US11571706B2 - Droplet ejecting apparatus having carriage marks, droplet ejecting method, and computer storage medium - Google Patents
Droplet ejecting apparatus having carriage marks, droplet ejecting method, and computer storage medium Download PDFInfo
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- US11571706B2 US11571706B2 US15/905,977 US201815905977A US11571706B2 US 11571706 B2 US11571706 B2 US 11571706B2 US 201815905977 A US201815905977 A US 201815905977A US 11571706 B2 US11571706 B2 US 11571706B2
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- carriage
- droplet ejecting
- scanning direction
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- workpiece
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0291—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work the material being discharged on the work through discrete orifices as discrete droplets, beads or strips that coalesce on the work or are spread on the work so as to form a continuous coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04505—Control methods or devices therefor, e.g. driver circuits, control circuits aiming at correcting alignment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
- B41J29/38—Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
- B41J29/393—Devices for controlling or analysing the entire machine ; Controlling or analysing mechanical parameters involving printing of test patterns
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H01L51/0005—
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/00681—Detecting the presence, position or size of a sheet or correcting its position before scanning
- H04N1/00742—Detection methods
- H04N1/00761—Detection methods using reference marks, e.g. on sheet, sheet holder or guide
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/084—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to condition of liquid or other fluent material already sprayed on the target, e.g. coating thickness, weight or pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/09—Ink jet technology used for manufacturing optical filters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2203/00—Embodiments of or processes related to the control of the printing process
- B41J2203/01—Inspecting a printed medium or a medium to be printed using a sensing device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J25/00—Actions or mechanisms not otherwise provided for
- B41J25/001—Mechanisms for bodily moving print heads or carriages parallel to the paper surface
Definitions
- the present disclosure relates to a droplet ejecting apparatus which ejects the droplets of a functional liquid onto a workpiece so as to draw a pattern, a droplet ejecting method using the droplet ejecting apparatus, a program, and a computer storage medium.
- an inkjet type droplet ejecting apparatus which ejects the droplets of the functional liquid.
- the droplet ejecting apparatus is widely used, for example, when manufacturing electro-optical devices (flat panel displays (FPD)) such as organic EL devices, color filters, liquid crystal display devices, plasma displays (PDP devices), and electron emitting devices (field emission display (FED) devices or surface-condition electron-emitter display (SED) devices).
- electro-optical devices flat panel displays (FPD)
- organic EL devices such as organic EL devices, color filters, liquid crystal display devices, plasma displays (PDP devices), and electron emitting devices (field emission display (FED) devices or surface-condition electron-emitter display (SED) devices.
- FED field emission display
- SED surface-condition electron-emitter display
- a droplet ejecting apparatus disclosed in Japanese Patent Application Laid-Open No. 2010-198028 includes a functional liquid droplet ejecting head (droplet ejecting head) which ejects the droplets of a functional liquid, a workpiece stage (workpiece table) on which a workpiece is mounted, and a movement mechanism (linear motor) which moves the workpiece table in a direction in which a pair of support bases for guidance extends (main scanning direction). Further, the droplet ejecting apparatus draws a pattern on the workpiece by ejecting the functional liquid from the droplet ejecting head into a bank formed in advance on the workpiece while moving the workpiece relative to the droplet ejecting head using the workpiece table.
- a functional liquid droplet ejecting head droplet ejecting head
- workpiece stage workpiece table
- a movement mechanism linear motor
- the workpiece is reciprocally moved relative to the droplet ejecting head in the main scanning direction and appropriately moved in a sub-scanning direction orthogonal to the main scanning direction. With this drawing operation, patterns are drawn on an overall surface of the workpiece.
- the present disclosure provides a droplet ejecting apparatus which ejects droplets of a functional liquid droplet onto a workpiece so as to draw a pattern.
- the droplet ejecting apparatus includes: a workpiece table configured to place the workpiece thereon; a droplet ejecting head configured to eject the droplet onto the workpiece placed on the workpiece table; a workpiece movement mechanism configured to relatively move the workpiece table and the droplet ejecting head in a main scanning direction; a position detector configured to detect a position of the droplet ejecting head; and a control unit configured to: calculate a positional deviation amount in the main scanning direction between a detection position detected by the position detector and a reference position of the droplet ejecting head; and correct a droplet ejecting timing of the droplet ejecting head based on the positional deviation amount.
- FIG. 1 is a side view illustrating an outline of a configuration of a droplet ejecting apparatus according to the present exemplary embodiment.
- FIG. 2 is a top plan view illustrating an outline of the configuration of the droplet ejecting apparatus according to the present exemplary embodiment.
- FIG. 3 is a top plan view illustrating an outline of a configuration of a carriage.
- FIG. 4 is an explanatory view illustrating a reference position of the carriage.
- FIG. 5 is an explanatory view illustrating, in a side view, a state in which a workpiece is moved toward a droplet ejecting head.
- FIG. 6 is an explanatory view illustrating, in a side view, a state in which an image capturing unit captures an image of a first carriage mark at a first image capturing position.
- FIG. 7 is an explanatory view illustrating, in a plan view, a state in which the image capturing unit captures an image of the first carriage mark at the first image capturing position.
- FIG. 8 is an explanatory view illustrating, in a side view, a state in which the image capturing unit captures an image of a second carriage mark at a second image capturing position.
- FIG. 9 is an explanatory view illustrating, in a plan view, a state in which the image capturing unit captures an image of the second carriage mark at the second image capturing position.
- FIG. 10 is an explanatory view illustrating a detection position (solid line) of the carriage, which is detected by the image capturing unit, together with the reference position (dotted line) of the carriage.
- FIG. 11 is a top plan view illustrating an outline of a configuration of a droplet ejecting apparatus according to another exemplary embodiment.
- FIG. 12 is an explanatory view illustrating, in a plan view, a state in which an image capturing unit captures an image of a first carriage mark at a first image capturing position in accordance with another exemplary embodiment.
- FIG. 13 is an explanatory view illustrating, in a plan view, a state in which the image capturing unit captures an image of a second carriage mark at a second image capturing position in accordance with another exemplary embodiment.
- a landing position when a droplet ejected from the droplet ejecting head lands on the workpiece is adjusted when the droplet ejecting apparatus starts up. Specifically, a droplet lands on a position adjustment workpiece, a landing position of the droplet is measured, and the positional deviation amount between the measured landing position and a target position is calculated. Further, based on the positional deviation amount, for example, a droplet ejecting timing of the droplet ejecting head is corrected, and a relative movement of the workpiece table and the droplet ejecting head in the main scanning direction and the sub-scanning direction is corrected.
- a positional relationship between the droplet ejecting head and the bank on the workpiece is changed in some instances due to factors such as, for example, a change in temperature or a change with time of each of the members of the droplet ejecting apparatus, for example, a carriage including the plurality of droplet ejecting heads.
- the landing position of the droplet on the workpiece deviates.
- the present disclosure has been made in consideration of the aforementioned situations, and an object of the present disclosure is to improve landing precision of a droplet on a workpiece from a droplet ejecting head in a droplet ejecting apparatus that ejects the droplets of a functional liquid onto a workpiece so as to draw a pattern.
- the present disclosure provides a droplet ejecting apparatus that ejects droplets of a functional liquid to a workpiece so as to draw a pattern.
- the droplet ejecting apparatus includes: a workpiece table configured to place the workpiece thereon; a droplet ejecting head configured to eject the droplet onto the workpiece placed on the workpiece table; a workpiece movement mechanism configured to relatively move the workpiece table and the droplet ejecting head in a main scanning direction; a position detector configured to detect a position of the droplet ejecting head; and a control unit configured to: calculate a positional deviation amount in the main scanning direction between a detection position detected by the position detector and a reference position of the droplet ejecting head; and correct a droplet ejecting timing of the droplet ejecting head based on the positional deviation amount.
- the present disclosure it is possible to improve landing precision of the droplets from the droplet ejecting head onto a workpiece even if a positional relationship between the droplet ejecting head and the workpiece is changed due to factors such as a change in temperature or a change with time of each of the members of the droplet ejecting apparatus.
- FIG. 1 is a side view illustrating an outline of a configuration of a droplet ejecting apparatus 1 .
- FIG. 2 is a top plan view illustrating an outline of the configuration of the droplet ejecting apparatus 1 .
- a main scanning direction of a workpiece W is defined as a Y-axis direction
- a sub-scanning direction orthogonal to the main scanning direction is defined as an X-axis direction
- a vertical direction orthogonal to the Y-axis direction and the X-axis direction is defined as a Z-axis direction
- a rotation direction about the Z-axis is defined as a ⁇ direction.
- the droplet ejecting apparatus 1 has a Y-axis stage 10 extending in the main scanning direction (Y-axis direction) and moving the workpiece W in the main scanning direction, and a pair of X-axis stages 11 and 11 crossing over the Y-axis stage 10 and extending in the sub-scanning direction (X-axis direction).
- a pair of Y-axis guide rails 12 and 12 is provided to extend in the Y-axis direction on the upper surface of the Y-axis stage 10 , and Y-axis linear motors 13 and 13 are provided on the Y-axis guide rails 12 and 12 , respectively.
- X-axis guide rails 14 and 14 are provided to extend in the X-axis direction on upper surfaces of the X-axis stages 11 and 11 , respectively, and X-axis linear motors 15 and 15 are provided on the X-axis guide rails 14 and 14 , respectively.
- a negative side area with respect to the X-axis stages 11 in a Y-axis direction is defined as a loading and unloading area A 1
- an area between the pair of X-axis stages 11 and 11 is defined as a processing area A 2
- a positive side area with respect to the X-axis stages 11 in a Y-axis direction is defined as a standby area A 3 .
- Carriage units 20 and first image capturing sections 30 are provided on the pair of X-axis stages 11 and 11 .
- a workpiece table 40 , a flushing unit 50 , an ejecting inspection unit 60 , and a second image capturing section 70 are provided on the Y-axis stage 10 .
- the workpiece table 40 , the flushing unit 50 , the ejecting inspection unit 60 , and the second image capturing section 70 are placed in this order in the Y-axis direction.
- a plurality of (e.g., ten) carriage units 20 are provided on the X-axis stages 11 .
- Each of the carriage units 20 has a carriage plate 21 , a carriage holding mechanism 22 , and a carriage 23 .
- the carriage holding mechanism 22 is provided at a center of a lower side of the carriage plate 21
- the carriage 23 is detachably mounted at a lower end of the carriage holding mechanism 22 .
- the carriage plate 21 is mounted on the X-axis guide rails 14 and may be moved by the X-axis linear motors 15 in the X-axis direction. Further, the plurality of carriage plates 21 may be integrally moved in the X-axis direction.
- a motor (not illustrated) is mounted on the carriage 23 .
- the carriage 23 is configured to be movable in the X-axis direction and the ⁇ direction by the motor.
- a droplet ejecting head 24 which is provided on the carriage 23 and will be described below, may also be moved in the X-axis direction and the ⁇ direction.
- the carriage 23 constitutes a head movement mechanism of the present disclosure. Further, the movement of the carriage 23 (droplet ejecting head 24 ) in the X-axis direction and the ⁇ direction may be performed by, for example, the carriage holding mechanism 22 .
- a plurality of droplet ejecting heads 24 are arranged side by side in the Y-axis direction and the X-axis direction at a lower side of the carriage 23 .
- the six droplet ejecting heads 24 are provided in the Y-axis direction
- the two droplet ejecting heads 24 are provided in the X-axis direction, that is, the total of twelve droplet ejecting heads 24 are provided.
- a plurality of ejecting nozzles (not illustrated) are disposed in the lower surface, that is, the nozzle surface of each droplet ejecting head 24 . Further, droplets of a functional liquid are ejected from the ejecting nozzles to droplet ejecting positions directly under the droplet ejecting head 24 .
- Carriage alignment marks 25 (hereinafter, referred to as “carriage marks 25 ”) as reference marks are disposed on the lower surface of the carriage 23 at opposite sides of the plurality of droplet ejecting heads 24 (at the positive side in the Y-axis direction and the negative side in the Y-axis direction).
- the carriage marks 25 are marks that serve as criteria when the plurality of droplet ejecting heads 24 are assembled to the carriage 23 , and the carriage marks 25 define the absolute reference position of the carriage 23 .
- the carriage mark 25 at the positive side of the droplet ejecting head 24 in the Y-axis direction is defined as a first carriage mark 25 a
- the carriage mark 25 at the negative side of the droplet ejecting head 24 in the Y-axis direction is defined as a second carriage mark 25 b.
- the first image capturing sections 30 include a first image capturing unit 31 and a second image capturing unit 32 which are provided to face each other in the Y-axis direction with the carriage 23 (droplet ejecting head 24 ) interposed therebetween.
- a CCD camera is used as the first image capturing unit 31 and the second image capturing unit 32 , and the first image capturing unit 31 and the second image capturing unit 32 may capture images of the workpiece W placed on the workpiece table 40 even while the workpiece table 40 is being moved or stopped or workpiece processing (ejecting of droplets) is performed.
- the first image capturing unit 31 is disposed at the negative side in the Y-axis direction with respect to the carriage 23
- the second image capturing unit 32 is disposed at the positive side in the Y-axis direction with respect to the carriage 23 .
- the first image capturing sections 30 may be configured to be movable in the X-axis direction.
- the first image capturing unit 31 is supported on a base 33 provided at a side of the X-axis stage 11 of the pair of X-axis stages 11 and 11 which is provided at the negative side in the Y-axis direction. Further, when the workpiece table 40 is guided to a position directly under the first image capturing unit 31 , the first image capturing unit 31 captures an image of the workpiece W placed on the workpiece table 40 .
- the second image capturing unit 32 is supported on a base 34 provided at a side of the X-axis stage 11 of the pair of X-axis stages 11 and 11 which is provided at the positive side in the Y-axis direction. Further, when the workpiece table 40 is guided to a position directly under the second image capturing unit 32 , the second image capturing unit 32 captures an image of the workpiece W placed on the workpiece table 40 .
- the workpiece table 40 is, for example, a vacuum suction table, and is configured to mount the workpiece W thereon by holding the workpiece W by suction.
- the workpiece table 40 is supported by a table movement mechanism 41 provided at a lower side of the workpiece table 40 so that the workpiece table 40 is movable in the X-axis direction and rotatable in the ⁇ direction.
- the workpiece table 40 and the table movement mechanism 41 are supported on a first Y-axis slider 42 provided at a lower side of the table movement mechanism 41 .
- the first Y-axis slider 42 is mounted on the Y-axis guide rails 12 and configured to be movable in the Y-axis direction by the Y-axis linear motors 13 .
- the workpiece table 40 is moved by the first Y-axis slider 42 in the Y-axis direction along the Y-axis guide rails 12 in a state in which the workpiece W is placed on the workpiece table 40 such that the workpiece W may be moved in the Y-axis direction.
- the Y-axis linear motors 13 first Y-axis slider 42
- the table movement mechanism 41 constitute a workpiece movement mechanism of the present disclosure.
- the table movement mechanism 41 is configured to move the workpiece table 40 in the X-axis direction and rotate the workpiece table 40 in the ⁇ direction, but a mechanism for moving the workpiece table 40 in the X-axis direction and a mechanism for rotating the workpiece table 40 in the ⁇ direction may be separately provided.
- a workpiece alignment camera (not illustrated is provided above the workpiece table 40 in the loading and unloading area A 1 ) so as to capture an image of the workpiece W placed on the workpiece table 40 . Further, based on the image captured by the workpiece alignment camera, the position in the Y-axis direction, the position in the X-axis direction, and the position in the ⁇ direction of the workpiece W placed on the workpiece table 40 are corrected by the first Y-axis slider 42 and the table movement mechanism 41 , as necessary. Therefore, the workpiece W is aligned such that a predetermined initial position of the workpiece W is set.
- the flushing unit 50 is a unit that receives a discarded droplet from the droplet ejecting head 24 .
- the flushing unit 50 is provided with a plurality of (e.g., ten) flushing recovery tables 51 provided side by side in the X-axis direction.
- the number of flushing recovery tables 51 is equal to the number of carriages 23
- a pitch of the flushing recovery tables 51 is also equal to a pitch of the carriages 23 .
- the flushing recovery table 51 is opened at an upper side thereof, and when the flushing recovery table 51 is guided to a position directly under the corresponding carriage 23 , the droplets are ejected (flushed) from the droplet ejecting head 24 of the carriage 23 , and the flushing recovery table 51 receives and accommodates the droplets. That is, the flushing operation is performed before a pattern is drawn on the workpiece W using the droplets, and the droplets based on the flushing operation are recovered by the flushing recovery table 51 .
- the ejecting inspection unit 60 is a unit that inspects the droplets ejected from the droplet ejecting head 24 .
- the ejecting inspection unit 60 is provided with an inspection table 61 which extends in the X-axis direction.
- An inspection sheet 62 which has a surface coated with a film, is disposed on an upper surface of the inspection table 61 .
- the inspection sheet 62 disposed on the inspection table 61 is configured such that the droplets ejected from the droplet ejecting head 24 lands on the inspection sheet 62 when the inspection table 61 is guided to a position directly under the droplet ejecting head 24 .
- the second image capturing section 70 is provided with a base 71 which extends in the X-axis direction.
- a plurality of (e.g., ten) position detectors 72 are provided side by side in the X-axis direction on an upper surface of the base 71 .
- the number of position detectors 72 is equal to the number of carriages 23
- a pitch of the position detectors 72 is also equal to a pitch of the carriages 23 .
- the position detector 72 is provided with, for example, a CCD camera, and when the position detector 72 is guided to a position directly under the carriage 23 , the position detector 72 captures an image of the carriage mark 25 of the carriage 23 . In addition, based on the captured image acquired by the CCD camera, the position detector 72 detects a position of the carriage mark 25 (i.e., a position of the droplet ejecting head 24 ).
- the flushing unit 50 , the ejecting inspection unit 60 , and the second image capturing section 70 are supported on a second Y-axis slider 80 .
- the second Y-axis slider 80 is mounted on the Y-axis guide rails 12 and configured to be movable in the Y-axis direction by the Y-axis linear motors 13 . Therefore, the flushing unit 50 , the ejecting inspection unit 60 , and the second image capturing section 70 may also be moved by the second Y-axis slider 80 in the Y-axis direction along the Y-axis guide rails 12 .
- the flushing unit 50 and the ejecting inspection unit 60 constitute a maintenance unit of the present disclosure.
- the Y-axis linear motors 13 (second Y-axis slider 80 ) constitute a unit movement mechanism of the present disclosure.
- the droplet ejecting apparatus 1 is provided with a control unit 150 .
- the control unit 150 is, for example, a computer and has a data storing unit (not illustrated).
- the data storing unit stores drawing data (bitmap data) for drawing a predetermined pattern on the workpiece W by controlling the droplets being ejected onto the workpiece W.
- the control unit 150 has a program storing unit (not illustrated).
- the program storing unit stores a program for controlling various types of processing in the droplet ejecting apparatus 1 .
- the data or the program are recorded in, for example, a computer-readable storage medium such as a computer-readable hard disk (HD), a flexible disk (FD), a compact disk (CD), a magneto-optical disk (MO), and a memory card, and may be installed in the control unit 150 from the storage medium.
- a computer-readable storage medium such as a computer-readable hard disk (HD), a flexible disk (FD), a compact disk (CD), a magneto-optical disk (MO), and a memory card
- the control unit 150 corrects the droplet ejecting timing of the droplet ejecting head 24 , and corrects the positions of the carriage 23 (droplet ejecting head 24 ) in the X-axis direction and the ⁇ direction. Specifically, the following steps S 1 to S 3 are performed.
- the position detector 72 is positioned directly under the first carriage mark 25 a and captures an image of the first carriage mark 25 a , and the position of the position detector 72 in this case is defined as a first image capturing position P 1 . Further, the position detector 72 is positioned directly under the second carriage mark 25 b and captures an image of the second carriage mark 25 b , and the position of the position detector 72 in this case is defined as a second image capturing position P 2 .
- the reference positions of the carriage marks 25 a and 25 b are acquired (step S 1 ).
- the positions of the plurality of carriages 23 deviate due to an assembling error when the carriages 23 are assembled to the droplet ejecting apparatus 1 , and as a result, the positions of the carriage marks 25 a and 25 b of the plurality of carriages 23 also deviate. Therefore, the reference positions of the carriage marks 25 a and 25 b of the respective carriages 23 are acquired.
- FIG. 4 illustrates five carriages 23 among ten carriages 23 for ease of description.
- a position adjustment workpiece W is used to adjust a landing position of a droplet onto the workpiece W from the droplet ejecting head 24 when the droplet ejecting apparatus 1 starts up, and the reference positions of the carriage marks 25 a and 25 b are acquired when the landing position is adjusted.
- the workpiece table 40 on which the workpiece W is placed is moved by the Y-axis linear motors 13 from the loading and unloading area A 1 to the standby area A 3 .
- a droplet is ejected from the droplet ejecting head 24 onto the workpiece W moved to the position under the droplet ejecting head 24 , and then the second image capturing unit 32 captures an image of the droplet landing on an upper surface of the workpiece W by capturing an image of the workpiece W.
- the control unit 150 Based on the captured image acquired by the second image capturing unit 32 , the control unit 150 measures the landing position of the droplet on the workpiece W and calculates the positional deviation amount between the measured landing position and a target position. Based on the positional deviation amount, for example, the droplet ejecting timing of the droplet ejecting head 24 is corrected, and the relative movement of the workpiece table 40 and the droplet ejecting head in the main scanning direction and the sub-scanning direction is corrected.
- the correction which is performed when the droplet ejecting apparatus 1 starts up, is referred to as automatic correction in some instances.
- the position detector 72 is moved by the Y-axis linear motors 13 to the position directly under the carriage 23 and captures an image of the carriage 23 . Further, based on the acquired captured image ( FIG. 4 ), the position detector 72 acquires the reference positions of the carriage marks 25 a and 25 b of the carriage 23 .
- step S 2 the positions of the carriage marks 25 a and 25 b are detected when maintenance is performed on the droplet ejecting head 24 during a normal operation. As described below, the maintenance is performed on the droplet ejecting head 24 each time a pattern is drawn on the workpiece W.
- the position detector 72 is moved by the Y-axis linear motors 13 to the position (first image capturing position P 1 ) directly under the first carriage mark 25 a , and an image of the first carriage mark 25 a is captured by the position detector 72 .
- the position detector 72 is moved by the Y-axis linear motors 13 to the position (second image capturing position P 2 ) directly under the second carriage mark 25 b , and an image of the second carriage mark 25 b is captured by the position detector 72 .
- the position detector 72 and the carriage 23 correspond to each other one by one, and images of the corresponding carriages 23 are captured by the respective position detectors 72 .
- the images may be captured by the position detector 72 at the image capturing positions P 1 and P 2 in a state in which the position detector 72 is stopped or while the position detector 72 is moved in the Y-axis direction.
- FIG. 10 illustrates the detection positions (solid lines) of the carriage marks 25 a and 25 b detected by the position detector 72 together with the reference positions (dotted lines) of the carriage marks 25 a and 25 b .
- the control unit 150 calculates the positional deviation amount ⁇ Ya in the Y-axis direction, the positional deviation amount ⁇ Xa in the X-axis direction, and the positional deviation amount ⁇ a in the ⁇ direction between the detection position and the reference position in respect to the first carriage mark 25 a of one carriage 23 .
- control unit 150 calculates the positional deviation amount ⁇ Yb in the Y-axis direction, the positional deviation amount ⁇ Xb in the X-axis direction, and the positional deviation amount ⁇ b in the ⁇ direction between the detection position and the reference position in respect to the second carriage mark 25 b.
- the control unit 150 calculates a correction amount of the droplet ejecting timing of the droplet ejecting head 24 (step S 3 ).
- the calculated correction amount is output to a motion controller (not illustrated) for controlling the droplet ejecting timing, and the droplet ejecting timing of the droplet ejecting head 24 is corrected.
- step S 3 based on the positional deviation amounts ⁇ Xa and ⁇ Xb in the X-axis direction and the positional deviation amounts ⁇ a and ⁇ b in the ⁇ direction, the control unit 150 calculates the positional correction amounts of the carriage 23 in the X-axis direction and the ⁇ direction.
- the calculated correction amounts are output to the carriage 23 , and the positions of the carriage 23 in the X-axis direction and the ⁇ direction are corrected.
- the workpiece table 40 is disposed in the loading and unloading area A 1 , and the workpiece W, which is loaded into the droplet ejecting apparatus 1 by a transport mechanism (not illustrated), is placed on the workpiece table 40 .
- an image of an alignment mark of the workpiece W placed on the workpiece table 40 is captured by the workpiece alignment camera. Further, based on the captured image, the positions of the workpiece W, which is placed on the workpiece table 40 , in the X-axis direction and the ⁇ direction are corrected by the table movement mechanism 41 , such that the workpiece W is aligned (step T 1 ).
- the workpiece table 40 is moved by the Y-axis linear motors 13 from the loading and unloading area A 1 to the processing area A 2 .
- the droplets are ejected from the droplet ejecting head 24 onto the workpiece W which is moved to the position under the droplet ejecting head 24 .
- the workpiece table 40 is further moved to the standby area A 3 so that the entire surface of the workpiece W passes below the droplet ejecting head 24 .
- the workpiece W is reciprocally moved in the Y-axis direction and moved appropriately in the X-axis direction, such that a predetermined pattern is drawn on the workpiece W (step T 2 ).
- the second image capturing unit 32 captures an image of the entire surface of the workpiece W placed on the workpiece table 40 , that is, captures an image indicating a state in which a pattern is drawn by the droplets ejected onto the workpiece W while the workpiece table 40 is moved.
- the captured image is output to the control unit 150 , and based on the captured image, the control unit 150 performs an inspection in respect to a defect of a drawing state, for example, film irregularity or the like.
- step T 3 when it is determined that the drawing state is defective, the movement of the workpiece table 40 in the Y-axis direction is corrected or the positions of the workpiece table 40 in the X-axis direction and the ⁇ direction are corrected, for example (step T 3 ).
- step T 4 When the workpiece table 40 is moved to the loading and unloading area A 1 , the workpiece W on which the drawing processing is completed is unloaded from the droplet ejecting apparatus 1 . Subsequently, a next workpiece W is loaded into the droplet ejecting apparatus 1 , and the workpiece W is aligned in accordance with the aforementioned step T 1 (step T 4 ).
- the flushing unit 50 , the ejecting inspection unit 60 , and the second image capturing section 70 are moved by the Y-axis linear motors 13 from the standby area A 3 to the processing area A 2 while the inspection in respect to the drawing state is performed in step T 3 and the loading and unloading of the workpiece W is performed in step T 4 .
- the inspection sheet 62 of the ejecting inspection unit 60 is disposed under the droplet ejecting head 24 , and the droplet is ejected from the droplet ejecting head 24 onto the inspection sheet 62 for inspection (step T 5 ).
- the flushing unit 50 and the ejecting inspection unit 60 are moved to the positive side in the X-axis direction, such that the inspection sheet 62 of the ejecting inspection unit 60 is disposed under the first image capturing unit 31 , and the flushing recovery table 51 of the flushing unit 50 is disposed under the droplet ejecting head 24 .
- the first image capturing unit 31 captures an image of a landed dot of the droplets ejected onto the inspection sheet 62 for inspection.
- the captured image is output to the control unit 150 , and based on the captured image, the control unit 150 detects an ejecting defect of the ejecting nozzle of the droplet ejecting head 24 . Based on the result of the inspection, appropriate maintenance is performed on the droplet ejecting head 24 .
- a discarded droplet is ejected from the droplet ejecting head 24 onto the flushing recovery table 51 while the image capturing process is performed by the first image capturing unit 31 and the ejecting defect inspection is performed by the control unit 150 (step T 6 ).
- steps S 1 to S 3 are performed when the ejection for inspection is performed in step T 5 and the flushing is performed in step T 6 , such that the position detector 72 detects the positions of the carriage marks 25 a and 25 b based on the captured image, and the control unit 150 corrects the droplet ejecting timing of the droplet ejecting head 24 and corrects the positions of the carriage 23 (droplet ejecting head 24 ) in the X-axis direction and the ⁇ direction based on the positional deviation amounts between the detection positions and the reference positions of the carriage marks 25 a and 25 b (step T 7 ).
- Steps T 1 to T 7 are performed on the respective workpieces as described above, and then a series of processing on the workpieces ends.
- the droplet ejecting apparatus 1 even if positional deviation of the carriage 23 occurs due to factors, for example, such as a change in temperature and a change with time of the carriage 23 , after the automatic correction is performed by the droplet ejecting apparatus 1 , it is possible to correct the droplet ejecting timing of the droplet ejecting head 24 and correct the positions of the carriage 23 (droplet ejecting head 24 ) in the X-axis direction and the ⁇ direction by performing the aforementioned steps S 1 to S 3 . Therefore, it is possible to appropriately eject the droplet onto the workpiece W from the droplet ejecting head 24 and improve precision in ejecting (precision in landing) the droplet onto the workpiece W from the droplet ejecting head 24 .
- step T 5 the maintenance of the droplet ejecting head 24 is performed for each sheet of workpiece W, and as a result, in step T 7 , the droplet ejecting timing and the position of the carriage 23 may also be corrected for each sheet of workpiece W. Therefore, it is possible to further improve precision in landing the droplet on the workpiece W from the droplet ejecting head 24 .
- the position detector 72 is provided to correspond to the carriage 23 one by one such that the position detector 72 may be disposed at an appropriate position with respect to the carriage 23 and may capture an image with high precision.
- images of the plurality of carriages 23 may be captured at a time using a plurality of position detectors 72 , and as a result, it is possible to reduce time required to capture the images.
- the position detector 72 may capture an image while moving in the Y-axis direction, and in this case, it is possible to further reduce time required to capture the image.
- the position detectors 72 of the second image capturing section 70 are provided in a single row in the Y-axis direction, but may be provided in two rows. In this case, the image capturing operation of the position detector 72 at the first image capturing position P 1 and the image capturing operation of the position detector 72 at the second image capturing position P 2 may be simultaneously performed. Therefore, the image capturing time may be further reduced.
- the position detector 72 captures the images of the carriage marks 25 a and 25 b , but images of the carriage 23 at other positions may be captured.
- another reference mark may be formed on the carriage 23 and an image of the reference mark may be captured, or an image of a particular nozzle of the droplet ejecting head 24 may be captured as an image of the reference mark.
- the droplet ejecting timing of the droplet ejecting head 24 and the positions of the carriage 23 (droplet ejecting head 24 ) in the X-axis direction and the ⁇ direction are corrected using the captured images at the first image capturing position P 1 and the second image capturing position P 2 .
- it does not have to acquire the captured images at both of the first image capturing position P 1 and the second image capturing position P 2 .
- only the captured image of the first carriage mark 25 a may be acquired by capturing an image of the carriage 23 at the first image capturing position P 1 by the position detector 72 . Further, based on the captured image, the position of the first carriage mark 25 a is detected, and at least the positional deviation amount in the Y-axis direction between the detection position and the reference position of the first carriage mark 25 a is calculated such that only the droplet ejecting timing of the droplet ejecting head 24 is corrected. In this case, it is possible to correct at least the positional deviation in the Y-axis direction which requires high landing precision.
- the captured images at both of the first image capturing position P 1 and the second image capturing position P 2 may be acquired with a predetermined timing, or for example, the captured images may be acquired at the time of the cleaning of the droplet ejecting head 24 , which is performed with a predetermined frequency.
- the droplet ejecting timing of the droplet ejecting head 24 may be corrected, and the positions of the carriage 23 (droplet ejecting head 24 ) in the X-axis direction and the ⁇ direction may be corrected.
- the position detectors 72 and the carriages 23 are provided side by side in the X-axis direction, and the number of position detectors 72 and the number of carriages 23 are equal to each other, but as illustrated in FIG. 11 , a single position detector 72 may be provided.
- the position detector 72 is configured to be movable in the X-axis direction along the base 71 .
- a mechanism for moving the position detector 72 is not particularly limited, but an actuator, which has, for example, a scanning axis in the X-axis direction, is used as the mechanism.
- step S 2 as illustrated in FIG. 12 , the position detector 72 is moved in the X-axis direction in a state in which the Y-axis linear motors 13 are stopped at the first image capturing position P 1 . Further, at the first image capturing position P 1 , images of the plurality of carriages 23 (first carriage marks 25 a ) are captured. Next, as illustrated in FIG. 13 , even at the second image capturing position P 2 , the position detector 72 is moved in the X-axis direction in a state in which the Y-axis linear motors 13 are stopped. Further, at the second image capturing position P 2 , images of the plurality of carriages 23 (second carriage marks 25 b ) are captured. Further, the other steps S 1 and S 3 are identical to steps S 1 and S 3 in the aforementioned exemplary embodiment, respectively.
- the droplet ejecting timing of the droplet ejecting head 24 may be corrected, and the positions of the carriage 23 (droplet ejecting head 24 ) in the X-axis direction and the 0 direction may be corrected.
- the plurality of position detectors 72 are not required, and as a result, it is possible to simplify the configuration of the second image capturing section 70 .
- the position detector 72 is provided on the second Y-axis slider 80 , but may be provided on the workpiece table 40 . Even in this case, the droplet ejecting timing of the droplet ejecting head 24 may be corrected, and the positions of the carriage 23 (droplet ejecting head 24 ) in the X-axis direction and the ⁇ direction may be corrected by performing the aforementioned steps S 1 to S 3 . Further, the position detectors 72 may be provided such that the number of position detectors 72 is equal to the number of carriages 23 as in the case illustrated in FIG. 2 , or the position detector 72 may be configured to be movable in the X-axis direction as in the case illustrated in FIG. 11 .
- the position detector 72 may be provided on the carriage 23 .
- the position detector 72 may, for example, detect the positions of the carriage 23 (droplet ejecting head 24 ) by capturing an image of the reference mark formed on the workpiece table 40 , the flushing unit 50 , or the ejecting inspection unit 60 .
- the position detectors 72 may be provided such that the number of position detectors 72 is equal to the number of carriages 23 as in the case illustrated in FIG. 2 , or the position detector 72 may be configured to be movable in the X-axis direction as in the case illustrated in FIG. 11 .
- the positions of the carriage marks 25 a and 25 b of the carriage 23 are detected by the position detector 72 , but the means for detecting the positions is not limited thereto.
- a laser interferometer (not illustrated) or a laser displacement meter (not illustrated) may be used to detect the positions of the carriage marks 25 a and 25 b.
- the workpiece table 40 is moved in the Y-axis direction using the Y-axis linear motors 13 (first Y-axis slider 42 ) and the table movement mechanism 41 as the workpiece movement mechanism, but the droplet ejecting head 24 may be moved in the Y-axis direction.
- both of the workpiece table 40 and the droplet ejecting head 24 may be moved in the Y-axis direction.
- the workpiece table 40 is moved in the X-axis direction such that a line break is performed, but the droplet ejecting head 24 may be moved in the X-axis direction.
- the X-axis linear motor 15 may be used in the case in which the droplet ejecting head 24 is moved in the X-axis direction.
- the flushing unit 50 , the ejecting inspection unit 60 , and the second image capturing section 70 are moved in the Y-axis direction using the Y-axis linear motors 13 (second Y-axis slider 80 ) as the unit movement mechanism, but the carriage 23 (droplet ejecting head 24 ) may be moved in the Y-axis direction.
- both of the droplet ejecting head 24 and the flushing unit 50 , the ejecting inspection unit 60 , and the second image capturing section 70 may be moved in the Y-axis direction.
- the droplet ejecting apparatus 1 configured as described above is applied to, for example, a substrate processing system for forming an organic EL layer of an organic light emitting diode which is disclosed in Japanese Patent Application Laid-Open No. 2017-13011. Specifically, the droplet ejecting apparatus 1 is applied to a coating apparatus for applying an organic material for forming a hole injection layer on a glass substrate as the workpiece W, a coating apparatus for applying an organic material for forming a hole transport layer on a glass substrate (hole injection layer), and a coating apparatus for applying an organic material for forming a light emitting layer on a glass substrate (hole transport layer).
- the droplet ejecting apparatus 1 may also be applied to the coating process of forming the electron transport layer and the electron injection layer.
- the droplet ejecting apparatus 1 may be applied to form the organic EL layer of the organic light emitting diode as described above, and may be applied to electro-optical devices (flat panel displays (FPD)) such as color filters, liquid crystal display devices, plasma displays (PDP devices), electron emitting devices (FED devices or SED devices), or may be applied to forming metal wiring, lenses, resist, light diffusion bodies, and the like.
- electro-optical devices flat panel displays (FPD)
- FPD flat panel displays
- PDP devices plasma displays
- FED devices or SED devices electron emitting devices
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Abstract
Description
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JP2017-042756 | 2017-03-07 | ||
JP2017042756A JP6925143B2 (en) | 2017-03-07 | 2017-03-07 | Droplet ejection device, droplet ejection method, program and computer storage medium |
JPJP2017-042756 | 2017-03-07 |
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US20180257099A1 US20180257099A1 (en) | 2018-09-13 |
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JP (1) | JP6925143B2 (en) |
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CN108568382B (en) | 2022-05-06 |
KR102505158B1 (en) | 2023-02-28 |
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KR20180102489A (en) | 2018-09-17 |
JP6925143B2 (en) | 2021-08-25 |
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US20180257099A1 (en) | 2018-09-13 |
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