Publications (1)

Publication Number Publication Date
US20100012301A1 true US20100012301A1 (en) 2010-01-21

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US12/518,296 Abandoned US20100012301A1 (en) 2006-12-15 2007-12-10 Pulsating fluid cooling with frequency control

Country Status (5)

Country Link
US (1) US20100012301A1 (fr)
EP (1) EP2094972B1 (fr)
JP (1) JP5320298B2 (fr)
CN (1) CN101568732B (fr)
WO (1) WO2008075245A2 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080226088A1 (en) * 2005-09-20 2008-09-18 Koninklijke Philips Electronics, N.V. Audio Transducer System
US8529097B2 (en) 2010-10-21 2013-09-10 General Electric Company Lighting system with heat distribution face plate
US8602607B2 (en) 2010-10-21 2013-12-10 General Electric Company Lighting system with thermal management system having point contact synthetic jets
US20140273796A1 (en) * 2013-03-14 2014-09-18 General Electric Company Synthetic jet driven cooling device with increased volumetric flow
WO2017129539A1 (fr) * 2016-01-26 2017-08-03 Audi Ag Système électrique conçu pour un véhicule automobile, véhicule automobile et procédé pour faire fonctionner un jet synthétique

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JP5285697B2 (ja) * 2007-06-14 2013-09-11 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 脈動流体冷却を備える照明装置
KR101540596B1 (ko) * 2007-12-07 2015-07-30 코닌클리케 필립스 엔.브이. 저잡음 냉각 장치
AR073259A1 (es) 2008-07-29 2010-10-28 Merck & Co Inc Derivados de furosemida utiles como diureticos
US8371829B2 (en) * 2010-02-03 2013-02-12 Kci Licensing, Inc. Fluid disc pump with square-wave driver
CN103363838A (zh) * 2012-04-11 2013-10-23 上海航天测控通信研究所 基于单片机开环控制的合成射流散热器的电气电路及散热器
US9951767B2 (en) * 2014-05-22 2018-04-24 General Electric Company Vibrational fluid mover active controller
JP2017157735A (ja) * 2016-03-03 2017-09-07 Ｎｅｃディスプレイソリューションズ株式会社 冷却装置、電子機器及び投射型表示装置
US10245668B2 (en) * 2016-10-31 2019-04-02 Kulicke And Soffa Industries, Inc Fluxing systems, bonding machines including fluxing systems, and methods of operating the same
CN110899076A (zh) * 2019-10-11 2020-03-24 泉州极简机器人科技有限公司 床板的振动方法及装置

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US20100018675A1 (en) * 2006-11-30 2010-01-28 Koninklijke Philips Electronics N.V. Pulsating cooling system
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JP2007527618A (ja) * 2003-07-07 2007-09-27 ジョージア テック リサーチ コーポレイション 分配された合成ジェットアクチュエータを使用する熱管理のためのシステムおよび方法
US7564164B2 (en) * 2004-02-23 2009-07-21 Nec Corporation Drive circuit for piezoelectric pump and cooling system that uses this drive circuit
JP3756168B2 (ja) * 2004-03-19 2006-03-15 株式会社ソニー・コンピュータエンタテインメント 回路の発熱制御方法、装置およびシステム

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010977A (en) * 1988-07-22 1991-04-30 Yamaha Corporation Acoustic apparatus with plural resonators having different resonance frequencies
US5216338A (en) * 1989-10-05 1993-06-01 Firma J. Eberspacher Circuit arrangement for accurately and effectively driving an ultrasonic transducer
US5758823A (en) * 1995-06-12 1998-06-02 Georgia Tech Research Corporation Synthetic jet actuator and applications thereof
US6123145A (en) * 1995-06-12 2000-09-26 Georgia Tech Research Corporation Synthetic jet actuators for cooling heated bodies and environments
US5914856A (en) * 1997-07-23 1999-06-22 Litton Systems, Inc. Diaphragm pumped air cooled planar heat exchanger
US6625285B1 (en) * 1997-10-16 2003-09-23 Fujitsu Limited Acoustic cooling system with noise reduction function
US6339368B1 (en) * 2000-03-31 2002-01-15 Zilog, Inc. Circuit for automatically driving mechanical device at its resonance frequency
US6418016B1 (en) * 2001-01-18 2002-07-09 Motorola, Inc. System and method for cooling using an oscillatory impinging jet
US6603658B2 (en) * 2001-03-19 2003-08-05 Tufts University Laminar air jet cooling of heat producing components
US6848631B2 (en) * 2002-01-23 2005-02-01 Robert James Monson Flat fan device
US6588497B1 (en) * 2002-04-19 2003-07-08 Georgia Tech Research Corporation System and method for thermal management by synthetic jet ejector channel cooling techniques
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US7263837B2 (en) * 2003-03-25 2007-09-04 Utah State University Thermoacoustic cooling device
US6937472B2 (en) * 2003-05-09 2005-08-30 Intel Corporation Apparatus for cooling heat generating components within a computer system enclosure
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US8496049B2 (en) * 2009-04-09 2013-07-30 General Electric Company Heat sinks with distributed and integrated jet cooling

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080226088A1 (en) * 2005-09-20 2008-09-18 Koninklijke Philips Electronics, N.V. Audio Transducer System
US8529097B2 (en) 2010-10-21 2013-09-10 General Electric Company Lighting system with heat distribution face plate
US8602607B2 (en) 2010-10-21 2013-12-10 General Electric Company Lighting system with thermal management system having point contact synthetic jets
US9423106B2 (en) 2010-10-21 2016-08-23 General Electric Company Lighting system with thermal management system having point contact synthetic jets
US9429302B2 (en) 2010-10-21 2016-08-30 General Electric Company Lighting system with thermal management system having point contact synthetic jets
US20140273796A1 (en) * 2013-03-14 2014-09-18 General Electric Company Synthetic jet driven cooling device with increased volumetric flow
US9976762B2 (en) * 2013-03-14 2018-05-22 General Electric Company Synthetic jet driven cooling device with increased volumetric flow
WO2017129539A1 (fr) * 2016-01-26 2017-08-03 Audi Ag Système électrique conçu pour un véhicule automobile, véhicule automobile et procédé pour faire fonctionner un jet synthétique

Also Published As

Publication number Publication date
WO2008075245A3 (fr) 2008-08-21
EP2094972B1 (fr) 2015-10-21
JP5320298B2 (ja) 2013-10-23
CN101568732A (zh) 2009-10-28
CN101568732B (zh) 2015-10-07
WO2008075245A2 (fr) 2008-06-26
EP2094972A2 (fr) 2009-09-02
JP2010512990A (ja) 2010-04-30

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