US10355185B2 - Light emitting diode array package having a plurality of power source signals without limiting resistor - Google Patents

Light emitting diode array package having a plurality of power source signals without limiting resistor Download PDF

Info

Publication number
US10355185B2
US10355185B2 US15/855,727 US201715855727A US10355185B2 US 10355185 B2 US10355185 B2 US 10355185B2 US 201715855727 A US201715855727 A US 201715855727A US 10355185 B2 US10355185 B2 US 10355185B2
Authority
US
United States
Prior art keywords
led
pins
units
package
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US15/855,727
Other languages
English (en)
Other versions
US20190088841A1 (en
Inventor
Jen-Hung CHANG
Song-Yi HSIAO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harvatek Corp
Original Assignee
Harvatek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harvatek Corp filed Critical Harvatek Corp
Assigned to HARVATEK CORPORATION reassignment HARVATEK CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, JEN-HUNG, HSIAO, SONG-YI
Publication of US20190088841A1 publication Critical patent/US20190088841A1/en
Application granted granted Critical
Publication of US10355185B2 publication Critical patent/US10355185B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/18—Distinguishing marks on switches, e.g. for indicating switch location in the dark; Adaptation of switches to receive distinguishing marks
    • H01H9/181—Distinguishing marks on switches, e.g. for indicating switch location in the dark; Adaptation of switches to receive distinguishing marks using a programmable display, e.g. LED or LCD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024—Details of scanning heads ; Means for illuminating the original
    • H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
    • H04N1/02815—Means for illuminating the original, not specific to a particular type of pick-up head
    • H04N1/0288—Means for illuminating the original, not specific to a particular type of pick-up head using a two-dimensional light source, e.g. two-dimensional LED array

Definitions

  • the disclosure relates to a semiconductor package, and more particularly to a light emitting diode (LED) package.
  • LED light emitting diode
  • a conventional light emitting diode (LED) module 1 is configured to receive a power source signal Vcc, and includes a plurality of LED packages 11 and a plurality of limiting resistors 110 corresponding respectively to the LED packages 11 .
  • Each of the LED packages 11 includes a first LED 111 , which is connected in series with the respective one of the limiting resistors 110 , a second LED 112 and a third LED 113 .
  • the first, second and third LEDs 111 , 112 and 113 respectively have anodes that are electrically connected with each other for receiving the power source signal Vcc, and are activated by the power source signal Vcc to emit red light, green light and blue light, respectively.
  • the limiting resistor 110 is necessary for reducing the voltage across the first LED 111 .
  • the inclusion of the limiting resistors 110 may cause relatively high energy consumption which will lead to heat accumulation in the conventional LED module 1 .
  • the materials of the first, second third LEDs 111 , 112 and 113 may deteriorate in the long term, and efficiency of light emission for each of the LED packages 11 may thus diminish. To make matters worse, the LED packages 11 may even fail to function.
  • the incorporation of the limiting resistors 110 also induces more complicated circuit architecture and higher manufacturing cost.
  • an object of the disclosure is to provide an LED package that can alleviate at least one of the drawbacks of the prior art.
  • the LED package includes N number of first pins, six second pins, N number of LED units, and a substrate for dispositions of the N number of first pins, the six second pins and the N number of LED units thereon.
  • the first pins are configured to receive N number of power source signals, respectively, where N is one of four and six.
  • Each of the LED units includes a first LED, a second LED and a third LED.
  • Each of the first LED, the second LED and the third LED has a first terminal and a second terminal.
  • the first terminal of the first LED for each one of a (2j ⁇ 1) th one of the LED units and a (2j) th one of the LED units is electrically connected to a (2j ⁇ 1) th one of the first pins.
  • the first terminals of the second LED and the third LED for each one of the (2j ⁇ 1) th one of the LED units and the (2j) th one of the LED units are electrically connected to a (2j) th one of the first pins, where j is an integer greater than zero, and is smaller than or equal to N/2.
  • the second terminals of the first LED, the second LED and the third LED for the (2j ⁇ 1) th one of the LED units are electrically connected to a first one of the second pins, a second one of the second pins and a third one of the second pins, respectively, and the second terminals of the first LED, the second LED and the third LED for the (2j) th one of the LED units are electrically connected to a fourth one of the second pins, a fifth one of the second pins and a sixth one of the second pins, respectively.
  • An effect of the disclosure resides in that, by electrically connecting the first electrode of the first LED to one of the first pins, and by electrically connecting the first electrodes of the second LED and the third LED to another one of the first pins, an additional limiting resistor may be omitted.
  • FIG. 1 is a circuit diagram illustrating a convention LED module
  • FIG. 2 is a circuit diagram illustrating one embodiment of an LED package according to the disclosure.
  • FIG. 3 is a circuit diagram illustrating another embodiment of the LED package according to the disclosure.
  • a first embodiment of a light emitting diode (LED) package 20 includes N number of first pins.
  • N is equal to four, and four first pins Ni 1 , Ni 2 , Ni 3 and Ni 4 are thus included in the LED package 20 .
  • the LED package 20 further includes six second pins No 1 , No 2 , No 3 , No 4 , No 5 and No 6 , a substrate 24 , and N number of LED units, that is, four LED units 2 in this embodiment.
  • the four first pins Ni 1 -Ni 4 , the six second pins No 1 -No 6 , and the four LED units 2 are disposed on the substrate 24 .
  • the LED package 20 is a multi-pixel package.
  • Each of the second pins No 1 -No 6 serves as a respective one of external electrodes for the multi-pixel package, such as leads, contact pads or solder pads for the multi-pixel package.
  • a plurality of the LED packages 20 may be combined to form an LED module or an LED display.
  • the first pins Ni 1 -Ni 4 are configured to receive four power source signals VCC 1 , VCC 2 , VCC 3 and VCC 4 , respectively.
  • the voltages of the power source signals VCC 1 and VCC 3 are smaller than the voltages of the power source signals VCC 2 and VCC 4 .
  • Each of the power source signals VCC 1 -VCC 4 is provided by a respective one of constant-voltage power sources or by a respective one of constant-current power sources.
  • the power source signals VCC 1 -VCC 4 may have the same or different values, as independently controlled by the respective power sources.
  • Each of the LED units 2 includes a first LED 21 , a second LED 22 and a third LED 23 .
  • Each of the first LED 21 , the second LED 22 and the third LED 23 has a first terminal and a second terminal.
  • the first terminal of the first LED 21 for each one of a (2j ⁇ 1) th one of the LED units 2 and a (2j) th one of the LED units 2 is electrically connected to a (2j ⁇ 1) th one of the first pins Ni(2j ⁇ 1), where j is an integer greater than zero, and is smaller than or equal to N/2. In this embodiment, since N is equal to four, j is thus equal to one or two.
  • the first terminals of the second LED 22 and the third LED 23 for each one of the (2j ⁇ 1) th one of the LED units 2 and the (2j) th one of the LED units 2 are electrically connected to a (2j) th one of the first pins Ni(2j), where j is equal to one or two in this embodiment.
  • the first terminal of the first LED 21 for each one of the first one of the LED units 2 and the second one of the LED units 2 is electrically connected to the first one of the first pins Ni 1 .
  • the first terminals of the second LED 22 and the third LED 23 for each one of the first one of the LED units 2 and the second one of the LED units 2 are electrically connected to the second one of the first pins Ni 2 .
  • the second terminals of the first LED 21 , the second LED 22 and the third LED 23 for the (2j ⁇ 1) th one of the LED units 2 are electrically connected to a first one of the second pins No 1 , a second one of the second pins No 2 and a third one of the second pins No 3 , respectively.
  • the second terminals of the first LED 21 , the second LED 22 and the third LED 23 for the (2j) th one of the LED units 2 are electrically connected to a fourth one of the second pins No 4 , a fifth one of the second pins No 5 and a sixth one of the second pins No 6 , respectively.
  • the second terminals of the first LED 21 , the second LED 22 and the third LED 23 for each of the first one of the LED units 2 and a third one of the LED units 2 are electrically connected to the first one of the second pins No 1 , the second one of the second pins No 2 and the third one of the second pins No 3 , respectively.
  • the second terminals of the first LED 21 , the second LED 22 and the third LED 23 for each of the second one of the LED units 2 and a fourth one of the LED units 2 are electrically connected to the fourth one of the second pins No 4 , the fifth one of the second pins No 5 and the sixth one of the second pins No 6 , respectively.
  • the first terminal of each of the first LED 21 , the second LED 22 and the third LED 23 is an anode
  • the second terminal of each of the first LED 21 , the second LED 22 and the third LED 23 is a cathode.
  • the second LED 22 and the third LED 23 are made of indium gallium nitride (InGaN)
  • the first LED 21 is made of aluminium gallium indium phosphide (AlGaInP).
  • the first LED 21 emits red light
  • the second LED 22 emits green light
  • the third LED 23 emits blue light.
  • a second embodiment of the LED package 20 is illustrated which is similar to the first embodiment as shown in FIG. 2 and is different in that the LED package 20 of the second embodiment includes six first pins Ni 1 , Ni 2 , Ni 3 , Ni 4 , Ni 5 and Ni 6 configured to receive six power source signals VCC 1 , VCC 2 , VCC 3 , VCC 4 , VCC 5 and VCC 6 , and six LED units 2 . That is to say, N is equal to six, and j is equal to one, two or three.
  • the second terminals of the first LED 21 , the second LED 22 and the third LED 23 for each of a first one of the LED units 2 , a third one of the LED units 2 and a fifth one of the LED units 2 are electrically connected to the first one of the second pins No 1 , the second one of the second pins No 2 and the third one of the second pins No 3 , respectively.
  • the second terminals of the first LED 21 , the second LED 22 and the third LED 23 for each of a second one of the LED units 2 , a fourth one of the LED units 2 and a sixth one of the LED units 2 are electrically connected to the fourth one of the second pins No 4 , the fifth one of the second pins No 5 and the sixth one of the second pins No 6 , respectively.
  • the first LED 21 is independently controlled with respect to the second LED 22 and the third LED 23 , and is different from the first LED 111 of the LED package 11 as shown in FIG. 1 which is controlled together with the second LED 112 and the third LED 113 by an identical power source signal Vcc.
  • the limiting resistors 110 of the conventional LED module 1 which are introduced for mitigating the issue of electric leakage or burn-out due to excessive driving voltage applied to the first LEDs 111 may be omitted in the LED package 20 of this disclosure.
  • an LED module constituted by at least one LED package 20 of the disclosure may consume less energy compared with the conventional LED module 1 , so heat accumulation in the LED module may be reduced and reliability of the LED package 20 according to the disclosure may be promoted.
  • a simpler electric circuit architecture and a lower manufacturing cost may be achieved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
US15/855,727 2017-09-20 2017-12-27 Light emitting diode array package having a plurality of power source signals without limiting resistor Active US10355185B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW106132202A TWI636590B (zh) 2017-09-20 2017-09-20 發光二極體封裝
TW106132202 2017-09-20
TW106132202A 2017-09-20

Publications (2)

Publication Number Publication Date
US20190088841A1 US20190088841A1 (en) 2019-03-21
US10355185B2 true US10355185B2 (en) 2019-07-16

Family

ID=64453102

Family Applications (1)

Application Number Title Priority Date Filing Date
US15/855,727 Active US10355185B2 (en) 2017-09-20 2017-12-27 Light emitting diode array package having a plurality of power source signals without limiting resistor

Country Status (3)

Country Link
US (1) US10355185B2 (zh)
CN (1) CN109524528A (zh)
TW (1) TWI636590B (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04303884A (ja) * 1991-03-30 1992-10-27 Takiron Co Ltd Ｌｅｄ点灯回路
US20110210349A1 (en) * 2008-08-26 2011-09-01 Dingguo Pan Led multi-chip bonding die and light strip using the same
US20120235574A1 (en) * 2009-10-02 2012-09-20 Lecip Holdings Corporation Fluorescent lamp drive and a protection circuit therein

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006119274A (ja) * 2004-10-20 2006-05-11 Nec Lighting Ltd Ｌｅｄ表示装置および表示制御方法
TW201011944A (en) * 2008-09-12 2010-03-16 Ultrachip Inc Light emitting diode lamp with single current source
CN201262809Y (zh) * 2008-10-10 2009-06-24 上海金陵时威科技发展股份有限公司 一种led电子显示屏节能装置
CN101808443A (zh) * 2009-02-17 2010-08-18 能极电源(深圳)有限公司 Led显示屏供电方法及系统
CN202126823U (zh) * 2011-07-06 2012-01-25 黄水桥 一种新型led节能屏
US9119258B2 (en) * 2013-03-06 2015-08-25 General Electric Company Current split circuit for equally splitting current between parallel connected LED luminaire strings
TWI581238B (zh) * 2015-07-07 2017-05-01 Light emitting diode display system
CN106875857A (zh) * 2017-04-01 2017-06-20 深圳诚通光电科技有限公司 双电源供电的led显示模组及led显示屏

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04303884A (ja) * 1991-03-30 1992-10-27 Takiron Co Ltd Ｌｅｄ点灯回路
US20110210349A1 (en) * 2008-08-26 2011-09-01 Dingguo Pan Led multi-chip bonding die and light strip using the same
US20120235574A1 (en) * 2009-10-02 2012-09-20 Lecip Holdings Corporation Fluorescent lamp drive and a protection circuit therein

Also Published As

Publication number Publication date
TWI636590B (zh) 2018-09-21
US20190088841A1 (en) 2019-03-21
CN109524528A (zh) 2019-03-26
TW201916406A (zh) 2019-04-16

Similar Documents

Publication Publication Date Title
US9900095B2 (en) Lighting apparatuses and LED modules for both illumination and optical communication
US9012932B2 (en) White LED assembly with LED string and intermediate node substrate terminals
US20080218093A1 (en) Structure of AC light-emitting diode dies
US8304789B2 (en) Light emitting diode package
JP2011159495A (ja) 照明装置
US20180254265A1 (en) Micro- or nano-wire led light source comprising temperature measurement means
TWI398971B (zh) 發光二極體封裝結構
JP2016092373A (ja) 発光装置
JP2011171320A (ja) 発光装置及び照明装置
US11309298B2 (en) Light-emitting diode device with driving mechanism
US10355185B2 (en) Light emitting diode array package having a plurality of power source signals without limiting resistor
WO2017203989A1 (ja) 発光装置及び照明装置
JP2008293861A (ja) 発光装置アレイ及び照明装置
JP2014192313A (ja) Ｌｅｄ発光装置
KR20100038252A (ko) 백색 발광 다이오드 패키지
CN105591006A (zh) 覆晶式led封装体
WO2013076480A2 (en) Led light source with passive chromaticity tuning
US20110084617A1 (en) High reliability and long lifetime AC LED device
CN215680713U (zh) Led封装体、显示装置、灯具以及灯光系统
CN210073846U (zh) 发光二极管和灯具
KR101142539B1 (ko) 역방향 직렬접속된 발광셀 어레이가 구비된 교류용 발광다이오드 칩 구조
JP2018530152A (ja) 電子回路を備えるｌｅｄ光源
US11152357B2 (en) Rectifier diode encapsulation structure with common electrodes
KR101001242B1 (ko) 교류용 발광 다이오드
KR101803011B1 (ko) 발광 장치

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

AS Assignment

Owner name: HARVATEK CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHANG, JEN-HUNG;HSIAO, SONG-YI;REEL/FRAME:044500/0576

Effective date: 20171214

FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STPP Information on status: patent application and granting procedure in general

Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED

STCF Information on status: patent grant

Free format text: PATENTED CASE

FEPP Fee payment procedure

Free format text: PETITION RELATED TO MAINTENANCE FEES GRANTED (ORIGINAL EVENT CODE: PTGR); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4