US20090152659A1 - Reflowable camera module with improved reliability of solder connections - Google Patents

Reflowable camera module with improved reliability of solder connections Download PDF

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Publication number
US20090152659A1
US20090152659A1 US11/959,308 US95930807A US2009152659A1 US 20090152659 A1 US20090152659 A1 US 20090152659A1 US 95930807 A US95930807 A US 95930807A US 2009152659 A1 US2009152659 A1 US 2009152659A1
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US
United States
Prior art keywords
camera module
solder
solder joints
printed circuit
reflowable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/959,308
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English (en)
Inventor
Jari Hiltunen
Ian Montandon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omnivision Technologies Inc
Original Assignee
Omnivision Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omnivision Technologies Inc filed Critical Omnivision Technologies Inc
Priority to US11/959,308 priority Critical patent/US20090152659A1/en
Assigned to OMNIVISION TECHNOLOGIES, INC. reassignment OMNIVISION TECHNOLOGIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MONTANDON, IAN, HILTUNEN, JARI
Priority to CN2008801273367A priority patent/CN101897175B/zh
Priority to PCT/US2008/086966 priority patent/WO2009079497A1/en
Priority to EP08861652A priority patent/EP2227897B1/en
Priority to TW097149516A priority patent/TWI383476B/zh
Publication of US20090152659A1 publication Critical patent/US20090152659A1/en
Priority to US12/724,928 priority patent/US7911019B2/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention is generally related to techniques to improve the reliability of solder connections in a Chip Scale Package (CSP). More particularly, the present invention is directed to improving the reliability of solder joint connections in a reflowable camera module.
  • CSP Chip Scale Package
  • Compact consumer devices increasingly include digital cameras.
  • camera phones include a digital camera to capture digital images.
  • a Chip Scale Package is a type of integrated circuit carrier.
  • CSP packages There are various definitions for CSP packages that are used in industry for current generation CSP packages, such as the package having an area no greater than about 1.2 times the size of the die and/or the ball pitch being no greater than one millimeter.
  • An interposer may be used with a CSP package.
  • the die is directly mounted to the CSP package.
  • an image sensor die has an array of light sensitive pixels and may, for example, be implemented as a Complementary Metal Oxide Semiconductor (CMOS) image sensor.
  • CMOS Complementary Metal Oxide Semiconductor
  • a CSP carrier forms the base of the reflowable camera module; i.e. a camera module that can be reflowed onto a printed circuit substrate using a solder reflow technique, such as reflowing a Ball Grid Array (BGA) of solder balls to form solder joints with a printed circuit board.
  • BGA Ball Grid Array
  • Other conventional process steps include plating the module after reflow.
  • Background information on reflowable camera modules utilizing a wafer-level Chip Scale Package (CSP) is described in more detail in U.S. Pat. Pub. No. 20070052827 by Hiltunen “Coated Wafer Level Camera Modules and Associated Methods,” the contents of which is hereby incorporated by reference.
  • Solder joint reliability is a concern in reflowable camera modules.
  • Reflowable camera modules include optical elements and are thus comparatively large modules (in terms of height) compared to other types of CSP components. Additionally, reflowable camera modules are typically included in consumer products, such as camera phones, that are likely to be repeatedly dropped during their lifetime.
  • An underfill encapsulant is conventionally a polymeric material that is formed to fill the entire gap between a substrate (either a chip or an interposer) and a printed circuit board. It is important with conventional underfilling techniques that there are no voids (“bubbles”) between the substrate and the motherboard.
  • the underfill encapsulant provides additional environmental protection to the solder joints.
  • underfill encapsulation processes significantly increase manufacturing costs and hence are disfavored in many types of high volume manufacturing processes.
  • a reflowable camera module utilizes solder joints to form electrical power and signal connections between an image sensor and a printed circuit substrate to which the reflowable camera module is mounted.
  • solder joints are subject to shear forces. Additional mechanical support is provided to improve the reliability of the solder joints. Reliability of the solder joints coupling electrical signals and power between the motherboard and the image sensor is improved by including additional localized mechanical supports about each corner of the camera module.
  • the reflowable camera module is preferably packaged without utilizing an underfill encapsulant.
  • the additional mechanical supports include leads attached over the camera module to provide additional lateral mechanical support.
  • dummy solder joints are formed proximate corner regions. The dummy solder joints provide additional mechanical support but do not couple electrical signals or power to the image sensor. The dummy solder joints may be formed using solder balls or a solder paste.
  • FIG. 1 is a perspective view of a camera module having additional localized mechanical supports to protect solder joints in accordance with one embodiment of the present invention
  • FIGS. 2A , 2 B, and 2 C illustrate in more detail an embodiment in which the localized mechanical supports include leads;
  • FIGS. 3A , 3 B, and 3 C illustrate in more detail an embodiment in which the localized mechanical supports include dummy solder balls formed in corner regions;
  • FIGS. 4A , 4 B, and 4 C illustrate in more detail an embodiment in which the localized mechanical supports include dummy solder paste regions formed in corner regions.
  • FIG. 1 illustrates a perspective view of a reflowable camera module 100 mounted to a printed circuit substrate 190 in accordance with one embodiment of the present invention.
  • the printed circuit substrate 190 may be any conventional substrate used to establish electrical connections between different components, such as a conventional printed circuit board, a motherboard, or a flex package.
  • An image sensor 110 is mounted to a Chip Scale Package (CSP) carrier 115 .
  • the CSP carrier 115 has a rectangular shape with four corners.
  • the image sensor 110 has an array of light sensitive pixels and may, for example, be implemented as a Complementary Metal Oxide Semiconductor (CMOS) image sensor.
  • CMOS Complementary Metal Oxide Semiconductor
  • the CSP carrier 115 forms the base of a reflowable camera module 100 ; i.e.
  • the CSP carrier 115 may have contact regions 120 formed within the CSP 115 carrier to permit electrical signal and power connections to be made between the printed circuit substrate 190 and the image sensor 110 .
  • the image sensor 110 is mounted to a top surface 116 of the CSP carrier 115 .
  • a Ball Grid Array (BGA) of solder balls is used to form solder joints 130 (to provide electrical signal and power connections) with the printed circuit substrate 190 using a reflow process.
  • the solder joints 130 that are intended to provide electrical signal and power connections are formed in a central portion 135 of the bottom surface 113 of the camera module 100 .
  • the central portion 135 does not extend all of the way to the edges of the camera module 100 .
  • the camera module 100 is preferably manufactured using a wafer level CSP manufacturing process in which an entire wafer is capped with an optical (glass) capping layer 120 before the wafer is diced into individual units. Wafer-level lens elements 125 are formed into glass capping layer 120 of the camera module 100 to focus light onto the image sensor 110 .
  • CSP Chip Scale Package
  • additional localized mechanical supports 160 are provided to protect the solder joints 130 in central portion 135 from shearing.
  • the mechanical supports 160 are in localized regions about the edges of the camera module and serve to protect the solder joints 130 in central portion 135 during assembly, testing, and the lifetime of the camera module 100 .
  • Investigations by the inventors indicate that shear forces tend to crack the outermost solder joints particularly in corner regions. It is believed that this failure mode has aspects unique to reflowable camera modules. Camera modules typically have a height on the order of several millimeters. The geometry of a camera module generates greater shear forces than other types of CSP packages that have a package height of about one millimeter.
  • the additional localized mechanical supports 160 protect against BGA ball shear without utilized an underfill encapsulant.
  • these protective localized mechanical supports 160 are preferably located about at least the corners of the CSP carrier 115 because it is the BGA solder joints proximate the corners that are most likely to fail due to BGA ball shear.
  • the additional mechanical supports 160 are preferably formed using process steps that are compatible with a high-volume reflow process.
  • One exemplary process to form the additional mechanical supports 160 includes forming dummy solder joints.
  • a “dummy solder joint” is a solder joint formed to provide mechanical support but which does not couple electrical power or signals to the image sensor 110 .
  • a dummy solder joint may be connected to a ground plane, if desired, to control the electrical potential of the dummy solder joint.
  • the dummy solder joints are preferably formed in the same reflow step used to form those solder joints 130 that couple electrical signals and power to the image sensor 110 .
  • Another exemplary process to form the additional mechanical supports 160 includes using leads extended over the surface of the camera module 100 to provide additional mechanical support.
  • the leads are used for mechanical purposes and may therefore also be described as “dummy leads” since they do not couple electrical power or signals to the image sensor 110 but instead are used to mechanically support the reflowable camera module 100 .
  • Still yet another exemplary process to form the additional mechanical supports 160 includes forming a bead of an epoxy along selected portions of the edge of the reflowable camera module 100 outside of central portion 135 . These techniques may be used either alone or in combination.
  • FIGS. 2A , 2 B, and 2 C illustrate in more detail aspects of a process in which additional mechanical supports 160 are formed using two or more leads 205 .
  • FIG. 2A illustrates a side view with certain conventional features omitted for clarity.
  • FIG. 2B illustrates a top view of the leads 205 extending over the camera module.
  • FIG. 2C illustrates a bottom view of the underside of the camera module further illustrating bottom solder ball contact pads 210 within central portion 135 (illustrated by dashed lines).
  • the ends 207 of each lead 205 extend out from the camera module 100 and are attached to the printed circuit substrate (not shown), thus providing additional lateral support of the camera module 100 to provide protection against shear forces. As illustrated in FIG.
  • each lead 205 is preferably attached to the outer surface of the camera module 100 such that each lead 205 conforms to the profile of the camera module 100 and extends over the sides and top of the outer surface of the camera module with the ends 207 proximate corner regions of camera module 100 .
  • the two ends 207 of each lead 205 are attached to the printed circuit substrate (e.g., using epoxy or solder) before a final plating process used to plate the reflowable camera module 100 to form an electromagnetic shield.
  • each lead 205 is a dummy lead in that the leads 205 are preferably grounded and do not couple electrical power or signals to the camera module 100 .
  • the leads 205 may be conventional leads, such as copper alloy based leads.
  • leads 205 While an exemplary process has two leads 205 , it will be understood that a different number of leads may be used (e.g., one, two, three, or four leads, with the upper limit depending on practical manufacturing limitations) and that the arrangement of the leads may differ from that illustrated in FIGS. 2A , 2 B, and 2 C.
  • FIGS. 3A , 3 B, and 3 C illustrate in more detail fabrication details for a process in which the mechanical supports 160 are dummy solder joints formed from solder balls 320 .
  • FIG. 3A is a side view illustrating solder joints formed across the underside of the carrier 115 .
  • dummy solder balls 320 are preferably formed in the corner areas.
  • the central portion 135 (bounded by dashed lines for the purposes of illustration) includes a BGA of solder balls for forming electrical signal and power connections with the camera module 100 . This embodiment effectively utilizes some of the extra area about the edges of the CSP package to form the dummy solder balls.
  • each corner region there are four dummy solder balls 320 in each corner region.
  • the corner-most solder joints formed at the location of solder balls 130 -A, 130 -B, 130 -C, and 130 -D will tend to be the most susceptible to shear-induced cracking.
  • the dummy solder balls 320 act to protect the solder balls 130 -A, 130 -B, 130 -C, and 130 -D in central portion 135 .
  • there is also some beneficial redundancy of the dummy solder balls 320 in case an individual dummy solder ball 320 cracks or is otherwise rendered incapable of providing mechanical support.
  • additional dummy solder balls 320 could be included along the edge of the CSP carrier 115 and/or in a different pattern than that illustrated in FIGS. 3A , 3 B, and 3 C.
  • FIGS. 4A , 4 B, and 4 C illustrates in more detail fabrication details for a process in which localized mechanical support 160 is provided using solder joints formed in corner solder areas 405 using a solder paste technique. Corner solder areas 405 are exposed and plated (e.g., with copper). That plated areas may be attached to the motherboard during the reflow process via a solder paste and may, for example, be connected into EMI shielding or alternatively left floating.
  • FIG. 4A illustrates a bottom view
  • FIG. 4B illustrates a top view showing corner areas in phantom
  • FIG. 4B illustrates a bottom view.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
US11/959,308 2007-12-18 2007-12-18 Reflowable camera module with improved reliability of solder connections Abandoned US20090152659A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US11/959,308 US20090152659A1 (en) 2007-12-18 2007-12-18 Reflowable camera module with improved reliability of solder connections
CN2008801273367A CN101897175B (zh) 2007-12-18 2008-12-16 焊接连接可靠性改进的可回焊相机模块
PCT/US2008/086966 WO2009079497A1 (en) 2007-12-18 2008-12-16 Reflowable camera module with improved reliability of solder connections
EP08861652A EP2227897B1 (en) 2007-12-18 2008-12-16 Reflowable camera module with improved reliability of solder connections
TW097149516A TWI383476B (zh) 2007-12-18 2008-12-18 不使用底部填充封膠即可改善焊點可靠度之相機模組封裝結構及其方法
US12/724,928 US7911019B2 (en) 2007-12-18 2010-03-16 Reflowable camera module with improved reliability of solder connections

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/959,308 US20090152659A1 (en) 2007-12-18 2007-12-18 Reflowable camera module with improved reliability of solder connections

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/724,928 Division US7911019B2 (en) 2007-12-18 2010-03-16 Reflowable camera module with improved reliability of solder connections

Publications (1)

Publication Number Publication Date
US20090152659A1 true US20090152659A1 (en) 2009-06-18

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US11/959,308 Abandoned US20090152659A1 (en) 2007-12-18 2007-12-18 Reflowable camera module with improved reliability of solder connections
US12/724,928 Active US7911019B2 (en) 2007-12-18 2010-03-16 Reflowable camera module with improved reliability of solder connections

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Application Number Title Priority Date Filing Date
US12/724,928 Active US7911019B2 (en) 2007-12-18 2010-03-16 Reflowable camera module with improved reliability of solder connections

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US (2) US20090152659A1 (zh)
EP (1) EP2227897B1 (zh)
CN (1) CN101897175B (zh)
TW (1) TWI383476B (zh)
WO (1) WO2009079497A1 (zh)

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US20090256255A1 (en) * 2008-04-10 2009-10-15 Sun Microsystems, Inc. Composite interconnect
US20100244171A1 (en) * 2009-03-31 2010-09-30 Masayuki Nagamatsu Semiconductor module and camera module mounting said semiconductor module
US20120286418A1 (en) * 2011-05-13 2012-11-15 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Dummy Pillars Between Semiconductor Die and Substrate for Maintaining Standoff Distance

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US8871629B2 (en) 2011-11-08 2014-10-28 Taiwan Semiconductor Manufacturing Company, Ltd. Methods of and semiconductor devices with ball strength improvement
CN103715208B (zh) 2012-09-28 2016-12-21 意法半导体研发(深圳)有限公司 具有粘合填充开口的成像器件及相关方法
US9560771B2 (en) * 2012-11-27 2017-01-31 Omnivision Technologies, Inc. Ball grid array and land grid array having modified footprint
US10523854B2 (en) 2015-06-25 2019-12-31 Intel Corporation Array imaging system having discrete camera modules and method for manufacturing the same
CN107994042B (zh) * 2017-11-28 2020-07-31 信利光电股份有限公司 一种多摄像头模组

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US6762495B1 (en) * 2003-01-30 2004-07-13 Qualcomm Incorporated Area array package with non-electrically connected solder balls
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US7791194B2 (en) * 2008-04-10 2010-09-07 Oracle America, Inc. Composite interconnect
US20100244171A1 (en) * 2009-03-31 2010-09-30 Masayuki Nagamatsu Semiconductor module and camera module mounting said semiconductor module
US8269298B2 (en) * 2009-03-31 2012-09-18 Sanyo Electric Co., Ltd. Semiconductor module and camera module mounting said semiconductor module
US20120286418A1 (en) * 2011-05-13 2012-11-15 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Dummy Pillars Between Semiconductor Die and Substrate for Maintaining Standoff Distance
US10096540B2 (en) * 2011-05-13 2018-10-09 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance

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Publication number Publication date
US20100171192A1 (en) 2010-07-08
WO2009079497A1 (en) 2009-06-25
TWI383476B (zh) 2013-01-21
US7911019B2 (en) 2011-03-22
EP2227897A1 (en) 2010-09-15
CN101897175A (zh) 2010-11-24
EP2227897A4 (en) 2011-02-16
TW200937589A (en) 2009-09-01
CN101897175B (zh) 2013-07-24
EP2227897B1 (en) 2012-09-05

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