US20020195230A1 - Heat exchange structure of loop type heat pipe - Google Patents

Heat exchange structure of loop type heat pipe Download PDF

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Publication number
US20020195230A1
US20020195230A1 US10/173,398 US17339802A US2002195230A1 US 20020195230 A1 US20020195230 A1 US 20020195230A1 US 17339802 A US17339802 A US 17339802A US 2002195230 A1 US2002195230 A1 US 2002195230A1
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United States
Prior art keywords
passageway
loop
heat exchange
fluid return
vapor
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Abandoned
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US10/173,398
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English (en)
Inventor
Jia Li
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Individual
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Individual
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Publication of US20020195230A1 publication Critical patent/US20020195230A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops

Definitions

  • the present invention relates to a heat exchange structure of a loop type heat pipe and, more particularly, to a heat exchange structure of large heat transfer rate and better uniformity of temperature, whereby non-condensing gas existing in the heat pipe has little influence to the characteristic of the loop system.
  • a heat pipe type heat radiating apparatus has a heat pipe 1 .
  • a heat spreader 11 is disposed at an electronic device end that needs to be cooled.
  • the heat spreader 11 is connected with one end of the heat pipe 1 .
  • the other end of the heat pipe 1 can be connected to a heat radiator via another heat spreader, or the other end of the heat pipe 1 can directly clip a plurality of heat radiating fins 12 .
  • FIG. 1 shows a radiating fin type heat pipe.
  • the evaporation end of the heating region of the heat spreader 11 generates the vapor and provides vapor flow, which flows along the pipeline toward the condensation end of the cooling region at the other end, and then the vapor condenses into condensed liquid in the pipeline at the cooling region.
  • a capillary tissue 13 is then used to quickly guide the condensed liquid to flow from the cooling region toward the heating region, thereby replenishing liquid for the evaporation end that reduced by evaporation to accomplish circulative flow.
  • the primary object of the present invention is to provide a heat exchange structure of a loop type heat pipe, which forms a multiple-pipe type structure connecting an evaporation portion, a vapor passageway, a condensing portion, a fluid return passageway in series in this order.
  • the vapor passageway can be a single pipeline or more than two pipelines connected in parallel.
  • the fluid return passageway can also be a single pipeline or more than two pipelines connected in parallel.
  • a series- and parallel-connected architecture of single loop is thus formed to apply to heat exchang of higher efficiency.
  • the operational theory is using a guidance effect of flow resistance of pipeline to let the loop automatically generate circulative and stable unidirectional flow. The phenomenon of dry-out of the loop type heat pipe will hardly occur so that very good thermal performance can be achieved to acquire quite large amount of heat transfer rate.
  • Another object of the present invention is to provide a heat exchange structure of a loop type heat pipe, whereby the manufacture of a heat pipe can be performed at a low cost in consideration of economy, the effect of thermal performance of the heat pipe can be maintained, and quicker heat transfer can be achieved simultaneously.
  • Asymmetric phenomenon of heat flow in the loop to cause a guidance in the loop structure are exploited to let the heat exchange loop form a circulative pipeline so that non-condensing gas existing in the pipeline cannot stay and accumulate at the condensation portion of the pipeline.
  • the non-condensing gas will continually circulate along the pipeline to greatly enhance the uniformity of temperature and reduce the difference of temperature of the heat pipe. Therefore, even though the non-condensing gas in the heat pipe appears after manufacture, the function and characteristic of the heat pipe will be hardly affected. Moreover, the lifetime of use of the heat pipe can be extended.
  • the structure of the present invention has a closed loop, which is formed by connecting an evaporation portion, a vapor passageway, a condensation portion, a fluid return passageway in series in this order. Appropriate amount of liquid is filled in the loop.
  • the fluid return passageway and the vapor passageway are not at the same pipeline.
  • the flow resistance in the fluid return passageway is larger than that in the vapor passageway so that vapor forming at the evaporation portion will naturally flow toward the condensation portion.
  • the condensed liquid and the non-condensing gas along with the left vapor without condensing will flow stably and unidirectionally toward the fluid return passageway, flow back to the evaporation portion, and then flow into the vapor passageway, forming a circulative flow and obtaining a heat exchange device of good uniformity of temperature and quite large amount of heat transfer rate.
  • FIG. 1 is a cross-sectional view of a prior art heat pipe
  • FIG. 2 is a cross-sectional view of the present invention
  • FIG. 2A is an enlarged view of the part a shown in FIG. 2;
  • FIG. 3 is a side cross-sectional view of the present invention.
  • a heat exchange structure of a loop type heat pipe has a closed loop 2 , which is formed by connecting an evaporation portion 21 , a vapor passageway 22 , an condensation portion 23 , a fluid return passageway 24 in series in this order.
  • Appropriate amount of liquid 20 is filled in the loop 2 .
  • the amount of liquid will fill a capillary tissue and up to 90% of the volume of the loop.
  • the fluid return passageway 24 and the vapor passageway 22 are not at the same pipeline. That is, the vapor passageway 22 is an independent pipeline, and the fluid return passageway 24 is also an independent pipeline. This is different from a conventional heat pipe, wherein the vapor passageway and the fluid return passageway are at the same pipeline.
  • the flow resistance in the fluid return passageway 24 is larger than that in the vapor passageway. This is intentional to build imbalance of heat flow in the pipeline to form an asymmetric structure in the pipeline, causing a pressure difference. Therefore, vapor forming at the evaporation portion 21 will stably and unidirectionally flow toward the condensation portion 23 and condense at the condensation portion 23 to form condensed liquid flow. Under the effect of pressure difference of the loop to cause the guidance of the pipeline structure, the condensed liquid and the non-condensing gas along with the left vapor without condensing will flow stably and unidirectionally toward the fluid return passageway 24 , and then flow back to the evaporation portion 21 via the fluid return passageway 24 .
  • the evaporation portion 21 in the present invention is the heated portion of the loop 2 .
  • a heat spreader 3 can be joined between them.
  • the heat spreader 3 has a connected passageway 31 therein to connect the vapor passageway 22 and the fluid return passageway 24 .
  • the pipeline of the evaporation portion 21 can be thermally connected with a heat conductor (not shown), or the heat spreader 3 can be thermally connected with a heat source via a heat conductor.
  • the heat source can be the hot surface of an electronic device, usually being a central processing unit, but is not limited to the electronic device.
  • the evaporation portion is thermally connected with a heat exchange device to be cooled.
  • the heat exchange device to be cooled can be the heat spreader of a heat source, a fin sets, a water sleeve, or an evaporation portion of another loop, which means that a loop type heat pipe of the present invention is connected with another independent loop type heat pipe in series.
  • the condensation portion 23 of the present invention is the heat-radiating position of the loop, i.e., the primary heat-radiating region.
  • the loop itself is also a good heat-radiating structure.
  • a connection block 4 is provided.
  • the connection block 4 has a connected passageway 41 to connect the vapor passageway 22 and the fluid return passageway 24 .
  • the pipeline of the condensation portion or a more bigger connection block 4 is connected with a set of integral heat radiators or heat-radiating sheets 25 .
  • a set of heat-radiating sheets are embodied, and the connection block 4 can be a pipeline type.
  • the condensation portion is thermally connected with a heat exchange device.
  • the heat exchange device can be the heat spreader of a heat source, a set of heated fins, a cooling water sleeve, or an evaporation portion of another loop.
  • the vapor passageway 22 shown in FIG. 2 is a pair of pipelines. That is, the vapor passageway 22 be a single pipeline or more than two pipelines connected in parallel so that the total sum of the flow resistances of all the pipelines of the vapor passageway is smaller than the flow resistance of the fluid return passageway.
  • the flow resistance is controlled by the cross section, the length, and the shape of pipeline.
  • the vapor passageway has a small flow resistance at a high flow speed, while the fluid return passageway has a large flow resistance at a low flow speed, hence generating asymmetric heat flow intentionally formed in the loop to ensure a unidirectional flowing direction.
  • the fluid return passageway 24 in the figures is a single pipeline, but it also can be more than two pipelines connected in parallel.
  • the fluid return passageway 24 has a larger flow resistance than the vapor passageway, and the condensed fluid will only passes through the fluid return passageway to return to the evaporation portion, naturally forming guided flow of the loop.
  • This kind of flow is stable and unidirectional, and is intentionally limited to flowing along the designed direction to ensure the thermal performance.
  • the fluid return passageway will affect passage of non-condensing gas in this case, uniformity of temperature will be inferior. Degassing procedure to the loop can be exploited to remove the non-condensing gas to enhance uniformity of temperature.
  • the pipeline of the loop 2 has been arranged in serial, and the flow follows unidirectional circulation, non-condensing gas existing in the loop will not stay, but can only flow with the vapor flow or the condensed liquid flow in the loop. Therefore, in the present invention, the vapor passageway has large part of vapor flow and small part of condensed liquid flow and non-condensing gas therein, and the fluid return passageway has large part of condensed liquid flow and small part of vapor flow and non-condensing gas therein, hence forming quick and unidirectional circulation of flow. All the fluids in the heat pipe will flow toward the same direction and pass through any pipeline in the system. This is different from the conventional heat pipe. Good thermal performance, large amount of heat transfer rate, and small difference of temperature can thus be achieved.
  • the pipelines adopted in the present invention have the same outer diameters, but can have different inner diameters when being manufactured.
  • a capillary tissue 26 is placed in the fluid return passageway to shrink the inner diameter, hence increasing the flow resistance.
  • the capillary tissue 26 is only of the length of the fluid return passageway where condensed liquid flow passes through, or extends to the evaporation portion alone, or extends to the condensation portion alone, or extends to the evaporation portion and the condensation portion simultaneously.
  • a capillary tissue can also be further disposed in the vapor passageway to let the distribution of liquid be more uniform, but the flow resistance of the vapor passageway still must be smaller than that of the fluid return passageway.
  • the capillary tissue can be ceramic, sintered powder, foaming metal, a knitted net, a sintered net, a grooved plate, a fiber bundle, or a spiral wire.
  • the fluid return passageway must have space to let vapor and non-condensing gas pass through.
  • the present invention utilizes an independent pipe mechanism and forms an architecture of unequal flow resistance between the vapor passageway and the fluid return passageway.
  • the generated pressure difference, imbalanced heat flow, and capillary phenomenon are matched to form a serial, orderly, and unidirectional circulation structure of fluid.
  • the vapor passageway and the fluid return passageway can also form pipeline structures connected in parallel, respectively. It is only necessary that the flow resistance in the fluid return passageway 24 is larger than that in the vapor passageway 22 . Matched with the disposition of the heat spreader and the connection block, a connected annular loop can be obtained. Therefore, during the manufacture of pipelines of the present invention, heat can be conducted even without the degassing procedure.
  • the present invention has better uniformity of temperature, better thermal performance, and larger amount of heat transfer rate and quicker heat transfer. Because the degassing process is not required and the cleaning process is not important, the present invention has a simple manufacturing process to lower the cost and conform to economy.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
US10/173,398 2001-06-22 2002-06-18 Heat exchange structure of loop type heat pipe Abandoned US20020195230A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN01118855.3A CN1220028C (zh) 2001-06-22 2001-06-22 环路型热管热交换组件
CN01118855.3 2001-06-22

Publications (1)

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US20020195230A1 true US20020195230A1 (en) 2002-12-26

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CN (1) CN1220028C (zh)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070002537A1 (en) * 2005-06-30 2007-01-04 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
US20070002538A1 (en) * 2005-06-30 2007-01-04 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
US20070002540A1 (en) * 2005-06-30 2007-01-04 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
US20070175613A1 (en) * 2006-01-30 2007-08-02 Jaffe Limited Loop heat pipe
US20070177353A1 (en) * 2006-01-30 2007-08-02 Jaffe Limited Mechanism for connecting loop heat pipe and method therefor
US20070175615A1 (en) * 2006-01-30 2007-08-02 Jaffe Limited Loop heat pipe
US7256999B1 (en) * 2004-04-12 2007-08-14 Frontline Systems Heat collector plate for an electronic display
WO2009019380A1 (fr) * 2007-08-08 2009-02-12 Astrium Sas Dispositif passif de regulation thermique a micro boucle fluide a pompage capillaire
US7650932B2 (en) * 2006-01-30 2010-01-26 Jaffe Limited Loop heat pipe
US20120024499A1 (en) * 2010-07-30 2012-02-02 Asia Vital Components Co., Ltd. Loop type pressure-gradient-drien low-pressure thermosiphon device
US20140182819A1 (en) * 2013-01-01 2014-07-03 Asia Vital Components Co., Ltd. Heat dissipating device
CN108801020A (zh) * 2018-08-29 2018-11-13 扬州大学 一种自驱动气液脉动相变热管式隔热导流板
JP2019190812A (ja) * 2018-04-26 2019-10-31 泰碩電子股▲分▼有限公司 同じ管路が気流流路および液流流路に仕切られた還流ヒートパイプ
US11333443B2 (en) * 2018-09-25 2022-05-17 Shinko Electric Industries Co., Ltd. Loop heat pipe
CN114857968A (zh) * 2022-05-31 2022-08-05 广州大学 一种双环结构气体单向流反重力平板热管

Families Citing this family (13)

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CN100573416C (zh) 2005-07-15 2009-12-23 富准精密工业(深圳)有限公司 电脑系统及其散热模组
CN105698576A (zh) * 2014-11-24 2016-06-22 讯凯国际股份有限公司 具有液、汽分离的回路型热管结构
CN106052449A (zh) * 2016-07-29 2016-10-26 苏州聚力电机有限公司 回路型热管的并组连接部位端盖封闭结构
CN106091761A (zh) * 2016-07-29 2016-11-09 苏州聚力电机有限公司 一种回路型热管的并组连接部位端盖封闭结构
TWI638972B (zh) 2017-10-31 2018-10-21 力致科技股份有限公司 多管並聯式均熱裝置
CN110388840A (zh) * 2018-04-16 2019-10-29 泰硕电子股份有限公司 具有液弹管的回路热管
TWI688741B (zh) * 2018-10-12 2020-03-21 廣州力及熱管理科技有限公司 製作具有印刷毛細結構之超薄熱管板的方法
CN110160384B (zh) * 2019-01-11 2020-04-24 青岛海尔空调器有限总公司 芯片换热器及变频空调器
CN111623655B (zh) * 2019-02-27 2022-03-25 泽鸿(广州)电子科技有限公司 热交换装置
CN111761050B (zh) * 2019-04-01 2022-06-03 广州力及热管理科技有限公司 以金属浆料制作毛细结构的方法
TWI700472B (zh) * 2019-04-29 2020-08-01 大陸商昆山廣興電子有限公司 散熱模組
CN111190472A (zh) * 2020-02-24 2020-05-22 大连理工大学 服务器用大功率分离式热管散热器
CN112050673B (zh) * 2020-09-08 2021-09-24 中国矿业大学 一种具有对等分流结构的脉动热管

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7256999B1 (en) * 2004-04-12 2007-08-14 Frontline Systems Heat collector plate for an electronic display
US20090027840A1 (en) * 2005-06-30 2009-01-29 Kabushiki Kaisha Toshiba Cooling Device and Electronic Apparatus
US20080128113A1 (en) * 2005-06-30 2008-06-05 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
US7486518B2 (en) * 2005-06-30 2009-02-03 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
CN100496201C (zh) * 2005-06-30 2009-06-03 株式会社东芝 冷却装置和电子设备
US20070002537A1 (en) * 2005-06-30 2007-01-04 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
US20070002538A1 (en) * 2005-06-30 2007-01-04 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
US7372697B2 (en) * 2005-06-30 2008-05-13 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
US20070002540A1 (en) * 2005-06-30 2007-01-04 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
US7352581B2 (en) * 2005-06-30 2008-04-01 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
US7317616B2 (en) * 2006-01-30 2008-01-08 Jaffe Limited Mechanism for connecting loop heat pipe and method therefor
US7650932B2 (en) * 2006-01-30 2010-01-26 Jaffe Limited Loop heat pipe
US7654310B2 (en) * 2006-01-30 2010-02-02 Jaffe Limited Loop heat pipe
US20070175613A1 (en) * 2006-01-30 2007-08-02 Jaffe Limited Loop heat pipe
US20070175615A1 (en) * 2006-01-30 2007-08-02 Jaffe Limited Loop heat pipe
US7347250B2 (en) * 2006-01-30 2008-03-25 Jaffe Limited Loop heat pipe
US20070177353A1 (en) * 2006-01-30 2007-08-02 Jaffe Limited Mechanism for connecting loop heat pipe and method therefor
FR2919922A1 (fr) * 2007-08-08 2009-02-13 Astrium Sas Soc Par Actions Si Dispositif passif de regulation thermique a micro boucle fluide a pompage capillaire
WO2009019380A1 (fr) * 2007-08-08 2009-02-12 Astrium Sas Dispositif passif de regulation thermique a micro boucle fluide a pompage capillaire
US20120024499A1 (en) * 2010-07-30 2012-02-02 Asia Vital Components Co., Ltd. Loop type pressure-gradient-drien low-pressure thermosiphon device
US9441888B2 (en) * 2010-07-30 2016-09-13 Asia Vital Components Co., Ltd. Loop type pressure-gradient-driven low-pressure thermosiphon device
US20140182819A1 (en) * 2013-01-01 2014-07-03 Asia Vital Components Co., Ltd. Heat dissipating device
JP2019190812A (ja) * 2018-04-26 2019-10-31 泰碩電子股▲分▼有限公司 同じ管路が気流流路および液流流路に仕切られた還流ヒートパイプ
CN108801020A (zh) * 2018-08-29 2018-11-13 扬州大学 一种自驱动气液脉动相变热管式隔热导流板
US11333443B2 (en) * 2018-09-25 2022-05-17 Shinko Electric Industries Co., Ltd. Loop heat pipe
CN114857968A (zh) * 2022-05-31 2022-08-05 广州大学 一种双环结构气体单向流反重力平板热管

Also Published As

Publication number Publication date
CN1393678A (zh) 2003-01-29
CN1220028C (zh) 2005-09-21

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