US20050217828A1 - Pump, cooler, and electronic device - Google Patents

Pump, cooler, and electronic device Download PDF

Info

Publication number
US20050217828A1
US20050217828A1 US11/083,633 US8363305A US2005217828A1 US 20050217828 A1 US20050217828 A1 US 20050217828A1 US 8363305 A US8363305 A US 8363305A US 2005217828 A1 US2005217828 A1 US 2005217828A1
Authority
US
United States
Prior art keywords
pump
housing
mounting portions
center
rotary unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/083,633
Other languages
English (en)
Inventor
Kentaro Tomioka
Yukihiko Hata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HATA, YUKIHIKO, TOMIOKA, KENTARO
Publication of US20050217828A1 publication Critical patent/US20050217828A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • the embodiments of the invention generally relate to liquid cooling systems and more particularly to a pump in a liquid cooling system to cool heat generating units, such as a central processing unit (CPU), using a liquid coolant.
  • a pump in a liquid cooling system to cool heat generating units, such as a central processing unit (CPU), using a liquid coolant.
  • CPU central processing unit
  • CPUs can generate a very large amount of heat during operation (i.e., operating heat), and may require cooling to maintain steady operation.
  • Heatsinks are used as a cooler to cool a CPU.
  • the heatsink may have an electric fan to blow cool air over the CPU, and a casing to accommodate the electric fan.
  • the casing has a heat receiving surface thermally coupled to a heat generating unit, and at least three mounting portions.
  • the heatsink is secured so that the heat receiving surface and the CPU are thermally coupled to each other.
  • One such heatsink is disclosed in Japan Pat. Appln. KOKAI Publication No. 2002-353670.
  • the contact-heat-exchange pump has a flat box-like pump casing with a heat receiving surface thermally coupled to a heat-generating electronic component; a ring-like impeller having a rotor magnet provided in an inner circumference; and a motor stator provided in an inner circumference side of the rotor magnet.
  • a contact-heat-exchange pump is disclosed in, for example, Japan Pat. No. 3452059.
  • FIG. 1 is a perspective view showing a portable computer according to an embodiment of the invention
  • FIG. 2 is a perspective view of the portable computer shown in FIG. 1 , as viewed from the side of exhaust openings of a first housing;
  • FIG. 3 is a plan view of a cooler housed in the first housing
  • FIG. 4 is an exploded perspective view of a pump
  • FIG. 5 is a cross-sectional view taken along line V-V of FIG. 3 .
  • a pump including a pump housing, a rotary unit, and a motor.
  • the pump housing has a heat receiving surface thermally coupled to a heat generating unit, a pump chamber, and three mounting portions.
  • the rotary unit is provided in the pump chamber.
  • the motor is coupled to the rotary unit to rotate it within the pump chamber to pump liquid coolant. At least one of the three mounting portions is located near a middle portion of a side of the pump housing.
  • a liquid cooling system including a heat dissipation portion; a circulation path coupled to the heat dissipation portion; and a pump coupled to the circulation path and a heat generating unit.
  • the pump is to transfer heat from the heat generating unit into a liquid coolant and to circulate the liquid coolant in the circulation path.
  • the pump includes a pump chamber accommodate a rotary unit to circulate coolant in the circulation path; a motor coupled to the rotary unit to rotate it; and three mounting portions at least one of which is located near a middle portion of a side of the pump.
  • an electronic device in another embodiment, is provided with a housing and a cooler mounted in the housing.
  • the housing has a heat generating unit and the cooler is used to cool the heat generating unit.
  • the cooler includes a heat dissipation portion, a circulation path thermally coupled to the heat dissipation portion, and a pump coupled to the circulation path and the heat generating unit.
  • the pump is used to circulate a coolant with the circulation path.
  • the pump includes three mounting portions to secure the pump to the housing of the electronic device.
  • Embodiments of the invention are described below with reference to FIGS. 1 to 5 .
  • FIGS. 1 and 2 show an electronic device such as a portable computer 1 .
  • the portable computer 1 has a computer main body 2 and a display unit 3 .
  • the computer main body 2 has a flat box-like first housing 10 .
  • the first housing 10 has a bottom wall 11 a , an upper wall 11 b , a front wall 11 c , left and right sidewalls 11 d and 11 e , and a rear wall 11 f.
  • the upper wall 11 b has a palm rest 12 and a keyboard mounting portion 13 .
  • the keyboard mounting portion 13 is provided in a portion of the upper wall which is behind the palm rest 12 .
  • a keyboard 14 is mounted in the keyboard mounting portion 13 .
  • the front wall 11 c , the left and right sidewalls 11 d and 11 e , and the rear wall 11 f form a peripheral wall along the periphery of the first housing 10 .
  • a plurality of exhaust openings 15 are formed in the peripheral wall of the first housing 10 , such as the rear wall 11 f .
  • the exhaust openings 15 are aligned in the width direction of the first housing 10 .
  • the display unit 3 has a flat box-like second housing 20 and a display panel 21 such as an LCD (liquid crystal display) panel a.
  • the LCD panel 21 is accommodated in the second housing 20 .
  • the LCD panel 21 has a screen 21 a that displays images.
  • the screen 21 a is exposed outwardly of the second housing 20 through an opening portion 22 formed on a front plane of the second housing 20 .
  • the second housing 20 is supported by a hinge (not shown) to a rear end portion of the first housing 10 .
  • the display unit 3 is pivotally movable between a closed position and an open position.
  • the closed position is a position in which the display unit 3 is folded from the upper portion such as to cover the palm rest 12 and the keyboard 14 .
  • the open position is a position where the display unit 3 stands upright exposing the palm rest 12 , the keyboard 14 , and the screen 21 a.
  • a printed circuit board 30 is accommodated in the first housing 10 . More specifically, as is shown in FIG. 5 , the printed circuit board 30 is disposed parallel with the bottom wall 11 a of the first housing 10 .
  • a central processing unit (CPU) 31 a heat generating unit, is mounted on an upper face of the printed circuit board 30 .
  • the CPU 31 constitutes a microprocessor, which serves as a central component of the portable computer 1 .
  • the CPU 31 has a base substrate 32 and a planarly square integrated circuit (IC) chip 33 disposed in a central portion of the upper face of the base substrate 32 .
  • IC integrated circuit
  • the portable computer 1 has a liquid-cooling type cooler or cooling system 40 for cooling the CPU 31 by using a liquid coolant such as antifreeze.
  • the cooler 40 is accommodated in the first housing 10 .
  • the cooler 40 may include components such as a pump 100 concurrently serving as a heat receiving portion and a heat exchanger; a heat dissipation portion 50 ; a circulation path 60 ; and an electric fan 70 .
  • the pump 100 lets a liquid coolant forcedly circulate and flow in the circulation path 60 .
  • the pump 100 may include a pump housing 101 concurrently serving as a heat receiving portion; a rotary unit 102 ; a motor 103 having a rotor 103 a and a stator 103 b ; and a control board 104 .
  • the pump housing 101 may include a housing body 110 , a heat receiving portion such as a heat receiving plate 111 , and a cover 112 .
  • the pump housing 101 may be shaped like a flat box to form a substantially plano-square that is larger than the CPU 31 .
  • the pump housing generally has four corner portions 101 a , 101 b , 10 c , and 101 d .
  • the corner portion 101 d may differ from the others as it may be squared or cut off as is illustrated in FIG. 3 .
  • the pump housing 101 is assumed to be formed such that the center of gravity thereof essentially matches a center O H of the pump housing 101 . Additionally, it is assumed that the center OH of the pump housing 101 is at an intersection between a perpendicular line extending through the center of a substantially square upper face of the pump housing 101 and a plane extending through a thickness-wise center of the pump housing 101 (see FIGS. 3 and 5 ).
  • the housing mainbody 110 has a recess portion 113 opening downward at a bottom or lower face.
  • the top or upper face of the housing mainbody 110 has a stator-accommodating recess portion 115 for accommodating the stator 103 b (see FIG. 5 ) and a control-board accommodation recess portion (not shown) to accommodate the control board 104 .
  • the heat receiving plate 111 is mounted from the lower portion to provide a liquid-tight seal over an opening end of the recess portion 113 of the housing body 110 .
  • An O-ring 123 may be provided between the housing body 110 and the heat receiving plate 111 .
  • the cover 112 is mounted from the upper portion to the housing body 110 to cover over the openings of the stator-accommodating recess portion 115 and the control-board accommodation recess portion (not shown).
  • the heat receiving plate 111 , the housing body 110 , and the cover 112 are secured together with a plurality of screws 106 .
  • the cover 112 covers the stator 103 b and the control board 104 , and concurrently, is used to restrain leakage, evaporation, and the like of the liquid coolant that is used in the pump housing 101 .
  • the cover 112 need not be provided if unnecessary.
  • the heat receiving plate 111 When mounting the pump, the heat receiving plate 111 opposes the CPU 31 .
  • a lower face of the heat receiving plate 111 may provide a flat heat receiving surface 120 .
  • the heat receiving plate 111 is preferably formed out of a high thermal conductivity material, such as copper, aluminum, or an aluminum alloy.
  • a ring-like partition wall 117 is provided that is integrally formed with the housing body 110 .
  • the interior of the pump housing 101 a region surrounded by the recess portion 113 of the housing body 110 and the upper face of the heat receiving plate 111 , is partitioned by the partition wall 117 into a pump chamber 118 and a reservoir tank 119 to contain liquid coolant.
  • the partition wall 117 In positions opposing the corner portion 101 d , the partition wall 117 has first and second communication openings (not shown) for communication between the pump chamber 118 and the reservoir tank 119 .
  • the pump chamber 118 is provided near the side of the corner portion 101 b .
  • the corner portion 101 b and the corner portion 101 d are point-symmetric with respect to the center O H of the pump housing 101 . More specifically, the substantially plano-circular pump chamber 118 is off-center with respect to the center O H of the pump housing 101 in a direction from the corner portion 101 d .
  • the reservoir tank 119 surrounds the pump chamber 118 from the corner portions 101 a , 10 c , and 101 d.
  • the housing body 110 may also have a discharge pipe 131 as a first communication portion and a suction pipe 132 as a second communication portion.
  • the discharge pipe 131 is used for intercommunication between the interior of the pump housing 101 and the exterior of the pump housing 101 .
  • the suction pipe 132 is used for intercommunication between the interior of the pump housing 101 and the exterior of the pump housing 101 .
  • the discharge pipe 131 and the suction pipe 132 are horizontally disposed spaced apart from each other. A downstream end of the discharge pipe 131 and an upstream end of the suction pipe 132 protrude outwardly through the housing body 110 .
  • a first communication piping 133 a is provided between an upstream end of the discharge pipe 131 and a first communication opening of the partition wall 117 .
  • a second communication piping 133 b is provided between a downstream end of the suction pipe 132 and a second communication opening of the partition wall 117 .
  • the first communication piping 133 a and the second communication piping 133 b may be integrated into one unit and thereby constitute a communication piping unit 133 .
  • the upstream end of the discharge pipe 131 communicates with the pump chamber 118 through the first communication piping 133 a and the first communication opening.
  • the downstream end of the suction pipe 132 communicates with the pump chamber 118 through the second communication piping 133 b and the second communication opening.
  • a gas-liquid separation opening 134 may be provided to the second communication piping 133 b such as illustrated in FIGS. 3-4 . In this case, when the position of the pump housing 101 changes to any direction, the gas-liquid separation opening 134 is positioned so that it is maintained under a liquid level of liquid coolant stored in the reservoir tank 119 .
  • the rotary unit 102 agitates the liquid coolant in the pump chamber 118 to transfer the liquid coolant from the interior of the pump housing 101 to the exterior of the pump housing 101 by way of the circulation path 60 .
  • the rotary unit 102 acts as an impeller, for example, and may be referred to as such.
  • the rotary unit 102 is accommodated in the pump chamber 118 .
  • the rotary unit 102 may be formed out of a resin product, and has a discoidal mainbody portion 102 b and a rotation axis 102 a .
  • the rotation axis 102 a is formed integrally with the mainbody portion 102 b to pass through a center O I of the mainbody portion 102 b .
  • the mainbody portion 102 b has a plurality of blades on a face that opposes the heat receiving plate 111 .
  • the rotation axis 102 a is disposed to be positioned between an upper wall of the housing body 110 and the heat receiving plate 111 in such a manner as to extend thereacross, whereby the rotary unit 102 is rotatably supported by the upper wall of the housing body 110 and the heat receiving plate 111 .
  • the motor 103 is coupled to and rotatably drives the rotary unit 102 .
  • the motor 103 includes a rotor 103 a that has a magnet magnetized through multiple positive polarities and multiple negative polarities and has a ring-like shape.
  • the rotor 103 a is accommodated in the pump chamber 118 to rotate while being secured coaxially to an upper face of the rotary unit 102 .
  • the pump chamber 118 is off-centered with respect to the center O H of the pump housing 101 .
  • the rotary unit 102 to be disposed in the pump chamber 118 is also off-centered with respect to the center O H of the pump housing 101 .
  • the center O I of the mainbody portion 102 b of the rotary unit 102 is offset from the center O H Of the pump housing 101 .
  • a perpendicular line L 1 (matching the axis line of the rotation axis 102 a ) extending through the center O I of the mainbody portion 102 b of the rotary unit 102 is offset with respect to a perpendicular line L 2 extending through the center OH of the pump housing 101 (see FIG. 5 ).
  • the motor 103 further includes a stator 103 b which is accommodated in the stator-accommodating recess portion 115 .
  • the motor 103 may oppose the rotor 103 a through the upper wall of the housing body 110 .
  • the stator-accommodating recess portion 115 is provided in a position to correspond to the rotor 103 a . That is, the stator-accommodating recess portion 115 is provided near the corner portion 101 b in one embodiment of the invention.
  • the control-board accommodation recess portion may be provided in a position to avoid the stator-accommodating recess portion 115 .
  • stator-accommodating recess portion 115 is formed within the confines of the rotor 103 a . More specifically, the stator 103 b is coaxially accommodated inside the rotor 103 a through the upper wall of the housing body 110 . The stator 103 b is electrically connected to the control board 104 .
  • Energization of the stator 103 b may be performed periodically, such as at the time of power-on of the portable computer 1 , for example.
  • a rotation magnetic field occurs in the circumferential direction of the stator 103 b to which the rotor 103 a is magnetically coupled.
  • a rotating torque along the circumferential direction of the rotary unit 102 is generated between the stator 103 b and the rotor 103 a , whereby the rotary unit 102 is rotated.
  • the pump housing 101 has three mounting portions 151 , 152 , and 153 that are used to mount the pump 100 to the first housing 10 .
  • the three mounting portions 151 - 153 are provided around the pump chamber 118 , and, more specifically, on the periphery of the pump housing 101 .
  • the individual positions of the three mounting portions 151 - 153 are preferably set so that the center of gravity of the pump housing 101 is included in a triangular region (the triangular region shown in FIG. 3 by a two-dotted chain line connecting the three mounting portions 151 - 153 ) formed by the three mounting portions 151 - 153 . Further, to stably mount the pump 100 to the first housing 10 at the three mounting portions 151 - 153 , the individual positions of the three mounting portions 151 - 153 are set so that the center of the rotary unit 102 is included in this triangular region.
  • the individual positions of the three mounting portions 151 to 153 are set so that the center O H of the pump housing 101 (which essentially matches the center of gravity of the pump housing 101 , as described above) and the center O I of the mainbody portion 102 b of the rotary unit 102 are also included in this triangular region.
  • the rotary unit 102 may be provided nearer corner portion 101 b with respect to the center O H of the pump housing 101 . That is, the rotary unit 102 may be provided in the pump chamber 118 off-center in the direction of side 121 a . As such, the degree of spatial freedom in the pump housing 101 is greater in a region closer to side 121 c than a region closer to side 121 a.
  • the three mounting portions 151 , 152 and 153 may be disposed as described below and illustrated in FIG. 3 .
  • the two mounting portions 151 and 152 are positioned at end portions of the side 121 a in the respective corner portions 101 a and 101 b .
  • Side 121 a is opposite to side 121 c with respect to the substantially plano-square heat receiving surface 120 .
  • the mounting portion 153 is positioned corresponding to a middle portion of side 121 c that is opposite side 121 a.
  • cutout portions 110 a and 112 a are formed respectively in a portion of the housing body 110 and the cover 112 corresponding to the corner portion 101 a to form the mounting portion 151 provided in the corner portion 101 a . Additionally, an opening portion 111 a is formed in the heat receiving plate 111 corresponding to the corner portion 101 a to further form the mounting portion 151 .
  • cutout portions 110 b and 112 b are formed respectively in a portion of the housing body 110 and the cover 112 corresponding to the corner portion 101 b to form the mounting portion 152 provided in the corner portion 101 b .
  • an opening portion 111 b is formed in the heat receiving plate 111 corresponding to the corner portion 101 b to further form the mounting portion 152 provided in the corner portion 101 b.
  • Cutout portions 110 c and 112 c are formed respectively in middle portions of the housing body 110 and the cover 112 corresponding to a middle portion of the side 121 c to form the mounting portion 153 provided in the position corresponding to the middle portion of side 121 c .
  • an opening portion 111 c is formed in the heat receiving plate 111 corresponding to the middle portion of side 121 c to further form the mounting portion 153 provided in the position corresponding to the middle portion of the side 121 c .
  • the O-ring 123 if provided, jogs around and avoids the position of the mounting portion 153 as illustrated in FIG. 4 .
  • the pump 100 thus configured is disposed on the printed circuit board 30 in such a manner so as to cover over the CPU 31 with the center O H of the pump housing 101 being matched with a center O C of the CPU 31 (which may also be the center of the IC chip 33 ). That is, the center O H of the pump housing 101 is matched with the center O C of the CPU to be concentric so that that a perpendicular line L 2 extending through the center O H of the pump housing 101 also extends through the center O C of the CPU.
  • the pump housing 101 of the pump 100 is secured together with the printed circuit board 30 to the bottom wall 11 a of the first housing 10 .
  • the bottom wall 11 a has boss portions 17 in positions corresponding to the mounting portions 151 - 153 .
  • the boss portions 17 project upwardly from the bottom wall 11 a .
  • the printed circuit board 30 may be overlaid on edge faces of these boss portions 17 .
  • a reinforcing plate 34 may be provided under the printed circuit board 30 adjacent to a lower face thereof to provide reinforcement.
  • the mounting mechanism for mounting the pump 100 to the first housing 10 includes three cylindrical inserts 143 , three coil springs 144 , three C-rings 145 , and three screws 146 , for example, in addition to the mounting portions 151 - 153 .
  • the inserts 143 may each have a projection portion 143 a at an upper end projecting circumferentially outward in a horizontal direction. Additionally, each cylindrical insert 143 may have a groove portion 143 b formed on an outer circumferential surface of the insert in a circumferential direction.
  • the pump 100 is compressed against the CPU 31 and secured in that state, in the following manner. While only components of a mounting structure in the mounting portion 152 is shown in FIG. 5 and described below, it is to be understood that similar components may be used to form similar mounting structures located at the mounting portions 151 and 153 .
  • the cylindrical insert 143 is inserted into the center of a coil spring 144 .
  • the cylindrical insert 143 with the coil spring 144 are inserted into each of the opening portions 111 a , 111 b , and 111 c of the heat receiving plate 111 so that the groove portion 143 b in each insert 143 is positioned below the heat receiving surface 120 of the pump 100 .
  • a fall-out prevention C-ring 145 is fitted into the groove portion 143 b of each insert 143 .
  • the cylindrical insert 143 is mounted to a position corresponding to each of the mounting portions 151 - 153 of the pump 100 in a spring loaded state so that the coil spring 144 applies a force between the projection portion 143 a and the heat receiving plate 111 .
  • a conductive grease (not shown) is applied on any one of an upper face of the IC chip 33 and a region corresponding to the IC chip 33 of the heat receiving surface 120 .
  • the pump is aligned and positioned so that the heat receiving surface 120 of the pump housing 101 is opposite the IC chip 33 .
  • Screws 146 are inserted into each cylindrical insert 143 and screwed into the boss portion 17 formed on the bottom wall 11 a . Thereby, the respective cylindrical inserts 143 are secured to the boss portions 17 , and the pump 100 is forced against the IC chip 33 by resilience of the coil springs 144 . In this manner, the IC chip 33 is thermally coupled to the heat receiving surface 120 of the pump housing 101 through the conductive grease.
  • the heat dissipation portion 50 has a heat-dissipation-portion mainbody 51 and multiple dissipation fins 57 thermally coupled with the heat-dissipation-portion main body 51 .
  • the heat-dissipation-portion main body 51 is configured of substantially U-shaped piping through which the liquid coolant flows. More specifically, the heat-dissipation-portion main body 51 is configured with a coolant inlet opening 54 and a coolant outlet opening (provided on an opposite side of the coolant inlet opening 54 as viewed in FIG. 3 , although it is not visibly shown) to allow the coolant to flow inside.
  • the piping (heat-dissipation-portion main body 51 ) of the heat dissipation portion 50 may be consider to be a part of the circulation path 60 (which will be described below in more detail).
  • the heat-dissipation-portion mainbody 51 is accommodated in the first housing 10 in such a manner that the substantially U-shaped piping is 90-degree rotated (horizontally inclined or positioned) with the coolant inlet opening 54 being on top and the coolant outlet opening being on the bottom.
  • the dissipation fins 57 may be formed of a metal material, such as an aluminum alloy or copper material, which has good thermal conductivity.
  • the dissipation fins 57 may be formed to have a rectangular plate shape.
  • the individual dissipation fins 57 are disposed parallel to one another with a spacing being maintained from one another.
  • the individual dissipation fins 57 may be soldered to the heat-dissipation-portion main body 51 .
  • the heat dissipation portion 50 is accommodated in the first housing 10 , where the dissipation fins 57 are positioned opposite the exhaust openings 15 of the first housing 10 .
  • a pair of brackets 58 may be soldered to the heat dissipation portion 50 .
  • the brackets 58 may each be secured with a screw to a boss portion (not shown) projecting from the bottom wall 11 a of the first housing 10 . Thereby, the heat dissipation portion 50 can be secured to the bottom wall 11 a of the first housing 10 .
  • the circulation path 60 has first piping 61 , second piping 62 , and the piping of the heat-dissipation-portion main body 51 in the heat dissipation portion 50 . That is, the heat-dissipation-portion main body 51 serves concurrently as being the heat dissipation portion 50 and the circulation path 60 .
  • the first piping 61 connects between the discharge pipe 131 of the pump 100 and the coolant inlet opening 54 of the heat dissipation portion 50 .
  • the second piping 62 connects between the suction pipe 132 of the pump 100 and the coolant outlet opening of the heat dissipation portion 50 . Thereby, the liquid coolant passes through the first and second piping 61 and 62 to circulate between the pump 100 and the heat dissipation portion 50 .
  • the electric fan 70 blows cooling air onto and through the heat dissipation portion 50 , and is disposed anterior to the heat dissipation portion 50 .
  • the electric fan 70 has a fan casing 71 and a centrifugal impeller 72 accommodated in the fan casing 71 .
  • the fan casing 71 has an outlet opening 71 a which discharges cooling air.
  • the outlet opening 71 a is connected to the heat dissipation portion 50 through a duct 73 .
  • the impeller 72 is driven by a motor (not shown).
  • the impeller 72 may be driven at power-on of the portable computer 1 or when the temperature has reached a predetermined level, for example. Cooling air is supplied from the outlet opening 71 a of the fan casing 71 to the heat dissipation portion 50 .
  • the IC chip 33 of the CPU 31 generates heat during use of the portable computer 1 .
  • the heat generated by the IC chip 33 transfers to the pump housing 101 through the heat receiving surface 120 of the pump 100 .
  • the recess portion 113 (the pump chamber 118 and the reservoir tank 119 ) of the pump housing 101 is filled with the liquid coolant, so that the liquid coolant absorbs much of the heat transferred to the pump housing 101 .
  • Energization to the stator 103 b of the motor 103 may periodically occur such as in synchronous with the power-on of the portable computer 1 . Thereby, a rotating torque occurs between the stator 103 b and the rotor 103 a , whereby the rotor 103 a is rotated with the rotary unit 102 .
  • the liquid coolant in the pump chamber 118 is pressurized thereby to be discharged from the discharge pipe 131 , and concurrently, is led into the heat dissipation portion 50 from the coolant inlet opening 54 through the first piping 61 .
  • the liquid coolant from the coolant inlet opening 54 is heated by heat exchange in the pump housing 101 and flows out through the coolant outlet opening to the heat dissipation portion 50 , where the heat of the IC chip 33 absorbed by the liquid coolant is transferred to the dissipation fins 57 .
  • cooling air flows to the heat dissipation portion 50 from the outlet opening 71 a of the fan casing 71 .
  • the cooling air passes through between the dissipation fins 57 being adjacent to one another.
  • components such as the dissipation fins 57 and the heat-dissipation-portion main body 51 are cooled.
  • much of the heat having transferred to the dissipation fins 57 , the heat-dissipation-portion main body 51 , and the like is transferred to and carried on the cooling air flow, and dissipated outside of the first housing 10 through the exhaust opening 15 .
  • the liquid coolant cooled in the heat dissipation portion 50 is guided into the suction pipe 132 of the pump housing 101 through the second piping 62 .
  • the liquid coolant is returned from the suction pipe 132 to the reservoir tank 119 .
  • the liquid coolant thus returned to the reservoir tank 119 again absorbs heat from the IC chip 33 while liquid coolant is sucked into the pump chamber 18 .
  • heat of the IC chip 33 is progressively transferred to the heat dissipation portion 50 , transferred to and carried on the cooling air flow passing through the heat dissipation portion 50 , and then dissipated to outside of the first housing 10 .
  • the pump 100 has the pump housing 101 with three mounting portions 151 - 153 . As such, the number of the mounting portions in the pump 100 is less than that in a conventional pump, so that the pump 100 can be easily mounted.
  • the individual positions of the three mounting portions 151 - 153 may be set at corners of a triangular region that includes the center O I of the rotary unit 102 .
  • the pump housing 101 secured at the mounting portions 151 - 153 , vibrations resulting from the rotation of the rotary unit 102 can be optimally received. Consequently, even with only three mounting portions, the pump 100 can be secured in a stable state so that the pump 100 can be mounted to the portable computer 1 or the like without impairing pump performance.
  • the individual positions of the three mounting portions 151 - 153 may be set at corners of a triangular region that includes the center O H of the pump housing 101 . As such, with the pump housing 101 secured at the mounting portions 151 - 153 , the pump housing 101 can be secured in a stable state. Consequently, the pump 100 can be mounted to the portable computer 1 or the like without impairing pump performance.
  • the center O of the rotary unit 102 is offset from the center O H of the pump housing 101 in the pump 100 .
  • the pump 100 can be secured to the printed circuit board 30 so that the center O H of the pump housing 101 substantially matches the center O C of the IC chip 33 .
  • the pump housing 101 can be secured in a stable state and a heat generating unit, such as the IC chip 33 , can be optimally cooled.
  • the center of the heat generating unit can be positioned offset from the center O I where the liquid coolant flows faster and opposed under the pump chamber with the pump housing 101 being interposed.
  • the pump 100 is employed and secured onto the printed circuit board 30 so that the center O H of the pump housing 101 substantially matches the center O C of the IC chip 33 .
  • the IC chip 33 can be set to oppose, with the pump housing 101 being interposed, the position where the liquid coolant flows fast.
  • the pump 100 can be secured in a stable position on the print circuit board 30 .
  • the center O I of the rotary unit 102 in the pump 100 is offset from the center O H of the pump housing 101 , the degree of spatial freedom in the region closer to the side 121 c is greater than the region closer to the side 121 a .
  • the two mounting portions 151 and 152 are provided at end portions of side 121 a of the heat receiving surface 120 .
  • the third mounting portion 153 is provided at the middle portion of side 121 c .
  • the mounting portions 151 - 153 of the pump 100 are disposed to use the spacing effectively. Consequently, the pump 100 can be miniaturized while the performance required of the pump is secure.
  • a larger capacity of the reservoir tank 119 can be secured with the mounting portions 151 - 153 of the pump 100 being disposed to use the spacing effectively.
  • the center O I of the rotary unit 102 is offset from the center O H of the pump housing 101 , the degree of spatial freedom is relatively high in the vicinity of the ends of side 121 c .
  • the discharge pipe 131 and the suction pipe 132 which are used for communication between the interior of the pump housing 101 and the exterior of the pump housing 101 , may be provided at one end portion of side 121 c .
  • the pump 100 can have the discharge pipe 131 and the suction pipe 132 disposed to use space effectively. Consequently, while the performance required for pumps is secure, the pump 100 can be miniaturized.
  • the cooler 40 has a pump 100 with three mounting portions 151 - 153 . Consequently, in comparison with a conventional pump, assembling of pump 100 is easier, and hence the mounting time (assembly time) can be reduced.
  • the pump 100 is secured to the first housing 10 of the portable computer 1 at the three mounting portions 151 to 153 . Consequently, in comparison with a conventional pump, the pump mounting time can be reduced. Additionally, the CPU 31 typically has a very large number of pins (electrical connection portions), making wirings intricate. By mounting the pump 100 secured at the three portions, wirings can be more easily routed in comparison with a conventional pump. Further, the number of boss portions 17 can be reduced when using pump 100 and the three mounting portions in comparison with a conventional pump. Consequently, a higher density can be implemented in the first housing 10 .
  • the application of the pump is not limited to electronic devices, such as the portable computer, or the cooler mounted therein.
  • the pump can be broadly used in any one of various other devices.
  • the electronic device is not limited to a portable computer.
  • the electronic device may be applied to any one of other devices that has a heat generating unit and a cooler to cool the heat generating unit.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
US11/083,633 2004-04-02 2005-03-18 Pump, cooler, and electronic device Abandoned US20050217828A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-133534 2004-04-02
JP2004133534A JP2005315157A (ja) 2004-04-28 2004-04-28 ポンプ、冷却装置および電子機器

Publications (1)

Publication Number Publication Date
US20050217828A1 true US20050217828A1 (en) 2005-10-06

Family

ID=35052998

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/083,633 Abandoned US20050217828A1 (en) 2004-04-02 2005-03-18 Pump, cooler, and electronic device

Country Status (3)

Country Link
US (1) US20050217828A1 (enExample)
JP (1) JP2005315157A (enExample)
CN (1) CN1690439A (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080104992A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Miniature liquid cooling device having an integral pump
WO2008109805A3 (en) * 2007-03-07 2008-10-23 Asetek Usa Inc Hybrid liquid-air cooled graphics display adapter
US20100139891A1 (en) * 2008-12-04 2010-06-10 Fujitsu Limited Radiator and cooling unit
US20150382507A1 (en) * 2014-06-28 2015-12-31 Nidec Corporation Heat module
US20210204453A1 (en) * 2018-10-24 2021-07-01 Nidec Corporation Cooling device
CN116294301A (zh) * 2022-12-05 2023-06-23 大连理工大学 泵辅助毛细力驱动两相流体热管理系统
CN116498433A (zh) * 2023-06-29 2023-07-28 江苏普瑞亚动力科技有限公司 一种排气集水式氢氨能源发动机
US11864346B2 (en) * 2021-05-17 2024-01-02 Rouchon Industries, Inc. Pump-driven coolant filling device and methods
US20240114653A1 (en) * 2022-09-30 2024-04-04 United States Of America As Represented By The Secretary Of The Army Universal ruggedized computer system enclosure
US20250216914A1 (en) * 2022-09-30 2025-07-03 United States Of America As Represented By The Secretary Of The Army Universal ruggedized computer enclosure with forced air cooling

Citations (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5268817A (en) * 1990-04-27 1993-12-07 Kabushiki Kaisha Toshiba Portable computer with keyboard and having display with coordinate input tablet rotatably mounted to face either toward or away from keyboard when closed over keyboard
US5441102A (en) * 1994-01-26 1995-08-15 Sun Microsystems, Inc. Heat exchanger for electronic equipment
US5731952A (en) * 1995-04-28 1998-03-24 Kabushiki Kaisha Toshiba Portable electronic apparatus having the heat radiation device for circuit module
US6005767A (en) * 1997-11-14 1999-12-21 Vadem Portable computer having articulated display
US6141214A (en) * 1997-10-02 2000-10-31 Samsung Electronics Co., Ltd. Cooling apparatus for electronic systems and computer systems with such apparatus
US6166907A (en) * 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US6196850B1 (en) * 2000-02-10 2001-03-06 International Business Machines Corporation Rotatable docking station for an electronic device
US6231371B1 (en) * 1999-06-25 2001-05-15 Hewlett-Packard Company Docking station for multiple devices
US6282082B1 (en) * 1998-07-31 2001-08-28 Qubit, Llc Case for a modular tablet computer system
US6296048B1 (en) * 2000-09-08 2001-10-02 Powerwave Technologies, Inc. Heat sink assembly
US6313990B1 (en) * 2000-05-25 2001-11-06 Kioan Cheon Cooling apparatus for electronic devices
US6333847B1 (en) * 1998-02-04 2001-12-25 Fujitsu Limited Outside panel for an electronic device
US20020018337A1 (en) * 2000-06-29 2002-02-14 Hiroshi Nakamura Electronic apparatus having heat sink for cooling heat generating component
US6377452B1 (en) * 1998-12-18 2002-04-23 Furukawa Electric Co., Ltd. Heat pipe hinge structure for electronic device
US20020053421A1 (en) * 1997-09-10 2002-05-09 Kabushiki Kaisha Toshiba Heat dissipating structure for electronic apparatus
US6396687B1 (en) * 2000-10-13 2002-05-28 Dell Products, L.P. Rotating portable computer docking station
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
US6430038B1 (en) * 2000-04-18 2002-08-06 Hewlett-Packard Company Computer with articulated mechanism
US6437973B1 (en) * 2000-04-18 2002-08-20 Hewlett-Packard Company Modular mechanism for movable display
US20020141159A1 (en) * 2001-03-29 2002-10-03 Bloemen James Andrew Sealed and passively cooled telecommunications customer service terminal
US6464195B1 (en) * 1997-12-04 2002-10-15 Raymond Hildebrandt Ergonomic mounting for computer screen displays
US6477871B1 (en) * 1999-03-27 2002-11-12 International Business Machines Corporation Lid restraint for portable computer
US6483445B1 (en) * 1998-12-21 2002-11-19 Intel Corporation Electronic device with hidden keyboard
US6519147B2 (en) * 2000-12-19 2003-02-11 Hitachi, Ltd. Notebook computer having a liquid cooling device
US6519143B1 (en) * 1999-09-17 2003-02-11 Nec Corporation Docking station
US20030039097A1 (en) * 2001-08-22 2003-02-27 Takeshi Igarashi Method of cooling system for a personal computer and personal computer
US20030072656A1 (en) * 2001-09-25 2003-04-17 Kyo Niwatsukino Ultra-thin pump and cooling system including the pump
US6594149B2 (en) * 2001-09-18 2003-07-15 Hitachi, Ltd. Liquid cooled circuit device
US20030142474A1 (en) * 2002-01-28 2003-07-31 International Business Machines Corporation Personal computer device having constant tilt display with adjustable height
US6625024B2 (en) * 2001-07-06 2003-09-23 Alstom Power converter enclosure
US20030206367A1 (en) * 2000-06-16 2003-11-06 Hdvi Technology Llc Disk drive system with enclosed removable cartridge including voice coil/head/disk assembly
US6654234B2 (en) * 2001-07-24 2003-11-25 Hewlett-Packard Development Company, L.P. Multifunctional foldable computer
US6655449B1 (en) * 2002-11-08 2003-12-02 Cho-Chang Hsien Heat dissipation device by liquid cooling
US20040057197A1 (en) * 2002-09-24 2004-03-25 International Business Machines Corporation User friendly computer equipment, monitor unit, and monitor unit setting base
US6717798B2 (en) * 2001-03-22 2004-04-06 Intel Corporation Docking digital picture displays
US20040070942A1 (en) * 2002-08-30 2004-04-15 Kabushiki Kaisha Toshiba Electronic apparatus
US6728102B2 (en) * 2000-09-21 2004-04-27 Kabushiki Kaisha Toshiba Electronic apparatus including a cooling unit for cooling a heat generating component
US6755626B2 (en) * 2001-07-18 2004-06-29 Matsushita Electric Industrial Co., Ltd. Miniature pump, cooling system and portable equipment
US6774870B2 (en) * 1996-04-05 2004-08-10 Fakespace Labs, Inc. Gimbal-mounted virtual reality display system
US6809927B2 (en) * 2001-09-07 2004-10-26 Hitachi, Ltd. Liquid circulation cooling system for electronic apparatus
US6832646B1 (en) * 1999-02-26 2004-12-21 Nippon Thermostat Co., Ltd. Cooler for electronic device
US6839234B2 (en) * 2002-05-15 2005-01-04 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
US6845011B2 (en) * 2002-10-15 2005-01-18 Kabushiki Kaisha Toshiba Electronic apparatus having a circulation path of liquid coolant to cool a heat-generating component
US6856506B2 (en) * 2002-06-19 2005-02-15 Motion Computing Tablet computing device with three-dimensional docking support
US20050052833A1 (en) * 2003-09-04 2005-03-10 Toshiyuki Tanaka Interlocking mechanism for a display
US6873521B2 (en) * 2001-07-24 2005-03-29 Hewlett-Packard Development Company, L.P. Multiple environment foldable computer
US20050068732A1 (en) * 2003-09-30 2005-03-31 Hiroyuki Tsuji Electronic apparatus with air cooling unit
US20050164624A1 (en) * 2003-12-26 2005-07-28 Kenichi Hisamatsu Electronic apparatus
US7187545B2 (en) * 2002-05-22 2007-03-06 Siemens Aktiengesellschaft Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and support

Patent Citations (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5268817A (en) * 1990-04-27 1993-12-07 Kabushiki Kaisha Toshiba Portable computer with keyboard and having display with coordinate input tablet rotatably mounted to face either toward or away from keyboard when closed over keyboard
US5441102A (en) * 1994-01-26 1995-08-15 Sun Microsystems, Inc. Heat exchanger for electronic equipment
US5731952A (en) * 1995-04-28 1998-03-24 Kabushiki Kaisha Toshiba Portable electronic apparatus having the heat radiation device for circuit module
US6774870B2 (en) * 1996-04-05 2004-08-10 Fakespace Labs, Inc. Gimbal-mounted virtual reality display system
US20020053421A1 (en) * 1997-09-10 2002-05-09 Kabushiki Kaisha Toshiba Heat dissipating structure for electronic apparatus
US6141214A (en) * 1997-10-02 2000-10-31 Samsung Electronics Co., Ltd. Cooling apparatus for electronic systems and computer systems with such apparatus
US6005767A (en) * 1997-11-14 1999-12-21 Vadem Portable computer having articulated display
US6464195B1 (en) * 1997-12-04 2002-10-15 Raymond Hildebrandt Ergonomic mounting for computer screen displays
US6333847B1 (en) * 1998-02-04 2001-12-25 Fujitsu Limited Outside panel for an electronic device
US6282082B1 (en) * 1998-07-31 2001-08-28 Qubit, Llc Case for a modular tablet computer system
US6377452B1 (en) * 1998-12-18 2002-04-23 Furukawa Electric Co., Ltd. Heat pipe hinge structure for electronic device
US6483445B1 (en) * 1998-12-21 2002-11-19 Intel Corporation Electronic device with hidden keyboard
US6832646B1 (en) * 1999-02-26 2004-12-21 Nippon Thermostat Co., Ltd. Cooler for electronic device
US6477871B1 (en) * 1999-03-27 2002-11-12 International Business Machines Corporation Lid restraint for portable computer
US6231371B1 (en) * 1999-06-25 2001-05-15 Hewlett-Packard Company Docking station for multiple devices
US6519143B1 (en) * 1999-09-17 2003-02-11 Nec Corporation Docking station
US6166907A (en) * 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US6196850B1 (en) * 2000-02-10 2001-03-06 International Business Machines Corporation Rotatable docking station for an electronic device
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
US6437973B1 (en) * 2000-04-18 2002-08-20 Hewlett-Packard Company Modular mechanism for movable display
US6430038B1 (en) * 2000-04-18 2002-08-06 Hewlett-Packard Company Computer with articulated mechanism
US6313990B1 (en) * 2000-05-25 2001-11-06 Kioan Cheon Cooling apparatus for electronic devices
US20030206367A1 (en) * 2000-06-16 2003-11-06 Hdvi Technology Llc Disk drive system with enclosed removable cartridge including voice coil/head/disk assembly
US20020018337A1 (en) * 2000-06-29 2002-02-14 Hiroshi Nakamura Electronic apparatus having heat sink for cooling heat generating component
US6296048B1 (en) * 2000-09-08 2001-10-02 Powerwave Technologies, Inc. Heat sink assembly
US6728102B2 (en) * 2000-09-21 2004-04-27 Kabushiki Kaisha Toshiba Electronic apparatus including a cooling unit for cooling a heat generating component
US6396687B1 (en) * 2000-10-13 2002-05-28 Dell Products, L.P. Rotating portable computer docking station
US6519147B2 (en) * 2000-12-19 2003-02-11 Hitachi, Ltd. Notebook computer having a liquid cooling device
US6519148B2 (en) * 2000-12-19 2003-02-11 Hitachi, Ltd. Liquid cooling system for notebook computer
US6717798B2 (en) * 2001-03-22 2004-04-06 Intel Corporation Docking digital picture displays
US20020141159A1 (en) * 2001-03-29 2002-10-03 Bloemen James Andrew Sealed and passively cooled telecommunications customer service terminal
US6625024B2 (en) * 2001-07-06 2003-09-23 Alstom Power converter enclosure
US6755626B2 (en) * 2001-07-18 2004-06-29 Matsushita Electric Industrial Co., Ltd. Miniature pump, cooling system and portable equipment
US6873521B2 (en) * 2001-07-24 2005-03-29 Hewlett-Packard Development Company, L.P. Multiple environment foldable computer
US6654234B2 (en) * 2001-07-24 2003-11-25 Hewlett-Packard Development Company, L.P. Multifunctional foldable computer
US20030039097A1 (en) * 2001-08-22 2003-02-27 Takeshi Igarashi Method of cooling system for a personal computer and personal computer
US6809927B2 (en) * 2001-09-07 2004-10-26 Hitachi, Ltd. Liquid circulation cooling system for electronic apparatus
US6594149B2 (en) * 2001-09-18 2003-07-15 Hitachi, Ltd. Liquid cooled circuit device
US20030072656A1 (en) * 2001-09-25 2003-04-17 Kyo Niwatsukino Ultra-thin pump and cooling system including the pump
US20030142474A1 (en) * 2002-01-28 2003-07-31 International Business Machines Corporation Personal computer device having constant tilt display with adjustable height
US6839234B2 (en) * 2002-05-15 2005-01-04 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
US7187545B2 (en) * 2002-05-22 2007-03-06 Siemens Aktiengesellschaft Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and support
US6856506B2 (en) * 2002-06-19 2005-02-15 Motion Computing Tablet computing device with three-dimensional docking support
US20040070942A1 (en) * 2002-08-30 2004-04-15 Kabushiki Kaisha Toshiba Electronic apparatus
US20040057197A1 (en) * 2002-09-24 2004-03-25 International Business Machines Corporation User friendly computer equipment, monitor unit, and monitor unit setting base
US6845011B2 (en) * 2002-10-15 2005-01-18 Kabushiki Kaisha Toshiba Electronic apparatus having a circulation path of liquid coolant to cool a heat-generating component
US6655449B1 (en) * 2002-11-08 2003-12-02 Cho-Chang Hsien Heat dissipation device by liquid cooling
US20050052833A1 (en) * 2003-09-04 2005-03-10 Toshiyuki Tanaka Interlocking mechanism for a display
US20050068732A1 (en) * 2003-09-30 2005-03-31 Hiroyuki Tsuji Electronic apparatus with air cooling unit
US20050164624A1 (en) * 2003-12-26 2005-07-28 Kenichi Hisamatsu Electronic apparatus

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080104992A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Miniature liquid cooling device having an integral pump
US7729118B2 (en) * 2006-11-03 2010-06-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Miniature liquid cooling device having an integral pump
WO2008109805A3 (en) * 2007-03-07 2008-10-23 Asetek Usa Inc Hybrid liquid-air cooled graphics display adapter
US20100139891A1 (en) * 2008-12-04 2010-06-10 Fujitsu Limited Radiator and cooling unit
US20150382507A1 (en) * 2014-06-28 2015-12-31 Nidec Corporation Heat module
US9826661B2 (en) * 2014-06-28 2017-11-21 Nidec Corporation Heat module
US20210204453A1 (en) * 2018-10-24 2021-07-01 Nidec Corporation Cooling device
US11497148B2 (en) * 2018-10-24 2022-11-08 Nidec Corporation Cooling device
US11864346B2 (en) * 2021-05-17 2024-01-02 Rouchon Industries, Inc. Pump-driven coolant filling device and methods
US20240114653A1 (en) * 2022-09-30 2024-04-04 United States Of America As Represented By The Secretary Of The Army Universal ruggedized computer system enclosure
US20250216914A1 (en) * 2022-09-30 2025-07-03 United States Of America As Represented By The Secretary Of The Army Universal ruggedized computer enclosure with forced air cooling
US12402275B2 (en) * 2022-09-30 2025-08-26 United States Of America As Represented By The Secretary Of The Army Universal ruggedized computer system enclosure
CN116294301A (zh) * 2022-12-05 2023-06-23 大连理工大学 泵辅助毛细力驱动两相流体热管理系统
CN116498433A (zh) * 2023-06-29 2023-07-28 江苏普瑞亚动力科技有限公司 一种排气集水式氢氨能源发动机

Also Published As

Publication number Publication date
JP2005315157A (ja) 2005-11-10
CN1690439A (zh) 2005-11-02

Similar Documents

Publication Publication Date Title
US7319587B2 (en) Electronic apparatus having pump unit
US7280357B2 (en) Pump and electronic device having the pump
US6847524B2 (en) Electronic apparatus having cooling unit for cooling heat-generating component
US20040042184A1 (en) Electronic apparatus provided with liquid cooling type cooling unit cooling heat generating component
US7273089B2 (en) Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components
US7301771B2 (en) Heat-receiving apparatus and electronic equipment
US6643129B2 (en) Cooling unit including fan and plurality of air paths and electronic apparatus including the cooling unit
KR100634862B1 (ko) 방열부를 구비한 냉각 유닛과, 냉각 유닛이 탑재된 전자장치
US20060162901A1 (en) Blower, cooling device including the blower, and electronic apparatus including the cooling device
US7215546B2 (en) Pump, electronic apparatus, and cooling system
US20050217828A1 (en) Pump, cooler, and electronic device
US20050244292A1 (en) Pump, cooler, and electronic device
JP4842040B2 (ja) 電子機器
JP4781929B2 (ja) 電子機器
WO2005064675A1 (ja) 放射状に配置された放熱フィンを有する放熱器、放熱器を備えた冷却装置および冷却装置を搭載した電子機器
JP4258292B2 (ja) 冷却装置
US20050244291A1 (en) Pump and electronic apparatus having this pump
JP5133531B2 (ja) 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
US20060254790A1 (en) Cooling unit having heat radiating portion, through which liquid coolant flows and electronic apparatus equipped with cooling unit
JP2004348649A (ja) 電子機器
US20050265833A1 (en) Pump
JP2004348651A (ja) 冷却装置および冷却装置を搭載した電子機器

Legal Events

Date Code Title Description
AS Assignment

Owner name: KABUSHIKI KAISHA TOSHIBA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TOMIOKA, KENTARO;HATA, YUKIHIKO;REEL/FRAME:015956/0680

Effective date: 20050331

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION