US10327323B2 - Multi-layer cooling element - Google Patents

Multi-layer cooling element Download PDF

Info

Publication number
US10327323B2
US10327323B2 US15/509,601 US201515509601A US10327323B2 US 10327323 B2 US10327323 B2 US 10327323B2 US 201515509601 A US201515509601 A US 201515509601A US 10327323 B2 US10327323 B2 US 10327323B2
Authority
US
United States
Prior art keywords
metallization
carrier body
sintered
metallization layer
regions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US15/509,601
Other versions
US20170265294A1 (en
Inventor
Alexander Dohn
Roland Dilsch
Roland Leneis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceramtec GmbH
Original Assignee
Ceramtec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec GmbH filed Critical Ceramtec GmbH
Publication of US20170265294A1 publication Critical patent/US20170265294A1/en
Assigned to CERAMTEC GMBH reassignment CERAMTEC GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DILSCH, ROLAND, DOHN, ALEXANDER, LENEIS, ROLAND
Application granted granted Critical
Publication of US10327323B2 publication Critical patent/US10327323B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets

Definitions

  • the invention relates to a ceramic carrier body having cooling elements and having sintered metallization regions.
  • Air- or liquid-cooled ceramic carrier bodies made of Al 2 O 3 or AlN have a patterned metallization (Cu or Cu/Ni/Au, or W/Ni/Au), wherein the circuit components can be soldered directly thereon.
  • patterned metallization Cu or Cu/Ni/Au, or W/Ni/Au
  • additional circuit elements such as shielding, coils, or capacitors in the immediate vicinity of the components on the surface of the carrier.
  • the increased switching frequencies used today generate high-frequency interference which must be elaborately shielded to avoid EMC problems.
  • the problem addressed by the invention is therefore that of advancing the design of a ceramic carrier body with cooling elements and with sintered metallization regions in such a manner that more space is available for other circuit elements (coils, capacitors) and/or it is possible to accommodate the additional circuit elements which are necessary to shield the circuits.
  • the ceramic carrier body according to the invention is characterized by cooling elements and sintered metallization regions which are arranged in at least two metallization layers one above the other, wherein the carrier body has a surface on which are arranged, in a first metallization layer, the sintered metallization regions, which carry electronic components and/or are structured in such a manner that they form resistors or coils, and these metallization region are covered, together with the components and/or the resistors or coils, by a ceramic plate, wherein additional metallization regions of these sintered metallization regions are optionally arranged on the ceramic plate in additional metallization layers, each covered by a ceramic plate, wherein, on the uppermost ceramic plate, facing away from the cooling element, sintered metallization regions are arranged in a metallization layer to accommodate circuit elements.
  • At least one additional metallization layer is therefore incorporated between the circuit layer and the cooling layer (fins or a layer with liquid cooling medium).
  • This covered metallization can consist of the same material as the outer circuit layer, or of a different metal, preferably with a higher melting point.
  • a contact between the metallic elements on the outside and the inside can be made by vias (punched, laser drilled) or by structures which are drawn out to the edge of the ceramic and connected externally.
  • This inner layer can also be structured. It improves the disturbance reaction and can accommodate electronic components. Resistors and inductors can be realized by a suitable structuring and selection of a metal.
  • This inner layer can, together with the cover layer, form capacitors which are determined by the geometry and spacing.
  • the cooling elements are either fins on the carrier body or cooling channels in the interior of the carrier body.
  • the additional metallization layer(s) carries/carry electronic components, and/or is/are structured such that it/they form(s) resistors or coils.
  • the components in this case are incorporated into the metallization in such a manner that everything can be covered with a ceramic plate.
  • the metallization and/or the metallization layer is/are structured in such a manner that it/they form(s) resistors or coils, then the metallization forms a layer on which a ceramic plate can be easily placed.
  • the carrier body preferably is made of the ceramic materials aluminum oxide Al 2 O 3 or aluminum nitride AlN. Both materials have good thermal conductivity and are not electrically conductive. The metallization regions can be easily sintered to these materials.
  • the uppermost metallization layer used to accommodate the circuit elements, is preferably made of copper, and the inner metallization layers are preferably made of tungsten.
  • An inventive method for the production of a carrier body according to the invention is characterized in that, to produce a metallization layer after the ceramic carrier body with the cooling elements is produced,
  • vias can also be incorporated between the metallizations to create an electrical connection between the inner tungsten metallizations and the uppermost copper metallization.
  • FIG. 1 illustrates an embodiment of a carrier body.
  • a polished cooling element 1 with fins 10 made of AlN and having a size of 40 ⁇ 40 ⁇ 30 mm is coated 15 ⁇ m high, on the surface, with a tungsten/glass paste 2 in the form of a capacitor, by means of screen printing.
  • a complementary screen the remaining area is printed with an insulating paste 3 (which contains a glass or the same ceramic of which the cooling element is made).
  • the tungsten/glass paste 2 is printed at one point 4 up to the outer edge of the cooling element 1 .
  • the tungsten-glass paste 2 and the insulating paste 3 are subjected to binder removal at 500° C.
  • a polished ceramic plate 5 made of AlN and having dimensions of 40 ⁇ 40 ⁇ 2 mm is placed on the cooling element 1 , and/or on the debindered tungsten/glass paste 2 and the insulating paste 3 , and fired together with the printed cooling element 1 at 1300° C. in wet nitrogen-hydrogen.
  • the two ceramic parts i.e., the cooling element 1 with its fins 10 and the ceramic plate 5 —connect to each other.
  • the fired tungsten/glass paste 2 then forms an intermediate layer and/or a metallization of tungsten.
  • the intermediate layer is also called a metallization region, and forms a metallization layer.
  • a motif or a metallization is printed with copper paste 6 .
  • the thickness of the copper paste 6 is preferably between 15 and 300 ⁇ m.
  • the copper print and/or the copper paste 6 extends up to the outer edge 7 of the plate 5 , and is connected to the tungsten intermediate layer on the lateral surface by means of a further screen printing step with copper paste 6 .
  • the copper paste 6 and/or the copper metallization is fired in nitrogen at 910° C.
  • the invention therefore also describes a ceramic carrier body with cooling elements and with a circuit layer, consisting of sintered metallization regions for the purpose of accommodating circuit elements, wherein at least one additional metallization layer with sintered metallizations is arranged between the circuit layer and the carrier body, each of these additional metallizations being covered by a ceramic plate, wherein the metallizations of the circuit layer are sintered with the uppermost ceramic plate, which faces away from the cooling elements, and the sintered metallizations of the metallization layers are connected to the metallization of the circuit layer by vias, or electrically conductive structures which are drawn out to the edge of the ceramic and connected externally.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Semiconductor Lasers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

To provide more space for additional circuit elements (coils, capacitors) and/or to allow the accommodation of additional circuit elements required for shielding the circuits, the metallization regions are arranged one over the other in at least two metallization layers. The carrier body has a surface on which sintered metallization regions are arranged in a first metallization layer, said metallization regions carrying electronic components and/or being structured such that the metallization regions form resistors or coils. The metallization regions are covered, together with the components and/or the resistors or coils, by a ceramic plate, and optionally additional metallization regions are arranged in additional metallization layers on the ceramic plate and each metallization region is covered by a ceramic plate. Sintered metallization regions are arranged in a metallization layer for the purpose of accommodating circuit elements on the uppermost ceramic plate facing away from the cooling elements.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a U.S. national phase application filed under 35 U.S.C. § 371 of International Application No. PCT/EP2015/070618, filed Sep. 9, 2015, designating the United States, which claims priority from German Patent Application No. 10 2014 217 978.5, filed Sep. 9, 2014, which are hereby incorporated herein by reference in their entireties for all purposes.
The invention relates to a ceramic carrier body having cooling elements and having sintered metallization regions.
Air- or liquid-cooled ceramic carrier bodies made of Al2O3 or AlN have a patterned metallization (Cu or Cu/Ni/Au, or W/Ni/Au), wherein the circuit components can be soldered directly thereon. As the result of an increasing degree of miniaturization or increasing switching frequency in power components, it may be necessary to have additional circuit elements, such as shielding, coils, or capacitors in the immediate vicinity of the components on the surface of the carrier. The increased switching frequencies used today generate high-frequency interference which must be elaborately shielded to avoid EMC problems.
The problem addressed by the invention is therefore that of advancing the design of a ceramic carrier body with cooling elements and with sintered metallization regions in such a manner that more space is available for other circuit elements (coils, capacitors) and/or it is possible to accommodate the additional circuit elements which are necessary to shield the circuits.
According to the invention, this problem is addressed by the carrier body described in claim 1.
The ceramic carrier body according to the invention is characterized by cooling elements and sintered metallization regions which are arranged in at least two metallization layers one above the other, wherein the carrier body has a surface on which are arranged, in a first metallization layer, the sintered metallization regions, which carry electronic components and/or are structured in such a manner that they form resistors or coils, and these metallization region are covered, together with the components and/or the resistors or coils, by a ceramic plate, wherein additional metallization regions of these sintered metallization regions are optionally arranged on the ceramic plate in additional metallization layers, each covered by a ceramic plate, wherein, on the uppermost ceramic plate, facing away from the cooling element, sintered metallization regions are arranged in a metallization layer to accommodate circuit elements.
So as to make it possible to accommodate additional circuit elements (coils, capacitors), or additional circuit elements which are necessary for shielding the circuits, in the limited space, according to the invention at least one additional metallization layer is therefore incorporated between the circuit layer and the cooling layer (fins or a layer with liquid cooling medium). This covered metallization can consist of the same material as the outer circuit layer, or of a different metal, preferably with a higher melting point. A contact between the metallic elements on the outside and the inside can be made by vias (punched, laser drilled) or by structures which are drawn out to the edge of the ceramic and connected externally. This inner layer can also be structured. It improves the disturbance reaction and can accommodate electronic components. Resistors and inductors can be realized by a suitable structuring and selection of a metal. This inner layer can, together with the cover layer, form capacitors which are determined by the geometry and spacing.
The cooling elements are either fins on the carrier body or cooling channels in the interior of the carrier body.
In a preferred implementation according to the invention, the additional metallization layer(s) carries/carry electronic components, and/or is/are structured such that it/they form(s) resistors or coils. The components in this case are incorporated into the metallization in such a manner that everything can be covered with a ceramic plate. When the metallization and/or the metallization layer is/are structured in such a manner that it/they form(s) resistors or coils, then the metallization forms a layer on which a ceramic plate can be easily placed.
The carrier body preferably is made of the ceramic materials aluminum oxide Al2O3 or aluminum nitride AlN. Both materials have good thermal conductivity and are not electrically conductive. The metallization regions can be easily sintered to these materials.
The uppermost metallization layer, used to accommodate the circuit elements, is preferably made of copper, and the inner metallization layers are preferably made of tungsten.
An inventive method for the production of a carrier body according to the invention is characterized in that, to produce a metallization layer after the ceramic carrier body with the cooling elements is produced,
  • a) sub-regions of the surface of the carrier body are coated with a tungsten/glass paste by screen printing, wherein at least at one point, the tungsten/glass paste is printed up to the outer edge of the carrier body,
  • b) next, the non-coated areas are printed with an insulating paste and the tungsten/glass paste and the insulating paste are subjected to binder removal,
  • c) next, a polished ceramic plate is placed on the debindered pastes,
  • d) and then optionally the method steps a, b, and c are repeated, in which case the ceramic plate is printed, and
  • e) finally, to create lateral metallizations by means of another screen printing step with copper paste on the lateral surface of the carrier body, the inner tungsten metallizations are connected to the uppermost copper metallization.
The individual method steps are generally known. Instead of or in addition to the lateral metallizations, vias can also be incorporated between the metallizations to create an electrical connection between the inner tungsten metallizations and the uppermost copper metallization.
BRIEF DESCRIPTION OF THE DRAWING
FIG. 1 illustrates an embodiment of a carrier body.
 EXAMPLE
A polished cooling element 1 with fins 10 (see FIG. 1) made of AlN and having a size of 40×40×30 mm is coated 15 μm high, on the surface, with a tungsten/glass paste 2 in the form of a capacitor, by means of screen printing. By means of a complementary screen, the remaining area is printed with an insulating paste 3 (which contains a glass or the same ceramic of which the cooling element is made). The tungsten/glass paste 2 is printed at one point 4 up to the outer edge of the cooling element 1.
The tungsten-glass paste 2 and the insulating paste 3 are subjected to binder removal at 500° C. A polished ceramic plate 5 made of AlN and having dimensions of 40×40×2 mm is placed on the cooling element 1, and/or on the debindered tungsten/glass paste 2 and the insulating paste 3, and fired together with the printed cooling element 1 at 1300° C. in wet nitrogen-hydrogen. In this case, the two ceramic parts—i.e., the cooling element 1 with its fins 10 and the ceramic plate 5—connect to each other. The fired tungsten/glass paste 2 then forms an intermediate layer and/or a metallization of tungsten. The intermediate layer is also called a metallization region, and forms a metallization layer.
On the upper side of the plate 5 made of AlN, a motif or a metallization is printed with copper paste 6. The thickness of the copper paste 6 is preferably between 15 and 300 μm. The copper print and/or the copper paste 6 extends up to the outer edge 7 of the plate 5, and is connected to the tungsten intermediate layer on the lateral surface by means of a further screen printing step with copper paste 6.
The copper paste 6 and/or the copper metallization is fired in nitrogen at 910° C.
The invention therefore also describes a ceramic carrier body with cooling elements and with a circuit layer, consisting of sintered metallization regions for the purpose of accommodating circuit elements, wherein at least one additional metallization layer with sintered metallizations is arranged between the circuit layer and the carrier body, each of these additional metallizations being covered by a ceramic plate, wherein the metallizations of the circuit layer are sintered with the uppermost ceramic plate, which faces away from the cooling elements, and the sintered metallizations of the metallization layers are connected to the metallization of the circuit layer by vias, or electrically conductive structures which are drawn out to the edge of the ceramic and connected externally.

Claims (16)

The invention claimed is:
1. A ceramic carrier body, having cooling elements and having sintered metallization regions which are arranged in at least two metallization layers one above the other, wherein the carrier body has a surface on which are arranged, in a first metallization layer, sintered metallization regions used for forming components, one or more insulating regions provided in the plane of the first metallization layer and in areas where the sintered metallization regions are not formed, and these metallization regions and insulating regions are covered by a ceramic plate, wherein additional metallization regions of these sintered metallization regions are optionally arranged on the ceramic plate in one or more additional metallization layers, each covered by means of a ceramic plate, wherein, on the uppermost ceramic plate, facing away from the cooling elements, sintered metallization regions are arranged in a metallization layer to accommodate circuit elements,
wherein the sintered metallization regions on the uppermost ceramic plate comprise copper, an inner metallization region of the sintered metallization regions comprises tungsten, and the carrier body further comprises an electrically conductive structure comprising copper drawn around an edge of the ceramic plate and connecting the sintered metallization regions on the uppermost ceramic plate and the inner metallization region.
2. The carrier body according to claim 1, wherein the cooling elements are fins on the carrier body or cooling channels in the interior of the carrier body.
3. The carrier body according to claim 1, wherein the one or more additional metallization layers are used for forming components.
4. The carrier body according to claim 1, wherein the carrier body is made of the ceramic materials aluminum oxide Al2O3 or aluminum nitride AlN.
5. The carrier body according to claim 1, wherein the uppermost metallization layer for accommodating the circuit elements is made of copper, and the other inner metallization layers are made of tungsten.
6. A method for the production of a carrier body according to claim 1, wherein, to produce a metallization layer after the ceramic carrier body with the cooling elements is produced,
a) sub-regions of the surface of the carrier body are coated with a tungsten/glass paste by screen printing, wherein at least at one point, the tungsten/glass paste is printed up to the outer edge of the carrier body,
b) next, the non-coated areas are printed with an insulating paste and the tungsten/glass paste and the insulating paste are subjected to binder removal,
c) next, a polished ceramic plate is placed on the debindered pastes,
d) and then optionally the method steps a, b, and c are repeated, in which case the ceramic plate is printed, and
e) finally, to create lateral metallizations by means of another screen printing step with copper paste on the lateral surface of the carrier body, the inner tungsten metallizations are connected to the uppermost copper metallization.
7. The method according to claim 6, further comprising vias incorporated between the metallization layers for the purpose of electrical connection between the inner tungsten metallizations and the uppermost copper metallization.
8. The carrier body according to claim 1, further comprising a via connecting the metallization layer to accommodate circuit elements to at least one of the first metallization layer and the optional additional metallization layers.
9. A ceramic carrier body comprising:
a cooling element;
an inner sintered metallization layer formed on the cooling element, the inner sintered metallization layer being used for forming components;
one or more insulating regions provided in the plane of the inner sintered metallization layer and in areas where the inner sintered metallization layer is not formed;
an outer sintered metallization layer;
a ceramic plate formed between the inner sintered metallization layer and the outer sintered metallization layer,
wherein the outer sintered metallization layer comprises copper, the inner sintered metallization layer comprises tungsten, and the carrier body further comprises an electrically conductive structure comprising copper drawn around an edge of the ceramic plate and connecting the outer sintered metallization layer and the inner sintered metallization layer.
10. The carrier body of claim 9, further comprising a circuit element formed on the outer sintered metallization layer.
11. The carrier body of claim 9, wherein the cooling element comprises fins on the carrier body or cooling channels in the interior of the carrier body.
12. The carrier body of claim 9, further comprising one or more additional inner sintered metallization layers and one or more additional ceramic plates, the ceramic plates being disposed between the metallization layers.
13. The carrier body of claim 12, wherein at least one of the one or more additional inner sintered metallization layers is used for forming components.
14. The carrier body of claim 12, further comprising a via connecting the outer sintered metallization layer to at least one of the inner sintered metallization layers.
15. The carrier body of claim 9, wherein the carrier body comprises aluminum oxide or aluminum nitride.
16. The carrier body of claim 9, further comprising a via connecting the outer sintered metallization layer to the inner sintered metallization layer.
US15/509,601 2014-09-09 2015-09-09 Multi-layer cooling element Active US10327323B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102014217978 2014-09-09
DE102014217978.5 2014-09-09
DE102014217978 2014-09-09
PCT/EP2015/070618 WO2016038094A1 (en) 2014-09-09 2015-09-09 Multilayer cooler

Publications (2)

Publication Number Publication Date
US20170265294A1 US20170265294A1 (en) 2017-09-14
US10327323B2 true US10327323B2 (en) 2019-06-18

Family

ID=54105786

Family Applications (1)

Application Number Title Priority Date Filing Date
US15/509,601 Active US10327323B2 (en) 2014-09-09 2015-09-09 Multi-layer cooling element

Country Status (10)

Country Link
US (1) US10327323B2 (en)
EP (2) EP3489996B1 (en)
JP (1) JP6761800B2 (en)
KR (1) KR102421016B1 (en)
CN (1) CN106663665B (en)
DE (1) DE102015217231A1 (en)
HR (1) HRP20221031T1 (en)
HU (1) HUE059298T2 (en)
PL (1) PL3489996T3 (en)
WO (1) WO2016038094A1 (en)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058381A (en) 1998-08-13 2000-02-25 Murata Mfg Co Ltd Multilayer substrate having built-in capacitor
DE10035170A1 (en) 2000-07-19 2002-02-07 Siemens Ag Ceramic body, for use as substrate of active electronic component, comprises surface sections, thermal through-contacts connecting surface sections to exchange heat between sections, and tempering device
US20020025439A1 (en) 1999-01-26 2002-02-28 Murata Manufacturing Co., Ltd. Dielectric ceramic composition and multi layered ceramic substrate
US20020181185A1 (en) 2001-04-26 2002-12-05 Masanao Kabumoto Multi-layer wiring board
EP1320286A2 (en) 2001-12-13 2003-06-18 Harris Corporation Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods
US20030218870A1 (en) 2002-05-21 2003-11-27 Fisher Phillip S. Low temperature co-fired ceramic with improved shrinkage control
US20070158101A1 (en) * 2004-10-29 2007-07-12 Murata Manufacturing Co., Ltd. Multilayer substrate with built-in-chip-type electronic component and method for manufacturing the same
WO2007107601A2 (en) 2006-03-23 2007-09-27 Ceramtec Ag Carrier body for components or circuits
US20090199999A1 (en) * 2005-07-19 2009-08-13 Gerhard Mitic Electric Component with Two-Phase Cooling Device and Method for Manufacturing
US20100112372A1 (en) * 2007-04-24 2010-05-06 Claus Peter Kluge Component having a ceramic base the surface of which is metalized
US20100156251A1 (en) * 2006-04-19 2010-06-24 Eugen Hohmann Piezoelectric actuator and method for producing it

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267854A (en) * 1992-03-24 1993-10-15 Mitsubishi Materials Corp Ceramic multilayer circuit board and manufacture thereof
JPH06188569A (en) * 1992-12-18 1994-07-08 Denki Kagaku Kogyo Kk Multilayer wiring board
EP0693776B1 (en) * 1994-07-15 2000-05-31 Mitsubishi Materials Corporation Highly heat-radiating ceramic package
JP4493140B2 (en) * 2000-01-31 2010-06-30 京セラ株式会社 Multilayer circuit board
US6710433B2 (en) * 2000-11-15 2004-03-23 Skyworks Solutions, Inc. Leadless chip carrier with embedded inductor
WO2002043441A1 (en) 2000-11-24 2002-05-30 Ibiden Co., Ltd. Ceramic heater, and production method for ceramic heater
JP5093840B2 (en) * 2007-05-14 2012-12-12 株式会社住友金属エレクトロデバイス Multilayer wiring board for mounting light emitting device and method for manufacturing the same
JP5713578B2 (en) * 2010-04-06 2015-05-07 株式会社アテクト Substrate manufacturing method
CN102238848A (en) * 2010-04-27 2011-11-09 富瑞精密组件（昆山）有限公司 Heat dissipation device and airflow generator thereof
US8519532B2 (en) * 2011-09-12 2013-08-27 Infineon Technologies Ag Semiconductor device including cladded base plate
JP2013123014A (en) * 2011-12-12 2013-06-20 Toyota Industries Corp Semiconductor device

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058381A (en) 1998-08-13 2000-02-25 Murata Mfg Co Ltd Multilayer substrate having built-in capacitor
US20020025439A1 (en) 1999-01-26 2002-02-28 Murata Manufacturing Co., Ltd. Dielectric ceramic composition and multi layered ceramic substrate
DE10035170A1 (en) 2000-07-19 2002-02-07 Siemens Ag Ceramic body, for use as substrate of active electronic component, comprises surface sections, thermal through-contacts connecting surface sections to exchange heat between sections, and tempering device
US20020181185A1 (en) 2001-04-26 2002-12-05 Masanao Kabumoto Multi-layer wiring board
EP1320286A2 (en) 2001-12-13 2003-06-18 Harris Corporation Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods
US20030218870A1 (en) 2002-05-21 2003-11-27 Fisher Phillip S. Low temperature co-fired ceramic with improved shrinkage control
US20070158101A1 (en) * 2004-10-29 2007-07-12 Murata Manufacturing Co., Ltd. Multilayer substrate with built-in-chip-type electronic component and method for manufacturing the same
US20090199999A1 (en) * 2005-07-19 2009-08-13 Gerhard Mitic Electric Component with Two-Phase Cooling Device and Method for Manufacturing
WO2007107601A2 (en) 2006-03-23 2007-09-27 Ceramtec Ag Carrier body for components or circuits
US8040676B2 (en) * 2006-03-23 2011-10-18 Ceramtec Gmbh Carrier body for components or circuits
US20100156251A1 (en) * 2006-04-19 2010-06-24 Eugen Hohmann Piezoelectric actuator and method for producing it
US20100112372A1 (en) * 2007-04-24 2010-05-06 Claus Peter Kluge Component having a ceramic base the surface of which is metalized

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
International Search Report for PCT/EP2015/070618 dateed Dec. 7, 2015; English translation submitted herewith (7 Pages).

Also Published As

Publication number Publication date
HRP20221031T1 (en) 2022-11-11
EP3192097A1 (en) 2017-07-19
EP3192097B1 (en) 2019-11-06
WO2016038094A1 (en) 2016-03-17
PL3489996T3 (en) 2022-09-19
JP2017527123A (en) 2017-09-14
KR102421016B1 (en) 2022-07-13
US20170265294A1 (en) 2017-09-14
CN106663665B (en) 2019-09-03
EP3489996B1 (en) 2022-07-13
JP6761800B2 (en) 2020-09-30
DE102015217231A1 (en) 2016-03-10
EP3489996A1 (en) 2019-05-29
HUE059298T2 (en) 2022-11-28
CN106663665A (en) 2017-05-10
KR20170051505A (en) 2017-05-11

Similar Documents

Publication Publication Date Title
KR101670184B1 (en) Multilayered electronic component and manufacturing method thereof
US9412509B2 (en) Multilayer electronic component having conductive patterns and board having the same
KR101548862B1 (en) Chip type coil component and manufacturing method thereof
KR102052596B1 (en) Chip coil component and manufacturing method thereof
JP6777755B2 (en) High frequency substrates, high frequency packages and high frequency modules
US20150187486A1 (en) Multilayer electronic component and manufacturing method thereof
JP6151572B2 (en) Electronic device mounting substrate and electronic device
JP5694464B2 (en) Multilayer ceramic electronic component and multilayer ceramic electronic component mounting substrate
CN110612780A (en) Multi-connection wiring board, package for housing electronic component, and electronic device
US10327323B2 (en) Multi-layer cooling element
CN109155196B (en) Multilayer capacitor
JP6068157B2 (en) Multi-wiring board
JP6819603B2 (en) Multilayer ceramic substrate and its manufacturing method
JP5956185B2 (en) Multiple wiring board
JP2005243739A (en) Package for accommodating electronic component, and electronic equipment
JP4807098B2 (en) Package for semiconductor devices
JP2007150034A (en) Insulating base and electronic device equipped therewith
JP6208618B2 (en) Device mounting board and mounting structure
JP2012146940A (en) Electronic component and electronic device
JP2015103745A (en) Wiring board
JP2014007292A (en) Electronic component housing package and electronic device
JP2005159130A (en) Wiring board
JP6042773B2 (en) INPUT / OUTPUT TERMINAL, INPUT / OUTPUT TERMINAL MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT PACKAGE AND SEMICONDUCTOR DEVICE USING THE SAME
JP2007294798A (en) Laminated substrate, electronic apparatus, and manufacturing method for them
JP2008186965A (en) Multilayer wiring board and manufacturing method thereof, and electronic device using multilayer wiring board

Legal Events

Date Code Title Description
STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

AS Assignment

Owner name: CERAMTEC GMBH, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:DOHN, ALEXANDER;DILSCH, ROLAND;LENEIS, ROLAND;SIGNING DATES FROM 20190325 TO 20190328;REEL/FRAME:048996/0827

STPP Information on status: patent application and granting procedure in general

Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT RECEIVED

STCF Information on status: patent grant

Free format text: PATENTED CASE

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4