KR102492390B1 - Liquid drop discharging apparatus, liquid drop discharging method and computer storage medium - Google Patents

Abstract

Functions of the droplet ejection device The droplet ejection head and the bank on the workpiece are aligned with high precision.
The droplet ejection device 1 includes a droplet ejection head 34, a work stage 20, and a first imaging device 41, and the workpiece W is at a predetermined distance along the main scanning direction (X-axis direction). The movement amount of the work stage 20 detected by the movement amount detection mechanism 23 by detecting the position of the reference mark formed on the workpiece W based on the captured image acquired by the first imaging device 41 when the The location of the reference mark is estimated based on . Then, based on the correlation between the position of the reference mark detected based on the captured image and the position of the reference mark estimated based on the movement amount of the work stage 20, the Correct the relative position.

Description

Droplet ejection device, droplet ejection method, and computer storage medium

The present invention relates to a droplet ejection device for drawing by ejecting droplets of a functional fluid onto a workpiece, a droplet ejection method using the droplet ejection device, a program, and a computer storage medium.

BACKGROUND ART [0002] Conventionally, as an apparatus for drawing on a workpiece using a functional liquid, an inkjet type droplet ejection apparatus that discharges the functional liquid in the form of droplets is known. A droplet ejection device is used when manufacturing an electro-optical device (flat panel display: FPD) such as, for example, an organic EL device, a color filter, a liquid crystal display device, a plasma display (PDP device), and an electron emission device (FED device, SED device). etc., are widely used.

The droplet ejection device includes, for example, a functional liquid droplet ejection head that ejects droplets of a functional liquid, a work stage for mounting a workpiece, and a pair of support bases for guiding movement for moving the workpiece stage along a direction in which they extend (main scanning direction). equipment is provided. Drawing is performed on the workpiece by ejecting a functional liquid from the functional liquid ejection head to a bank previously formed on the workpiece while relatively moving the workpiece with respect to the functional droplet ejection head by the work stage (Patent Document 1). .

In such a droplet ejection device, alignment of the workpiece is performed in advance in order to accurately eject the functional liquid to a desired position on the workpiece. The work stage is configured to be movable in the horizontal direction including rotational motion, and an alignment mark of the work is captured by an alignment camera provided above the work stage. Then, alignment of the workpiece is performed by correcting the position of the workpiece stage in the horizontal direction based on the picked-up image. After that, the aligned work is moved to a predetermined position, and the functional liquid is discharged into the bank of the work from the functional droplet ejection head.

Patent Document 1: Japanese Unexamined Patent Publication No. 2010-198028

However, in the process of moving the work stage toward the functional droplet ejection head after alignment of the workpiece, due to factors such as displacement of the workpiece posture, mechanical accuracy of the workpiece moving mechanism, temperature change, and change over time, the functional droplet There has been a problem that the positional relationship between the discharge head and the bank on the workpiece may change.

The present invention has been made in view of these points, and an object of the present invention is to align the functional droplet ejection head of a droplet ejection device and a bank on a workpiece with high accuracy.

In order to achieve the above object, the present invention is a liquid droplet ejection device for ejecting and drawing liquid droplets of a functional liquid on a workpiece, comprising: a droplet ejection head for ejecting a droplet with respect to the workpiece disposed at a droplet ejection position; and the workpiece. A work stage for disposing, a work moving mechanism for relatively moving the droplet ejection head and the work in a main scanning direction, a direction orthogonal to the main scanning direction, and a rotational direction; and a main scanning of the work stage by the work moving mechanism. a movement amount detection mechanism for detecting a movement amount in a direction, a mark detection unit for detecting a reference mark previously formed on an upper surface of the work during movement, upstream of the droplet ejection head in the main scanning direction of the work; a mark position estimating unit for estimating the position of the reference mark based on a movement amount detected by the movement amount detecting mechanism when the work has moved a predetermined distance along the main scanning direction; and based on a correlation between the position of the reference mark detected by the mark detection unit when the workpiece moves the predetermined distance and the position of the reference mark estimated by the mark position estimating unit when the work moves the predetermined distance, the droplet and a work movement controller for controlling the work movement mechanism to correct the relative positions of the work and the droplet discharge head at the discharge position.

The present invention according to a separate aspect is a droplet ejection method for drawing by ejecting droplets of a functional fluid onto a workpiece using a droplet ejection device having a workpiece moving mechanism for moving the workpiece in a main scanning direction, wherein the workpiece moving mechanism detecting a movement amount of the workpiece when the workpiece is moved toward the droplet ejection head along the main scanning direction by a movement amount detecting mechanism, and on the upstream side of the droplet ejection head in the main scanning direction of the workpiece, Detects a reference mark previously formed on the upper surface of the workpiece during movement, and estimates the position of the reference mark based on the movement amount detected by the movement amount detection mechanism when the workpiece moves a predetermined distance along the main scanning direction. and the reference mark estimated based on the position of the reference mark detected when the workpiece has moved the predetermined distance and the movement amount detected by the movement amount detecting mechanism when the workpiece has moved the predetermined distance. and correcting the relative positions of the workpiece and the droplet ejection head at a droplet ejection position at which the droplet is ejected from the droplet ejection head to the work, based on the correlation between the positions of the droplet ejection head.

According to another aspect of the present invention, a computer readable storage medium storing a program operating on a computer of a droplet ejection device so as to execute the droplet ejection method by the droplet ejection device is provided.

According to the present invention, the functional droplet ejection head of the droplet ejection device and the bank on the workpiece can be aligned with high precision.

1 is a schematic side view showing an outline of the configuration of a droplet ejection device according to a first embodiment.
Fig. 2 is a schematic plan view showing an outline of the configuration of the droplet ejection device according to the first embodiment.
Fig. 3 is a schematic plan view showing a state in which banks and reference marks are formed on a work.
4 is a schematic diagram of a captured image.
5 is a block diagram schematically showing an outline of the configuration of a control unit.
6 is a correction table showing the position of the workpiece and the amount of displacement.
Fig. 7 is an explanatory view showing how the work is moved toward the droplet ejection head.
8 is an explanatory diagram of processing operations in the droplet ejection device according to the first embodiment.
Fig. 9 is an explanatory diagram showing the relative positional relationship between a workpiece and a droplet ejection head in time series.
10 is a schematic plan view schematically illustrating the configuration of a droplet ejection device according to another embodiment.
11 is a schematic plan view showing the state of the surface of a workpiece according to another embodiment.
12 is a table showing the position of the workpiece and the amount of displacement.
13 is a table showing the position of the workpiece and the amount of displacement.
Fig. 14 is a schematic plan view showing a state in which a droplet has landed on a reference mark formed on a work.
15 is a plan view schematically illustrating the configuration of a substrate processing system equipped with a droplet inspection device.
16 is a side view schematically illustrating the structure of an organic light emitting diode.
Fig. 17 is a plan view schematically illustrating the configuration of a barrier rib of an organic light emitting diode.

EMBODIMENT OF THE INVENTION Hereinafter, with reference to an accompanying drawing, embodiment of this invention is described. In addition, this invention is not limited by embodiment shown below.

<1. First Embodiment>

First, the configuration of the droplet ejection device according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2 . 1 is a schematic side view showing an outline of the configuration of a liquid droplet ejection device 1 . 2 is a schematic plan view showing an outline of the configuration of the droplet ejection device 1 . In addition, in the following, the X-axis direction is the main scanning direction of the workpiece W, the Y-axis direction is the sub-scanning direction orthogonal to the main scanning direction, the Z-axis direction is the vertical direction orthogonal to the X-axis direction and the Y-axis direction, and the Z-axis direction is Let the direction of rotation around the direction be the θ direction.

Further, as shown in Fig. 3, a bank 100 serving as a partition wall is formed on the workpiece W used in the present invention. The bank 100 is patterned in a predetermined pattern by, for example, photolithography processing or etching processing. In the bank 100, a plurality of substantially rectangular openings 101 are formed in a row direction (X-axis direction) and column direction (Y-axis direction) at a predetermined pitch. The inside of this opening 101 becomes a landing area where the droplet ejected by the droplet ejection device 1 lands. For the bank 100, for example, photosensitive polyimide resin is used.

At the end of the workpiece W, a plurality of reference marks 102 are formed along the X-axis direction. The reference mark 102 is drawn on the upper surface of the work W using, for example, an inkjet drawing method or the like. In Fig. 3, a substantially cross-shaped mark is drawn as the reference mark 102, but the shape of the reference mark 102 is not limited to the content of the present embodiment, and may be, for example, a circle or a triangle, as long as it is identifiable. Can be set arbitrarily. 3 shows a state in which the reference mark 102 is formed at the end of the workpiece W on the Y-direction negative direction side, the reference mark 102 is formed at the end of the workpiece W on the Y-direction positive direction side. It may be.

The droplet ejection device 1 is constructed so as to span an X-axis table 10 that extends in the main scanning direction (X-axis direction) and moves the workpiece W in the main scanning direction, and the X-axis table 10, It has a pair of Y-axis tables 11, 11 extending in the scanning direction (Y-axis direction). On the upper surface of the X-axis table 10, a pair of X-axis guide rails 12, 12 are provided by extending in the X-axis direction, and each X-axis guide rail 12 has an X-axis linear motor (not shown) is provided. On the upper surface of each Y-axis table 11, a Y-axis guide rail 13 is provided extending in the Y-axis direction, and a Y-axis linear motor (not shown) is provided on the Y-axis guide rail 13. . In the following description, on the X-axis table 10, the area on the X-axis negative direction side of the Y-axis table 11 is referred to as a carry-in/out area A1, and the pair of Y-axis tables 11, 11 ) is called processing area A2, and the area on the positive X-axis side of the Y-axis table 11 is called standby area A3.

On the X-axis table 10, a work stage 20 is provided. A carriage unit 30 and an imaging unit 40 are provided on the pair of Y-axis tables 11 and 11 .

The work stage 20 is, for example, a vacuum adsorption stage, and the workpiece W is adsorbed and disposed. The work stage 20 is rotatably supported in the θ direction by a stage rotation mechanism 21 provided on the lower surface side of the work stage 20 . The work stage 20 and the stage rotation mechanism 21 are supported by an X-axis slider 22 provided on the lower surface side of the stage rotation mechanism 21 . The X-axis slider 22 is attached to the X-axis guide rail 12 and is moved in the X-axis direction by an X-axis linear motor provided on the X-axis guide rail 12, for example, at a predetermined speed V. Consists of. Therefore, by moving the work stage 20 in the X-axis direction along the X-axis guide rail 12 with the X-axis slider 22 in the state in which the work W is arranged, the work W is moved in the X-axis direction ( main scan direction) at speed (V).

Further, above the work stage 20 in the carry-in/out area A1, a work alignment camera (not shown) is provided that captures an image of the reference mark 102 of the work W on the work stage 20. . Then, based on the image captured by the work alignment camera, the position of the workpiece W disposed on the work stage 20 in the X-axis direction and the θ direction by the X-axis slider 22 and the stage rotation mechanism 21 is corrected as needed. As a result, the work W is aligned and set to a predetermined initial position.

The X-axis slider 22 has a movement amount detection mechanism 23 that detects the amount of movement of the X-axis slider 22, that is, the amount of movement of the workpiece W disposed on the work stage 20. As the movement amount detection mechanism 23, for example, a linear encoder that emits a pulse signal whenever a predetermined distance is moved is used. Information (pulse signal) related to the movement amount detected by the movement amount detection mechanism 23 is input to a control unit 150 described later.

In the Y-axis table 11, a plurality of carriage units 30, for example, 10 are provided. Each carriage unit 30 has a carriage plate 31 , a carriage holding mechanism 32 , a carriage 33 , and a droplet ejection head 34 . The carriage holding mechanism 32 is provided in the central portion of the lower surface of the carriage plate 31, and the carriage 33 is detachably attached to the lower end of the carriage holding mechanism 32.

The carriage plate 31 is attached to the Y-axis guide rail 13 and is movable in the Y-axis direction by a Y-axis linear motor provided on the Y-axis guide rail 13 (not shown). Accordingly, by moving the carriage plate 31 in the Y-axis direction, the droplet ejection head 34 and the workpiece W can be relatively moved along the Y-axis direction. It is also possible to move the plurality of carriage plates 31 integrally in the Y-axis direction. In addition, the X-axis slider 22, the X-axis guide rail 12 (X-axis linear motor), the stage rotation mechanism 21, the carriage plate 31, and the Y-axis guide rail 13 (Y-axis linear motor) , In the present invention, workpiece movement for relatively moving the workpiece W and the droplet discharge head 34 in the X-axis direction (main scanning direction), Y-axis direction (direction orthogonal to the main scanning direction), and rotational direction (θ direction) function as an instrument.

On the lower surface of the carriage 33, a plurality of droplet ejection heads 34 are arranged in the X-axis direction and the Y-axis direction. In this embodiment, for example, three droplet ejection heads 34 are provided in the X-axis direction and two in the Y-axis direction, that is, a total of six droplet ejection heads 34 . A plurality of ejection nozzles (not shown) are formed on the lower surface of the droplet ejection head 34, that is, on the nozzle surface. Then, from the ejection nozzle, droplets of the functional liquid are ejected to a droplet ejection position directly below the droplet ejection head 34 .

The imaging unit 40 is disposed at a position substantially overlapping with the trajectory of the reference mark 102 on the work W when the work stage 20 is moved in the X direction by the X-axis linear motor in plan view do. Specifically, as shown in FIG. 2 , for example, the arrangement of the second carriage plate 31a from the bottom on the negative direction side of the Y direction is the fiducial mark 102 when the workpiece W is moved in the W-axis direction. ), the imaging unit 40 is provided on the carriage plate 31a. The imaging unit 40 has a first imaging unit 41 and a second imaging unit 42 provided facing each other in the X-axis direction with the carriage 33 (droplet ejection head 24) therebetween. As the 1st imaging part 41 and the 2nd imaging part 42, CCD cameras are used, for example. The first imaging unit 41 is disposed on the negative X-direction side with respect to the carriage 33, and is disposed away from the carriage 33 by a predetermined distance L in the X-axis direction, for example. The second imaging unit 42 is disposed on the positive X-direction side with respect to the carriage 33 . The setting of the distance L will be described later.

The first imaging unit 41 captures an image of the reference mark 102 formed on the workpiece W. The first imaging unit 41 is supported by a base 43 provided on a side surface of the Y-axis table 11 on the negative X-axis side of the pair of Y-axis tables 11 and 11 . Then, when the workpiece W moves from the carry-in/out area A1 toward the processing area A2 and the work stage 20 is guided right below the first imaging unit 41, the first imaging unit ( 41) images the work W disposed on the work stage 20 at a predetermined cycle T. In this way, a captured image F of the workpiece W as shown in FIG. 4 is acquired, for example. The acquired captured image F is input to a control unit 150 described later. In addition, the timing of imaging by the first imaging unit 41 is determined based on, for example, a pulse signal detected by the movement amount detecting mechanism 23, and the period T of imaging is defined as the captured image in the control unit 150 ( It is set longer than the time (Ts) required for the processing of F). In addition, the captured image F shown in FIG. 4 is drawing the state in which the vicinity of the end part of the workpiece|work W on the X-direction positive direction side was imaged.

The second imaging unit 42 is supported by a base 44 provided on a side surface of the Y-axis table 11 on the positive X-axis side of the pair of Y-axis tables 11 and 11 . Then, when the work stage 20 is guided directly below the second imaging unit 42, the second imaging unit 42 images the work W disposed on the work stage 20, thereby capturing the workpiece. A droplet landing on the upper surface of (W) can be imaged.

The above liquid droplet ejection device 1 is provided with a controller 150 . The controller 150 is, for example, a computer and has a data storage unit (not shown). The data storage unit stores, for example, drawing data (bit diagram data) for controlling droplets discharged onto the work W and drawing a predetermined pattern on the work W. In addition, the control unit 150 has a program storage unit (not shown). The program storage unit stores programs for controlling various processes in the droplet ejection device 1 and the like.

In addition, the data or the program is recorded on a computer-readable storage medium such as a computer-readable hard disk (HD), flexible disk (FD), compact disk (CD), magnet optical disk (MO), memory card, etc. It may have been, and it may have been installed in the control unit 150 from the storage medium.

Further, as shown in FIG. 5 , the control unit 150 includes an image processing unit that processes the captured image F captured by the first imaging unit 41 and detects the position of the reference mark 102 from the captured image ( 160) and the work W on the work stage 20 are moved a predetermined distance along the X-axis direction, the position of the reference mark 102 is estimated based on the movement amount detected by the movement amount detection mechanism 23 a mark position estimating unit 161 that controls the operation of each drive system functioning as a workpiece moving mechanism, such as an X-axis linear motor, a stage rotation mechanism 21, and a Y-axis linear motor; there is.

When detecting the position of the fiducial mark 102 based on the captured image F in the image processing unit 160, first, the X-axis direction of the first imaging unit 41 when the captured image F is acquired and based on the positional information in the Y-axis direction, coordinates in the X-axis direction and Y-axis direction of a predetermined position of the captured image F, for example, the center position are calculated. Next, the distance between the center position of the captured image F and the center position CT of the reference mark 102 is calculated based on the captured image F, thereby calculating the distance between the center position CT of the reference mark 102 Get the X and Y coordinates. In addition, in the image processing unit 160, the time when the captured image F is captured or after the workpiece W starts moving from the initial position of the carry-in/out area A1 toward the processing area A2 Time information M, which is the time until the image F is captured, is also stored. In this way, in the image processing unit 160, positional information [M(X, Y)] of the reference mark 102, including time information M, is detected. In this case, the first imaging unit 41 and the image processing unit 160 function as a work detection unit in the present invention.

In the mark position estimating unit 161, when the work stage 20 on which the work W is placed moves from the initial position of the carry-in/out area A1 toward the processing area A2, the movement amount detection mechanism 23 detects Information on the movement amount is input through the control unit 150 . Further, position information (coordinate information) of the reference mark 102 formed on the work W in the work W is input to the mark position estimation unit 161 in advance. Then, in the mark position estimating unit 161, based on the time information M stored in the image processing unit 160 and the information of the movement amount detection mechanism 23, the work stage 20 when the captured image F is captured ) is calculated in the X-axis direction (coordinates). Then, based on the positional relationship between the workpiece W and the work stage 20 when the workpiece W is aligned, the position of the workpiece W when the captured image F is captured is calculated. Next, based on the calculated position of the workpiece W and the positional information [M(X, Y)] of the reference mark 102 within the workpiece W, a criterion when the captured image F is captured The position of the mark 102 in the X-axis direction is estimated.

The work movement control unit 162 controls the operation of each drive system functioning as a work movement mechanism to draw a predetermined pattern on the work W based on the drawing data stored in the data storage unit of the control unit 150. For example, when moving the work stage 20, a command signal (pulse train) is output to the X-axis linear motor based on the positional information (pulse signal) obtained from the movement amount detection mechanism 23 to position the work stage 20. I control my speed In addition, the work movement control unit 162 includes the position information [M(X, Y)] of the reference mark 102 detected in the image processing unit 160 and the reference mark estimated by the mark position estimating unit 161 ( 102), the relative positions of the droplet ejection head 34 and the workpiece W at the droplet ejection position immediately below the droplet ejection head 34 are corrected based on the positional correlation in the X-axis direction. Controls the operation of the drivetrain.

Correction of the relative positions of the droplet ejection head 34 and the workpiece W based on the above correlation will be described in detail. As described above, even if the alignment of the workpiece W is performed in the carry-in/out area A1, in the process of moving the workpiece stage 20 toward the droplet discharge head 34 in the processing area A2, the workpiece When the relative positional relationship between the droplet ejection head 34 and the bank 100 on the workpiece W is displaced from the desired state due to factors such as mechanical accuracy of each drive system that moves the stage 20 or temperature change there is In such a case, it becomes a problem because it is not possible to draw accurately on the workpiece W.

Therefore, in the work movement control unit 162, first, the position in the X-axis direction of the reference mark 102 detected in the image processing unit 160 and the X of the reference mark 102 estimated by the mark position estimating unit 161 Calculate the difference in position in the axial direction. Then, if the obtained difference is zero or within a predetermined threshold value, it is determined that the work W on the work stage 20 is at a desired position. That is, since the position of the reference mark 102 estimated by the mark position estimating unit 161 is the theoretical position when the workpiece W is conveyed without deviation, the theoretical position and the image processing unit 160 ), it can be said that the relative positional relationship between the work W on the work stage 20 and the droplet discharge head 34 is in a desired state.

On the other hand, if the difference between the position detected by the image processing unit 160 and the position estimated by the mark position estimating unit 161 exceeds a predetermined threshold, the relative positional relationship between the workpiece W and the droplet ejection head 34 It is judged that a discrepancy has occurred. In this case, when the workpiece W is moved by a distance L from the position where the captured image F was acquired by the first imaging unit 41 to the droplet discharge position, the workpiece W moves from the predetermined position to the difference It will move to a position that is off by minutes. Accordingly, the work movement control unit 162 calculates a correction position at which this difference becomes zero or within a predetermined threshold value, and controls the work stage 20 to move to this correction position, thereby controlling the work W and the droplet. The relative positional relationship of the ejection head 34 is corrected. In addition, the time Ts required for the processing of the captured image F described above is, for example, the time for generating the captured image F in the first imaging unit 41, the time from the first imaging unit 41 to the control unit ( 150), the time for transferring the captured image F, the time for detecting the positional information [M(X, Y)] of the reference mark 102 in the image processing unit 160, and the correction position in the work movement control unit 162. The calculation time means the time from acquisition of the captured image F to calculation of the correction position.

When the correction position is calculated, the work movement control unit 162 adjusts the reference mark 102 where the displacement is detected to be positioned at the correction position at the droplet discharge position immediately below the droplet discharge head 34 ( 20) (X-axis linear motor) is controlled. In addition, as described above, a predetermined time Ts is required from the acquisition of the captured image F by the first imaging unit 41 to the calculation of the corrected position by the work movement control unit 162 . Therefore, the distance (L) between the first imaging unit 41 and the carriage 33 is such that the work stage 20 moving along the X-axis at the speed V is the carriage from directly below the first imaging unit 41. The time required to move to the droplet ejection position immediately below the droplet ejection head 34 provided in (33) is set to be longer than the time Ts required for processing the captured image F. That is, the distance L is set longer than the distance that the workpiece W moves during the time period Ts. Also, since the distance L needs to be synchronized with the imaging period T, it is set to an integer multiple of the distance that the workpiece W moves during the imaging period T. That is, the distance L is set so as to satisfy L=n×T×V (n is a positive integer).

Correction of this position will be specifically described using the correction table AM shown in FIG. 6 . In the following description, it is assumed that "n" is set to "2", that is, the distance L is twice the distance traveled during the imaging period T. The “number of times of detection” in FIG. 6 is the number of times the captured image F of the workpiece W was acquired at a predetermined cycle T, and for example, “DATA1” indicates the first image capture, and “DATA2” indicates the second image capture. It means. The “shift amount” in FIG. 6 means the shift amount detected by the workpiece movement control unit 162 . In Fig. 6, for example, a shift amount L1 is detected in DATA3, and a shift amount 2L1 is detected after DATA4.

"Current position" in FIG. 6 is the position of the workpiece W recognized by the mark position estimation unit 161 at the time of acquisition of each DATA, for example, the work stage 20 is at a predetermined position set in advance. If there is, it is expressed as zero. For example, in DATA5, -L ₁ means that the workpiece W is located at a shifted position. The reason why "current position" may be other than zero will be described later.

The "corrected position" in Fig. 6 means the coordinates of the corrected position calculated by the work movement control unit 162, and is obtained as a value obtained by subtracting the "displacement amount" from the "current position". For example, the correction position is zero because the &quot;deviation amount&quot; is not detected in DATA1 and DATA2 of the correction table AM. Also, in DATA3, since the "current position" is zero and the "deviation amount" is L ₁ , the "correction position" is -L ₁ .

And since "n" is set to "2" in the setting of the distance L, in the correction of the position of the workpiece W at the droplet ejection position, the "deviation amount" is detected (DATA3) The work stage 20 (X-axis linear motor) is controlled so that the workpiece W moves to the corrected position with a delay of 2 cycles from . That is, it is moved to the position of the coordinates (-L ₁ ), which is the correction position, so as to cancel the shift amount (L ₁ ). In this way, by preemptively correcting the position of the workpiece W, the displacement of the relative positions of the workpiece W and the droplet ejection head 34 caused by any cause is eliminated by the droplet ejection head 34. You can resolve it before doing it.

In addition, when the workpiece W is moved to the correction position, for example, at the time of acquiring DATA5 of the correction table AM, the workpiece W has a relative positional relationship with the first imaging unit 41 by -L ₁ It will be located at the wrong coordinates. Therefore, in the work movement control part 162, as shown in DATA5 _of FIG. 6, it memorizes that "current position" is shifted by -L1. And, if it is detected that the "displacement amount" is 2L ₁ in DATA5, this "displacement amount" is actually detected at a position shifted by -L ₁ , so subtracting the "displacement amount" from the "current position" Correction position” becomes -3L ₁ . Therefore, in DATA7 in which the imaging period T is delayed by 2 cycles from DATA5, the work stage 20 is moved to the position of the coordinates (-3L ₁ ) as the correction position. In addition, since the imaging period T is kept constant even when moving to the correction position, for example, by controlling the moving speed of the work stage 20 by the X-axis linear motor, the movement to the correction position within the same imaging period T let it

In addition, as in the present embodiment, when “n” is set to “2”, that is, when the distance L is twice the distance that the workpiece W travels during the imaging period T, for example, FIG. 7 Assuming that the captured image F is acquired by the first imaging unit 41 at the position of the workpiece W indicated by the solid line in , after imaging the workpiece W in the first imaging unit 41, the distance During either (1/2L) progress (1 cycle of the imaging cycle) or while moving from the position of the distance (1/2L) to the position of the distance L (2 cycles of the imaging cycle), the work stage By shifting the position of (20) by the shift amount, the workpiece W is placed at the correcting position at the droplet ejection position. For example, if the correction for DATA3 in FIG. 6 is performed at the time point of DATA4 delayed by one cycle, DATA4 The current position becomes “-L ₁ ” instead of “0”. Therefore, in order to minimize the influence of the correction, it is preferable to perform the correction operation during the imaging period T when the reference mark 102, from which the amount of deviation is detected, reaches the droplet ejection position. That is, it is preferable that the correction operation based on the information of DATA3 indicated in the correction table AM is completed at the time of acquisition of DATA5 after acquisition of DATA4.

Then, in DATA4, for example, the captured image F is acquired in a state where the "current position" is "0", and correction is performed for the shift amount (2L ₁ ) in DATA6 delayed by two cycles. As a result, in DATA6, the "current position" becomes -2L ₁ , and the correction operation is completed without being affected by the correction based on DATA3.

Next, work processing performed using the droplet ejection device 1 configured as described above will be described.

First, the work stage 20 is placed in the carry-in/out area A1, and the work W carried into the droplet ejection device 1 by a transfer mechanism (not shown) is placed on the work stage 20. . Next, the alignment mark of the work W on the work stage 20 is imaged by the work alignment camera. Then, based on the captured image, the position of the work W disposed on the work stage 20 in the θ direction is corrected by the stage rotation mechanism 21, and the work W is aligned ( Step S1). Further, for example, if correction in the Y-axis direction is required, the relative positional relationship between the work stage 20 and the carriage unit 30 along the Y-axis direction is corrected by appropriately moving the Y-axis linear motor.

After that, the work stage 20 is moved from the carry-in/out area A1 to the processing area A2 by the X-axis slider 22 . In the processing area A2 , droplets are ejected from the droplet ejection head 24 to the workpiece W that has moved downward of the droplet ejection head 24 . Further, as shown in FIG. 8 , the work stage 20 is further moved toward the waiting area A3 side so that the entire surface of the work W passes below the droplet ejection head 24 . Then, the workpiece is reciprocated in the X-axis direction, and the carriage unit 30 is appropriately moved in the Y-axis direction to draw a predetermined pattern on the workpiece W (step S2).

Here, the correction work of the position of the workpiece W based on the correction table AM will be described using FIG. 9 . The left-right direction in FIG. 9 represents the X-axis direction, and the vertical direction is a time-sequential drawing of the work W moving from the position where DATA1 is acquired to the position where DATA7 is acquired with the lapse of time. In addition, the distance between the dashed-dotted lines extending in the vertical direction is the distance that the workpiece W moves during the imaging period T by the first imaging unit 41, and as in the present embodiment, "n" is "2" When set to , the distance between adjacent dashed-dotted lines is 1/2L. In addition, the “imaging position” shown in FIG. 9 is the position at which the workpiece W is imaged immediately below the first imaging unit 41, and the “droplet ejection position” is the position immediately below the droplet ejection head 34. are shown, respectively, and the distance between the "imaging position" and the "droplet ejection position" is L as described above. In addition, the workpiece|work W shown in "ideal state" of FIG. 9 is drawing for explanatory purposes the state in which the reference mark 102 is formed at the pitch of 1/2L, for example.

Like the workpiece W shown in the "ideal state" of FIG. 9 , for example, if the reference marks 102 are formed at equal intervals at a pitch of 1/2L, and the workpiece W is conveyed while maintaining this state, the droplets Since the relative positional relationship between the discharge head 34 and the bank 100 on the work W does not shift, good drawing is performed at the droplet discharge position. However, in reality, for example, as shown in the positions corresponding to DATA1 to DATA7 in FIG. 9 , in the actual workpiece Wa, the wrinkles of the workpiece Wa itself, the mechanical accuracy and temperature of the workpiece stage 20, etc. Due to factors such as changes, the relative positional relationship between the bank 100 and the droplet ejection head 34 on the work Wa is not constant within the surface of the work Wa, and in FIG. 102) is drawing the workpiece Wa in a state where it is not located at equal intervals with an oblique hatch. In Fig. 9, it is assumed that the relative positional relationship between the bank 100 and the droplet ejection head 34 on the workpiece W is in a desired state if the droplet ejection position coincides with the central position of the reference mark 102. .

And, as shown in Fig. 6, in DATA1 to DATA4, since the position of the workpiece Wa is not particularly corrected, the workpiece Wa is shifted by, for example, a position of 1/2L per imaging period T. go to Then, in DATA3, since it is detected that the reference mark 102 is shifted from the imaging position to the positive direction of the X direction by the distance L ₁ , in DATA5 delayed by 2 cycles from DATA3, the distance from the predetermined position set in advance ( The workpiece Wa moves to the "correction position" shifted in the positive direction of the X direction by L ₁ ). As a result, as shown in FIG. 9 , the droplet ejection position and the central position of the reference mark 102 can be matched. In addition, the rectangular part indicated by the code|symbol W _ref in FIG. 9 is a position where the workpiece|work Wa exists when it is assumed that positional correction is not performed with respect to the workpiece|work Wa.

Further, in DATA5, the displacement amount of the workpiece Wa is detected as 2L ₁ , but in DATA5, since the captured image F is acquired at the L ₁ displacement correction position from W _ref , the actual displacement of the workpiece Wa The amount becomes 3L ₁ , and as shown in FIG. 6 , -3L ₁ is obtained as the correction position.

Then, in DATA6, droplets are ejected onto the workpiece Wa and the captured image F is acquired at the corrected position (-2L ₁ ) calculated in DATA4. Then, in the work movement control unit 162, the corrected position (-4L ₁ ) is determined based on the corrected position (-2L ₁ ) and the shift amount.

In DATA7, at the corrected position (-3L ₁ ) obtained in DATA5, droplets are ejected onto the workpiece Wa and a captured image F is acquired. Then, by repeatedly performing this operation, a predetermined pattern is drawn on the workpiece Wa.

At this time, the upper surface of the workpiece W is captured by the second imaging unit 42 . The captured image is output to the control unit 150, and the control unit 150 inspects the drawing state for defects such as film stains based on the captured image. In the result of this inspection, if the drawing state is determined to be defective, for example, droplet ejection from the droplet ejection head 24 is feedback-controlled (step S3).

When the work stage 20 moves to the carry-in/out area A1, the work W on which the drawing process is completed is carried out from the droplet ejection device 1. Next, the next workpiece W is loaded into the droplet ejection device 1 . Subsequently, alignment of the workpiece W in step S1 described above is performed, followed by step S2 and step S3.

As described above, steps S1 to S3 are performed for each work W, and a series of work processing is completed.

According to the above first embodiment, the movement amount detection mechanism 23 for detecting the movement amount of the work stage 20 in the X-axis direction (main scanning direction) and the workpiece ( A first imaging unit 41 that acquires a captured image F of the upper surface of W), an image processing unit 160 that detects a reference mark 102 based on the captured image F, and a movement amount detecting mechanism ( Since it has a mark position estimation unit 161 that estimates the position of the reference mark 102 based on the amount of movement detected in 23), in the work movement control unit 162, the position of the reference mark 102 is detected. Based on the position of the reference mark 102 estimated by the mark position estimating unit 161, the difference between the two can be obtained. Then, in the work movement control unit 162, if this difference is equal to or greater than the threshold value, the position of the reference mark 102 detected in the imaging position and the position of the reference mark 102 estimated by the mark position estimating unit 161 It is determined that the displacement has occurred, and the operation of the work stage 20 is controlled, for example, so as to move the workpiece W to a correction position that eliminates the displacement in the droplet ejection position. As a result, the liquid droplet ejection head and the bank on the workpiece can be aligned with high precision before ejection of liquid droplets from the droplet ejection head 34 . Thereby, it is possible to draw a predetermined pattern on the workpiece W with high precision.

In the above embodiment, the relative movement of the workpiece W and the droplet ejection head in the X-axis direction and the θ direction is controlled by the work stage 20, and the relative movement in the Y-axis direction is controlled by the Y-axis linear motor. The method of movement in the axial direction, the Y-axis direction, and the θ direction is not limited to the contents of the present embodiment. For example, the position of the carriage plate 31 may be fixed to a predetermined position, and the work stage 20 may be equipped with a movement function in the X-axis direction, the Y-axis direction, and the θ direction. Conversely, the work stage 20 may be fixed, and the carriage plate 31 may be equipped with a movement function in the X-axis direction, the Y-axis direction, and the θ direction. In either case, the droplet discharging method of the present invention described above can be realized.

In the above embodiment, the reference mark 102 is formed in advance on the workpiece W, but the reference mark 102 is not necessarily necessary, and for example, in the captured image F captured by the first imaging unit 41 Thus, if the shade of the bank 100 can be identified, the position of the workpiece W may be detected based on the position of the bank 100. In this case, the bank 100 functions as the reference mark 102 .

Further, in the above embodiment, the case where displacement of the workpiece W occurred in the X-axis direction was described, but also in the case where displacement occurred in the Y-axis direction and the θ-axis direction, the same as the case of performing correction in the X-axis direction. By using the method, the position of the workpiece W can be appropriately corrected. That is, when the position of the work W is corrected by preceding control after the displacement amount is detected by the work movement control unit 162 of the present embodiment, the correction amount at the corrected position is calculated by the work movement control unit 162 and by reflecting the position of the fiducial mark 102 detected from the captured image F acquired at the correction position, an accurate displacement amount can be detected regardless of the X-axis direction, the Y-axis direction, and the θ direction. can

In addition, in detecting the displacement in the θ direction, as shown in FIG. 10, for example, a reference mark 102 is also formed on the positive Y-axis direction side of the workpiece W, and the carriage plate having the first imaging unit 41 (31a) is placed on the trajectory of the added reference mark 102. Then, the shift in the θ direction is calculated based on the shift in the X-axis direction and the Y-axis direction of the reference mark 102 detected by the two first imaging units 41, respectively.

In the above embodiment, the workpiece W is moved to the corrected position by keeping the imaging cycle T by the first imaging unit 41 constant and appropriately controlling the moving speed of the workpiece W, but, for example, In the correction of the relative position of the workpiece W and the droplet ejection head 34, the discharge timing of the droplet ejection head 34 is adjusted to the displacement of the workpiece W while the moving speed of the workpiece W is kept constant. You may make it change based on quantity. In this case, the imaging period T is appropriately adjusted so as to be synchronized with the timing of ejection of the droplet ejection head 34.

In the above embodiment, in detecting the fiducial mark 102 on the upper surface of the workpiece W in the image processing unit 160, the first imaging unit 41 is used to acquire the captured image F, but, for example, The reference mark 102 may be formed in a concave-convex shape, and the reference mark 102 may be detected based on a mechanism for detecting the concavo-convexity, such as a laser displacement meter. When a CCD camera is used as the imaging unit, adjustment work such as optimizing the shutter speed is required to prevent image blur. Therefore, even when the work W is moved at high speed in the X-axis direction, for example, the reference mark 102 can be appropriately detected.

In addition, in detecting the fiducial mark 102, for example, as shown in FIG. 11 , for example, the substantially rectangular fiducial mark 110 is formed of a material with high reflectance and arranged at a predetermined pitch, thereby providing high-sensitivity light. The reflected light from the reference mark 110 may be detected as a pulse signal using a sensor. In this case, the position of the work W may be determined by counting pulse signals using an optical sensor, such as an encoder. Even when an optical sensor is used, as in the case where a laser displacement meter is used, even when a workpiece is moved at high speed, the reference mark 110 can be appropriately detected and the current position of the workpiece W can be grasped.

Regarding the shape of the camera used as the first imaging unit 41, for example, using a rectangular line scan camera such that the entire X-axis direction of the workpiece W enters the field of view, all reference marks can be captured in one image capture. By detecting (102), expansion and contraction (temperature effect) of the workpiece W in the X-axis direction may be detected, and the position of the workpiece W may be appropriately corrected by the workpiece movement controller 162. Moreover, distribution of expansion and contraction of the workpiece W in the X-axis direction can be detected by imaging the workpiece W multiple times at a predetermined cycle using a rectangular line scan camera. Moreover, the straightness of the X direction of the work stage 20 can be measured by imaging the whole work W. Further, since the displacement amount in the θ direction can also be detected based on the displacement amounts of the plurality of fiducial marks 102, it is sufficient to provide only one line scan camera to perform correction in the θ direction.

<2. Second Embodiment>

Next, a second embodiment of the present invention will be described. Also, the droplet ejection device 1 used in the second embodiment is the same as the droplet ejection device 1 used in the first embodiment.

In the first embodiment, the position of the fiducial mark 102 on the work W is detected, and based on the positional information of the fiducial mark 102, so-called feed forward control is performed on the same work W, but continuously. When processing a plurality of workpieces W, there is a case where the tendency of displacement of the workpieces W is common among the respective workspieces. In such a case, for example, correction data obtained when processing the K (K is a positive integer)-th work W may be reflected in the processing of the K+1-th work W.

Specifically, as shown in FIG. 12 , for example, the work movement control unit 162 collects the correction position of the K-th work W in advance before processing the K+1-th work W. do. In addition, in FIG. 12, for comparison between the K-th work W and the K+1-th work W, the displacement amount in the K-th work W is also indicated.

And, in processing the K+1th workpiece W, the “current position” when the K+1th workpiece W reaches the imaging position is the corrected position of the Kth workpiece W Control the work stage 20 to coincide with. In other words, for the K+1th workpiece W, the position of the workpiece W is not corrected between the imaging position and the droplet ejection position, but the result of correcting the Kth workpiece is reflected in advance to obtain an image Regarding the position, a correction operation has already been performed in the step of acquiring the captured image F.

Then, for example, when the displacement amount of the K+1th workpiece W matches the displacement amount of the Kth workpiece, the displacement amount detected by the work movement controller 162 becomes zero. As a result, the “correction position” of the K+1th workpiece W also becomes zero, and there is no need to correct the position of the workpiece W between the imaging position and the droplet ejection position. In such a case, if the position of the workpiece W is corrected between the imaging position and the droplet ejection position, the driving system further shifts the position of the workpiece W between the imaging position and the droplet ejection position due to mechanical precision and rattling. There is a possibility that this may occur, but in the workpiece W before the Kth, a tendency such as mechanical rattling is grasped, and by performing feed forward control for the K+1th workpiece, such a new misalignment is eliminated, and the positioning of the workpiece W and the droplet ejection head 34 can be performed with higher precision.

Further, even when the position of the K+1 workpiece W is corrected based on the positional information of the workpiece W before the Kth, a shift in the imaging position is detected due to a factor different from the previous tendency. There may be cases Also in this case, the position of the workpiece W is determined again based on the captured image F of the K+1th workpiece W by the same method as in the case of using the correction table AM shown in FIG. 6 . good to correct

Specifically, as shown in FIG. 13, for example, as a result of performing correction of the position of the K+1th workpiece W at the imaging position based on the positional information of the Kth workpiece W, in DATA4 It is assumed that the deviation amount (L ₁ ) has been detected. In this case, as in the case of using the correction table AM, the "correction position" is calculated as -L ₁ based on the displacement amount. And, in DATA6 of the delay of 2 cycles of the imaging cycle T, since the position of the workpiece W has already shifted by -L ₁ based on the correction information of the K-th workpiece W, "current position" is , -2L ₁ is obtained by adding -L ₁ , which is the displacement amount detected in the K+1th workpiece W. Also, for the corrected position in DATA6, since the corrected position is calculated as -L1 in DATA4, -L1 of this corrected position is added to -L1 of the shift amount in _DATA6 to obtain _-2L1 It happens. That is, in the case of FIG. 6 , the point obtained by taking the difference between the correction position of DATA4 and the shift amount of DATA6 as the correction position of DATA6 is the same, but for the current position of DATA6, the K-th work already at the imaging position ( Since correction based on W) is performed, the "current position" in DATA6 is different from the case of FIG. 6 .

Further, in the above embodiment, the feed forward control of the K+1th work W is performed based on the correction data obtained during the processing of the Kth work W, but the K+1 work W In performing the feed forward control for , it is not necessarily necessary to use the correction data of the K-th work W, and any work W before the K-th can be used. In addition, the correction data of the K-th and previous work W used for feed forward control of the K+1-th work need not necessarily be information when droplets are ejected to the work W. That is, for example, when maintenance of the liquid droplet ejection device 1 is performed, for example, a correction table AM as shown in FIG. It may be used instead of work (W) information.

In the above embodiment, so-called feed forward control is performed based on the captured image F obtained using the first imaging unit 41 disposed on the positive X-direction side of the droplet ejection head 34, but the workpiece From the point of view of correcting the relative positional relationship between the bank 100 and the droplet ejection head 34 on (W), for example, after ejecting the droplet into the bank 100 at the droplet ejection position, further outside the bank 100 The position of the workpiece W may be corrected by feedback control by ejecting droplets to a predetermined position of , and detecting the position of the ejected droplets by the second imaging unit 42 .

Specifically, as shown in FIG. 14 , for example, after the droplet is ejected into the bank 100 at the droplet ejection position, the droplet 120 is ejected to a predetermined position outside the bank 100 . In this embodiment, the predetermined position is, for example, the central position of the reference mark 102 . In this case, if the position of the workpiece W at the droplet ejection position is a desired position by correcting the position of the workpiece W between the imaging position and the droplet ejection position, the position of the center of the reference mark 102 and the position of the center of the droplet 120 coincide. However, if the relative positions of the workpiece W and the droplet discharge head 34 are shifted due to some factor during, for example, moving the distance L between the imaging position and the droplet discharge position, the reference mark 102 and the droplet ( 120), a shift occurs at the center position.

Therefore, for example, a discrepancy between the position of the reference mark 102 estimated by the mark position estimating unit 161 and the center position of the droplet 120 in the captured image F acquired by the second imaging unit 42 is determined. , calculated by the work movement control unit 162. Then, when this discrepancy is detected in DATAp obtained in the p-th (p is a positive integer) image pickup by the second imaging unit 42, at the droplet ejection position at the timing of DATA(p+1), this By moving the workpiece W to a current position that further reflects the displacement amount, the relative positional relationship between the workpiece W and the droplet ejection head 34 can be aligned with higher precision. In addition, in order to correct the relative position of the workpiece W and the droplet discharge head 34 at the timing of DATA(p+1) based on DATAp, the distance between the second imaging unit 42 and the droplet discharge head 34 It is preferable to make the distance as small as possible, and more specifically, the time during which the workpiece W moves from the droplet ejection position to the imaging position by the second imaging unit 42 and the time in the second imaging unit 42 The sum of the time required from acquisition of the captured image F to calculation of the correction position in the work movement controller 162 is set to be shorter than the imaging period T.

In addition, after discharging liquid droplets into the bank 100, the landing position of the liquid droplets to be discharged in order to perform the above-described feedback control does not necessarily have to be at the center of the fiducial mark 102, and based on the captured image F If the landing position can be specified, the landing position can be arbitrarily set. For example, if the landing position and the reference mark 102 are captured within the field of view of the same captured image F, the landing position of the droplet can be grasped from the relative positional relationship between the reference mark 102 and the landing position of the droplet in the image processing unit, for example. Therefore, it is possible to determine whether or not the landing position of the droplet is shifted from the desired position.

<3. Application example of droplet ejection device>

Next, an application example of the droplet ejection device 1 configured as described above will be described. FIG. 15 is an explanatory diagram schematically illustrating the configuration of the substrate processing system 200 provided with the droplet ejection device 1 . In the substrate processing system 200, an organic EL layer of an organic light emitting diode is formed.

First, the outline of the structure of an organic light emitting diode and its manufacturing method are demonstrated. 16 is a side view schematically illustrating the structure of the organic light emitting diode 300. As shown in FIG. As shown in FIG. 16 , the organic light emitting diode 300 has an organic EL layer 330 between an anode (anode) 310 and a cathode (cathode) 320 on a glass substrate G serving as a workpiece W. It has an embedded structure. In the organic EL layer 330, a hole injection layer 331, a hole transport layer 332, a light emitting layer 333, an electron transport layer 334, and an electron injection layer 335 are sequentially stacked from the anode 310 side. is formed

In manufacturing the organic light emitting diode 300, first, the anode 310 is formed on the glass substrate (G). The anode 310 is formed using, for example, a vapor deposition method. In addition, as the anode 310, a transparent electrode made of, for example, ITO (Indium Tin Oxide) is used.

Then, on the anode 310, as shown in FIG. 17, a bank 340 is formed. The bank 340 is patterned in a predetermined pattern by, for example, photolithography processing or etching processing. In the bank 340, a plurality of slit-shaped openings 341 are formed in a row direction (X-axis direction) and a column direction (Y-axis direction). Inside the opening 341, as will be described later, an organic EL layer 330 and a cathode 320 are laminated to form a pixel. For the bank 340, for example, photosensitive polyimide resin is used.

After that, in the opening 341 of the bank 340, the organic EL layer 330 is formed on the anode 310. Specifically, the hole injection layer 331 is formed on the anode 310, the hole transport layer 332 is formed on the hole injection layer 331, and the light emitting layer 333 is formed on the hole transport layer 332. The electron transport layer 334 is formed on the light emitting layer 333, and the electron injection layer 335 is formed on the electron transport layer 334.

In this embodiment, the hole injection layer 331 , the hole transport layer 332 , and the light emitting layer 333 are each formed in the substrate processing system 200 . That is, in the substrate processing system 200, the application process of the organic material by the inkjet method, the drying process of the organic material under reduced pressure, and the firing process of the organic material are sequentially performed, and these hole injection layer 331, the hole transport layer 332 and A light emitting layer 333 is formed.

In addition, the electron transport layer 334 and the electron injection layer 335 are each formed using, for example, a vapor deposition method.

After that, a cathode 320 is formed on the electron injection layer 335 . Cathode 320 is formed using, for example, a vapor deposition method. Also, for the cathode 320, for example, aluminum is used.

In the organic light emitting diode 300 manufactured in this way, by applying a voltage between the anode 310 and the cathode 320, a predetermined number of holes injected from the hole injection layer 331 pass through the hole transport layer 332. A predetermined number of electrons injected from the electron injection layer 335 are transported to the light emitting layer 333 through the electron transport layer 334 . Holes and electrons recombine in the light emitting layer 333 to form molecules in an excited state, and the light emitting layer 333 emits light.

Next, the substrate processing system 200 shown in FIG. 15 will be described. In addition, the anode 310 and the bank 340 are formed in advance on the glass substrate G processed by the substrate processing system 200, and in the substrate processing system 200, the hole injection layer 331, the hole transport layer ( 332) and the light emitting layer 333 are formed.

The substrate processing system 200 carries in a plurality of glass substrates G into the substrate processing system 200 from the outside in cassette units, and takes out the glass substrates G from the cassette C before processing 201 ), a processing station 202 provided with a plurality of processing devices that perform a predetermined process on the glass substrate G, and the glass substrate G after processing is accommodated in the cassette C, and a plurality of glass substrates It has a structure in which the carrying out station 203 which carries (G) out from the substrate processing system 200 in cassette units is integrally connected. The carrying-in station 201, the processing station 202, and the carrying-out station 203 are arranged and arranged in this order in the X-axis direction.

The carrying-in station 201 is provided with a cassette placing table 210 . Cassette placing table 210 is capable of arranging a plurality of cassettes C in a row in the Y-axis direction. That is, the carrying-in station 201 is comprised so that holding|maintenance of some glass substrate G is possible.

The carrying-in station 201 is provided with a substrate carrier 212 capable of moving on a carrier path 211 extending in the Y-axis direction. The substrate carrier 212 is also movable in the vertical direction and around the vertical direction, and can transport the glass substrate G between the cassette C and the processing station 202 . In addition, the substrate transporter 212 adsorbs and holds the glass substrate G, for example, and transports it.

In the processing station 202, a hole injection layer forming unit 220 for forming the hole injection layer 331, a hole transport layer forming unit 221 for forming the hole transport layer 332, and a light emitting layer 333 are formed. The light-emitting layer formation part 222 is arranged in this order in the X-axis direction from the carrying-in station 201 side.

In the hole injection layer forming unit 220, a first substrate transport area 230, a second substrate transport area 231, and a third substrate transport area 232 are provided in the X-axis direction from the carrying station 201 side. are arranged in this order. Each substrate transport area 230, 231, 232 is provided by stretching in the X-axis direction, and a substrate transport device (not shown) that transports the glass substrate G is provided in the substrate transport area 230, 231, 232. It is provided. The substrate transport device can also move in the horizontal direction, the vertical direction, and the vertical circumferential direction, and can transport the glass substrate G to each device provided adjacent to these substrate transport areas 230, 231, and 232.

Between the loading station 201 and the first substrate transport area 230, a transition device 233 for transferring the glass substrate G is provided. Similarly, transition devices 234 and 235 are provided between the first substrate transport area 230 and the second substrate transport area 231 and between the second substrate transport area 231 and the third substrate transport area 232, respectively. there is.

On the positive side of the first substrate transport area 230 in the Y-axis direction, an application device 240 for applying an organic material for forming the hole injection layer 331 on the glass substrate G (anode 310) is provided. there is. The application device 240 has the same configuration as the droplet ejection device 1, and in the application device 240, the application device 240 is applied at a predetermined position on the glass substrate G, that is, of the opening 341 of the bank 340 by an inkjet method. An organic material is applied inside. The organic material of this embodiment is a solution obtained by dissolving a predetermined material for forming the hole injection layer 331 in an organic solvent.

On the negative Y-axis direction side of the first substrate transport area 230, a buffer device 241 for temporarily accommodating a plurality of glass substrates G is provided.

On the positive Y-axis direction side and the negative Y-axis direction side of the second substrate transport area 231, a plurality of vacuum drying devices 242 for drying the organic material applied by the coating device 240 under reduced pressure are stacked, all of which are For example, there are 5 available. The reduced pressure drying device 242 has, for example, a turbo molecular pump (not shown), and is configured to reduce the internal atmosphere to, for example, 1 Pa or less by means of the turbo molecular pump to dry the organic material.

On the positive side of the third substrate conveyance area 232 in the Y-axis direction, a plurality of heat treatment devices 243 for heat treating and firing organic materials dried by the reduced pressure drying device 242 are provided, for example, stacked in 20 stages. . The heat treatment device 243 has a hot plate (not shown) on which the glass substrate G is disposed, and is configured to sinter the organic material by the hot plate.

On the negative side of the Y-axis direction of the third substrate transport area 232, a plurality of temperature control devices 244 are provided to control the glass substrate G heat-treated by the heat treatment device 243 to a predetermined temperature, for example, room temperature. It is provided.

In the hole injection layer forming unit 220, the number and arrangement of the coating device 240, the buffer device 241, the vacuum drying device 242, the heat treatment device 243, and the temperature control device 244 , can be chosen arbitrarily.

In the hole transport layer forming unit 221, a first substrate transport region 250, a second substrate transport region 251, and a third substrate transport region 252 are formed by X from the hole injection layer forming unit 220 side. They are arranged and arranged in this order in the axial direction. Each substrate transport area 250, 251, 252 is provided by extending in the X-axis direction, and in the substrate transport area 250, 251, 252, a substrate transport device (not shown) that transports the glass substrate G is provided. is provided. The substrate transport device can also move in the horizontal direction, the vertical direction, and the vertical circumferential direction, and can transport the glass substrate G to each device provided adjacent to these substrate transport areas 250, 251, and 252.

In addition, a heat treatment device 263 and a temperature control device 264, which will be described later, are provided adjacent to the third substrate transport area 252, and the inside of each of these devices 263 and 264 is maintained in a low-oxygen and low-dew point atmosphere. do. For this reason, also in the third substrate transport region 252, the inside is maintained in a low-oxygen and low-dew point atmosphere. In the following description, a low-oxygen atmosphere refers to an atmosphere in which the oxygen concentration is lower than that of the atmosphere, for example, an atmosphere in which the oxygen concentration is 10 ppm or less, and a low-dew point atmosphere refers to an atmosphere in which the dew point temperature is lower than that of the air, for example, an atmosphere in which the dew point temperature is -10 ° C or less. says And, as such a low oxygen and low dew point atmosphere, for example, an inert gas such as nitrogen gas is used.

Between the hole injection layer forming unit 220 and the first substrate transport region 250 and between the first substrate transport region 250 and the second substrate transport region 251, there are transitions for transferring the glass substrate G, respectively. Devices 253 and 254 are provided. Between the second substrate transport area 251 and the third substrate transport area 252, a load lock device 255 capable of temporarily accommodating the glass substrate G is provided. The load lock device 255 is configured to be able to switch the internal atmosphere, that is, to be able to switch between an atmospheric atmosphere and a low oxygen and low dew point atmosphere.

On the positive side of the first substrate conveyance region 250 in the Y-axis direction, an organic material for forming a hole transport layer 332 is applied on the glass substrate G (hole injection layer 331), applied as a droplet ejection device. Device 260 is provided. The application device 260 has the same configuration as the droplet ejection device 1, and in the application device 260, the application device 260 is applied at a predetermined position on the glass substrate G, that is, of the opening 341 of the bank 340 by an inkjet method. An organic material is applied inside. In addition, the organic material of this embodiment is a solution obtained by dissolving a predetermined material for forming the hole transport layer 332 in an organic solvent.

On the negative Y-axis direction side of the first substrate transport area 250, a buffer device 261 for temporarily accommodating a plurality of glass substrates G is provided.

On the positive Y-axis direction side and the negative Y-axis direction side of the second substrate conveyance area 251, a plurality of vacuum drying devices 262 for drying the organic material applied by the coating device 260 under reduced pressure are stacked, and all of them are For example, there are 5 available. The reduced-pressure drying device 262 is configured to dry the organic material by reducing the internal atmosphere to, for example, 1 Pa or less, using, for example, a turbo molecular pump (not shown).

On the positive side of the third substrate transport area 252 in the Y-axis direction, a plurality of heat treatment devices 263 for heat treating and firing organic materials dried by the reduced pressure drying device 262 are provided, for example, stacked in 20 stages. . The heat treatment device 263 is configured to have a hot plate (not shown) on which the glass substrate G is disposed, and to sinter the organic material by the hot plate. In addition, the inside of the thermal processing device 263 is maintained in a low-oxygen and low-dew point atmosphere.

On the negative side of the third substrate transport area 252 in the Y-axis direction, there are a plurality of temperature control devices 264 that control the glass substrate G heat-treated by the heat treatment device 263 to a predetermined temperature, for example, room temperature. It is provided. The inside of the temperature control device 264 is maintained in a low oxygen and low dew point atmosphere.

In the hole transport layer forming unit 221, the number and arrangement of the coating device 260, the buffer device 261, the vacuum drying device 262, the heat treatment device 263, and the temperature control device 264, can be selected arbitrarily.

In the light emitting layer forming unit 222, a first substrate transporting region 270, a second substrate transporting region 271, and a third substrate transporting region 272 are provided in the X-axis direction from the hole transporting layer forming unit 221 side. are arranged in this order. Each substrate transport area 270, 271, 272 is provided by extending in the X-axis direction, and in the substrate transport area 270, 271, 272, a substrate transport device (not shown) that transports the glass substrate G is provided. is provided. The substrate transport device can also move in the horizontal direction, the vertical direction, and the vertical circumferential direction, and can transport the glass substrate G to each device provided adjacent to these substrate transport areas 270, 271, and 272.

Further, in the third substrate transfer area 272, a heat treatment device 283 and a temperature control device 284, which will be described later, are provided adjacent to each other, and the inside of each of these devices 283 and 284 is maintained in a low-oxygen and low-dew point atmosphere. do. For this reason, also in the third substrate transport region 272, the inside is maintained in a low-oxygen and low-dew point atmosphere.

Between the hole transport layer forming unit 221 and the first substrate transport region 270 and between the first substrate transport region 270 and the second substrate transport region 271, a transition device for transferring the glass substrate G, respectively. (273, 274) are provided. Between the second substrate transport area 271 and the third substrate transport area 272 and between the third substrate transport area 272 and the transfer station 203, load-lock devices capable of temporarily accommodating the glass substrates G, respectively. (275, 276) are provided. The load lock devices 275 and 276 are configured to be able to switch the internal atmosphere, that is, to be able to switch between an atmospheric atmosphere and a low oxygen and low dew point atmosphere.

On the positive side of the first substrate conveyance area 270 in the Y-axis direction, an application device ( 280) are provided, for example, two. The application device 280 has the same configuration as the droplet ejection device 1, and in the application device 280, the application device 280 is applied at a predetermined position on the glass substrate G, that is, of the opening 341 of the bank 340 by an inkjet method. An organic material is applied inside. The organic material of this embodiment is a solution obtained by dissolving a predetermined material for forming the light emitting layer 333 in an organic solvent.

On the negative side of the Y-axis direction of the first substrate transport area 270, a buffer device 281 for temporarily accommodating a plurality of glass substrates G is provided.

On the positive Y-axis direction side and the negative Y-axis direction side of the second substrate transport area 271, a plurality of vacuum drying devices 282 for drying the organic material applied by the coating device 280 under reduced pressure are stacked, all of which are, for example, There are 5 available. The reduced-pressure drying device 282 is configured to dry the organic material by reducing the internal atmosphere to, for example, 1 Pa or less, using, for example, a turbo molecular pump (not shown).

On the positive side of the third substrate transport area 272 in the Y-axis direction, a plurality of heat treatment devices 283, for example, stacked in 20 stages, are provided to heat-treat and bake organic materials dried by the reduced-pressure drying device 282. . The heat treatment device 283 has a hot plate (not shown) on which the glass substrate G is disposed, and is configured to sinter the organic material by the hot plate. In addition, the inside of the thermal processing device 283 is maintained in a low-oxygen and low-dew point atmosphere.

On the negative Y-axis direction side of the third substrate transport area 272, a plurality of temperature control devices 284 are provided to control the glass substrate G heat-treated by the heat treatment device 283 to a predetermined temperature, for example, room temperature. It is provided. The inside of the temperature control device 284 is maintained in a low oxygen and low dew point atmosphere.

In the light emitting layer forming unit 222, the number and arrangement of the coating device 280, the buffer device 281, the vacuum drying device 282, the heat treatment device 283, and the temperature control device 284 are arbitrary. You can choose.

A cassette placing table 290 is provided in the delivery station 203 . Cassette placement table 290 is capable of arranging a plurality of cassettes C in a row in the Y-axis direction. That is, the carrying out station 203 is comprised so that holding|maintenance of some glass substrate G is possible.

The transport station 203 is provided with a substrate transporter 292 capable of moving on a transport path 291 extending in the Y-axis direction. The substrate carrier 292 is also movable in the vertical direction and around the vertical direction, and can transport the glass substrate G between the cassette C and the processing station 202 . In addition, the substrate transporter 292 adsorbs and holds the glass substrate G, for example, and transports it.

In addition, it is preferable that the inside of the carrying out station 203 is maintained in a low oxygen and low dew point atmosphere.

The above substrate processing system 200 is provided with the control unit 150 described above. Accordingly, the application devices 240 , 260 , and 280 are controlled by the controller 150 . However, in the program storage unit (not shown) of the control unit 150, in addition to the program for controlling the coating devices 240, 260 and 280, the glass substrate G in the substrate processing system 200 A program for controlling the processing is also stored.

Next, the processing method of the glass substrate G performed using the substrate processing system 200 structured as above is demonstrated.

First, a cassette C containing a plurality of glass substrates G is loaded into the loading station 201 and placed on the cassette placing table 210 . Thereafter, the glass substrate G is sequentially taken out from the cassette C on the cassette placing table 210 by the substrate carrier 212 .

The glass substrate G taken out from the cassette C is transported to the transition device 233 of the hole injection layer forming unit 220 by the substrate transporter 212, and further transports the first substrate transport area 230. It is conveyed to the application device 240 through. Then, in the application device 240, the hole injection layer 331 is applied at a predetermined position on the glass substrate G (anode 310), that is, inside the opening 341 of the bank 340 by an inkjet method. An organic material is applied. The processing in this coating device 240 is the same processing as the steps S1 to S6 described above.

On the other hand, the glass substrate G after the application process in the coating device 240 is transported to the transition device 234 via the first substrate transport area 230, and further transported to the second substrate transport area 231. Through this, it is conveyed to the reduced pressure drying device 242. And in the reduced-pressure drying apparatus 242, the internal atmosphere is reduced in pressure, and the organic material apply|coated on the glass substrate G is dried.

Next, the glass substrate G is transported to the transition device 235 via the second substrate transport area 231 and further transported to the thermal processing device 243 via the third substrate transport area 232 . In the heat treatment device 243, the glass substrate G disposed on the hot plate is heated to a predetermined temperature, for example, 280° C., and the organic material of the glass substrate G is fired.

Next, glass substrate G is conveyed to the temperature control device 244 via the 3rd substrate conveyance area|region 232. And in the temperature control device 244, the glass substrate (G) is temperature-controlled to a predetermined temperature, for example, room temperature. In this way, the hole injection layer 331 is formed on the glass substrate G (anode 310).

Next, the glass substrate G is conveyed to the transition device 253 of the hole transport layer forming unit 221 through the third substrate conveyance area 232, and further through the first substrate conveyance area 250, the coating device ( 260) is returned. Then, in the application device 260, the organic material for the hole transport layer 332 is applied onto the glass substrate G (hole injection layer 331) by an inkjet method. The processing in this coating device 260 is the same processing as the steps S1 to S6 described above.

Next, glass substrate G is conveyed to the transition device 254 via the 1st substrate conveyance area 250, and further conveyed to the reduced-pressure drying apparatus 262 via the 2nd substrate conveyance area 251. And in the reduced-pressure drying apparatus 262, the internal atmosphere is reduced in pressure, and the organic material apply|coated on the glass substrate G is dried.

Next, the glass substrate G is transported to the load-lock device 255 through the second substrate transport area 251 . When the glass substrate G is carried into the load-lock device 255, the inside thereof is converted into a low-oxygen and low-dew point atmosphere. Thereafter, the inside of the load-lock device 255 and the inside of the third substrate transfer region 252 maintained in the same low-oxygen and low-dew point atmosphere are communicated with each other.

Next, the glass substrate G is conveyed to the heat processing apparatus 263 via the 3rd substrate conveyance area|region 252. The inside of this heat treatment device 263 is also maintained in a low oxygen and low dew point atmosphere. In the heat treatment device 263, the glass substrate G disposed on the hot plate is heated to a predetermined temperature, for example, 200° C., and the organic material of the glass substrate G is fired.

Next, glass substrate G is conveyed to the temperature control device 264 via the 3rd substrate conveyance area|region 252. The inside of this temperature control device 264 is also maintained in a low oxygen and low dew point atmosphere. And in the temperature control device 264, the glass substrate (G) is temperature-controlled to a predetermined temperature, for example, room temperature. In this way, the hole transport layer 332 is formed on the glass substrate G (hole injection layer 331).

Next, the glass substrate G is conveyed to the transition device 273 of the light emitting layer forming unit 222 through the third substrate conveyance area 252, and further passed through the first substrate conveyance area 270 to the coating device 280. ) is returned to Then, in the application device 280, the organic material for the light emitting layer 333 is applied onto the glass substrate G (hole transport layer 332) by an inkjet method. The processing in this coating device 280 is the same processing as the steps S1 to S6 described above.

Next, glass substrate G is conveyed to the transition device 274 via the 1st substrate conveyance area|region 270, and further conveyed to the reduced-pressure drying apparatus 282 via the 2nd substrate conveyance area|region 271. And in the reduced-pressure drying apparatus 282, the internal atmosphere is reduced in pressure, and the organic material apply|coated on the glass substrate G is dried.

Next, the glass substrate G is conveyed to the load-lock device 275 through the second substrate conveyance area 271 . When the glass substrate G is carried into the load-lock device 275, the inside thereof is converted into a low-oxygen and low-dew point atmosphere. Thereafter, the inside of the load-lock device 275 and the inside of the third substrate transfer region 272 maintained in the same low-oxygen and low-dew point atmosphere are communicated with each other.

Next, the glass substrate G is conveyed to the heat processing apparatus 283 via the 3rd substrate conveyance area|region 272. The inside of this heat treatment device 283 is also maintained in a low oxygen and low dew point atmosphere. Then, in the heat treatment device 283, the glass substrate G disposed on the hot plate is heated to a predetermined temperature, for example, 260° C., and the organic material of the glass substrate G is fired.

Next, glass substrate G is conveyed to the temperature control device 284 via the 3rd substrate conveyance area|region 272. The inside of this temperature control device 284 is also maintained in a low oxygen and low dew point atmosphere. And in the temperature control device 284, the temperature of the glass substrate G is controlled to a predetermined temperature, for example room temperature. In this way, the light emitting layer 333 is formed on the glass substrate G (hole transport layer 332).

Next, the glass substrate G is conveyed to the load-lock device 276 through the third substrate conveyance area 272 . The inside of this load lock device 276 is maintained in a low oxygen and low dew point atmosphere. Then, the inside of the load lock device 276 communicates with the inside of the discharge station 203 maintained in a low oxygen and low dew point atmosphere.

Next, the glass substrate G is conveyed to a predetermined cassette C on the cassette placing table 290 by the substrate conveying member 292 of the carrying out station 203 . In this way, a series of processing of the glass substrate G in the substrate processing system 200 ends.

Also in the above embodiment, the same effects as those of the first embodiment and the second embodiment described above can be obtained.

In addition, the layout of the substrate processing system 200 of the above embodiment is not limited to the layout shown in FIG. 15, and can be arbitrarily set.

In addition, in the substrate processing system 200 of the above embodiment, the hole injection layer 331, the hole transport layer 332, and the light emitting layer 333 are formed, but similarly, other electron transport layers 334 of the organic light emitting diode 300 and An electron injection layer 335 may also be formed. That is, depending on the organic material used for the electron transport layer 334 and the electron injection layer 335, the electron transport layer 334 and the electron injection layer 335 may be coated with an organic material by an inkjet method or an organic material. It is formed on the glass substrate G by performing the reduced-pressure drying process of and the baking process of an organic material. Also in the coating process of the electron transport layer 334 and the electron injection layer 335, the droplet ejection device 1 may be used.

Further, as an application example of the droplet ejection device 1, the substrate processing system 200 for forming the organic EL layer 330 of the organic light emitting diode 300 has been described, but the application example of the droplet ejection device 1 is this not limited to For example, when manufacturing an electro-optical device (flat panel display: FPD) such as a color filter, a liquid crystal display device, a plasma display (PDP device), an electron emission device (FED device, SED device), the droplet ejection device 1 is applied to also good In addition, the droplet ejection device 1 may also be applied when manufacturing metal wiring formation, lens formation, resist formation, light diffusion body formation, and the like.

As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, this invention is not limited to this example. It is clear that those skilled in the art can conceive of various changes or modifications within the scope of the idea described in the claims, and it is understood that these also naturally belong to the technical scope of the present invention.

1 droplet ejection device
10 X-axis table
11 Y-axis table
12 X-axis guide rail
13 Y-axis guide rail
20 walk stages
21 stage rotation mechanism
22 X-axis slider
23 Movement amount detection mechanism
30 carriage units
33 carriage
34 droplet ejection head
40 imaging units
41 first imaging unit
42 2nd imaging unit
100 bank
101 opening
102 reference mark
150 control
200 Substrate Handling System
240, 260, 280 Applicator
300 organic light emitting diode
330 organic EL layer
331 hole injection layer
332 hole transport layer
333 light emitting layer
334 electron transport layer
335 electron injection layer
G glass substrate
W walk

Claims (13)

A droplet ejection device for drawing by ejecting droplets of a functional fluid onto a workpiece, comprising:
a droplet ejection head for ejecting a droplet to the work disposed at a droplet ejection position;
a work stage for arranging the work;
a workpiece moving mechanism for relatively moving the droplet discharge head and the workpiece in a main scanning direction, a direction orthogonal to the main scanning direction, and a rotational direction by moving the workpiece stage;
a movement amount detecting mechanism for detecting a movement amount of the work stage in a main scanning direction by the work moving mechanism;
a mark detection unit for detecting a reference mark formed in advance on an upper surface of the workpiece during movement, upstream of the droplet ejection head in the main scanning direction of the workpiece;
a mark position estimating unit for estimating a position of the reference mark based on a movement amount detected by the movement amount detection mechanism when the workpiece has moved a predetermined distance along the main scanning direction;
The position of the reference mark detected by the mark detection unit when the workpiece has moved the predetermined distance, and the position of the reference mark estimated by the mark position estimating unit when the workpiece has moved the predetermined distance , and based on the detected difference, controls a moving speed of the work stage by the work moving mechanism so as to eliminate the difference between the workpiece and the droplet ejection head at the droplet ejection position.
Characterized in that, the droplet ejection device comprising a. The method of claim 1, characterized in that the fiducial mark is a bank formed to define a landing area where the liquid droplet discharged from the droplet ejection head lands, or an identification symbol formed outside the landing area. Droplet ejection device. The method according to claim 2, wherein a plurality of the impact areas are formed on the workpiece,
characterized in that the workpiece movement controller controls a moving speed of the workpiece stage by the workpiece moving mechanism so as to eliminate a difference between the workpiece and the droplet ejection head at the droplet ejection position for each impact area. Droplet ejection device. 4. The method of claim 3, wherein the detection of the reference mark by the mark detection unit is performed at a predetermined cycle,
a distance between the mark detection unit and the droplet ejection head is set to n times (n = a positive integer) a distance moved by the work stage during a period of detecting the reference mark;
Controlling the moving speed of the work stage by the work moving mechanism so as to eliminate the difference between the workpiece and the droplet ejection head at the droplet ejection position is, after detection of the reference mark by the mark detection unit ( The liquid droplet ejection device characterized in that it is performed between the n-1)th detection of the reference mark and the nth detection of the reference mark. The method according to any one of claims 1 to 4, further comprising an imaging unit disposed downstream of the droplet discharge head in the main scanning direction of the workpiece;
An impact area in which a predetermined pattern is drawn by liquid droplets is formed on the work,
The work movement control unit,
discharging a droplet from the droplet ejection head to a predetermined position outside the impact area in a state in which a difference between the workpiece and the droplet ejection head at the droplet ejection position is eliminated;
specifying a position of a droplet discharged from the droplet discharge head based on a captured image captured by the image capture unit;
calculating a displacement amount between the position of the specified liquid droplet and a predetermined position outside the impact area;
In next and subsequent discharges of liquid droplets from the liquid droplet discharge head, based on the calculated displacement amount, the workpiece moving mechanism eliminates the difference between the workpiece and the droplet discharge head at the droplet discharge position. A droplet ejection device characterized by controlling the movement speed of the work stage. A droplet ejection method for drawing by ejecting droplets of a functional liquid onto a workpiece using a droplet ejection device having a workpiece moving mechanism for moving the workpiece in a main scanning direction, the method comprising the steps of:
Detecting a movement amount of the workpiece when the workpiece moving mechanism moves the workpiece toward the droplet ejection head along a main scanning direction by a movement amount detection mechanism;
detecting a fiducial mark previously formed on an upper surface of the workpiece during movement on an upstream side of the droplet ejection head in the main scanning direction of the workpiece;
Estimating a position of the reference mark based on a movement amount detected by the movement amount detection mechanism when the workpiece has moved a predetermined distance along the main scanning direction;
The position of the reference mark detected when the workpiece moved the predetermined distance, and the position of the reference mark estimated based on the movement amount detected by the movement amount detection mechanism when the workpiece moved the predetermined distance by the workpiece moving mechanism to detect a difference between the workpiece and the droplet ejection head at a droplet ejection position where a droplet is ejected from the droplet ejection head to the work based on the detected difference. A droplet ejection method characterized in that the movement speed of the work is controlled. 7. The droplet ejection method according to claim 6, wherein the fiducial mark is a bank formed to define a landing area where the droplet ejected from the droplet ejection head lands, or an identification symbol formed outside the landing area. The method according to claim 7, wherein a plurality of the impact areas are formed on the workpiece,
Controlling the moving speed of the workpiece by the workpiece moving mechanism so as to eliminate a difference between the workpiece and the droplet ejection head at the droplet ejection position is performed for each of the impact areas. . 9. The method according to claim 8, wherein the detection of the fiducial mark on the upstream side of the droplet ejection head is performed at a predetermined cycle;
The distance between the position at which the fiducial mark is detected and the liquid droplet ejection head is set to n times (n = a positive integer) the distance the workpiece moves during a period of detecting the fiducial mark,
Controlling the moving speed of the workpiece by the workpiece moving mechanism so as to eliminate the difference between the workpiece and the droplet ejection head at the droplet ejection position is performed at the (n-1)th time after the detection of the reference mark. A liquid droplet ejection method characterized in that it is performed between the detection of the reference mark performed and the detection of the reference mark performed nth time. The method according to any one of claims 6 to 9, wherein an impact area in which a predetermined pattern is drawn by droplets is formed on the work,
discharging a droplet from the droplet ejection head to a predetermined position outside the impact area in a state in which a difference between the workpiece and the droplet ejection head at the droplet ejection position is eliminated;
On a downstream side of the droplet ejection head in the main scanning direction of the workpiece, detecting a position of the ejected droplet with respect to a predetermined position outside the impact area;
calculating a displacement amount between the detected droplet position and a predetermined position outside the impact area;
In next and subsequent discharges of liquid droplets from the liquid droplet discharge head, based on the calculated displacement amount, the workpiece moving mechanism eliminates the difference between the workpiece and the droplet discharge head at the droplet discharge position. A droplet ejection method characterized by controlling the movement speed of the workpiece. A computer-readable storage medium storing a program that runs on a computer of a droplet ejection device so that the droplet ejection method according to any one of claims 6 to 9 is executed by the droplet ejection device. delete delete

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