US20070028437A1 - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
US20070028437A1
US20070028437A1 US11/493,190 US49319006A US2007028437A1 US 20070028437 A1 US20070028437 A1 US 20070028437A1 US 49319006 A US49319006 A US 49319006A US 2007028437 A1 US2007028437 A1 US 2007028437A1
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US
United States
Prior art keywords
propagation
liquid
bath
substrate processing
ultrasonic vibrations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/493,190
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English (en)
Inventor
Masahiro Kimura
Seiichiro Okuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Assigned to DAINIPPON SCREEN MFG. CO., LTD. reassignment DAINIPPON SCREEN MFG. CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIMURA, MASAHIRO, OKUDA, SEIICHIRO
Publication of US20070028437A1 publication Critical patent/US20070028437A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4998—Combined manufacture including applying or shaping of fluent material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/54—Miscellaneous apparatus

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
US11/493,190 2005-07-28 2006-07-26 Substrate processing apparatus and substrate processing method Abandoned US20070028437A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005218490 2005-07-28
JPJP2005-218490 2005-07-28
JPJP2006-084404 2006-03-27
JP2006084404A JP2007059868A (ja) 2005-07-28 2006-03-27 基板処理装置

Publications (1)

Publication Number Publication Date
US20070028437A1 true US20070028437A1 (en) 2007-02-08

Family

ID=37716294

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/493,190 Abandoned US20070028437A1 (en) 2005-07-28 2006-07-26 Substrate processing apparatus and substrate processing method

Country Status (2)

Country Link
US (1) US20070028437A1 (ja)
JP (1) JP2007059868A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8404056B1 (en) * 2009-05-27 2013-03-26 WD Media, LLC Process control for a sonication cleaning tank
US8863763B1 (en) 2009-05-27 2014-10-21 WD Media, LLC Sonication cleaning with a particle counter
CN104139106A (zh) * 2014-07-11 2014-11-12 山东科技大学 一种板材超声振动颗粒介质成形装置
US20180342844A1 (en) * 2013-10-21 2018-11-29 A. C. Dandy Products Ltd. Power pedestal with breakaway pedestal base
US20190172734A1 (en) * 2017-12-04 2019-06-06 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
CN111524834A (zh) * 2020-04-29 2020-08-11 西安奕斯伟硅片技术有限公司 一种多晶硅清洗装置及方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2226834B1 (en) * 2009-03-06 2020-04-29 IMEC vzw Method for physical force assisted cleaning with reduced damage
JP2011151282A (ja) * 2010-01-25 2011-08-04 Shin Etsu Handotai Co Ltd 超音波洗浄方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6138698A (en) * 1997-11-20 2000-10-31 Tokyo Electron Limited Ultrasonic cleaning apparatus
US20050150515A1 (en) * 2001-04-19 2005-07-14 Suguru Ozawa Gas dissolved water producing apparatus and method thereof and ultrasonic cleaning equipment and method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6138698A (en) * 1997-11-20 2000-10-31 Tokyo Electron Limited Ultrasonic cleaning apparatus
US20050150515A1 (en) * 2001-04-19 2005-07-14 Suguru Ozawa Gas dissolved water producing apparatus and method thereof and ultrasonic cleaning equipment and method thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8404056B1 (en) * 2009-05-27 2013-03-26 WD Media, LLC Process control for a sonication cleaning tank
US8863763B1 (en) 2009-05-27 2014-10-21 WD Media, LLC Sonication cleaning with a particle counter
US20180342844A1 (en) * 2013-10-21 2018-11-29 A. C. Dandy Products Ltd. Power pedestal with breakaway pedestal base
CN104139106A (zh) * 2014-07-11 2014-11-12 山东科技大学 一种板材超声振动颗粒介质成形装置
US20190172734A1 (en) * 2017-12-04 2019-06-06 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US11232959B2 (en) * 2017-12-04 2022-01-25 Tokyo Electron Limited Substrate processing apparatus and substrate processing meihod
US11915947B2 (en) 2017-12-04 2024-02-27 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
CN111524834A (zh) * 2020-04-29 2020-08-11 西安奕斯伟硅片技术有限公司 一种多晶硅清洗装置及方法

Also Published As

Publication number Publication date
JP2007059868A (ja) 2007-03-08

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Legal Events

Date Code Title Description
AS Assignment

Owner name: DAINIPPON SCREEN MFG. CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KIMURA, MASAHIRO;OKUDA, SEIICHIRO;REEL/FRAME:018135/0288

Effective date: 20060622

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION