US20030006268A1 - Method and device for making a metal bump with an increased height - Google Patents

Method and device for making a metal bump with an increased height Download PDF

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Publication number
US20030006268A1
US20030006268A1 US09/987,497 US98749701A US2003006268A1 US 20030006268 A1 US20030006268 A1 US 20030006268A1 US 98749701 A US98749701 A US 98749701A US 2003006268 A1 US2003006268 A1 US 2003006268A1
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Prior art keywords
metal
vertical passage
metal wire
chip
tubular member
Prior art date
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Abandoned
Application number
US09/987,497
Inventor
Wen-Lo Shieh
Ning Huang
Hui-Pin Chen
Hua-Wen Chiang
Chung-Ming Chang
Feng-Chang Tu
Fu-Yu Huang
Hsuan-Jui Chang
Chia-Chieh Hu
Wen-Long Leu
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Orient Semiconductor Electronics Ltd
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Orient Semiconductor Electronics Ltd
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Application filed by Orient Semiconductor Electronics Ltd filed Critical Orient Semiconductor Electronics Ltd
Assigned to ORIENT SEMICONDUCTOR ELECTRONICS LIMITED reassignment ORIENT SEMICONDUCTOR ELECTRONICS LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, CHUNG MING, CHANG, HSUAN JUI, CHEN, HUI-PIN, CHIANG, HUA WEN, HU, CHIA-CHIEH, HUANG, FU YU, HUANG, NING, LEU, WEN-LONG, SHIEH, WEN LO, TU, FENG CHANG
Publication of US20030006268A1 publication Critical patent/US20030006268A1/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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Definitions

  • This invention is related to a method and device for making a metal bump with an increased height and in particular to one which can increase the connection reliability between the metal bump and the chip and enlarging the contact area between the metal bump and the metal or solder ball.
  • FCOB flip chip on board
  • FCIP flip chip in package
  • the capillary tube is still the most commonly used tool for making metal bumps by means of wire bonding.
  • the capillary tube has an inner diameter with an inner wall and has a larger diameter at the upper end than the lower end. A metal wire is inserted into the capillary tube and the lower end of the metal wire is melted to form a ball shaped member by electric spark.
  • the metal bump will have a spherical surface which is insufficient to provide a large contact area and a reliable structure for joining other component parts. Furthermore, the bottom of the metal bump will tend to go beyond the lower opening of the capillary tube under pressure thereby making it difficult to control. Moreover, as the metal bump has a spherical surface, there will not be sufficient area in contact with a metal or solder ball.
  • the metal bump is so short that the metal or solder ball must be soldered to the metal bump at a very low position thereby making it difficult to make the connection between the chip and the fingers of a substrate (or lead frame, chips, metal bumps or the like) and therefore influencing the qualification rate of products.
  • FIG. 2A illustrates the lower end of a metal wire being melted to form a ball shaped member according to the present invention
  • FIG. 2B illustrates how the lower end of the metal wire is joined with the chip according to the present invention
  • FIG. 2C illustrates a metal bump according to the present invention
  • FIGS. 3A and 3B illustrate the connection between the metal bump and the metal or solder ball according to the present invention.
  • FIGS. 4A and 4B illustrate the connection between the metal bump and the metal or solder ball according to the prior art.
  • the metal bump according to the present invention is manufactured by a hard conical tubular member 20 having a vertical passage 21 which is conical in shape and has a larger diameter at the bottom 231 so that the lower portion 23 of the vertical passage 21 is larger than the upper portion 24 of the vertical passage 21 .
  • the vertical passage 21 has an inner surface 22 .
  • a metal wire 3 is inserted into the vertical passage 21 of the hard conical tubular member 20 , with its lower end protruded downwardly out of the vertical passage 21 . Then, the lower end of the metal wire 3 is melted to form a ball 31 .
  • the hard conical tubular member 2 is approached to a raised platform 11 formed on the top of a chip 1 , and a load (not shown) is applied to the metal wire 3 and the metal wire 3 is heated and bonded on the pad of die and ultrasonic energy is applied to deform the melted metal so as to fill up the lower portion 23 of the vertical passage 21 , thereby forming a metal bump 32 on the raised platform 11 of the chip 1 .
  • the hard conical tubular member 2 is removed to pull off the necking position between the metal wire 3 and the top of the metal bump 32 thereby leaving the metal bump 32 on the raised platform 11 of the chip 1 .
  • the metal bump 32 will be formed with a flange 321 at the bottom thereof (see FIG. 2B).
  • the metal bump 32 will have an increased height 232 thereby increasing the joining capability between the metal bump 32 and the raised platform 11 of the semiconductor chip 1 and enlarging the contact area 33 between the metal bump 32 and the metal or solder ball 4 .
  • the metal or solder ball 4 As the metal or solder ball 4 is joined to the metal bump 32 (see FIGS. 3A and 3B), the metal or solder ball 4 will be pressed by a soldering finger 5 thereby deforming the shape of the metal or solder ball 4 and therefore causing the deformed metal or solder ball 4 to go outwardly. In the meantime, the flange 321 of the metal bump 32 will block the metal or solder ball 4 to overflow to the raised platform 11 of the chip 1 . Referring to FIGS.
  • the metal or solder ball 4 ′ will be pressed by a soldering finger 5 ′ when the metal or solder ball 4 ′ is joined to the metal bump 32 ′, thereby deforming the shape of the metal or solder ball 4 ′ and therefore causing the deformed metal or solder ball 4 ′ to overflow to the raised platform 11 ′ of the chip 1 ′.
  • the connection reliability between the chip and the fingers of a substrate or lead frame, chips, metal bumps or the like

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

A device for making metal bumps includes a hard conical tubular member having a vertical passage which is conical in shape and has a larger diameter at a bottom such that a lower portion of the vertical passage is larger than an upper portion of the vertical passage, whereby a metal wire is inserted into the vertical passage of the hard conical tubular member, with a lower end of the metal wire protruded downwardly out of the vertical passage, the lower end of the metal wire is melted to form a ball, the hard conical tubular member is approached to a raised platform formed on a top of a chip, and a load is applied to the metal wire and the metal wire is heated and bonded on the pad of die and ultrasonic energy is applied to deform the melted metal so as to fill up the lower portion of the vertical passage thereby forming a metal bump on the raised platform of the chip, and finally the hard conical tubular member is removed to pull off the necking position between the metal wire and a top of the metal bump thereby leaving the metal bump on the raised platform of the chip.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • This invention is related to a method and device for making a metal bump with an increased height and in particular to one which can increase the connection reliability between the metal bump and the chip and enlarging the contact area between the metal bump and the metal or solder ball. [0002]
  • 2. Description of the Prior Art [0003]
  • Various kinds of methods of making metal bumps on a chip have been developed for flip chip on board (FCOB) technology with a small number of input pins or a small number of Input/Output pins or for flip chip in package (FCIP) with a large number of Input/Output pins, such as evaporation plating, splash plating, electroplating, printing, spraying, and bonding. However, the capillary tube is still the most commonly used tool for making metal bumps by means of wire bonding. The capillary tube has an inner diameter with an inner wall and has a larger diameter at the upper end than the lower end. A metal wire is inserted into the capillary tube and the lower end of the metal wire is melted to form a ball shaped member by electric spark. Then, ultrasonic vibration and pressure deformation processing are applied to the capillary tube to join the inter-metallic compounds between the wire and the chip. When the capillary tube is removed, a metal bump will be formed on the raised platform of the chip. Thereafter, a metal or solder ball is soldered on the metal bump. [0004]
  • However, due to the limitation of the design of the capillary tube, the metal bump will have a spherical surface which is insufficient to provide a large contact area and a reliable structure for joining other component parts. Furthermore, the bottom of the metal bump will tend to go beyond the lower opening of the capillary tube under pressure thereby making it difficult to control. Moreover, as the metal bump has a spherical surface, there will not be sufficient area in contact with a metal or solder ball. In addition, the metal bump is so short that the metal or solder ball must be soldered to the metal bump at a very low position thereby making it difficult to make the connection between the chip and the fingers of a substrate (or lead frame, chips, metal bumps or the like) and therefore influencing the qualification rate of products. [0005]
  • Therefore, it is an object of the present invention to provide a method and device for making a metal bump with an increased height which can obviate and mitigate the above-mentioned drawbacks. [0006]
    • SUMMARY OF THE INVENTION
  • This invention is related to a method and device for making a metal bump with an increased height. [0007]
  • It is the primary object of the present invention to provide a method and device for making metal bumps with an increased height which can increase the joining strength with other metal bumps or pads of a die. [0008]
  • It is another object of the present invention to provide a method and device for making metal bumps with an increased height which can enlarge the contact area with the metal or solder ball. [0009]
  • It is still another object of the present invention to provide a method and device for making metal bumps with an increased height which can increase its reliability in joining with other component parts. [0010]
  • It is a further object of the present invention to provide a method and device for making metal bumps which have an increased height but are small in diameter. [0011]
  • The foregoing object and summary provide only a brief introduction to the present invention. To fully appreciate these and other objects of the present invention as well as the invention itself, all of which will become apparent to those skilled in the art, the following detailed description of the invention and the claims should be read in conjunction with the accompanying drawings. Throughout the specification and drawings identical reference numerals refer to identical or similar parts. [0012]
  • Many other advantages and features of the present invention will become manifest to those versed in the art upon making reference to the detailed description and the accompanying sheets of drawings in which a preferred structural embodiment incorporating the principles of the present invention is shown by way of illustrative example. [0013]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a sectional view of a capillary tube according to the present invention; [0014]
  • FIG. 2A illustrates the lower end of a metal wire being melted to form a ball shaped member according to the present invention; [0015]
  • FIG. 2B illustrates how the lower end of the metal wire is joined with the chip according to the present invention; [0016]
  • FIG. 2C illustrates a metal bump according to the present invention; [0017]
  • FIGS. 3A and 3B illustrate the connection between the metal bump and the metal or solder ball according to the present invention; and [0018]
  • FIGS. 4A and 4B illustrate the connection between the metal bump and the metal or solder ball according to the prior art. [0019]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • For the purpose of promoting an understanding of the principles of the invention, reference will now be made to the embodiment illustrated in the drawings. Specific language will be used to describe same. It will, nevertheless, be understood that no limitation of the scope of the invention is thereby intended, alterations and filter modifications in the illustrated device, and further applications of the principles of the invention as illustrated herein being contemplated as would normally occur to one skilled in the art to which the invention relates. [0020]
  • Referring to the drawings and in particular to FIG. 1 thereof, the metal bump according to the present invention is manufactured by a hard conical [0021] tubular member 20 having a vertical passage 21 which is conical in shape and has a larger diameter at the bottom 231 so that the lower portion 23 of the vertical passage 21 is larger than the upper portion 24 of the vertical passage 21. The vertical passage 21 has an inner surface 22.
  • Referring to FIGS. 2A, 2B and [0022] 2C, a metal wire 3 is inserted into the vertical passage 21 of the hard conical tubular member 20, with its lower end protruded downwardly out of the vertical passage 21. Then, the lower end of the metal wire 3 is melted to form a ball 31. Thereafter, the hard conical tubular member 2 is approached to a raised platform 11 formed on the top of a chip 1, and a load (not shown) is applied to the metal wire 3 and the metal wire 3 is heated and bonded on the pad of die and ultrasonic energy is applied to deform the melted metal so as to fill up the lower portion 23 of the vertical passage 21, thereby forming a metal bump 32 on the raised platform 11 of the chip 1. Thereafter, the hard conical tubular member 2 is removed to pull off the necking position between the metal wire 3 and the top of the metal bump 32 thereby leaving the metal bump 32 on the raised platform 11 of the chip 1. As the bottom opening of the lower portion 23 of the vertical passage 21 is formed with an angle 231, the metal bump 32 will be formed with a flange 321 at the bottom thereof (see FIG. 2B).
  • Accordingly, the [0023] metal bump 32 will have an increased height 232 thereby increasing the joining capability between the metal bump 32 and the raised platform 11 of the semiconductor chip 1 and enlarging the contact area 33 between the metal bump 32 and the metal or solder ball 4.
  • As the metal or solder ball [0024] 4 is joined to the metal bump 32 (see FIGS. 3A and 3B), the metal or solder ball 4 will be pressed by a soldering finger 5 thereby deforming the shape of the metal or solder ball 4 and therefore causing the deformed metal or solder ball 4 to go outwardly. In the meantime, the flange 321 of the metal bump 32 will block the metal or solder ball 4 to overflow to the raised platform 11 of the chip 1. Referring to FIGS. 4A and 4B, according to the prior art, the metal or solder ball 4′ will be pressed by a soldering finger 5′ when the metal or solder ball 4′ is joined to the metal bump 32′, thereby deforming the shape of the metal or solder ball 4′ and therefore causing the deformed metal or solder ball 4′ to overflow to the raised platform 11′ of the chip 1′. Hence, the connection reliability between the chip and the fingers of a substrate (or lead frame, chips, metal bumps or the like) will be decreased and therefore influencing the qualification rate of products.
  • It will be understood that each of the elements described above, or two or more together may also find a useful application in other types of methods differing from the type described above. [0025]
  • While certain novel features of this invention have been shown and described and are pointed out in the annexed claim, it is not intended to be limited to the details above, since it will be understood that various omissions, modifications, substitutions and changes in the forms and details of the device illustrated and in its operation can be made by those skilled in the art without departing in any way from the spirit of the present invention. [0026]

Claims (1)

We claim:
1. A device for making metal bumps comprising a hard conical tubular member having a vertical passage which is conical in shape and has a larger diameter at a bottom such that a lower portion of said vertical passage is larger than an upper portion of said vertical passage, whereby a metal wire is inserted into said vertical passage of said hard conical tubular member, with a lower end of said metal wire protruded downwardly out of said vertical passage, said lower end of said metal wire is melted to form a ball, said hard conical tubular member is approached to a raised platform formed on a top of a chip, and a load is applied to said metal wire and said metal wire is heated and bonded on the pad of die and ultrasonic energy is applied to deform said melted metal so as to fill up said lower portion of said vertical passage thereby forming a metal bump on said raised platform of said chip, and finally said hard conical tubular member is removed to pull off the necking position between said metal wire and a top of said metal bump thereby leaving said metal bump on said raised platform of said chip.
US09/987,497 2001-05-31 2001-11-15 Method and device for making a metal bump with an increased height Abandoned US20030006268A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW90113434A TW515067B (en) 2001-05-31 2001-05-31 Metal bump having higher pillar and the fabricated device thereof
TW090113434A01 2001-07-09

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US20030006268A1 true US20030006268A1 (en) 2003-01-09

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US09/988,097 Expired - Fee Related US6499648B2 (en) 2001-05-31 2001-11-19 Method and device for making a metal bump with an increased height

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US (2) US20030006268A1 (en)
DE (2) DE10148463A1 (en)
TW (1) TW515067B (en)

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US20050090091A1 (en) * 2003-10-28 2005-04-28 Fujitsu Limited Method of forming multi-piled bump
CN110860759A (en) * 2019-12-26 2020-03-06 广州市谊华电子设备有限公司 Electric soldering iron robot capable of rapidly soldering tin
CN110935979A (en) * 2019-12-26 2020-03-31 广州市谊华电子设备有限公司 Soldering tin piece and electric soldering iron capable of quickly soldering tin

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US20050090091A1 (en) * 2003-10-28 2005-04-28 Fujitsu Limited Method of forming multi-piled bump
US7049217B2 (en) * 2003-10-28 2006-05-23 Fujitsu Limited Method of forming multi-piled bump
CN110860759A (en) * 2019-12-26 2020-03-06 广州市谊华电子设备有限公司 Electric soldering iron robot capable of rapidly soldering tin
CN110935979A (en) * 2019-12-26 2020-03-31 广州市谊华电子设备有限公司 Soldering tin piece and electric soldering iron capable of quickly soldering tin

Also Published As

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DE10148460A1 (en) 2002-12-05
DE10148463A1 (en) 2003-01-23
US6499648B2 (en) 2002-12-31
US20020179686A1 (en) 2002-12-05
TW515067B (en) 2002-12-21

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Effective date: 20011106

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