US20060201983A1 - Glass cutting method - Google Patents

Glass cutting method Download PDF

Info

Publication number
US20060201983A1
US20060201983A1 US10/551,760 US55176005A US2006201983A1 US 20060201983 A1 US20060201983 A1 US 20060201983A1 US 55176005 A US55176005 A US 55176005A US 2006201983 A1 US2006201983 A1 US 2006201983A1
Authority
US
United States
Prior art keywords
glass
laser
scribe line
laser beam
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US10/551,760
Other versions
US7423237B2 (en
Inventor
Hideaki Kusama
Toshio Inami
Naoyuki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Steel Works Ltd
Original Assignee
Japan Steel Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Steel Works Ltd filed Critical Japan Steel Works Ltd
Assigned to JAPAN STEEL WORKS, LTD., THE reassignment JAPAN STEEL WORKS, LTD., THE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INAMI, TOSHIO, KUSAMA, HIDEAKI, KOBAYASHI, NAOYUKI
Publication of US20060201983A1 publication Critical patent/US20060201983A1/en
Application granted granted Critical
Publication of US7423237B2 publication Critical patent/US7423237B2/en
Expired - Fee Related legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042Automatically aligning the laser beam
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076Laminated glass comprising interlayers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00Severing by tearing or breaking
    • Y10T225/10Methods
    • Y10T225/12With preliminary weakening
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00Severing by tearing or breaking
    • Y10T225/30Breaking or tearing apparatus
    • Y10T225/304Including means to apply thermal shock to work

Definitions

  • the present invention relates to a method of cutting glass, and more specifically, to a method of cutting laminated glass.
  • a scribe line (notch line) 62 is formed on the surface of glass 60 with a blade 61 such as a diamond blade or a super-hard blade, and thereafter, a break force (shock separation force) 63 is applied from a rear surface to cut the glass 60 along the scribe line 62 .
  • a method of cutting glass using a laser has been also known.
  • a method disclosed in Patent Document 1 involves, as shown in FIG. 7 , irradiating the glass 60 with an infrared laser 74 shaped in an oval shape and transmitted through the glass with relative ease, and the vicinity of a rear side of a laser-irradiated portion is cooled with a refrigerant 75 (aqueous coolant). More specifically, an initial crack is previously caused manually at a portion where the glass 60 is to be cut. Then, the laser 74 is irradiated from the portion and the vicinity of a rear side of the irradiated portion is being cooled with the refrigerant 75 in a liquid form (or gaseous form) while both of them are scanned on the glass 60 .
  • a refrigerant 75 aqueous coolant
  • Patent Document 2 utilizes an ultraviolet laser with high photon energy in place of the infrared laser 74 shown in FIG. 7 .
  • One ultraviolet laser beam is condensed with a lens, and a molecular bond inside glass is directly broken, whereby a scribe line is formed without causing an initial crack.
  • the refrigerant 75 is not used.
  • an infrared laser is used instead of a mechanical shock.
  • Patent Document 3 proposes that laser light from various kinds of laser oscillators is divided in two systems, and linear laser light is applied to front and rear surfaces of a substrate.
  • the substrate include a glass substrate and a quartz substrate for a liquid crystal display apparatus and a solar battery, and two substrates are laminated.
  • the linear laser light forms scratching lines, i.e., scribe lines on two substrates simultaneously or successively, and the substrates on which the scribe lines are formed are irradiated with wide laser light, and thus heated and thermally distorted, whereby the substrates are separated or broken along the scribe lines.
  • the linear laser light is shaped in a rectangular shape with a cylindrical lens array or the like.
  • Patent Document 1 JP 9-150286 A
  • Patent Document 2 JP 5-32428 A
  • Patent Document 3 JP 2001-179473 A
  • the blade 61 such as a diamond blade or a super-hard blade
  • the blade 61 is a consumable product, so that a cutting apparatus is stopped every time the blade 61 is exchanged.
  • the use of laser light in two systems enables laminated glass to be cut without reversing the glass.
  • laser light is applied to one side and the other side of the laminated glass respectively, so that a light path needs to be ensured on the front and rear sides of the glass. This complicates the configuration of an apparatus and enlarges the apparatus.
  • the operation of adjusting an irradiation position of laser light in two systems to the glass is performed on front and rear sides of the glass, which unavoidably results in the cumbersome operation.
  • the present invention has been made in view of the above-mentioned problems in conventional techniques, and provides the following configuration.
  • the invention as claimed in claim 1 relates to a method of cutting glass in which a first glass member 5 a and a second glass member 5 b are laminated to each other via a spacer 5 c , and a portion in which a light transmissive material is filled in between the two glass members 5 a , 5 b is cut, the method being characterized by including: irradiating a first laser beam 2 and a second laser beam 3 composed of an ultraviolet laser from a side of the second glass member 5 b , allowing the first laser beam 2 to pass through the second glass member 5 b to condense the first laser beam 2 on the first glass member 5 a to form a first scribe line 14 , condensing the second laser beam 3 on the second glass member 5 b to form a second scribe line 15 ; and applying a break force to the first scribe line 14 and the second scribe line 15 to cut the glass.
  • the method of cutting glass according to claim 1 is characterized in that the first scribe line 14 is formed first, and then, the second scribe line 15 is formed on an upper side of the first scribe line 14 .
  • the method of cutting glass according to claim 1 or 2 is characterized in that the first laser beam 2 and the second laser beam 3 are one of a linear beam and an oval beam.
  • each laser beam is irradiated from a side of a second glass member so that a first laser beam passes through the second glass member and a light transmissive material to be condensed to a first glass member, whereby a first scribe line is formed, and a second laser beam is condensed to the second glass member to form a second scribe line, and thereafter, a break force is applied to cut the laminated glass. Therefore, it is not necessary to perform the step of reversing the laminated glass during breaking.
  • the first and second laser beams are irradiated from one side of the laminated glass, so that a light path only needs to be ensured only on one side of the glass. Consequently, the configuration of an apparatus becomes simple, and the apparatus becomes small.
  • the operation of adjusting an irradiation position of the laser beam in two systems to the glass is performed only on one side of the glass, which makes it easy to perform the operation.
  • the two glass members, first and second glass members are cut simultaneously, whereby a break time is shortened remarkably, which enables the efficient cutting of the laminated glass.
  • a laser beam is applied to the first glass member farther from the laser beam than the other to form a scribe line, and then, the same processing is performed with respect to a second glass member closer thereto.
  • a scribe line can be formed exactly on the first glass member at a position overlapping with a scribe line on the second glass member without allowing light to scatter due to the scribe line formed on the second glass member.
  • the irradiation shape of an ultraviolet laser to glass is set to be a linear beam or an oval beam, whereby a large region having a laser energy density optimum for scribing can be ensured on a scribe line without decreasing the original output of an ultraviolet laser, which remarkably increases a scribing speed and enhances the glass cutting efficiency.
  • FIG. 1 A schematic diagram showing a cutting apparatus used for implementing a method of cutting glass according to a first embodiment of the present invention.
  • FIG. 2 A cross-sectional view showing main portions of a substrate according to the first embodiment of the present invention.
  • FIG. 3 A view showing a linear beam and an oval beam according to the first embodiment of the present invention, in which FIG. 3 (A) is a view showing a linear beam, and FIG. 3 (B) shows an oval beam.
  • FIG. 4 A view illustrating an overlapping state of laser beams according to the first embodiment of the present invention, in which FIG. 3 (A) is a view showing an overlapping state of linear beams, and FIG. 3 (B) is a view showing an overlapping state of oval beams.
  • FIG. 5 A line diagram showing wavelength-transmittance characteristics of ultraviolet light according to the first embodiment of the present invention.
  • FIG. 6 A perspective view showing a conventional cutting method.
  • FIG. 7 A perspective view showing a conventional cutting method.
  • FIGS. 1 to 4 show an apparatus for cutting glass according to a first embodiment of the present invention.
  • reference numeral 1 denotes a laser oscillation apparatus. Scribe lines 14 , 15 are formed on a substrate 5 with a first laser beam 2 and a second laser beam 3 composed of an ultraviolet laser emitted from the laser oscillation apparatus 1 , and thereafter, the substrate 5 is cut.
  • the laser oscillation apparatus 1 may be composed of an apparatus for emitting the first laser beam 2 and an apparatus for emitting the second laser beam 3 .
  • One laser light emitted from one laser oscillator may be split with a half mirror (not shown), and one light beam is set to be the first laser beam 2 and the other light beam is set to be the second laser beam 3 .
  • the laser oscillation apparatus 1 emits an ultraviolet laser; therefore, for example, an apparatus for generating the third harmonic of a Nd:YAG laser can be used.
  • the substrate 5 is a substrate of a flat panel display such as a liquid crystal panel display. As shown in FIG. 2 , two glass members 5 a , 5 b are laminated via spacers 5 c , and a cutting portion 5 d containing a light transmissive material is provided between the pair of spacers 5 c and the first and second glass members 5 a , 5 b . Thus, the substrate 5 is laminated glass.
  • the first laser beam 2 and the second laser beam 3 are guided in parallel to one side (upper side in the figure) of the substrate 5 , and respectively shaped in a linear or oval shape with beam shaping elements 7 , 8 . Then, the first and second laser beams 2 and 3 are deflected by 90° with respective mirrors 10 , 11 , and condensed with respective condensing lenses 12 , 13 , whereby they are irradiated to the substrate 1 from one side substantially vertically.
  • the laser beams 2 , 3 shaped with the beam shaping elements 7 , 8 are linear beams shown in FIG. 3 (A) or oval beams shown in FIG. 3 (B).
  • the first laser beam 2 passing through one condensing lens 12 is irradiated to the substrate 5 from one side, passes through the second glass member 5 b , and is condensed at a predetermined position of the first glass member 5 a positioned on the lower side to form a first scribe line 14 .
  • the first laser beam 2 composed of an ultraviolet laser passes through the second glass member 5 b with ease owing to the satisfactory glass transmittance, and when the first laser beam 2 is condensed at a predetermined position of the first glass member 5 a , it directly breaks a molecular bond inside the glass to form the scribe line 14 .
  • the scribe line 14 is formed without generating an initial crack.
  • a portion where the scribe line 14 is formed, i.e., a cutting portion of the substrate 5 is the cutting portion 5 d containing a light transmissive material between the spacers 5 c , 5 c . Therefore, the first laser beam 2 composed of an ultraviolet laser passes through the second glass member 5 b positioned on the upper side and the light transmissive material to reach the first glass member 5 a positioned on the lower side satisfactorily and to be condensed in accordance with a focal position of the condensing lens 12 . Needless to say, the first laser beam 2 is sufficiently dispersed so as to pass through the second glass member 5 b without giving damage (photochemical reaction due to vaporization/evaporation and dissociation/ionization, etc.) thereto.
  • the transmittance (%) of ultraviolet light with respect to glass for a flat panel display with a thickness of 0.7 mm is as shown in FIG. 5 , and regarding the three-times harmonic (wavelength: 355 nm) of an ultraviolet laser, e.g., a Nd:YAG laser, about 85% thereof passes through the glass. Regarding a four-times harmonic (wavelength: 266 nm), the transmittance is about 5%, which is unsuitable as the first laser beam 2 .
  • an ultraviolet laser with a wavelength having a transmittance of 80% or more, preferably 85% or more is appropriate.
  • the second laser beam 3 passing through the other condensing lens 13 is applied to the substrate 5 from one side, and is condensed at a predetermined position of the second glass member 5 b positioned on the upper side to form a second scribe line 15 similarly.
  • Ascribe direction X in which both the scribe lines 14 , 15 are formed extends to the right in FIG. 1 , and the first scribe line 14 is first formed, and then, the second scribe line 15 is formed.
  • the second scribe line 15 is formed so as to overlap with the upper side of the first scribe line 14 .
  • the first laser beam 2 passes through the second glass member 5 b under the condition that the second scribe line 15 is not formed. Therefore, in the case of forming the second scribe line 15 so as to overlap with the upper side of the first scribe line 14 , the first laser beam 2 is scattered by the scribe line 15 on the second glass member 5 b , whereby the transmittance is reliably prevented from degrading.
  • the scribe direction X can be set through the relative movement between the substrate 5 and the first and second laser beams 2 , 3 .
  • the substrate 5 is moved by moving a mounting board (not shown) for the substrate 5 . Needless to say, it is not necessary to form a slit for allowing a laser beam to pass through on the mounting board for the substrate 5 .
  • the first and second laser beams 2 , 3 can be moved by moving the laser oscillation apparatus 1 , the beam shaping elements 7 , 8 , the mirrors 10 , 11 , and the condensing lenses 12 , 13 in an integrated manner.
  • the laser beams 2 , 3 composed of an ultraviolet laser are emitted in a pulsed form, and irradiated by being relatively moved in the scribe direction X with respect to the substrate 5 so as to appropriately overlap with each other. Therefore, the relative movement speed in the scribe direction X is set in such a manner that the linear beams shown in FIG. 3 (A) and the oval beams shown in FIG. 3 (B) overlap with each other at a predetermined interval up to a predetermined number of overlap times as shown in FIGS. 4 (A) and 4 (B), respectively.
  • an ultraviolet laser to glass By setting the irradiation shape of an ultraviolet laser to glass to be a linear beam or an oval beam, a large region having a laser energy density optimum for scribing can be ensured on the scribe lines 14 , 15 without decreasing the original output of an ultraviolet laser emitted from the laser oscillation apparatus 1 , whereby the scribing speed can be increased.
  • an ultraviolet laser when a laser output is set too high, cracks develop in parallel to the scribe line and welding occurs again. Furthermore, non-uniform cracks develop vertically to the extending direction (X) of the scribe line. Consequently, at a time of breaking, a cut surface does not become uniform, and the strength of glass at that portion is weakened by at least two orders of magnitude due to the presence of cracks at a cutting portion edge on the scribed side. Therefore, an ultraviolet laser needs to be used with the output thereof suppressed to an appropriate value at which the depth and shape of a scribe line becomes optimum, instead of the maximum output.
  • an ultraviolet laser is not irradiated to glass under the condition of being condensed in a circular shape with the output thereof suppressed to an optimum value for forming the scribe lines 14 , 15 , and the following is performed.
  • An ultraviolet laser with the maximum output is shaped to a linear beam or an oval beam with such an output that gives an appropriate energy density, and is applied to the glass (substrate 5 ) at an optimum energy for forming the scribe lines 14 , 15 with a large area, whereby the scribe lines 14 , 15 are formed effectively.
  • the ultraviolet laser with a short wavelength can be photochemically decomposed due to a large energy of one photon, and if an appropriate irradiation time is given at an appropriate energy density, fine processing with precision can be performed without having a large thermal effect on the periphery.
  • the movement amount per pulse of a linear beam or an oval beam can be obtained largely from the first laser beam 2 and the second laser beam 3 composed of an ultraviolet laser that is emitted in a pulsed form, and the time for forming the scribe lines 14 , 15 required for cutting glass can be shortened.
  • the circular beam and the linear beam shown in FIG. 3 (A) are given a size and an energy density optimum for scribing, and the scribing speeds are compared.
  • the scribing speed of the linear beam is (long side of a linear beam/diameter of a circular beam) times as high as the circular beam.
  • the energy density of a laser beam at portions for forming the scribe lines 14 , 15 needs to be about 28 J/cm 2 .
  • the scan speed with a linear beam (rectangular beam) of 20 ⁇ m ⁇ 40 ⁇ m becomes twice that of a square beam of 20 ⁇ m ⁇ 20 ⁇ m at the same energy density.
  • the laser beams 2 , 3 of an ultraviolet laser incident from one side (upper side in the figure) with respect to two glass plates of laminated glass are condensed at respective target portions, using the transmittance characteristics of an ultraviolet laser with respect to glass, whereby scribing can be performed simultaneously and efficiently.
  • the step of reversing the laminated glass for scribing the laminated glass is not necessary.
  • a slight time delay is set between irradiations with the two laser beams 2 , 3 , and under this condition, an ultraviolet laser is irradiated to the overlapping position of the first glass member 5 a and the second glass member 5 b of the substrate 5 composed of laminated glass, whereby a scribe line can be formed substantially simultaneously and at a high speed.
  • the energy profile of the laser beams 2 , 3 is a flat linear beam.
  • the laser beams 2 , 3 of this type can be formed through splitting and overlapping of laser beams, shaping of a laser beam with a rectangular kaleidoscope, or shaping of a kinoform phase control plate.
  • the substrate 5 that is laminated glass in which the scribe lines 14 , 15 are thus formed is cut along the scribe lines 14 , 15 in the step of breaking.
  • breaking means in the step of breaking conventionally known means can be adopted, and any one of a mechanical shock, cooling with a refrigerant in a liquid or gaseous form, and irradiation with an infrared laser can be used.
  • the breaking means By applying a break force by the breaking means to the substrate 5 in which the scribe lines 14 , 15 are formed from front and rear surfaces, and cutting the first and second glass members 5 a , 5 b simultaneously, the substrate 5 can be divided into a plurality of pieces along the scribe lines 14 , 15 .
  • a time required for cutting glass is shortened remarkably.
  • the respective laser beams 2 , 3 are condensed on one side (upper surface portion in the figure) of the respective glass members 5 a , 5 b .
  • the following can also be performed.
  • the respective laser beams 2 , 3 are condensed on the other side (lower surface portion in the figure) of the respective glass members 5 a , 5 b to form scribe lines ( 14 , 15 ), and a break force is applied to the portions of the scribe lines ( 14 , 15 ), whereby the substrate 5 is cut.
  • the present invention is also applicable to laminated glass of two or more layers, instead of two-layered laminated glass.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)

Abstract

According to the present invention, a first laser beam 2 and a second laser beam 3 composed of an ultraviolet laser are irradiated from a side of a second glass member 5 b, allowing the first laser beam 2 to pass through the second glass member 5 b so as to condense the first laser beam 2 on the first glass member 5 a to form a first scribe line 14, condensing the second laser beam 3 on the second glass member 5 b to form a second scribe line 15, and applying a break force to the first scribe line 14 and the second scribe line 15 to cut the glass.

Description

    TECHNICAL FIELD
  • The present invention relates to a method of cutting glass, and more specifically, to a method of cutting laminated glass.
  • BACKGROUND ART
  • As a conventional, typical method of cutting glass, as shown in FIG. 6, the following is known: a scribe line (notch line) 62 is formed on the surface of glass 60 with a blade 61 such as a diamond blade or a super-hard blade, and thereafter, a break force (shock separation force) 63 is applied from a rear surface to cut the glass 60 along the scribe line 62.
  • A method of cutting glass using a laser has been also known.
  • A method disclosed in Patent Document 1 involves, as shown in FIG. 7, irradiating the glass 60 with an infrared laser 74 shaped in an oval shape and transmitted through the glass with relative ease, and the vicinity of a rear side of a laser-irradiated portion is cooled with a refrigerant 75 (aqueous coolant). More specifically, an initial crack is previously caused manually at a portion where the glass 60 is to be cut. Then, the laser 74 is irradiated from the portion and the vicinity of a rear side of the irradiated portion is being cooled with the refrigerant 75 in a liquid form (or gaseous form) while both of them are scanned on the glass 60. This allows the initial crack to develop in a desired cutting direction owing to the thermal distortion of the inside of the glass 60, whereby a scribe line 72 is formed. By applying a break force 73 from a rear surface of the glass 60 after the scribe line 72 is formed, the glass 60 is cut.
  • A method disclosed in Patent Document 2 utilizes an ultraviolet laser with high photon energy in place of the infrared laser 74 shown in FIG. 7. One ultraviolet laser beam is condensed with a lens, and a molecular bond inside glass is directly broken, whereby a scribe line is formed without causing an initial crack. Thus, the refrigerant 75 is not used. For breaking, an infrared laser is used instead of a mechanical shock.
  • Patent Document 3 proposes that laser light from various kinds of laser oscillators is divided in two systems, and linear laser light is applied to front and rear surfaces of a substrate. Examples of the substrate include a glass substrate and a quartz substrate for a liquid crystal display apparatus and a solar battery, and two substrates are laminated. The linear laser light forms scratching lines, i.e., scribe lines on two substrates simultaneously or successively, and the substrates on which the scribe lines are formed are irradiated with wide laser light, and thus heated and thermally distorted, whereby the substrates are separated or broken along the scribe lines. The linear laser light is shaped in a rectangular shape with a cylindrical lens array or the like.
  • Patent Document 1: JP 9-150286 A
  • Patent Document 2: JP 5-32428 A
  • Patent Document 3: JP 2001-179473 A
  • DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
  • According to the method of cutting with the blade 61 such as a diamond blade or a super-hard blade, there are disadvantages in that micro cracks develop at a cutting portion during scribing or breaking to decrease the strength of glass, and particles are generated to scatter during cutting. Furthermore, the blade 61 is a consumable product, so that a cutting apparatus is stopped every time the blade 61 is exchanged.
  • In contrast, according to the cutting method using an infrared laser, although micro-cracks and particles can be prevented from being caused at the cutting portion, an initial crack needs to be formed in a portion from which a scribe line extends. Therefore, the operation is cumbersome, and for example, in the case of forming crossing scribe lines, if one scribe line is formed and then, a scribe line crossing the previous scribe line is formed, it is difficult to draw the scribe line at a crossing point. Consequently, an initial crack needs to be formed at the crossing point again, which makes the operation remarkably cumbersome. Furthermore, it is very difficult to select the strength of a laser and cooling conditions for extending a scribe line from an initial crack.
  • On the other hand, in the case of using an ultraviolet laser, provided that one ultraviolet laser beam is disclosed as shown in Patent Document 2, a scribe line is formed from each surface of glass in the case of irradiating laminated glass with the ultraviolet laser. Thus, in a scribe stage of laminated glass, the step of reversing the laminated glass is required for the purpose of irradiating front and rear surfaces of the glass with the ultraviolet laser.
  • Furthermore, the use of laser light in two systems enables laminated glass to be cut without reversing the glass. However, laser light is applied to one side and the other side of the laminated glass respectively, so that a light path needs to be ensured on the front and rear sides of the glass. This complicates the configuration of an apparatus and enlarges the apparatus. In addition, the operation of adjusting an irradiation position of laser light in two systems to the glass is performed on front and rear sides of the glass, which unavoidably results in the cumbersome operation.
  • Means for Solving the Problems
  • The present invention has been made in view of the above-mentioned problems in conventional techniques, and provides the following configuration.
  • The invention as claimed in claim 1 relates to a method of cutting glass in which a first glass member 5 a and a second glass member 5 b are laminated to each other via a spacer 5 c, and a portion in which a light transmissive material is filled in between the two glass members 5 a, 5 b is cut, the method being characterized by including: irradiating a first laser beam 2 and a second laser beam 3 composed of an ultraviolet laser from a side of the second glass member 5 b, allowing the first laser beam 2 to pass through the second glass member 5 b to condense the first laser beam 2 on the first glass member 5 a to form a first scribe line 14, condensing the second laser beam 3 on the second glass member 5 b to form a second scribe line 15; and applying a break force to the first scribe line 14 and the second scribe line 15 to cut the glass.
  • According to the invention as claimed in claim 2, the method of cutting glass according to claim 1 is characterized in that the first scribe line 14 is formed first, and then, the second scribe line 15 is formed on an upper side of the first scribe line 14.
  • According to the invention as claimed in claim 3, the method of cutting glass according to claim 1 or 2 is characterized in that the first laser beam 2 and the second laser beam 3 are one of a linear beam and an oval beam.
  • Effects of the Invention
  • As is understood from the above description, according to the method of cutting glass of the present invention, the following effects can be exhibited.
  • According to independent claim 1, for scribing laminated glass, the transmittance characteristics of an ultraviolet laser with respect to glass are used effectively. Each laser beam is irradiated from a side of a second glass member so that a first laser beam passes through the second glass member and a light transmissive material to be condensed to a first glass member, whereby a first scribe line is formed, and a second laser beam is condensed to the second glass member to form a second scribe line, and thereafter, a break force is applied to cut the laminated glass. Therefore, it is not necessary to perform the step of reversing the laminated glass during breaking. Furthermore, the first and second laser beams are irradiated from one side of the laminated glass, so that a light path only needs to be ensured only on one side of the glass. Consequently, the configuration of an apparatus becomes simple, and the apparatus becomes small. In addition, the operation of adjusting an irradiation position of the laser beam in two systems to the glass is performed only on one side of the glass, which makes it easy to perform the operation. Furthermore, the two glass members, first and second glass members are cut simultaneously, whereby a break time is shortened remarkably, which enables the efficient cutting of the laminated glass.
  • According to claim 2, first, a laser beam is applied to the first glass member farther from the laser beam than the other to form a scribe line, and then, the same processing is performed with respect to a second glass member closer thereto. Through the processing, a scribe line can be formed exactly on the first glass member at a position overlapping with a scribe line on the second glass member without allowing light to scatter due to the scribe line formed on the second glass member.
  • According to claim 3, the irradiation shape of an ultraviolet laser to glass is set to be a linear beam or an oval beam, whereby a large region having a laser energy density optimum for scribing can be ensured on a scribe line without decreasing the original output of an ultraviolet laser, which remarkably increases a scribing speed and enhances the glass cutting efficiency.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [FIG. 1] A schematic diagram showing a cutting apparatus used for implementing a method of cutting glass according to a first embodiment of the present invention.
  • [FIG. 2] A cross-sectional view showing main portions of a substrate according to the first embodiment of the present invention.
  • [FIG. 3] A view showing a linear beam and an oval beam according to the first embodiment of the present invention, in which FIG. 3(A) is a view showing a linear beam, and FIG. 3(B) shows an oval beam.
  • [FIG. 4] A view illustrating an overlapping state of laser beams according to the first embodiment of the present invention, in which FIG. 3(A) is a view showing an overlapping state of linear beams, and FIG. 3(B) is a view showing an overlapping state of oval beams.
  • [FIG. 5] A line diagram showing wavelength-transmittance characteristics of ultraviolet light according to the first embodiment of the present invention.
  • [FIG. 6] A perspective view showing a conventional cutting method.
  • [FIG. 7] A perspective view showing a conventional cutting method.
  • BEST MODE FOR CARRYING OUT THE INVENTION
  • It is an object of the present invention to provide a method of cutting glass with a compact, simple apparatus, in which first and second laser beams are irradiated only from one side of laminated glass, and a light path only needs to be ensured only on one side of the glass.
  • First Embodiment
  • FIGS. 1 to 4 show an apparatus for cutting glass according to a first embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a laser oscillation apparatus. Scribe lines 14, 15 are formed on a substrate 5 with a first laser beam 2 and a second laser beam 3 composed of an ultraviolet laser emitted from the laser oscillation apparatus 1, and thereafter, the substrate 5 is cut. The laser oscillation apparatus 1 may be composed of an apparatus for emitting the first laser beam 2 and an apparatus for emitting the second laser beam 3. One laser light emitted from one laser oscillator may be split with a half mirror (not shown), and one light beam is set to be the first laser beam 2 and the other light beam is set to be the second laser beam 3. The laser oscillation apparatus 1 emits an ultraviolet laser; therefore, for example, an apparatus for generating the third harmonic of a Nd:YAG laser can be used.
  • The substrate 5 is a substrate of a flat panel display such as a liquid crystal panel display. As shown in FIG. 2, two glass members 5 a, 5 b are laminated via spacers 5 c, and a cutting portion 5 d containing a light transmissive material is provided between the pair of spacers 5 c and the first and second glass members 5 a, 5 b. Thus, the substrate 5 is laminated glass.
  • The first laser beam 2 and the second laser beam 3 are guided in parallel to one side (upper side in the figure) of the substrate 5, and respectively shaped in a linear or oval shape with beam shaping elements 7, 8. Then, the first and second laser beams 2 and 3 are deflected by 90° with respective mirrors 10, 11, and condensed with respective condensing lenses 12, 13, whereby they are irradiated to the substrate 1 from one side substantially vertically. The laser beams 2, 3 shaped with the beam shaping elements 7, 8 are linear beams shown in FIG. 3(A) or oval beams shown in FIG. 3(B).
  • The first laser beam 2 passing through one condensing lens 12 is irradiated to the substrate 5 from one side, passes through the second glass member 5 b, and is condensed at a predetermined position of the first glass member 5 a positioned on the lower side to form a first scribe line 14. The first laser beam 2 composed of an ultraviolet laser passes through the second glass member 5 b with ease owing to the satisfactory glass transmittance, and when the first laser beam 2 is condensed at a predetermined position of the first glass member 5 a, it directly breaks a molecular bond inside the glass to form the scribe line 14. The scribe line 14 is formed without generating an initial crack. A portion where the scribe line 14 is formed, i.e., a cutting portion of the substrate 5 is the cutting portion 5 d containing a light transmissive material between the spacers 5 c, 5 c. Therefore, the first laser beam 2 composed of an ultraviolet laser passes through the second glass member 5 b positioned on the upper side and the light transmissive material to reach the first glass member 5 a positioned on the lower side satisfactorily and to be condensed in accordance with a focal position of the condensing lens 12. Needless to say, the first laser beam 2 is sufficiently dispersed so as to pass through the second glass member 5 b without giving damage (photochemical reaction due to vaporization/evaporation and dissociation/ionization, etc.) thereto.
  • Herein, the transmittance (%) of ultraviolet light with respect to glass for a flat panel display with a thickness of 0.7 mm is as shown in FIG. 5, and regarding the three-times harmonic (wavelength: 355 nm) of an ultraviolet laser, e.g., a Nd:YAG laser, about 85% thereof passes through the glass. Regarding a four-times harmonic (wavelength: 266 nm), the transmittance is about 5%, which is unsuitable as the first laser beam 2. Thus, as the first laser beam 2, an ultraviolet laser with a wavelength having a transmittance of 80% or more, preferably 85% or more is appropriate.
  • The second laser beam 3 passing through the other condensing lens 13 is applied to the substrate 5 from one side, and is condensed at a predetermined position of the second glass member 5 b positioned on the upper side to form a second scribe line 15 similarly. Ascribe direction X in which both the scribe lines 14, 15 are formed extends to the right in FIG. 1, and the first scribe line 14 is first formed, and then, the second scribe line 15 is formed. Usually, the second scribe line 15 is formed so as to overlap with the upper side of the first scribe line 14. If the first scribe line 14 to be formed on the first glass member 5 a through the second glass member 5 b is formed first, the first laser beam 2 passes through the second glass member 5 b under the condition that the second scribe line 15 is not formed. Therefore, in the case of forming the second scribe line 15 so as to overlap with the upper side of the first scribe line 14, the first laser beam 2 is scattered by the scribe line 15 on the second glass member 5 b, whereby the transmittance is reliably prevented from degrading.
  • The scribe direction X can be set through the relative movement between the substrate 5 and the first and second laser beams 2, 3. The substrate 5 is moved by moving a mounting board (not shown) for the substrate 5. Needless to say, it is not necessary to form a slit for allowing a laser beam to pass through on the mounting board for the substrate 5. The first and second laser beams 2, 3 can be moved by moving the laser oscillation apparatus 1, the beam shaping elements 7, 8, the mirrors 10, 11, and the condensing lenses 12, 13 in an integrated manner.
  • The laser beams 2, 3 composed of an ultraviolet laser are emitted in a pulsed form, and irradiated by being relatively moved in the scribe direction X with respect to the substrate 5 so as to appropriately overlap with each other. Therefore, the relative movement speed in the scribe direction X is set in such a manner that the linear beams shown in FIG. 3(A) and the oval beams shown in FIG. 3(B) overlap with each other at a predetermined interval up to a predetermined number of overlap times as shown in FIGS. 4(A) and 4(B), respectively. By setting the irradiation shape of an ultraviolet laser to glass to be a linear beam or an oval beam, a large region having a laser energy density optimum for scribing can be ensured on the scribe lines 14, 15 without decreasing the original output of an ultraviolet laser emitted from the laser oscillation apparatus 1, whereby the scribing speed can be increased.
  • In the case of using an ultraviolet laser, when a laser output is set too high, cracks develop in parallel to the scribe line and welding occurs again. Furthermore, non-uniform cracks develop vertically to the extending direction (X) of the scribe line. Consequently, at a time of breaking, a cut surface does not become uniform, and the strength of glass at that portion is weakened by at least two orders of magnitude due to the presence of cracks at a cutting portion edge on the scribed side. Therefore, an ultraviolet laser needs to be used with the output thereof suppressed to an appropriate value at which the depth and shape of a scribe line becomes optimum, instead of the maximum output.
  • More specifically, an ultraviolet laser is not irradiated to glass under the condition of being condensed in a circular shape with the output thereof suppressed to an optimum value for forming the scribe lines 14, 15, and the following is performed. An ultraviolet laser with the maximum output is shaped to a linear beam or an oval beam with such an output that gives an appropriate energy density, and is applied to the glass (substrate 5) at an optimum energy for forming the scribe lines 14, 15 with a large area, whereby the scribe lines 14, 15 are formed effectively. The ultraviolet laser with a short wavelength can be photochemically decomposed due to a large energy of one photon, and if an appropriate irradiation time is given at an appropriate energy density, fine processing with precision can be performed without having a large thermal effect on the periphery.
  • Accordingly, the movement amount per pulse of a linear beam or an oval beam can be obtained largely from the first laser beam 2 and the second laser beam 3 composed of an ultraviolet laser that is emitted in a pulsed form, and the time for forming the scribe lines 14, 15 required for cutting glass can be shortened.
  • The circular beam and the linear beam shown in FIG. 3(A) are given a size and an energy density optimum for scribing, and the scribing speeds are compared. In the case where the oscillation repetition frequency of a laser oscillator is the same, the scribing speed of the linear beam is (long side of a linear beam/diameter of a circular beam) times as high as the circular beam. Thus, the disadvantage involved in a pulse oscillation that the scribing speed becomes low, caused by using overlapping ultraviolet lasers of a pulsed form to form a scribe portion uniformly, can be eliminated substantially by matching the longitudinal direction of a linear beam or an oval beam with the scribe direction X.
  • More specifically, in the case of forming a scribe line in glass for a flat panel display with a thickness of 0.7 mm at pulse laser overlap times of 40, the energy density of a laser beam at portions for forming the scribe lines 14, 15 needs to be about 28 J/cm2. Thus, the scan speed with a linear beam (rectangular beam) of 20 μm×40 μm becomes twice that of a square beam of 20 μm×20 μm at the same energy density.
  • Thus, the laser beams 2, 3 of an ultraviolet laser incident from one side (upper side in the figure) with respect to two glass plates of laminated glass are condensed at respective target portions, using the transmittance characteristics of an ultraviolet laser with respect to glass, whereby scribing can be performed simultaneously and efficiently. Needless to say, the step of reversing the laminated glass for scribing the laminated glass is not necessary.
  • In particular, a slight time delay is set between irradiations with the two laser beams 2, 3, and under this condition, an ultraviolet laser is irradiated to the overlapping position of the first glass member 5 a and the second glass member 5 b of the substrate 5 composed of laminated glass, whereby a scribe line can be formed substantially simultaneously and at a high speed. It is desirable that the energy profile of the laser beams 2, 3 is a flat linear beam. The laser beams 2, 3 of this type can be formed through splitting and overlapping of laser beams, shaping of a laser beam with a rectangular kaleidoscope, or shaping of a kinoform phase control plate.
  • The substrate 5 that is laminated glass in which the scribe lines 14, 15 are thus formed is cut along the scribe lines 14, 15 in the step of breaking. As breaking means in the step of breaking, conventionally known means can be adopted, and any one of a mechanical shock, cooling with a refrigerant in a liquid or gaseous form, and irradiation with an infrared laser can be used. By applying a break force by the breaking means to the substrate 5 in which the scribe lines 14, 15 are formed from front and rear surfaces, and cutting the first and second glass members 5 a, 5 b simultaneously, the substrate 5 can be divided into a plurality of pieces along the scribe lines 14, 15. Thus, a time required for cutting glass is shortened remarkably.
  • In FIG. 1, the respective laser beams 2, 3 are condensed on one side (upper surface portion in the figure) of the respective glass members 5 a, 5 b. However, the following can also be performed. By adjusting the focal positions of the condensing lenses 12, 13, the respective laser beams 2, 3 are condensed on the other side (lower surface portion in the figure) of the respective glass members 5 a, 5 b to form scribe lines (14, 15), and a break force is applied to the portions of the scribe lines (14, 15), whereby the substrate 5 is cut.
  • INDUSTRIAL APPLICABILITY
  • The present invention is also applicable to laminated glass of two or more layers, instead of two-layered laminated glass.

Claims (4)

1. A method of cutting glass in which a first glass member (5 a) and a second glass member (5 b) are laminated to each other via a spacer (5 c), and a portion in which a light transmissive material is filled in between the two glass members (5 a, 5 b) is cut, the method comprising:
irradiating a first laser beam (2) and a second laser beam (3) composed of an ultraviolet laser from a side of the second glass member (5 b), allowing the first laser beam (2) to pass through the second glass member (5 b) to condense the first laser beam (2) on the first glass member (5 a) to form a first scribe line (14), condensing the second laser beam (3) on the second glass member (5 b) to form a second scribe line (15); and
applying a break force to the first scribe line (14) and the second scribe line (15) to cut the glass.
2. A method of cutting glass according to claim 1, wherein the first scribe line (14) is formed first, and then, the second scribe line (15) is formed on an upper side of the first scribe line (14).
3. A method of cutting glass according to claim 1, wherein the first laser beam (2) and the second laser beam (3) are one of a linear beam and an oval beam.
4. A method of cutting glass according to claim 2, wherein the first laser beam (2) and the second laser beam (3) are one of a linear beam and an oval beam.
US10/551,760 2003-10-31 2004-10-25 Method of cutting laminated glass with laser beams Expired - Fee Related US7423237B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003-372155 2003-10-31
JP2003372155A JP4175636B2 (en) 2003-10-31 2003-10-31 Glass cutting method
PCT/JP2004/015779 WO2005042421A1 (en) 2003-10-31 2004-10-25 Glass cutting method

Publications (2)

Publication Number Publication Date
US20060201983A1 true US20060201983A1 (en) 2006-09-14
US7423237B2 US7423237B2 (en) 2008-09-09

Family

ID=34543993

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/551,760 Expired - Fee Related US7423237B2 (en) 2003-10-31 2004-10-25 Method of cutting laminated glass with laser beams

Country Status (5)

Country Link
US (1) US7423237B2 (en)
JP (1) JP4175636B2 (en)
KR (1) KR100699729B1 (en)
DE (1) DE112004000581B4 (en)
WO (1) WO2005042421A1 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080070378A1 (en) * 2006-09-19 2008-03-20 Jong-Souk Yeo Dual laser separation of bonded wafers
US20080290077A1 (en) * 2007-05-22 2008-11-27 Demeritt Jeffery Alan Separation of transparent glasses and systems and methods therefor
CN101844275A (en) * 2009-03-25 2010-09-29 三星移动显示器株式会社 Method for dividing substrate
US20130068736A1 (en) * 2011-09-21 2013-03-21 Michael Mielke Systems and processes that singulate materials
US20130280465A1 (en) * 2012-04-05 2013-10-24 Nippon Electric Glass Co., Ltd. Glass film cleaving method and glass film laminate
US20140102146A1 (en) * 2011-06-15 2014-04-17 Asahi Glass Company, Limited Method for cutting glass plate
US9114482B2 (en) 2010-09-16 2015-08-25 Raydiance, Inc. Laser based processing of layered materials
US9130344B2 (en) 2006-01-23 2015-09-08 Raydiance, Inc. Automated laser tuning
US9281653B2 (en) 2006-04-26 2016-03-08 Coherent, Inc. Intelligent laser interlock system
US9334188B2 (en) 2012-07-10 2016-05-10 Asahi Glass Company, Limited Method for processing glass plate
US9919380B2 (en) 2013-02-23 2018-03-20 Coherent, Inc. Shaping of brittle materials with controlled surface and bulk properties
US10828727B2 (en) 2010-11-29 2020-11-10 Yury Georgievich Shreter Method of separating surface layer of semiconductor crystal using a laser beam perpendicular to the separating plane
CN115500079A (en) * 2021-04-02 2022-12-20 法国圣戈班玻璃厂 Method for cutting laminated glazing with laser source

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100636852B1 (en) * 2005-03-22 2006-10-19 (주)한빛레이저 Scribing method and cutting method for glass using mode-locked uv-laser
JP2007021528A (en) * 2005-07-15 2007-02-01 Matsushita Electric Ind Co Ltd Laser beam machining apparatus, and method for controlling the same
JP2007261885A (en) * 2006-03-29 2007-10-11 Lemi Ltd Cleaving method of piled glass
US8624157B2 (en) 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
JP4835927B2 (en) * 2006-06-28 2011-12-14 アイシン精機株式会社 Method of splitting hard and brittle plate
JP2009086092A (en) * 2007-09-28 2009-04-23 Aji Kk Method of manufacturing optical component and method of manufacturing photographing device
JP5345334B2 (en) * 2008-04-08 2013-11-20 株式会社レミ Thermal stress cleaving method for brittle materials
JP2010095414A (en) * 2008-10-17 2010-04-30 Linkstar Japan Co Ltd Method for cutting mother glass substrate for display and brittle material substrate, and method for manufacturing display
WO2010044217A1 (en) * 2008-10-17 2010-04-22 株式会社リンクスタージャパン Method for cutting mother glass substrate for display and brittle material substrate and method for manufacturing display
JP5217930B2 (en) * 2008-11-13 2013-06-19 株式会社ブイ・テクノロジー Laser processing method and laser processing apparatus
KR20100107253A (en) * 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 Substrate cutting appartus and method for cutting substrate using the same
KR101041137B1 (en) * 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 Substrate cutting appartus and method for cutting substrate using the same
JP5268749B2 (en) * 2009-04-01 2013-08-21 株式会社日立ハイテクノロジーズ Substrate condition inspection method, laser processing apparatus, and solar panel manufacturing method
JP2010285286A (en) 2009-06-09 2010-12-24 Mitsuboshi Diamond Industrial Co Ltd Method for dividing laminated substrate and laminated substrate
JP5383365B2 (en) * 2009-07-27 2014-01-08 株式会社日立ハイテクノロジーズ Laser processing method, laser processing apparatus, and solar panel manufacturing method
CN102910809B (en) * 2012-10-24 2015-04-15 深圳市华星光电技术有限公司 Base plate and cutting method thereof
TWI574767B (en) * 2014-07-29 2017-03-21 Improved laser structure
KR20170083565A (en) 2014-11-10 2017-07-18 코닝 인코포레이티드 Laser processing of transparent article using multiple foci
US10793462B2 (en) 2015-07-07 2020-10-06 Corning Incorporated Apparatuses and methods for heating moving glass ribbons at separation lines and/or for separating glass sheets from glass ribbons
CN105750736A (en) * 2016-04-28 2016-07-13 深圳市大德激光技术有限公司 Laser cutting method for double-layer glass
US10752534B2 (en) * 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
KR102174928B1 (en) * 2019-02-01 2020-11-05 레이저쎌 주식회사 Multi-beam laser de-bonding equipment and method thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3410979A (en) * 1964-05-28 1968-11-12 Burroughs Corp Method and apparatus for drilling holes by means of a focused laser beam
US20020125232A1 (en) * 1998-08-26 2002-09-12 Choo Dae-Ho Laser cutting apparatus and method
US20020170896A1 (en) * 2001-05-21 2002-11-21 Samsung Electronics Co., Ltd. Method and apparatus for cutting a non-metallic substrate using a laser beam
US20030006221A1 (en) * 2001-07-06 2003-01-09 Minghui Hong Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
US6512196B1 (en) * 1999-09-21 2003-01-28 Lg. Philips Lcd Co., Ltd. Laser cutting device and method for cutting glass substrate by using the same
US20030052098A1 (en) * 2001-05-23 2003-03-20 Gi-Heon Kim Method and apparatus for cutting substrate using coolant
US6576870B2 (en) * 2000-11-13 2003-06-10 Hannstar Display Corp. Apparatus with double laser beams for cutting two bonded glass substrates and method thereof
US20030146197A1 (en) * 2002-02-02 2003-08-07 Baek-Kyun Jeon Method and apparatus for cutting nonmetallic substrate

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3036906B2 (en) * 1991-07-30 2000-04-24 ホーヤ株式会社 Glass processing method and apparatus
DE4230811C2 (en) * 1992-09-15 1994-09-29 Lothar Laser Kg Glass cutting device
DE19846368C1 (en) * 1998-10-08 2000-04-13 Univ Stuttgart Strahlwerkzeuge Apparatus for cutting, welding, boring or removing a workpiece has a diffractive element made up of different segments to form focal points
TWI226877B (en) 2001-07-12 2005-01-21 Mitsuboshi Diamond Ind Co Ltd Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates
CN1264768C (en) 2001-07-18 2006-07-19 三星钻石工业股份有限公司 Device and method for scribing fragile material substrate
TW568809B (en) 2001-09-21 2004-01-01 Mitsuboshi Diamond Ind Co Ltd Method for scribing substrate of brittle material and scriber
ES2356817T3 (en) 2002-03-12 2011-04-13 Hamamatsu Photonics K.K. CUTTING METHOD OF A PROCESSED OBJECT.

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3410979A (en) * 1964-05-28 1968-11-12 Burroughs Corp Method and apparatus for drilling holes by means of a focused laser beam
US20020125232A1 (en) * 1998-08-26 2002-09-12 Choo Dae-Ho Laser cutting apparatus and method
US6512196B1 (en) * 1999-09-21 2003-01-28 Lg. Philips Lcd Co., Ltd. Laser cutting device and method for cutting glass substrate by using the same
US6576870B2 (en) * 2000-11-13 2003-06-10 Hannstar Display Corp. Apparatus with double laser beams for cutting two bonded glass substrates and method thereof
US20020170896A1 (en) * 2001-05-21 2002-11-21 Samsung Electronics Co., Ltd. Method and apparatus for cutting a non-metallic substrate using a laser beam
US20030052098A1 (en) * 2001-05-23 2003-03-20 Gi-Heon Kim Method and apparatus for cutting substrate using coolant
US20030006221A1 (en) * 2001-07-06 2003-01-09 Minghui Hong Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
US20030146197A1 (en) * 2002-02-02 2003-08-07 Baek-Kyun Jeon Method and apparatus for cutting nonmetallic substrate

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9130344B2 (en) 2006-01-23 2015-09-08 Raydiance, Inc. Automated laser tuning
US9281653B2 (en) 2006-04-26 2016-03-08 Coherent, Inc. Intelligent laser interlock system
US20080070378A1 (en) * 2006-09-19 2008-03-20 Jong-Souk Yeo Dual laser separation of bonded wafers
US20080290077A1 (en) * 2007-05-22 2008-11-27 Demeritt Jeffery Alan Separation of transparent glasses and systems and methods therefor
CN101844275A (en) * 2009-03-25 2010-09-29 三星移动显示器株式会社 Method for dividing substrate
US20100243623A1 (en) * 2009-03-25 2010-09-30 Samsung Mobile Display Co., Ltd. Method of cutting substrate
US8444906B2 (en) 2009-03-25 2013-05-21 Samsung Display Co., Ltd. Method of cutting substrate
TWI413565B (en) * 2009-03-25 2013-11-01 Samsung Display Co Ltd Method of cutting substrate
US9120181B2 (en) 2010-09-16 2015-09-01 Coherent, Inc. Singulation of layered materials using selectively variable laser output
US9114482B2 (en) 2010-09-16 2015-08-25 Raydiance, Inc. Laser based processing of layered materials
US10828727B2 (en) 2010-11-29 2020-11-10 Yury Georgievich Shreter Method of separating surface layer of semiconductor crystal using a laser beam perpendicular to the separating plane
US11103960B2 (en) 2010-11-29 2021-08-31 Yury Georgievich Shreter Method of separating surface layer of semiconductor crystal using a laser beam perpendicular to the separating plane
US20140102146A1 (en) * 2011-06-15 2014-04-17 Asahi Glass Company, Limited Method for cutting glass plate
US20130068736A1 (en) * 2011-09-21 2013-03-21 Michael Mielke Systems and processes that singulate materials
US10239160B2 (en) * 2011-09-21 2019-03-26 Coherent, Inc. Systems and processes that singulate materials
US20130280465A1 (en) * 2012-04-05 2013-10-24 Nippon Electric Glass Co., Ltd. Glass film cleaving method and glass film laminate
US9212080B2 (en) * 2012-04-05 2015-12-15 Nippon Electric Glass Co., Ltd. Glass film cleaving method and glass film laminate
US9334188B2 (en) 2012-07-10 2016-05-10 Asahi Glass Company, Limited Method for processing glass plate
DE112013003503B4 (en) * 2012-07-10 2020-02-13 AGC Inc. Process for processing a glass plate
US9919380B2 (en) 2013-02-23 2018-03-20 Coherent, Inc. Shaping of brittle materials with controlled surface and bulk properties
CN115500079A (en) * 2021-04-02 2022-12-20 法国圣戈班玻璃厂 Method for cutting laminated glazing with laser source

Also Published As

Publication number Publication date
KR20060030017A (en) 2006-04-07
DE112004000581T5 (en) 2006-02-23
JP2005132694A (en) 2005-05-26
JP4175636B2 (en) 2008-11-05
US7423237B2 (en) 2008-09-09
KR100699729B1 (en) 2007-03-28
DE112004000581B4 (en) 2007-10-18
WO2005042421A1 (en) 2005-05-12

Similar Documents

Publication Publication Date Title
US7423237B2 (en) Method of cutting laminated glass with laser beams
US11345625B2 (en) Method and device for the laser-based machining of sheet-like substrates
US10010971B1 (en) Method and apparatus for performing laser curved filamentation within transparent materials
EP3363771B1 (en) Method of machining and releasing closed forms from a transparent substrate using burst of ultrafast laser pulses
US10144088B2 (en) Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
US8943855B2 (en) Methods for laser cutting articles from ion exchanged glass substrates
CN103079747B (en) The method being carried out material process by laser filament effect
US20070090100A1 (en) Glass cutting method and apparatus therefor
JP2020500808A (en) Glass plate moving device for cutting glass-like glass substrates based on laser
JP2006035710A (en) Glass processing method using laser and device
KR20150077276A (en) Apparatus for chamfering glass substrate and laser processing apparatus
WO2012063348A1 (en) Laser processing method and device
JP2010138046A (en) Method and device for working material to be cut
CN107520541B (en) Method for laser cutting brittle material
KR102472644B1 (en) Method and apparatus of dividing brittleness material substrate
JP6944703B2 (en) Method for forming a modified layer of a brittle material substrate
JP6787617B2 (en) Method and device for dividing tubular brittle members
TW202128581A (en) Processing method and processing device of substrate

Legal Events

Date Code Title Description
AS Assignment

Owner name: JAPAN STEEL WORKS, LTD., THE, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KUSAMA, HIDEAKI;INAMI, TOSHIO;KOBAYASHI, NAOYUKI;REEL/FRAME:017860/0331;SIGNING DATES FROM 20050721 TO 20050722

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20120909