US20040234412A1 - High-strength copper alloy - Google Patents

High-strength copper alloy Download PDF

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Publication number
US20040234412A1
US20040234412A1 US10/478,454 US47845403A US2004234412A1 US 20040234412 A1 US20040234412 A1 US 20040234412A1 US 47845403 A US47845403 A US 47845403A US 2004234412 A1 US2004234412 A1 US 2004234412A1
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Prior art keywords
mass percent
copper alloy
high strength
relationship
satisfy
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US10/478,454
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Keiichiro Oishi
Isao Sasaki
Junichi Otani
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Mitsubishi Shindoh Co Ltd
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Sambo Copper Alloy Co Ltd
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Assigned to SAMBO COPPER ALLOY CO., LTD. reassignment SAMBO COPPER ALLOY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OISHI, KEIICHIRO, OTANI, JUNICHI, SASAKI, ISAO
Publication of US20040234412A1 publication Critical patent/US20040234412A1/en
Assigned to MITSUBISHI SHINDOH CO., LTD. reassignment MITSUBISHI SHINDOH CO., LTD. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: SAMBO COPPER ALLOY CO., LTD.
Abandoned legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/04Alloys based on copper with zinc as the next major constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/02Contacts characterised by the material thereof
    • H01H1/021Composite material
    • H01H1/025Composite material having copper as the basic material

Definitions

  • the present invention relates to the high strength copper alloy suitable for materials comprising leads, switches, connectors, relays and sliding pieces etc. which are parts of electrical devices, electronic devices, communication equipments, information appliances, measuring instruments, automobiles and so on.
  • high strength copper alloys are used as materials comprising leads, switches, connectors, relays and sliding pieces etc., which are used as parts of electrical devices, electronic devices, and communication devices, information appliances, measuring instruments, automobiles, and so on.
  • their devices have been improved toward miniaturization, lightweighting, and higher efficiency, so that there are extremely severe demands for the improvements of characteristics of the materials.
  • the extremely thin plates are employed for the spring contact member of the connector. The higher strength is required for the high strength copper alloy comprising said extremely thin plates in order to thin the plate still more.
  • the high strength copper alloy it is also demanded for the high strength copper alloy to have higher balance between the strength and ductility including the bending characteristics, superiority in productivity and economy without problems of conductivity, stress relaxation characteristic, soldering characteristics, abrasion resistance, and corrosion resistance such as stress corrosion cracking resistance, dezincification corrosion resistance and migration resistance.
  • beryllium copper, titanium copper, aluminum bronze, phosphor bronze, nickel silver, brass and brass doped with Sn or Ni are generally well-known for the high strength copper alloys.
  • the beryllium copper has the highest strength in the copper alloys, but the beryllium is extremely harmful to the humans: in particular the beryllium vapor in fusion state is significantly dangerous for the humans even in a very small amount, so that initial cost of melting arrangement becomes extremely expensive because of difficulty in disposal processes, particularly in a firing treatment of the beryllium copper materials or their products. Therefore, the melting process becomes necessary at the last step of manufacturing to obtain the predetermined characteristics, and then the problems appear in economy including the manufacturing cost.
  • the titanium copper shows the higher strength to next to beryllium copper, but the expensive melting arrangement is required because titanium is active element, and hence it becomes difficult to keep quality and yield in the melting.
  • the beryllium copper since the melting process becomes necessary at the last step of manufacturing, the problems in economy appear.
  • the brass or brass doped with Si and Ni is inexpensive, but there are problems with respect to the corrosion resistance such as the stress corrosion cracking and dezincification, and then they are unsuitable for the parts to realize miniaturization and higher efficiency.
  • the micronization for the crystal grain (grain refinement) of the copper alloys is realized by selecting suitably additive elements in the recrystallization. It is recognized that the strength including mainly the 0.2% proof stress is improved remarkably by making the crystal grain size smaller than a certain size and its strength also increases with decreasing of the grain size. Furthermore, from the results of various experiments with respect to influence of the additive elements for micronization of the grain size, it is clarified that addition of Si to Cu—Zn alloy increases the number of nucleation sites and addition of Co to Cu—Zn—Si alloy suppresses the grain growth. This means that Cu—Zn—Si or Cu—Zn—Si—Co alloy system with fine grains is obtained by exploiting their effects. In other words, the increase of nucleation sites is considered to be due to decreasing of stacking fault energy based on the addition of Si, and the suppression of the grain growth is considered to be due to the formation of fine precipitates based on the addition of Co.
  • the present invention is completed based upon these investigated results and relates to new high strength copper alloy superior in mechanical properties, workability and corrosion resistance without problems in economy.
  • the invention is suitable for materials of the parts composing several devices in tendency of miniaturization, lightweighting and higher efficiency. Accordingly, it is the object of the present invention to provide new high strength copper alloy that is extensively applied and extremely rich in utility.
  • first invention copper alloy suitable for rolled stocks (plates, rods and wires etc.) required high strength, or the work piece of rolled stock (press-forming product and bending product etc.), and this alloy is in the following.
  • first invention copper alloy there are the portable or miniature communication equipments which are required thinization (to thin the plate still more) and lightweighting, electronic device parts used for personal computer, medical care instrument parts, accessory parts, machine parts, tubes or plates of heat exchanger, cooling instruments using sea water, parts composing inlet or outlet of sea water in small size ship, wiring tool parts, various instrument parts for automobile, measuring-instrument parts, play tools and daily necessities and so on.
  • second invention copper alloy suitable for rolled stocks (plates, rods and wires etc.) required highly balanced strength and electric conductivity, or the work piece of rolled stock (press-forming product and bending product etc.), where the strength required for first invention copper alloy is not needed.
  • second invention copper alloy there are electronic device parts required electric conductivity, measuring-instrument parts, household electric appliance parts, tubes or plates of heat exchanger, cooling instruments using sea water, parts composing inlet or outlet of sea water in small size ship, machine parts, play tools and daily necessities and so on.
  • third invention copper alloy suitable for wire drawing materials [general wire material of round cross section and deformed wire material such as rectangle cross section (square etc.), polygon cross section (hexagon etc.) and so on] or the workpiece of wire drawing materials (bending product etc.), where the strength required for first invention copper alloy is needed.
  • third invention copper alloy there are electronic device parts, parts for construction, accessory parts, machine parts, play tools, various instrument parts for automobile, measuring-instrument parts, electronic device parts and electrical device parts.
  • each invention copper alloy
  • said mean grain size D and said 0.2% proof stress in copper alloy are determined from said two physical quantities of the materials (called “recrystallization materials”) obtained from the recrystallization treatment performed at last (called “last recrystallization treatment”).
  • recrystallization materials obtained from the recrystallization treatment performed at last
  • Each invention copper alloy is provided with any form shown in the following preferred embodiments.
  • Ingots are worked into plastic working blanks with predetermined forms by the plastic working including the hot working (rolling, extruding and forging etc.) and/or the cold working (rolling and wire drawing etc.).
  • the plastic working blanks receive the recrystallization treatment (last recrystallization treatment) based upon heat treatment (annealing etc.) in the range of the recrystallization temperature, and then become the recrystallization materials.
  • the recrystallization materials are rolled stocks in first and second invention copper alloys, and wire drawing materials in third invention copper alloy.
  • the recrystallization materials of said embodiment 1 are worked into the cold working materials with predetermined forms according to cold working (rolling, wire drawing and forging).
  • the cold working materials are rolled stocks in first and second invention copper alloys, and wire drawing materials in third invention copper alloy.
  • the recrystallization materials of said embodiment 1 are worked into manufacture pieces with predetermined forms according to press working or bending etc.
  • the cold working materials of said embodiment 2 are worked into manufacture pieces with predetermined forms according to press working or bending etc.
  • the copper alloy composition In order to improve the property of first invention copper alloy, it is desired for the copper alloy composition to contain 0.005 to 0.5 mass percent (preferably 0.01 to 0.3 mass percent, more preferably 0.02 to 0.2 mass percent) of Co and/or 0.03 to 1.5 mass percent (preferably 0.05 to 0.7 mass percent, more preferably 0.05 to 0.5 mass percent) of Sn.
  • the contents of Co and Sn are determined from said each range under consideration of the content of Si.
  • the content of Sn is determined to satisfy the relationship Si/Sn ⁇ 1.5 (preferably Si/Sn ⁇ 2, more preferably Si/Sn ⁇ 3), wherein the value of Si content divided by Sn content is defined by Si/Sn.
  • the copper alloy composition in first invention copper alloy, it is possible for the copper alloy composition to contain 0.005 to 0.3 mass percent (preferably 0.01 to 0.2 mass percent) of Fe and/or 0.005 to 0.3 mass percent (preferably 0.01 to 0.2 mass percent) of Ni in substitution for Co or together with Co.
  • the content of Fe or Ni is determined under consideration of the content of Si.
  • Co 0.005 to 0.5 mass percent (preferably 0.01 to 0.3 mass percent, more preferably 0.02 to 0.2 mass percent) and/or Sn of 0.2 to 3 mass percent (preferably 1 to 2.6 mass percent, more preferably 1.2 to 2.5 mass percent) in alloy composition.
  • the contents of Co and Sn are determined by considering the relation to Si content.
  • the content of Sn is determined to satisfy the relationship Si/Sn ⁇ 0.5 (preferably Si/Sn ⁇ 0.4, more preferably Si/Sn ⁇ 0.3) in the range described above.
  • copper alloy it is possible to contain Fe of 0.005 to 0.3 mass percent (preferably 0.01 to 0.2 mass percent) and/or Ni of 0.005 to 0.3 mass percent (preferably 0.01 to 0.2 mass percent) in substitution for Co or together with Co.
  • the content of Fe or Ni is determined by considering the content of Si (or both contents of Si and Co in case of co-adding Co).
  • the first and second invention copper alloys, it is possible to contain at least one element selected from a group of P, Sb, As, Sr, Mg, Y, Cr, La, Ti, Mn, Zr, In and Hf corresponding to characteristics required in their applications.
  • the contents of these elements are determined appropriately in the range of 0.003 to 0.3 mass percent.
  • Co 0.005 to 0.3 mass percent (preferably 0.01 to 0.2 mass percent, more preferably 0.02 to 0.15 mass percent) and/or Sn of 0.03 to 1 mass percent (preferably 0.05 to 0.7 mass percent, more preferably 0.05 to 0.5 mass percent) in alloy composition.
  • the contents of Co and Sn are determined by considering the content of Si in above range.
  • the content of Sn is determined to satisfy the relationship Si/Sn ⁇ 1 (preferably Si/Sn ⁇ 1.5, more preferably Si/Sn ⁇ 2).
  • copper alloy it is possible to contain Fe of 0.005 to 0.3 mass percent (preferably 0.01 to 0.2 mass percent) and/or Ni of 0.005 to 0.3 mass percent (preferably 0.01 to 0.2 mass percent) in substitution for Co or together with Co.
  • alloy composition for third invention copper alloy it is possible to contain at least one element selected from a group of P, Sb, As, Sr, Mg, Y, Cr, La, Ti, Mn, Zr, In and Hf corresponding to characteristics required in their applications, where each content of P, Sb, or As is 0.005 to 0.3 mass percent and each content of Sr, Mg, Y, Cr, La, Ti, Mn, Zr, In or Hf is 0.003 to 0.3 mass percent, and the total content in cases selecting at least one element from P, Sb and As is 0.005 to 0.25 mass percent.
  • the strength, particularly the 0.2% proof stress is enhanced by the grain (recrystallized grain) refinement.
  • the present inventors have confirmed experimentally that the 0.2% proof stress is enhanced remarkably for the mean grain size less than 3.5 ⁇ m in comparison with the case larger than 3.5 ⁇ m.
  • the enhanced ratio of the proof stress increase rapidly at 3, 2.5 and 2 ⁇ m. From such experimental results, it is found that the proof stress (generally higher than 250 N/mm 2 , preferably higher than 300 N/mm 2 ) required for the parts of the electrical devices, electronic devices, communication equipments and measuring instruments is ensured in the mean grain size D less than 3.5 ⁇ m.
  • mean grain size D In the case demanding high strength (the proof stress), it is preferable for mean grain size D to be less than 3.0 cm, and in the case demanding higher strength, it is preferable to be less than 2.5 ⁇ m. In order to improve rapidly the strength in the possible range, it is preferable for mean grain size D to be less than 2 ⁇ m. On the other hand, although the proof stress is improved with decrease of the mean grain size D, it is predictably difficult to obtain practically grains less than 0.3 ⁇ m because the smallest grain size confirmed by the experiments is 0.3 ⁇ m.
  • the recrystallized structure of 0.3 ⁇ m ⁇ D ⁇ 3.5 mm is required.
  • the mean grain size D in the recrystallization state (state after the last recrystallization treatment) distributes in 0.3 ⁇ m ⁇ D ⁇ 3.5 ⁇ m and 0.2% proof stress is higher than 250 N/mm 2 .
  • the first invention copper alloy required sometimes the strength higher than the second and third invention copper alloys, it is preferable to distribute in 0.3 ⁇ m ⁇ D ⁇ 2.5 ⁇ m, and more preferable to distribute in 0.3 ⁇ m ⁇ D ⁇ 2 ⁇ m.
  • first and second invention copper alloys used mainly as the rolled stocks or the manufacture pieces when the functions of grain refinement and strengthening due to the addition of Zn appear enough, the content of Zn is more than 4 mass percent, and in order to improve largely the strength in first invention copper alloy, it is required that the content is more than 6 mass percent (preferably higher than 7 mass percent).
  • the content is more than 5 mass percent (more preferably higher than 6 mass percent).
  • the content of Zn becomes excessively, the sensitivity of the stress-corrosion cracking increases and the bending characteristic deteriorates.
  • the content of Zn in the first invention copper alloy is less than 19 mass percent (preferably less than 15 mass percent, more preferably less than 13 mass percent), and the content in the second invention copper alloy is less than 17 mass percent (preferably less than 13 mass percent, more preferably less than 11.5 mass percent).
  • the electric conductivity, hot workability and cold workability in first invention copper alloy are decreased by the Si content (also called the content of Si) in excess over 2.5 mass percent, and in order to keep those characteristics enough, it is preferable that the Si content is less than 2.3 mass percent, and the more preferable content is less than 2.2 mass percent.
  • the Si content of 0.1 mass percent at least is necessary, and it is preferable to be higher than 0.2 mass percent.
  • the Si content is less than 0.8 mass percent, and in order to ensure the electric conductivity enough to be used for the applications, it is preferable to be less than 0.6 mass percent (more preferably less than 0.5 mass percent).
  • first and second invention copper alloys it is necessary that balance among the effect of grain refinement, stress-corrosion cracking characteristics and the strength is kept by the co-addition of Zn and Si, but it is unsuitable in these alloys to determine independently the individual content in said range. Accordingly, it is necessary that the relation of the Zn and Si contents is specified by the relationship Zn-2.5.Si and the values of this formulae are determined to be in above predetermined range.
  • first invention copper alloy In order to obtain the predetermined strength based upon the grain refinement, it is necessary for first invention copper alloy to satisfy the relationship Zn-2.5.Si ⁇ 0 mass percent, and the preferable relationship is Zn-2.5.Si ⁇ 1 mass percent (more preferably Zn-2.5.Si ⁇ 2 mass percent ), and it is necessary for second invention copper alloy to satisfy the relationship Zn-2.5.Si ⁇ 2 mass percent, and the preferable relationship is Zn-2.5.Si ⁇ 4 mass percent (more preferably Zn-2.5.Si ⁇ 5 mass percent ). On the other hand, in any of first and second invention copper alloys, it is necessary to satisfy the relationship Zn-2.5.Si ⁇ 15 mass percent because the stress corrosion cracking arises remarkably for Zn-2.5.Si>15 mass percent.
  • Zn-2.5.Si ⁇ 12 mass percent (more preferably Zn-2.5.Si ⁇ 9 mass percent for first invention copper alloy, and Zn-2.5.Si ⁇ 10 mass percent for second invention copper alloy).
  • the Zn content in third invention copper alloy the grain refinement and strength are rightly considered as well as first and second invention copper alloys. Furthermore, since the third invention copper alloy is mainly used as wire drawing material and its manufactured piece, the Zn content should be determined in consideration of hot extruding characteristics, so that the Zn content is set to be abundantly in comparison with first and second invention copper alloys. In order to ensure the hot extruding characteristics enough, it is necessary for Zn content to be higher than 21 mass percent. It is more preferable for Zn content to be higher than 22 mass percent so that hot extruding-wire drawing can be kept more excellent.
  • Zn content In order to carry out the hot extrusion-wire drawing well while the stress corrosion cracking resistance and the cold workability are ensured, it is preferable for Zn content to be less than 31 mass percent. In order to ensure the hot extrusion characteristics and the cold workability, it is necessary in third invention copper alloy to consider the Cu content, and the ⁇ and ⁇ phases are easy to remain when the Cu content is less than 66 mass percent. On the other hand, when the content is higher than 76 mass percent, it gets difficult to perform the hot extrusion. Therefore, it is necessary for the Cu content to be 66 to 76 mass percent. Furthermore, in order to ensure the cold workability and the hot extrusion characteristics enough, it is preferable to be 68 to 75.5 mass percent.
  • Si shows the grain refinement, strength improvement and inhibition function of stress-corrosion cracking by adding together with Zn. Accordingly, in the case that the grain refinement and strength improvement are the principal object of third invention copper alloy used as wire drawing material, it is necessary for the content of Si to be higher than 0.5 mass percent as well as first invention copper alloy. Considering that said copper alloy is utilized as wire drawing material, it is preferable to be higher than 0.8 mass percent and the most preferable to be higher than 1 mass percent. However, when the Si content becomes higher than 2 mass percent, the ⁇ or ⁇ phase which is a factor obstructing cold workability precipitate. Therefore, it is required to be less than 2 mass percent so that the cold workability is ensured, and if considering that plenty of Zn is added, it is preferable to be less than 1.8 mass percent, and more preferable to be less than 1.7 mass percent.
  • the grains grow with the rise of temperature or with time, and then in the recrystallization process, the whole of grains does not recrystallize at the same time and the parts easy to recrystallize start to recrystallize at first and a long time becomes necessary until its recrystallization finish in all structures. Therefore, the crystal grains recrystallizing at the initial stage of the recrystalization process continue to grow till the recrystallization process finishes, and then the crystal grains become considerably large at the time point that all structures have recrystallized completely. Consequently, it is preferable to inhibit growth of recrystallized grains in the recrystallization, so that the fine recrystallized grains distribute uniformly in all structures.
  • Co has a function inhibiting growth of the recrystallized grains, and this is the reason of Co addition in first to third invention copper alloys.
  • Co combines with Si, and the growth of crystal grains is suppressed by forming fine precipitates (Co2Si of about 0.01 ⁇ m, etc.).
  • the Co content it is necessary for the Co content to be higher than 0.005 mass percent. All of the added Co is not concerned with formation of said precipitate but the solid solution part of Co improves the heat resistance of matrix and stress relaxation characteristic.
  • content of Co in the first and second invention copper alloys it is necessary for content of Co in the first and second invention copper alloys to be lower than 0.5 mass percent and for content of Co in the third invention copper alloy to be lower than 0.3 mass percent.
  • contents of Co in the first and second invention copper alloys it is preferable that the contents of Co in the first and second invention copper alloys become less than 0.3 mass percent, and it is more preferable that the contents become less than 0.2 mass percent. From the same reasons, it is preferable that the content of Co in the third invention copper alloy becomes less than 0.2 mass percent, and it is more preferable that the content becomes less than 0.15 mass percent.
  • the content of Co needs to be determined from relation to the content of Si.
  • the ratio Co/Si in the first and third invention copper alloys is determined to be higher than 0.005 mass percent and the ratio Co/Si in the second invention copper alloy is determined to be higher than 0.02.
  • Co/Si is higher than 0.01 and more preferable that Co/Si is high than 0.02 mass percent.
  • the preferable and more preferable values in the second invention copper alloy are higher than 0.04 and 0.06, respectively.
  • Co content must be determined to satisfy the ratio Co/Si which becomes higher than the predetermined values, and since said precipitate becomes rough and increases, the bending characteristics are obstructed.
  • Co/Si in the first invention copper alloy used as the rolled stock becomes higher than 0.5
  • Co/Si in the third invention copper alloy used as the wire drawing material or the manufactured piece becomes higher than 0.4 the bending characteristics decreases suddenly.
  • the second invention copper alloy whose strength has not to satisfy the strength condition required in the first invention copper alloy when Co/Si exceeds 1.5, it becomes difficult to ensure the minimum condition required for the bending characteristics.
  • the upper limit of Co/Si must be determined by comparing said point with the effect of grain growth inhibition, taking the applications, worked history and shapes into consideration in this invention copper alloy.
  • the range of Co/Si is determined as follows. In other words, it is necessary that the upper limit of Co/Si in the first invention copper alloy satisfies the relationship Co/Si ⁇ 0.5, and the preferable and optimum relationships are Co/Si ⁇ 0.3 and Co/Si ⁇ 0.2, respectively.
  • the second invention copper alloy it is necessary to satisfy the relationship Co/Si ⁇ 1.5, and the preferable and optimum relationships are Co/Si ⁇ 1 and Co/Si ⁇ 0.5, respectively.
  • the third invention copper alloy it is necessary to satisfy the relationship Co/Si ⁇ 0.4, and the preferable and optimum relationships are Co/Si ⁇ 0.2 and Co/Si ⁇ 0.15, respectively.
  • Fe and Ni show the same effect inhibiting crystal grain as Co (exactly, its effect due to Fe, Ni is less than or equal to the effect of Co). Therefore, it is possible to contain Fe, Ni as substitutive element of Co. Of course, further improvement of the effect can be expected by co-adding Fe and Ni together with Co. In the case that Fe and/or Ni are added in substitution of Co or with Co, those additions have the remarkable effect in economy because of decreasing of the expensive Co.
  • the relationship (Fe+Ni+Co)/Si in the first invention copper alloy is 0.005 to 0.5 (preferably 0.01 to 0.3, more preferably 0.002 to 0.2), and said relationship in the second invention copper alloy is 0.02 to 1.5 (preferably 0.04 to 1, more preferably 0.06 to 0.5), and said relationship in the third invention copper alloy is 0.005 to 0.4 (preferably 0.01 to 0.2, more preferably 0.02 to 0.15).
  • Fe and Ni can become substitutive elements with the same function as Co, the total content in the case that two or three elements selected from a group of Fe, Ni and Co are added must be equal to the content of the single addition of Co (the content of Co described above).
  • the upper limit of co-addition content of Fe, Ni and Co (total content) is permitted to be higher than the Co content by about 0.05 mass percent under consideration of the solid solution and precipitation. From said consideration, in the case that two or three elements selected from Fe, Ni and Co are co-added, it is desirable for the upper limit of total content (Fe+Ni+Co) to be set higher than the Co content by 0.05 mass percent.
  • this total content (Fe+Ni+Co) in the first and second invention copper alloys are 0.005 to 0.55 mass percent (more preferably 0.01 to 0.35 mass percent, much more preferably 0.02 to 0.25 mass percent), and it is desirable that said total content in the third invention copper alloy is 0.005 to 0.35 mass percent (preferably 0.01 to 0.25 mass percent, much more preferably 0.02 to 0.2 mass percent).
  • Sn shows the strength improvement function, grain refinement function and improvement function of stress relaxation characteristic, corrosion resistance and wear resistance, etc.
  • the Sn content is higher than 0.03 mass percent, and it is preferable to be higher than 0.05 mass percent.
  • the Sn content becomes higher than 1.5 mass percent or 1 mass percent in the first invention copper alloy used as the rolled stock or the third invention copper alloy used as wire drawing material, respectively, the bending characteristics decrease suddenly.
  • the Sn content in the first and third invention copper alloys is less than 1.5 mass percent and less than 1 mass percent, respectively. Additionally, in order to ensure enough the bending characteristics in both the first and third invention copper alloys, it is preferable for the Sn content to be less than 0.7 mass percent, and it is optimum to be less than 0.5 mass percent.
  • the second invention copper alloy which has lower minimum strength than the first and third invention copper alloys, it is preferable to try the strength improvement, grain refinement, improvement of stress relaxation characteristic, stress corrosion crack resistance, corrosion resistance and improvement of wear resistance, while considering the relation with Si content. Accordingly, it is necessary for the Sn content to be higher than 0.2 mass percent, and it is preferable to be higher than 1 mass percent and more preferable to be higher than 1.2 mass percent corresponding to required strength. However, when the Sn content exceeds 3 mass percent, the hot workability is obstructed, and then the bending characteristics become lower, too.
  • Sn content is less than 3 mass percent, and it is preferable to be less than 2.6 mass percent so as to ensure more satisfactory hot-workability and bending characteristics, and more preferable to be less than 2.5 mass percent.
  • the third invention copper alloy that Sn content is suppressed to a little amount slightly comparing with the first invention copper alloy, from the same reasons described above, it is necessary for Sn content to satisfy the relationship Si/Sn ⁇ 1. Furthermore, in order to ensure said ductility enough, it is preferable for the Sn content to satisfy the relationship Si/Sn ⁇ 1.5, and it is optimum to satisfy the relationship Si/Sn ⁇ 2.
  • At least one element selected from a group of P, Sb, As, Sr, Mg, Y. Cr, La, Ti, Mn, Zr, In and Hf is added according as the applications of said alloys, and the effects are mainly the grain refinement, improvement of hot workability, improvement of corrosion resistance, action making the accessory elements mixturing inevitably harmless and improvement of stress relaxation characteristic, etc.
  • Such effects are hardly expected in the case that the content of each element is less than 0.003 mass percent, and on the contrary the effects balanced with the additive quantity are not obtained in the case beyond 0.3 mass percent. Accordingly, the addition is useless in economy and rather loses the bending characteristics.
  • annealing is generally adopted for the heat treatment to obtain recrystallization materials (recrystallization treatment), where the annealing keep plastic working blank mentioned in said (1) the temperature of 200 to 600° C. for 20 minutes to 10 hours.
  • the heat treatment usually carried out by batch processing system, when the time of heat treatment is long, the grains recrystallized at the early stage of heat treatment gradually grow, and then there is possibility that the uniform grain refinement is obstructed, even if the effect of grain growth inhibition appears by the Co addition.
  • the grain refinement due to the recrystallization for both Co addition and no addition is preferably carried out by the growth inhibition of early recrystallized grains.
  • the recrystallization in many nucleation sites is realized by acting the large thermal energy almost simultaneously in a short time, because the time span generating the crystal growth is not given.
  • the crystalline structure of molding material are completely recrystallized by the heat treatment of said plastic working blank in the range from 450 to 750° C. for 1 to 1000 seconds.
  • first, second and third invention copper alloys are generally produced as the recrystallization materials of (1), cold working materials of (2) and manufacture pieces of (3)(4), and alloy characteristics such as strength are improved more by adding the following treatment in the manufacturing process.
  • a working rate in the cold working before obtaining the recrystallized materials is higher than 30 percent (preferably 60 percent)
  • the rolling or wire drawing rate of the cold working in the process obtaining the plastic working blank of (1) is higher than 30 percent (preferably 60 percent)
  • the strength improvement due to the grain refinement is effectively reached by promoting the refinement.
  • the nucleation sites are necessary.
  • the nucleation sites increase by the cold working with the higher working rate, and the increment rate of nucleation sites becomes large with increasing of working rate.
  • the recrystallization originates in releasing of strain energy, more fine grains are obtained by increasing of shearing strain through said cold working.
  • the plastic working blank performed the last recrystallization treatment has the small mean size of grains, and concretely the mean grain size is less than 20 ⁇ m (preferably less than 10 ⁇ m).
  • the mean grain size before recrystallization becomes small, the places causing the recrystallized nucleation in the following heat treatment increase, and in particular, when dislocation density at the grain boundaries becomes higher, it is easy to form nucleation sites.
  • the mean grain size of plastic working blank in (1) is determined from balance with said working rate.
  • the recrystallization materials lack the strength, this materials can obtain higher strength by performing the cold working or cold drawing with the working rate of 10 to 60 percent.
  • the rolling or wire drawing rate is set to be large (higher than 15 percent, preferably 25 percent).
  • the rolling or wire drawing rate is set to be large (higher than 15 percent, preferably 25 percent).
  • the more refinement of recrystallized grains can be realized by increment of the shearing strain and nucleation sites resulting from the cold working that the rolling and wire drawing rates are higher.
  • the rolling is carried out by using of the roll of small diameter or extremely large diameter, or if the wire drawing is carried out by wire dice with large dice angle or extremely small dice angle, the nucleation sites or the local distortion energy increases, so that the further refinement of recrystallized grain can be effectively realized.
  • the rolling is carried out by the rolling method with different peripheral speed, and in other words if the rolling is carried out varying the velocity by use of the rolling machine providing for top and bottom rolls having different diameters, the large shearing strain is given to the rolling material, so that the grain refinement can be reached.
  • the spring elastic limit and stress relaxation characteristic can be remarkably improved by performing the suitable heat treatment (generally annealing in range of 150 to 600° C. for 1 second to 4 hours) without recrystallization.
  • heat treatment is carried out for the cold working materials of (2) (including cold working materials in (4)) or the manufacture pieces of (3) (4), for instance, under the condition of 200° C. for 2 hours or 600° C. for 3 seconds.
  • the copper alloy of composition shown in tables 1 to 4 was dissolved in atmospheric air, and prism-shaped ingots of 35 mm in thickness, 80 mm in width and 200 mm in length were obtained. And intermediate plate materials of 6 mm in thickness were formed by hot rolling (four paths) of this ingot at 850° C., and the materials after acid cleaning became final plate materials of 1 mm in thickness by the cold rolling. Each final plate material was performed the heat treatment for one hour at temperature causing the recystallization of 100 percent (called “recrystallization temperature”), so that there were obtained the first invention copper alloy from No.101 to No.186 by performing complete recrystallization treatment of structure.
  • recrystallization temperature the recystallization temperature
  • the final plate materials of the same quality (same form, same composition) as composing materials of alloy No.102, No.107, No.111, No.154 and No.180 were obtained due to the same process described above, and these final plate materials were recrystallization-treated under condition different from said condition, so that there were obtained the first invention copper alloy No.102A, No.107A, No.111A, No.154A and No.180A with the same composition as No.102, No.107, No.111, No.152 and No.175, respectively.
  • the first invention copper alloy No.102A, No.107A, No.111 A, No.154A and No.180A were obtained by the recrystallization treatment (rapid heating treatment at higher temperature) in which the heating was maintained for a short time at much higher temperature than recrystallization temperature, where the temperature a (° C.) and heating time b (second) are shown as “a(b)” in the column titled “recrystallization temperature” in Tables 15 to 17.
  • “480(20)” in column of “recrystallization temperature” of No.102A in Table 15 means the heating at 480° C. for 20 seconds.
  • the copper alloy of composition shown in Tables 5 to 8 was dissolved in atmospheric air, and prism-shaped ingots of 35 mm in thickness, 80 mm in width and 200 mm in length were obtained. And intermediate plate materials of 6 mm in thickness are formed by hot rolling (four paths) of this ingot at 850° C., and the materials after acid cleaning became final plate materials of 1 mm in thickness by the cold rolling. Each final plate material was performed by the heat treatment (annealing) for one hour at temperature causing the recystallization of 100 percent (by recrystallized treatment), so that there were obtained the second invention copper alloy from No.201 to No.281. In addition, the recrystallization temperature was determined in advance by method similar to example 1 (refer Table 18 to 20).
  • the final plate materials of the same quality as composing materials of alloy No.202, No.209, No.250 and No.265 were obtained due to the same process described above, and these final plate materials were recrystallized by the above-described rapid heating treatment at higher temperature, so that there were obtained the second invention copper alloy No.202A, No.209A, No.250A and No.265A with the same composition as No.202, No.209, No.250 and No.265, respectively.
  • condition obtaining alloy No.202A, No.209A, No.250A and No.265A in the rapid heating treatment at high temperature (a(° C.) and heating time b (second)) is described as “a(b)” in column titled “recrystallization temperature” of Tables 18 to 20 by the same description as Tables 15 to 17.
  • the copper alloy of composition shown in Tables 9 to 12 was dissolved in atmospheric air, and column-shaped ingots of 95 mm in diameter and 180 mm in length were obtained. Round bars of 12 mm in diameter were obtained by extruding press (500 t) while heating the ingots at 780° C. This round bars after cleaning were worked by wire drawing into 8 mm in diameter, and after heat-treating the round bars for one hour at 500° C. and cleaning them, the wires of 4 mm in diameter (molding materials) were obtained by wire drawing.
  • each wire was heat-treated (annealing) for 1 hour at the temperature (recrystallization temperature) that recrystallization of 100 percent was realized (recrytallization treatment), and third invention copper alloys No.301 to 397 were obtained.
  • recrystallization treatment in advance, samples (wires of 20 mm in length (4 mm in diameter)) picked up from each wire were annealed for one hour at each temperature rising with spacing of 50° C. starting from 300° C., and the lowest temperature causing the complete recrystallization was found out, so that the lowest temperature was determined as said recrystallization temperature of the samples (refer to Tables 21 to 24).
  • the wires (molding materials) of the same quality as composing materials of alloy No.302, No.314 and No.338 were obtained due to the same process described above, and these wires were recrystallized by the above-described rapid heating treatment at higher temperature, so that there were obtained the third invention copper alloy No.302A, No.314A and No.338A with the same composition as No.302, No.314 and No.338, respectively.
  • condition obtaining alloy No.302A, No.314A and No.338A due to the rapid heating treatment at high temperature is described as “a(b)” in column titled “recrystallization temperature” of Tables 21 to 24 by the same descriptive method as Tables 15 to 17.
  • first comparative example alloys No.401 to No.422 shown in Table 13 were obtained on the basis of the same process as the first embodiment.
  • second comparative example alloys No.423 to No.431 shown in Table 14 were obtained due to the same process as third embodiment.
  • the first comparative example alloys No.401 to 407, respectively have the same compositions as C2100, C2200, C2300, C2400, C2600, C2680 and C4250 of Japanese Industrial Standards (JIS)
  • the second comparative example alloys No.423 and 424, respectively have the same compositions as C2600 and C2700 of JIS.
  • Tables 1 to 12 the expression of relationship “(Co+Fe+Ni)/Si” for alloy that contains only Co without Fe and Ni is replaced by “Co/Si”.
  • the mean grain size D ( ⁇ m) of recrystallized structures was measured on the basis of intercept method with the use of optical image (JIS-H0501). The results are shown in Tables 15 to 26.
  • the electric conductivity was measured in the first invention copper alloys of No.101 to No.186 and No.102A, 107A, 111A, 154A, 180A.
  • the results are shown in Tables 15 to 26 and Table 25.
  • the electric conductivity (% IACS) is defined by a percentage of the ratio of the volume specific resistance of international standard soft copper (17.241 ⁇ 10 ⁇ 9 ⁇ m) divided by that of said alloy.
  • the second invention copper alloys of No.201 to 281, No.202A, 209A, 250A, 265A and the first comparative example alloys of No. 401 to 422 were measured by tensile test using an Amsler-type universal testing machine.
  • post workpiece tensile strength and elongation of the rolling materials
  • the bending characteristics are evaluated from bending rate R/t at cracked moment (R: inside radius at bending positions). This cracking is suffered when the samples that are vertically cut from the worked pieces to the rolling direction are bend in W shape.
  • R inside radius at bending positions
  • This cracking is suffered when the samples that are vertically cut from the worked pieces to the rolling direction are bend in W shape.
  • testing of stress corrosion cracking is carried out by use of test container and testing liquid prescribed in JISH3250, and characteristics of stress corrosion cracking resistance are evaluated from the relationship between ammonia atmosphere exposure time and stress relaxation rate (stress of proof stress value 80% of the post workpiece is added on the surface of the post workpiece) by using the fluid which mixed ammonia fluid and water, where two quantities are equal.
  • stress relaxation rate stress of proof stress value 80% of the post workpiece is added on the surface of the post workpiece
  • Tables 15 to 20 and Table 25 the pieces that the stress relaxation rate is less than 20% in the exposure for 75 hours are indicated by a symbol ⁇ as superior bending characteristics.
  • the pieces that the stress relaxation rate is higher than 20% in the exposure for 75 hours but less than 20% in the exposure for 30 hours are indicated by a symbol ⁇ as superior bending characteristics (there is no problem in application).
  • the pieces that the stress relaxation rate is less than 20% in the exposure for 12 hours are indicated by a symbol ⁇ as general bending characteristics (there is problem in applications but it is possible to use).
  • the pieces that the stress relaxation rate is higher than 20% in the exposure for 12 hours are indicated by a symbol X as superior bending characteristics (it is difficult for applications to use).
  • the third invention copper alloys of No.301 to 397 and No.302A, 314A and 338A the second invention copper alloys of No.423 to 431 (except No.425, No.427 and No.431 of abandoned manufacture), tensile strength and elongation are determined from tensile testing with use of an Amsler-type universal testing machine.
  • each alloy is straightened to 0.7 mm in thickness, and tensile strength and elongation in the wire drawing material (called “post workpiece”) are determined by the same tensile testing as being described above. Additionally, evaluation of bending characteristics and testing of stress corrosion cracking are carried out. The results are shown in Tables 21 to 24 and Table 26.
  • the post workpieces are obtained by the wire drawing of the third invention copper alloys of No.301 to 397 and No.302A, 314A and 338A and the second invention copper alloys of No.201 to 281, No.202A, 209A, 250A and 265A, and it go without saying that the after working pieces are also the high strength copper alloy of the present invention.
  • the pieces that the cracking is caused in the exposure for 40 hours but is not caused in the exposure for 15 hours are indicated by a symbol ⁇ as preferable corrosion cracking resistance (there is no problem in application).
  • the pieces that the cracking is caused in the exposure for 15 hours but is not caused in the exposure for 6 hours are indicated by a symbol ⁇ as general corrosion cracking resistance (there is problem in applications but it is possible to use).
  • the pieces that the cracking is caused in the exposure for 6 hours are indicated by a symbol X as inferior stress corrosion cracking resistance (it is difficult to use in applications).
  • Em- 101 2.4 350 308 416 45 504 572 15 ⁇ ⁇ 16 bod- 102 2.2 350 312 481 44 575 676 11 ⁇ ⁇ 12 iment 102A 1.8 480(20) 367 493 45 602 691 12 ⁇ ⁇ 12 1 103 2.0 400 347 493 45 593 688 11 ⁇ ⁇ 12 104 2.0 400 339 491 44 592 685 11 ⁇ ⁇ 12 105 2.1 350 328 489 44 586 682 13 ⁇ ⁇ 12 106 2.1 350 331 488 45 584 683 12 ⁇ ⁇ 12 107 1.9 350 360 528 43 610 739 7 ⁇ ⁇ 10 107A 1.7 550(10) 403 542 44 627 751 8 ⁇ ⁇ 10 108 2.0 350 355 508 42 599
  • Embodiment 327 2.8 350 329 621 36 655 756 6 ⁇ ⁇ 13 3 328 2.8 350 341 536 35 697 792 6 ⁇ ⁇ 12 329 2.7 350 343 539 35 680 781 6 ⁇ ⁇ 12 330 2.7 350 348 545 32 693 800 5 ⁇ ⁇ 12 331 2.5 350 355 551 34 692 804 5 ⁇ ⁇ 12 332 2.4 350 348 543 35 698 802 8 ⁇ ⁇ 12 333 2.5 350 350 545 35 695 796 6 ⁇ ⁇ 13 334 2.6 350 381 557 33 710 818 5 ⁇ ⁇ 12 335 2.8 350 346 545 35 681 790 5 ⁇ ⁇ 11 336 2.8 350 363 556 31 688 806 4 ⁇ ⁇ 11 337 2.7
  • Embodiment 354 2.1 350 377 570 33 725 836 5 ⁇ ⁇ 12 3 355 2.1 350 381 572 34 722 836 5 ⁇ ⁇ 12 356 2.1 350 375 568 35 733 835 5 ⁇ ⁇ 12 357 1.8 350 417 610 31 767 885 4 ⁇ ⁇ 11 358 2.4 350 354 548 35 699 804 6 ⁇ ⁇ 12 359 2.3 350 364 560 34 727 823 6 ⁇ ⁇ 12 360 2.4 350 368 551 34 688 801 5 ⁇ ⁇ 12 361 2.4 350 385 556 34 706 811 6 ⁇ ⁇ 11 362 2.4 350 377 564 32 708 818 4 ⁇ ⁇ 11 363 2.3 350 351 545 34 695 790 6 ⁇ ⁇ 12 3
  • Embodiment 382 2.5 350 350 545 34 892 791 6 ⁇ ⁇ 12 3 383 2.5 350 345 539 36 684 782 6 ⁇ ⁇ 12 384 2.1 350 389 585 34 737 859 5 ⁇ ⁇ 11 385 2.3 350 354 547 36 698 803 6 ⁇ ⁇ 12 386 2.4 350 359 556 35 698 806 6 ⁇ ⁇ 12 387 2.4 350 368 562 34 715 829 6 ⁇ ⁇ 12 388 3.0 300 338 530 35 681 770 6 ⁇ ⁇ 12 389 2.9 300 342 545 35 675 775 6 ⁇ ⁇ 12 390 2.7 350 333 527 34 668 760 6 ⁇ ⁇ 13 391 2.3 350 372 572 32 720 825 5 ⁇ ⁇ 12 392

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Abstract

The present invention is a high strength copper alloy that is superior to mechanical properties, workability, corrosion resistance and economy. The present invention discloses high strength copper alloy characterized in that said copper alloy consists essentially of 4 to 19 mass percent of Zn, 0.5 to 2.5 mass percent of Si and the remaining mass percent of Cu, wherein said mass percent of Zn and said mass percent of Si satisfy the relationship Zn-2.5.Si=0 to 15 mass percent; mean grain size D of crystalline structure of said copper alloy distributes in 0.3 μm≦D≦3.5 μm; and 0.2% yield strength in recrystallization state of said copper alloy is higher than 250 N/mm2.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates to the high strength copper alloy suitable for materials comprising leads, switches, connectors, relays and sliding pieces etc. which are parts of electrical devices, electronic devices, communication equipments, information appliances, measuring instruments, automobiles and so on. [0002]
  • 2. Prior Art [0003]
  • In general, high strength copper alloys are used as materials comprising leads, switches, connectors, relays and sliding pieces etc., which are used as parts of electrical devices, electronic devices, and communication devices, information appliances, measuring instruments, automobiles, and so on. Recently, their devices have been improved toward miniaturization, lightweighting, and higher efficiency, so that there are extremely severe demands for the improvements of characteristics of the materials. For example, the extremely thin plates are employed for the spring contact member of the connector. The higher strength is required for the high strength copper alloy comprising said extremely thin plates in order to thin the plate still more. It is also demanded for the high strength copper alloy to have higher balance between the strength and ductility including the bending characteristics, superiority in productivity and economy without problems of conductivity, stress relaxation characteristic, soldering characteristics, abrasion resistance, and corrosion resistance such as stress corrosion cracking resistance, dezincification corrosion resistance and migration resistance. [0004]
  • Incidentally, beryllium copper, titanium copper, aluminum bronze, phosphor bronze, nickel silver, brass and brass doped with Sn or Ni are generally well-known for the high strength copper alloys. However, there are following problems for these high strength copper alloys, so that it was impossible to satisfy the above demands. [0005]
  • The beryllium copper has the highest strength in the copper alloys, but the beryllium is extremely harmful to the humans: in particular the beryllium vapor in fusion state is significantly dangerous for the humans even in a very small amount, so that initial cost of melting arrangement becomes extremely expensive because of difficulty in disposal processes, particularly in a firing treatment of the beryllium copper materials or their products. Therefore, the melting process becomes necessary at the last step of manufacturing to obtain the predetermined characteristics, and then the problems appear in economy including the manufacturing cost. [0006]
  • In addition, the titanium copper shows the higher strength to next to beryllium copper, but the expensive melting arrangement is required because titanium is active element, and hence it becomes difficult to keep quality and yield in the melting. As well as the beryllium copper, since the melting process becomes necessary at the last step of manufacturing, the problems in economy appear. [0007]
  • For the aluminum bronze, it is difficult to obtain pure ingots because aluminum is an active element, and furthermore the aluminum bronze has the lower soldering characteristics. [0008]
  • Moreover, as the phosphor bronze and the nickel silver have the lower hot workability, it is difficult to produce them by hot rolling. Their alloys are usually produced with horizontal continuous casting. Consequently, their alloys are inferior in the productivity, the yield and the energy cost. Additionally, as to a spring phosphor-bronze and a spring nickel-silver which are representative copper alloys with high strength, problems in economy appear because expensive Sn and Ni are abundantly contained in the two alloys. [0009]
  • The brass or brass doped with Si and Ni is inexpensive, but there are problems with respect to the corrosion resistance such as the stress corrosion cracking and dezincification, and then they are unsuitable for the parts to realize miniaturization and higher efficiency. [0010]
  • As a result, these conventional high strength copper alloys are not satisfied as the parts used in the various devices with tendency toward miniaturization, lightweighting and higher efficiency, so that the development of a new high strength copper alloy is demanded greatly. [0011]
  • SUMMARY OF THE INVENTION
  • Present inventors have paid their attention to the Hall-Petch relationship (E. O. Hall, Proc. Phys. Soc. London. 64 (1951) 747. and N. J. Petch, J. Iron Steel Inst. 174 (1953) 25.) that 0.2% proof stress is proportional to grain size (D[0012] −1/2), where said 0.2% proof stress is defined by the strength that permanent strain becomes 0.2%, and said 0.2% proof stress is sometimes abbreviated as “proof stress”. The present inventors have considered that the high strength copper alloys satisfying the demands of said epoch can be obtained by grain refinement, and then several investigations and experiments have been performed on the grain refinement. From their results, it is found that the micronization for the crystal grain (grain refinement) of the copper alloys is realized by selecting suitably additive elements in the recrystallization. It is recognized that the strength including mainly the 0.2% proof stress is improved remarkably by making the crystal grain size smaller than a certain size and its strength also increases with decreasing of the grain size. Furthermore, from the results of various experiments with respect to influence of the additive elements for micronization of the grain size, it is clarified that addition of Si to Cu—Zn alloy increases the number of nucleation sites and addition of Co to Cu—Zn—Si alloy suppresses the grain growth. This means that Cu—Zn—Si or Cu—Zn—Si—Co alloy system with fine grains is obtained by exploiting their effects. In other words, the increase of nucleation sites is considered to be due to decreasing of stacking fault energy based on the addition of Si, and the suppression of the grain growth is considered to be due to the formation of fine precipitates based on the addition of Co.
  • The present invention is completed based upon these investigated results and relates to new high strength copper alloy superior in mechanical properties, workability and corrosion resistance without problems in economy. In particular the invention is suitable for materials of the parts composing several devices in tendency of miniaturization, lightweighting and higher efficiency. Accordingly, it is the object of the present invention to provide new high strength copper alloy that is extensively applied and extremely rich in utility. [0013]
  • Namely, it is mainly first object of the present invention to provide the high strength copper alloy (called “first invention copper alloy”) suitable for rolled stocks (plates, rods and wires etc.) required high strength, or the work piece of rolled stock (press-forming product and bending product etc.), and this alloy is in the following. In addition, as parts and products suitably manufactured by use of first invention copper alloy, there are the portable or miniature communication equipments which are required thinization (to thin the plate still more) and lightweighting, electronic device parts used for personal computer, medical care instrument parts, accessory parts, machine parts, tubes or plates of heat exchanger, cooling instruments using sea water, parts composing inlet or outlet of sea water in small size ship, wiring tool parts, various instrument parts for automobile, measuring-instrument parts, play tools and daily necessities and so on. There are concretely connectors, relays, switches, sockets, springs, gears, pins, washers, coins for play, keys, tumblers, buttons, hooks, braces, diaphragms, bellows, sliding pieces, bearings, sliding pieces adjusting sound volume, bushes, fuse grips, lead frames and gauge board and so on. [0014]
  • It is mainly second object of the present invention to provide the high strength copper alloy (called “second invention copper alloy”) suitable for rolled stocks (plates, rods and wires etc.) required highly balanced strength and electric conductivity, or the work piece of rolled stock (press-forming product and bending product etc.), where the strength required for first invention copper alloy is not needed. In addition, as parts and products suitably manufactured by use of second invention copper alloy, there are electronic device parts required electric conductivity, measuring-instrument parts, household electric appliance parts, tubes or plates of heat exchanger, cooling instruments using sea water, parts composing inlet or outlet of sea water in small size ship, machine parts, play tools and daily necessities and so on. There are concretely connectors, switches, relays, bushes, fuse grips, lead frames, wiring instruments, keys, tumblers, buttons, hooks, braces, diaphragms, bellows, sliding pieces, bearings, coins for play, and so on. [0015]
  • Furthermore, it is mainly third object of the present invention to provide the high strength copper alloy (called “third invention copper alloy”) suitable for wire drawing materials [general wire material of round cross section and deformed wire material such as rectangle cross section (square etc.), polygon cross section (hexagon etc.) and so on] or the workpiece of wire drawing materials (bending product etc.), where the strength required for first invention copper alloy is needed. In addition, as parts and products suitably manufactured by use of third invention copper alloy, there are electronic device parts, parts for construction, accessory parts, machine parts, play tools, various instrument parts for automobile, measuring-instrument parts, electronic device parts and electrical device parts. There are concretely connectors, keys, header members, nails (nails for play instrument), washers, pins, screws, coiled springs, lead screws, shafts of copying machines etc., wire gauzes (wire gauze for culture or filter for inlet and outlet of seawater used in seawater cooling equipment and small ship etc.), sliding pieces, bearings, bolts and so on. [0016]
  • The first invention copper alloy consists essentially of 4 to 19 mass percent (preferably 6 to 15 mass percent, more preferably 7 to 13 mass percent) of Zn, 0.5 to 2.5 mass percent (preferably 0.9 to 2.3 mass percent, more preferably 1.3 to 2.2 mass percent)of Si and the remaining mass percent of Cu, wherein said mass percent of Zn and said mass percent of Si satisfy the relationship Zn-2.5.Si=0 to 15 mass percent (preferably 1 to 12 mass percent, more preferably 2 to 9 mass percent); mean grain size D of crystalline structure of said copper alloy distributes in 0.3 μm≦D≦3.5 μm (preferably 0.3 μm≦D≦2.5 μm, more preferably 0.3 μm≦D≦2 μm); and 0.2% proof stress in recrystallization state of said copper alloy is higher than 250 N/mm[0017] 2 (preferably higher than 300 N/mm2).
  • In addition, the second invention copper alloy consists essentially of 4 to 17 mass percent (preferably 5 to 13 mass percent, more preferably 6 to 11.5 mass percent) of Zn, 0.1 to 0.8 mass percent (preferably 0.2 to 0.6 mass percent, more preferably 0.2 to 0.5 mass percent) of Si and the remaining mass percent of Cu, wherein said mass percent of Zn and said mass percent of Si satisfy the relationship Zn-2.5.Si=2 to 15 mass percent (preferably 4 to 12 mass percent, more preferably 5 to 10 mass percent); mean grain size D of crystalline structure of said copper alloy distributes in 0.3 μm≦D≦3.5 μm (preferably 0.3 μm≦D≦3 μm, more preferably 0.3 μm≦D≦2.5 μm); and 0.2% proof stress in recrystallization state of said copper alloy is higher than 250 N/mm[0018] 2 (preferably higher than 300 N/mm2).
  • Furthermore, the third invention copper alloy consists essentially of 66 to 76 mass percent (preferably 68 to 75.5 mass percent) of Cu, 21 to 33 mass percent (preferably 22 to 31 mass percent) of Zn and 0.5 to 2 mass percent (preferably 0.8 to 1.8 mass percent, more preferably 1 to 1.7 mass percent) of Si, wherein said mass percent of Cu, said mass percent of Zn and said mass percent of Si satisfy the relationships Cu-5.Si=62 to 67 (preferably Cu-5.Si=63 to 66.5 mass percent) and Zn+6.Si=32 to 38 (preferably Zn+6.Si=33 to 37 mass percent); mean grain size D of crystalline structure of said copper alloy distributes in 0.3 μm≦D≦3.5 μm(preferably 0.3 μm≦D≦3 μm, more preferably 0.3 μm≦D≦2.5 μm); and 0.2% proof stress in recrystallization state of said copper alloy is higher than 250 N/mm[0019] 2 (preferably higher than 300 N/mm2).
  • In order to obtain said each invention copper alloy, there are some cases receiving a plurality of recrystallization treatments in which a part or all of the alloy structure is recrystallized by the heat treatment. In such cases, said mean grain size D and said 0.2% proof stress in copper alloy are determined from said two physical quantities of the materials (called “recrystallization materials”) obtained from the recrystallization treatment performed at last (called “last recrystallization treatment”). In the case that said recrystallization treatment is performed only once, it goes without saying that the recrystallization treatment is the last recrystallization treatment and the treated materials are the recrystallization materials.[0020]
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Each invention copper alloy is provided with any form shown in the following preferred embodiments. [0021]
  • Embodiment 1
  • Ingots are worked into plastic working blanks with predetermined forms by the plastic working including the hot working (rolling, extruding and forging etc.) and/or the cold working (rolling and wire drawing etc.). The plastic working blanks receive the recrystallization treatment (last recrystallization treatment) based upon heat treatment (annealing etc.) in the range of the recrystallization temperature, and then become the recrystallization materials. The recrystallization materials are rolled stocks in first and second invention copper alloys, and wire drawing materials in third invention copper alloy. [0022]
  • Embodiment 2
  • The recrystallization materials of said embodiment 1 are worked into the cold working materials with predetermined forms according to cold working (rolling, wire drawing and forging). The cold working materials are rolled stocks in first and second invention copper alloys, and wire drawing materials in third invention copper alloy. [0023]
  • Embodiment 3
  • The recrystallization materials of said embodiment 1 are worked into manufacture pieces with predetermined forms according to press working or bending etc. [0024]
  • Embodiment 4
  • The cold working materials of said embodiment 2 are worked into manufacture pieces with predetermined forms according to press working or bending etc. [0025]
  • In order to improve the property of first invention copper alloy, it is desired for the copper alloy composition to contain 0.005 to 0.5 mass percent (preferably 0.01 to 0.3 mass percent, more preferably 0.02 to 0.2 mass percent) of Co and/or 0.03 to 1.5 mass percent (preferably 0.05 to 0.7 mass percent, more preferably 0.05 to 0.5 mass percent) of Sn. [0026]
  • In this case, the contents of Co and Sn are determined from said each range under consideration of the content of Si. In other words, the content of Co is determined to satisfy the relationship Co/Si=0.05 to 0.5 (preferably Co/Si=0.01 to 0.3, more preferably Co/Si=0.03 to 0.2), wherein the value of Co content divided by Si content is defined by Co/Si. Additionally, the content of Sn is determined to satisfy the relationship Si/Sn≧1.5 (preferably Si/Sn≧2, more preferably Si/Sn≧3), wherein the value of Si content divided by Sn content is defined by Si/Sn. [0027]
  • In first invention copper alloy, it is possible for the copper alloy composition to contain 0.005 to 0.3 mass percent (preferably 0.01 to 0.2 mass percent) of Fe and/or 0.005 to 0.3 mass percent (preferably 0.01 to 0.2 mass percent) of Ni in substitution for Co or together with Co. [0028]
  • For said composition, the content of Fe or Ni is determined under consideration of the content of Si. In the case added with Co, the contents of Si and Co are considered. Namely, the content of Fe or Ni is determined to satisfy the relationship (Fe+Ni+Co)/Si=0.005 to 0.5 (preferably (Fe+Ni+Co)/Si=0.01 to 0.3, more preferably (Fe+Ni+Co)/Si=0.03 to 0.2), wherein the value of total contents containing Co divided by Si content is defined by (Fe+Ni+Co)/Si. It is desirable for such determination that said total content (Fe+Ni+Co) is adjusted to be 0.005 to 0.55 mass percent (more preferably 0.01 to 0.35 mass percent, much more preferably 0.02 to 0.2 mass percent). [0029]
  • In order to improve the characteristics more in second invention copper alloy, it is preferable to contain Co of 0.005 to 0.5 mass percent (preferably 0.01 to 0.3 mass percent, more preferably 0.02 to 0.2 mass percent) and/or Sn of 0.2 to 3 mass percent (preferably 1 to 2.6 mass percent, more preferably 1.2 to 2.5 mass percent) in alloy composition. In this case, the contents of Co and Sn are determined by considering the relation to Si content. In other words, the content of Co is determined to satisfy the relationship Co/Si=0.02 to 1.5 (preferably Co/Si=0.04 to 1, more preferably Co/Si=0.06 to 0.5) in the range described above. In addition, the content of Sn is determined to satisfy the relationship Si/Sn≦0.5 (preferably Si/Sn≦0.4, more preferably Si/Sn≦0.3) in the range described above. [0030]
  • In second invention copper alloy, it is possible to contain Fe of 0.005 to 0.3 mass percent (preferably 0.01 to 0.2 mass percent) and/or Ni of 0.005 to 0.3 mass percent (preferably 0.01 to 0.2 mass percent) in substitution for Co or together with Co. In this case, the content of Fe or Ni is determined by considering the content of Si (or both contents of Si and Co in case of co-adding Co). In other words, the contents of Fe and Ni are determined to satisfy the relationship (Fe+Ni+Co)/Si=0.02 to 1.5 (preferably (Fe+Ni+Co)/Si=0.04 to 1, more preferably (Fe+Ni+Co)/Si=0.06 to 0.5). It is desirable for such determination that said total content (Fe+Ni+Co) is adjusted to be 0.005 to 0.55 mass percent (preferably 0.01 to 0.35 mass percent, more preferably 0.02 to 0.25 mass percent). [0031]
  • Furthermore, for the first and second invention copper alloys, it is possible to contain at least one element selected from a group of P, Sb, As, Sr, Mg, Y, Cr, La, Ti, Mn, Zr, In and Hf corresponding to characteristics required in their applications. The contents of these elements are determined appropriately in the range of 0.003 to 0.3 mass percent. [0032]
  • In order to improve the characteristics of third invention copper alloy, it is preferable to contain Co of 0.005 to 0.3 mass percent (preferably 0.01 to 0.2 mass percent, more preferably 0.02 to 0.15 mass percent) and/or Sn of 0.03 to 1 mass percent (preferably 0.05 to 0.7 mass percent, more preferably 0.05 to 0.5 mass percent) in alloy composition. [0033]
  • In this case, the contents of Co and Sn are determined by considering the content of Si in above range. In other words, the content of Co is determined to satisfy the relationship Co/Si=0.005 to 0.4 (preferably Co/Si=0.01 to 0.2, more preferably Co/Si=0.02 to 0.15). In addition, the content of Sn is determined to satisfy the relationship Si/Sn≧1 (preferably Si/Sn≧1.5, more preferably Si/Sn≧2). [0034]
  • For the third invention copper alloy, it is possible to contain Fe of 0.005 to 0.3 mass percent (preferably 0.01 to 0.2 mass percent) and/or Ni of 0.005 to 0.3 mass percent (preferably 0.01 to 0.2 mass percent) in substitution for Co or together with Co. [0035]
  • In this case, the content of Fe or Ni is determined by considering the content of Si (or both contents of Si and Co in case of co-adding Co). In other words, the contents of Fe and Ni are determined to satisfy the relationship (Fe+Ni+Co)/Si=0.005 to 0.4 (preferably (Fe+Ni+Co)/Si=0.01 to 0.2, more preferably (Fe+Ni+Co)/Si=0.02 to 0.15). It is desirable for such determination that said total content (Fe+Ni+Co) is adjusted to be 0.005 to 0.35 mass percent (more preferably 0.01 to 0.25 mass percent, much more preferably 0.02 to 0.2 mass percent). [0036]
  • Furthermore, in alloy composition for third invention copper alloy, it is possible to contain at least one element selected from a group of P, Sb, As, Sr, Mg, Y, Cr, La, Ti, Mn, Zr, In and Hf corresponding to characteristics required in their applications, where each content of P, Sb, or As is 0.005 to 0.3 mass percent and each content of Sr, Mg, Y, Cr, La, Ti, Mn, Zr, In or Hf is 0.003 to 0.3 mass percent, and the total content in cases selecting at least one element from P, Sb and As is 0.005 to 0.25 mass percent. [0037]
  • By the way, the strength, particularly the 0.2% proof stress, is enhanced by the grain (recrystallized grain) refinement. The present inventors have confirmed experimentally that the 0.2% proof stress is enhanced remarkably for the mean grain size less than 3.5 μm in comparison with the case larger than 3.5 μm. In addition, by reducing gradually the mean grain size D from 3.5 μm, it is identified that the enhanced ratio of the proof stress increase rapidly at 3, 2.5 and 2 μm. From such experimental results, it is found that the proof stress (generally higher than 250 N/mm[0038] 2, preferably higher than 300 N/mm2) required for the parts of the electrical devices, electronic devices, communication equipments and measuring instruments is ensured in the mean grain size D less than 3.5 μm. In the case demanding high strength (the proof stress), it is preferable for mean grain size D to be less than 3.0 cm, and in the case demanding higher strength, it is preferable to be less than 2.5 μm. In order to improve rapidly the strength in the possible range, it is preferable for mean grain size D to be less than 2 μm. On the other hand, although the proof stress is improved with decrease of the mean grain size D, it is predictably difficult to obtain practically grains less than 0.3 μm because the smallest grain size confirmed by the experiments is 0.3 μm.
  • From such points, in order to ensure the proof stress higher than 250 N/mm[0039] 2 (preferably higher than 300 N/mm2) in the first, second and third invention copper alloys, the recrystallized structure of 0.3 μm≦D≦3.5 mm is required. In other words, it is necessary that the mean grain size D in the recrystallization state (state after the last recrystallization treatment) distributes in 0.3 μm≦D≦3.5 μm and 0.2% proof stress is higher than 250 N/mm2. In the case demanding the higher strength for the second and third invention copper alloys, it is preferable to distribute in 0.3 μm≦D≦3 μm, and more preferable to distribute in 0.3 μm≦D≦2.5 μm. On the other hand, in the first invention copper alloy required sometimes the strength higher than the second and third invention copper alloys, it is preferable to distribute in 0.3 μm≦D≦2.5 μm, and more preferable to distribute in 0.3 μm≦D≦2 μm.
  • Additionally, in the first to third invention copper alloys of which grain refinement is realized by recrystallization due to the suitable heat-treatment (generally annealing), such grain refinement becomes possible in alloy composition described above. [0040]
  • Namely, in the first to third invention copper alloys, Zn and Si cause the stacking fault energy to decrease, the dislocation density to increase, and the nucleus sites of recrystallized grain generation to increase. The functions which contributes to the grain refinement and the material strengthening due to solid solution into the Cu matrix (both functions are called “grain refinement and strengthening” as following) are given, and the contents of those elements are determined by said ranges as mentioned below. In other words, for first and second invention copper alloys used mainly as the rolled stocks or the manufacture pieces, when the functions of grain refinement and strengthening due to the addition of Zn appear enough, the content of Zn is more than 4 mass percent, and in order to improve largely the strength in first invention copper alloy, it is required that the content is more than 6 mass percent (preferably higher than 7 mass percent). For second invention copper alloy of which strength is allowed to be inferior to the first invention, it is preferable that the content is more than 5 mass percent (more preferably higher than 6 mass percent). On the other hand, when the content of Zn becomes excessively, the sensitivity of the stress-corrosion cracking increases and the bending characteristic deteriorates. Accordingly, when the relation of the content of Si for the applications of the rolled stock and the inhibition function of the stress corrosion cracking is taken into consideration, the content of Zn in the first invention copper alloy is less than 19 mass percent (preferably less than 15 mass percent, more preferably less than 13 mass percent), and the content in the second invention copper alloy is less than 17 mass percent (preferably less than 13 mass percent, more preferably less than 11.5 mass percent). [0041]
  • On the other hand, although the grain refinement and strengthening functions due to addition of Si appear remarkably in pretty little quantity comparing with Zn, the functions are caused by interaction with Zn. In addition, Si improves the characteristics of the stress-corrosion cracking by co-addition of Zn. However, the surplus addition of Si decreases the electric conductivity of this alloy. When these points are taken into consideration, it is required that the content of Si is higher than 0.5 mass percent for first invention copper alloy which accomplishes the strength improvement and grain refinement. The more or much more preferable content is more than 0.9 or 1.3 mass percent, respectively. However, the electric conductivity, hot workability and cold workability in first invention copper alloy are decreased by the Si content (also called the content of Si) in excess over 2.5 mass percent, and in order to keep those characteristics enough, it is preferable that the Si content is less than 2.3 mass percent, and the more preferable content is less than 2.2 mass percent. On the other hand, in second invention copper alloy that thinks the balance between the strength and the electric conductivity important, in order to realize the grain-refinement effect required for the predetermined strength, the Si content of 0.1 mass percent at least is necessary, and it is preferable to be higher than 0.2 mass percent. However, in order to ensure the predetermined electric conductivity considering balance with strength, it is required that the Si content is less than 0.8 mass percent, and in order to ensure the electric conductivity enough to be used for the applications, it is preferable to be less than 0.6 mass percent (more preferably less than 0.5 mass percent). [0042]
  • Furthermore, in first and second invention copper alloys, it is necessary that balance among the effect of grain refinement, stress-corrosion cracking characteristics and the strength is kept by the co-addition of Zn and Si, but it is unsuitable in these alloys to determine independently the individual content in said range. Accordingly, it is necessary that the relation of the Zn and Si contents is specified by the relationship Zn-2.5.Si and the values of this formulae are determined to be in above predetermined range. In order to obtain the predetermined strength based upon the grain refinement, it is necessary for first invention copper alloy to satisfy the relationship Zn-2.5.Si≧0 mass percent, and the preferable relationship is Zn-2.5.Si≧1 mass percent (more preferably Zn-2.5.Si≧2 mass percent ), and it is necessary for second invention copper alloy to satisfy the relationship Zn-2.5.Si≧2 mass percent, and the preferable relationship is Zn-2.5.Si≧4 mass percent (more preferably Zn-2.5.Si≧5 mass percent ). On the other hand, in any of first and second invention copper alloys, it is necessary to satisfy the relationship Zn-2.5.Si≧15 mass percent because the stress corrosion cracking arises remarkably for Zn-2.5.Si>15 mass percent. In order to inhibit effectively the stress corrosion cracking, it is preferable to satisfy the relationship Zn-2.5.Si≦12 mass percent (more preferably Zn-2.5.Si≦9 mass percent for first invention copper alloy, and Zn-2.5.Si≦10 mass percent for second invention copper alloy). [0043]
  • In addition, for the Zn content in third invention copper alloy, the grain refinement and strength are rightly considered as well as first and second invention copper alloys. Furthermore, since the third invention copper alloy is mainly used as wire drawing material and its manufactured piece, the Zn content should be determined in consideration of hot extruding characteristics, so that the Zn content is set to be abundantly in comparison with first and second invention copper alloys. In order to ensure the hot extruding characteristics enough, it is necessary for Zn content to be higher than 21 mass percent. It is more preferable for Zn content to be higher than 22 mass percent so that hot extruding-wire drawing can be kept more excellent. Although the characteristics of stress-corrosion cracking resistance of third invention copper alloy is inferior in comparison with first and second invention copper alloys, this characteristics can be satisfied enough for use of wire etc. because Zn content is a little in comparison with general Cu—Zn system alloy (for example, JIS-C2700 (65Cu-35Zn)). However, in order to ensure enough the stress-corrosion cracking resistance and cold workability, it is required that Zn content of third invention copper alloy is lower than 33 mass percent. In other words, when Zn content is higher than 33 mass percent, β and γ phases are easy to remain and give a wrong influence upon the cold workability. Furthermore, the stress corrosion cracking resistance and dezincification corrosion become also problems. In order to carry out the hot extrusion-wire drawing well while the stress corrosion cracking resistance and the cold workability are ensured, it is preferable for Zn content to be less than 31 mass percent. In order to ensure the hot extrusion characteristics and the cold workability, it is necessary in third invention copper alloy to consider the Cu content, and the β and γ phases are easy to remain when the Cu content is less than 66 mass percent. On the other hand, when the content is higher than 76 mass percent, it gets difficult to perform the hot extrusion. Therefore, it is necessary for the Cu content to be 66 to 76 mass percent. Furthermore, in order to ensure the cold workability and the hot extrusion characteristics enough, it is preferable to be 68 to 75.5 mass percent. [0044]
  • In addition, as mentioned above, Si shows the grain refinement, strength improvement and inhibition function of stress-corrosion cracking by adding together with Zn. Accordingly, in the case that the grain refinement and strength improvement are the principal object of third invention copper alloy used as wire drawing material, it is necessary for the content of Si to be higher than 0.5 mass percent as well as first invention copper alloy. Considering that said copper alloy is utilized as wire drawing material, it is preferable to be higher than 0.8 mass percent and the most preferable to be higher than 1 mass percent. However, when the Si content becomes higher than 2 mass percent, the γ or β phase which is a factor obstructing cold workability precipitate. Therefore, it is required to be less than 2 mass percent so that the cold workability is ensured, and if considering that plenty of Zn is added, it is preferable to be less than 1.8 mass percent, and more preferable to be less than 1.7 mass percent. [0045]
  • Furthermore, in order to ensure the hot extrusion characteristics, cold workability and stress corrosion cracking resistance in third invention copper alloy, it is unsuitable that the individual contents of Cu, Si and Zn are determined independently. Namely, it is necessary that the contents of Cu, Si and Zn are determined so as to satisfy the relationship Cu-5.Si=62 to 67 mass percent and Zn-6.Si=32 to 38 mass percent. In other words, even though the contents of Cu, Si and Zn are in said range, the preferable hot workability can not be ensured when the contents of Cu, Si and Zn satisfy the relationships Cu-5.Si>67 mass percent or Zn+6.Si<32 mass percent. On the other hands, when Cu-5.Si<62 mass percent or Zn+6.Si>38, the cold workability worsens because concentrations of Zn and Si at grain boundary become higher, and β and γ phases became easy to remain. Additionally, it becomes easy for the stress corrosion cracking to appear, and for some applications, problems of dezincification corrosion are also caused easily. In order to ensure enough the cold workability and stress-corrosion cracking resistance without these problems, it is preferable that the contents of Cu, Si and Zn are determined to satisfy the relationships Cu-5.Si=63 to 66.5 mass percent and Zn+6.Si=33 to 37 mass percent. [0046]
  • Incidentally, the grains grow with the rise of temperature or with time, and then in the recrystallization process, the whole of grains does not recrystallize at the same time and the parts easy to recrystallize start to recrystallize at first and a long time becomes necessary until its recrystallization finish in all structures. Therefore, the crystal grains recrystallizing at the initial stage of the recrystalization process continue to grow till the recrystallization process finishes, and then the crystal grains become considerably large at the time point that all structures have recrystallized completely. Consequently, it is preferable to inhibit growth of recrystallized grains in the recrystallization, so that the fine recrystallized grains distribute uniformly in all structures. Co has a function inhibiting growth of the recrystallized grains, and this is the reason of Co addition in first to third invention copper alloys. In other words, Co combines with Si, and the growth of crystal grains is suppressed by forming fine precipitates (Co2Si of about 0.01 μm, etc.). In order that the Co shows the function inhibiting the growth of crystal grain, it is necessary for the Co content to be higher than 0.005 mass percent. All of the added Co is not concerned with formation of said precipitate but the solid solution part of Co improves the heat resistance of matrix and stress relaxation characteristic. Accordingly, in order that such functions improving stress relaxation characteristic and heat resistance are shown enough, it is preferable for all copper alloys of first to third inventions to be higher than 0.01 mass percent, and it is more preferable to be higher than 0.02 mass percent. On the other hands, when the Co addition becomes higher than 0.5 mass percent or 0.3 mass percent in the first and second invention copper alloys, and the third invention copper alloy, respectively, it is difficult to improve still more the effect of grain-growth inhibition and the improvement effect of stress relaxation characteristic needed in applications because of those saturation, and then it is useless economically. Furthermore, there is a possibility that such additions lower the bending characteristics because of enlarging of precipitating particle and increasing of precipitating amount. Therefore, it is necessary for content of Co in the first and second invention copper alloys to be lower than 0.5 mass percent and for content of Co in the third invention copper alloy to be lower than 0.3 mass percent. However, in order to show effectively said functions and to ensure bending characteristics enough, it is preferable that the contents of Co in the first and second invention copper alloys become less than 0.3 mass percent, and it is more preferable that the contents become less than 0.2 mass percent. From the same reasons, it is preferable that the content of Co in the third invention copper alloy becomes less than 0.2 mass percent, and it is more preferable that the content becomes less than 0.15 mass percent. [0047]
  • In addition, since Co have the close relation with Si in the grain refinement, the content of Co needs to be determined from relation to the content of Si. For the grain refinement with purpose of strength improvement required in applications, it is necessary that the ratio Co/Si in the first and third invention copper alloys is determined to be higher than 0.005 mass percent and the ratio Co/Si in the second invention copper alloy is determined to be higher than 0.02. In other words, when Co/Si dose not reach these values, there is a little formation of said precipitate and the effect of grain-growth inhibition are not shown, and then it is difficult to obtain the strength needed in applications of said invention copper alloys. Furthermore, in order to show the growth inhibition effect of crystal grain enough and improve the strength more, in the first and third invention copper alloys, it is preferable that Co/Si is higher than 0.01 and more preferable that Co/Si is high than 0.02 mass percent. In addition, the preferable and more preferable values in the second invention copper alloy are higher than 0.04 and 0.06, respectively. [0048]
  • As described above, in the relation to Si content, Co content must be determined to satisfy the ratio Co/Si which becomes higher than the predetermined values, and since said precipitate becomes rough and increases, the bending characteristics are obstructed. For example, when Co/Si in the first invention copper alloy used as the rolled stock becomes higher than 0.5 or Co/Si in the third invention copper alloy used as the wire drawing material or the manufactured piece becomes higher than 0.4, the bending characteristics decreases suddenly. Additionally, even in the second invention copper alloy whose strength has not to satisfy the strength condition required in the first invention copper alloy, when Co/Si exceeds 1.5, it becomes difficult to ensure the minimum condition required for the bending characteristics. Therefore, the upper limit of Co/Si must be determined by comparing said point with the effect of grain growth inhibition, taking the applications, worked history and shapes into consideration in this invention copper alloy. Concretely, the range of Co/Si is determined as follows. In other words, it is necessary that the upper limit of Co/Si in the first invention copper alloy satisfies the relationship Co/Si≦0.5, and the preferable and optimum relationships are Co/Si≦0.3 and Co/Si≦0.2, respectively. In addition, in the second invention copper alloy, it is necessary to satisfy the relationship Co/Si≦1.5, and the preferable and optimum relationships are Co/Si≦1 and Co/Si≦0.5, respectively. Furthermore, in the third invention copper alloy, it is necessary to satisfy the relationship Co/Si≦0.4, and the preferable and optimum relationships are Co/Si≦0.2 and Co/Si≦0.15, respectively. [0049]
  • Fe and Ni show the same effect inhibiting crystal grain as Co (exactly, its effect due to Fe, Ni is less than or equal to the effect of Co). Therefore, it is possible to contain Fe, Ni as substitutive element of Co. Of course, further improvement of the effect can be expected by co-adding Fe and Ni together with Co. In the case that Fe and/or Ni are added in substitution of Co or with Co, those additions have the remarkable effect in economy because of decreasing of the expensive Co. As to the relationship (Co+Fe+Ni)/Si among the contents of Fe, Ni and Si in the case of the additions of Fe and/or Ni, the content of Fe or Ni is adjusted to be equal to the content of Co, and (Co+Fe+Ni)/Si is set to be equal to the value of Co/Si in single addition of Co, in all of first, second and third invention copper alloys. This admixture is based upon the reason described above on the relationship Co/Si between the contents of Co and Si. In other words, the relationship (Fe+Ni+Co)/Si in the first invention copper alloy is 0.005 to 0.5 (preferably 0.01 to 0.3, more preferably 0.002 to 0.2), and said relationship in the second invention copper alloy is 0.02 to 1.5 (preferably 0.04 to 1, more preferably 0.06 to 0.5), and said relationship in the third invention copper alloy is 0.005 to 0.4 (preferably 0.01 to 0.2, more preferably 0.02 to 0.15). Incidentally, since Fe and Ni can become substitutive elements with the same function as Co, the total content in the case that two or three elements selected from a group of Fe, Ni and Co are added must be equal to the content of the single addition of Co (the content of Co described above). However, in the case that two or three elements selected from Fe, Ni and Co are added, the upper limit of co-addition content of Fe, Ni and Co (total content) is permitted to be higher than the Co content by about 0.05 mass percent under consideration of the solid solution and precipitation. From said consideration, in the case that two or three elements selected from Fe, Ni and Co are co-added, it is desirable for the upper limit of total content (Fe+Ni+Co) to be set higher than the Co content by 0.05 mass percent. In other words, it is desirable that this total content (Fe+Ni+Co) in the first and second invention copper alloys are 0.005 to 0.55 mass percent (more preferably 0.01 to 0.35 mass percent, much more preferably 0.02 to 0.25 mass percent), and it is desirable that said total content in the third invention copper alloy is 0.005 to 0.35 mass percent (preferably 0.01 to 0.25 mass percent, much more preferably 0.02 to 0.2 mass percent). [0050]
  • Sn shows the strength improvement function, grain refinement function and improvement function of stress relaxation characteristic, corrosion resistance and wear resistance, etc. In the first and third invention copper alloys, in order to show the strength improvement function, grain refinement function, improvement function of heat resistance in matrix and improvement function of stress relaxation characteristic, corrosion resistance and wear resistance, it is necessary that the Sn content is higher than 0.03 mass percent, and it is preferable to be higher than 0.05 mass percent. However, when the Sn content becomes higher than 1.5 mass percent or 1 mass percent in the first invention copper alloy used as the rolled stock or the third invention copper alloy used as wire drawing material, respectively, the bending characteristics decrease suddenly. Therefore, in order to ensure the bending characteristics, it is necessary that the Sn content in the first and third invention copper alloys is less than 1.5 mass percent and less than 1 mass percent, respectively. Additionally, in order to ensure enough the bending characteristics in both the first and third invention copper alloys, it is preferable for the Sn content to be less than 0.7 mass percent, and it is optimum to be less than 0.5 mass percent. [0051]
  • On the other hand, in the second invention copper alloy which has lower minimum strength than the first and third invention copper alloys, it is preferable to try the strength improvement, grain refinement, improvement of stress relaxation characteristic, stress corrosion crack resistance, corrosion resistance and improvement of wear resistance, while considering the relation with Si content. Accordingly, it is necessary for the Sn content to be higher than 0.2 mass percent, and it is preferable to be higher than 1 mass percent and more preferable to be higher than 1.2 mass percent corresponding to required strength. However, when the Sn content exceeds 3 mass percent, the hot workability is obstructed, and then the bending characteristics become lower, too. Therefore, in order to ensure the workability, it is necessary for Sn content to be less than 3 mass percent, and it is preferable to be less than 2.6 mass percent so as to ensure more satisfactory hot-workability and bending characteristics, and more preferable to be less than 2.5 mass percent. [0052]
  • Additionally, in the case that Sn is added, it is necessary that its content is determined by considering the relationship (Si/Sn) with the Si content. In the first invention copper alloy whose strength improvement is a principal purpose, when high strength is obtained with increase of Si content, ductility such as bending characteristics decreases remarkably for Si/Sn<1.5. Therefore, in the first invention copper alloy, it is necessary for the Sn content to satisfy the relationship Si/Sn≧1.5. Furthermore, in order to ensure said ductility enough, it is preferable to satisfy the relationship Si/Sn≧2, and it is optimum to satisfy the relationship Si/Sn≧3. Moreover, in the third invention copper alloy that Sn content is suppressed to a little amount slightly comparing with the first invention copper alloy, from the same reasons described above, it is necessary for Sn content to satisfy the relationship Si/Sn≧1. Furthermore, in order to ensure said ductility enough, it is preferable for the Sn content to satisfy the relationship Si/Sn≧1.5, and it is optimum to satisfy the relationship Si/Sn≧2. [0053]
  • On the other hand, in the second invention copper alloy of which electric conductivity is required so as to balance with the strength, the addition of Si is restricted. Therefore, in order to ensure the high strength without loss of the ductility, it is necessary for Sn content to satisfy the relationship Si/Sn≦0.5 with Si content. For more improvement of the ductility and strength, the preferable and optimum relationships are Si/Sn≦0.4 and Si/Sn≦0.3, respectively. [0054]
  • At least one element selected from a group of P, Sb, As, Sr, Mg, Y. Cr, La, Ti, Mn, Zr, In and Hf is added according as the applications of said alloys, and the effects are mainly the grain refinement, improvement of hot workability, improvement of corrosion resistance, action making the accessory elements mixturing inevitably harmless and improvement of stress relaxation characteristic, etc. Such effects are hardly expected in the case that the content of each element is less than 0.003 mass percent, and on the contrary the effects balanced with the additive quantity are not obtained in the case beyond 0.3 mass percent. Accordingly, the addition is useless in economy and rather loses the bending characteristics. However, in the third invention copper alloy with much Zn content, P, Sb and As are especially added for the improvement of dezincification corrosion resistance and stress corrosion cracking resistance. Similarly to the case described above, the effects of P, Pb and As added for such purposes scarcely appear in the addition less than 0.005 mass percent. On the other hand, when the P content exceeds 0.2 mass percent, adversely the cold bending characteristics are lost. Therefore, for the additions of P. Sb and As in the third invention copper alloy, it is necessary for the contents to be 0.005 to 0.2 mass percent, and in the case adding at least two kinds of element from P. Sb and As, it is necessary for the total content to be 0.005 to 0.25 mass percent. [0055]
  • By the way, annealing is generally adopted for the heat treatment to obtain recrystallization materials (recrystallization treatment), where the annealing keep plastic working blank mentioned in said (1) the temperature of 200 to 600° C. for 20 minutes to 10 hours. In the heat treatment usually carried out by batch processing system, when the time of heat treatment is long, the grains recrystallized at the early stage of heat treatment gradually grow, and then there is possibility that the uniform grain refinement is obstructed, even if the effect of grain growth inhibition appears by the Co addition. However, in the case with such possibility, when the heat treatment (rapid heating treatment at high temperature) of molding material is performed in a short time at higher temperature (body temperature of molding material) than general annealing temperature, the grain refinement due to the recrystallization for both Co addition and no addition is preferably carried out by the growth inhibition of early recrystallized grains. In other words, the recrystallization in many nucleation sites is realized by acting the large thermal energy almost simultaneously in a short time, because the time span generating the crystal growth is not given. To be concrete, for example, the crystalline structure of molding material are completely recrystallized by the heat treatment of said plastic working blank in the range from 450 to 750° C. for 1 to 1000 seconds. [0056]
  • In addition, the first, second and third invention copper alloys are generally produced as the recrystallization materials of (1), cold working materials of (2) and manufacture pieces of (3)(4), and alloy characteristics such as strength are improved more by adding the following treatment in the manufacturing process. [0057]
  • For example, in the case that a working rate in the cold working before obtaining the recrystallized materials is higher than 30 percent (preferably 60 percent), and more concretely when the rolling or wire drawing rate of the cold working in the process obtaining the plastic working blank of (1) is higher than 30 percent (preferably 60 percent), the strength improvement due to the grain refinement is effectively reached by promoting the refinement. In other words, in order that the grain refinement can be caused, the nucleation sites are necessary. As mentioned above, the nucleation sites increase by the cold working with the higher working rate, and the increment rate of nucleation sites becomes large with increasing of working rate. Furthermore, since the recrystallization originates in releasing of strain energy, more fine grains are obtained by increasing of shearing strain through said cold working. As a result, the strength improvement due to the grain refinement is effectively reached. Incidentally, it is preferable that the plastic working blank performed the last recrystallization treatment has the small mean size of grains, and concretely the mean grain size is less than 20 μm (preferably less than 10 μm). As the mean crystal grain size before recrystallization becomes small, the places causing the recrystallized nucleation in the following heat treatment increase, and in particular, when dislocation density at the grain boundaries becomes higher, it is easy to form nucleation sites. However, since the strength increases with decreasing of the mean grain size, the energy cost for manufacturing the high strength copper alloy becomes expensive, and manufacturing time becomes longer. Therefore, it is preferable that the mean grain size of plastic working blank in (1) is determined from balance with said working rate. In addition, when the recrystallization materials lack the strength, this materials can obtain higher strength by performing the cold working or cold drawing with the working rate of 10 to 60 percent. [0058]
  • Furthermore, in the case that said plastic working blank is obtained, when the rolling or wire drawing work of one path is performed, it is preferable that the rolling or wire drawing rate is set to be large (higher than 15 percent, preferably 25 percent). The more refinement of recrystallized grains can be realized by increment of the shearing strain and nucleation sites resulting from the cold working that the rolling and wire drawing rates are higher. In addition, if the rolling is carried out by using of the roll of small diameter or extremely large diameter, or if the wire drawing is carried out by wire dice with large dice angle or extremely small dice angle, the nucleation sites or the local distortion energy increases, so that the further refinement of recrystallized grain can be effectively realized. Furthermore, if the rolling is carried out by the rolling method with different peripheral speed, and in other words if the rolling is carried out varying the velocity by use of the rolling machine providing for top and bottom rolls having different diameters, the large shearing strain is given to the rolling material, so that the grain refinement can be reached. [0059]
  • Additionally, in each invention copper alloy, according to those applications, the spring elastic limit and stress relaxation characteristic can be remarkably improved by performing the suitable heat treatment (generally annealing in range of 150 to 600° C. for 1 second to 4 hours) without recrystallization. Concretely, heat treatment is carried out for the cold working materials of (2) (including cold working materials in (4)) or the manufacture pieces of (3) (4), for instance, under the condition of 200° C. for 2 hours or 600° C. for 3 seconds. [0060]
  • EXAMPLES
  • As embodiment 1, the copper alloy of composition shown in tables 1 to 4 was dissolved in atmospheric air, and prism-shaped ingots of 35 mm in thickness, 80 mm in width and 200 mm in length were obtained. And intermediate plate materials of 6 mm in thickness were formed by hot rolling (four paths) of this ingot at 850° C., and the materials after acid cleaning became final plate materials of 1 mm in thickness by the cold rolling. Each final plate material was performed the heat treatment for one hour at temperature causing the recystallization of 100 percent (called “recrystallization temperature”), so that there were obtained the first invention copper alloy from No.101 to No.186 by performing complete recrystallization treatment of structure. For the recrystallization treatment, in advance, samples (a square plate with one side of about 20 mm) picked up from each final plate material were annealed for one hour at each temperature rising with spacing of 50° C. starting from 300° C., and the lowest temperature causing the complete recrystallization was found out, so that the lowest temperature was determined as said recrystallization temperature of the samples (refer to Tables 15 to 17). [0061]
  • Furthermore, the final plate materials of the same quality (same form, same composition) as composing materials of alloy No.102, No.107, No.111, No.154 and No.180 were obtained due to the same process described above, and these final plate materials were recrystallization-treated under condition different from said condition, so that there were obtained the first invention copper alloy No.102A, No.107A, No.111A, No.154A and No.180A with the same composition as No.102, No.107, No.111, No.152 and No.175, respectively. In other words, the first invention copper alloy No.102A, No.107A, No.111 A, No.154A and No.180A were obtained by the recrystallization treatment (rapid heating treatment at higher temperature) in which the heating was maintained for a short time at much higher temperature than recrystallization temperature, where the temperature a (° C.) and heating time b (second) are shown as “a(b)” in the column titled “recrystallization temperature” in Tables 15 to 17. For example, “480(20)” in column of “recrystallization temperature” of No.102A in Table 15 means the heating at 480° C. for 20 seconds. [0062]
  • As embodiment 2, the copper alloy of composition shown in Tables 5 to 8 was dissolved in atmospheric air, and prism-shaped ingots of 35 mm in thickness, 80 mm in width and 200 mm in length were obtained. And intermediate plate materials of 6 mm in thickness are formed by hot rolling (four paths) of this ingot at 850° C., and the materials after acid cleaning became final plate materials of 1 mm in thickness by the cold rolling. Each final plate material was performed by the heat treatment (annealing) for one hour at temperature causing the recystallization of 100 percent (by recrystallized treatment), so that there were obtained the second invention copper alloy from No.201 to No.281. In addition, the recrystallization temperature was determined in advance by method similar to example 1 (refer Table 18 to 20). [0063]
  • Furthermore, the final plate materials of the same quality as composing materials of alloy No.202, No.209, No.250 and No.265 were obtained due to the same process described above, and these final plate materials were recrystallized by the above-described rapid heating treatment at higher temperature, so that there were obtained the second invention copper alloy No.202A, No.209A, No.250A and No.265A with the same composition as No.202, No.209, No.250 and No.265, respectively. In other words, condition obtaining alloy No.202A, No.209A, No.250A and No.265A in the rapid heating treatment at high temperature (a(° C.) and heating time b (second)) is described as “a(b)” in column titled “recrystallization temperature” of Tables 18 to 20 by the same description as Tables 15 to 17. [0064]
  • As embodiment 3, the copper alloy of composition shown in Tables 9 to 12 was dissolved in atmospheric air, and column-shaped ingots of 95 mm in diameter and 180 mm in length were obtained. Round bars of 12 mm in diameter were obtained by extruding press (500 t) while heating the ingots at 780° C. This round bars after cleaning were worked by wire drawing into 8 mm in diameter, and after heat-treating the round bars for one hour at 500° C. and cleaning them, the wires of 4 mm in diameter (molding materials) were obtained by wire drawing. Furthermore, each wire was heat-treated (annealing) for 1 hour at the temperature (recrystallization temperature) that recrystallization of 100 percent was realized (recrytallization treatment), and third invention copper alloys No.301 to 397 were obtained. For the recrystallization treatment, in advance, samples (wires of 20 mm in length (4 mm in diameter)) picked up from each wire were annealed for one hour at each temperature rising with spacing of 50° C. starting from 300° C., and the lowest temperature causing the complete recrystallization was found out, so that the lowest temperature was determined as said recrystallization temperature of the samples (refer to Tables 21 to 24). [0065]
  • Furthermore, the wires (molding materials) of the same quality as composing materials of alloy No.302, No.314 and No.338 were obtained due to the same process described above, and these wires were recrystallized by the above-described rapid heating treatment at higher temperature, so that there were obtained the third invention copper alloy No.302A, No.314A and No.338A with the same composition as No.302, No.314 and No.338, respectively. The condition obtaining alloy No.302A, No.314A and No.338A due to the rapid heating treatment at high temperature (temperature a (° C.) and heating time b (second)) is described as “a(b)” in column titled “recrystallization temperature” of Tables 21 to 24 by the same descriptive method as Tables 15 to 17. [0066]
  • As comparative example 1, first comparative example alloys No.401 to No.422 shown in Table 13 were obtained on the basis of the same process as the first embodiment. In addition, as comparative example 2, second comparative example alloys No.423 to No.431 shown in Table 14 were obtained due to the same process as third embodiment. Incidentally, the first comparative example alloys No.401 to 407, respectively, have the same compositions as C2100, C2200, C2300, C2400, C2600, C2680 and C4250 of Japanese Industrial Standards (JIS), and the second comparative example alloys No.423 and 424, respectively, have the same compositions as C2600 and C2700 of JIS. Additionally, in Tables 1 to 12, the expression of relationship “(Co+Fe+Ni)/Si” for alloy that contains only Co without Fe and Ni is replaced by “Co/Si”. [0067]
  • Incidentally, since the following problems in manufacturing process occurred for the comparative example alloys No.421, No.425, No. 427 and No.431, the manufacturing has been abandoned because of impossibility of manufacturing thereafter. In other words, No.421 causes large cracking in the step that ingots are hot-rolled, and No.425 cannot be hot-extruded. No.427 and No.431 rupture in the wire drawing process. Accordingly, their manufacturing was abandoned because it is difficult to carry out the process thereafter. [0068]
  • In the first invention copper alloys of No.101 to 186 and No.102A, 107A, 111A, 154A, 180A, the second invention copper alloys of No.201 to 281 and No.202A, 209A, 250A, 265A, the third invention copper alloys of No.301 to 397 and No.302A, 314A, No.338A, and the first and second comparative example alloys of No.401 to 431 (except for No.421, No. 425, No. 427 and No. 431 abandoned the manufacturing), the mean grain size D (μm) of recrystallized structures was measured on the basis of intercept method with the use of optical image (JIS-H0501). The results are shown in Tables 15 to 26. [0069]
  • In the first invention copper alloys of No.101 to No.186 and No.102A, 107A, 111A, 154A, 180A, the second invention copper alloys of No.201 to 281, No.202A, 209A, 250A, 265A and the first comparative example alloys No. 401 to 422 (except for No.421), the electric conductivity was measured. The results are shown in Tables 15 to 26 and Table 25. In addition, the electric conductivity (% IACS) is defined by a percentage of the ratio of the volume specific resistance of international standard soft copper (17.241×10[0070] −9 μΩ·m) divided by that of said alloy.
  • Additionally, in the first invention copper alloys of No.101 to No.186 and No.102A, 107A, 111A, 154A, 180A, the second invention copper alloys of No.201 to 281, No.202A, 209A, 250A, 265A and the first comparative example alloys of No. 401 to 422 (except for No.421), proof stress (0.2% proof stress), tensile strength and elongation were measured by tensile test using an Amsler-type universal testing machine. Furthermore, after each alloy was cold-rolled until its thickness becomes 0.7 mm, 0.2% proof stress, tensile strength and elongation of the rolling materials (called “post workpiece”) were measured by the same tensile test as one described above, and then evaluation of bending characteristics and stress corrosion cracking test were carried out. The results are shown in Tables 15 to 20 and Table 26. [0071]
  • In addition, for the first invention copper alloys of No.101 to No.186 and No.102A, 107A, 111A, 154A, 180A and the second invention copper alloys of No.201 to 281, No.202A, 209A, 250A, 265A, it goes without saying that the post workpieces obtained by 30% rolling are also high strength copper alloy of the present invention. [0072]
  • In addition, the bending characteristics are evaluated from bending rate R/t at cracked moment (R: inside radius at bending positions). This cracking is suffered when the samples that are vertically cut from the worked pieces to the rolling direction are bend in W shape. In Tables 12 to 17 and Table 22, the pieces that the cracking is not caused for R/t=0.5 are indicated by a symbol ⊚ as superior bending characteristics. The pieces that the cracking is not caused for R/t=1.5 but is found for 0.5≦R/t<1.5 are indicated by a symbol ∘ as preferable bending characteristics (there is no problem in application). The pieces that the cracking is not caused for R/t=2.5 but is found for 1.5≦R/t<2.5 are indicated by a symbol Δ as general bending characteristics (there is problem in applications but it is possible to use). The pieces that the cracking is caused for R/t=2.5 are indicated by a symbol X as superior bending characteristics (it is difficult for applications to use). [0073]
  • In addition, testing of stress corrosion cracking is carried out by use of test container and testing liquid prescribed in JISH3250, and characteristics of stress corrosion cracking resistance are evaluated from the relationship between ammonia atmosphere exposure time and stress relaxation rate (stress of proof stress value 80% of the post workpiece is added on the surface of the post workpiece) by using the fluid which mixed ammonia fluid and water, where two quantities are equal. In Tables 15 to 20 and Table 25, the pieces that the stress relaxation rate is less than 20% in the exposure for 75 hours are indicated by a symbol ⊚ as superior bending characteristics. The pieces that the stress relaxation rate is higher than 20% in the exposure for 75 hours but less than 20% in the exposure for 30 hours are indicated by a symbol ∘ as superior bending characteristics (there is no problem in application). The pieces that the stress relaxation rate is less than 20% in the exposure for 12 hours are indicated by a symbol Δ as general bending characteristics (there is problem in applications but it is possible to use). The pieces that the stress relaxation rate is higher than 20% in the exposure for 12 hours are indicated by a symbol X as superior bending characteristics (it is difficult for applications to use). [0074]
  • Additionally, in the third invention copper alloys of No.301 to 397 and No.302A, 314A and 338A, the second invention copper alloys of No.423 to 431 (except No.425, No.427 and No.431 of abandoned manufacture), tensile strength and elongation are determined from tensile testing with use of an Amsler-type universal testing machine. [0075]
  • Furthermore, each alloy is straightened to 0.7 mm in thickness, and tensile strength and elongation in the wire drawing material (called “post workpiece”) are determined by the same tensile testing as being described above. Additionally, evaluation of bending characteristics and testing of stress corrosion cracking are carried out. The results are shown in Tables 21 to 24 and Table 26. In addition, the post workpieces are obtained by the wire drawing of the third invention copper alloys of No.301 to 397 and No.302A, 314A and 338A and the second invention copper alloys of No.201 to 281, No.202A, 209A, 250A and 265A, and it go without saying that the after working pieces are also the high strength copper alloy of the present invention. [0076]
  • Additionally, the bending characteristics was evaluated from bending rate R/d when the post workpieces were bent to 90 degree by use of V-block, and the cracking was caused (R (mm): radius of curvature of inner side at the bending portion, d (mm): radius of post workpices). In Tables 18 to 22, the pieces that the cracking is not caused for R/d=0 are indicated by a symbol ⊚ as superior bending characteristics. The pieces that the cracking is not caused for R/d=0.25 but found for 0≦R/d<0.25 are indicated by a symbol ∘ as preferable bending characteristics (there is no problem in application). The pieces that the cracking is not caused for R/d=0.5 but found for 0.25≦R/d<0.5 are indicated by a symbol Δ as general bending characteristics (there is problem in applications but it is possible to use). The pieces that the cracking is caused for R/d=0.5 are indicated by a symbol X as inferior bending characteristics (it is difficult to use in applications). [0077]
  • In addition, the stress corrosion cracking test using the post workpiece used for the evaluation of bending characteristics with R/d=1.5 and 90 degree bending is carried out by use of test device and test liquid prescribed in JISH3250. After ammonia exposure using the fluid that mixed equal amounts of ammonia aqueous solution and water, and pickling due to sulfuric acid, the stress corrosion cracking resistance was evaluated from the research of cracking existence due to the stereoscopic microscope with 10 times magnification. In Tables 15 to 20 and Table 25, the pieces that the cracking is not caused in the exposure for 40 hours are indicated by a symbol ⊚ as superior corrosion cracking resistance. The pieces that the cracking is caused in the exposure for 40 hours but is not caused in the exposure for 15 hours are indicated by a symbol ∘ as preferable corrosion cracking resistance (there is no problem in application). The pieces that the cracking is caused in the exposure for 15 hours but is not caused in the exposure for 6 hours are indicated by a symbol Δ as general corrosion cracking resistance (there is problem in applications but it is possible to use). The pieces that the cracking is caused in the exposure for 6 hours are indicated by a symbol X as inferior stress corrosion cracking resistance (it is difficult to use in applications). [0078]
    TABLE 1
    Alloy Alloy composition (mass %)
    No. Cu Zn Si Co Fe P Sr Y Cr La Hf Zn − 2.5Si (Co + Fe + Ni)/Si
    Embodiment 1 101 remainder 10.0 0.98 7.550
    102 remainder 10.3 1.50 6.550
    102A remainder 10.3 1.50 6.550
    103 remainder 9.6 1.58 0.07 5.650
    104 remainder 11.1 1.43 0.05 7.525
    105 remainder 10.4 1.51 0.02 6.625
    106 remainder 8.5 1.66 0.03 4.350
    107 remainder 9.7 2.07 4.525
    107A remainder 9.7 2.07 4.525
    108 remainder 6.8 2.33 0.975
    109 remainder 16.1 0.73 14.275
    110 remainder 10.0 1.02 0.11 7.450 0.108
    111 remainder 10.2 1.52 0.12 6.400 0.079
    111A remainder 10.2 1.52 0.12 6.400 0.079
    112 remainder 11.8 1.44 0.08 0.12 8.200 0.056
    113 remainder 9.1 1.57 0.11 0.03 5.175 0.070
    114 remainder 10.1 2.01 0.11 5.075 0.055
    115 remainder 11.5 2.32 0.14 5.700 0.060
    116 remainder 11.0 1.52 0.01 7.200 0.005
    117 remainder 10.2 1.51 0.06 6.425 0.040
    118 remainder 9.3 1.08 0.23 6.600 0.213
    119 remainder 4.8 1.58 0.07 0.850 0.044
    120 remainder 18.1 1.39 0.15 14.625 0.108
    121 remainder 13.6 1.26 0.09 10.450 0.071
    122 remainder 10.2 1.49 0.03 6.475 0.020
    123 remainder 11.2 0.69 0.07 9.475 0.101
    124 remainder 13.2 1.81 0.12 8.675 0.066
  • [0079]
    TABLE 2
    Alloy composition (mass %)
    Alloy Zn − (Co + Fe +
    No. Cu Zn Si Co Fe Ni Sn As Mg Zr In 2.5Si Ni/Si Si/Sn
    Embodiment 1 125 remainder 6.6 1.31 0.27 5.325 0.206
    126 remainder 10.3 1.95 0.10 0.05 5.425 0.051
    127 remainder 9.8 0.88 0.39 7.600 0.443
    128 remainder 7.1 1.62 0.06 3.050 0.037
    129 remainder 9.5 2.01 0.12 4.475 0.060
    130 remainder 10.0 1.63 0.06 0.01 5.925 0.043
    131 remainder 9.4 1.04 0.10 0.06 6.800 0.154
    132 remainder 10.8 1.58 0.04 0.07 6.850 0.070
    133 remainder 9.3 1.66 0.08 0.02 5.150 0.060
    134 remainder 7.8 1.81 0.16 0.12 3.275 0.155
    135 remainder 12.1 1.73 0.05 0.06 7.775 0.064
    136 remainder 11.8 1.12 0.19 0.08 9.000 0.241
    137 remainder 9.7 1.48 0.04 0.07 6.000 0.074
    138 remainder 8.8 1.63 0.12 0.01 4.725 0.080
    139 remainder 8.6 1.69 0.11 0.09 0.07 4.375 0.160
    140 remainder 5.3 1.32 0.03 0.01 0.04 2.000 0.058
    141 remainder 10.2 0.81 0.01 0.02 0.08 8.175 0.136
    142 remainder 9.4 1.64 0.34 5.300 4.824
    143 remainder 8.9 1.56 1.01 5.000 1.545
    144 remainder 10.6 1.12 0.05 7.800 22.400
    145 remainder 8.2 2.41 0.05 0.29 2.175 0.021 8.310
    146 remainder 11.3 2.14 0.10 0.42 5.950 0.047 5.095
    147 remainder 7.6 0.57 0.12 0.21 6.175 0.211 2.714
    148 remainder 10.8 1.74 0.11 0.35 6.450 0.063 4.971
    149 remainder 10.6 1.52 0.09 0.29 0.03 6.800 0.059 5.241
    150 remainder 9.6 1.63 0.10 0.30 0.01 0.03 5.525 0.061 5.433
    151 remainder 9.8 1.67 0.07 0.25 0.02 5.625 0.042 6.680
  • [0080]
    TABLE 3
    Alloy composition (mass %)
    (Co +
    Fe +
    Alloy Zn − Ni)/
    No. Cu Zn Si Co Fe Ni Sn P Sb Sr Mg Ti Mn Zr Hf 2.5Si Si Si/Sn
    Em- 152 re- 10.7 1.59 0.11 0.32 0.02 0.01 4.675 0.069 4.969
    bodi- mainder
    ment 153 re- 5.9 1.84 0.02 0.23 1.300 0.011 8.000
    1 mainder
    154 re- 8.7 1.76 0.06 0.28 4.300 0.034 6.286
    mainder
    154A re- 8.7 1.76 0.06 0.28 4.300 0.034 6.286
    mainder
    155 re- 9.0 1.62 0.47 0.08 4.950 3.447
    mainder
    156 re- 9.9 1.77 0.09 0.41 0.03 0.05 5.475 0.051 4.317
    mainder
    157 re- 10.1 1.30 0.44 0.08 6.850 0.338 16.250
    mainder
    158 re- 9.5 1.61 0.08 0.20 5.475 0.050 8.050
    mainder
    159 re- 13.3 1.11 0.08 0.21 10.525 0.072 5.286
    mainder
    160 re- 8.2 1.82 0.12 0.18 3.650 0.066 10.111
    mainder
    161 re- 4.9 1.79 0.08 0.26 0.425 0.045 6.885
    mainder
    162 re- 8.9 1.32 0.09 0.82 5.600 0.068 1.610
    mainder
    163 re- 10.0 2.01 0.12 0.42 4.975 0.060 4.786
    mainder
    164 re- 11.3 1.38 0.28 0.33 7.850 0.203 4.182
    mainder
    165 re- 9.0 1.60 0.08 0.25 5.000 0.050 6.400
    mainder
    166 re- 9.7 1.65 0.06 0.03 0.30 5.575 0.055 5.500
    mainder
    167 re- 10.5 1.59 0.04 0.07 0.08 6.525 0.069 19.875
    mainder
    168 re- 11.3 1.45 0.03 0.01 0.12 0.16 7.675 0.028 12.083
    mainder
    169 re- 8.9 1.62 0.03 0.03 0.18 0.08 4.850 0.037 9.000
    mainder
    170 re- 9.8 1.58 0.07 0.04 0.11 0.02 0.02 5.850 0.070 14.364
    mainder
    171 re- 10.0 1.50 0.03 0.05 0.14 0.04 6.250 0.053 10.714
    mainder
    172 re- 13.2 1.47 0.05 0.05 0.18 9.525 0.068 8.167
    mainder
    173 re- 7.8 1.24 0.21 0.06 0.12 4.700 0.218 10.333
    mainder
    174 re- 9.7 1.49 0.09 0.02 0.28 5.975 0.074 5.321
    mainder
    175 re- 9.5 1.55 0.08 0.01 0.25 0.07 5.625 0.057 6.200
    mainder
    176 re- 9.3 1.60 0.04 0.04 0.26 0.03 5.300 0.050 6.154
    mainder
    177 re- 10.2 2.21 0.06 0.05 0.22 4.675 0.050 10.045
    mainder
  • [0081]
    TABLE 4
    Alloy Alloy composition (mass %)
    No. Cu Zn Si Co Fe Ni Sn Zn − 2.5Si (Co + Fe + Ni)/Si Si/Sn
    Embodiment 1 178 remainder 6.9 1.19 0.15 0.14 0.54 3.925 0.244 2.204
    179 remainder 8.9 1.68 0.09 0.02 0.09 4.700 0.065 18.667
    180 remainder 14.2 1.65 0.03 0.09 0.20 10.075 0.073 8.250
    180A remainder 14.2 1.65 0.03 0.09 0.20 10.075 0.073 8.250
    181 remainder 9.4 1.62 0.06 0.01 0.02 0.18 5.350 0.056 9.000
    182 remainder 10.1 0.89 0.03 0.02 0.01 0.24 7.875 0.067 3.708
    183 remainder 11.8 1.45 0.01 0.03 0.02 0.33 8.175 0.041 4.394
    184 remainder 8.3 1.20 0.31 0.07 0.05 5.300 0.317 24.000
    185 remainder 9.5 1.70 0.15 0.07 5.250 0.129
    186 remainder 9.5 1.70 0.10 0.30 5.250 0.059 5.667
  • [0082]
    TABLE 5
    Alloy Alloy composition (mass %)
    No. Cu Zn Si Co Fe Ni P Sr Cr La Mn Zn − 2.5Si (Co + Fe + Ni)/Si
    Embodiment 2 201 remainder 10.1 0.28 9.400
    202 remainder 10.0 0.49 8.775
    202A remainder 10.0 0.49 8.775
    203 remainder 9.0 0.51 0.21 7.725
    204 remainder 10.5 0.45 0.12 9.375
    205 remainder 7.7 0.52 6.400
    206 remainder 14.0 0.39 13.025
    207 remainder 10.2 0.19 0.03 9.725 0.158
    208 remainder 9.9 0.31 0.05 9.125 0.161
    209 remainder 10.0 0.50 0.12 8.750 0.240
    209A remainder 10.0 0.50 0.12 8.750 0.240
    210 remainder 9.5 0.52 0.10 0.03 8.200 0.192
    211 remainder 8.8 0.50 0.09 0.04 7.550 0.180
    212 remainder 10.3 0.46 0.07 0.03 9.150 0.152
    213 remainder 9.7 0.33 0.11 8.875 0.333
    214 remainder 4.9 0.73 0.21 3.075 0.288
    215 remainder 15.8 0.70 0.10 14.050 0.143
    216 remainder 8.5 0.43 0.009 7.425 0.021
    217 remainder 13.4 0.40 0.05 12.400 0.125
    218 remainder 10.5 0.52 0.06 9.200 0.115
    219 remainder 8.7 0.47 0.02 7.525 0.043
    220 remainder 9.8 0.39 0.07 8.825 0.179
    221 remainder 9.8 0.73 0.21 7.975 0.288
    222 remainder 8.3 0.44 0.06 7.200 0.136
    223 remainder 12.8 0.37 0.07 11.875 0.189
    224 remainder 8.1 0.55 0.06 0.03 6.725 0.164
    225 remainder 8.9 0.18 0.26 8.450 1.444
  • [0083]
    TABLE 6
    Alloy composition (mass %)
    Alloy Zn − (Co + Fe +
    No. Cu Zn Si Co Fe Ni Sn Sr Mg Y Ti Zr Hf 2.5Si Ni)/Si Si/Sn
    Em- 226 remainder 9.2 0.30 0.36 0.02 8.450 1.200
    bodiment 2 227 remainder 8.5 0.49 0.45 7.275 0.918
    228 remainder 7.8 0.38 0.02 0.06 6.850 0.211
    229 remainder 10.1 0.56 0.26 0.05 8.700 0.554
    230 remainder 10.8 0.19 0.04 0.02 10.325 0.316
    231 remainder 9.7 0.66 0.03 0.06 8.050 0.136
    232 remainder 8.8 0.48 0.04 0.04 7.600 0.167
    233 remainder 14.8 0.39 0.02 0.03 13.825 0.128
    234 remainder 4.8 0.50 0.21 0.02 3.550 0.460
    235 remainder 8.5 0.47 0.04 0.05 7.325 0.191
    236 remainder 10.0 0.28 0.04 0.02 0.02 9.300 0.286
    237 remainder 8.1 0.44 0.03 0.02 0.03 7.000 0.182
    238 remainder 10.8 0.57 0.01 0.05 0.02 9.375 0.140
    239 remainder 9.7 0.43 1.41 8.625 0.305
    240 remainder 8.2 0.18 2.01 7.750 0.090
    241 remainder 8.5 0.20 1.99 0.05 8.000 0.101
    242 remainder 7.7 0.15 2.06 0.05 0.01 7.325 0.073
    243 remainder 9.1 0.23 2.12 0.07 8.525 0.108
    244 remainder 12.3 0.51 1.13 11.025 0.451
    245 remainder 9.8 0.18 0.38 9.350 0.474
    246 remainder 7.9 0.32 0.11 1.75 7.100 0.344 0.183
    247 remainder 7.2 0.33 0.09 1.80 0.04 6.375 0.273 0.183
    248 remainder 7.5 0.30 0.12 1.77 0.03 6.750 0.400 0.169
    249 remainder 7.9 0.29 0.10 1.68 0.03 0.02 7.175 0.345 0.173
    250 remainder 9.1 0.28 0.05 1.92 8.400 0.179 0.146
    250A remainder 9.1 0.28 0.05 1.92 8.400 0.179 0.146
    251 remainder 10.4 0.70 0.12 1.50 8.650 0.171 0.467
  • [0084]
    TABLE 7
    Alloy Alloy composition (mass %)
    No. Cu Zn Si Co Fe Ni Sn Sb As Mg Y In Zn − 2.5Si (Co + Fe + Ni)/Si Si/Sn
    Embodiment 252 remainder 8.5 0.32 0.18 1.58 7.700 0.563 0.203
    7 253 remainder 7.8 0.27 0.15 2.12 0.07 7.125 0.556 0.127
    254 remainder 7.4 0.35 0.10 1.75 0.05 6.525 0.286 0.200
    255 remainder 8.8 0.21 0.01 1.48 8.275 0.048 0.142
    256 remainder 8.4 0.32 0.11 2.28 7.600 0.344 0.140
    257 remainder 7.8 0.27 0.09 2.71 7.125 0.333 0.100
    258 remainder 10.6 0.14 0.05 0.29 10.250 0.357 0.483
    259 remainder 15.1 0.32 0.07 1.56 14.300 0.219 0.205
    260 remainder 8.8 0.28 0.08 1.88 8.100 0.286 0.149
    261 remainder 9.2 0.23 0.06 1.33 8.625 0.261 0.173
    262 remainder 9.0 0.40 0.06 1.75 8.000 0.150 0.229
    263 remainder 4.9 0.35 0.08 1.62 4.025 0.229 0.216
    264 remainder 8.3 0.74 0.08 1.63 6.450 0.108 0.454
    265 remainder 7.7 0.26 0.07 0.02 2.02 7.050 0.346 0.129
    265A remainder 7.7 0.26 0.07 0.02 2.02 7.050 0.346 0.129
    266 remainder 7.1 0.27 0.06 0.03 2.22 0.06 6.425 0.333 0.122
    267 remainder 8.3 0.27 0.08 0.01 2.00 0.02 0.02 7.625 0.322 0.135
    268 remainder 6.9 0.44 0.21 0.01 2.18 5.800 0.500 0.202
    269 remainder 8.8 0.36 0.02 0.05 1.58 7.900 0.194 0.228
    270 remainder 9.3 0.19 0.04 0.02 0.58 8.825 0.316 0.328
    271 remainder 7.8 0.32 0.03 0.05 1.49 7.000 0.250 0.215
    272 remainder 11.3 0.44 0.03 0.03 1.68 10.200 0.136 0.262
    273 remainder 8.7 0.33 0.02 0.05 1.40 7.875 0.212 0.236
    274 remainder 10.6 0.22 0.06 0.02 1.90 10.050 0.364 0.116
    275 remainder 7.7 0.28 0.03 0.03 1.66 7.000 0.214 0.169
    276 remainder 6.8 0.36 0.05 0.02 0.01 1.58 5.900 0.217 0.228
    277 remainder 12.5 0.41 0.12 0.05 0.05 2.28 11.475 0.244 0.180
  • [0085]
    TABLE 8
    Alloy Alloy composition (mass %)
    No. Cu Zn Si Co Fe Ni Sn P Sb Zn − 2.5Si (Co + Fe + Ni)/Si Si/Sn
    Embodiment 2 278 remainder 7.7 0.26 0.01 0.04 0.02 1.77 7.050 0.269 0.147
    279 remainder 8.3 0.34 0.09 0.03 1.73 0.05 0.03 7.450 0.353 0.197
    280 remainder 9.0 0.35 0.13 2.10 8.125 0.371 0.167
    281 remainder 9.0 0.40 0.26 2.00 8.000 0.650 0.200
  • [0086]
    TABLE 9
    Alloy Alloy composition (mass %)
    No. Cu Zn Si Co Fe Ni Mg Ti Mn In Cu − 5Si Zn + 6Si (Co + Fe + Ni)/Si
    Embodiment 3 301 71.1 27.7 1.22 64.980 35.02
    302 70.8 27.8 1.38 63.920 36.08
    302A 70.8 27.8 1.38 63.920 36.08
    303 71.1 27.5 1.36 0.07 64.270 35.66
    304 71.5 27.0 1.41 0.12 64.420 35.46
    305 72.6 25.9 1.55 64.800 35.20
    306 68.2 31.1 0.68 0.02 64.800 35.18 0.029
    307 71.0 28.0 0.97 0.07 66.110 33.82 0.072
    308 70.5 28.1 1.33 0.05 63.870 36.08 0.038
    309 72.1 26.3 1.38 0.23 65.190 34.58 0.167
    310 73.2 25.1 1.61 0.11 65.130 34.76 0.068
    311 71.5 26.7 1.72 0.13 62.850 37.02 0.076
    312 75.2 22.9 1.77 0.09 66.390 33.52 0.051
    313 71.7 26.8 1.43 0.07 64.550 35.38 0.049
    314 72.9 25.5 1.56 0.08 65.060 34.86 0.051
    314A 72.9 25.5 1.56 0.08 65.060 34.86 0.051
    315 72.4 26.0 1.51 0.07 0.05 64.820 35.06 0.046
    316 73.1 25.2 1.58 0.07 0.02 0.02 65.210 34.68 0.044
    317 71.6 26.9 1.40 0.08 64.620 35.30 0.057
    318 72.6 25.7 1.51 0.22 65.020 34.76 0.146
    319 68.4 31.0 0.62 0.01 65.272 34.72 0.013
    320 72.4 26.1 1.48 0.05 64.970 34.98 0.034
    321 67.8 31.5 0.67 0.01 64.471 35.52 0.013
    322 75.3 22.7 1.91 0.08 65.760 34.16 0.042
    323 71.2 27.3 1.41 0.03 0.05 64.160 35.76 0.057
    324 72.3 26.0 1.64 0.01 0.06 64.093 35.84 0.041
    325 68.4 30.8 0.65 0.18 0.01 65.110 34.70 0.292
  • [0087]
    TABLE 10
    Alloy composition (mass %)
    Alloy Cu − Zn + (Co + Fe +
    No. Cu Zn Si Co Fe Ni Sn Sr Y Le Zr In Hf 5Si 6Si Ni)/Si Si/Sn
    Embodi- 326 72.5 25.9 1.53 0.05 0.02 64.85 35.08 0.046
    ment 3 327 70.6 28.1 1.25 0.06 0.01 64.33 35.60 0.056
    328 71.5 27.0 1.44 0.02 0.05 64.29 35.64 0.049
    329 71.7 26.8 1.45 0.06 0.03 64.41 35.50 0.062
    330 70.7 27.6 1.58 0.04 0.04 62.84 37.08 0.051
    331 71.9 26.5 1.55 0.04 0.03 0.03 64.10 35.80 0.045
    332 72.2 26.2 1.48 0.03 0.03 0.02 64.84 35.08 0.054
    333 71.2 27.3 1.38 0.03 0.05 0.01 0.03 64.30 35.58 0.065
    334 71.4 27.0 1.55 0.07 0.01 0.02 63.60 36.30 0.065
    335 73.7 24.5 1.61 0.22 65.62 34.16 7.318
    336 74.0 23.8 1.52 0.73 66.35 32.92 2.082
    337 71.7 26.6 1.42 0.09 64.62 35.12 15.778
    338 73.2 25.0 1.59 0.06 0.13 65.27 34.54 0.038 12.231
    338A 73.2 25.0 1.59 0.06 0.13 65.27 34.54 0.038 12.231
    339 73.0 25.2 1.60 0.05 0.10 0.03 65.02 34.80 0.031 16.000
    340 72.8 25.5 1.57 0.05 0.08 0.01 0.03 64.91 34.92 0.032 19.625
    341 72.9 25.3 1.59 0.07 0.13 0.04 64.92 34.84 0.044 12.231
    342 75.1 22.8 1.82 0.09 0.23 65.96 33.72 0.049 7.913
    343 71.5 26.9 1.41 0.15 0.04 64.45 35.36 0.106 35.250
    344 72.3 26.0 1.24 0.07 0.37 66.12 33.44 0.056 3.351
    345 71.7 26.3 1.19 0.08 0.74 65.74 33.44 0.067 1.608
    346 71.9 26.3 1.45 0.21 0.15 64.64 35.00 0.145 9.667
    347 72.5 25.6 1.67 0.05 0.20 64.13 35.62 0.030 8.350
    348 71.2 27.1 1.55 0.02 0.11 63.47 36.40 0.013 14.091
    349 73.7 24.4 1.71 0.07 0.06 0.03 65.18 34.66 0.041 28.500
    350 71.8 26.6 1.42 0.06 0.16 64.66 35.12 0.042 8.875
    351 75.1 22.7 1.91 0.13 0.05 0.09 65.57 34.16 0.094 21.222
  • [0088]
    TABLE 11
    Alloy composition (mass %)
    Alloy Cu − Zn + (Co +
    No. Cu Zn Si Co Fe Ni Sn P Sr Mg Y Zr Hf 5Si 6Si Fe + Ni)/Si Si/Sn
    Em- 352 71.7 26.6 1.45 0.04 0.05 0.21 64.400 35.30 0.062 6.905
    bod- 353 73.3 24.9 1.60 0.02 0.07 0.14 65.270 34.50 0.056 11.429
    iment 3 354 72.8 25.3 1.58 0.03 0.07 0.18 0.02 64.920 34.78 0.063 8.778
    355 73.3 24.8 1.63 0.04 0.05 0.12 0.02 0.02 65.170 34.58 0.055 13.583
    356 73.1 25.1 1.61 0.04 0.06 0.09 0.03 0.01 65.013 34.76 0.062 17.889
    357 75.6 21.9 1.88 0.07 0.01 0.59 66.152 33.18 0.041 3.186
    358 72.1 26.2 1.44 0.05 0.04 0.14 64.930 34.84 0.063 10.286
    359 72.7 25.5 1.63 0.02 0.05 0.12 64.530 35.28 0.043 13.583
    360 71.4 26.8 1.38 0.18 0.04 0.22 64.480 35.08 0.159 6.273
    361 72.8 25.2 1.70 0.06 0.03 0.19 64.320 35.40 0.053 8.947
    362 73.8 23.8 1.44 0.03 0.06 0.92 66.550 32.44 0.063 1.565
    363 71.9 26.4 1.41 0.02 0.02 0.05 0.21 64.840 34.86 0.064 6.714
    364 70.0 28.6 0.75 0.12 0.63 66.250 33.10 0.160 1.190
    365 71.0 27.1 1.06 0.06 0.02 0.82 65.700 33.46 0.075 1.293
    366 73.1 24.9 1.68 0.02 0.07 0.01 0.18 64.740 34.98 0.060 9.333
    367 66.8 32.3 0.63 0.12 0.04 0.02 0.05 63.690 36.08 0.286 12.600
    368 72.3 26.3 1.40 0.03 65.270 34.70
    369 73.1 25.1 1.65 0.14 64.860 35.00
    370 71.7 26.8 1.43 0.06 0.01 64.552 35.38 0.042
    371 73.1 25.0 1.72 0.09 0.12 64.470 35.32 0.052
    372 72.2 26.2 1.50 0.07 0.05 64.680 35.20 0.047
    373 71.9 26.3 1.61 0.13 0.07 63.840 35.96 0.081
    374 72.3 26.1 1.47 0.07 0.08 64.930 34.92 0.048
    375 71.1 27.5 1.22 0.07 0.02 0.06 65.030 34.82 0.074
    376 72.4 25.9 1.53 0.06 0.01 0.09 64.763 35.08 0.044
    377 73.0 25.2 1.66 0.05 0.03 0.03 64.730 35.16 0.048
    378 73.5 24.7 1.68 0.05 0.03 0.01 0.04 65.090 34.78 0.054
  • [0089]
    TABLE 12
    Alloy Alloy composition (mass %)
    No. Cu Zn Si Co Fe Ni Sn P Sb As Cu − 5Si Zn + 6Si (Co + Fe + Ni)/Si Si/Sn
    Em- 379 71.6 26.5 1.55 0.28 0.06 63.860 35.80 5.536
    bod- 380 72.5 25.4 1.23 0.07 0.81 0.04 66.300 32.78 0.057 1.519
    iment 381 72.6 25.5 1.60 0.08 0.15 0.06 64.610 35.10 0.050 10.67
    3 382 71.6 26.7 1.54 0.05 0.08 0.08 63.850 35.94 0.032 19.25
    383 73.3 24.9 1.60 0.02 0.07 0.14 65.270 34.50 0.056 11.43
    384 74.7 23.2 1.72 0.01 0.14 0.22 0.06 68.052 33.52 0.086 7.818
    385 73.1 25.1 1.44 0.06 0.01 0.17 0.08 65.943 33.74 0.047 8.471
    386 72.6 25.6 1.58 0.03 0.06 0.11 0.06 64.660 35.08 0.057 14.36
    387 71.8 26.4 1.46 0.09 0.01 0.03 0.19 0.05 64.472 35.16 0.088 7.684
    388 72.5 25.9 1.55 0.04 64.750 35.20
    389 73.6 24.6 1.70 0.07 65.100 34.80
    390 71.2 27.4 1.26 0.07 0.10 64.900 34.96 0.056
    391 73.1 25.1 1.68 0.11 0.03 64.700 35.18 0.065
    392 72.1 26.2 1.55 0.07 0.06 0.02 64.350 35.50 0.045
    393 72.2 25.8 1.60 0.35 0.05 64.200 35.40 4.571
    394 71.0 27.0 1.26 0.06 0.65 0.08 64.700 34.56 0.048 1.938
    395 72.0 26.2 1.25 0.08 0.37 0.05 0.06 65.750 33.70 0.064 3.378
    396 72.5 25.1 1.53 0.06 0.02 0.72 0.07 0.01 64.850 34.28 0.052 2.125
    397 71.5 26.7 1.48 0.04 0.04 0.21 0.03 0.02 0.02 64.100 35.58 0.054 7.048
  • [0090]
    TABLE 13
    Alloy Alloy composition (mass %)
    No. Cu Zn Si Co Fe Ni Sn P Zn − 2.5Si (Co + Fe + Ni)/Si Si/Sn
    Comparative 401 94.70 5.3 5.30
    example 1 402 89.80 10.2 10.20
    403 85.10 14.9 14.90
    404 79.40 20.6 20.60
    405 69.90 30.1 30.10
    406 65.20 34.8 34.80
    407 88.32 9.5 2.10 0.08 9.50
    408 82.08 17.6 0.32 16.80
    409 96.47 2.1 1.18 0.25 −0.85 4.720
    410 78.36 19.9 1.44 0.09 0.21 16.30 0.063 6.857
    411 79.78 17.9 0.52 0.05 1.75 16.60 0.096 0.297
    412 96.69 2.8 0.48 0.03 1.60 0.063
    413 91.35 8.6 0.04 0.01 8.50 0.250
    414 86.41 10.9 2.61 0.08 4.38 0.031
    415 87.88 10.4 1.13 0.59 7.58 0.522
    416 87.05 11.1 1.23 0.62 8.03 0.504
    417 88.43 10.3 0.72 0.55 8.50 0.764
    418 88.20 9.8 1.31 0.17 0.26 0.26 6.53 0.527
    419 86.90 10.2 1.53 0.09 1.28 6.38 0.059 1.195
    420 88.51 9.4 0.76 1.33 7.50 0.571
    421 85.97 9.8 0.66 0.07 3.50 8.15 0.106 0.189
    422 88.30 8.8 0.45 0.42 0.28 1.75 7.68 1.556 0.257
  • [0091]
    TABLE 14
    Alloy Alloy composition (mass %)
    No. Cu Zn Si Co Sn Cu − 5Si Zn + 6Si (Co + Fe + Ni)/Si Si/Sn
    Comparative 423 69.80 30.2 69.80 30.20
    example 2 424 64.90 35.1 64.90 35.10
    425 74.97 23.8 1.23 68.82 31.18
    426 66.81 31.9 1.25 0.04 60.56 39.40 0.032
    427 74.74 23.0 2.21 0.05 63.69 36.26 0.023
    428 65.85 32.8 1.25 0.10 59.60 40.30 0.080
    429 67.12 32.5 0.35 0.03 65.37 34.60 0.086
    430 68.80 29.3 0.92 0.05 0.95 64.20 34.82 0.054 0.968
    431 73.31 23.7 1.80 0.04 1.15 64.31 34.50 0.022 1.565
  • [0092]
    TABLE 15
    Mechanical properies
    Mean Recrystal- Mechanical properies (Post workpiece) Bending
    grain lization Proof Tensile Proof Tesile characteristics Corrosion Electro-
    Alloy size temperature stress strength Elongation stress strength Elongation (Post cracking conductivity
    No. (μm) (° C.) (N/mm2) (N/mm2) (%) (N/mm2) (N/mm2) (%) workpiece) resistance (% IACS)
    Em- 101 2.4 350 308 416 45 504 572 15 16
    bod- 102 2.2 350 312 481 44 575 676 11 12
    iment 102A 1.8 480(20) 367 493 45 602 691 12 12
    1 103 2.0 400 347 493 45 593 688 11 12
    104 2.0 400 339 491 44 592 685 11 12
    105 2.1 350 328 489 44 586 682 13 12
    106 2.1 350 331 488 45 584 683 12 12
    107 1.9 350 360 528 43 610 739 7 Δ 10
    107A 1.7 550(10) 403 542 44 627 751 8 10
    108 2.0 350 355 508 42 599 725 8 Δ 10
    109 2.2 350 309 432 43 513 601 9 Δ 17
    110 2.1 400 353 448 41 528 625 14 16
    111 1.7 400 404 509 40 608 709 12 13
    111A 1.5 560(13) 444 525 40 626 723 13 13
    112 1.5 400 431 522 42 626 724 13 13
    113 1.6 400 417 515 40 615 716 13 13
    114 1.6 400 438 558 37 657 780 8 Δ 11
    115 1.1 400 500 610 35 713 834 7 Δ 10
    116 2.1 350 333 496 44 593 691 10 13
    117 1.7 400 372 501 41 622 733 10 13
    118 1.3 400 399 502 39 591 692 10 17
    119 2.3 400 312 452 40 548 638 9 13
    120 1.5 400 475 583 40 640 785 8 Δ Δ 13
    121 1.8 400 406 509 43 602 701 11 14
    122 2.0 350 354 493 45 615 705 11 13
    123 2.2 400 310 415 43 501 598 14 19
    124 1.6 400 439 562 38 543 754 8 Δ 11
    125 1.5 450 395 507 34 613 701 9 Δ 16
    126 1.6 400 429 548 37 648 771 8 Δ 11
    127 1.4 450 381 456 36 558 639 8 Δ 19
    128 1.9 400 337 470 39 552 657 10 13
  • [0093]
    TABLE 16
    Mechanical properies
    Mean Recrystal- Mechanical properies (Post workpiece) Bending
    grain lization Proof Tensile Proof Tesile characteristics Corrosion Electro-
    Alloy size temperature stress strength Elongation stress strength Elongation (Post cracking conductivity
    No. (μm) (° C.) (N/mm2) (N/mm2) (%) (N/mm2) (N/mm2) (%) workpiece) resistance (% IACS)
    Em- 129 1.5 400 412 544 38 630 742 9 Δ 11
    bod- 130 1.5 400 392 512 44 614 725 12 13
    iment 131 1.7 400 357 478 40 575 665 12 15
    1 132 1.3 400 413 517 40 628 730 11 12
    133 1.3 400 404 513 40 624 735 11 12
    134 1.4 450 430 558 36 559 784 9 Δ 12
    135 1.2 400 430 558 40 561 759 9 12
    136 1.8 400 383 510 37 604 702 9 Δ 16
    137 1.4 400 391 507 39 618 713 9 13
    138 1.3 400 400 515 42 600 708 12 12
    139 1.2 450 444 559 36 673 779 7 Δ 13
    140 2.0 400 314 434 40 510 614 14 14
    141 1.8 400 321 436 43 522 616 15 18
    142 1.9 350 357 499 44 547 689 12 12
    143 1.7 350 389 512 40 588 702 9 Δ 11
    144 2.3 350 325 447 43 515 627 13 16
    145 1.3 400 465 585 38 700 810 6 Δ 10
    146 1.1 400 490 606 37 712 822 7 Δ 11
    147 2.3 400 303 403 42 522 580 14 18
    148 1.2 400 443 565 40 701 787 10 12
    149 1.3 400 411 536 42 670 757 11 12
    150 1.3 400 414 541 43 675 753 11 12
    151 1.3 400 410 537 42 677 760 12 12
    152 1.2 400 425 552 43 688 770 11 12
    153 2.2 400 360 480 40 540 655 12 11
    154 1.4 400 402 538 41 645 750 11 11
    154A 1.3 710(5) 426 553 43 658 762 12 11
    155 1.8 350 363 506 42 593 691 11 12
    156 1.3 400 449 573 39 708 795 10 12
    157 1.1 450 434 561 36 706 780 7 Δ 17
    158 1.4 400 400 530 40 627 735 11 12
  • [0094]
    TABLE 17
    Mechanical properies
    Mean Recrystal- Mechanical properies (Post workpiece) Bending
    grain lization Proof Tensile Proof Tesile characteristics Corrosion Electro-
    Alloy size temperature stress strength Elongation stress strength Elongation (Post cracking conductivity
    No. (μm) (° C.) (N/mm2) (N/mm2) (%) (N/mm2) (N/mm2) (%) workpiece) resistance (% IACS)
    Em- 159 1.9 400 392 504 42 592 688 12 14
    bod- 160 1.3 400 412 542 40 623 741 10 11
    iment 161 2.0 400 355 482 40 560 665 12 11
    1 162 1.4 400 404 502 39 600 701 8 Δ 12
    163 1.2 400 472 595 36 688 800 7 Δ 10
    164 1.5 450 428 510 34 588 698 9 Δ 14
    165 1.6 400 382 510 40 601 705 11 12
    166 1.2 400 417 544 40 674 769 10 12
    167 1.4 400 409 537 41 648 750 11 13
    168 1.3 400 409 524 40 644 738 11 13
    169 1.3 400 408 525 40 645 745 11 13
    170 1.4 400 410 521 42 646 740 12 13
    171 1.4 400 400 517 42 640 730 13 13
    172 1.3 400 428 549 40 653 763 10 13
    173 1.9 400 382 474 34 535 654 9 14
    174 1.4 400 405 519 40 615 719 12 12
    175 1.3 400 419 530 41 630 730 13 12
    176 1.3 400 420 527 41 628 733 13 12
    177 1.1 400 476 599 36 716 823 7 Δ 10
    178 2.0 450 393 487 34 562 673 9 Δ 14
    179 1.5 400 403 520 41 613 720 12 12
    180 1.2 400 459 586 38 704 802 8 Δ 11
    180A 1.1 630(B) 482 597 38 721 813 9 11
    181 1.3 400 405 519 42 609 714 12 12
    182 2.1 400 336 441 43 515 621 13 18
    183 1.5 400 407 518 42 607 708 10 13
    184 1.4 450 423 491 35 563 662 8 Δ 16
    185 1.2 150 456 571 40 694 784 12 12
    186 1.2 400 444 567 41 692 778 11 13
  • [0095]
    TABLE 18
    Mechanical properies
    Mean Recrystal- Mechanical properies (Post workpiece) Bending
    grain lization Proof Tensile Proof Tesile characteristics Corrosion Electro-
    Alloy size temperature stress strength Elongation stress strength Elongation (Post cracking conductivity
    No. (μm) (° C.) (N/mm2) (N/mm2) (%) (N/mm2) (N/mm2) (%) workpiece) resistance (% IACS)
    Em- 201 3.2 350 251 347 41 412 466 15 28
    bod 202 2.6 350 257 366 41 433 498 14 23
    iment 202A 2.3 530(15)  287 379 42 451 507 15 23
    2 203 2.4 400 288 399 41 452 530 14 24
    204 2.4 400 275 390 41 449 525 14 24
    205 2.8 350 258 349 41 437 489 13 24
    206 3.1 350 265 390 42 486 536 11 Δ 25
    207 3.1 400 254 346 43 420 484 12 33
    208 2.8 400 263 372 41 485 542 10 29
    209 2.3 450 301 412 38 500 565 12 27
    209A 2.1 520(100) 322 423 40 515 570 13 27
    210 2.2 450 315 425 40 515 573 13 27
    211 2.3 450 305 418 41 503 568 14 28
    212 2.2 450 312 420 40 510 570 13 27
    213 2.8 450 274 393 37 480 535 10 29
    214 2.4 450 272 412 34 474 537 9 20
    215 2.1 400 359 469 42 550 647 8 Δ 20
    216 2.4 350 261 362 41 455 510 14 24
    217 2.5 400 306 411 42 488 558 12 Δ 26
    218 2.5 400 277 394 40 476 533 12 24
    219 2.7 400 257 360 41 448 502 13 25
    220 2.6 400 259 375 42 469 522 14 26
    221 2.0 450 322 439 35 513 564 9 Δ 20
    222 3.0 400 256 363 42 457 505 13 25
    223 2.8 400 283 398 41 478 534 12 Δ 26
    224 2.4 400 262 391 40 480 531 12 23
    225 2.8 400 270 358 42 430 492 12 32
    226 2.4 450 298 405 37 491 570 9 Δ 28
    227 2.1 450 320 438 35 515 592 9 Δ 27
  • [0096]
    TABLE 19
    Mechanical properies
    Mean Recrystal- Mechanical properies (Post workpiece) Bending
    grain lization Proof Tensile Proof Tesile characteristics Corrosion Electro-
    Alloy size temperature stress strength Elongation stress strength Elongation (Post cracking conductivity
    No. (μm) (° C.) (N/mm2) (N/mm2) (%) (N/mm2) (N/mm2) (%) workpiece) resistance (% IACS)
    Em- 228 2.7 400 259 356 40 445 488 11 27
    bod- 229 2.1 450 333 448 42 543 579 10 22
    iment 230 2.9 400 259 362 43 449 495 14 34
    2 231 2.2 400 301 419 42 512 578 13 21
    232 2.4 400 260 388 42 460 526 13 25
    233 2.8 400 312 422 43 515 581 11 Δ 25
    234 2.3 450 260 377 34 456 499 8 21
    235 2.4 400 257 386 40 477 525 13 25
    236 2.8 400 255 375 42 474 510 13 30
    237 2.4 400 268 376 40 474 514 13 25
    238 2.3 400 304 408 41 499 553 14 23
    239 2.6 350 331 410 41 523 590 12 20
    240 3.1 400 313 392 40 530 585 11 24
    241 3.0 400 327 400 41 540 591 12 24
    242 2.8 400 335 399 41 543 590 12 24
    243 2.8 400 351 415 40 551 600 11 24
    244 2.7 350 337 433 43 545 612 11 20
    245 3.3 350 256 345 42 425 475 14 28
    246 1.8 400 354 435 42 600 640 13 22
    247 1.7 400 380 443 41 608 655 12 22
    248 1.8 400 371 438 42 600 645 13 22
    249 1.8 400 365 435 42 599 642 13 22
    250 1.8 400 376 443 43 588 645 11 22
    250A 1.7 520(20) 390 455 43 600 653 12 22
    251 1.4 400 396 473 38 617 673 9 Δ 19
    252 1.7 400 365 440 40 606 643 11 24
    253 1.7 450 390 458 38 595 663 10 23
    254 1.8 400 365 430 40 590 636 11 22
  • [0097]
    TABLE 20
    Mechanical properies
    Mean Recrystal- Mechanical properies (Post workpiece) Bending
    grain lization Proof Tensile Proof Tesile characteristics Corrosion Electro-
    Alloy size temperature stress strength Elongation stress strength Elongation (Post cracking conductivity
    No. (μm) (° C.) (N/mm2) (N/mm2) (%) (N/mm2) (N/mm2) (%) workpiece) resistance (% IACS)
    Em- 255 2.3 350 302 385 41 470 525 14 23
    bod- 256 1.7 400 396 469 41 608 679 12 21
    iment 257 1.8 400 411 472 37 630 693 10 Δ 20
    2 258 3.2 400 269 374 43 484 518 11 32
    259 2.1 400 411 487 42 628 701 8 Δ Δ 21
    260 2.0 400 354 434 42 578 625 12 22
    261 2.2 400 323 404 41 530 578 12 23
    262 2.0 400 355 439 40 575 632 11 20
    263 2.4 450 302 381 40 480 524 12 21
    264 1.5 400 366 469 42 619 678 9 Δ 18
    265 1.8 400 363 440 40 566 639 12 21
    265A 1.7 750(4) 377 450 41 575 645 12 21
    266 1.7 400 380 448 40 585 650 12 20
    267 1.7 400 379 452 41 590 665 13 21
    268 1.4 450 403 492 40 638 700 11 20
    269 1.8 400 360 438 41 587 624 12 21
    270 3.0 400 271 371 42 492 530 14 28
    271 2.0 400 332 413 41 548 590 13 23
    272 1.7 400 389 465 42 612 664 12 20
    273 1.9 400 334 416 40 555 590 13 23
    274 2.1 400 388 457 40 574 633 12 25
    275 2.0 400 334 409 41 536 584 12 23
    276 1.8 400 332 410 40 537 586 11 22
    277 1.5 400 458 531 39 672 721 9 20
    278 2.0 400 341 414 42 550 591 13 23
    279 1.7 400 388 460 40 605 658 11 22
    280 1.7 400 396 475 39 615 680 12 21
    281 1.3 450 430 492 35 638 702 9 23
  • [0098]
    TABLE 21
    Mechanical properies
    Mean Recrystal- Mechanical properies (Post workpiece) Bending
    grain lization Proof Tensile Elonga- Proof Tesile Elonga- characteristics Corrosion Electro-
    Alloy size temperature stress strength tion stress strength tion (Post cracking conductivity
    No. (μm) (° C.) (N/mm2) (N/mm2) (%) (N/mm2) (N/mm2) (%) workpiece) resistance (% IACS)
    301 3.1 300 310 502 38 635 729 6 Δ 13
    302 3.2 300 324 518 35 658 756 6 Δ 13
    302A 3.0    500(15) 339 527 37 670 765 7 Δ 13
    303 2.9 350 345 533 35 673 788 6 Δ 13
    304 2.8 350 352 540 35 685 775 6 Δ 13
    305 2.9 300 340 535 36 685 776 6 12
    306 3.3 350 266 453 39 589 667 7 Δ 16
    307 2.9 350 305 495 36 621 717 6 Δ 15
    308 2.7 350 332 526 34 670 762 6 Δ 13
    309 2.2 350 360 541 32 677 774 5 Δ 14
    310 2.4 350 372 569 35 713 824 6 12
    311 2.3 350 382 580 32 729 841 5 Δ 12
    312 1.9 350 392 580 34 751 860 5 Δ 11
    313 2.6 350 346 541 35 682 784 6 13
    314 2.4 350 360 556 35 716 811 6 12
    314A 2.3    550(10) 372 565 36 725 817 7 12
    315 2.3 350 375 567 36 728 819 6 12
    316 2.3 350 376 569 36 733 822 6 12
    317 2.7 350 338 533 35 670 773 6 Δ 12
    318 2.4 400 349 546 32 694 792 5 12
    319 3.4 300 253 433 39 559 638 7 Δ 17
    320 2.7 350 339 535 36 675 776 6 12
    321 3.4 350 255 443 38 568 647 6 Δ 16
    322 2.1 400 377 574 35 726 832 5 11
    323 2.8 350 342 537 35 685 788 6 Δ 12
    324 2.6 350 358 555 34 702 805 5 12
    325 2.8 350 293 481 34 615 702 6 Δ Δ 18
    326 2.4 350 353 548 35 803 807 6 12
  • [0099]
    TABLE 22
    Mechanical properies Bending
    Mean Recrystal- Mechanical properies (Post workpiece) charac-
    grain lization Proof Tensile Elonga- Proof Tesile Elonga- teristics Corrosion Electro-
    Alloy size temperature stress strength tion stress strength tion (Post cracking conductivity
    No. (μm) (° C.) (N/mm2) (N/mm2) (%) (N/mm2) (N/mm2) (%) workpiece) resistance (% IACS)
    Embodiment 327 2.8 350 329 621 36 655 756 6 Δ 13
    3 328 2.8 350 341 536 35 697 792 6 Δ 12
    329 2.7 350 343 539 35 680 781 6 12
    330 2.7 350 348 545 32 693 800 5 Δ Δ 12
    331 2.5 350 355 551 34 692 804 5 12
    332 2.4 350 348 543 35 698 802 8 12
    333 2.5 350 350 545 35 695 796 6 Δ 13
    334 2.6 350 381 557 33 710 818 5 12
    335 2.8 350 346 545 35 681 790 5 11
    336 2.8 350 363 556 31 688 806 4 11
    337 2.7 350 352 542 35 688 796 6 12
    338 2.3 350 365 559 36 714 826 6 12
    338A 2.2 640(5) 377 567 37 722 833 7 12
    339 2.2 350 381 570 37 720 832 7 12
    340 2.2 350 375 568 38 723 833 6 12
    341 2.2 350 373 569 36 718 829 6 12
    342 1.8 400 398 594 34 756 865 4 Δ 11
    343 2.3 350 366 560 34 714 817 6 Δ 12
    344 2.6 350 348 536 36 670 783 5 13
    345 3.0 350 346 536 32 663 777 4 Δ Δ 12
    346 2.4 350 350 545 34 685 780 5 13
    347 2.5 350 363 558 35 702 809 6 12
    348 2.8 350 337 537 33 678 779 5 12
    349 2.4 350 360 558 35 699 814 6 11
    350 2.7 350 333 527 36 669 764 6 12
    351 1.9 400 416 615 31 780 892 4 Δ 11
    352 2.5 350 359 551 34 702 810 6 12
    353 2.2 350 367 562 33 720 830 5 12
  • [0100]
    TABLE 23
    Mechanical properies Bending
    Mean Recrystal- Mechanical properies (Post workpiece) charac-
    grain lization Proof Tensile Elonga- Proof Tesile Elonga- teristics Corrosion Electro-
    Alloy size temperature stress strength tion stress strength tion (Post cracking conductivity
    No. (μm) (° C.) (N/mm2) (N/mm2) (%) (N/mm2) (N/mm2) (%) workpiece) resistance (% IACS)
    Embodiment 354 2.1 350 377 570 33 725 836 5 12
    3 355 2.1 350 381 572 34 722 836 5 12
    356 2.1 350 375 568 35 733 835 5 12
    357 1.8 350 417 610 31 767 885 4 Δ 11
    358 2.4 350 354 548 35 699 804 6 12
    359 2.3 350 364 560 34 727 823 6 12
    360 2.4 350 368 551 34 688 801 5 Δ 12
    361 2.4 350 385 556 34 706 811 6 11
    362 2.4 350 377 564 32 708 818 4 Δ 11
    363 2.3 350 351 545 34 695 790 6 12
    364 2.9 350 307 480 34 615 698 4 Δ 18
    365 3.1 350 335 530 31 653 765 4 Δ Δ 14
    366 2.2 350 377 573 33 724 831 5 11
    367 3.1 350 297 478 36 612 693 6 Δ Δ 16
    368 2.9 300 316 510 37 644 740 6 12
    369 2.7 350 339 540 36 670 783 6 12
    370 2.5 350 344 538 36 681 785 6 12
    371 2.3 350 377 575 34 715 833 5 11
    372 2.4 350 353 548 35 693 804 6 12
    373 2.5 350 354 557 33 700 808 5 12
    374 2.6 350 331 531 35 666 770 6 12
    375 2.8 350 330 523 36 654 758 6 13
    376 2.4 350 354 549 35 705 810 6 12
    377 2.4 350 361 558 35 711 824 6 12
    378 2.3 350 369 567 34 723 832 6 12
    379 2.7 350 334 536 33 676 777 6 12
    380 2.7 350 369 553 33 695 802 4 Δ 12
    381 2.4 350 372 566 34 720 831 5 12
  • [0101]
    TABLE 24
    Mechanical properies Bending
    Mean Recrystal- Mechanical properies (Post workpiece) charac-
    grain lization Proof Tensile Elonga- Proof Tesile Elonga- teristics Corrosion Electro-
    Alloy size temperature stress strength tion stress strength tion (Post cracking conductivity
    No. (μm) (° C.) (N/mm2) (N/mm2) (%) (N/mm2) (N/mm2) (%) workpiece) resistance (% IACS)
    Embodiment 382 2.5 350 350 545 34 892 791 6 12
    3 383 2.5 350 345 539 36 684 782 6 12
    384 2.1 350 389 585 34 737 859 5 Δ 11
    385 2.3 350 354 547 36 698 803 6 12
    386 2.4 350 359 556 35 698 806 6 12
    387 2.4 350 368 562 34 715 829 6 12
    388 3.0 300 338 530 35 681 770 6 12
    389 2.9 300 342 545 35 675 775 6 12
    390 2.7 350 333 527 34 668 760 6 Δ 13
    391 2.3 350 372 572 32 720 825 5 Δ 12
    392 2.4 350 370 563 35 725 814 6 12
    393 2.8 350 354 652 34 685 798 5 11
    394 2.8 350 353 545 33 673 787 5 Δ 12
    395 2.6 350 352 640 36 678 790 5 13
    396 1.9 350 408 601 31 755 866 4 Δ 11
    397 2.5 350 360 555 34 703 815 5 12
  • [0102]
    TABLE 25
    Mechanical properies Bending
    Mean Recrystal- Mechanical properies (Post workpiece) charac-
    grain lization Proof Tensile Elonga- Proof Tesile Elonga- teristics Corrosion Electro-
    Alloy size temperature stress strength tion stress strength tion (Post cracking conductivity
    No. (μm) (° C.) (N/mm2) (N/mm2) (%) (N/mm2) (N/mm2) (%) workpiece) resistance (% IACS)
    Comparative 401 6.5 350 136 267 42 345 388 13 56
    example 1 402 4.0 350 198 322 44 387 425 14 44
    403 4.5 350 202 345 44 422 464 14 Δ 37
    404 4.5 350 210 365 45 485 517 12 X 32
    405 4.5 300 235 419 46 513 582 10 X 28
    406 4.5 300 226 416 42 508 578 8 Δ X 28
    407 4.0 350 242 408 40 515 585 7 Δ Δ 28
    408 4.0 350 248 388 41 452 490 12 X 25
    409 4.5 450 241 368 42 443 485 14 12
    410 1.2 400 501 598 36 688 807 5 X X 14
    411 1.3 400 438 522 37 612 719 5 X X 17
    412 5.5 400 199 328 42 393 436 15 16
    413 4.5 350 201 307 44 391 415 16 38
    414 1.1 400 487 623 36 734 854 4 X 7
    415 1.3 450 430 510 35 602 712 6 X 16
    416 1.3 450 440 525 34 613 730 5 X 14
    417 1.6 450 366 451 34 573 631 8 X 22
    418 1.2 450 465 538 32 630 752 5 X 15
    419 1.2 400 448 576 37 647 798 5 X 12
    420 2.0 350 357 452 38 535 643 8 X 16
    421
    422 1.6 450 395 470 32 605 678 5 X 26
  • [0103]
    TABLE 26
    Mechanical properies Bending
    Mean Recrystal- Mechanical properies (Post workpiece) charac-
    grain lization Proof Tensile Elonga- Proof Tesile Elonga- teristics Corrosion Electro-
    Alloy size temperature stress strength tion stress strength tion (Post cracking conductivity
    No. (μm) (° C.) (N/mm2) (N/mm2) (%) (N/mm2) (N/mm2) (%) workpiece) resistance (% IACS)
    Comparative 423 4.5 300 238 419 38 533 609 7 X 28
    example 2 424 4.5 300 237 421 36 535 614 6 X 28
    425
    426 2.8 350 333 537 28 685 753 2 X X 13
    427
    428 2.7 350 338 546 27 688 748 2 X X 13
    429 4.0 350 246 448 37 572 645 7 X 20
    430 2.9 350 363 540 29 685 766 2 X Δ 12
    431
  • INDUSTRIAL APPLICABILITY
  • As understood from Tables 15 to 26, in comparison with first and second comparative example alloys having neither alloy composition nor recrytallized structure specified at the beginning, it becomes possible for the first to third invention copper alloys to realize the grain refinement and to improve greatly the machinability and bending characteristics. It is possible for the present invention alloy to be used preferably as plate, rod and wire materials even in difficult applications in which the prior high strength copper alloy cannot be used. In addition, it is possible to obtain the grain refinement and strength improvement by the recrystallization treatment due to the rapid high temperature heating processes. Furthermore, though not shown in Tables 15 to 26, as regards said post workpiece (pieces that the cold rolling and wire drawing are performed additionally for the rolled stock and wire drawing material after the recrystallization) heat-treated for 1 second to 4 hours at 150 to 600° C., it was confirmed that spring deflection limit and stress relaxation characteristics are greatly improved. [0104]

Claims (34)

1. A high strength copper alloy characterized in that said copper alloy consists essentially of 4 to 19 mass percent of Zn, 0.5 to 2.5 mass percent of Si and the remaining mass percent of Cu, wherein said mass percent of Zn and said mass percent of Si satisfy the relationship Zn-2.5.Si=0 to 15 mass percent; mean grain size D of crystalline structure of said copper alloy distributes in 0.3 μm≦D≦3.5 μm; and 0.2% yield strength in recrystallization state of said copper alloy is higher than 250 N/mm2.
2. The high strength copper alloy according to claim 1, wherein said copper alloy contains 0.005 to 0.5 mass percent of Co, wherein said mass percent of Co and said mass percent of Si satisfy the relationship Co/Si=0.005 to 0.5.
3. The high strength copper alloy according to claim 1, wherein said copper alloy contains 0.03 to 1.5 mass percent of Sn, wherein said mass percent of Sn and said mass percent of Si satisfy the relationship Si/Sn≧1.5.
4. The high strength copper alloy according to claim 2, wherein said copper alloy contains 0.03 to 1.5 mass percent of Sn, wherein said mass percent of Sn and said mass percent of Si satisfy the relationship Si/Sn≧1.5.
5. The high strength copper alloy according to claim 1, wherein said copper alloy contains 0.005 to 0.3 mass percent of Fe and/or 0.005 to 0.3 mass percent of Ni, wherein said mass percent of Fe, said mass percent of Ni and said mass percent of Si satisfy the relationship (Fe+Ni)/Si=0.005 to 0.5.
6. The high strength copper alloy according to claim 3, wherein said copper alloy contains 0.005 to 0.3 mass percent of Fe and/or 0.005 to 0.3 mass percent of Ni, wherein said mass percent of Fe, said mass percent of Ni and said mass percent of Si satisfy the relationship (Fe+Ni)/Si=0.005 to 0.5.
7. The high strength copper alloy according to claim 2, wherein said copper alloy contains 0.005 to 0.3 mass percent of Fe and/or 0.005 to 0.3 mass percent of Ni, wherein said mass percent of Fe, said mass percent of Ni, said mass percent of Co and said mass percent of Si satisfy the relationship (Fe+Ni+Co)/Si=0.005 to 0.5.
8. The high strength copper alloy according to claim 4, wherein said copper alloy contains 0.005 to 0.3 mass percent of Fe and/or 0.005 to 0.3 mass percent of Ni, wherein said mass percent of Fe, said mass percent of Ni, said mass percent of Co and said mass percent of Si satisfy the relationship (Fe+Ni+Co)/Si=0.005 to 0.5.
9. A high strength copper alloy characterized in that said copper alloy consists essentially of 4 to 17 mass percent of Zn, 0.1 to 0.8 mass percent of Si and the remaining mass percent of Cu, wherein said mass percent of Zn and said mass percent of Si satisfy the relationship Zn-2.5.Si=2˜15 mass percent; mean grain size D of crystalline structure of said copper alloy distributes in 0.3 μm≦D≦3.5 μm; and 0.2% yield strength in recrystallization state of said copper alloy is higher than 250 N/mm2.
10. The high strength copper alloy according to claim 9, wherein said copper alloy contains 0.005 to 0.5 mass percent of Co, wherein said mass percent Co and said mass percent of Si satisfy the relationship Co/Si=0.02 to 1.5.
11. The high strength copper alloy according to claim 9, wherein said copper alloy contains 0.2 to 3 mass percent of Sn, wherein said mass percent of Sn and said mass percent of Si satisfy the relationship Si/Sn≦0.5.
12. The high strength copper alloy according to claim 10, wherein said copper alloy contains 0.2 to 3 mass percent of Sn, wherein said mass percent of Sn and said mass percent of Si satisfy the relationship Si/Sn≦0.5.
13. The high strength copper alloy according to claim 9, wherein said copper alloy contains 0.005 to 0.3 mass percent of Fe and/or 0.005 to 0.3 mass percent of Ni, wherein said mass percent of Fe, said mass percent of Ni and said mass percent of Si satisfy the relationship (Fe+Ni)/Si=0.02 to 1.5.
14. The high strength copper alloy according to claim 11, wherein said copper alloy contains 0.005 to 0.3 mass percent of Fe and/or 0.005 to 0.3 mass percent of Ni, wherein said mass percent Fe, said mass percent of Ni and said mass percent of Si satisfy the relationship (Fe+Ni)/Si=0.02 to 1.5.
15. The high strength copper alloy according to claim 10, wherein said copper alloy contains 0.005 to 0.3 mass percent of Fe and/or 0.005 to 0.3 mass percent of Ni, wherein said mass percent of Fe, said mass percent of Ni, said mass percent of Co and said mass percent of Si satisfy the relationship (Fe+Ni+Co)/Si=0.02 to 1.5.
16. The high strength copper alloy according to claim 12, wherein said copper alloy contains 0.005 to 0.3 mass percent of Fe and/or 0.005 to 0.3 mass percent of Ni, wherein said mass percent of Fe, said mass percent of Ni, said mass percent of Co and said mass percent of Si satisfy the relationship (Fe+Ni+Co)/Si=0.02 to 1.5.
17. The high strength copper alloy according to any one of claims 1 through 16, wherein said copper alloy contains at least one element selected from a group of P, Sb, As, Sr, Mg, Y, Cr, La, Ti, Mn, Zr, In and Hf, wherein content of said element is 0.003 to 0.3 mass percent.
18. A high strength copper alloy characterized in that said copper alloy consists essentially of 66 to 76 mass percent of Cu, 21 to 33 mass percent of Zn and 0.5 to 2 mass percent of Si and the remaining mass percent of Cu, wherein said mass percent of Cu, said mass percent of Zn and said mass percent of Si satisfy the relationship Cu-5.Si=62 to 67 mass percent and Zn+6.Si=32 to 38 mass percent; mean grain size D of crystalline structure of said copper alloy distributes in 0.3 μm≦D≦3.5 μm; and 0.2% yield strength in recrystallization state of said copper alloy is higher than 250 N/mm2.
19. The high strength copper alloy according to claim 18, wherein said copper alloy contains 0.005 to 0.3 mass percent of Co, wherein said mass percent of Co and said mass percent of Si satisfy the relationship Co/Si=0.005 to 0.4.
20. The high strength copper alloy according to claim 18, wherein said copper alloy contains 0.03 to 1 mass percent of Sn, wherein said mass percent of Si and said mass percent of Sn satisfy the relationship Si/Sn≧1.
21. The high strength copper alloy according to claim 19, wherein said copper alloy contains 0.03 to 1 mass percent of Sn, wherein said mass percent of Si and said mass percent of Sn satisfy the relationship Si/Sn≧1.
22. The high strength copper alloy according to claim 18, wherein said copper alloy contains 0.005 to 0.3 mass percent of Fe and/or 0.005 to 0.3 mass percent of Ni, wherein said mass percent of Fe, said mass percent of Ni and said mass percent of Si satisfy the relationship (Fe+Ni)/Si=0.005 to 0.4.
23. The high strength copper alloy according to claim 20, wherein said copper alloy contains 0.005 to 0.3 mass percent of Fe and/or 0.005 to 0.3 mass percent of Ni, wherein said mass percent of Fe, said mass percent of Ni and said mass percent of Si satisfy the relationship (Fe+Ni)/Si=0.005 to 0.4.
24. The high strength copper alloy according to claim 19, wherein said copper alloy contains 0.005 to 0.3 mass percent of Fe and/or 0.005 to 0.3 mass percent of Ni, wherein said mass percent of Fe, said mass percent of Ni, said mass percent of Co and said mass percent of Si satisfy the relationship (Fe+Ni+Co)/Si=0.005 to 0.4.
25. The high strength copper alloy according to claim 21, wherein said copper alloy contains 0.005 to 0.3 mass percent of Fe and/or 0.005 to 0.3 mass percent of Ni, wherein said mass percent of Fe, said mass percent of Ni, said mass percent of Co and said mass percent of Si satisfy the relationship (Fe+Ni+Co)/Si=0.005 to 0.4.
26. The high strength copper alloy according to any one of claims 18 through 25, wherein said copper alloy contains at least one element selected from a group of P, Sb, As, Sr, Mg, Y, Cr, La, Ti, Mn, Zr, In and Hf, wherein content of P, Sb, or As is 0.005 to 0.3 mass percent, content of Sr, Mg, Y, Cr, La, Ti, Mn, Zr, In or Hf is 0.003 to 0.3 mass percent, and total content in a case selected from at least P, Sb or As is 0.005 to 0.25 mass percent.
27. The high strength copper alloy according to any one of claims 1 through 26, wherein said copper alloy is recrystallized material obtained from recrystallization of plastic working blank, which is formed by plastic working including cold working with working rate being more than 30 percent.
28. The high strength copper alloy according to claim 27, wherein said recrystallized materials are obtained by heat-treatment of said plastic working blank at the range from 450 to 750° C. for 1 to 1000 seconds.
29. The high strength copper alloy according to claim 27, wherein said cold working materials are obtained by cold rolling works or cold wire drawing of said recrystallized materials.
30. The high strength copper alloy according to claim 29, wherein said copper alloy is obtained by heat-treatment of said cold working materials at the range from 150 to 600° C. for 1 second to 4 hours.
31. The high strength copper alloy according to claim 29, wherein said copper alloys are manufactured pieces obtained by working said cold working materials to a predetermined form.
32. The high strength copper alloy according to claim 31, wherein said copper alloy is obtained by heat-treatment of said cold working materials at the range from 150 to 600° C. for 1 second to 4 hours.
33. The high strength copper alloy according to any one of claims 1 through 17, wherein said copper alloy is rolled material or manufactured piece with a predetermined form obtained by working said rolled material.
34. The high strength copper alloy according to any one of claims 18 through 26, wherein said copper alloys are wire drawing material or manufactured pieces with a predetermined form obtained by working said wire drawing material.
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KR100565979B1 (en) 2006-03-30
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