US10791620B2 - Optical module - Google Patents

Optical module Download PDF

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Publication number
US10791620B2
US10791620B2 US16/021,087 US201816021087A US10791620B2 US 10791620 B2 US10791620 B2 US 10791620B2 US 201816021087 A US201816021087 A US 201816021087A US 10791620 B2 US10791620 B2 US 10791620B2
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Prior art keywords
optoelectronic chip
heat sink
housing
circuit board
optical module
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US20190029102A1 (en
Inventor
Long Chen
Yuzhou SUN
Dengqun Yu
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Innolight Technolgoy Pte Ltd
Innolight Technology Pte Ltd
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Innolight Technology Suzhou Ltd
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Publication of US20190029102A1 publication Critical patent/US20190029102A1/en
Priority to US17/001,778 priority Critical patent/US11432395B2/en
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Publication of US10791620B2 publication Critical patent/US10791620B2/en
Assigned to INNOLIGHT TECHNOLOGY PTE. LTD. reassignment INNOLIGHT TECHNOLOGY PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INNOLIGHT TECHNOLOGY (SUZHOU) LTD.
Priority to US17/815,714 priority patent/US20220369450A1/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4272—Cooling with mounting substrates of high thermal conductivity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4273—Thermal aspects, temperature control or temperature monitoring with heat insulation means to thermally decouple or restrain the heat from spreading
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

Definitions

  • the present disclosure relates to the field of optical communication element manufacturing technology and, more particularly, to an optical module.
  • the purpose of the present disclosure is to provide an optical module, which possesses a high heat-dissipation capability and reduces the impact of signal crosstalk between optoelectronic chips.
  • an optical module which includes a housing, a heat sink apparatus arranged in and thermally connected to the housing, and a printed circuit board partially arranged in the heat sink apparatus.
  • the optical module further includes a first optoelectronic chip and a second optoelectronic chip that are both arranged on the heat sink apparatus.
  • the first optoelectronic chip and second optoelectronic chip are both electrically connected to the printed circuit board.
  • the printed circuit board has a first surface, a second surface opposite to the first surface, and an opening that extends from the first surface to the second surface.
  • the second optoelectronic chip is arranged at the opening.
  • the second optoelectronic chip is configured separately from the first optoelectronic chip.
  • FIG. 1 is a three-dimensional diagram showing an optical module in a first embodiment of the present disclosure
  • FIG. 2 is an exploded-view diagram showing an optical module in the first embodiment of the present disclosure
  • FIG. 3 is a three-dimensional diagram showing the printed circuit board of the optical module in FIG. 2 ;
  • FIG. 4 is a three-dimensional diagram showing the printed circuit board, heat sink apparatus, and optoelectronic chip area of an optical module in the first embodiment of the present disclosure
  • FIG. 5 is a three-dimensional diagram showing the optical module in FIG. 4 from a different perspective
  • FIG. 6 is a front view of the optical module in FIG. 4 ;
  • FIG. 7 is a three-dimensional diagram showing an optical module in the second embodiment of the present disclosure.
  • FIG. 8 is an exploded-view diagram showing an optical module in a second embodiment of the present disclosure.
  • FIG. 9 is a three-dimensional diagram showing the printed circuit board of the optical module in FIG. 8 ;
  • FIG. 10 is a three-dimensional diagram showing the printed circuit board, heat sink apparatus, and optoelectronic chip area of an optical module in the second embodiment of the present disclosure
  • FIG. 11 is a three-dimensional diagram showing the optical module in FIG. 10 from a different perspective
  • FIG. 12 is a front view of the optical module in FIG. 10 ;
  • FIG. 13 is an exploded-view diagram showing an optical module in the third embodiment of the present disclosure.
  • FIG. 14 is a three-dimensional diagram showing the printed circuit board of the optical module in FIG. 13 .
  • relative spatial position such as “upper,” “above,” “lower,” “below,” and so forth, are used for explanatory purposes in describing the relationship between a unit or feature with another unit or feature depicted in a drawing.
  • Terms indicating relative spatial position may be meant to include positions other than those depicted in the drawings when a device is being used or operated. For example, if the device shown in a drawing is flipped over, a unit that is described as being located “below” or “under” another unit or feature will be located “above” the other unit or feature. Therefore, the exemplary term “below” may include positions both above and below.
  • a device can be oriented in other ways (rotated 90 degrees or facing another direction); as such, spatially-related descriptive terms that appear in the text should be interpreted accordingly.
  • first and second can be used to describe various elements or structures in this text, the objects of such description shall not be limited by the aforementioned terms.
  • the aforementioned terms are only used to differentiate the objects of the description from one another.
  • a first surface can be called a second surface; similarly, a second surface can also be called a first surface. This in no way departs from the scope of protection of this application.
  • FIGS. 1 through 6 schematically illustrate an optical module consistent with a first exemplary embodiment of the disclosure.
  • FIG. 1 is a three-dimensional diagram showing an optical module 10 in the first embodiment.
  • FIG. 2 is an exploded-view diagram of the optical module 10 in the first embodiment.
  • the optical module 10 includes a housing 20 , an optical interface system 36 arranged in the housing 20 , a connector 38 fixed on the housing 20 , and a pull ring 40 that is arranged on the housing 20 and used to unlock the optical module 10 .
  • a spring 42 is arranged between the connector 38 and the optical interface system 36 .
  • the optical module 10 also includes a heat sink apparatus 22 and a printed circuit board 24 .
  • the heat sink apparatus 22 is arranged in the housing 20 and is thermally connected to the housing 20 , and the printed circuit board 24 is partially arranged on the heat sink apparatus 22 .
  • the printed circuit board 24 is fixed to the housing 20 by snap-fitting, and the heat sink apparatus 22 is fixed to the housing 20 by an adhesive.
  • the printed circuit board 24 may be arranged in the housing 20 by other connecting methods.
  • the heat sink apparatus 22 may be arranged in the housing 20 by other connecting methods as well.
  • the optical module 10 further includes a first optoelectronic chip 26 and a second optoelectronic chip 28 that are both arranged on the heat sink apparatus 22 .
  • the first optoelectronic chip 26 and the second optoelectronic chip 28 may both be optoelectronic chip arrays, or they may be single chips or a plurality of single chips arranged together.
  • the first optoelectronic chip 26 is a laser array
  • the second optoelectronic chip 28 is a photoelectric detector array.
  • the first optoelectronic chip 26 and the second optoelectronic chip 28 are electrically connected to the printed circuit board 24 by gold wire bonding or other means of high-speed signal electrical connection.
  • FIG. 3 is a three-dimensional diagram of the printed circuit board 24 of the optical module 10 in FIG. 2 .
  • the printed circuit board 24 has a first surface 30 , a second surface 32 opposite to first surface 30 , and an opening 34 that extends from the first surface 30 to the second surface 32 .
  • the second optoelectronic chip 28 is arranged in the opening 34 , and the second optoelectronic chip 28 is arranged separately from the first optoelectronic chip 26 .
  • the opening 34 is located in the printed circuit board 24
  • the second optoelectronic chip 28 is arranged in opening 34
  • the first optoelectronic chip 26 and the second optoelectronic chip 28 are both arranged on the heat sink apparatus 22 . Therefore, heat generated by the first optoelectronic chip 26 and the second optoelectronic chip 28 is dissipated to the housing 20 through the heat sink apparatus 22 , resulting in a high heat-dissipation capability.
  • the second optoelectronic chip 28 and the first optoelectronic chip 26 are arranged separately, thereby increasing the distance between the two optoelectronic chips, which greatly reduces the impact of signal crosstalk between the first optoelectronic chip 26 and the second optoelectronic chip 28 and improves the heat dissipation performance.
  • FIG. 4 is a three-dimensional diagram of the printed circuit board 24 , the heat sink apparatus 22 , and an optoelectronic chip area of the optical module 10 consistent with the first embodiment of this disclosure.
  • FIG. 5 is a three-dimensional diagram showing the optical module 10 in FIG. 4 from a different perspective.
  • FIG. 6 is a front view of the optical module 10 in FIG. 4 .
  • the heat sink apparatus 22 includes a first heat sink 44 and a second heat sink 46 that is thermally connected to the first heat sink 44 .
  • the first optoelectronic chip 26 is arranged on the first heat sink 44 , and heat generated by the first optoelectronic chip 26 is dissipated to the housing 20 through the first heat sink 44 .
  • the second heat sink 46 is partially located in the opening 34 , and the second optoelectronic chip 28 is arranged on the second heat sink 46 . Both the first heat sink 44 and the second heat sink 46 are thermally connected to the housing 20 .
  • heat generated by the first optoelectronic chip 26 and the second optoelectronic chip 28 is caused to dissipate to the housing 20 through the first heat sink 44 and the second heat sink 46 , respectively, and the separate arrangement of the first optoelectronic chip 26 and the second optoelectronic chip 28 ensures that the optical module 10 has a comparatively high heat-dissipation capability while further reducing the impact of signal crosstalk between the first optoelectronic chip 26 and the second optoelectronic chip 28 .
  • the housing 20 includes a first housing 48 and a second housing 50 that is connected to first housing 48 .
  • the first housing 48 and the second housing 50 may be fixed together with screws.
  • the heat sink apparatus 22 is arranged near the second housing 50 . Therefore, heat generated by the first optoelectronic chip 26 and the second optoelectronic chip 28 primarily transfers to the second housing 50 , and the second housing 50 constitutes a primary heat-dissipation surface. Additionally, only a portion of the heat transfers to the first housing 48 , and the first housing 48 constitutes a secondary heat-dissipation surface.
  • the second housing 50 is specially designed for heat dissipation in order to better dissipate heat out of the housing 20 .
  • a thermal pad or thermal grease is arranged between the heat sink apparatus 22 and the housing 20 so as to better conduct the heat from the heat sink apparatus 22 to the housing 20 .
  • the thermal pad or thermal grease is arranged between the heat sink apparatus 22 and the second housing 50 .
  • a first thermal pad 52 is arranged between the first heat sink 44 and the second housing 50
  • a second thermal pad 54 is arranged between the second heat sink 46 and the second housing 50 .
  • the first thermal pad 52 and the first optoelectronic chip 26 are arranged on two opposing sides of the first heat sink 44 , and their positions correspond to each other.
  • a projection of the first thermal pad 52 onto the first surface 30 of the printed circuit board 24 overlaps at least partially with the projection of the first optoelectronic chip 26 onto the first surface 30 .
  • the second thermal pad 54 and the second optoelectronic chip 28 are arranged on two opposing sides of the second heat sink 46 , and their positions also correspond to each other.
  • the projection of the second thermal pad 54 onto the first surface 30 of the printed circuit board 24 overlaps at least partially with the projection of the second optoelectronic chip 28 onto the first surface 30 .
  • the first heat sink 44 and the second heat sink 46 form an integrated single structure.
  • the first heat sink 44 and the second heat sink 46 may also employ separate structures that are thermally connected to each other or that are separately thermally connected to the housing 20 .
  • the heat sink apparatus 22 formed with the first heat sink 44 and the second heat sink 46 has an L-shape, and such structure can cause the positions of the first optoelectronic chip 26 and the second optoelectronic chip 28 to be staggered in a transmission direction of an optical path so that optical and electrical signals can be conveniently isolated.
  • the L-shaped heat sink apparatus 22 can also, on the premise that it ensures heat dissipation, reduce usage of heat sinks and can also allow more layout space for the printed circuit board 24 to facilitate layout of elements.
  • the first heat sink 44 has a base 56 and a first protruding platform 58 , and the first optoelectronic chip 26 is arranged on the first protruding platform 58 .
  • the first optoelectronic chip 26 is arranged near one end of the printed circuit board 24 , and the first optoelectronic chip 26 is electrically connected to the printed circuit board 24 .
  • the second heat sink 46 has a second protruding platform 60 , and at least a portion of the second protruding platform 60 is located in opening 34 .
  • the second optoelectronic chip 28 is located on the second protruding platform 60 , and the second optoelectronic chip 28 is electrically connected to the printed circuit board 24 .
  • an external electrical interface 25 for realizing external electrical connections is arranged at the end of the printed circuit board 24 that is farther from the first optoelectronic chip 26 .
  • the external electrical interface 25 includes gold fingers.
  • the optical module 10 includes an optical interface 11 and an electrical interface 12
  • the first optoelectronic chip 26 is located on the end of printed circuit board 24 nearest to the optical interface 11 .
  • the positions of the first optoelectronic chip 26 and the second optoelectronic chip 28 are staggered along the direction of the line connecting the optical interface 11 and the electrical interface 12 .
  • the first optoelectronic chip 26 is a laser emitter
  • the second optoelectronic chip 28 is a photoelectric detector.
  • the first optoelectronic chip 26 may also be configured to be a photoelectric detector and the second optoelectronic chip 28 as a laser emitter.
  • the first optoelectronic chip 26 and the second optoelectronic chip 28 are both configured to be photoelectric detectors.
  • the first optoelectronic chip 26 and the second optoelectronic chip 28 are both configured to be laser emitters.
  • the first optoelectronic chip 26 and the second optoelectronic chip 28 are laser emitters or photoelectric detectors, there may also concurrently be drivers, optoelectronic signal detectors, or other elements.
  • the first optoelectronic chip 26 is a laser emitter
  • the second optoelectronic chip 28 is a photoelectric detector.
  • the laser emitter as an element that generates a large amount of heat, is arranged near the middle portion of the heat sink apparatus 22 for better heat-dissipation performance.
  • the laser emitter is located on one side of the printed circuit board 24 rather than arranged in the middle portion of the printed circuit board 24 , facilitating optical path design and assembly.
  • the cross section of the opening 34 in the direction parallel to the first surface 30 is a closed shape.
  • the opening 34 is a through-hole whose periphery forms a closed shape.
  • the cross section of the opening 34 in the direction parallel to the first surface 30 is square.
  • the cross section of the opening 34 in the direction parallel to the first surface 30 may also be configured to be other closed shapes.
  • the cross section of the opening 34 in the direction parallel to the first surface 30 may also be configured to be an open shape.
  • the cross section of the opening 34 in the direction parallel to the first surface 30 may be configured to be U-shaped or L-shaped.
  • the opening 34 may also be configured to be other open shapes.
  • the printed circuit board 24 is adhered on the heat sink apparatus 22 .
  • Other connecting methods may be used to fix the printed circuit board 24 on the heat sink apparatus 22 .
  • the printed circuit board 24 may be directly adhered on the heat sink apparatus 22 .
  • the printed circuit board 24 may be indirectly adhered on the heat sink apparatus 22 , in which case a thermally or electrically conductive medium may be arranged between the printed circuit board 24 and the heat sink apparatus 22 .
  • the first optoelectronic chip 26 and the second optoelectronic chip 28 are located on the same side of the heat sink apparatus 22 .
  • the first optoelectronic chip 26 and the second optoelectronic chip 28 are arranged on a same-side surface of the heat sink apparatus, and the first optoelectronic chip 26 and the second optoelectronic chip 28 are electrically connected to the same surface of the printed circuit board 24 .
  • the first optoelectronic chip 26 and the second optoelectronic chip 28 may also be arranged on different sides of the heat sink apparatus 22 , such as being arranged on opposite sides of the heat sink apparatus 22 .
  • the first optoelectronic chip 26 and the second optoelectronic chip 28 are arranged on different sides of the heat sink apparatus 22 , the first optoelectronic chip 26 is electrically connected to one of the surfaces of the printed circuit board 24 , and the second optoelectronic chip 28 is electrically connected to the other surface of printed circuit board 24 . In this way, signal transmission crosstalk is further reduced, and the quality of signal transmission is further increased.
  • a hole or groove is arranged on the first heat sink 44 to allow light to pass through.
  • An optical fiber may also be used to realize the connection of the optical path, etc.
  • a first electrical isolation pad 62 is arranged between the first optoelectronic chip 26 and the heat sink apparatus 22 .
  • the first electrical isolation pad 62 is thermally connected to the heat sink apparatus 22 and has an electrical isolation effect, thereby enabling heat generated by the first optoelectronic chip 26 to transfer to the housing 20 through the heat sink apparatus 22 to realize heat dissipation while achieving electrical isolation between the housing 20 , the heat sink apparatus 22 , and the first optoelectronic chip 26 . This stabilizes the performance of the optical module 10 and makes it safe to use.
  • an upper surface of the first electrical isolation pad 62 includes a material of low electrical conductivity and is electrically connected to the printed circuit board 24 , and the substrate and a lower surface of the first electrical isolation pad 62 include an electrically non-conductive material for electrical isolation from the heat sink apparatus 22 .
  • a second electrical isolation pad is arranged between the second optoelectronic chip 28 and the heat sink apparatus 22 , and the second electrical isolation pad is thermally connected to and electrically isolated from the heat sink apparatus 22 .
  • heat generated by the second optoelectronic chip 28 may transfer to the housing 20 through the heat sink apparatus 22 to realize heat dissipation while achieving electrical isolation between the housing 20 , the heat sink apparatus 22 , and the second optoelectronic chip 28 . This further stabilizes the performance of the optical module and makes it safer to use.
  • the heat sink apparatus 22 may itself be made of electrically isolating and highly thermally conductive materials so as to not require the use of electrical isolation pads.
  • FIGS. 7 through 12 schematically illustrate an optical module 200 consistent with a second exemplary embodiment of the disclosure.
  • FIG. 7 is a three-dimensional diagram of the optical module 200 in the second embodiment.
  • FIG. 8 is an exploded-view diagram of the optical module 200 in the second embodiment.
  • the optical module 200 includes a housing 68 , an optical interface system 88 arranged in housing 68 , a connector 90 into which the optical interface system 88 is plugged, and a pull ring 92 that is arranged on the housing 68 and used to unlock the optical module.
  • the optical module further includes a heat sink apparatus 70 and a printed circuit board 72 .
  • the heat sink apparatus 70 is arranged in the housing 68 and is thermally connected to the housing 68 , and the printed circuit board 72 is also arranged in the housing 68 . Similar to the first exemplary embodiment, in the second exemplary embodiment, the printed circuit board 72 is fixed to the housing 68 by snap-fitting, and the heat sink apparatus 70 is fixed with an adhesive to the housing 68 .
  • the printed circuit board 72 may be arranged in the housing 68 by other connecting methods; similarly, the heat sink apparatus 70 may be arranged in the housing 68 by other connecting methods as well.
  • FIG. 9 is a three-dimensional diagram of the printed circuit board 72 of the optical module 200 in FIG. 8 .
  • FIG. 10 is a three-dimensional diagram showing the printed circuit board 72 , the heat sink apparatus 70 , and optoelectronic chip area of the optical module 200 in the second exemplary embodiment.
  • FIG. 11 is a three-dimensional diagram of the optical module 200 in FIG. 10 from a different perspective.
  • FIG. 12 is a front view of the optical module 200 in FIG. 10 .
  • the printed circuit board 72 has a first surface 74 , a second surface 76 , and an accommodating space 82 located on the first surface 74 .
  • the first surface 74 and the second surface 76 are opposite to each other.
  • the printed circuit board 72 further includes a third surface 78 and a side surface 80 that connects the first surface 74 and the third surface 78 .
  • the third surface 78 is located between the first surface 74 and the second surface 76 and has a certain height difference from the first surface 74 .
  • the third surface 78 and the side surface 80 form the accommodating space 82
  • the heat sink apparatus 70 is partially located in the accommodating space 82 .
  • the accommodating space 82 is an accommodating recess.
  • the optical module 200 further includes a first optoelectronic chip 84 and a second optoelectronic chip 86 that are both arranged on the heat sink apparatus 70 and both electrically connected with the printed circuit board 72 . Additionally, at least a portion of the second optoelectronic chip 86 is located in the accommodating space 82 , and the second optoelectronic chip 86 and the first optoelectronic chip 84 are arranged separately from each other.
  • the heat sink apparatus 70 is partially located in the accommodating space 82 , at least a portion of the second optoelectronic chip 86 is located in the accommodating space 82 , and the heat sink apparatus 70 is located in between the second optoelectronic chip 86 and the printed circuit board 72 , so that heat generated by the first optoelectronic chip 84 and the second optoelectronic chip 86 is dissipated to the housing 68 through the heat sink apparatus 70 , resulting in a high heat-dissipation capability.
  • the second optoelectronic chip 86 is separated from the first optoelectronic chip 84 , thereby increasing the distance between the two optoelectronic chips, which greatly reduces the impact of signal crosstalk between the first optoelectronic chip 84 and the second optoelectronic chip 86 and also improves heat dissipation performance.
  • the heat sink apparatus 70 includes a first heat sink 94 and a second heat sink 96 that is thermally connected to the first heat sink 94 .
  • the first optoelectronic chip 84 is arranged on the first heat sink 94 .
  • At least a portion of the second heat sink 96 is located in the accommodating space 82 , and the second optoelectronic chip 86 is thermally connected to the second heat sink 96 . In this way, heat generated by the first optoelectronic chip 84 and the second optoelectronic chip 86 is caused to dissipate to the housing 68 through the first heat sink 94 and the second heat sink 96 , respectively.
  • the distance between the first optoelectronic chip 84 and the second optoelectronic chip 86 ensures a comparatively high heat-dissipation capability while further reducing the impact of signal crosstalk between the first optoelectronic chip 84 and the second optoelectronic chip 86 .
  • first heat sink 94 and the second heat sink 96 are separately arranged, and the second heat sink 96 is fixed with an adhesive and thermally connected to the first heat sink 94 .
  • the first heat sink 94 and the second heat sink 96 may also form an integrated single structure.
  • the housing 68 includes a first housing 98 and a second housing 99 that is connected to the first housing 98 , and the heat sink apparatus 70 is arranged near the second housing 99 . Therefore, heat generated by the first optoelectronic chip 84 and the second optoelectronic chip 86 primarily transfers to the second housing 99 , and the second housing 99 constitutes a primary heat-dissipation surface. Additionally, only a portion of the heat transfers to the first housing 98 . Therefore, the first housing 98 constitutes a secondary heat-dissipation surface.
  • a thermal pad (not illustrated) or thermal grease may also be arranged between the heat sink apparatus 70 and the housing 68 so as to better conduct the heat from the heat sink apparatus 70 to the housing 68 .
  • the cross section of the accommodating space 82 in the direction parallel to the first surface 74 is a closed shape.
  • the accommodating space 82 is a recess arranged on the printed circuit board 72 , and the accommodating space 82 does not penetrate all the way through and has a periphery that forms a closed shape.
  • the cross section of the accommodating space 82 in the direction parallel to the first surface 74 is square.
  • the cross section of the accommodating space 82 in the direction parallel to the first surface 74 may be configured to be other closed shapes.
  • the cross section of the accommodating space 82 in the direction parallel to the first surface 74 may also be configured to be an open shape.
  • the cross section of the accommodating space 82 in the direction parallel to the first surface 74 may be configured to be U-shaped or L-shaped.
  • the accommodating space 82 may also be configured to be other open shapes.
  • the first optoelectronic chip 84 is a transmitting-end chipset
  • the second optoelectronic chip 86 is a receiving-end chipset.
  • the first optoelectronic chip 84 may also be configured to be a receiving-end chipset and the second optoelectronic chip 86 to be a transmitting-end chipset.
  • the first optoelectronic chip 84 and the second optoelectronic chip 86 may both be configured to be transmitting-end chipsets, or the first optoelectronic chip 84 and the second optoelectronic chip 86 may both be configured to be receiving-end chipsets.
  • the printed circuit board 72 is adhered on heat sink apparatus 70 .
  • Other connecting methods may be used to connect the printed circuit board 72 on the heat sink apparatus 70 .
  • the first optoelectronic chip 84 and the second optoelectronic chip 86 are located on different sides of the heat sink apparatus 70 .
  • the first optoelectronic chip 84 and the second optoelectronic chip 86 are arranged on opposite sides of the heat sink apparatus 70 .
  • the first optoelectronic chip 84 and the second optoelectronic chip 86 may also be arranged on the same side of the heat sink apparatus 70 .
  • first optoelectronic chip 84 and the second optoelectronic chip 86 are located on different sides of the heat sink apparatus 70 , a hole or groove is arranged on the first heat sink 94 to allow light to pass through.
  • An optical fiber may also be used to realize the connection of the optical path.
  • a first electrical isolation pad 100 is arranged between the first optoelectronic chip 84 and the heat sink apparatus 70 .
  • the first electrical isolation pad 100 is thermally connected to and electrically isolated from the heat sink apparatus 70 , thereby enabling heat generated from the first optoelectronic chip 84 to transfer to the housing 68 through the heat sink apparatus 70 to realize heat dissipation while achieving electrical isolation between the housing 68 , the heat sink apparatus 70 , and the first optoelectronic chip 84 . This stabilizes the performance of the optical module and makes it safe to use.
  • a second electrical isolation pad (not illustrated) is arranged between the second optoelectronic chip 86 and the heat sink apparatus 70 , and the second electrical isolation pad is thermally connected to and electrically isolated from the heat sink apparatus 70 .
  • heat generated from the second optoelectronic chip 86 may transfer to the housing 68 through the heat sink apparatus 70 to realize heat dissipation while achieving electrical isolation between the housing 68 , the heat sink apparatus 70 , and the second optoelectronic chip 86 . This further stabilizes the performance of the optical module and makes it safer to use.
  • the first electrical isolation pad 100 is arranged between the first optoelectronic chip 84 and the first heat sink 94
  • the second electrical isolation pad is arranged between the second optoelectronic chip 86 and the second heat sink 96 .
  • FIGS. 13 and 14 schematically illustrate an optical module 300 consistent with a third exemplary embodiment of the disclosure.
  • FIG. 13 is an exploded-view diagram of the optical module 300 in the third embodiment of the present disclosure.
  • FIG. 14 is a three-dimensional diagram of a printed circuit board of the optical module 300 in FIG. 13 .
  • a printed circuit board 103 and an accommodating space 104 are constructed differently from those in the second exemplary embodiment, and the third example embodiment is otherwise identical to the second embodiment. The differences are described in detail below while the similarities will not be described again in detail.
  • the cross section of the accommodating space 104 in the direction parallel to the first surface 106 is an open shape.
  • the cross section of the accommodating space 104 in the direction parallel to a first surface 106 of the printed circuit board 103 is configured to be a straight line.
  • the printed circuit board 103 has a step that forms the accommodating space 104 .
  • the optical module 300 includes an optical interface 301 and an electrical interface 302 .
  • An end of the printed circuit board 103 nearest to the optical interface 301 forms a step circuit board 110 , and a step portion of the step circuit board 110 forms the accommodating space 104 that accommodates a second optoelectronic chip 114 .
  • the step circuit board 110 may be a rigid circuit board or a flexible circuit board.
  • the end of the printed circuit board 103 nearest to the optical interface 301 may connect to a flexible circuit board, and the flexible circuit board and the end of the printed circuit board 103 form the accommodating space 104 that accommodates the second optoelectronic chip 114 .
  • the first optoelectronic chip 112 is disposed near the printed circuit board 103 and is electrically connected to the printed circuit board 103
  • the second optoelectronic chip 114 is disposed near the step circuit board 110 and is electrically connected to the step circuit board 110
  • the configuration may also be that the first optoelectronic chip 112 is disposed near the step circuit board 110 and is electrically connected to the step circuit board 110 while, correspondingly, the second optoelectronic chip 114 is disposed near the printed circuit board 103 and is electrically connected to the printed circuit board 103 .
  • the first optoelectronic chip 112 is a transmitting-end chipset
  • the second optoelectronic chip 114 is a receiving-end chipset.
  • the first optoelectronic chip 112 may also be configured to be a receiving-end chipset and the second optoelectronic chip 114 to be a transmitting-end chipset.
  • the first optoelectronic chip 112 and the second optoelectronic chip 114 may both be configured to be transmitting-end chipsets, or the first optoelectronic chip 112 and the second optoelectronic chip 114 may both be configured to be receiving-end chipsets.
  • an opening is arranged on a printed circuit board, a second optoelectronic chip is arranged in the opening, and a first optoelectronic chip and the second optoelectronic chip are both arranged on a heat sink apparatus. Therefore, heat generated by the first optoelectronic chip and the second optoelectronic chip is dissipated to a housing through the heat sink apparatus, resulting in a high heat-dissipation capability.
  • the second optoelectronic chip is separated from the first optoelectronic chip, thereby increasing the distance between the two optoelectronic chips, which greatly reduces the impact of signal crosstalk between the first optoelectronic chip and the second optoelectronic chip.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Optical Couplings Of Light Guides (AREA)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12025842B2 (en) 2020-06-03 2024-07-02 Hisense Broadband Multimedia Technologies Co., Ltd Optical module

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD887991S1 (en) * 2018-03-06 2020-06-23 Adolite Inc. Optical module
JP7379854B2 (ja) * 2019-04-19 2023-11-15 住友電気工業株式会社 光トランシーバ
CN112578508A (zh) * 2019-09-29 2021-03-30 苏州旭创科技有限公司 光模块
CN110764202B (zh) * 2019-12-09 2024-02-09 亨通洛克利科技有限公司 一种400g光模块的结构
US11307368B2 (en) 2020-04-07 2022-04-19 Cisco Technology, Inc. Integration of power and optics through cold plates for delivery to electronic and photonic integrated circuits
US11320610B2 (en) 2020-04-07 2022-05-03 Cisco Technology, Inc. Integration of power and optics through cold plate for delivery to electronic and photonic integrated circuits
CN111474644A (zh) * 2020-05-13 2020-07-31 青岛海信宽带多媒体技术有限公司 一种光模块
CN113759472B (zh) * 2020-06-03 2023-01-24 青岛海信宽带多媒体技术有限公司 一种光模块
CN114488419B (zh) * 2020-10-23 2023-06-20 苏州旭创科技有限公司 一种光模块封装结构

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6773532B2 (en) * 2002-02-27 2004-08-10 Jds Uniphase Corporation Method for improving heat dissipation in optical transmitter
US20120103663A1 (en) 2010-10-29 2012-05-03 Shinko Electric Industries Co., Ltd. Wiring substrate, electronic device, and method of manufacturing wiring substrate
CN104465552A (zh) 2014-12-26 2015-03-25 苏州旭创科技有限公司 封装结构及光模块
CN104678515A (zh) 2015-02-11 2015-06-03 武汉锐奥特科技有限公司 用于单纤双向的光器件光路结构
CN104730656A (zh) 2015-04-01 2015-06-24 苏州旭创科技有限公司 光模块及其制造方法
CN105549163A (zh) 2016-02-02 2016-05-04 武汉电信器件有限公司 一种光互连组件
CN205232234U (zh) 2015-12-24 2016-05-11 中航海信光电技术有限公司 一种光模块
US20160198586A1 (en) * 2015-01-06 2016-07-07 Fujitsu Limited Different thermal zones in an opto-electronic module
US9496959B1 (en) 2015-07-01 2016-11-15 Inphi Corporation Photonic transceiving device package structure
US9641254B1 (en) * 2014-10-10 2017-05-02 Google Inc. Heat dissipation approach in chip on board assembly by using stacked copper microvias
US10171170B2 (en) 2015-12-23 2019-01-01 Global Technology Inc. Multi-channel parallel optical transceiver module

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4119363A (en) 1976-03-18 1978-10-10 Bell Telephone Laboratories Incorporated Package for optical devices including optical fiber-to-metal hermetic seal
US7070340B2 (en) * 2001-08-29 2006-07-04 Silicon Bandwidth Inc. High performance optoelectronic packaging assembly
JP2004179273A (ja) * 2002-11-26 2004-06-24 Nec Corp 半導体レーザチップ部品及びこれを用いた半導体レーザモジュール
JP2005316475A (ja) 2004-04-29 2005-11-10 Sumitomo Electric Ind Ltd 光トランシーバ
JP2008170636A (ja) 2007-01-10 2008-07-24 Nec Electronics Corp 半導体レーザモジュール
JP5428256B2 (ja) 2008-09-10 2014-02-26 日本電気株式会社 光モジュール及び光伝送方法
CN102129101B (zh) 2010-11-23 2012-10-17 武汉电信器件有限公司 带耦合透镜的高速蝶形封装管壳及光发射器组件、制造工艺
CN202513440U (zh) 2012-04-26 2012-10-31 无锡亮源激光技术有限公司 具电路板的串联式半导体激光器
TW201428925A (zh) * 2013-01-04 2014-07-16 矽品精密工業股份有限公司 光電模組結構
CN203164482U (zh) 2013-04-08 2013-08-28 青岛海信宽带多媒体技术有限公司 一种光模块
CN104111503A (zh) 2013-04-17 2014-10-22 鸿富锦精密工业（深圳）有限公司 光通讯模组
CN103364897B (zh) 2013-07-24 2015-08-12 苏州旭创科技有限公司 用于单模激光器耦合的透镜组
CN203838377U (zh) 2014-04-22 2014-09-17 武汉电信器件有限公司 一种并行传输光模块耦合/分光结构
JP6277851B2 (ja) 2014-05-08 2018-02-14 富士通株式会社 光モジュール
CN104503044B (zh) * 2014-12-31 2016-08-24 苏州旭创科技有限公司 光模块
CN204761934U (zh) * 2015-06-11 2015-11-11 中兴通讯股份有限公司 光模块散热装置
CN104934386B (zh) * 2015-06-16 2017-11-28 苏州旭创科技有限公司 封装结构及光模块
US9548817B1 (en) 2015-06-19 2017-01-17 Inphi Corporation Small form factor transmitting device
US9553671B1 (en) 2015-07-07 2017-01-24 Inphi Corporation Package structure for photonic transceiving device
CN205213227U (zh) * 2015-10-30 2016-05-04 武汉电信器件有限公司 一种cob的散热结构
CN105957846B (zh) * 2016-06-28 2019-06-14 青岛海信宽带多媒体技术有限公司 光模块
TWI583086B (zh) * 2016-07-18 2017-05-11 華星光通科技股份有限公司 光發射器散熱結構及包含其的光發射器

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6773532B2 (en) * 2002-02-27 2004-08-10 Jds Uniphase Corporation Method for improving heat dissipation in optical transmitter
US20120103663A1 (en) 2010-10-29 2012-05-03 Shinko Electric Industries Co., Ltd. Wiring substrate, electronic device, and method of manufacturing wiring substrate
CN102543913A (zh) 2010-10-29 2012-07-04 新光电气工业株式会社 布线衬底、电子装置和制造布线衬底的方法
US9641254B1 (en) * 2014-10-10 2017-05-02 Google Inc. Heat dissipation approach in chip on board assembly by using stacked copper microvias
US20160192533A1 (en) 2014-12-26 2016-06-30 InnoLightTechnology Corporation Packaging Structure and Optical Module Using the Same
CN104465552A (zh) 2014-12-26 2015-03-25 苏州旭创科技有限公司 封装结构及光模块
US20160198586A1 (en) * 2015-01-06 2016-07-07 Fujitsu Limited Different thermal zones in an opto-electronic module
CN104678515A (zh) 2015-02-11 2015-06-03 武汉锐奥特科技有限公司 用于单纤双向的光器件光路结构
CN104730656A (zh) 2015-04-01 2015-06-24 苏州旭创科技有限公司 光模块及其制造方法
US10018794B2 (en) 2015-04-01 2018-07-10 Innolight Technology (Suzhou) Ltd. Optical module and manufacturing method thereof
US9496959B1 (en) 2015-07-01 2016-11-15 Inphi Corporation Photonic transceiving device package structure
US10171170B2 (en) 2015-12-23 2019-01-01 Global Technology Inc. Multi-channel parallel optical transceiver module
CN205232234U (zh) 2015-12-24 2016-05-11 中航海信光电技术有限公司 一种光模块
CN105549163A (zh) 2016-02-02 2016-05-04 武汉电信器件有限公司 一种光互连组件

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12025842B2 (en) 2020-06-03 2024-07-02 Hisense Broadband Multimedia Technologies Co., Ltd Optical module

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US20220369450A1 (en) 2022-11-17
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US11432395B2 (en) 2022-08-30
CN110730599A (zh) 2020-01-24
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