US20010055714A1 - Electronic power device - Google Patents
Electronic power device Download PDFInfo
- Publication number
- US20010055714A1 US20010055714A1 US09/852,655 US85265501A US2001055714A1 US 20010055714 A1 US20010055714 A1 US 20010055714A1 US 85265501 A US85265501 A US 85265501A US 2001055714 A1 US2001055714 A1 US 2001055714A1
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- US
- United States
- Prior art keywords
- support plate
- frames
- power device
- support plates
- electronic power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to an electronic power device, and more particularly to a device comprising power chips fixed on support plates, the plates being cooled by a cooling fluid.
- the electronic power device of invention is particularly applicable to electronic devices used in converter type circuits for distributing power in railway applications, in which the delivered current and voltage values are particularly large.
- document FR 2 775 416 discloses an electronic power device having power chips fixed on one face of a support plate, the other face of the plate having a heat exchanger. It is also known from that document to associate support plates in pairs by placing them on opposite sides of a cooling circuit, the heat exchangers then been disposed facing each other.
- the object of the present invention is to propose an electronic power circuit enabling the above-mentioned drawbacks of a prior art to be mitigated.
- the invention provides an electronic power device comprising support plates each having one face receiving one or more power components and an opposite face in contact with a cooling fluid for cooling said power components by conduction, wherein at least one support plate is associated with another support plate disposed facing it and provided with similar power components, and wherein the power components of the two facing support plates are disposed facing one another and in the immediate vicinity of one another.
- the electronic power device can comprise one or more of the following characteristics taken in isolation or in any technically feasible combination:
- each support plate is associated with another support plate disposed facing it and provided with similar power components, the power components of the facing support plates being disposed facing one another and in the immediate vicinity of one another;
- said support plates are distributed over two frames made of electrically insulating material, each of the frames having openings whose outlines form seats for receiving said support plates, said two frames being of a form enabling the two frames to be associated one against the other with the support plates of the two facing frames, the free faces of the two adjacent frames supporting respective cooling boxes each having a cooling fluid circulation volume and means for supplying and for removing said fluid;
- each support plate is fed with electricity via at least one emitter and at least one collector projecting respectively from two opposite edges of said support plate so that the emitter feeding one support plate is disposed on the same side as and close to the collector feeding the facing support plate;
- said frames support said emitters, said collectors, and a control circuit for controlling the power components
- each of said support plates receives two IGBT components presenting a common emitter disposed between the two IGBT components and projecting laterally from one side of the frame, each of said IGBT components having an independent collector projecting laterally from the other side of the frame;
- a strip of heat conducting material such as copper or aluminum is brazed or soldered to those faces of the support plates which come into contact with the cooling fluid, said strip having folds constituting micro-channels encouraging heat exchange with said fluid;
- said frames and boxes are molded out of a plastics material and are assembled to one another by adhesive or by means of a sealing gasket;
- said support plates are made by assembling an electrically insulating material that conducts heat such as aluminum nitride with a composite material that conducts heat and has a coefficient of expansion matching that of the electrically insulating material such as a composite of aluminum and silicon carbide, said electrically insulating material supporting the power components and said composite being in contact with the cooling fluid.
- FIG. 1 is an exploded perspective view of an embodiment of the electronic power device of invention
- FIG. 2 is a perspective view showing how support plates are assembled on one of the frames of the FIG. 1 device
- FIG. 3 is a perspective view on a larger scale showing the FIG. 1 device when both frames and the bottom housing have been assembled together;
- FIG. 4 is a view similar to FIG. 3 when all of the elements have been assembled together.
- FIG. 1 it shows an electronic power device for a converter comprising two frames 1 of generally rectangular shape capable of being placed one against the other via one of their faces and capable of receiving respective cooling boxes 2 via their other faces.
- the frames 1 are substantially identical and they are made of an electrically insulating moldable material, e.g. an injection moldable resin of the polyphenylene dioxide type (PPO).
- PPO polyphenylene dioxide
- each frame one has three openings 11 each receiving a support plate 3 of metallized aluminum nitride having two power components 31 brazed thereto, e.g. of the insulated gate bipolar transistor type (IGBT).
- the support plates 3 also have respective strips of copper 5 brazed to their faces opposite their faces receiving the IGBT components 31 , these copper strips 5 having folds constituting micro-channels that can be seen in FIGS. 1 and 3.
- the support plates 3 are held pressed against the inside peripheries of the openings 11 by adhesive, optionally with gaskets (not shown) being interposed therebetween, in order to ensure a perfectly leak-proof connection.
- sealing between the support plates 3 and the frame 1 can equally well be provided by more intimate co-operation between the support plate 3 and the surround of the opening 11 that receives it, for example by overmolding the frame 1 on the support plates 3 .
- each support plate 3 takes place by means of emitters 12 and collectors 13 integrated in the frame 1 and extending respectively from two opposite sides of the frame 1 .
- the emitters 12 are constituted by respective conductive members passing centrally through the opening 11 and serving as an emitter common to both IGBT components 31 carried by the support plate 3 .
- each emitter 12 has a connection tongue extending laterally from one side of the frame 1 and enabling it to be connected to an external connector (not shown).
- the collectors 13 comprise two conductive members placed on the edge of the opening 11 remote from its edge receiving the connection tongue of the emitter 12 .
- the collectors 13 are disposed on either side of the end of the emitter 12 , and they project outside the frame 1 via connection tongues.
- Control current is fed to the IGBT components 31 by means of a printed circuit 4 carried by the frame 1 and connecting to the grids of the IGBT components.
- the printed circuit 4 shown in FIG. 1, has connectors 41 disposed perpendicularly to the plane of the frame 1 and enabling connection to be made with wires (not shown) for controlling the IGBT components.
- the micro-channels of the support plates 3 are fed with cooling fluid by the two boxes 2 which are fitted to the frames 1 , which boxes 2 have respective plane side faces provided with edges that match the outline of the frame 1 , a sealing gasket that is not shown being interposed between each box 2 and the frame 1 .
- both boxes 2 are generally elongate in shape and include two channels extending longitudinally relative to the frame 1 , having one end fitted with openings 22 enabling cooling fluid to be supplied and removed.
- the boxes 2 are made by molding a polymer material, of e.g. of the polyetherimide type (PEI).
- Such an electronic power device presents the advantage of having very low parasitic inductance because the power components carried by each support plate are close to the identical power components carried by a facing support plate, which makes it possible to reduce switching surges considerably. For given operating power, such a device thus makes it possible to use components that withstand smaller surges and that are therefore less expensive, and it also makes it possible to take full advantage of possibilities for improving cooling.
- a device to the invention also has the advantage of placing the emitters of the power components carried by one support plate close to the collectors of the power components carried by the other support plate facing it, thus making it possible substantially to cancel out the parasitic inductance generated thereby.
- the copper strip having folds could be made in some other material that conducts heat, such as aluminum.
- the support plates could be made of a composite material constituted by a layer of metal in contact with the cooling fluid together with a fine insulating layer supporting the power components.
Abstract
Description
- The invention relates to an electronic power device, and more particularly to a device comprising power chips fixed on support plates, the plates being cooled by a cooling fluid. The electronic power device of invention is particularly applicable to electronic devices used in converter type circuits for distributing power in railway applications, in which the delivered current and voltage values are particularly large.
- In conventional manner, it is known to cool an electronic power component by coupling it to a heat exchanger and by inserting a ceramic plate between these two components to isolate the heat exchanger electrically from the component. Thus,
document FR 2 775 416 discloses an electronic power device having power chips fixed on one face of a support plate, the other face of the plate having a heat exchanger. It is also known from that document to associate support plates in pairs by placing them on opposite sides of a cooling circuit, the heat exchangers then been disposed facing each other. - Nevertheless, such an electronic power device suffers from the drawback of generating parasitic switch loops of high inductance and thus of generating high voltage surges on switching, thus requiring the power components to be over-dimensioned so as to enable them to withstand such surges. Naturally, such over-dimensioning of power components presents the drawback of increasing manufacturing cost and of causing the power components to be larger in size.
- The object of the present invention is to propose an electronic power circuit enabling the above-mentioned drawbacks of a prior art to be mitigated.
- To this end, the invention provides an electronic power device comprising support plates each having one face receiving one or more power components and an opposite face in contact with a cooling fluid for cooling said power components by conduction, wherein at least one support plate is associated with another support plate disposed facing it and provided with similar power components, and wherein the power components of the two facing support plates are disposed facing one another and in the immediate vicinity of one another.
- In particular embodiments, the electronic power device can comprise one or more of the following characteristics taken in isolation or in any technically feasible combination:
- each support plate is associated with another support plate disposed facing it and provided with similar power components, the power components of the facing support plates being disposed facing one another and in the immediate vicinity of one another;
- said support plates are distributed over two frames made of electrically insulating material, each of the frames having openings whose outlines form seats for receiving said support plates, said two frames being of a form enabling the two frames to be associated one against the other with the support plates of the two facing frames, the free faces of the two adjacent frames supporting respective cooling boxes each having a cooling fluid circulation volume and means for supplying and for removing said fluid;
- said two frames are identical;
- each support plate is fed with electricity via at least one emitter and at least one collector projecting respectively from two opposite edges of said support plate so that the emitter feeding one support plate is disposed on the same side as and close to the collector feeding the facing support plate;
- said frames support said emitters, said collectors, and a control circuit for controlling the power components;
- each of said support plates receives two IGBT components presenting a common emitter disposed between the two IGBT components and projecting laterally from one side of the frame, each of said IGBT components having an independent collector projecting laterally from the other side of the frame;
- a strip of heat conducting material such as copper or aluminum is brazed or soldered to those faces of the support plates which come into contact with the cooling fluid, said strip having folds constituting micro-channels encouraging heat exchange with said fluid;
- said frames and boxes are molded out of a plastics material and are assembled to one another by adhesive or by means of a sealing gasket; and
- said support plates are made by assembling an electrically insulating material that conducts heat such as aluminum nitride with a composite material that conducts heat and has a coefficient of expansion matching that of the electrically insulating material such as a composite of aluminum and silicon carbide, said electrically insulating material supporting the power components and said composite being in contact with the cooling fluid.
- The objects, aspects, and advantages of the present invention will be understood better on reading the following description of an embodiment of the invention given by way of non-limiting example and with reference to the accompanying drawings, in which:
- FIG. 1 is an exploded perspective view of an embodiment of the electronic power device of invention;
- FIG. 2 is a perspective view showing how support plates are assembled on one of the frames of the FIG. 1 device;
- FIG. 3 is a perspective view on a larger scale showing the FIG. 1 device when both frames and the bottom housing have been assembled together; and
- FIG. 4 is a view similar to FIG. 3 when all of the elements have been assembled together.
- To make the drawings easier to read, only those elements which are necessary for understanding invention have been shown.
- FIG. 1 it shows an electronic power device for a converter comprising two
frames 1 of generally rectangular shape capable of being placed one against the other via one of their faces and capable of receivingrespective cooling boxes 2 via their other faces. Theframes 1 are substantially identical and they are made of an electrically insulating moldable material, e.g. an injection moldable resin of the polyphenylene dioxide type (PPO). - As shown in FIG. 2, each frame one has three
openings 11 each receiving asupport plate 3 of metallized aluminum nitride having twopower components 31 brazed thereto, e.g. of the insulated gate bipolar transistor type (IGBT). Thesupport plates 3 also have respective strips ofcopper 5 brazed to their faces opposite their faces receiving theIGBT components 31, thesecopper strips 5 having folds constituting micro-channels that can be seen in FIGS. 1 and 3. - The
support plates 3 are held pressed against the inside peripheries of theopenings 11 by adhesive, optionally with gaskets (not shown) being interposed therebetween, in order to ensure a perfectly leak-proof connection. In a variant embodiment that is not shown, sealing between thesupport plates 3 and theframe 1 can equally well be provided by more intimate co-operation between thesupport plate 3 and the surround of theopening 11 that receives it, for example by overmolding theframe 1 on thesupport plates 3. - The power current feed of the
IGBT components 31 in eachsupport plate 3 takes place by means ofemitters 12 andcollectors 13 integrated in theframe 1 and extending respectively from two opposite sides of theframe 1. In eachopening 11, theemitters 12 are constituted by respective conductive members passing centrally through the opening 11 and serving as an emitter common to bothIGBT components 31 carried by thesupport plate 3. At one end, eachemitter 12 has a connection tongue extending laterally from one side of theframe 1 and enabling it to be connected to an external connector (not shown). In eachopening 11, thecollectors 13 comprise two conductive members placed on the edge of the opening 11 remote from its edge receiving the connection tongue of theemitter 12. Thecollectors 13 are disposed on either side of the end of theemitter 12, and they project outside theframe 1 via connection tongues. - Control current is fed to the
IGBT components 31 by means of a printedcircuit 4 carried by theframe 1 and connecting to the grids of the IGBT components. The printedcircuit 4, shown in FIG. 1, hasconnectors 41 disposed perpendicularly to the plane of theframe 1 and enabling connection to be made with wires (not shown) for controlling the IGBT components. - The two
frames 1 present complementary shapes enabling them to be assembled one against the other in such a manner that thesupport plates 3 of theframes 1 face each other and theIGBT components 31 carried by eachsupport plate 3 of theframe 1 are disposed facing and in the immediate vicinity of theidentical IGBT components 31 carried by asupport plate 3 of theother frame 1. As shown in FIG. 3, once the twoframes 1 have been put together, they form a compact assembly from which only the micro-channels of thecopper strips 4 brazed to thesupport plates 3 extend from eachopening 11. - The micro-channels of the
support plates 3 are fed with cooling fluid by the twoboxes 2 which are fitted to theframes 1, whichboxes 2 have respective plane side faces provided with edges that match the outline of theframe 1, a sealing gasket that is not shown being interposed between eachbox 2 and theframe 1. - As shown in FIGS. 1 and 4, both
boxes 2 are generally elongate in shape and include two channels extending longitudinally relative to theframe 1, having one end fitted withopenings 22 enabling cooling fluid to be supplied and removed. Advantageously, theboxes 2 are made by molding a polymer material, of e.g. of the polyetherimide type (PEI). - Such an electronic power device presents the advantage of having very low parasitic inductance because the power components carried by each support plate are close to the identical power components carried by a facing support plate, which makes it possible to reduce switching surges considerably. For given operating power, such a device thus makes it possible to use components that withstand smaller surges and that are therefore less expensive, and it also makes it possible to take full advantage of possibilities for improving cooling.
- A device to the invention also has the advantage of placing the emitters of the power components carried by one support plate close to the collectors of the power components carried by the other support plate facing it, thus making it possible substantially to cancel out the parasitic inductance generated thereby.
- Furthermore, the use of a heat exchanger having a copper strip with folds to form micro-channels and which is brazed to a ceramic plate of standard type makes it possible to ensure that the power components are provided with excellent cooling at very low manufacturing cost.
- The naturally, the invention is not limited in any way to the embodiment described and shown which has been given purely by way of example.
- Thus, in a variant electronic device of invention, the copper strip having folds could be made in some other material that conducts heat, such as aluminum.
- In a variant embodiment, the support plates could be made of a composite material constituted by a layer of metal in contact with the cooling fluid together with a fine insulating layer supporting the power components.
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0006512A FR2809281B1 (en) | 2000-05-22 | 2000-05-22 | ELECTRONIC POWER DEVICE |
FR0006512 | 2000-05-22 |
Publications (2)
Publication Number | Publication Date |
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US20010055714A1 true US20010055714A1 (en) | 2001-12-27 |
US6442023B2 US6442023B2 (en) | 2002-08-27 |
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ID=8850474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US09/852,655 Expired - Lifetime US6442023B2 (en) | 2000-05-22 | 2001-05-11 | Electronic power device |
Country Status (9)
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US (1) | US6442023B2 (en) |
EP (1) | EP1158656B1 (en) |
JP (1) | JP2002016216A (en) |
KR (1) | KR100618005B1 (en) |
CA (1) | CA2348146C (en) |
DE (1) | DE60142422D1 (en) |
ES (1) | ES2346849T3 (en) |
FR (1) | FR2809281B1 (en) |
HK (1) | HK1044421A1 (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6606251B1 (en) | 2002-02-07 | 2003-08-12 | Cooligy Inc. | Power conditioning module |
US20050016715A1 (en) * | 2003-07-23 | 2005-01-27 | Douglas Werner | Hermetic closed loop fluid system |
EP1966812A1 (en) * | 2005-12-30 | 2008-09-10 | Smc Electrical Products, Inc. | Variable frequency drive system apparatus and method for reduced ground leakage current and transistor protection |
US7715194B2 (en) | 2006-04-11 | 2010-05-11 | Cooligy Inc. | Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers |
US7806168B2 (en) | 2002-11-01 | 2010-10-05 | Cooligy Inc | Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange |
US7913719B2 (en) | 2006-01-30 | 2011-03-29 | Cooligy Inc. | Tape-wrapped multilayer tubing and methods for making the same |
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Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6972957B2 (en) * | 2002-01-16 | 2005-12-06 | Rockwell Automation Technologies, Inc. | Modular power converter having fluid cooled support |
US7032695B2 (en) * | 2002-01-16 | 2006-04-25 | Rockwell Automation Technologies, Inc. | Vehicle drive module having improved terminal design |
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US6885553B2 (en) * | 2002-09-27 | 2005-04-26 | Rockwell Automation Technologies, Inc. | Bus bar assembly for use with a compact power conversion assembly |
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US20160150678A1 (en) * | 2014-11-22 | 2016-05-26 | Gerald Ho Kim | Silicon Cooling Plate With An Integrated PCB |
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US10874037B1 (en) * | 2019-09-23 | 2020-12-22 | Ford Global Technologies, Llc | Power-module assembly with cooling arrangement |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2337694C2 (en) * | 1973-07-25 | 1984-10-25 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Semiconductor rectifier arrangement with high current carrying capacity |
US4037270A (en) * | 1976-05-24 | 1977-07-19 | Control Data Corporation | Circuit packaging and cooling |
JPS60160151A (en) * | 1984-01-26 | 1985-08-21 | Fujitsu Ltd | Cooling system for integrated circuit |
FR2574615B1 (en) * | 1984-12-11 | 1987-01-16 | Silicium Semiconducteur Ssc | HOUSING FOR HIGH-FREQUENCY POWER COMPONENT COOLED BY WATER CIRCULATION |
US5426565A (en) * | 1993-03-26 | 1995-06-20 | Sundstrand Corporation | Electronic package clamping arrangement |
JPH07211832A (en) * | 1994-01-03 | 1995-08-11 | Motorola Inc | Power radiating device and manufacture thereof |
US5453911A (en) * | 1994-02-17 | 1995-09-26 | General Motors Corporation | Device for cooling power electronics |
US5504378A (en) * | 1994-06-10 | 1996-04-02 | Westinghouse Electric Corp. | Direct cooled switching module for electric vehicle propulsion system |
DE4421319A1 (en) * | 1994-06-17 | 1995-12-21 | Abb Management Ag | Low-inductance power semiconductor module |
FR2729044B1 (en) * | 1994-12-30 | 1997-01-24 | Atherm | COOLING ELEMENT AND CONNECTOR FOR AN ELECTRONIC POWER COMPONENT COOLED BY AN ELECTRICALLY ISOLATED FLUID FROM THE COMPONENT |
US5740015A (en) * | 1996-05-02 | 1998-04-14 | Chrysler Corporation | Heat exchanger |
US5801442A (en) * | 1996-07-22 | 1998-09-01 | Northrop Grumman Corporation | Microchannel cooling of high power semiconductor devices |
US5848733A (en) * | 1996-11-12 | 1998-12-15 | Continental Sprayers International, Inc. | Manually operated pump dispenser having child-resistant nozzle |
FR2756134B1 (en) * | 1996-11-21 | 1999-07-09 | Gec Alsthom Transport Sa | COOLING DEVICE FOR IGBT COMPONENTS |
JP3877098B2 (en) * | 1997-11-25 | 2007-02-07 | 株式会社デンソー | Liquid cooling circuit device |
FR2775416B1 (en) * | 1998-02-23 | 2000-06-23 | Gec Alsthom Transport Sa | COOLING ELEMENT FOR ELECTRONIC POWER DEVICE AND ELECTRONIC POWER DEVICE COMPRISING SUCH AN ELEMENT |
GB2339081A (en) * | 1998-06-30 | 2000-01-12 | Cummins Engine Co Ltd | Cooling an engine control unit using fuel as coolant |
-
2000
- 2000-05-22 FR FR0006512A patent/FR2809281B1/en not_active Expired - Lifetime
-
2001
- 2001-04-26 EP EP01401084A patent/EP1158656B1/en not_active Expired - Lifetime
- 2001-04-26 DE DE60142422T patent/DE60142422D1/en not_active Expired - Lifetime
- 2001-04-26 ES ES01401084T patent/ES2346849T3/en not_active Expired - Lifetime
- 2001-05-11 US US09/852,655 patent/US6442023B2/en not_active Expired - Lifetime
- 2001-05-18 CA CA002348146A patent/CA2348146C/en not_active Expired - Lifetime
- 2001-05-21 KR KR1020010027575A patent/KR100618005B1/en active IP Right Grant
- 2001-05-21 JP JP2001150425A patent/JP2002016216A/en active Pending
-
2002
- 2002-05-28 HK HK02103988.6A patent/HK1044421A1/en unknown
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US6606251B1 (en) | 2002-02-07 | 2003-08-12 | Cooligy Inc. | Power conditioning module |
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US7806168B2 (en) | 2002-11-01 | 2010-10-05 | Cooligy Inc | Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange |
US20050016715A1 (en) * | 2003-07-23 | 2005-01-27 | Douglas Werner | Hermetic closed loop fluid system |
US8602092B2 (en) | 2003-07-23 | 2013-12-10 | Cooligy, Inc. | Pump and fan control concepts in a cooling system |
EP1966812A1 (en) * | 2005-12-30 | 2008-09-10 | Smc Electrical Products, Inc. | Variable frequency drive system apparatus and method for reduced ground leakage current and transistor protection |
US20080303469A1 (en) * | 2005-12-30 | 2008-12-11 | Smc Electrical Products, Inc. | Variable Frequency Drive System Apparatus and Method for Reduced Ground Leakage Current and Transistor Protection |
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US7913719B2 (en) | 2006-01-30 | 2011-03-29 | Cooligy Inc. | Tape-wrapped multilayer tubing and methods for making the same |
US8157001B2 (en) | 2006-03-30 | 2012-04-17 | Cooligy Inc. | Integrated liquid to air conduction module |
US7715194B2 (en) | 2006-04-11 | 2010-05-11 | Cooligy Inc. | Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers |
US8250877B2 (en) | 2008-03-10 | 2012-08-28 | Cooligy Inc. | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
US20110114289A1 (en) * | 2009-11-16 | 2011-05-19 | Altman David H | Cold chassis for electronic modules and method of making same |
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US8839519B2 (en) | 2009-11-16 | 2014-09-23 | Raytheon Company | Method of making cold chassis for electronic modules |
US9526192B2 (en) | 2009-11-16 | 2016-12-20 | Raytheon Company | Cold chassis for electronic modules and method of making same |
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KR20170042067A (en) * | 2015-10-08 | 2017-04-18 | 현대모비스 주식회사 | apparatus with direct cooling pathway for cooling both side of power semiconductor |
KR102443261B1 (en) * | 2015-10-08 | 2022-09-13 | 현대모비스 주식회사 | apparatus with direct cooling pathway for cooling both side of power semiconductor |
US10950522B2 (en) * | 2017-02-13 | 2021-03-16 | Shindengen Electric Manufacturing Co., Ltd. | Electronic device |
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FR3084810A1 (en) * | 2018-07-31 | 2020-02-07 | Valeo Systemes Thermiques | ELEMENT FOR THERMAL REGULATION OF AN ELECTRICAL COMPONENT, OF A MOTOR VEHICLE, CAPABLE OF GENERATING HEAT DURING OPERATION |
CN111261601A (en) * | 2020-01-16 | 2020-06-09 | 浙江大学 | Clamp embedded type high-integration-level compression joint type packaged power module |
Also Published As
Publication number | Publication date |
---|---|
KR20010107594A (en) | 2001-12-07 |
ES2346849T3 (en) | 2010-10-21 |
FR2809281A1 (en) | 2001-11-23 |
CA2348146C (en) | 2008-02-19 |
KR100618005B1 (en) | 2006-08-31 |
DE60142422D1 (en) | 2010-08-05 |
CA2348146A1 (en) | 2001-11-22 |
JP2002016216A (en) | 2002-01-18 |
US6442023B2 (en) | 2002-08-27 |
HK1044421A1 (en) | 2002-10-18 |
EP1158656A1 (en) | 2001-11-28 |
EP1158656B1 (en) | 2010-06-23 |
FR2809281B1 (en) | 2002-07-12 |
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