CN103715208B - 具有粘合填充开口的成像器件及相关方法 - Google Patents
具有粘合填充开口的成像器件及相关方法 Download PDFInfo
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- CN103715208B CN103715208B CN201210377434.4A CN201210377434A CN103715208B CN 103715208 B CN103715208 B CN 103715208B CN 201210377434 A CN201210377434 A CN 201210377434A CN 103715208 B CN103715208 B CN 103715208B
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- image sensor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Lens Barrels (AREA)
Abstract
Description
Claims (26)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210377434.4A CN103715208B (zh) | 2012-09-28 | 2012-09-28 | 具有粘合填充开口的成像器件及相关方法 |
US14/032,607 US9083872B2 (en) | 2012-09-28 | 2013-09-20 | Imaging device with adhesive filling openings and related methods |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210377434.4A CN103715208B (zh) | 2012-09-28 | 2012-09-28 | 具有粘合填充开口的成像器件及相关方法 |
Publications (2)
Publication Number | Publication Date |
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CN103715208A CN103715208A (zh) | 2014-04-09 |
CN103715208B true CN103715208B (zh) | 2016-12-21 |
Family
ID=50384826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210377434.4A Active CN103715208B (zh) | 2012-09-28 | 2012-09-28 | 具有粘合填充开口的成像器件及相关方法 |
Country Status (2)
Country | Link |
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US (1) | US9083872B2 (zh) |
CN (1) | CN103715208B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101127837A (zh) * | 2006-08-16 | 2008-02-20 | 鸿富锦精密工业(深圳)有限公司 | 影像模组 |
CN102298247A (zh) * | 2010-06-25 | 2011-12-28 | 美商豪威科技股份有限公司 | 用于晶片级照相机模块的强化结构 |
CN203165899U (zh) * | 2012-09-28 | 2013-08-28 | 意法半导体制造(深圳)有限公司 | 成像器件 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1626571A1 (en) | 2004-08-13 | 2006-02-15 | STMicroelectronics Limited | Imaging assembly |
GB2449596B (en) * | 2006-03-22 | 2011-04-20 | Murata Manufacturing Co | Infrared sensor and method for manufacturing infrared sensor |
EP1912427B1 (en) | 2006-10-13 | 2009-12-09 | STMicroelectronics (Research & Development) Limited | Camera module lens cap |
US20090152659A1 (en) | 2007-12-18 | 2009-06-18 | Jari Hiltunen | Reflowable camera module with improved reliability of solder connections |
US8164179B2 (en) | 2008-12-16 | 2012-04-24 | STMicroelectronics Asia Pacific PTE Ltd-Singapore | Chip scale package structure with can attachment |
WO2011008443A2 (en) * | 2009-06-29 | 2011-01-20 | Lensvector Inc. | Wafer level camera module with active optical element |
US8466997B2 (en) | 2009-12-31 | 2013-06-18 | Stmicroelectronics Pte Ltd. | Fan-out wafer level package for an optical sensor and method of manufacture thereof |
US9640574B2 (en) | 2010-12-30 | 2017-05-02 | Stmicroelectronics Pte. Ltd. | Image sensor circuit, system, and method |
WO2013047198A1 (ja) * | 2011-09-30 | 2013-04-04 | 富士フイルム株式会社 | レンズユニット及びその製造方法 |
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2012
- 2012-09-28 CN CN201210377434.4A patent/CN103715208B/zh active Active
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2013
- 2013-09-20 US US14/032,607 patent/US9083872B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101127837A (zh) * | 2006-08-16 | 2008-02-20 | 鸿富锦精密工业(深圳)有限公司 | 影像模组 |
CN102298247A (zh) * | 2010-06-25 | 2011-12-28 | 美商豪威科技股份有限公司 | 用于晶片级照相机模块的强化结构 |
CN203165899U (zh) * | 2012-09-28 | 2013-08-28 | 意法半导体制造(深圳)有限公司 | 成像器件 |
Also Published As
Publication number | Publication date |
---|---|
US20140092297A1 (en) | 2014-04-03 |
CN103715208A (zh) | 2014-04-09 |
US9083872B2 (en) | 2015-07-14 |
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Owner name: ST SEMICONDUCTOR DESIGN AND APPLICATION CO., LTD. Free format text: FORMER OWNER: STMICROELECTRONICS MANUFACTURING (SHENZHEN) CO., LTD. Effective date: 20140626 |
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Effective date of registration: 20140626 Address after: 518057 SKYWORTH building, South Zone, hi tech Zone, Nanshan District Science Park, Guangdong, Shenzhen Applicant after: ST Microelectronics Research Development (Shenzhen) Co.,Ltd. Address before: No. 12 Longgang District of Shenzhen City, Guangdong province 518116 Baolong Industrial City hi tech Avenue Applicant before: STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO.,LTD |
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Address after: 5 / F East B501, South B502, North B503, 6th floor, block B, TCL Industrial Research Institute building, No. 006, Gaoxin South 1st Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: STMicroelectronics (Shenzhen) R&D Co.,Ltd. Address before: 518057 SKYWORTH building, South Zone, hi tech Zone, Nanshan District Science Park, Guangdong, Shenzhen Patentee before: STMicroelectronics (Shenzhen) R&D Co.,Ltd. |