JP6576124B2 - Droplet ejection apparatus, droplet ejection method, program, and computer storage medium - Google Patents

Description

  The present invention relates to a droplet discharge device that discharges and draws functional liquid droplets on a workpiece, a droplet discharge method using the droplet discharge device, a program, and a computer storage medium.

  2. Description of the Related Art Conventionally, as an apparatus that performs drawing on a workpiece using a functional liquid, an ink jet type liquid droplet ejection apparatus that ejects the functional liquid as droplets is known. As the droplet discharge device, for example, an electro-optical device (flat panel display: FPD) such as an organic EL device, a color filter, a liquid crystal display device, a plasma display (PDP device), and an electron emission device (FED device, SED device) is manufactured. It is widely used.

  For example, the droplet discharge device is a functional droplet discharge head that discharges droplets of functional liquid, a work stage on which a workpiece is mounted, and a workpiece along a direction in which a pair of guide support bases extend (main scanning direction). And a moving mechanism for moving the stage. Then, while moving the work relative to the functional liquid droplet ejection head by the work stage, the functional liquid is ejected from the functional liquid droplet ejection head to the bank formed in advance on the work, thereby drawing on the work. (Patent Document 1).

  In such a droplet discharge device, the workpiece is aligned in advance in order to accurately discharge the functional liquid to a desired position on the workpiece. The work stage is configured to be movable in the horizontal direction including the rotation operation, and the alignment mark of the work is imaged by an alignment camera provided above the work stage. Then, the workpiece alignment is performed by correcting the horizontal position of the workpiece stage based on the captured image. Thereafter, the aligned workpiece is moved to a predetermined position, and the functional liquid is discharged from the functional droplet discharge head into the bank of the workpiece.

JP 2010-198028 A

  However, in the process of moving the work stage toward the functional liquid droplet ejection head after aligning the work, due to factors such as the work position deviation, mechanical accuracy of the work stage moving mechanism, temperature change, change over time, There has been a problem that the positional relationship between the functional liquid droplet ejection head and the bank on the workpiece may change.

  The present invention has been made in view of such a point, and an object of the present invention is to align a functional liquid droplet ejection head of a liquid droplet ejection apparatus and a bank on a work with high accuracy.

In order to achieve the above object, the present invention provides a liquid droplet ejection apparatus that draws and draws a liquid droplet of a functional liquid on a workpiece. A droplet discharge head for discharging, a work stage on which the workpiece is placed, and a movement of the work stage to move the droplet discharge head and the workpiece in a main scanning direction, a direction orthogonal to the main scanning direction, and A workpiece moving mechanism that moves relative to the rotation direction; a movement amount detection mechanism that detects a movement amount of the workpiece stage in the main scanning direction by the workpiece moving mechanism; and the droplet discharge in the main scanning direction of the workpiece. A mark detection unit for detecting a reference mark formed in advance on the upper surface of the moving workpiece on the upstream side of the head; and the workpiece moves a predetermined distance along the main scanning direction. A mark position estimation unit that estimates the position of the reference mark based on the amount of movement detected by the movement amount detection mechanism, and detected by the mark detection unit when the workpiece has moved the predetermined distance. Further, a difference between the position of the reference mark and the position of the reference mark estimated by the mark position estimation unit when the workpiece has moved the predetermined distance is detected, and the droplet is detected based on the detected difference. And a work movement control unit that controls a movement speed of the work stage by the work movement mechanism so as to eliminate a difference between the work and the droplet discharge head at a discharge position.

  According to the present invention, a movement amount detection mechanism that detects the movement amount of the work stage in the main scanning direction, and a mark detection unit that detects a reference mark formed in advance on the upper surface of the work on the upstream side of the droplet discharge head. And a mark position estimation unit that estimates the position of the reference mark based on the amount of movement detected by the movement amount detection mechanism, the position of the reference mark detected by the mark detection unit, and the mark As a correlation with the position of the reference mark estimated by the position estimation unit, for example, a difference between the position of the reference mark detected by the mark detection unit and the position of the reference mark estimated by the mark position estimation unit is obtained. it can. Therefore, even if there is a deviation in the relative positional relationship between the bank on the workpiece and the droplet discharge head, the relative position between the workpiece and the droplet discharge head is corrected so that this difference is zero. As a result, before the droplets are ejected from the droplet ejection head, the droplet ejection head and the bank on the work can be aligned with high accuracy.

  The reference mark may be a bank formed so as to define a landing area on which a droplet discharged from the droplet discharge head is landed, or an identification symbol formed outside the landing area.

On the work, the landing area is formed with a plurality, the workpiece movement control unit, said each landing area, said to eliminate the difference between the workpiece and the liquid droplet ejection head of the droplet ejection position The moving speed of the work stage by the work moving mechanism may be controlled .

The reference mark is detected by the mark detection unit at a predetermined cycle, and the distance between the mark detection unit and the droplet discharge head is such that the work stage moves during the cycle for detecting the reference mark. The moving speed of the work stage by the work moving mechanism is set to n times (n = a positive integer) and the difference between the work and the liquid drop discharging head at the liquid drop discharge position is eliminated. Is controlled between the (n−1) th detection of the reference mark and the nth detection of the reference mark after the mark detection unit detects the reference mark. May be.

The image processing apparatus further includes an imaging unit disposed on the downstream side of the droplet discharge head in the main scanning direction of the workpiece, wherein the workpiece is formed with a landing area in which a predetermined pattern is drawn by the droplet, and the workpiece movement The control unit removes the liquid from the droplet discharge head to a predetermined position outside the landing area in a state where the difference between the workpiece and the droplet discharge head at the droplet discharge position is eliminated. A droplet is ejected, and the position of the droplet ejected from the droplet ejection head is identified based on the captured image captured by the imaging unit, and the position of the identified droplet and the outside of the landing area The amount of deviation from a predetermined position is calculated, and in the subsequent ejection of droplets from the droplet ejection head, the workpiece at the droplet ejection position is calculated based on the calculated amount of deviation. And the liquid By the workpiece moving mechanism so as to eliminate the difference between the discharge head may be controlled moving speed of said work stage.

Another aspect of the present invention is a droplet discharge method for drawing by drawing droplets of a functional liquid onto a workpiece using a droplet discharge device having a workpiece moving mechanism that moves the workpiece in the main scanning direction. When the workpiece is moved toward the droplet discharge head along the main scanning direction by the workpiece movement mechanism, the movement amount of the workpiece is detected by the movement amount detection mechanism, and the liquid in the main scanning direction of the workpiece is detected. A reference mark formed in advance on the upper surface of the moving workpiece on the upstream side of the droplet discharge head is detected, and is detected by the movement amount detection mechanism when the workpiece moves a predetermined distance along the main scanning direction. The position of the reference mark is estimated based on the amount of movement performed, and the position of the reference mark detected when the workpiece has moved the predetermined distance, and the workpiece moved to the predetermined distance. On the basis of the movement amount detected by the movement amount detecting mechanism detects a difference between the position of the reference mark to be estimated, based on the detected difference when a droplet on the work from the droplet discharge head The moving speed of the workpiece by the workpiece moving mechanism is controlled so as to eliminate the difference between the workpiece and the droplet discharging head at the droplet discharging position where the workpiece is discharged.

  The reference mark may be a bank formed so as to define a landing area on which a droplet discharged from the droplet discharge head is landed, or an identification symbol formed outside the landing area.

A plurality of the landing areas are formed on the workpiece, and the moving speed of the workpiece by the workpiece moving mechanism is controlled so as to eliminate the difference between the workpiece and the droplet discharge head at the droplet discharge position. It may be performed for each landing area.

The detection of the reference mark on the upstream side of the droplet discharge head is performed in a predetermined cycle, and the distance between the position where the reference mark is detected and the droplet discharge head is equal to the cycle of detecting the reference mark. It is set to n times (n = a positive integer) the distance that the workpiece moves in between, and the workpiece moving mechanism eliminates the difference between the workpiece and the droplet discharge head at the droplet discharge position. Controlling the moving speed of the workpiece includes the detection of the reference mark performed at the (n-1) th time after the detection of the reference mark and the detection of the reference mark performed at the nth time. It may be done in between.

A landing area where a predetermined pattern is drawn by the droplet is formed on the workpiece, and the difference between the workpiece and the droplet discharge head at the droplet discharge position is eliminated , and the landing area A droplet is ejected from the droplet ejection head to a predetermined external position, and a predetermined location outside the landing area is downstream of the droplet ejection head in the main scanning direction of the workpiece. The position of the ejected liquid droplet relative to the predetermined position is detected, and the amount of deviation between the detected liquid droplet position and a predetermined position outside the landing area is calculated, and next time In the subsequent ejection of droplets from the droplet ejection head, the difference between the workpiece and the droplet ejection head at the droplet ejection position and the droplet ejection head based on the calculated deviation amount Eliminate Sea urchin may control the moving speed of the workpiece by the workpiece moving mechanism.

  According to another aspect of the present invention, there is provided a program that operates on a computer of the droplet discharge device so that the droplet discharge method is executed by the droplet discharge device.

  According to another aspect of the present invention, a readable computer storage medium storing the program is provided.

  According to the present invention, the functional liquid droplet ejection head of the liquid droplet ejection apparatus and the bank on the work can be aligned with high accuracy.

1 is a schematic side view showing an outline of a configuration of a droplet discharge device according to a first embodiment. 1 is a schematic plan view showing an outline of a configuration of a droplet discharge device according to a first embodiment. It is a schematic plan view which shows the state in which the bank and the reference mark were formed on the work. It is a schematic diagram of a captured image. It is a block diagram which shows the outline of a structure of a control part typically. It is a correction table which shows the position and deviation | shift amount of a workpiece | work. It is explanatory drawing which shows a mode that a workpiece | work is moved toward a droplet discharge head. It is explanatory drawing of the processing operation in the droplet discharge apparatus concerning 1st Embodiment. It is explanatory drawing which represented the relative positional relationship of a workpiece | work and a droplet discharge head in time series. It is a model top view which shows the outline of a structure of the droplet discharge apparatus concerning other embodiment. It is a schematic plan view which shows the state of the surface of the workpiece | work concerning other embodiment. It is a table | surface which shows the position and deviation | shift amount of a workpiece | work. It is a table | surface which shows the position and deviation | shift amount of a workpiece | work. FIG. 6 is a schematic plan view showing a state in which a droplet has landed on a reference mark formed on a workpiece. It is a top view which shows the outline of a structure of the substrate processing system provided with the droplet test | inspection apparatus. It is a side view which shows the outline of a structure of an organic light emitting diode. It is a top view which shows the outline of a structure of the partition of an organic light emitting diode.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. The present invention is not limited to the embodiments described below.

<1. First Embodiment>
First, the configuration of the droplet discharge device according to the first embodiment of the present invention will be described with reference to FIG. 1 and FIG. FIG. 1 is a schematic side view showing an outline of the configuration of the droplet discharge device 1. FIG. 2 is a schematic plan view showing an outline of the configuration of the droplet discharge device 1. In the following, the main scanning direction of the workpiece W is the X-axis direction, the sub-scanning direction orthogonal to the main scanning direction is the Y-axis direction, the vertical direction orthogonal to the X-axis direction and the Y-axis direction is the Z-axis direction, and the Z-axis The direction of rotation around the direction is the θ direction.

  Moreover, the bank 100 which is a partition wall is formed in the workpiece | work W used by this invention, as shown in FIG. The bank 100 is patterned into a predetermined pattern by performing, for example, a photolithography process or an etching process. In the bank 100, a plurality of substantially rectangular openings 101 are formed in a row at a predetermined pitch in the row direction (X-axis direction) and the column direction (Y-axis direction). The inside of the opening 101 is a landing area where droplets discharged by the droplet discharge device 1 land. For example, a photosensitive polyimide resin is used for the bank 100.

  A plurality of reference marks 102 are formed at the end of the workpiece W along the X-axis direction. The reference mark 102 is drawn on the upper surface of the workpiece W using, for example, an ink jet drawing method. In FIG. 3, a substantially cross-shaped mark is drawn as the reference mark 102, but the shape of the reference mark 102 is not limited to the contents of the present embodiment, and is, for example, a circle or a triangle. As long as it is identifiable, it can be set arbitrarily. 3 illustrates a state in which the reference mark 102 is formed at the end of the workpiece W on the Y direction negative direction side, the reference mark 102 is formed at the end of the workpiece W on the Y direction positive direction side. May be.

  The droplet discharge device 1 extends in the main scanning direction (X-axis direction), spans the X-axis table 10 that moves the workpiece W in the main scanning direction, and straddles the X-axis table 10, and performs sub-scanning. It has a pair of Y-axis tables 11, 11 extending in the direction (Y-axis direction). A pair of X-axis guide rails 12 and 12 are provided on the top surface of the X-axis table 10 so as to extend in the X-axis direction, and each X-axis guide rail 12 is provided with an X-axis linear motor (not shown). ing. On the upper surface of each Y-axis table 11, a Y-axis guide rail 13 is provided extending in the Y-axis direction, and a Y-axis linear motor (not shown) is provided on the Y-axis guide rail 13. In the following description, on the X-axis table 10, an area on the X-axis negative direction side from the Y-axis table 11 is referred to as a carry-in / out area A1, and an area between the pair of Y-axis tables 11 and 11 is referred to as a processing area A2. The area on the positive side of the X axis from the Y axis table 11 is referred to as a standby area A3.

  A work stage 20 is provided on the X-axis table 10. A carriage unit 30 and an imaging unit 40 are provided on the pair of Y-axis tables 11 and 11.

  The work stage 20 is a vacuum suction stage, for example, and sucks and places the work W thereon. The work stage 20 is supported by a stage rotating mechanism 21 provided on the lower surface side of the work stage 20 so as to be rotatable in the θ direction. The work stage 20 and the stage rotation mechanism 21 are supported by an X-axis slider 22 provided on the lower surface side of the stage rotation mechanism 21. The X-axis slider 22 is attached to the X-axis guide rail 12 and is configured to move at, for example, a predetermined speed V in the X-axis direction by an X-axis linear motor provided on the X-axis guide rail 12. Therefore, by moving the work stage 20 in the X-axis direction along the X-axis guide rail 12 by the X-axis slider 22 while the work W is placed, the speed of the work W in the X-axis direction (main scanning direction) V It can be moved with.

  A work alignment camera (not shown) that images the reference mark 102 of the work W on the work stage 20 is provided above the work stage 20 in the carry-in / out area A1. Based on the image captured by the workpiece alignment camera, the X-axis slider 22 and the stage rotating mechanism 21 correct the positions of the workpiece W placed on the workpiece stage 20 in the X-axis direction and the θ direction as necessary. Is done. Thereby, the workpiece W is aligned and set to a predetermined initial position.

  The X-axis slider 22 has a movement amount detection mechanism 23 that detects the movement amount of the X-axis slider 22, that is, the movement amount of the work W placed on the work stage 20. As the movement amount detection mechanism 23, for example, a linear encoder that emits a pulse signal every time it moves a predetermined distance is used. Information (pulse signal) regarding the movement amount detected by the movement amount detection mechanism 23 is input to the control unit 150 described later.

  A plurality of, for example, ten carriage units 30 are provided in the Y-axis table 11. Each carriage unit 30 includes a carriage plate 31, a carriage holding mechanism 32, a carriage 33, and a droplet discharge head 34. The carriage holding mechanism 32 is provided at the center of the lower surface of the carriage plate 31, and a carriage 33 is detachably attached to the lower end of the carriage holding mechanism 32.

  The carriage plate 31 is attached to the Y-axis guide rail 13 and is movable in the Y-axis direction by a Y-axis linear motor (not shown) provided on the Y-axis guide rail 13. Therefore, by moving the carriage plate 31 in the Y-axis direction, the droplet discharge head 34 and the workpiece W can be relatively moved along the Y-axis direction. A plurality of carriage plates 31 can be moved together in the Y-axis direction. In addition, the X-axis slider 22 and the X-axis guide rail 12 (X-axis linear motor), the stage rotating mechanism 21, the carriage plate 31 and the Y-axis guide rail 13 (Y-axis linear motor) are the workpiece W and the droplet in the present invention. It functions as a workpiece moving mechanism that relatively moves the ejection head 34 in the X-axis direction (main scanning direction), the Y-axis direction (direction orthogonal to the main scanning direction), and the rotation direction (θ direction).

  A plurality of droplet discharge heads 34 are arranged on the lower surface of the carriage 33 in the X-axis direction and the Y-axis direction. In this embodiment, for example, three droplet ejection heads 34 are provided in the X-axis direction and three in the Y-axis direction, that is, a total of six. A plurality of discharge nozzles (not shown) are formed on the lower surface of the droplet discharge head 34, that is, the nozzle surface. From the ejection nozzle, functional liquid droplets are ejected to a liquid droplet ejection position directly below the liquid droplet ejection head 34.

  The imaging unit 40 is disposed at a position that substantially overlaps the locus of the reference mark 102 on the workpiece W when the workpiece stage 20 is moved in the X direction by the X-axis linear motor in plan view. Specifically, for example, as shown in FIG. 2, the arrangement of the second carriage plate 31a from the bottom in the Y direction on the negative side is the locus of the reference mark 102 when the workpiece W is moved in the W axis direction. When substantially overlapping, the imaging unit 40 is provided on the carriage plate 31a. The imaging unit 40 includes a first imaging unit 41 and a second imaging unit 42 that are provided facing each other in the X-axis direction with the carriage 33 (droplet ejection head 24) interposed therebetween. As the first imaging unit 41 and the second imaging unit 42, for example, a CCD camera is used. The first imaging unit 41 is disposed on the negative side in the X direction with respect to the carriage 33, and is disposed, for example, a predetermined distance L away from the carriage 33 in the X axis direction. The second imaging unit 42 is disposed on the positive side in the X direction with respect to the carriage 33. The setting of the distance L will be described later.

  The first imaging unit 41 images the reference mark 102 formed on the workpiece W. The first imaging unit 41 is supported by a base 43 provided on the side surface of the Y-axis table 11 on the X-axis negative direction side among the pair of Y-axis tables 11 and 11. When the work W moves from the carry-in / out area A1 toward the processing area A2, and the work stage 20 is guided directly below the first imaging unit 41, the first imaging unit 41 has a predetermined period T. Thus, the workpiece W placed on the workpiece stage 20 is imaged. Thereby, the captured image F of the workpiece | work W as shown, for example in FIG. 4 is acquired. The acquired captured image F is input to the control unit 150 described later. Note that the timing of imaging by the first imaging unit 41 is determined based on, for example, a pulse signal detected by the movement amount detection mechanism 23, and the imaging period T is the time Ts required for processing of the captured image F by the control unit 150. Is set longer than. Moreover, the captured image F shown in FIG. 4 depicts a state in which the vicinity of the end portion of the workpiece W on the positive side in the X direction is captured.

  The second imaging unit 42 is supported by a base 44 provided on the side surface of the Y-axis table 11 on the X-axis positive direction side among the pair of Y-axis tables 11 and 11. When the work stage 20 is guided directly below the second imaging unit 42, the second imaging unit 42 captures the workpiece W placed on the workpiece stage 20, thereby capturing the workpiece W on the upper surface of the workpiece W. The landed droplet can be imaged.

  The droplet discharge device 1 described above is provided with a control unit 150. The control unit 150 is a computer, for example, and has a data storage unit (not shown). The data storage unit stores, for example, drawing data (bitmap data) for controlling droplets discharged onto the work W and drawing a predetermined pattern on the work W. Further, the control unit 150 has a program storage unit (not shown). The program storage unit stores a program for controlling various processes in the droplet discharge device 1.

  The data and the program are stored in a computer-readable storage medium such as a computer-readable hard disk (HD), flexible disk (FD), compact disk (CD), magnetic optical desk (MO), or memory card. It may be recorded and installed in the control unit 150 from the storage medium.

  Further, as shown in FIG. 5, the control unit 150 processes the captured image F captured by the first imaging unit 41 and detects the position of the reference mark 102 from the captured image, A mark position estimation unit 161 that estimates the position of the reference mark 102 based on the amount of movement detected by the movement amount detection mechanism 23 when the workpiece W on the stage 20 moves a predetermined distance along the X-axis direction; A work movement control unit 162 that controls the operation of each drive system that functions as a work movement mechanism, such as an X-axis linear motor, a stage rotation mechanism 21, and a Y-axis linear motor, is provided.

  When the image processing unit 160 detects the position of the reference mark 102 based on the captured image F, first, the position information of the first image capturing unit 41 in the X-axis direction and the Y-axis direction when the captured image F is acquired is used. Based on the predetermined position of the captured image F, for example, the coordinates of the center position in the X axis direction and the Y axis direction are calculated. Next, the distance between the center position of the captured image F and the center position CT of the reference mark 102 is calculated based on the captured image F, thereby obtaining the X and Y coordinates of the center position CT of the reference mark 102. Further, in the image processing unit 160, the captured image F is captured after the captured image F is captured or when the work W starts moving from the initial position of the carry-in / out area A1 toward the processing area A2. Time information M such as the time until is also stored. Accordingly, the image processing unit 160 detects the position information M (X, Y) of the reference mark 102 including the time information M. In such a case, the first imaging unit 41 and the image processing unit 160 function as a workpiece detection unit in the present invention.

  In the mark position estimation unit 161, information on the movement amount detected by the movement amount detection mechanism 23 when the work stage 20 on which the work W is placed moves from the initial position of the loading / unloading area A1 toward the processing area A2. Are input via the control unit 150. In addition, position information (coordinate information) of the reference mark 102 formed on the workpiece W in the workpiece W is input to the mark position estimation unit 161 in advance. In the mark position estimation unit 161, based on the time information M stored in the image processing unit 160 and the information of the movement amount detection mechanism 23, the position (X axis direction position) of the work stage 20 when the captured image F is captured ( Coordinate). Next, the position of the workpiece W when the captured image F is captured is calculated based on the positional relationship between the workpiece W and the workpiece stage 20 when the workpiece W is aligned. Next, based on the calculated position of the workpiece W and position information M (X, Y) of the reference mark 102 in the workpiece W, the position of the reference mark 102 in the X-axis direction when the captured image F is captured. Is estimated.

  The work movement control unit 162 controls the operation of each drive system that functions as a work movement mechanism so as to draw a predetermined pattern on the work W based on the drawing data stored in the data storage unit of the control unit 150. For example, when the work stage 20 is moved, a command signal (pulse train) is output to the X-axis linear motor based on the position information (pulse signal) obtained from the movement amount detection mechanism 23, and the work stage 20 Control position and speed. Further, the workpiece movement control unit 162 includes the position information M (X, Y) of the reference mark 102 detected by the image processing unit 160 and the position in the X-axis direction of the reference mark 102 estimated by the mark position estimation unit 161. Based on this correlation, the operation of each drive system is controlled so as to correct the relative position between the droplet discharge head 34 and the workpiece W at the droplet discharge position immediately below the droplet discharge head 34. .

  The correction of the relative position between the droplet discharge head 34 and the workpiece W based on the above correlation will be specifically described. As described above, even if the workpiece W is aligned in the carry-in / out area A1, each drive system that moves the work stage 20 in the process of moving the work stage 20 toward the droplet discharge head 34 in the processing area A2 is used. The relative positional relationship between the droplet discharge head 34 and the bank 100 on the workpiece W may deviate from a desired state due to factors such as mechanical accuracy and temperature change. In this case, there is a problem because drawing cannot be performed accurately on the workpiece W.

  Therefore, in the workpiece movement control unit 162, first, the difference between the position in the X-axis direction of the reference mark 102 detected by the image processing unit 160 and the position in the X-axis direction of the reference mark 102 estimated by the mark position estimation unit 161. Ask for. If the obtained difference is zero or within a predetermined threshold, it is determined that the workpiece W on the workpiece stage 20 is at a desired position. That is, since the position of the reference mark 102 estimated by the mark position estimation unit 161 is a theoretical position when the workpiece W is conveyed without causing a shift, the theoretical position and the image processing unit 160 If the detected position of the reference mark 102 matches, it can be said that the relative positional relationship between the workpiece W on the workpiece stage 20 and the droplet discharge head 34 is in a desired state.

  On the other hand, if the difference between the detection position by the image processing unit 160 and the position estimated by the mark position estimation unit 161 exceeds a predetermined threshold, the relative positional relationship between the workpiece W and the droplet discharge head 34 is established. It is determined that a deviation has occurred. In such a case, when the workpiece W is moved by the distance L from the position where the captured image F is acquired by the first imaging unit 41 and moved to the droplet discharge position, the workpiece W is shifted from the predetermined position by the difference. It will move to the position. Accordingly, the workpiece movement control unit 162 calculates a correction position such that the difference is zero or within a predetermined threshold value, and controls the workpiece stage 20 to move to the correction position, whereby the workpiece W and the droplet discharge are calculated. The relative positional relationship with the head 34 is corrected. Note that the above-described time Ts required for processing the captured image F is, for example, the time for generating the captured image F by the first image capturing unit 41, and the captured image F is transmitted from the first image capturing unit 41 to the control unit 150. From the acquisition of the captured image F to the calculation of the correction position, such as the time, the time for detecting the position information M (X, Y) of the reference mark 102 by the image processing unit 160, and the time for calculating the correction position by the work movement control unit 162. Means the time until.

  When the correction position is calculated, the work stage 20 (the work stage 20 () is positioned so that the reference mark 102 in which the position shift is detected is positioned at the correction position at the droplet discharge position directly below the droplet discharge head 34. X axis linear motor) is controlled. As described above, a predetermined time Ts is required from the acquisition of the captured image F by the first imaging unit 41 to the calculation of the correction position by the work movement control unit 162. Therefore, the distance L between the first imaging unit 41 and the carriage 33 is a droplet in which the work stage 20 that moves along the X axis at the speed V is provided on the carriage 33 from directly below the first imaging unit 41. The time required to move to the droplet discharge position directly under the discharge head 34 is set to be longer than the time Ts required for processing the captured image F. That is, the distance L is set longer than the distance that the workpiece W moves during the time Ts. Further, since the distance L needs to be synchronized with the imaging cycle T, it is set to an integral multiple of the distance that the workpiece W moves during the imaging cycle T. That is, the distance L is set to satisfy L = n × T × V (n is a positive integer).

This position correction will be specifically described with reference to a correction table AM shown in FIG. In the following description, it is assumed that “n” is “2”, that is, the distance L is twice the distance traveled during the imaging period T. The “number of detections” in FIG. 6 is the number of times the captured image F of the workpiece W is acquired at a predetermined period T. For example, “DATA1” means the first imaging, and “DATA2” means the second imaging. Yes. The “deviation amount” in FIG. 6 means the deviation amount detected by the workpiece movement control unit 162. In Figure 6, for example, DATA3 shift amount _{L 1} is detected in the amount of displacement after DATA4 2L ₁ is detected.

The “current position” in FIG. 6 is the position of the workpiece W recognized by the mark position estimation unit 161 at the time of acquiring each DATA. For example, the case where the workpiece stage 20 is at a predetermined position set in advance. It is written as zero. For example, in DATA5, workpiece W to -L ₁ shift position is meant that it is located. The reason why the “current position” may be other than zero will be described later.

“Correction position” in FIG. 6 means the coordinates of the correction position calculated by the workpiece movement control unit 162, and is obtained as a value obtained by subtracting “deviation amount” from “current position”. For example, since the “deviation amount” is not detected in DATA1 and DATA2 of the correction table AM, the correction position is zero. Further, the DATA3, "current position" is zero, "deviation amount" is because it is _{L 1,} "the correction position" becomes -L _1.

In setting the distance L, “n” is set to “2”. Therefore, in correcting the position of the workpiece W at the droplet discharge position, the workpiece is delayed by two cycles from the imaging (DATA 3) in which the “deviation amount” is detected. The work stage 20 (X-axis linear motor) is controlled so that W moves to the correction position. That is, to cancel the thread quantity L _1, is moved to the position of the coordinate -L ₁ a correction position. In this way, by correcting the position of the workpiece W in advance, a relative displacement between the workpiece W and the droplet discharge head 34 caused by any cause is detected by the droplet discharge head 34. Can be resolved before doing.

Further, when the workpiece W is moved to the correction position, for example, when the DATA5 of the correction table AM is acquired, the workpiece W is shifted to the coordinates shifted by −L ₁ in the relative positional relationship with the first imaging unit 41. Will be located. Therefore, the workpiece movement control unit 162 stores that the “current position” is shifted by −L ₁ as indicated by DATA 5 in FIG. Then, if it is detected in DATA5 that the “deviation amount” is 2L ₁ , since this “deviation amount” is actually detected at a position shifted by −L ₁ , The “correction position” obtained by subtracting the “deviation amount” is −3L ₁ . Therefore, in the DATA7 the capturing cycle T is delayed two cycles from DATA5, moves the workpiece carrier 20 in the position of the coordinate -3L ₁ is a correction position. In addition, since the imaging cycle T is maintained constant when moving to the correction position, for example, the movement speed of the work stage 20 by the X-axis linear motor is controlled to move to the correction position within the same imaging cycle T. Let

When “n” is set to “2” as in this embodiment, that is, when the distance L is twice the distance traveled by the workpiece W during the imaging period T, for example, FIG. If the captured image F is acquired by the first imaging unit 41 at the position of the workpiece W indicated by a solid line, after the workpiece W is captured by the first imaging unit 41, the distance travels by 1 / 2L (imaging cycle). 1 cycle), or while moving from the position of distance 1 / 2L to the position of distance L (2 cycles of imaging cycle), by shifting the position of the work stage 20 by the amount of deviation, at the droplet discharge position Although the workpiece W is arranged at the correction position, for example, when correction for DATA3 in FIG. 6 is performed at the time of DATA4 delayed by one cycle, the current position of DATA4 becomes “−L ₁ ” instead of “0”. Therefore, in order to minimize the influence of the correction, the correction operation is preferably performed during the imaging period T in which the reference mark 102 in which the deviation amount is detected reaches the droplet discharge position. That is, it is preferable that the correction operation based on the DATA3 information shown in the correction table AM is completed after the acquisition of DATA4 and after the acquisition of DATA5.

Then, for example, in DATA4 "current position" is acquired captured image F is in the state of "0", the two cycles delayed DATA6 correction for deviation amount 2L ₁ is performed. Thus, next ₁ "current position" -2L in DATA6, different without correcting operation is completed affected by correction based on DATA3.

  Next, work processing performed using the droplet discharge device 1 configured as described above will be described.

  First, the work stage 20 is arranged in the carry-in / out area A1, and the work W carried into the droplet discharge device 1 by the transport mechanism (not shown) is placed on the work stage 20. Subsequently, an alignment mark of the workpiece W on the workpiece stage 20 is imaged by the workpiece alignment camera. Then, based on the captured image, the position of the workpiece W placed on the workpiece stage 20 in the θ direction is corrected by the stage rotating mechanism 21, and the workpiece W is aligned (step S1). For example, if correction in the Y-axis direction is necessary, the relative positional relationship between the work stage 20 and the carriage unit 30 in the Y-axis direction is corrected by appropriately moving the Y-axis linear motor. .

  Thereafter, the work stage 20 is moved from the loading / unloading area A1 to the processing area A2 by the X-axis slider 22. In the processing area A <b> 2, droplets are discharged from the droplet discharge head 24 onto the workpiece W that has moved below the droplet discharge head 24. Further, as shown in FIG. 8, the work stage 20 is further moved to the standby area A3 side so that the entire surface of the work W passes under the droplet discharge head 24. Then, the workpiece is reciprocated in the X-axis direction, and the carriage unit 30 is appropriately moved in the Y-axis direction to draw a predetermined pattern on the workpiece W (step S2).

  Here, the work W position correction operation based on the correction table AM will be described with reference to FIG. The left-right direction in FIG. 9 represents the X-axis direction, and the vertical direction depicts the state of the work W moving from the position where DATA1 is acquired to the position where DATA7 is acquired over time. The distance between the alternate long and short dash lines extending in the vertical direction is the distance that the workpiece W moves during the imaging period T by the first imaging unit 41, and “n” is “2” as in the present embodiment. Is set, the distance between adjacent one-dot chain lines is 1 / 2L. Further, “imaging position” shown in FIG. 9 represents a position where the workpiece W is imaged immediately below the first imaging unit 41, and “droplet ejection position” represents a position directly below the droplet ejection head 34. The distance between the “imaging position” and the “droplet discharge position” is L as described above. Further, the workpiece W shown in the “ideal state” in FIG. 9 depicts a state in which the reference marks 102 are formed at a pitch of, for example, ½ L for explanation.

  As shown in the “ideal state” in FIG. 9, for example, if the reference marks 102 are formed at equal intervals with a pitch of ½ L, and the workpiece W is conveyed while maintaining this state, the droplet discharge head Since the relative positional relationship between the bank 34 and the bank 100 on the workpiece W does not deviate, good drawing is performed at the droplet discharge position. However, in practice, as shown in the positions corresponding to DATA1 to DATA7 in FIG. 9, for example, the actual workpiece Wa is caused by factors such as the waviness of the workpiece Wa itself, the mechanical accuracy of the workpiece stage 20 and the like, temperature change, and the like. The relative positional relationship between the bank 100 on the workpiece Wa and the droplet discharge head 34 is not constant in the plane of the workpiece Wa, and in FIG. 9, the reference marks 102 are not positioned at equal intervals. The workpiece Wa is drawn with hatched hatching. In FIG. 9, if the droplet discharge position matches the center position of the reference mark 102, the relative positional relationship between the bank 100 on the workpiece W and the droplet discharge head 34 is in a desired state. It shall be.

As shown in FIG. 6, in DATA1 to DATA4, the position of the workpiece Wa is not particularly corrected. Therefore, the workpiece Wa moves to a position shifted by, for example, a position of ½ L every imaging period T. Go. Then, the reference mark 102 in DATA3 it is detected that are offset by a distance _{L 1} in the positive direction, for example the X direction from the imaging position in the DATA5 delayed two cycles from DATA3, the predetermined position set in advance The workpiece Wa is moved to a “correction position” that is shifted to the positive direction side in the X direction by a distance L ₁ from the _first position. As a result, as shown in FIG. 9, the droplet discharge position and the center position of the reference mark 102 can be matched. Note that the rectangular portion indicated by the reference symbol W _ref in FIG. 9 is a position where the workpiece Wa is present when the position of the workpiece Wa is not corrected.

In the DATA5, but displacement amount of the work Wa is detected as 2L _1, since DATA5 the captured image F is acquired in the correction position _{L 1} offset from _{W ref,} the deviation amount of the actual workpiece Wa is 3L ₁ next, as shown in FIG. 6, -3L ₁ is obtained as the correction position.

Then, in DATA6, obtains discharge the captured image F of the droplet to the work Wa is performed in the correction position -2L ₁ calculated in DATA4. Then, the workpiece movement control unit 162, the correction position -4L ₁ is determined based on the corrected position -2L ₁ and shift amount.

In DATA7, obtains discharge the captured image F of the droplet to the work Wa is performed in the correction position -3L ₁ obtained in DATA5. Then, this operation is repeated, and a predetermined pattern is drawn on the workpiece Wa.

  At this time, the upper surface of the workpiece W is imaged by the second imaging unit 42. The captured image is output to the control unit 150, and the control unit 150 inspects for a defective drawing state, such as film unevenness, based on the captured image. If it is determined in this inspection result that the drawing state is defective, for example, the ejection of droplets from the droplet ejection head 24 is feedback controlled (step S3).

  When the work stage 20 moves to the carry-in / out area A1, the work W for which the drawing process has been completed is carried out from the droplet discharge device 1. Subsequently, the next workpiece W is carried into the droplet discharge device 1. Next, the alignment of the workpiece W in step S1 described above is performed, and then steps S2 and S3 are performed.

  As described above, steps S1 to S3 are performed on each workpiece W, and a series of workpiece processing ends.

  According to the first embodiment described above, the workpiece W on the upstream side of the movement amount detection mechanism 23 that detects the amount of movement of the workpiece stage 20 in the X-axis direction (main scanning direction) and the droplet discharge head 34. Based on the first imaging unit 41 that acquires the captured image F of the upper surface, the image processing unit 160 that detects the reference mark 102 based on the captured image F, and the movement amount detected by the movement amount detection mechanism 23. And the mark position estimation unit 161 for estimating the position of the reference mark 102, the workpiece movement control unit 162 detects the position of the reference mark 102 detected by the mark position estimation unit 161. Based on the position of the mark 102, the difference between the two can be obtained. If the difference is equal to or larger than the threshold, the workpiece movement control unit 162 has a difference between the position of the reference mark 102 detected at the imaging position and the position of the reference mark 102 estimated by the mark position estimation unit 161. For example, the operation of the workpiece stage 20 is controlled so that the workpiece W is moved to a correction position where the deviation is eliminated at the droplet discharge position. As a result, the droplet discharge head and the bank on the workpiece can be aligned with high accuracy before the droplet discharge from the droplet discharge head 34 is performed. Thereby, a predetermined pattern can be accurately drawn on the workpiece W.

  In the above embodiment, the relative movement of the workpiece W and the droplet discharge head in the X axis direction and the θ direction is controlled by the workpiece stage 20, and the relative movement in the Y axis direction is controlled by the Y axis linear motor. However, the method of movement in the X-axis direction, the Y-axis direction, and the θ direction is not limited to the contents of the present embodiment. For example, the position of the carriage plate 31 may be fixed at a predetermined position, and the work stage 20 may be provided with a moving function in the X axis direction, the Y axis direction, and the θ direction. Conversely, the work stage 20 may be fixed and the carriage plate 31 may be provided with a function of moving in the X-axis direction, the Y-axis direction, and the θ direction. In any case, the above-described droplet discharge method of the present invention can be realized.

  In the above embodiment, the reference mark 102 is formed on the workpiece W in advance. However, the reference mark 102 is not always necessary. For example, the density of the bank 100 is determined by the captured image F captured by the first imaging unit 41. Can be detected, the position of the workpiece W may be detected based on the position of the bank 100. In such a case, the bank 100 functions as the reference mark 102.

  In the above embodiment, the case where the workpiece W is displaced in the X-axis direction has been described. However, even when the displacement occurs in the Y-axis direction and the θ-axis direction, correction in the X-axis direction is performed. By using the same method, the position of the workpiece W can be corrected as appropriate. That is, when the position of the workpiece W is corrected by the preceding control after the deviation amount is detected by the workpiece movement control unit 162 of the present embodiment, the correction amount at the correction position is stored in the workpiece movement control unit 162. By reflecting on the position of the reference mark 102 detected from the captured image F acquired at the correction position, an accurate shift amount can be detected regardless of the X-axis direction, the Y-axis direction, and the θ direction.

  In detecting the shift in the θ direction, for example, as shown in FIG. 10, the reference mark 102 is formed on the positive side of the workpiece W in the Y-axis direction, and the carriage plate 31a having the first imaging unit 41 is formed. Are arranged on the locus of the added reference mark 102. Then, the deviation in the θ direction is calculated based on the deviation in the X-axis direction and the Y-axis direction of the reference mark 102 detected by each of the two first imaging units 41.

  In the above embodiment, the workpiece W is moved to the correction position by maintaining the imaging cycle T by the first imaging unit 41 constant and appropriately controlling the moving speed of the workpiece W. In correcting the relative position with respect to the droplet discharge head 34, the discharge timing of the droplet discharge head 34 is changed based on the shift amount of the workpiece W while the moving speed of the workpiece W is kept constant. May be. In this case, the imaging period T is appropriately adjusted so as to be synchronized with the ejection timing of the droplet ejection head 34.

  In the above embodiment, when the image processing unit 160 detects the reference mark 102 on the upper surface of the workpiece W, the captured image F is acquired using the first imaging unit 41. The reference mark 102 may be detected based on a mechanism for detecting irregularities such as a laser displacement meter. When a CCD camera is used as the imaging unit, adjustment work such as optimization of the shutter speed is required to prevent image blurring, but the laser displacement meter can detect continuous irregularities, and such Adjustment work becomes unnecessary. Therefore, for example, the reference mark 102 can be appropriately detected even when the workpiece W is moved at high speed in the X-axis direction.

  In detecting the reference mark 102, for example, as shown in FIG. 11, for example, a substantially rectangular reference mark 110 is formed of a highly reflective material and arranged at a predetermined pitch, and a high-sensitivity optical sensor is formed. The reflected light from the reference mark 110 may be used as a pulse signal. In such a case, the position of the workpiece W can be grasped by counting the pulse signals using an optical sensor like an encoder. Even when the optical sensor is used, the reference mark 110 can be appropriately detected and the current position of the workpiece W can be grasped even when the workpiece is moved at high speed, as in the case of using the laser displacement meter. it can.

  Also, with respect to the shape of the camera used as the first imaging unit 41, for example, all the reference marks 102 are captured by one imaging using a long line scan camera in which all the X-axis directions of the workpiece W are in the field of view. May be detected to detect the expansion and contraction (temperature effect) of the workpiece W in the X-axis direction, and the workpiece movement control unit 162 may correct the position of the workpiece W as appropriate. Further, by using a long line scan camera to image the workpiece W a plurality of times at a predetermined cycle, it is possible to detect the distribution of expansion and contraction of the workpiece W in the X-axis direction. Further, by capturing an image of the entire workpiece W, the straightness of the workpiece stage 20 in the X direction can be measured. Further, since the shift amount in the θ direction can also be detected based on the shift amounts of the plurality of reference marks 102, it is sufficient to provide only one line scan camera when performing the correction in the θ direction.

<2. Second Embodiment>
Next, a second embodiment of the present invention will be described. Note that the droplet discharge device 1 used in the second embodiment is the same as the droplet discharge device 1 used in the first embodiment.

  In the first embodiment, the position of the reference mark 102 of the workpiece W is detected, and so-called feedforward control is performed on the same workpiece W based on the position information of the reference mark 102. When processing the workpiece W, there is a case where the tendency of deviation of the workpiece W is common among the workpieces. In such a case, for example, the correction data obtained when the K-th workpiece W (K is a positive integer) is processed may be reflected in the processing of the (K + 1) -th workpiece W.

  Specifically, for example, as illustrated in FIG. 12, the workpiece movement control unit 162 collects in advance the correction position of the Kth workpiece W before performing the process of the (K + 1) th workpiece W. In FIG. 12, the shift amount in the Kth workpiece W is also shown for comparison between the Kth workpiece W and the K + 1th workpiece W.

  When processing the (K + 1) th work W, the work stage 20 is controlled so that the “current position” when the K + 1th work W reaches the imaging position matches the correction position of the Kth work W. To do. In other words, for the (K + 1) -th workpiece W, the position of the workpiece W is not corrected between the imaging position and the droplet discharge position, but the K-th workpiece correction result is reflected in advance. At the position, correction work has already been performed at the stage of acquiring the captured image F.

  Then, for example, when the amount of deviation in the (K + 1) th workpiece W matches the amount of deviation in the Kth workpiece, the amount of deviation detected by the workpiece movement control unit 162 is zero. As a result, the “correction position” of the (K + 1) th work W is also zero, and there is no need to correct the position of the work W between the imaging position and the droplet discharge position. In such a case, if the position of the workpiece W is corrected between the imaging position and the droplet discharge position, the workpiece is further moved between the imaging position and the droplet discharge position due to mechanical accuracy and rattling of the drive system. Although there is a possibility that the position of W may be displaced, the tendency of mechanical rattling or the like is grasped in the workpiece W before the Kth, and feedforward control is performed on the K + 1th workpiece. As a result, it is possible to eliminate such a new shift and align the workpiece W and the droplet discharge head 34 with higher accuracy.

  Even when the position of the (K + 1) th work W is corrected based on the position information of the Kth previous work W, a shift may be detected at the imaging position due to a factor different from the previous tendency. . Also in such a case, the position of the workpiece W may be corrected again based on the captured image F of the (K + 1) th workpiece W by the same method as in the case of using the correction table AM shown in FIG.

More specifically, as shown in FIG. 13, the correction of the position of the K + 1 th workpiece W based on the position information of the K-th workpiece W, As a result of the imaging position deviation amount L ₁ is detected in the DATA4 Suppose that In this case, as in the case of using the correction table AM, the “correction position” is calculated as −L ₁ based on the deviation amount. Then, in DATA 6 that is delayed by two cycles of the imaging cycle T, the position of the workpiece W has already shifted by −L ₁ based on the correction information of the K-th workpiece W, so the “current position” is the K + 1-th workpiece. adding -L ₁ is a displacement amount detected in W calculated as -2L ₁ to. Also, the correction position in DATA6, the correction position DATA4 is calculated -L _1, by adding the -L ₁ shift amount in DATA6 to -L ₁ of the correction position, is obtained -2L ₁ . That is, in the case of FIG. 6, the difference between the correction position of DATA4 and the amount of deviation of DATA6 is the same as that of DATA6, but the current position of DATA6 is already at the imaging position for the Kth work W. Since the correction based on is performed, the “current position” in DATA 6 is different from that in FIG. 6.

  In the above embodiment, the feedforward control for the (K + 1) th workpiece W is performed based on the correction data obtained when the Kth workpiece W is processed. However, the feedforward control for the (K + 1) th workpiece W is performed. At this time, it is not always necessary to use correction data for the Kth workpiece W, and any Kth workpiece W or earlier can be used arbitrarily. Further, the correction data for the K-th and previous workpieces W used for the feed-forward control of the (K + 1) -th workpiece does not necessarily need to be information when droplets are ejected onto the workpiece W. That is, for example, when maintaining the droplet discharge device 1, for example, a correction table AM as shown in FIG. 6 is created in advance based on the information at the time of maintenance, and the information in the correction table AM is used as the Kth work W information. It may replace with and may be used.

  In the above embodiment, the so-called feedforward control is performed based on the captured image F acquired using the first imaging unit 41 disposed on the X direction positive direction side of the droplet discharge head 34. From the viewpoint of correcting the relative positional relationship between the bank 100 on the work W and the droplet discharge head 34, for example, after a droplet is discharged into the bank 100 at the droplet discharge position, the outside of the bank 100 is further discharged. Alternatively, the position of the workpiece W may be corrected by feedback control by discharging the droplet to a predetermined position and detecting the position of the discharged droplet by the second imaging unit 42.

  Specifically, for example, as shown in FIG. 14, after a droplet is discharged into the bank 100 at the droplet discharge position, the droplet 120 is discharged to a predetermined position outside the bank 100. In the present embodiment, the predetermined position determined in advance is, for example, the center position of the reference mark 102. In such a case, if the position of the workpiece W is the desired position at the droplet discharge position due to the correction of the position of the workpiece W performed between the imaging position and the droplet discharge position, the position of the center of the reference mark 102 is set. The position of the center of the droplet 120 matches. However, if, for example, the relative position between the workpiece W and the droplet discharge head 34 shifts due to some factor while moving the distance L between the imaging position and the droplet discharge position, the center of the reference mark 102 and the droplet 120 is shifted. Deviation occurs in position.

  Therefore, for example, a shift between the position of the reference mark 102 estimated by the mark position estimation unit 161 and the center position of the droplet 120 in the captured image F acquired by the second imaging unit 42 is determined as a workpiece movement control unit 162. Calculated by When this deviation is detected in DATAp obtained by the p-th imaging (p is a positive integer) by the second imaging unit 42, this deviation amount at the droplet discharge position at the timing of DATA (p + 1). By moving the workpiece W to the current position that further reflects the above, the relative positional relationship between the workpiece W and the droplet discharge head 34 can be aligned with higher accuracy. In addition, in order to correct the relative position between the workpiece W and the droplet discharge head 34 at the timing of DATA (p + 1) based on DATAp, the distance between the second imaging unit 42 and the droplet discharge head 34 is set. The distance is preferably as small as possible. More specifically, the time during which the work W moves from the droplet discharge position to the imaging position by the second imaging unit 42 and the image captured by the second imaging unit 42 are preferred. The sum of the time required from the acquisition of F to the calculation of the correction position in the workpiece movement control unit 162 is set to be shorter than the imaging cycle T.

  In addition, after the liquid droplets are discharged into the bank 100, the landing position of the liquid droplets discharged for performing the above-described feedback control does not necessarily need to be the center of the reference mark 102. The landing position is based on the captured image F. Can be specified, the landing position can be arbitrarily set. For example, if the landing position and the reference mark 102 are reflected in the field of view of the same captured image F, for example, the relative position between the reference mark 102 and the landing position of the droplet is determined by the image processing unit. Since the landing position can be grasped, it is possible to determine whether or not the landing position of the droplet is deviated from a desired position.

<3. Application example of droplet discharge device>
Next, an application example of the droplet discharge device 1 configured as described above will be described. FIG. 15 is an explanatory diagram showing an outline of the configuration of the substrate processing system 200 including the droplet discharge device 1. In the substrate processing system 200, an organic EL layer of an organic light emitting diode is formed.

  First, the outline of the structure of the organic light emitting diode and the manufacturing method thereof will be described. FIG. 16 is a side view illustrating a schematic configuration of the organic light emitting diode 300. As shown in FIG. 16, the organic light emitting diode 300 has a structure in which an organic EL layer 330 is sandwiched between an anode (anode) 310 and a cathode (cathode) 320 on a glass substrate G as a work W. The organic EL layer 330 is formed by laminating a hole injection layer 331, a hole transport layer 332, a light emitting layer 333, an electron transport layer 334, and an electron injection layer 335 in this order from the anode 310 side.

  In manufacturing the organic light emitting diode 300, first, the anode 310 is formed on the glass substrate G. The anode 310 is formed using, for example, a vapor deposition method. For the anode 310, a transparent electrode made of, for example, ITO (Indium Tin Oxide) is used.

  Thereafter, a bank 340 is formed on the anode 310 as shown in FIG. The bank 340 is patterned into a predetermined pattern by performing, for example, a photolithography process or an etching process. In the bank 340, a plurality of slit-shaped openings 341 are formed side by side in the row direction (X-axis direction) and the column direction (Y-axis direction). Inside the opening 341, as will be described later, an organic EL layer 330 and a cathode 320 are stacked to form a pixel. For example, a photosensitive polyimide resin is used for the bank 340.

  Thereafter, the organic EL layer 330 is formed on the anode 310 in the opening 341 of the bank 340. Specifically, the hole injection layer 331 is formed on the anode 310, the hole transport layer 332 is formed on the hole injection layer 331, the light emitting layer 333 is formed on the hole transport layer 332, and the light emitting layer An electron transport layer 334 is formed on 333, and an electron injection layer 335 is formed on the electron transport layer 334.

  In the present embodiment, the hole injection layer 331, the hole transport layer 332, and the light emitting layer 333 are each formed in the substrate processing system 200. That is, in the substrate processing system 200, an organic material coating process, an organic material decompression drying process, and an organic material baking process are sequentially performed by an inkjet method, and the hole injection layer 331, the hole transport layer 332, and the light emitting layer 333 is formed.

  The electron transport layer 334 and the electron injection layer 335 are each formed by using, for example, a vapor deposition method.

  Thereafter, the cathode 320 is formed on the electron injection layer 335. The cathode 320 is formed using, for example, a vapor deposition method. For the cathode 320, for example, aluminum is used.

  In the organic light emitting diode 300 manufactured as described above, a predetermined number of holes injected by the hole injection layer 331 are applied to the hole transport layer 332 by applying a voltage between the anode 310 and the cathode 320. Then, a predetermined number of electrons injected by the electron injection layer 335 are transported to the light emitting layer 333 via the electron transport layer 334. Then, holes and electrons recombine in the light emitting layer 333 to form excited molecules, and the light emitting layer 333 emits light.

  Next, the substrate processing system 200 shown in FIG. 15 will be described. Note that an anode 310 and a bank 340 are formed in advance on a glass substrate G to be processed by the substrate processing system 200. In the substrate processing system 200, a hole injection layer 331, a hole transport layer 332, and a light emitting layer 333 are formed. It is formed.

  The substrate processing system 200 carries a plurality of glass substrates G from the outside into the substrate processing system 200 in units of cassettes, takes out a glass substrate G before processing from the cassette C, and performs predetermined processing on the glass substrates G. A processing station 202 having a plurality of processing apparatuses for performing processing, a processed glass substrate G being housed in a cassette C, and a plurality of glass substrates G being unloaded from the substrate processing system 200 to the outside in units of cassettes; Are integrally connected. The carry-in station 201, the processing station 202, and the carry-out station 203 are arranged in this order in the X-axis direction.

  The loading station 201 is provided with a cassette mounting table 210. The cassette mounting table 210 can mount a plurality of cassettes C in a line in the Y-axis direction. That is, the carry-in station 201 is configured to be able to hold a plurality of glass substrates G.

  The carry-in station 201 is provided with a substrate transport body 212 that can move on a transport path 211 extending in the Y-axis direction. The substrate transport body 212 is also movable in the vertical direction and the vertical direction, and can transport the glass substrate G between the cassette C and the processing station 202. The substrate transport body 212 transports, for example, the glass substrate G by suction holding.

  The processing station 202 includes a hole injection layer forming unit 220 that forms the hole injection layer 331, a hole transport layer forming unit 221 that forms the hole transport layer 332, and a light emitting layer forming unit that forms the light emitting layer 333. 222 are arranged in this order from the loading station 201 side in the X-axis direction.

  In the hole injection layer forming unit 220, a first substrate transfer region 230, a second substrate transfer region 231 and a third substrate transfer region 232 are arranged in this order from the loading station 201 side in the X-axis direction. They are arranged side by side. Each substrate transport region 230, 231 and 232 is provided extending in the X-axis direction, and a substrate transport device (not shown) for transporting the glass substrate G is provided in the substrate transport region 230, 231 and 232. . The substrate transfer device is also movable in the horizontal direction, the vertical direction, and the vertical direction, and can transfer the glass substrate G to each device provided adjacent to these substrate transfer regions 230, 231, and 232.

  A transition device 233 for delivering the glass substrate G is provided between the carry-in station 201 and the first substrate transfer region 230. Similarly, transition devices 234 and 235 are provided between the first substrate transfer region 230 and the second substrate transfer region 231 and between the second substrate transfer region 231 and the third substrate transfer region 232, respectively. Is provided.

  A coating device 240 for applying an organic material for forming the hole injection layer 331 on the glass substrate G (anode 310) is provided on the positive side of the first substrate transport region 230 in the Y-axis direction. The coating device 240 has the same configuration as that of the droplet discharge device 1. In the coating device 240, an organic material is applied to a predetermined position on the glass substrate G, that is, inside the opening 341 of the bank 340 by an inkjet method. The Note that the organic material of this embodiment is a solution in which a predetermined material for forming the hole injection layer 331 is dissolved in an organic solvent.

  A buffer device 241 for temporarily accommodating a plurality of glass substrates G is provided on the negative side in the Y-axis direction of the first substrate transfer region 230.

  A plurality of reduced-pressure drying apparatuses 242 for drying the organic material applied by the application apparatus 240 under reduced pressure are stacked on the Y-axis direction positive direction side and the Y-axis direction negative direction side of the second substrate transport region 231, for example, Five are provided. The vacuum drying apparatus 242 has, for example, a turbo molecular pump (not shown), and is configured to dry the organic material by reducing the internal atmosphere to, for example, 1 Pa or less by the turbo molecular pump.

  On the positive side in the Y-axis direction of the third substrate transfer region 232, a plurality of, for example, 20 heat treatment devices 243 for heat-treating and baking the organic material dried by the reduced pressure drying device 242 are provided. . The heat treatment apparatus 243 has a hot plate (not shown) on which the glass substrate G is placed, and is configured to fire the organic material by the hot plate.

  A plurality of temperature adjusting devices 244 for adjusting the glass substrate G heat-treated by the heat treatment device 243 to a predetermined temperature, for example, room temperature, are provided on the Y axis direction negative direction side of the third substrate transport region 232.

  In the hole injection layer forming unit 220, the number and arrangement of the coating device 240, the buffer device 241, the vacuum drying device 242, the heat treatment device 243, and the temperature control device 244 can be arbitrarily selected.

  The hole transport layer forming portion 221 includes a first substrate transport region 250, a second substrate transport region 251 and a third substrate transport region 252 from the hole injection layer formation portion 220 side in the X-axis direction. Are arranged in this order. Each substrate transport region 250, 251, 252 is provided extending in the X-axis direction, and a substrate transport device (not shown) for transporting the glass substrate G is provided in the substrate transport region 250, 251, 252. Yes. The substrate transfer device is also movable in the horizontal direction, the vertical direction, and the vertical direction, and can transfer the glass substrate G to each device provided adjacent to these substrate transfer regions 250, 251, and 252.

  The third substrate transfer region 252 is provided with a heat treatment device 263 and a temperature adjustment device 264 which will be described later, and the insides of these devices 263 and 264 are maintained in a low oxygen and low dew point atmosphere. For this reason, the inside of the third substrate transfer region 252 is also maintained in a low oxygen and low dew point atmosphere. In the following description, the low oxygen atmosphere refers to an atmosphere having an oxygen concentration lower than that of the air, for example, an atmosphere having an oxygen concentration of 10 ppm or less, and the low dew point atmosphere refers to an atmosphere having a dew point temperature lower than that of the air, for example, An atmosphere of 10 ° C. or lower. For example, an inert gas such as nitrogen gas is used as the low oxygen and low dew point atmosphere.

  For transferring the glass substrate G between the hole injection layer forming part 220 and the first substrate transport region 250 and between the first substrate transport region 250 and the second substrate transport region 251, respectively. Transition devices 253 and 254 are provided. Between the second substrate transfer region 251 and the third substrate transfer region 252, a load lock device 255 capable of temporarily storing the glass substrate G is provided. The load lock device 255 is configured to be able to switch the internal atmosphere, that is, to switch between an air atmosphere and a low oxygen and low dew point atmosphere.

  As a droplet discharge device for applying an organic material for forming a hole transport layer 332 on the glass substrate G (hole injection layer 331) on the positive side in the Y-axis direction of the first substrate transport region 250 The coating device 260 is provided. The coating device 260 has the same configuration as that of the droplet discharge device 1. In the coating device 260, an organic material is applied to a predetermined position on the glass substrate G, that is, inside the opening 341 of the bank 340 by an inkjet method. The Note that the organic material in this embodiment is a solution in which a predetermined material for forming the hole-transport layer 332 is dissolved in an organic solvent.

  A buffer device 261 that temporarily accommodates a plurality of glass substrates G is provided on the Y axis direction negative direction side of the first substrate transfer region 250.

  A plurality of reduced-pressure drying apparatuses 262 for drying the organic material applied by the application apparatus 260 under reduced pressure are stacked on the Y-axis direction positive direction side and the Y-axis direction negative direction side of the second substrate transfer region 251, for example, Five are provided. The vacuum drying apparatus 262 has, for example, a turbo molecular pump (not shown), and is configured to dry the organic material by reducing the internal atmosphere to 1 Pa or less, for example.

  On the positive side in the Y-axis direction of the third substrate transfer region 252, a plurality of heat treatment devices 263 for heat treating and baking the organic material dried by the reduced pressure drying device 262 are provided, for example, in 20 layers. . The heat treatment apparatus 263 includes a hot plate (not shown) on which the glass substrate G is placed, and is configured to fire the organic material using the hot plate. Further, the inside of the heat treatment apparatus 263 is maintained in a low oxygen and low dew point atmosphere.

  A plurality of temperature adjustment devices 264 for adjusting the glass substrate G heat-treated by the heat treatment device 263 to a predetermined temperature, for example, room temperature, are provided on the Y axis direction negative direction side of the third substrate transfer region 252. The inside of the temperature control device 264 is maintained in a low oxygen and low dew point atmosphere.

  In the hole transport layer forming unit 221, the number and arrangement of the coating device 260, the buffer device 261, the reduced pressure drying device 262, the heat treatment device 263, and the temperature control device 264 can be arbitrarily selected.

  The light emitting layer forming unit 222 includes a first substrate transport region 270, a second substrate transport region 271 and a third substrate transport region 272 in the X-axis direction from the hole transport layer forming unit 221 side. They are arranged in order. Each substrate transport region 270, 271, 272 is provided extending in the X-axis direction, and a substrate transport device (not shown) for transporting the glass substrate G is provided in the substrate transport region 270, 271, 272. Yes. The substrate transfer device is also movable in the horizontal direction, the vertical direction, and the vertical direction, and can transfer the glass substrate G to each device provided adjacent to these substrate transfer regions 270, 271, and 272.

  Note that a heat treatment apparatus 283 and a temperature adjustment apparatus 284, which will be described later, are provided adjacent to the third substrate transfer region 272, and the insides of these apparatuses 283 and 284 are maintained in a low oxygen and low dew point atmosphere. For this reason, the inside of the third substrate transfer region 272 is also maintained in a low oxygen and low dew point atmosphere.

  For transferring the glass substrate G between the hole transport layer forming part 221 and the first substrate transport region 270 and between the first substrate transport region 270 and the second substrate transport region 271, respectively. Transition devices 273, 274 are provided. A load lock device capable of temporarily storing the glass substrate G between the second substrate transfer region 271 and the third substrate transfer region 272 and between the third substrate transfer region 272 and the unloading station 203, respectively. 275, 276 are provided. The load lock devices 275 and 276 are configured to be able to switch the internal atmosphere, that is, to switch between an air atmosphere and a low oxygen and low dew point atmosphere.

  Application as a droplet discharge device for applying an organic material for forming the light emitting layer 333 on the glass substrate G (hole transport layer 332) on the positive side in the Y-axis direction of the first substrate transport region 270 For example, two devices 280 are provided. The coating device 280 has the same configuration as that of the droplet discharge device 1. In the coating device 280, an organic material is applied to a predetermined position on the glass substrate G, that is, inside the opening 341 of the bank 340 by an inkjet method. The Note that the organic material in this embodiment is a solution in which a predetermined material for forming the light-emitting layer 333 is dissolved in an organic solvent.

  A buffer device 281 that temporarily accommodates a plurality of glass substrates G is provided on the Y axis direction negative direction side of the first substrate transfer region 270.

  A plurality of reduced-pressure drying devices 282 that dry the organic material applied by the coating device 280 under reduced pressure are stacked on the Y-axis direction positive direction side and the Y-axis direction negative direction side of the second substrate transfer region 271, Five are provided. The vacuum drying apparatus 282 includes, for example, a turbo molecular pump (not shown), and is configured to dry the organic material by reducing the internal atmosphere to 1 Pa or less, for example.

  On the positive side in the Y-axis direction of the third substrate transfer region 272, a plurality of, for example, 20 stages of heat treatment apparatuses 283 for heat treating and baking the organic material dried by the reduced pressure drying apparatus 282 are provided. . The heat treatment apparatus 283 has a hot plate (not shown) on which the glass substrate G is placed, and is configured to fire the organic material by the hot plate. Further, the inside of the heat treatment apparatus 283 is maintained in a low oxygen and low dew point atmosphere.

  A plurality of temperature adjusting devices 284 for adjusting the glass substrate G heat-treated by the heat treatment device 283 to a predetermined temperature, for example, room temperature, are provided on the Y axis direction negative direction side of the third substrate transport region 272. The inside of the temperature control device 284 is maintained in a low oxygen and low dew point atmosphere.

  In the light emitting layer forming part 222, the number and arrangement of the coating device 280, the buffer device 281, the vacuum drying device 282, the heat treatment device 283, and the temperature adjusting device 284 can be arbitrarily selected.

  The unloading station 203 is provided with a cassette mounting table 290. The cassette mounting table 290 can mount a plurality of cassettes C in a line in the Y-axis direction. That is, the carry-out station 203 is configured to be able to hold a plurality of glass substrates G.

  The carry-out station 203 is provided with a substrate transfer body 292 that can move on a transfer path 291 extending in the Y-axis direction. The substrate transport body 292 is movable in the vertical direction and the vertical direction, and can transport the glass substrate G between the cassette C and the processing station 202. The substrate transport body 292 transports, for example, the glass substrate G by sucking and holding it.

  The inside of the carry-out station 203 is preferably maintained in a low oxygen and low dew point atmosphere.

  The above substrate processing system 200 is provided with the control unit 150 described above. Therefore, the coating devices 240, 260, and 280 are controlled by the control unit 150. However, the program storage unit (not shown) of the control unit 150 includes a program for controlling the processing of the glass substrate G in the substrate processing system 200 in addition to the program for controlling the coating apparatuses 240, 260, and 280. Stored.

  Next, a glass substrate G processing method performed using the substrate processing system 200 configured as described above will be described.

  First, a cassette C containing a plurality of glass substrates G is carried into the carry-in station 201 and placed on the cassette placing table 210. Thereafter, the glass substrates G are sequentially taken out from the cassette C on the cassette mounting table 210 by the substrate carrier 212.

  The glass substrate G taken out from the cassette C is transported to the transition device 233 of the hole injection layer forming unit 220 by the substrate transport body 212 and further transported to the coating device 240 through the first substrate transport region 230. In the coating device 240, an organic material for the hole injection layer 331 is applied to a predetermined position on the glass substrate G (anode 310), that is, inside the opening 341 of the bank 340 by an inkjet method. The processing in this coating apparatus 240 is the same processing as steps S1 to S6 described above.

  On the other hand, the glass substrate G that has been subjected to the coating process in the coating device 240 is transported to the transition device 234 via the first substrate transport region 230, and further to the reduced-pressure drying device 242 via the second substrate transport region 231. Be transported. In the vacuum drying apparatus 242, the internal atmosphere is decompressed, and the organic material applied on the glass substrate G is dried.

  Next, the glass substrate G is transferred to the transition apparatus 235 via the second substrate transfer area 231 and further transferred to the heat treatment apparatus 243 via the third substrate transfer area 232. In the heat treatment apparatus 243, the glass substrate G placed on the hot plate is heated to a predetermined temperature, for example, 280 ° C., and the organic material of the glass substrate G is baked.

  Next, the glass substrate G is transferred to the temperature adjustment device 244 via the third substrate transfer region 232. In the temperature adjusting device 244, the temperature of the glass substrate G is adjusted to a predetermined temperature, for example, room temperature. Thus, the hole injection layer 331 is formed on the glass substrate G (anode 310).

  Next, the glass substrate G is transferred to the transition device 253 of the hole transport layer forming unit 221 via the third substrate transfer region 232 and further transferred to the coating device 260 via the first substrate transfer region 250. . In the coating device 260, an organic material for the hole transport layer 332 is applied on the glass substrate G (hole injection layer 331) by an inkjet method. The processing in this coating apparatus 260 is the same processing as steps S1 to S6 described above.

  Next, the glass substrate G is transferred to the transition device 254 via the first substrate transfer region 250 and further transferred to the reduced-pressure drying device 262 via the second substrate transfer region 251. In the vacuum drying apparatus 262, the internal atmosphere is decompressed, and the organic material applied on the glass substrate G is dried.

  Next, the glass substrate G is transferred to the load lock device 255 via the second substrate transfer area 251. When the glass substrate G is carried into the load lock device 255, the inside thereof is switched to a low oxygen and low dew point atmosphere. Thereafter, the inside of the load lock device 255 and the inside of the third substrate transfer region 252 that is similarly maintained in a low oxygen and low dew point atmosphere are communicated.

  Next, the glass substrate G is transferred to the heat treatment apparatus 263 through the third substrate transfer region 252. The inside of the heat treatment apparatus 263 is also maintained in a low oxygen and low dew point atmosphere. In the heat treatment apparatus 263, the glass substrate G placed on the hot plate is heated to a predetermined temperature, for example, 200 ° C., and the organic material of the glass substrate G is baked.

  Next, the glass substrate G is transferred to the temperature adjustment device 264 via the third substrate transfer region 252. The inside of the temperature control device 264 is also maintained in a low oxygen and low dew point atmosphere. In the temperature adjustment device 264, the temperature of the glass substrate G is adjusted to a predetermined temperature, for example, room temperature. Thus, the hole transport layer 332 is formed on the glass substrate G (hole injection layer 331).

  Next, the glass substrate G is transferred to the transition device 273 of the light emitting layer forming unit 222 via the third substrate transfer region 252 and further transferred to the coating device 280 via the first substrate transfer region 270. In the coating apparatus 280, an organic material for the light emitting layer 333 is applied onto the glass substrate G (hole transport layer 332) by an inkjet method. The processing in this coating apparatus 280 is the same processing as steps S1 to S6 described above.

  Next, the glass substrate G is transferred to the transition device 274 via the first substrate transfer region 270 and further transferred to the vacuum drying device 282 via the second substrate transfer region 271. In the vacuum drying apparatus 282, the internal atmosphere is decompressed, and the organic material applied on the glass substrate G is dried.

  Next, the glass substrate G is transferred to the load lock device 275 via the second substrate transfer region 271. When the glass substrate G is carried into the load lock device 275, the inside thereof is switched to a low oxygen and low dew point atmosphere. Thereafter, the inside of the load lock device 275 is communicated with the inside of the third substrate transfer region 272 that is similarly maintained in a low oxygen and low dew point atmosphere.

  Next, the glass substrate G is transferred to the heat treatment apparatus 283 through the third substrate transfer region 272. The inside of the heat treatment apparatus 283 is also maintained in a low oxygen and low dew point atmosphere. In the heat treatment apparatus 283, the glass substrate G placed on the hot plate is heated to a predetermined temperature, for example, 260 ° C., and the organic material of the glass substrate G is baked.

  Next, the glass substrate G is transferred to the temperature adjustment device 284 via the third substrate transfer region 272. The inside of the temperature control device 284 is also maintained in a low oxygen and low dew point atmosphere. In the temperature adjusting device 284, the temperature of the glass substrate G is adjusted to a predetermined temperature, for example, room temperature. Thus, the light emitting layer 333 is formed on the glass substrate G (hole transport layer 332).

  Next, the glass substrate G is transferred to the load lock device 276 via the third substrate transfer region 272. The interior of the load lock device 276 is maintained in a low oxygen and low dew point atmosphere. Then, the inside of the load lock device 276 is communicated with the inside of the carry-out station 203 which is similarly maintained in a low oxygen and low dew point atmosphere.

  Next, the glass substrate G is transferred to a predetermined cassette C on the cassette mounting table 290 by the substrate transfer body 292 of the carry-out station 203. Thus, a series of processing of the glass substrate G in the substrate processing system 200 is completed.

  Also in the above embodiment, the effect similar to 1st Embodiment and 2nd Embodiment mentioned above can be enjoyed.

  The layout of the substrate processing system 200 of the above embodiment is not limited to the layout shown in FIG. 15, and can be set arbitrarily.

  Further, in the substrate processing system 200 of the above embodiment, the hole injection layer 331, the hole transport layer 332, and the light emitting layer 333 are formed. A layer 335 may also be formed. That is, depending on the organic material used for the electron transport layer 334 and the electron injection layer 335, the electron transport layer 334 and the electron injection layer 335 are formed by applying an organic material by an inkjet method, a reduced pressure drying process of an organic material, and an organic material, respectively. The material is baked to form on the glass substrate G. The droplet discharge apparatus 1 may also be used in the coating process of the electron transport layer 334 and the electron injection layer 335.

  Further, the substrate processing system 200 for forming the organic EL layer 330 of the organic light emitting diode 300 has been described as an application example of the droplet discharge device 1, but the application example of the droplet discharge device 1 is not limited to this. For example, the droplet discharge device 1 is also applied when manufacturing electro-optical devices (flat panel displays: FPD) such as color filters, liquid crystal display devices, plasma displays (PDP devices), electron emission devices (FED devices, SED devices), etc. May be. The droplet discharge device 1 may also be applied when manufacturing metal wiring formation, lens formation, resist formation, light diffuser formation, and the like.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood.

DESCRIPTION OF SYMBOLS 1 Droplet discharge device 10 X-axis table 11 Y-axis table 12 X-axis guide rail 13 Y-axis guide rail 20 Work stage 21 Stage rotation mechanism 22 X-axis slider 23 Movement amount detection mechanism 30 Carriage unit 33 Carriage 34 Droplet discharge head 40 Imaging unit 41 First imaging unit 42 Second imaging unit 100 Bank 101 Opening 102 Reference mark 150 Control unit 200 Substrate processing system 240, 260, 280 Coating device 300 Organic light emitting diode 330 Organic EL layer 331 Hole injection layer 332 Hole transport layer 333 Light emitting layer 334 Electron transport layer 335 Electron injection layer G Glass substrate W Workpiece

Claims (12)

A droplet discharge device that draws and draws functional liquid droplets on a workpiece,
A droplet discharge head that discharges droplets to the work placed at a droplet discharge position;
A work stage on which the work is placed;
A workpiece moving mechanism for moving the droplet stage relative to the main scanning direction, a direction orthogonal to the main scanning direction, and a rotation direction by moving the workpiece stage ;
A movement amount detection mechanism for detecting a movement amount of the work stage in the main scanning direction by the work movement mechanism;
A mark detection unit for detecting a reference mark formed in advance on the upper surface of the moving workpiece on the upstream side of the droplet discharge head in the main scanning direction of the workpiece;
A mark position estimation unit that estimates the position of the reference mark based on a movement amount detected by the movement amount detection mechanism when the workpiece has moved a predetermined distance along the main scanning direction;
The position of the reference mark detected by the mark detection unit when the workpiece has moved the predetermined distance, and the reference mark estimated by the mark position estimation unit when the workpiece has moved the predetermined distance. The difference between the position and the movement speed of the work stage by the work movement mechanism is controlled based on the detected difference so as to eliminate the difference between the work and the liquid droplet ejection head at the liquid droplet ejection position. And a work movement control unit. The reference mark is a bank formed so as to define a landing area on which a droplet discharged from the droplet discharge head is landed, or an identification symbol formed outside the landing area. The droplet discharge device according to claim 1 . A plurality of the landing areas are formed on the workpiece,
The workpiece movement control unit, said each landing area, to control the moving speed of the workpiece stage by the workpiece moving mechanism so as to eliminate a difference between the workpiece and the liquid droplet ejection head of the droplet ejection position The droplet discharge device according to claim 2 , wherein: The detection of the reference mark by the mark detection unit is performed in a predetermined cycle,
The distance between the mark detection unit and the droplet discharge head is set to n times (n = a positive integer) the distance that the work stage moves during the period of detecting the reference mark,
Controlling the moving speed of the work stage by the work moving mechanism so as to eliminate the difference between the work and the liquid droplet discharging head at the liquid droplet discharge position is performed by detecting the reference mark by the mark detection unit. 4. The droplet discharge device according to claim 3 , which is performed between (n−1) th detection of the reference mark and nth detection of the reference mark. An image pickup unit disposed on the downstream side of the droplet discharge head in the main scanning direction of the workpiece;
A landing area where a predetermined pattern is drawn by droplets is formed on the workpiece,
The workpiece movement control unit
In a state where the difference between the workpiece and the droplet discharge head at the droplet discharge position is eliminated, the droplet is discharged from the droplet discharge head to a predetermined position outside the landing area. ,
Based on the captured image captured by the imaging unit, the position of the droplet discharged from the droplet discharge head is specified,
Calculating the amount of deviation between the position of the identified droplet and a predetermined position outside the landing area;
In the subsequent discharge of droplets from the droplet discharge head, the workpiece movement is performed so as to eliminate the difference between the workpiece and the droplet discharge head at the droplet discharge position based on the calculated deviation amount. and controlling the moving speed of the work stage by mechanism, the droplet discharge device to one of claims 1-4. A droplet discharge method for drawing by drawing a liquid droplet of a functional liquid on a workpiece using a droplet discharge device provided with a workpiece moving mechanism that moves the workpiece in the main scanning direction,
When the workpiece moving mechanism moves the workpiece toward the droplet discharge head along the main scanning direction, the movement amount of the workpiece is detected by a movement amount detecting mechanism;
Detecting a reference mark formed in advance on the upper surface of the moving workpiece on the upstream side of the droplet discharge head in the main scanning direction of the workpiece;
Estimating the position of the reference mark based on the amount of movement detected by the amount-of-movement detection mechanism when the workpiece has moved a predetermined distance along the main scanning direction;
The position estimated based on the position of the reference mark detected when the workpiece has moved the predetermined distance and the amount of movement detected by the movement amount detection mechanism when the workpiece has moved the predetermined distance. detecting a difference between the position of the reference marks, on the basis of the detected difference, in the droplet discharge position for discharging droplets on the workpiece from the droplet discharge head, a difference between the workpiece and the liquid droplet ejection head A droplet discharge method, wherein the moving speed of the workpiece by the workpiece moving mechanism is controlled so as to be eliminated . The reference mark is a bank formed so as to define a landing area on which a droplet discharged from the droplet discharge head is landed, or an identification symbol formed outside the landing area. The droplet discharge method according to claim 6 . A plurality of the landing areas are formed on the workpiece,
Controlling the movement speed of the workpiece by the workpiece moving mechanism so as to eliminate the difference between the workpiece and the droplet ejection head at the droplet ejection position is performed for each landing area. The droplet discharge method according to claim 7 . The detection of the reference mark on the upstream side of the droplet discharge head is performed at a predetermined cycle,
The distance between the position where the reference mark is detected and the droplet discharge head is set to n times (n = a positive integer) the distance that the workpiece moves during the period during which the reference mark is detected. And
Controlling the movement speed of the workpiece by the workpiece moving mechanism so as to eliminate the difference between the workpiece and the droplet ejection head at the droplet ejection position is (n− after detecting the reference mark). 9. The droplet discharge method according to claim 8 , wherein the method is performed between the detection of the reference mark performed at the first time and the detection of the reference mark performed at the nth time. The workpiece is formed with a landing area where a predetermined pattern is drawn by droplets,
In a state where the difference between the workpiece and the droplet discharge head at the droplet discharge position is eliminated, the droplet is discharged from the droplet discharge head to a predetermined position outside the landing area. ,
On the downstream side of the droplet discharge head in the main scanning direction of the workpiece, a position of a droplet discharged to a predetermined position outside the landing area is detected,
Calculating the amount of deviation between the position of the detected droplet and a predetermined position outside the landing area;
In the subsequent discharge of droplets from the droplet discharge head, based on the calculated deviation amount, the workpiece, the droplet discharge head, and the droplet discharge head at the droplet discharge position and controlling the moving speed of the workpiece by the workpiece moving mechanism so as to eliminate the difference, a droplet discharge method in any one of claims 6-9. 11. A program that operates on a computer of a droplet discharge device so that the droplet discharge device executes the droplet discharge method according to any one of claims 6 to 10 . A readable computer storage medium storing the program according to claim 11 .

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