US20040266628A1 - Novel superconducting articles, and methods for forming and using same - Google Patents

Novel superconducting articles, and methods for forming and using same Download PDF

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Publication number
US20040266628A1
US20040266628A1 US10/607,945 US60794503A US2004266628A1 US 20040266628 A1 US20040266628 A1 US 20040266628A1 US 60794503 A US60794503 A US 60794503A US 2004266628 A1 US2004266628 A1 US 2004266628A1
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layer
power
substrate
superconducting
superconducting article
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English (en)
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Hee-Gyoun Lee
Yi-Yuan Xie
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SuperPower Inc
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SuperPower Inc
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Application filed by SuperPower Inc filed Critical SuperPower Inc
Priority to US10/607,945 priority Critical patent/US20040266628A1/en
Assigned to SUPERPOWER, INC. reassignment SUPERPOWER, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LEE, HEE-GYOUN, XIE, YI-YUAN
Priority to EP04817705.9A priority patent/EP1639609B1/fr
Priority to CA2529661A priority patent/CA2529661C/fr
Priority to PCT/US2004/020558 priority patent/WO2005055275A2/fr
Priority to JP2006517696A priority patent/JP5085931B2/ja
Priority to CN200480018114.3A priority patent/CN1813317B/zh
Publication of US20040266628A1 publication Critical patent/US20040266628A1/en
Priority to US11/130,349 priority patent/US7109151B2/en
Priority to KR20057025042A priority patent/KR101079564B1/ko
Priority to US11/522,850 priority patent/US7774035B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/20—Permanent superconducting devices
    • H10N60/203—Permanent superconducting devices comprising high-Tc ceramic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0268—Manufacture or treatment of devices comprising copper oxide
    • H10N60/0661—Processes performed after copper oxide formation, e.g. patterning
    • H10N60/0716—Passivating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/93—Electric superconducting

Definitions

  • the present invention is generally directed to superconducting or superconductor components, and in particular, a novel superconducting tape, power components incorporating same, and methods for utilizing and manufacturing same.
  • a first generation of HTS tapes includes use of the above-mentioned BSCCO high-temperature superconductor.
  • This material is generally provided in the form of discrete filaments, which are embedded in a matrix of noble metal, typically silver.
  • noble metal typically silver.
  • second-generation HTS tapes typically rely on a layered structure, generally including a flexible substrate that provides mechanical support, at least one buffer layer overlying the substrate, the buffer layer optionally containing multiple films, an HTS layer overlying the buffer film, and an electrical stabilizer layer overlying the superconductor layer, typically formed of at least a noble metal.
  • a layered structure generally including a flexible substrate that provides mechanical support, at least one buffer layer overlying the substrate, the buffer layer optionally containing multiple films, an HTS layer overlying the buffer film, and an electrical stabilizer layer overlying the superconductor layer, typically formed of at least a noble metal.
  • a superconducting article which includes a substrate, a buffer layer overlying the substrate, a superconductor layer overlying the buffer layer, and an electroplated stabilizer layer overlying the superconductor layer.
  • the stabilizer layer may be formed principally of non-noble metals, such as copper, aluminum, and alloys and mixtures thereof.
  • a noble metal cap layer may be provided between the stabilizer layer and the superconductor layer.
  • the electroplated stabilizer layer may overlie one of the two opposite major surfaces of the substrate, both major surfaces, or may completely encapsulate the substrate, buffer layer, and superconductor layer.
  • the article may be in the form of a relatively high aspect ratio tape.
  • a method for forming a superconducting tape includes providing a substrate, depositing a buffer layer overlying the substrate, and depositing a superconductor layer overlying the buffer layer. Further, an electroplating step is carried out to deposit a stabilizer layer overlying the superconductor layer.
  • a power cable including a plurality of superconductive tapes, the superconductive tapes being provided in accordance with the first aspect of the present invention described above.
  • a power transformer including primary and secondary windings, at least one of the windings including a wound coil of superconductive tape provided in accordance with the first aspect of the present invention.
  • a power generator including a shaft coupled to a rotor that contains electromagnets comprising rotor coils, and a stator comprising a conductive winding surrounding the rotor.
  • the rotor coils and/or the conductive winding include a superconductive tape generally in accordance with the first aspect of the present invention described above.
  • the power grid includes multiple components for generation, transmission and distribution of electrical power.
  • the power grid includes a power generation station including a power generator, a transmission substation including a plurality of power transformers for receiving power from the power generation station and stepping-up voltage for transmission, and a plurality of power transmission cables for transmitting power from the transmission substation.
  • Distribution of the power is provided by utilization of a power substation for receiving power from the power transmission cables, the power substation containing a plurality of power transformers for stepping-down voltage for distribution, and a plurality of power distribution cables for distributing power to end users.
  • at least one of the power grid elements described above includes a plurality of superconductive tapes, provided in accordance with the first aspect of the present invention described above.
  • another aspect of the present invention provides a method for laying power cable, sometimes also referred to generically as “pulling” cable.
  • the method calls for providing a coil of power cable, and unwinding the coil while inserting the power cable into a conduit, wherein the conduit is an underground utility conduit.
  • the structure of the power cable is described above, namely, includes a plurality of superconductive tapes in accordance with the first aspect of the present invention.
  • FIG. 1 illustrates an HTS conductive tape according to an embodiment of the present invention.
  • FIG. 2 illustrates a cross-section of a HTS tape according to another embodiment of the present invention in which the entire superconductive tape is encapsulated by electroplated stabilizer.
  • FIG. 3 a cross-section of a dual-sided HTS conductive tape according to another embodiment of the present invention.
  • FIG. 4 illustrates an electroplating process according to an embodiment of the present invention.
  • FIG. 5 illustrates the results of a current overloading test.
  • FIG. 6 illustrates the results of testing conducted to evaluate the effect of overloading on the critical current of the HTS tape.
  • FIGS. 7 and 8 illustrate power cables incorporating superconductive tapes.
  • FIG. 9 illustrates a power-transformer according to an aspect of the present invention.
  • FIG. 10 illustrates a power generator according to an aspect of the present invention
  • FIG. 11 illustrates a power grid according to another aspect of the present invention.
  • the HTS conductor includes a substrate 10 , a buffer layer 12 a overlying the substrate 10 , an HTS layer 14 a, followed by a capping layer 16 a, typically a noble metal layer, and a stabilizer layer 18 a, typically a non-noble metal.
  • the substrate 10 is generally metal-based, and typically, an alloy of at least two metallic elements.
  • Particularly suitable substrate materials include nickel-based metal alloys such as the known Inconel® group of alloys.
  • the Inconel® alloys tend to have desirable thermal, chemical and mechanical properties, including coefficient of expansion, thermal conductivity, Curie temperature, tensile strength, yield strength, and elongation.
  • These metals are generally commercially available in the form of spooled tapes, particularly suitable for HTS tape fabrication, which typically will utilize reel-to-reel tape handling.
  • the substrate 10 is typically in a tape-like configuration, having a high aspect ratio.
  • the width of the tape is generally on the order of about 0.4-10 cm, and the length of the tape is typically at least about 100 m, most typically greater than about 500 m.
  • embodiments of the present invention provide for superconducting tapes that include substrate 10 having a length on the order of 1 km or above.
  • the substrate may have an aspect ratio which is fairly high, on the order of not less than 10 3 , or even not less than 10 4 . Certain embodiments are longer, having an aspect ratio of 10 5 and higher.
  • the term ‘aspect ratio’ is used to denote the ratio of the length of the substrate or tape to the next longest dimension, the width of the substrate or tape.
  • the substrate is treated so as to have desirable surface properties for subsequent deposition of the constituent layers of the HTS tape.
  • the surface may be lightly polished to a desired flatness and surface roughness.
  • the substrate may be treated to be biaxially textured as is understood in the art, such as by the known RABiTS (roll assisted biaxially textured substrate) technique.
  • the buffer layer 12 a may be a single layer, or more commonly, be made up of several films.
  • the buffer layer includes a biaxially textured film, having a crystalline texture that is generally aligned along crystal axes both in-plane and out-of-plane of the film.
  • Such biaxial texturing may be accomplished by IBAD.
  • IBAD is acronym that stands for ion beam assisted deposition, a technique that may be advantageously utilized to form a suitably textured buffer layer for subsequent formation of an HTS layer having desirable crystallographic orientation for superior superconducting properties.
  • Magnesium oxide is a typical material of choice for the IBAD film, and may be on the order or 50 to 500 Angstroms, such as 50 to 200 Angstroms.
  • the IBAD film has a rock-salt like crystal structure, as defined and described in U.S. Pat. No. 6,190,752, incorporated herein by reference.
  • the buffer layer may include additional films, such as a barrier film provided to directly contact and be placed in between an IBAD film and the substrate.
  • the barrier film may advantageously be formed of an oxide, such as yttria, and functions to isolate the substrate from the IBAD film.
  • a barrier film may also be formed of non-oxides such as silicon nitride and silicon carbide. Suitable techniques for deposition of a barrier film include chemical vapor deposition and physical vapor deposition including sputtering. Typical thicknesses of the barrier film may be within a range of about 100-200 angstroms.
  • the buffer layer may also include an epitaxially grown film, formed over the IBAD film. In this context, the epitaxially grown film is effective to increase the thickness of the IBAD film, and may desirably be made principally of the same material utilized for the IBAD layer such as MgO.
  • the buffer layer may further include another buffer film, this one in particular implemented to reduce a mismatch in lattice constants between the HTS layer and the underlying IBAD film and/or epitaxial film.
  • This buffer film may be formed of materials such as YSZ (yttria-stabilized zirconia) strontium ruthenate, lanthanum manganate, and generally, perovskite-structured ceramic materials.
  • the buffer film may be deposited by various physical vapor deposition techniques.
  • the substrate surface itself may be biaxially textured.
  • the buffer layer is generally epitaxially grown on the textured substrate so as to preserve biaxial texturing in the buffer layer.
  • RABiTS roll assisted biaxially textured substrates
  • the high-temperature superconductor (HTS) layer 14 a is typically chosen from any of the high-temperature superconducting materials that exhibit superconducting properties above the temperature of liquid nitrogen, 77K.
  • Such materials may include, for example, YBa 2 Cu 3 O 7 ⁇ x , Bi 2 Sr 2 Ca 2 Cu 3 O 10+y , Ti 2 Ba 2 Ca 2 Cu 3 O 10+y , and HgBa 2 Ca 2 Cu 3 O 8+y .
  • One class of materials includes REBa 2 Cu 3 O 7 ⁇ x , wherein RE is a rare earth element.
  • YBa 2 Cu 3 O 7 ⁇ x also generally referred to as YBCO, may be advantageously utilized.
  • the HTS layer 14 a may be formed by any one of various techniques, including thick and thin film forming techniques.
  • a thin film physical vapor deposition technique such as pulsed laser deposition (PLD) can be used for a high deposition rates, or a chemical vapor deposition technique can be used for lower cost and larger surface area treatment.
  • PLD pulsed laser deposition
  • the HTS layer has a thickness on the order of about 1 to about 30 microns, most typically about 2 to about 20 microns, such as about 2 to about 10 microns, in order to get desirable amperage ratings associated with the HTS layer 14 a.
  • the capping layer 16 a and the stabilizer layer 18 a are generally implemented for electrical stabilization, to aid in prevention of HTS burnout in practical use. More particularly, layers 16 a and 18 a aid in continued flow of electrical charges along the HTS conductor in cases where cooling fails or the critical current density is exceeded, and the HTS layer moves from the superconducting state and becomes resistive.
  • a noble metal is utilized for capping layer 16 a to prevent unwanted interaction between the stabilizer layer(s) and the HTS layer 14 a .
  • Typical noble metals include gold, silver, platinum, and palladium. Silver is typically used due to its cost and general accessibility.
  • the capping layer 16 a is typically made to be thick enough to prevent unwanted diffusion of the components from the stabilizer layer 18 a into the HTS layer 14 a, but is made to be generally thin for cost reasons (raw material and processing costs). Typical thicknesses of the capping layer 16 a range within about 0.1 to about 10.0 microns, such as 0.5 to about 5.0 microns. Various techniques may be used for deposition of the capping layer 16 a, including physical vapor deposition, such as DC magnetron sputtering.
  • a stabilizer layer 18 a is incorporated, to overlie the superconductor layer 14 a, and in particular, overlie and directly contact the capping layer 16 a in the particular embodiment shown in FIG. 1.
  • the stabilizer layer 18 a functions as a protection/shunt layer to enhance stability against harsh environmental conditions and superconductivity quench.
  • the layer is generally dense and thermally and electrically conductive, and functions to bypass electrical current in case of failure in the superconducting layer.
  • such layers have been formed by laminating a pre-formed copper strip onto the superconducting tape, by using an intermediary bonding material such as a solder or flux.
  • the stabilizer layer 18 is formed by electroplating. According to this technique, electroplating can be used to quickly build-up a thick layer of material on the superconducting tape, and it is a relatively low cost process that can effectively produce dense layers of thermally and electrically conductive metals. According to one feature, the stabilizer layer is deposited without the use of or reliance upon and without the use of an intermediate bonding layer, such as a solder layer (including fluxes) that have a melting point less than about 300° C.
  • an intermediate bonding layer such as a solder layer (including fluxes) that have a melting point less than about 300° C.
  • Electroplating also known as electrodeposition
  • Electroplating is generally performed by immersing the superconductive tape in a solution containing ions of the metal to be deposited.
  • the surface of the tape is connected to an external power supply and current is passed through the surface into the solution, causing a reaction of metal ions (M z ⁇ ) with electrons (e ⁇ ) to form a metal (M).
  • the capping layer 16 a functions as a seed layer for deposition of copper thereon.
  • the superconductive tape is generally immersed in a solution containing cupric ions, such as in a copper sulfate solution. Electrical contact is made to the capping layer 16 a and current is passed such that the reaction Cu 2+ +2e ⁇ ⁇ Cu occurs at the surface of the capping layer 16 a.
  • the capping layer 16 a functions as the cathode in the solution, such that the metal ions are reduced to Cu metal atoms and deposited on the tape.
  • a copper-containing anode is placed in the solution, at which an oxidation reaction occurs such that copper ions go into solution for reduction and deposition at the cathode.
  • the current delivered to the conductive surface during electroplating is directly proportional to the quantity of metal deposited (Faraday's Law of Electrolysis). Using this relationship, the mass, and hence thickness of the deposited material forming stabilizer layer 18 a can be readily controlled.
  • FIG. 1 While the foregoing description and FIG. 1 describe electroplating to form a stabilizer layer 18 a along one side of the superconductive tape, it is also noted that the opposite, major side of the superconductive tape may also be coated, and indeed, the entirety of the structure can be coated so as to be encapsulated. In this regard, attention is drawn to FIG. 2.
  • FIG. 2 is a cross-sectional diagram illustrating another embodiment of the present invention, in which the entire superconductive tape is encapsulated with first stabilizer layer 18 a, second stabilizer layer 18 b disposed on an opposite major surface of the superconductive tape, the first and second stabilizer layers 18 a, 18 b, joining together along the side surfaces of the superconductive tape, forming generally convex side portions or side bridges 20 a and 20 b.
  • This particular structure is desirable to further improve current flow and further protect the HTS layer 14 a, in the case of cryogenic failure, superconductivity quench, etc.
  • first and second stabilizer layers 18 a and 18 b By essentially doubling the cross-sectional area of the deposited stabilizer layer by forming first and second stabilizer layers 18 a and 18 b, a marked improvement in current-carrying capability is provided. Electrical continuity between stabilizer layers 18 a and 18 b may be provided by the lateral bridging portions 20 a and 20 b.
  • the lateral bridging portions 20 a and 20 b may desirably have a positive radius of curvature so as to form generally convex surfaces, which may further reduce build up of electrical charge at high voltages that HTS electric power devices will experience.
  • further current-carrying capability can be provided by encapsulation as illustrated in FIG.2. That is, the bridging portions extending laterally and defining side surfaces of the tape may provide electrical connection to the substrate itself, which can add to the current carrying capability of the coated conductor (tape).
  • a noble metal layer along the entirety of the superconductive tape, particularly along the side surfaces of the superconductive tape, to isolate the superconductor layer 14 a from the material of the bridging portions 20 a and 20 b, which may be a non-noble metal such as copper or aluminum as described above.
  • FIG. 3 illustrates yet another embodiment of the present invention.
  • the embodiment is somewhat similar to that shown in FIG. 2, but essentially forms a double-sided structure, including first and second buffer layers 12 a and 12 b , respectively overlying first and second surfaces 11 a and 11 b of the substrate 10 .
  • first and second superconductor layers 14 a and 14 b are provided, along with first and second capping layers 16 a and 16 b.
  • This particular structure provides an advantage of further current-carrying capability by utilizing both sides of the substrate for coating of the superconductor layers 14 a and 14 b.
  • FIG. 4 schematically illustrates an electroplating process according to an embodiment of the present invention.
  • electroplating is carried out in a reel-to-reel process by feeding a superconductive tape through an electroplating solution 27 by feeding the tape from feed reel 32 and taking up the tape at take-up reel 34 .
  • the tape is fed through a plurality of rollers 26 .
  • the rollers may be negatively charged so as to impart a negative charge along the capping layer(s) and/or the substrate for electrodeposition of the metal ions provided in solution.
  • the embodiment shown in FIG. 4 shows two anodes 28 and 30 for double-sided deposition, although a single anode 28 may be disposed for single-sided electroplating.
  • the electroplating solution 27 generally contains metal ions of the desired species for electrodeposition.
  • the solution may be a copper sulfate solution containing copper sulfate and sulfuric acid, for example.
  • the anodes 28 , 30 provide the desired feedstock metal for electrodeposition, and may be simply formed of high-purity copper plates. It is noted that while the rollers 26 may be electrically biased so as to bias the superconductive tape, biasing may take place outside of the solution bath, to curtail unwanted deposition of metal on the rollers themselves.
  • a particular example was created utilizing the electroplating technique described above.
  • samples were subjected to DC magnetron sputtering of silver to form 3 micron-thick capping layers. Those samples were placed in a copper-sulfate solution and biased such that the capping layers formed a cathode, the anode being a copper plate. Electroplating was carried out to form a copper layer having a nominal thickness of about 40 microns. Testing of the samples is described hereinbelow.
  • the estimated power dissipation is higher than 62.5 KW/cm 2 at 326 A.
  • the electroplated stabilizer layer acted as a robust shunt layer to protect the superconducting film from burning out during the overloading event.
  • the sample was then subjected to a second load, following the overloading event.
  • the curves show the same I c of about 111 A before and after overloading. The foregoing indicates that the HTS tape retained its critical current even after the overloading.
  • the stabilizer layer In order to provide adequate current-carrying capability in the stabilizer layer, typically the stabilizer layer has a thickness within a range of about 1 to about 1,000 microns, most typically within a range of about 10 to about 400 microns, such as about 10 to about 200 microns. Particular embodiments had a nominal thickness at about 40 microns and about 50 microns.
  • FIGS. 7 and 8 illustrate implementation of a superconducting tape in a commercial power component, namely a power cable.
  • FIG. 7 illustrates several power cables 42 extending through an underground conduit 40 , which may be a plastic or steel conduit.
  • FIG. 7 also illustrates the ground 41 for clarity. As is shown, several power cables may be run through the conduit 40 .
  • FIG. 8 a particular structure of a power cable is illustrated.
  • liquid nitrogen is fed through the power cable through LN2 duct 44 .
  • One or a plurality of HTS tapes 46 is/are provided so as to cover the duct 44 .
  • the tapes may be placed onto the duct 44 in a helical manner, spiraling the tape about the duct 44 .
  • Further components include a copper shield 48 , a dielectric tape 50 for dielectric separation of the components, a second HTS tape 52 , a copper shield 54 having a plurality of centering wires 56 , a second, larger LN2 duct 58 , thermal insulation 60 , provided to aid in maintaining a cryogenic state, a corrugated steel pipe 62 for structural support, including skid wires 64 , and an outer enclosure 66 .
  • FIG. 9 illustrates schematically a power transformer having a central core 76 around which a primary winding 72 and a secondary winding 74 are provided.
  • FIG. 9 is schematic in nature, and the actual geometric configuration of the transformer may vary as is well understood in the art.
  • the transformer includes the basic primary and secondary windings.
  • the primary winding has a higher number of coils than the secondary winding 74 , representing a step-down transformer that reduces voltage of an incoming power signal.
  • provision of a fewer number of coils in the primary winding relative to the secondary winding provides a voltage step-up.
  • step-up transformers are utilized in power transmission substations to increase voltage to high voltages to reduce power losses over long distances
  • step-down transformers are integrated into distribution substations for later stage distribution of power to end users.
  • At least one of and preferably both the primary and secondary windings comprise superconductive tapes in accordance with the foregoing description
  • the generator includes a turbine 82 connected to a shaft 84 for rotatably driving a rotor 86 .
  • Rotor 86 includes high-intensity electromagnets, which are formed of rotor coils that form the desired electromagnetic field for power generation.
  • the turbine 82 , and hence the shaft 84 and the rotor 86 are rotated by action of a flowing fluid such as water in the case of a hydroelectric power generator, or steam in the case of nuclear, diesel, or coal-burning power generators.
  • the generation of the electromagnetic field generates power in the stator 88 , which comprises at least one conductive winding.
  • At least one of the rotor coils and the stator winding comprises a superconductive tape in accordance with embodiments described above.
  • at least the rotor coils include a superconductive tape, which is effective to reduce hysteresis losses.
  • the power grid 110 includes a power plant 90 typically housing a plurality of power generators.
  • the power plant 90 is electrically connected and typically co-located with a transmission substation 94 .
  • the transmission substation contains generally a bank of step-up power transformers, which are utilized to step-up voltage of the generated power.
  • power is generated at a voltage level on the order of thousands of volts, and the transmission substation functions to step-up voltages are on the order of 100,000 to 1,000,000 volts in order to reduce line losses.
  • Typical transmission distances are on the order of 50 to 1,000 miles, and power is carried along those distances by power transmission cables 96 .
  • the power transmission cables 96 are routed to a plurality of power substations 98 (only one shown in FIG. 10).
  • the power substations contain generally a bank of step-down power transformers, to reduce the transmission level voltage from the relatively high values to distribution voltages, typically less than about 10,000 volts.
  • a plurality of further power substations may also be located in a grid-like fashion, provided in localized areas for localized power distribution to end users. However, for simplicity, only a single power substation is shown, noting that downstream power substations may be provided in series.
  • the distribution level power is then transmitted along power distribution cables 100 to end users 102 , which include commercial end users as well as residential end users. It is also noted that individual transformers may be locally provided for individual or groups of end users. According to a particular feature at least one of the generators provided in the power plant 90 , the transformers and the transmission substation, the power transmission cable, the transformers provided in the power substation, and the power distribution cables contain superconductive tapes in accordance with the

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US10/607,945 2003-06-27 2003-06-27 Novel superconducting articles, and methods for forming and using same Abandoned US20040266628A1 (en)

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Application Number Priority Date Filing Date Title
US10/607,945 US20040266628A1 (en) 2003-06-27 2003-06-27 Novel superconducting articles, and methods for forming and using same
CN200480018114.3A CN1813317B (zh) 2003-06-27 2004-06-25 新颖的超导制品及其形成和应用方法
JP2006517696A JP5085931B2 (ja) 2003-06-27 2004-06-25 新規な超伝導物品、及びそれを形成する及び使用する方法
PCT/US2004/020558 WO2005055275A2 (fr) 2003-06-27 2004-06-25 Nouveaux articles supraconducteurs, et leurs procedes de fabrication et d'utilisation
CA2529661A CA2529661C (fr) 2003-06-27 2004-06-25 Nouveaux articles supraconducteurs, et leurs procedes de fabrication et d'utilisation
EP04817705.9A EP1639609B1 (fr) 2003-06-27 2004-06-25 Nouveaux articles supraconducteurs
US11/130,349 US7109151B2 (en) 2003-06-27 2005-05-16 Superconducting articles, and methods for forming and using same
KR20057025042A KR101079564B1 (ko) 2003-06-27 2005-12-27 신규 초전도 물품, 그 형성 및 사용 방법
US11/522,850 US7774035B2 (en) 2003-06-27 2006-09-18 Superconducting articles having dual sided structures

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KR101079564B1 (ko) 2011-11-07
EP1639609A4 (fr) 2009-12-02
CN1813317B (zh) 2014-03-12
CA2529661C (fr) 2013-05-28
CA2529661A1 (fr) 2005-06-16
KR20060107273A (ko) 2006-10-13
CN1813317A (zh) 2006-08-02
JP2007526597A (ja) 2007-09-13
WO2005055275A3 (fr) 2005-12-01
EP1639609A2 (fr) 2006-03-29
EP1639609B1 (fr) 2013-09-25
JP5085931B2 (ja) 2012-11-28

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