US20090038777A1 - Heat sink and manufacturing method thereof - Google Patents

Heat sink and manufacturing method thereof Download PDF

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Publication number
US20090038777A1
US20090038777A1 US12/187,819 US18781908A US2009038777A1 US 20090038777 A1 US20090038777 A1 US 20090038777A1 US 18781908 A US18781908 A US 18781908A US 2009038777 A1 US2009038777 A1 US 2009038777A1
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US
United States
Prior art keywords
heat
notch
hole
press strips
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/187,819
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English (en)
Inventor
Kuo-Hsin Chen
Hsuan-Chih Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMA Precision Inc
Original Assignee
AMA Precision Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMA Precision Inc filed Critical AMA Precision Inc
Assigned to AMA PRECISION INC. reassignment AMA PRECISION INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, KUO-HSIN, LIN, HSUAN-CHIH
Publication of US20090038777A1 publication Critical patent/US20090038777A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Definitions

  • the invention relates to a heat sink and, more particularly, to a heat sink including heat pipes and heat dissipating fins and a manufacturing method thereof.
  • a heat sink having heat pipes and heat dissipating fins are often used.
  • Such heat sink is made of a material with high heat-conducting coefficient. With the aid of the capillary structure and the working fluid in the heat pipe, such heat sink has a high heat-conducting characteristic. Since it has the advantage of a light structure, the problems of heaviness, cost and complexity of a heat dissipation device can be alleviated.
  • the connections between the heat pipes and the heat dissipating fins are affected by the physical properties of the materials and the method of manufacturing, and the problem of loose connection may occur, which affects the heat conduction between the heat pipes and the heat dissipating fins. Since the structures of the heat dissipation fins are more fragile than the heat pipes, the heat dissipation fins cannot be pressed too heavily to fit them with the heat pipes tightly. Therefore, the heat conduction efficiency is reduced. To solve this problem, stat-of-the-art techniques use metallic heat-conducting materials, such as solder pastes, to fill in the gaps between the heat pipes and the heat dissipating fins to improve the heat conduction between them.
  • An objective of the invention is to provide a heat sink and a manufacturing method thereof.
  • the invention provides a heat sink and a manufacturing method thereof.
  • the heat sink includes a heat dissipating fin and a heat pipe.
  • the heat pipe has a heat absorption end and a condensing end, and the condensing end passes through the heat dissipating fin.
  • the heat dissipating fin has a through hole for the heat pipe to pass through, and a notch formed at the peripheral of the through hole and communicating with the through hole. Openings are formed at two sides of the notch, respectively.
  • press strips pass through the openings and are pressed inwardly to reduce the notch to make the heat dissipation fin plastically deformed, so that the heat dissipating fin is tightly-fitted with the heat pipe to increase the heat-conducting efficiency between the heat dissipating fin and the heat pipe.
  • FIG. 1 is a cross-sectional schematic diagram showing the structure according to an embodiment of the invention.
  • FIG. 2 is a perspective schematic diagram showing the assembled structure according to the embodiment of the invention.
  • FIG. 3 is a perspective schematic diagram showing the operation procedure according to the embodiment of the invention.
  • FIG. 4 is a cross-sectional diagram showing the operation procedure according to the embodiment of the invention.
  • FIG. 5 is a first partially-enlarged view of the combination of the heat pipes and the heat dissipating fins according to the embodiment of the invention.
  • FIG. 6 is a second partially-enlarged view of the combination of the heat pipes and the heat dissipating fins according to the embodiment of the invention.
  • FIG. 7 is a third partially-enlarged view of the combination of the heat pipes and the heat dissipating fins according to the embodiment of the invention.
  • FIG. 8 is a cross-sectional view showing a complete structure according to an embodiment of the invention.
  • a heat sink 1 includes a heat-conducting base 11 , a plurality of heat dissipating fins 12 and a heat pipe 13 (in the drawings, multiple heat pipes are shown for exemplary purpose).
  • the heat-conducting base 11 has a plurality of trenches 111 for accommodating the heat pipe 13 (detailed descriptions will be given hereinbelow).
  • the heat dissipating fins 12 are connected to the upper surface of the heat-conducting base 11 .
  • the heat dissipating fins 12 are provided vertically on the heat-conducting base 11 at intervals.
  • Each heat dissipating fin 12 has through holes 121 formed thereon for the heat pipes 13 to pass through.
  • a notch 122 communicating with each through hole 121 is formed at the upper edge of each through hole 121 .
  • the notch 122 has a shape of inverse triangle. Openings 123 are formed at two sides of each notch 122 of the heat dissipating fin 12 . Those openings 123 are in shapes of triangles, and communicate with neither the through hole 121 nor the notch 122 .
  • the heat pipes 13 are U-shaped pipes, and have heat absorption ends 131 and a condensing ends 132 .
  • the heat absorption ends 131 pass through the trenches 111 of the heat-conducting base 11
  • the condensing ends 132 pass through the through holes 121 of the heat dissipating fins 12 .
  • FIG. 2 is a perspective schematic diagram showing the assembled structure according to the embodiment of the invention.
  • the heat pipes 13 pass through the heat-conducting base 11 and the heat dissipating fins 12 to complete a preliminary structure of the heat sink 1 .
  • the preliminary structure of the heat sink 1 are put on a bearing seat 2 , and press strips 3 pass through the openings 123 of the heat dissipating fin 12 .
  • the shapes of the cross sections of the press strips 3 are substantially the same to the shapes of the openings 123 , and small gaps 4 exist between the press strips 3 and the openings 123 .
  • the lengths of the press strips 3 are longer than the sum of the intervals between the heat dissipating fins 12 .
  • FIG. 3 and FIG. 4 are a schematic view and a sectional view of the operation procedure, respectively.
  • a tool 5 is provided at the bottom of the tool 5 .
  • a plurality of long grooves 51 are formed in one direction
  • a plurality of accommodating grooves 52 are formed in another direction.
  • the positions of the long grooves 51 correspond to those of the heat pipes 13 passing through the heat dissipating fins 12
  • the positions of the accommodating grooves 52 correspond to those of the heat dissipating fins 12 .
  • the heat dissipating fins 12 are accommodated in the accommodating grooves 52 to maintain the completeness of the heat dissipating fins 12 .
  • FIG. 5 to FIG. 7 are partially-enlarged views showing the sequence of combining the heat pipes and the heat dissipating fins.
  • the heat dissipating fins 12 are accommodated in the accommodating grooves 52 , and the tops of the long grooves 51 correspond to the positions of the press strips 3 , as shown by the arrows in FIG. 5 .
  • the tops of the long grooves 51 touch the press strips 3 first.
  • the press strips 3 are pushed to move toward the notches 122 , so that the notches 122 are reduced by the pressing force of the tool 5 , and the peripherals of the through holes 121 of the heat dissipating fins 12 are plastically deformed toward the condensing ends 132 of the heat pipes 13 to make the heat dissipating fins 12 tightly-fit with the heat pipes 13 , as shown by the arrow in FIG. 7 .
  • This improves the heat-conducting efficiency between the condensing ends 132 of the heat pipes 13 and the heat dissipating fins 12 , and eliminates the necessity of the assistance of any heat conducting medium.
  • the press strips 3 are removed from the openings 123 to finish the assembled structure of the heat dissipating fins 12 and the heat pipes 13 , as shown by the sectional view of FIG. 8 .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US12/187,819 2007-08-10 2008-08-07 Heat sink and manufacturing method thereof Abandoned US20090038777A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW096129520A TW200907276A (en) 2007-08-10 2007-08-10 Heat dissipation device and its fabrication method
TW096129520 2007-08-10

Publications (1)

Publication Number Publication Date
US20090038777A1 true US20090038777A1 (en) 2009-02-12

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Family Applications (1)

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US12/187,819 Abandoned US20090038777A1 (en) 2007-08-10 2008-08-07 Heat sink and manufacturing method thereof

Country Status (2)

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US (1) US20090038777A1 (enrdf_load_stackoverflow)
TW (1) TW200907276A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100319880A1 (en) * 2009-06-23 2010-12-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device and manufacturing method thereof
CN102538557A (zh) * 2012-02-07 2012-07-04 魏辉 一种挤压式换热单元及其制作方法
KR200468290Y1 (ko) 2010-05-26 2013-08-12 충-시엔 후앙 냉각 장치
US11478773B2 (en) 2018-07-16 2022-10-25 Basf Corporation Evaporative emission control articles including activated carbon
US11624340B2 (en) 2018-07-16 2023-04-11 Basf Corporation Evaporative emission control articles including activated carbon
US20230235968A1 (en) * 2022-01-21 2023-07-27 Dongguan Hanxu Hardware Plastic Technology Co., Ltd. Tight-fit riveting structure for clustered radiation fin set and heat pipe and riveting method
US11779900B2 (en) 2017-06-28 2023-10-10 Basf Corporation Evaporative emission device and adsorbent

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100319880A1 (en) * 2009-06-23 2010-12-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device and manufacturing method thereof
KR200468290Y1 (ko) 2010-05-26 2013-08-12 충-시엔 후앙 냉각 장치
CN102538557A (zh) * 2012-02-07 2012-07-04 魏辉 一种挤压式换热单元及其制作方法
US11779900B2 (en) 2017-06-28 2023-10-10 Basf Corporation Evaporative emission device and adsorbent
US12168215B2 (en) 2017-06-28 2024-12-17 Basf Corporation Evaporative emission device and adsorbent
US11478773B2 (en) 2018-07-16 2022-10-25 Basf Corporation Evaporative emission control articles including activated carbon
US11624340B2 (en) 2018-07-16 2023-04-11 Basf Corporation Evaporative emission control articles including activated carbon
US11813586B2 (en) 2018-07-16 2023-11-14 Basf Corporation Evaporative emission control articles including activated carbon
US20230235968A1 (en) * 2022-01-21 2023-07-27 Dongguan Hanxu Hardware Plastic Technology Co., Ltd. Tight-fit riveting structure for clustered radiation fin set and heat pipe and riveting method
US11953268B2 (en) * 2022-01-21 2024-04-09 Dongguan Hanxu Hardware Plastic Technology Co., Ltd. Tight-fit riveting structure for clustered radiation fin set and heat pipe and riveting method

Also Published As

Publication number Publication date
TWI327637B (enrdf_load_stackoverflow) 2010-07-21
TW200907276A (en) 2009-02-16

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Legal Events

Date Code Title Description
AS Assignment

Owner name: AMA PRECISION INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, KUO-HSIN;LIN, HSUAN-CHIH;REEL/FRAME:021357/0218

Effective date: 20080804

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION