US20090283251A1 - Heat flow device - Google Patents
Heat flow device Download PDFInfo
- Publication number
- US20090283251A1 US20090283251A1 US12/373,975 US37397507A US2009283251A1 US 20090283251 A1 US20090283251 A1 US 20090283251A1 US 37397507 A US37397507 A US 37397507A US 2009283251 A1 US2009283251 A1 US 2009283251A1
- Authority
- US
- United States
- Prior art keywords
- heat
- equipment item
- cold
- thermal
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/008—Variable conductance materials; Thermal switches
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/10—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overheating, e.g. heat shields
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2270/00—Thermal insulation; Thermal decoupling
Definitions
- the invention relates to a heat-flow device.
- a heat source of any kind (such as an electrical circuit or an electronic component).
- the invention proposes a device comprising an equipment item with a heat source having a maximum thermal operating condition, a part relatively colder than the equipment item and a member capable of transmitting the heat from the equipment item to the cold part, characterized in that the member is capable of causing a limitation of the transmitted heat under thermal conditions that exceed a defined threshold below the said maximum condition.
- the heat generated within the equipment is no longer totally transmitted (or even almost no longer transmitted) to the cold part when these thermal conditions are encountered (or in other words, for example, when the temperature or the thermal power transmitted across the member exceeds the said threshold), and so overheating of the said cold part is avoided.
- the thermal conditions correspond, for example, to a thermal power transmitted across the member.
- the member may limit the transmitted thermal power to the value of the said defined threshold.
- the equipment item and the cold part may additionally be separated substantially by a gas screen, at least under the said thermal conditions, in order that the transmission of electrical phenomena (such as electrical arcs), especially the propagation of electrical arcs from the equipment item to the cold source, can also be avoided under these conditions.
- electrical phenomena such as electrical arcs
- the equipment item and the cold part are, for example, separated by the said screen regardless of the thermal conditions, and the member may then comprise a heat pipe passing through the said screen.
- an advantage is taken of the limitation, beyond a certain threshold, of the thermal power that the heat pipes can transmit, in order to limit the thermal power transmitted by the member to this threshold.
- the member comprises at least one component whose change of state (for example from the liquid state to the gas state) under the said thermal conditions causes an increase of the thermal resistance, also making it possible to limit the amount of heat transmitted.
- the component may then form the said screen after the said change of state, which is a practical way of obtaining this screen.
- the member is configured to lose contact with the equipment item or the cold part under the said thermal conditions. In this case it is the breaking of contact between the different components that causes the interruption of the heat path between the equipment item and the cold part and consequently the limitation of the transmission of heat.
- the member in this case comprises, for example, at least one component whose change of state under the said thermal conditions causes the said loss of contact.
- the said component participates in conduction from the equipment item to the cold part outside the said thermal conditions, and disappears due to its change of state under the said thermal conditions, thus substantially insulating the equipment item and the cold part.
- the change of a mechanical property of the component during its change of state may lead to a movement of part of the member, thus causing the said loss of contact.
- the member may be configured in such a way that the change of state of the component makes it possible to form the said gas screen.
- the change of state then makes it possible not only to interrupt the thermal path but also to prevent the propagation of electrical phenomena.
- the change of state may be a transition from the solid state to the liquid state or a transition from the liquid state to the gas state.
- the equipment may be a fuel pump and the cold part a liquid fuel, for example in an aircraft; the invention is particularly interesting in this context, although it naturally has numerous other applications, such as protection against overheating of members of heat sinks that are sensitive to temperature elevations, such as carbon structures.
- the invention also proposes an aircraft equipped with such a device.
- FIGS. 1A to 1C represent a first exemplary embodiment of the invention
- FIGS. 2A to 2C represent a second exemplary embodiment of the invention
- FIGS. 2D to 2F represent a variant of the second example presented in FIGS. 2A to 2C ;
- FIGS. 3A to 3C represent a third exemplary embodiment of the invention.
- FIGS. 4A to 4C represent a fourth exemplary embodiment of the invention.
- FIGS. 5A and 5B represent a fifth exemplary embodiment of the invention.
- FIG. 1A represents a first exemplary embodiment of the invention under normal operating conditions.
- a hot plate 101 comprising a heat source (not illustrated) is connected to a cold plate 102 (such as a structural part of the device) by means of a material 103 that is solid at the nominal temperature T nominal corresponding to normal operation.
- Material 103 is a heat conductor, and its thermal resistance R material is therefore relatively low. Thus the heat generated by the heat source within hot plate 101 is evacuated under normal operating conditions across material 103 to cold plate 102 , which acts as a heat sink or cold source.
- Material 103 is also chosen such that its melting temperature T melting is lower than or equal to the desired maximum operating temperature T max .
- T melting is lower than or equal to the desired maximum operating temperature T max .
- T max is the desired maximum operating temperature
- Such a maximum temperature may be desired, for example, to avoid degradation of cold plate 102 or other negative consequences, such as, for example, a risk of fire when the cold plate is made in the form of a combustible material, such as the fuel of an aircraft.
- Cold plate 102 is then thermally insulated from hot plate 101 by virtue of air screen 106 separating them; this screen also acts as an electrical insulator, which also makes it possible to prevent transmission of electrical energy (for example, in the form of electrical arcs) from the hot plate to cold plate 102 .
- This latter advantage is particularly interesting in the case in which hot plate 101 is provided with an electrical or electronic equipment item whose potential malfunctions could prove dangerous to cold plate 102 , especially when this has attained a temperature above the desired maximum temperature T max .
- Wax is used, for example, as material 103 , since its thermal properties permit heat conduction clearly greater than that permitted by the thermal resistance of air 106 .
- FIG. 2A represents a second exemplary embodiment of the invention under normal operating conditions, that is, for example, at an operating temperature T nominal clearly lower than a desired maximum temperature.
- an equipment item 201 comprising a heat source is situated at a distance from a cold plate 202 and is consequently separated from it by an air screen 206 . Furthermore, equipment item 201 is connected to cold plate 202 by means of a heat drain 203 formed in a material that is a good heat conductor (that is having low thermal resistance) and that therefore extends partly into the space formed by air screen 206 .
- Heat drain 203 is maintained in contact with cold plate 202 by interposition of a bonding material 204 in solid state between a part of equipment item 201 and conducting drain 203 . Furthermore, a compression spring 205 is interposed between drain 203 and cold plate 202 , spring 205 being compressed when drain 203 is in contact with cold plate 202 .
- Drain 203 is connected to equipment 201 , on the one hand across bonding material 204 and on the other hand directly at parts of equipment item 201 other than those receiving bonding material 204 , for example at a side wall 208 of equipment item 201 .
- drain 203 is no longer maintained in contact with cold plate 202 but instead is moved away under the action of spring 205 . Because of the displacement of drain 203 and its loss of contact with cold plate 202 , equipment item 201 and cold plate 202 are separated by the thickness (or screen) of air 206 , except for spring 205 , whose thermal conductivity is negligible, and these two members are therefore substantially insulated by means of air screen 206 , as represented in FIG. 2C .
- FIG. 2D represents a variant, under normal operating conditions, of the second example just described.
- an equipment item 211 comprising a heat source is situated at a distance from a cold plate 212 and consequently separated therefrom by an air screen 216 . Furthermore, equipment item 211 is connected to cold plate 212 by means of a heat drain 213 formed in a material that has low thermal resistance and that therefore extends partly into the space formed by air screen 216 .
- heat drain 213 is maintained braced against cold plate 212 by means of a solid block 214 interposed between conducting drain 213 and a structural part 210 .
- a compression spring 215 is interposed between drain 213 and cold plate 212 , spring 215 being compressed when drain 213 is in contact with cold plate 212 because of the presence of solid block 214 .
- solid block 214 does not necessarily participate in the flow of heat.
- drain 213 is no longer maintained in contact with cold plate 212 but instead is moved away under the action of spring 215 . Because of the displacement of drain 213 and its loss of contact with cold plate 212 , equipment item 211 and cold plate 212 are separated by the thickness (or screen) of air 216 , except for spring 215 , whose thermal conductivity is negligible, and these two members are therefore substantially insulated by means of air screen 216 .
- the displacement of drain 213 then continues until it comes into contact with structural part 210 , which then in this case could in turn act as a heat sink.
- FIG. 3A represents a third exemplary embodiment of the invention under normal operating conditions.
- heat-generating equipment item 301 and cold part 302 acting as cold source are situated respectively in the upper part and the lower part of a chamber 305 .
- a space formed in the chamber between equipment item 301 and cold part 302 is filled with a bonding material 303 in liquid form having low thermal resistance, and which forms a heat-conduction path between equipment 301 and cold part 302 .
- Chamber 305 hermetically houses equipment item 301 , bonding material 303 and cold part 302 . Only a safety valve 304 penetrating into the chamber in the space filled with bonding material 303 makes it possible, if necessary, to evacuate liquid when the pressure exceeds a threshold, as explained hereinafter.
- Bonding material 303 is such that its vaporization temperature corresponds approximately (and preferably is slightly lower) to a desired maximum temperature in cold part 302 .
- bonding material 303 passes from the liquid state to the gas state during a phase represented in FIG. 3B (the material in gaseous form 303 ′ naturally appearing in the upper part of the space of chamber 305 previously occupied by the liquid, in contact with equipment item 301 ).
- the change of state in hermetic chamber 305 causes a pressure rise therein until the pressure attains the trip threshold of safety valve 304 , and the liquid part of bonding material 303 consequently begins to escape, as represented in FIG. 3B .
- the heat path initially formed by bonding material 303 in liquid form is therefore interrupted, and by virtue of this fact cold part 302 is thermally insulated from equipment item 301 , since the thermal resistance of the bonding material in gaseous form is much greater than that of the bonding material in liquid form.
- the change of phase (or in other words the transition from the liquid state to the gas state) of the bonding material has also made it possible to replace the heat path by a gas screen, which makes it possible in particular to prevent the formation of electrical arcs between equipment item 301 and cold part 302 .
- FIG. 4A represents a fourth exemplary embodiment of the invention under normal operating conditions, or in other words for temperatures (including the normal operating temperature) clearly lower than a permitted maximum temperature.
- a chamber 405 is formed in the lower prolongation of a hot plate 401 (which constitutes, for example, part of an equipment item containing a heat source, such as a fuel pump with which the aircraft are equipped).
- Chamber 405 is hermetic and its lower part contains, under normal operating conditions, a liquid component 403 .
- Part of a heat drain 404 is also accommodated inside chamber 405 : an upper part 406 (substantially horizontal in this case) extends over the entire surface (horizontal in this case) of chamber 405 , in such a way as to form a piston separating an upper part of chamber 405 , filled with air, for example, from a lower part of chamber 405 , filled with liquid component 403 under normal operating conditions.
- Heat drain 404 also comprises a rod (substantially vertical in this case), a lower part 407 of which is in contact, during normal operation as illustrated in FIG. 4A , with a cold part forming a heat sink, in this case composed of liquid fuel 402 of the aircraft. Lower part 407 in this case is precisely immersed in fuel 402 as represented in FIG. 4A .
- a heat path is therefore formed between equipment item 401 and cold part 402 by means of materials having relatively low thermal resistance, namely in this case the walls of chamber 405 , liquid component 403 and heat drain 404 .
- a gas phase 403 ′ is formed in the lower part of chamber 405 , and the pressure exerted thereby tends to displace upward heat drain 404 , whose upper part 406 it is recalled, forms a piston, as represented in FIG. 4B .
- the space situated between lower part 407 of drain 404 and the surface of liquid fuel 402 is filled with a thermally and electrically insulating gas screen (such as air, for example), so that equipment item 401 and liquid fuel 402 forming a cold source are sufficiently insulated thermally and electrically to avoid any risk of fire from fuel 402 .
- a thermally and electrically insulating gas screen such as air, for example
- FIG. 5A represents a fifth exemplary embodiment of the invention.
- an equipment item comprising a heat source (or hot plate) 501 is separated from a cold plate 502 (for example, a structural member of an aircraft) by means of an air screen 504 , in order to prevent propagation of electrical arcs between equipment item 501 and cold plate 502 .
- a plurality of heat conduits (or heat tubes, closer to the English term “heat pipe”) 503 (two in the case of FIG. 5A ) pass through air screen 504 , each heat pipe 503 being in contact at one end with equipment item 501 and in contact at the other end with cold plate 502 .
- heat pipe 503 it is possible to use a single heat pipe when the dimensioning of the heat fluxes in the device so permits.
- the heat pipes constructed in the form of two-phase tubes, for example, make it possible to evacuate the heat generated inside equipment item 501 toward cold plate 502 , and this during normal operation, or in other words when the power transmitted by the heat pipes (or alternatively the temperature thereof) does not exceed a power threshold P threshold (respectively a temperature threshold).
- a power threshold there is understood here either an absolute value of temperature or a relative value, for example relative to the temperature outside the heat pipe).
- the thermal resistance R th of heat pipes 503 is therefore relatively low as long as the thermal power passing through them is below the threshold P threshold (respectively as long as the temperature is below the temperature threshold).
- heat pipes 503 are such that, when the thermal power passing through them is above this threshold P threshold (respectively when the temperature is above the threshold temperature), their thermal resistance R th increases rapidly, as illustrated in FIG. 5B .
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
- Transmitters (AREA)
- Thermal Insulation (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0653014 | 2006-07-18 | ||
FR0653014A FR2904102B1 (fr) | 2006-07-18 | 2006-07-18 | Dispositif a ecoulement de chaleur |
PCT/FR2007/001222 WO2008009811A1 (fr) | 2006-07-18 | 2007-07-17 | Dispositif a ecoulement de chaleur |
Publications (1)
Publication Number | Publication Date |
---|---|
US20090283251A1 true US20090283251A1 (en) | 2009-11-19 |
Family
ID=37691785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/373,975 Abandoned US20090283251A1 (en) | 2006-07-18 | 2007-07-17 | Heat flow device |
Country Status (9)
Country | Link |
---|---|
US (1) | US20090283251A1 (fr) |
EP (1) | EP2044381B1 (fr) |
JP (1) | JP2009543997A (fr) |
CN (1) | CN101490496A (fr) |
BR (1) | BRPI0713193A2 (fr) |
CA (1) | CA2657777C (fr) |
FR (1) | FR2904102B1 (fr) |
RU (1) | RU2465531C2 (fr) |
WO (1) | WO2008009811A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9310145B2 (en) | 2006-07-18 | 2016-04-12 | Airbus Operations S.A.S. | Heat flow device |
US10866036B1 (en) * | 2020-05-18 | 2020-12-15 | Envertic Thermal Systems, Llc | Thermal switch |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2433074B1 (fr) * | 2009-05-22 | 2013-03-20 | Arçelik Anonim Sirketi | Appareil électroménager |
FR2977121B1 (fr) * | 2011-06-22 | 2014-04-25 | Commissariat Energie Atomique | Systeme de gestion thermique a materiau a volume variable |
CN103376025A (zh) * | 2012-04-24 | 2013-10-30 | 上海首太工业装备有限公司 | 一种可控热开关 |
RU2608053C1 (ru) * | 2015-10-06 | 2017-01-13 | Общество с ограниченной ответственностью "Уральская производственная компания" | Модуль отведения и распределения тепловой энергии энергоустановки на твердооксидных топливных элементах |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3463224A (en) * | 1966-10-24 | 1969-08-26 | Trw Inc | Thermal heat switch |
US3519067A (en) * | 1967-12-28 | 1970-07-07 | Honeywell Inc | Variable thermal conductance devices |
US4384610A (en) * | 1981-10-19 | 1983-05-24 | Mcdonnell Douglas Corporation | Simple thermal joint |
US4402358A (en) * | 1982-10-15 | 1983-09-06 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Heat pipe thermal switch |
US4742867A (en) * | 1986-12-01 | 1988-05-10 | Cape Cod Research, Inc. | Method and apparatuses for heat transfer |
US5188909A (en) * | 1991-09-12 | 1993-02-23 | Eveready Battery Co., Inc. | Electrochemical cell with circuit disconnect device |
US5216580A (en) * | 1992-01-14 | 1993-06-01 | Sun Microsystems, Inc. | Optimized integral heat pipe and electronic circuit module arrangement |
US5322114A (en) * | 1991-11-05 | 1994-06-21 | Grabner Instruments Messtechnik Gesmgh | Method and device for limiting the temperature of a body |
US5379601A (en) * | 1993-09-15 | 1995-01-10 | International Business Machines Corporation | Temperature actuated switch for cryo-coolers |
US6047766A (en) * | 1998-08-03 | 2000-04-11 | Hewlett-Packard Company | Multi-mode heat transfer using a thermal heat pipe valve |
US6435454B1 (en) * | 1987-12-14 | 2002-08-20 | Northrop Grumman Corporation | Heat pipe cooling of aircraft skins for infrared radiation matching |
US20030196787A1 (en) * | 2002-04-19 | 2003-10-23 | Mahoney William G. | Passive thermal regulator for temperature sensitive components |
US6768781B1 (en) * | 2003-03-31 | 2004-07-27 | The Boeing Company | Methods and apparatuses for removing thermal energy from a nuclear reactor |
US20060037589A1 (en) * | 2004-08-17 | 2006-02-23 | Ramesh Gupta | Heat pipe for heating of gasoline for on-board octane segregation |
US20060060367A1 (en) * | 2004-09-20 | 2006-03-23 | Schultz Mark D | Multi-dimensional compliant thermal cap for an electronic device |
US20060061966A1 (en) * | 2000-07-13 | 2006-03-23 | Intel Corporation | Method and apparatus for dissipating heat from an electronic device |
US20060141308A1 (en) * | 2004-12-23 | 2006-06-29 | Becerra Juan J | Apparatus and method for variable conductance temperature control |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS63161388A (ja) * | 1986-12-23 | 1988-07-05 | Ishikawajima Harima Heavy Ind Co Ltd | ヒ−トパイプ |
JPH01110245A (ja) * | 1987-10-23 | 1989-04-26 | Iwatani Internatl Corp | 極低温試験装置 |
JPH0645177Y2 (ja) * | 1988-07-11 | 1994-11-16 | 三菱重工業株式会社 | ヒートパイプ |
RU2110902C1 (ru) * | 1996-11-13 | 1998-05-10 | Российский Федеральный Ядерный Центр - Всероссийский Научно-Исследовательский Институт Экспериментальной Физики | Способ охлаждения электрорадиоэлементов |
RU2161384C1 (ru) * | 1999-05-13 | 2000-12-27 | Фонд Сертификации "Энергия" | Устройство для температурной стабилизации электронного оборудования |
RU2183310C1 (ru) * | 2000-10-31 | 2002-06-10 | Центр КОРТЭС | Устройство термостабилизации |
DE10123473A1 (de) * | 2001-05-15 | 2002-11-21 | Volkswagen Ag | Vorrichtung zur Wärmeeinbringung in eine Flüssigkeit |
DE10342425A1 (de) * | 2003-09-13 | 2005-01-05 | Daimlerchrysler Ag | Steuerbare Wärmeisolationsschicht |
-
2006
- 2006-07-18 FR FR0653014A patent/FR2904102B1/fr active Active
-
2007
- 2007-07-17 EP EP07803878.3A patent/EP2044381B1/fr active Active
- 2007-07-17 CA CA2657777A patent/CA2657777C/fr not_active Expired - Fee Related
- 2007-07-17 CN CNA2007800270850A patent/CN101490496A/zh active Pending
- 2007-07-17 RU RU2009105499/06A patent/RU2465531C2/ru not_active IP Right Cessation
- 2007-07-17 US US12/373,975 patent/US20090283251A1/en not_active Abandoned
- 2007-07-17 JP JP2009520011A patent/JP2009543997A/ja active Pending
- 2007-07-17 BR BRPI0713193-3A patent/BRPI0713193A2/pt not_active Application Discontinuation
- 2007-07-17 WO PCT/FR2007/001222 patent/WO2008009811A1/fr active Application Filing
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3463224A (en) * | 1966-10-24 | 1969-08-26 | Trw Inc | Thermal heat switch |
US3519067A (en) * | 1967-12-28 | 1970-07-07 | Honeywell Inc | Variable thermal conductance devices |
US4384610A (en) * | 1981-10-19 | 1983-05-24 | Mcdonnell Douglas Corporation | Simple thermal joint |
US4402358A (en) * | 1982-10-15 | 1983-09-06 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Heat pipe thermal switch |
US4742867A (en) * | 1986-12-01 | 1988-05-10 | Cape Cod Research, Inc. | Method and apparatuses for heat transfer |
US6435454B1 (en) * | 1987-12-14 | 2002-08-20 | Northrop Grumman Corporation | Heat pipe cooling of aircraft skins for infrared radiation matching |
US5188909A (en) * | 1991-09-12 | 1993-02-23 | Eveready Battery Co., Inc. | Electrochemical cell with circuit disconnect device |
US5322114A (en) * | 1991-11-05 | 1994-06-21 | Grabner Instruments Messtechnik Gesmgh | Method and device for limiting the temperature of a body |
US5216580A (en) * | 1992-01-14 | 1993-06-01 | Sun Microsystems, Inc. | Optimized integral heat pipe and electronic circuit module arrangement |
US5379601A (en) * | 1993-09-15 | 1995-01-10 | International Business Machines Corporation | Temperature actuated switch for cryo-coolers |
US6047766A (en) * | 1998-08-03 | 2000-04-11 | Hewlett-Packard Company | Multi-mode heat transfer using a thermal heat pipe valve |
US20060061966A1 (en) * | 2000-07-13 | 2006-03-23 | Intel Corporation | Method and apparatus for dissipating heat from an electronic device |
US20030196787A1 (en) * | 2002-04-19 | 2003-10-23 | Mahoney William G. | Passive thermal regulator for temperature sensitive components |
US6768781B1 (en) * | 2003-03-31 | 2004-07-27 | The Boeing Company | Methods and apparatuses for removing thermal energy from a nuclear reactor |
US20060037589A1 (en) * | 2004-08-17 | 2006-02-23 | Ramesh Gupta | Heat pipe for heating of gasoline for on-board octane segregation |
US20060060367A1 (en) * | 2004-09-20 | 2006-03-23 | Schultz Mark D | Multi-dimensional compliant thermal cap for an electronic device |
US20060141308A1 (en) * | 2004-12-23 | 2006-06-29 | Becerra Juan J | Apparatus and method for variable conductance temperature control |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9310145B2 (en) | 2006-07-18 | 2016-04-12 | Airbus Operations S.A.S. | Heat flow device |
US10866036B1 (en) * | 2020-05-18 | 2020-12-15 | Envertic Thermal Systems, Llc | Thermal switch |
US11041682B1 (en) | 2020-05-18 | 2021-06-22 | Envertic Thermal Systems, Llc | Thermal switch |
US11204206B2 (en) | 2020-05-18 | 2021-12-21 | Envertic Thermal Systems, Llc | Thermal switch |
US11740037B2 (en) | 2020-05-18 | 2023-08-29 | Envertic Thermal Systems, Llc | Thermal switch |
Also Published As
Publication number | Publication date |
---|---|
FR2904102B1 (fr) | 2015-03-27 |
WO2008009811A1 (fr) | 2008-01-24 |
JP2009543997A (ja) | 2009-12-10 |
RU2465531C2 (ru) | 2012-10-27 |
RU2009105499A (ru) | 2010-08-27 |
CN101490496A (zh) | 2009-07-22 |
FR2904102A1 (fr) | 2008-01-25 |
BRPI0713193A2 (pt) | 2012-03-20 |
CA2657777C (fr) | 2016-06-14 |
CA2657777A1 (fr) | 2008-01-24 |
EP2044381A1 (fr) | 2009-04-08 |
EP2044381B1 (fr) | 2017-11-01 |
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