US20050133201A1

US20050133201A1 - Radiation fin structure

Info

Publication number: US20050133201A1
Application number: US10/740,473
Authority: US
Inventors: I-Ming Liu
Original assignee: Individual
Current assignee: Individual
Priority date: 2003-12-22
Filing date: 2003-12-22
Publication date: 2005-06-23

Abstract

A radiation fin structure aims to disperse heat for personal or notebook computers and peripheral devices thereof. The structure includes a base deck at the bottom end of the radiation fins with grid type passages formed therein to form a closed loop. The closed loop is filled with a liquid or gas heat dissipation medium to the amount about 50% to 90% of the internal volume capacity of the grid type passages. When the base deck is in contact with the contact surface of a computer heat generating element, heat concentrates on the heat absorption end of the base deck and is transferred to the fin-type heat dissipation section to be dispelled by a fan to improve heat dissipation effect.

Description

FIELD OF THE INVENTION

The present invention relates to a radiation fin structure for improving heat dissipation.

BACKGROUND OF THE INVENTION

The radiator for personal computers or notebook computers generally has a fan fixedly mounted onto the radiation fins. The radiation fins are clamped on a computer heat generating element through an eccentric fixture. During heat dissipation process, the eccentric fixture is prone to skew and results in the radiation fins not in direct contact with the computer heat generating element. Therefore heat generated by the computer heat generating element concentrates on the contact surface, while airflow generated by the fan does not blow in a converged fashion but around the surrounding. Moreover, the radiation fins simply rely on metal thermal conduction principle to disperse heat. Namely, the computer heat generating element transfers heat through the contact surface to the base deck of the radiator. Then the heat is transferred to the radiation fins to be carried away by the airflow generated by the fan. The heat dissipation efficiency of such an approach is determined by the thermal conductivity power of the metal that is used to fabricate the radiator. As solid substance has limited thermal conductivity power, heat dissipation effect of the known radiator also is limited. To remedy this problem, the present invention provides a closed chamber structure that is filled with a liquid or gas heat dissipation medium. It maintains the original metal thermal conductive heat dissipation approach, also includes a medium convection heat dissipation approach. Therefore heat dissipation effect may be improved.

SUMMARY OF THE INVENTION

In view of the aforesaid disadvantages occurred to the conventional radiation fins that do not provide desirable heat dissipation effect, applicant aims to provide an improved radiation fin structure that has a base deck which has a closed loop consisting of grid type passages. The closed loop is filled with a liquid or gas heat dissipation medium to the amount about 50% to 90% of the internal volume capacity of the grid type passages. Heat concentrates on a heat absorption end of the base deck and passes through the radiation fins to be dispelled by the fan to achieve heat dissipation effect.
The structure set forth can achieve the following advantages:
1. The base deck at the bottom end of the radiation fins has grid type passages to form a closed loop to contain a liquid or gas heat dissipation medium. It maintains the original metal thermal conductive heat dissipation approach, also includes a medium convection heat dissipation approach. Therefore heat dissipation effect may be improved.
2. The radiation fin structure according to the invention consists of aluminum radiation fins with a closed loop formed therein. Heat on the contact surface of the heat generating element (at a higher temperature) concentrates on the heat absorption end of the base deck, and passes through the radiation fins to be dispelled by the fan. Thus heat dissipation effect may be improved.
3. The radiation fins of the invention are in contact with the contact surface of the heat generating element so that the heat absorption end of the base deck at the bottom can converge heat which passes through the radiation fins to be dispelled by the fan. The contact area is evenly formed and has an improved heat conduction coefficient. This also can enhance heat dissipation effect.
The foregoing, as well as additional objects, features and advantages of the invention will be more readily apparent from the following detailed description, which proceeds with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a first embodiment of the present invention.
FIG. 2 is a front view of FIG. 1.
FIG. 3 is a schematic view of circulating heat dissipation by the heat dissipation medium according to FIG. 1.
FIG. 4 is a schematic view of circulating heat dissipation by the heat dissipation medium according to a second embodiment of the invention.
FIG. 5 is a schematic view of circulating heat dissipation by the heat dissipation medium according to a third embodiment of the invention.
FIG. 6 is a schematic view of circulating heat dissipation by the heat dissipation medium according to a fourth embodiment of the invention.
FIG. 7 is a perspective view of a fifth embodiment of the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Please refer to FIGS. 1 and 2 for a first embodiment of the invention. The radiation fin structure according to the invention includes a base deck 10 and a fin-type heat dissipation section 11. It is adopted for use on personal computers or notebook computers and peripheral devices thereof for dispersing heat.
The base deck 10 is in contact with a heat generating element of a computer to absorb heat. The base deck 10 has grid type passages 102 formed therein that consist of longitudinal and transverse passages on neighboring sides communicating with one another to form a closed loop 100. The closed loop 100 is filled with a liquid or gas heat dissipation medium 101 to the amount about 50% to 90% of the internal volume capacity of the grid type passages 102 (shown by arrows in FIG. 3).
The fin-type heat dissipation section 11 is located above the base deck 10 which has a heat absorption end to absorb heat and transfer the heat through the fin-type heat dissipation section 11 to be dispelled by a fan.
Referring to FIG. 3, the grid type passages 102 are formed in the base deck 10. They have outlets sealed by pliable plugs 103. The grid type passages 102 form a closed loop 100 which is filled with a liquid or gas heat dissipation medium 101 to the amount about 50% to 90% of the internal volume capacity of the grid type passages 102 (shown by arrows in FIG. 3). When the base deck 10 is in contact with the contact surface of the computer heat generating element, the heat dissipation medium 101 in the base deck 10 gathers heat generated by the computer heat generating element to the heat absorption end of the base deck 10, then the heat is transferred to the fin-type heat dissipation section 11 to be dispelled by the fan to achieve optimal heat dissipation effect.
Refer to FIG. 4 for a second embodiment of the invention. It is constructed largely like the first embodiment shown in FIG. 1. The difference is that reciprocal passages 102 a are formed by machining in the base deck 10 a at the bottom end of the radiation fins with outlets sealed by pliable plugs 103 a. The reciprocal passages 102 a form a closed loop 100 a which is filled with a liquid or gas heat dissipation medium 101 to the amount about 50% to 90% of the internal volume capacity of the reciprocal passages 102 a (shown by arrows in FIG. 4). When the base deck 10 a is in contact with the contact surface of the computer heat generating element, heat concentrates on the heat absorption end of the base deck 10 a, and is transferred to the fin-type heat dissipation section to be dispelled by the fan to achieve optimal heat dissipation effect.
Refer to FIG. 5 for a third embodiment of the invention. It is constructed largely like the first embodiment shown in FIG. 1. The difference is that the grid type passages 102 b fabricated by machining in the base deck 10 b with outlets sealed by pliable plugs 103 b form an open-type loop 10 b. The base deck 10 b has an outlet connection end 104 b on one side and an inlet connection end 105 b on another side thereof to form a circulation system. When the base deck 10 b is in contact with the contact surface of the computer heat generating element, heat concentrates on the heat absorption end of the base deck 10 b, and is exchanged through an external heat exchanger, then is transferred to the fin-type heat dissipation section to be dispelled by the fan to achieve optimal heat dissipation effect.
Refer to FIG. 6 for a fourth embodiment of the invention. It is constructed largely like the third embodiment shown in FIG. 5. The difference is that a reciprocal loop 100 c is formed in the base deck 10 c. The reciprocal loop 100 c may be connected to an external heat exchanger, then is transferred to the fin-type heat dissipation section to dispel heat by the fan.
Refer to FIG. 7 for a fifth embodiment of the invention. It is constructed largely like the first embodiment shown in FIG. 1. The difference is that the radiation fins 1 d are to be housed in the heat generating space. While it has a base deck 10 d with the same height as the one in the embodiment shown in FIG. 1, the radiation fins 1 d located above the base deck 10 d are formed with different heights and arranged in different densities.

Claims

1. A radiation fin structure, comprising:

a base deck having gird type passages formed therein consisting of longitudinal and transverse passages on neighboring sides communicating with one another to form a closed loop which is filled with a heat dissipation medium; and

a fin-type heat dissipation section located above the base deck.

2. The radiation fin structure of claim 1, wherein the heat dissipation medium is liquid or gas.

3. The radiation fin structure of claim 1, wherein the heat dissipation medium is filled to the amount about 50% to 90% of the internal volume capacity of the gird type passages.

4. The radiation fin structure of claim 1, wherein the closed loop has reciprocal passages.

5. The radiation fin structure of claim 1, wherein the base deck has an outlet connection end on one side and an inlet connection end on another side thereof to form an open loop circulation system.

6. The radiation fin structure of claim 5, wherein the open loop is connected to an external heat exchange circulation system.

7. The radiation fin structure of claim 1, wherein the radiation fins are located in a heat generation space on the base deck of a same height and have different heights and are arranged in different densities.