US10168112B2 - Heat exchanging apparatus and method for transferring heat - Google Patents

Heat exchanging apparatus and method for transferring heat Download PDF

Info

Publication number
US10168112B2
US10168112B2 US14/416,445 US201314416445A US10168112B2 US 10168112 B2 US10168112 B2 US 10168112B2 US 201314416445 A US201314416445 A US 201314416445A US 10168112 B2 US10168112 B2 US 10168112B2
Authority
US
United States
Prior art keywords
orifice
main
jet
heat
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US14/416,445
Other languages
English (en)
Other versions
US20150176927A1 (en
Inventor
Mikhail Spokoyny
Nick Ortenberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
COOL TECHNOLOGY SOLUTIONS Inc
Original Assignee
COOL TECHNOLOGY SOLUTIONS Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by COOL TECHNOLOGY SOLUTIONS Inc filed Critical COOL TECHNOLOGY SOLUTIONS Inc
Priority to US14/416,445 priority Critical patent/US10168112B2/en
Assigned to COOL TECHNOLOGY SOLUTIONS, INC. reassignment COOL TECHNOLOGY SOLUTIONS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ORTENBERG, NICK, SPOKOYNY, MIKHAIL
Publication of US20150176927A1 publication Critical patent/US20150176927A1/en
Application granted granted Critical
Publication of US10168112B2 publication Critical patent/US10168112B2/en
Expired - Fee Related legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/20—Jet mixers, i.e. mixers using high-speed fluid streams
    • B01F25/25—Mixing by jets impinging against collision plates
    • B01F5/0268—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an apparatus and a method for transferring heat between one or more heat transfer surfaces and a heat carrier medium in either a liquid or two-phase state, particularly for cooling of electronic devices.
  • Heat dissipation in technical devices particularly in electronic devices such as power electronic devices, microprocessors or lasers, imposes serious issues regarding the design of technical systems, particularly with respect to system integration and performance.
  • cooling measures are commonly applied. Owing to the increasing power density of such devices, cooling methods have steadily developed.
  • impingement jets which include jet streams of a cooling medium that are directed to a heat transfer surface.
  • the cooling medium experiences a significant turbulization in the vicinity of the heat transfer surface which might result in an uneven heat transfer from the heat transfer surface, so that localized hot spots with reduced heat transfer characteristics will occur. This effect is even more dominant for higher jet velocities and/or inlet pressures.
  • impingement jets For lower velocities, impingement jets have a more laminar flow with no or a low swirling tendency and therefore only a low heat transfer rate to the cooling medium due to the formation of a boundary layer between the jet and the heat transfer surface is obtained.
  • Embodiments of the present invention are indicated by a jet-flow heat exchanging device for transferring heat from or to one or more heat transfer surfaces, as well as systems and methods, embodiments of which are discussed herein.
  • a jet-flow heat exchanging device for transferring heat from or to one or more heat transfer surfaces, comprising:
  • One idea of the above jet-flow heat exchanging apparatus is to provide at least one main jet-stream and two respectively associated control jet-streams substantially flowing in parallel, wherein the control jet-streams are arranged in proximity of or around the main jet-stream to allow interacting with the main jet-stream so as to cause the heat carrier medium, such as a cooling medium, a coolant and the like, to swirl.
  • This swirling occurs because the main jet-stream dynamically changes its direction so as to wipe irregularly across an area of the heat transfer surface in a fan-like manner, wherein the area is substantially larger than the area which would be covered by the main jet-stream without the existence of the control jet-streams.
  • turbulization is achieved, i.e.
  • the flow direction of the one or more control jet-streams may be substantially equal to the flow direction of the main jet.
  • an area of a cross-section of one or more control orifices may have a size of about 1 to 60% of the area of the cross-section of an opening of the main orifice that is directed to the heat transfer surface.
  • control orifices are distanced from the main orifice by between 1% and 50% of a largest cross-sectional dimension of the main orifice.
  • the two or more control orifices may be symmetrically arranged around the associated main orifice, wherein the symmetry is at least with respect to a first cross-axis of the main orifice, wherein the first cross-axis is, in particular, substantially perpendicular to the heat transfer surface.
  • control orifices may be symmetrically arranged around the main orifice of a respective orifice group, wherein symmetry lines go through the geometrical center of the main orifice the number of which corresponds to the number of control orifices associated to the main orifice.
  • control orifices are offset from a selected one of the symmetry lines or a further symmetry line through the main orifice towards the heat transfer surface, wherein the two control orifices are located between the selected or further symmetry line and the heat transfer surface, causing the main jet stream to flow in a curved manner towards the heat transfer surface.
  • each of the main orifices and each of the control orifices of each orifice group have a cross-section selected from a square, rectangular, triangular, circular and elliptical cross-section.
  • the main orifice within an orifice group may be of any shape in any orientation. Shape, size, and orientation (of the cross-sectional shape with respect to the flow direction) of the main orifice are dictated by the shape, size and location of the local spot onto heat transfer surface that this particular orifice group is servicing.
  • Each control orifice within an orifice group may be of any shape in any orientation. Shape, size, and orientation of each control orifice are dictated by the shape, size and location of the local spot onto heat transfer surface that this particular orifice group is servicing.
  • At least one of the main orifices and/or one or more of the control orifices within at least one of the orifice groups are tapered.
  • an orifice can be tapered either in the downstream or in the upstream direction.
  • one or more orifice groups may be supplied by an inlet manifold having a common volume to supply the heat carrier medium to each orifice within each orifice group under substantially the same pressure.
  • one or more of the orifice groups are incorporated in a orifice plate in a straight alignment extending substantially parallel to the heat transfer surface.
  • one or more of the heat transfer surfaces are included in an enclosure through which the heat carrier medium is passed.
  • One or more of the heat transfer surfaces may include one or more protrusions and/or one or more dimples arranged relative to one of the orifice groups, so that the main jet-stream of at least one of the orifice groups engages with the one or more protrusions and/or the one or more dimples.
  • arrangements of one or more aligned pins are located downstream of at least one of the control orifices of at least one of the orifice groups along the control jet-stream path, and/or wherein arrangements of one or more aligned pins are located downstream of the main orifice of at least one of the orifice groups along the main jet-stream path.
  • one or more chambers may be provided which include one or more heat transfer surface, wherein the one or more chambers are limited by at least one orifice plate including the one or more orifice groups.
  • a plurality of chambers may be arranged within an enclosure of a housing of the device either in series or in parallel or in a combination of parallel and serial arrangement.
  • a system comprising:
  • a method for transferring heat from or to one or more heat transfer surfaces comprising the steps of:
  • FIG. 1 shows a cross-sectional view of a first heat exchanging apparatus
  • FIG. 2 shows a cross-sectional view of an orifice arrangement for providing a main jet-stream and two control jet-streams
  • FIG. 3 shows a perspective cross-sectional view of a heat exchanging apparatus illustrating the flow direction of the main jet-stream in the embodiment of FIG. 1 ;
  • FIGS. 4 a to 4 k show cross-sectional views through orifice plates of different types for providing the swirling jet stream
  • FIG. 5 shows a perspective cross-sectional view of a heat exchanging device with orifice groups of different types
  • FIG. 6 shows a cross-sectional view of the orifice plate with a reduced number of control orifices for providing the swirling jet-streams
  • FIG. 7 shows a cross-sectional view of a second heat exchanging apparatus with two heat transfer surfaces
  • FIG. 8 shows a cross-sectional view of the orifice groups for the second heat exchanging apparatus of FIG. 7 ;
  • FIG. 9 shows a cross-sectional view of a third heat exchanging apparatus
  • FIGS. 10 a and 10 b show orifice groups for generating opposing swirling jet streams differently distanced from the heat transfer surface
  • FIG. 11 shows a cross-sectional view of a fourth heat exchanging apparatus with a heat transfer surface being provided with a structure
  • FIG. 11 a shows a perspective cross-sectional view of one type of the fourth heat exchanging device with pins as structure of the heat transfer surface located in the flow path of the control jet-streams;
  • FIG. 11 b shows a top cross-sectional view on the heat exchanging device of FIG. 11 a;
  • FIG. 11 c shows a perspective cross-sectional view of another type of the fourth heat exchanging device with pins as structure of the heat transfer surface located in the flow path of the control jet-streams and pins located in the flow path of the main jet-stream;
  • FIG. 11 d shows a top cross-sectional view on the heat exchanging device of FIG. 11 c;
  • FIG. 12 shows a cross-sectional view of a fifth heat exchanging apparatus with two heat transfer surfaces
  • FIGS. 13 a and 13 b show the arrangements of outlet arrangements for providing two opposing swirling jet streams
  • FIG. 14 shows a cross-sectional view of a sixth heat exchanging apparatus, wherein the enclosure is separated into a number of cells;
  • FIG. 14 a shows a top cross-sectional view onto the sixth heat exchanging apparatus of FIG. 14 ;
  • FIG. 15 shows a cross-sectional view of a seventh heat exchanging apparatus, wherein the cross-section of the orifices is tapered
  • FIG. 16 shows a cross-sectional view of the orifice plate of the seventh heat exchanging apparatus of FIG. 15 ;
  • FIG. 17 shows a cross-sectional view of an eighth heat exchanging apparatus providing a main jet-stream and control jet-streams flowing in opposite directions.
  • FIGS. 18 a and 18 b show the cross-sectional views of the orifice plates for generating main jet-stream and control jet-streams flowing in opposite directions.
  • FIG. 1 shows a cross-sectional view depicting an exemplary embodiment of a first heat exchanging apparatus 100 having a housing 101 .
  • the housing 101 may be formed by two housing plates 102 being spaced apart by an enclosure element 108 encompassing a chamber 104 to form an enclosure with a closed volume.
  • One of the housing plates 102 forming the housing 101 is provided as a thermal coupling wall having a high thermal conductivity.
  • the thermal coupling wall is used for coupling to a device from or to which heat shall be transferred, such as a heat source device, e.g. an electronic semiconductor device or an integrated circuit device.
  • the thermal coupling wall has an inner surface which serves as a heat transfer surface 120 .
  • a heat carrier medium in either liquid, such as water, or ethylene glycol, or propylene glycol, or two-phase state (liquid-gas or liquid-vapor) is forced to flow through the chamber 104 of the housing 101 .
  • the heat carrier medium can be a coolant or a cooling liquid.
  • the heat carrier medium is supplied to the first heat exchanging apparatus 100 through the supply port 110 and is discharged from the chamber 104 through the discharge port 109 .
  • the supply port 110 and the discharge port 109 are fed through one of the housing plates 102 .
  • the supply port 110 and the discharge port 109 are fed through the housing plate 102 which is not carrying the heat transfer surface 120 .
  • the supply port 110 and the discharge port 109 might be fed through enclosure element 108
  • an inlet manifold 103 is formed by partitioning the enclosure within the housing 101 by means of an orifice plate 105 . So the chamber 104 and the inlet manifold 103 form different partitions of the enclosure of the housing 101 .
  • the inlet manifold 103 is directly connected to the inlet of the supply port 110 .
  • the orifice plate 105 provides through-holes 106 , 107 connecting the inlet manifold 103 to the chamber 104 .
  • the through-holes 106 , 107 are configured to form orifices, so that the heat carrier medium in the inlet manifold 103 , which is forced to flow through the through-holes 106 , 107 in the orifice plate 105 , forms a jet-stream of the heat carrier medium in the chamber 104 .
  • the through-holes are substantially cylindrically in shape.
  • the orifice plate 105 comprises one or more orifice groups 115 , one type of which is exemplarily shown in FIG. 2 .
  • FIG. 2 shows a cutout cross-sectional view of the orifice plate 105 along the cutting plane A-A.
  • the illustrated orifice group 115 comprises a main orifice 106 (also referred to as main nozzle) as one type of through-hole and two control orifices 107 (also referred to as supplementary nozzle) as another type of the through-holes arranged around the main orifice 106 .
  • the control orifices 107 have a substantially smaller cross-section area (perpendicular to the flow axis) which may be about 10% of the cross-section area of the main orifice 106 .
  • the cross-section area of the control orifices 107 may be about 1% to 50% of the cross-section area of the main orifice 106 , preferable 5% to 30%, more preferred 10% to 20%.
  • the distance (center to center) between the main orifice 106 and the control orifices 107 is between 1% and 80% of a largest cross-sectional dimension of the main orifice, particularly between 1% and 50%, particularly between 1% and 30%, particularly between 5% and 20%.
  • control orifices 107 are arranged symmetrically around a first axis (first symmetry line) 121 through a (geometrical) center of the main orifice 106 , wherein the first axis 121 is perpendicular to the flow direction through the main orifice 106 and perpendicular to the heat transfer surface 120 in the chamber 104 .
  • a second axis (second symmetry line) 122 going through the center of the main orifice 106 and being perpendicular to the first axis 121 and to the flow direction is provided, wherein the control orifices 107 are offset from the second axis 122 towards the heat transfer surface 120 .
  • a plurality of orifice groups 115 can be provided in the orifice plate 105 which are arranged along the orifice plate 105 along the direction of the heat transfer surface 120 .
  • the plurality of orifice groups 115 can be provided in the orifice plate 105 and be aligned in parallel to the heat transfer surface 120 .
  • a heat carrier medium ant is supplied via the supply port 110 to pass via the inlet manifold 103 and through the orifices 106 , 107 in the orifice plate 105 to the chamber 104 . After being received in the chamber 104 , the heat carrier medium is discharged through a discharge port 109 carrying away heat received from the heat transfer surface 120 .
  • FIG. 3 a perspective view of the interior of the housing 101 of the first heat exchanging apparatus 100 is shown. It can be seen that a portion of the orifice plate 105 separates the inlet manifold 103 and the chamber 104 .
  • the orifice plate 105 is illustrated with one exemplary orifice group 115 having one main orifice 106 and two laterally displaced control orifices 107 . In this merely exemplary embodiment, both the cross-sections of the main orifice 106 and the control orifices 107 have a rectangular shape.
  • the inlet manifold 103 When heat carrier medium is supplied via the supply port 110 , the inlet manifold 103 is pressurized, so that the heat carrier medium is forced to flow through the main orifice 106 and the control orifices 107 with substantially the same pressure.
  • the heat carrier medium flowing through the main orifice 106 forms a main jet-stream indicated by the dashed arrows F and the heat carrier medium flowing through the control orifices 107 forms control jet-streams indicated by the dashed lines C.
  • the present arrangement of the control orifices 107 in association with the main orifice 106 exhibits two important effects:
  • FIGS. 4 a to 4 k show different configurations of orifice groups 115 including the main orifice 106 and the control orifices 107 to be arranged in the orifice plate 105 .
  • the orifice groups 115 differ with respect to the cross-sectional shape of the orifices, the displacement of the whole orifice group 115 with respect to the heat transfer surface 120 , the orientations of the cross-sectional shapes of the main orifice 106 and/or the control orifices 107 , and the offset of the control orifices 107 with respect to the second axis 122 .
  • FIG. 4 a shows a configuration where the main orifice 106 and the control orifices 107 both have a circular cross-section (in the flow direction), wherein the outer walls of the control orifices 107 abut the outer wall of the main orifice 106 with the control orifices 107 being symmetrically arranged with respect to the first axis 121 and offset with respect to the second axis 122 .
  • the cross-sectional shapes of the main orifice 106 and the control orifices 107 are square, with the control orifices 107 being symmetrically arranged with respect to the first axis 121 and offset from a second axis 122 .
  • the main orifice 106 and the control orifices 107 still have square cross-sections, while a first axis 121 is inclined towards the heat transfer surface 120 .
  • the control orifices 107 are symmetrically arranged with respect to the first axis 121 and arranged on the second axis 122 (no offset), with both axes 121 , 122 going through a center of the main orifice 106 and being perpendicular to the flow direction.
  • FIG. 4 d shows an orifice group 115 where the main orifice 106 and the control orifices 107 are arranged in the orifice plate 105 , both having edges which are aligned with the heat transfer surface 120 or the end of the orifice plate 105 in offset displacement direction, respectively.
  • FIG. 4 e shows a main orifice 106 having a rectangular shape in cross-section, with the control orifices 107 being arranged symmetrically along the first axis 121 and offset from a second axis 122 having a circular cross-sectional shape.
  • the rectangular-shaped cross-section of the main orifice 106 has its longer dimension parallel to the heat transfer surface 120 and its shorter dimension in a direction perpendicular to the heat transfer surface 120 .
  • FIG. 4 f shows an arrangement where the rectangular-shaped cross-section of the main orifice 106 abuts the heat transfer surface 120 , while two control orifices 107 are arranged symmetrically with respect to the first axis 121 and along the second axis 122 , having no offset therefrom.
  • the main orifice 106 has an elliptical shape in cross-section, while the longer dimension of the elliptical shape is parallel to the heat transfer surface 120 .
  • the control orifices 107 are arranged symmetrically with respect to the first axis 121 and offset from the second axis 122 and have a rectangular cross-sectional shape, also with its longer dimension parallel to a heat transfer surface 120 .
  • FIG. 4 h shows the main orifice 106 having an elliptical shape with a longer dimension parallel to the heat transfer surface 120 and with control orifices 107 having an edge which abuts either the heat transfer surface 120 or an end in direction of the offset displacement, respectively.
  • FIG. 4 i shows an orifice group 115 with a main orifice 106 having an elliptical shape in cross-section, with its longer dimension parallel to the heat transfer surface 120 and with control orifices 107 symmetrically arranged with respect to the first axis 121 and offset from a second axis 122 , wherein the control orifices 107 have an elliptical shape with its longer dimension perpendicular to the heat transfer surface 120 , i.e. perpendicular to the direction of the longer dimension of the main orifice 106 .
  • FIG. 4 j shows an orifice group 115 with a main orifice 106 having a rectangular shape in cross-section, with its longer dimension perpendicular to the heat transfer surface 120 and with control orifices 107 symmetrically arranged with respect to the first axis 121 and offset from a second axis 122 perpendicular thereto, wherein the control orifices 107 have a rectangular shape with its longer dimension in parallel to the heat transfer surface 120 , i.e. perpendicular to the direction of the longer dimension of the main orifice 106 .
  • FIG. 4 k shows an orifice group 115 with a main orifice 106 having a circular shape in cross-section and three circular control orifices 107 symmetrically arranged with respect to the three symmetry axes (symmetry lines) 131 , 132 133 arranged by an angle of 60° with respect to each other.
  • Each two of the control orifices 107 are symmetrically arranged with respect to one of the symmetry axes.
  • this concept is adaptable to different cross-section shapes and orientations of the orifices 106 , 107 and scalable to more than three control orifices 107 being symmetrically arranged around the main orifice 106 with respect to a corresponding number of symmetry axes.
  • FIG. 5 a perspective view of the interior of the heat exchanging apparatus 100 is shown with the orifice plate 105 having orifice groups 115 with orifices having different shapes, arrangements and displacements with respect to each other. It can be seen that the swirling of the main jet-stream F can be achieved irrespective of the (cross-sectional) shape the main orifice 106 or the control orifices 107 .
  • two neighboring orifice groups 115 can be configured to overlap, so that for a first orifice group 115 , the control orifices 107 have an offset towards the heat transfer surface 120 with respect to the second axis 122 , wherein the neighboring orifice group 115 has control orifices 107 which are offset with respect to the second axis 122 away from the heat transfer surface 120 .
  • This may lead to an overlapping of control orifices 107 of neighboring orifice groups 115 in the direction of alignment of the orifice groups 115 .
  • the orifice groups 115 can be as shown in FIG. 6 , i.e. having two or more adjacent main orifices 106 wherein each two of the main orifices 106 are serviced by one common control orifice 107 ′ located between the two adjacent main orifices 106 .
  • Common control orifices 107 ′ which are located between two adjacent main orifices 106 can have a different shape (rectangular in FIG. 6 ) and an orientation of its longer cross sectional dimension perpendicular to the direction of alignment of the main orifices 106 .
  • control orifices 107 which are not commonly associated to two adjacent main orifices may have different offsets from a cross axis (symmetry line of the main orifices). Such an arrangement may particularly replace configurations of overlapping control orifices 107 , as indicated in the embodiment of FIG. 5 . According to one embodiment the control orifices are located with the same distance from the two adjacent main orifices 106 .
  • a second heat exchanging apparatus 200 is shown having elements substantially similar to those of the first heat exchanging apparatus 100 . Identical elements or elements having a similar function are indicated by identical two last numbers in the reference signs.
  • the second heat exchanging apparatus 200 has two housing plates 202 spaced apart by an enclosure element 208 forming an enclosure with an inlet manifold 203 and a chamber 204 .
  • An orifice plate 205 having orifice groups 215 a , 215 b is provided to separate the inlet manifold 203 from the chamber 204 .
  • a supply port 210 is arranged at the enclosure element 208 which encompasses the chamber 204 and the inlet manifold 203 , while the discharge port 209 is also arranged substantially on an end opposite the enclosure element 208 .
  • the control jet-streams C generated by the control orifices 207 a , 207 b cause a constant dynamic pressure imbalance with respect to the main jet-stream F. Since the control jet-streams C are close to the main jet-stream F, the pressure imbalances interact with the main jet-stream F, so that the main jet-stream F alternatively swings between the stream paths 211 a , 212 a , 213 a , 211 b , 212 b and 213 b creating the swirling jets 214 a , 214 b.
  • orifice plate 205 may contain two sets of orifice groups 215 , each associated with one of the heat transfer surfaces 220 .
  • FIG. 8 a cutout cross-sectional view along the cutting plane A-A is shown and it can be seen that two main orifices 206 a , 206 b of two orifice groups 215 a , 215 b are shown, each of which is accompanied by two control orifices 207 a , 207 b .
  • the control orifices 207 a , 207 b are offset from their second axes 222 a , 222 b in different directions so as to curve the swirling jets 214 a , 214 b towards a respective one of the heat transfer surfaces 220 .
  • FIG. 9 a third heat exchanging apparatus 300 is illustrated having elements substantially similar to those of the first heat exchanging apparatus 100 . Identical elements or elements having a similar function are indicated by identical last two numbers in the reference signs.
  • the third heat exchanging apparatus 300 has two housing plates 302 spaced apart by an enclosure element 308 forming an enclosure of a housing 301 with a first and a second inlet manifold 303 a , 303 b and a chamber 304 between the first and the second inlet manifold 303 a , 303 b .
  • a first orifice plate 305 a to separate the first inlet manifold 303 a from the chamber 304 and having orifice groups 315 a , 315 b is provided.
  • a first and a second supply port 310 a , 310 b are arranged at opposite ends of the enclosure element 308 which encompasses the chamber 304 and the inlet manifolds 303 a , 303 b to supply heat carrier medium into the inlet manifolds 303 a , 303 b .
  • a discharge port 309 is provided through one of the housing plates 302 opposite to the heat transfer surface 320 to discharge the heat carrier medium from the chamber 304 .
  • Each of the orifice plates 305 a , 305 b has a plurality of orifice groups 315 a , 315 b aligned substantially parallel to the heat transfer surface 320 .
  • the orifice groups 315 a , 315 b each have a main orifice 306 a , 306 b and control orifices 307 a , 307 b associated thereto, respectively.
  • the control jet-streams C generated by the control orifices 307 a , 307 b cause a constant dynamic pressure imbalance with respect to the main jet-stream F. Since the control jet-streams C are close to the main jet-stream F, the pressure imbalances interact with the main jet-stream F, so that the main jet-stream F alternatively swings between the stream paths 311 a , 312 a , 313 a , 311 b , 312 b and 313 b creating the swirling jets 314 a , 314 b.
  • FIGS. 10 a and 10 b show cross-sectional views of the first and second orifice plates 305 a , 305 b along the cutting planes A-A and B-B, respectively. It can be seen that the first orifice plate 305 a ( FIG. 10 a ) on the left-hand side has its orifice groups 315 a displaced from the heat transfer surface 320 with a smaller distance than the orifice groups 315 b of the second orifice plate 305 b on the right-hand side.
  • the resulting swirling jets 314 a , 314 b are directed towards each other, but impinge on the heat transfer surface 320 at different angles due to the different distance of the respective orifice groups 315 a , 315 b from the heat transfer surface 320 .
  • FIG. 11 shows a fourth heat exchanging apparatus 400 which is similar to the third heat exchanging apparatus 300 of FIG. 9 .
  • identical elements or elements having a similar function are indicated by identical last two numbers in the reference signs.
  • the fourth heat exchanging apparatus 400 has two housing plates 402 spaced apart by an enclosure element 408 which encompasses a chamber 404 and forming an enclosure of a housing 401 .
  • the enclosure of the housing 401 includes a first and a second inlet manifold 403 a , 403 b and the chamber 404 between a first and the second orifice plates 405 a , 405 b .
  • a first orifice plate 405 a incorporates one or more orifice groups 415 a , each consisting of main orifice 406 a and two or more control orifices 407 a per each main orifice 406 a .
  • the second orifice plate 405 b incorporates one or more orifice groups 415 b , each consisting of main orifice 406 b and two or more control orifices 407 b per each main orifice 406 b .
  • a first and a second supply port 410 a , 410 b are arranged at opposite ends of the housing 401 and supply the heat carrier medium into the inlet manifolds 403 a and 403 b .
  • a discharge port 409 is provided through the housing plate 402 , opposite the heat transfer surface 420 to discharge the heat carrier medium from the chamber 404 .
  • the corresponding orifice groups 415 a , 415 b including the main orifices 406 a , 406 b and the control orifices 407 a , 407 b are arranged as shown in FIGS. 10 a and 10 b.
  • the heat transfer surface 420 is provided with one or more pin 416 as elevated structures.
  • the heat transfer surface 420 may be provided with a structure of elevated pins 416 arranged, for at least one orifice group 415 , two rows of a plurality of pins (here 3) aligned in the direction of flow from the control orifice 407 .
  • Pins 416 in at least a first row are located directly in front (downstream) of a control orifice 407 splitting flow from it into two stream paths. This creates control jet-streams of reduced sizes while utilizing relatively large (in terms of cross-sectional area) control orifices 407 allowing for more precise control while making manufacturing more economical. It also allows generating deeper swirling zones by including further rows of pins 416 into swirling creating process
  • the heat transfer surface 420 may be provided additionally with a structure of elevated pins 416 arranged in one row of a plurality of pins (here 2) aligned in the direction of flow from the main orifice 406 . Additionally to the row of pins in front of the control orifices 406 pins 416 in at least a further row are located directly in front (downstream) of the main orifice 406 splitting main jet-stream into two stream paths. This creates main jet-streams of reduced sizes while utilizing relatively large (in terms of cross-sectional area) main orifices 406 making manufacturing more economical.
  • the pin rows associated to the control orifices and the pin rows associated to the main orifices might be arranged staggered.
  • FIG. 12 shows a fifth heat exchanging apparatus, wherein identical elements or elements having a similar function are indicated by identical last two numbers in the reference signs.
  • the fifth heat exchanging apparatus 500 has two housing plates 502 spaced apart by an enclosure element 508 forming an enclosure of a housing 501 with a first and a second inlet manifold 503 a , 503 b and a chamber 504 between the first and the second inlet manifold 503 a , 503 b .
  • a first orifice plate 505 a to separate the first inlet manifold 503 a from the chamber 504 and having orifice groups 515 a and a second orifice plate 505 b to separate the second inlet manifold 503 b from the chamber 504 and having orifice groups 415 b are provided.
  • a first and a second supply port 510 a , 510 b are arranged at opposite ends of the enclosure element 508 which encompasses the chamber 504 and the inlet manifolds 503 a , 503 b to supply heat carrier medium into the inlet manifolds 503 a , 503 b .
  • a discharge port 509 is provided on another side of the enclosure element 508 to discharge the heat carrier medium from the chamber 504 .
  • the corresponding orifice groups 515 a , 515 b are arranged as shown in FIGS. 13 a and 13 b .
  • the orifice groups 515 a of the first orifice plate 505 a comprise control orifices 507 a with an offset displaced towards one (the lower) of the housing plates 502 and the orifice groups 515 b of the second orifice plate 505 b comprise control orifices 507 b with an offset displaced towards another (the upper) of the housing plates 502 .
  • both housing plates 502 forming the housing 501 provide a heat transfer surface 520 while the discharge port 509 is also arranged at the side of the enclosure element 508 which forms the enclosure of the housing 501 .
  • the orifice plates 505 a , 505 b are each provided with one or more orifice groups 515 a , 515 b , both of which include orifice groups from which the swirling jet 514 is directed to one or both of the heat transfer surfaces 520 , so that with both orifice plates 505 a , 505 b swirling jets 514 a , 514 b are directed to both heat transfer surfaces 520 .
  • FIG. 14 shows a sixth heat exchanging apparatus 600 similar to the third heat exchanging apparatus 300 shown in FIG. 9 .
  • Identical elements or elements having a similar function are indicated by identical last two numbers in the reference signs.
  • the sixth heat exchanging apparatus 600 has two housing plates 602 spaced apart by an enclosure element 608 forming an enclosure of a housing 601 with an inlet manifold 603 , first cell chambers 604 a , 604 b , and second cell chambers 619 a , 619 b .
  • First cell chambers 604 a , 604 b are created between first orifice plates 605 a , 605 b each containing one or more orifice groups 615 a , 615 b and second orifice plates 617 a , 617 b containing one or more orifice groups 618 a , 618 b , respectively.
  • Second cell chambers 619 a , 619 b are created between the first orifice plates 605 a , 605 b each containing one or more first orifice groups 615 a , 615 b and enclosure element 608 which encompasses the first order cell chambers 604 a , 604 b and the second cell chambers 619 a , 619 b .
  • a first and a second discharge ports 609 a , 609 b are arranged at opposite ends of the enclosure element 608 .
  • a supply port 610 is provided through one of the housing plates 602 opposite the heat transfer surface 620 to supply the heat carrier medium to the second cell chambers 619 a , 619 b which act as supply manifolds.
  • Each of the first and second orifice plates 605 a , 605 b , 617 a , 617 b has a plurality of orifice groups 615 a , 615 b which can be aligned substantially parallel to the heat transfer surface 620 .
  • the control jet-streams Ca generated by the control orifices in second orifice plates 617 b , within the (left) first cell chamber 604 b cause a constant dynamic pressure imbalance with respect to the main jet-stream Fa within first cell chamber 604 b . Since, within first cell chamber 604 b , the control jet-streams Ca are close to the main jet-stream Fa, the pressure imbalances interact with the main jet-stream Fa, so that the main jet-stream Fa alternatively swings between the stream paths 611 b , 612 b and 613 b creating the swirling jet 614 b.
  • control jet-streams Cb generated by the control orifices in first orifice plate 605 b within second cell chamber 619 b cause a constant dynamic pressure imbalance with respect to the main jet-stream Fb within second cell chamber 619 b . Since within second cell chamber 604 b the control jet-streams Cb are close to the main jet-stream Fb, the pressure imbalances interact with the main jet-stream Fb creating a second swirling jet.
  • the chamber is comprised of a plurality of cascaded cell chambers of at least two types: the first cell chamber 604 a , 604 b defined by first and second orifice plates 605 a , 605 b and 617 a , 617 b ; and the second cell chambers 619 a , 619 b defined by at least one first orifice plate 605 a and enclosure element 608 .
  • First orifice plates 605 a and 605 b contain each at least one orifice group 615 a and 615 b respectively.
  • Each orifice group 615 a , 615 b is comprised of a main orifice 606 a , 606 b and at least two control orifices 607 a , 607 b .
  • Orifice plates 617 a and 617 b contain each at least one orifice group 618 a and 618 b respectively.
  • Orifice plates 605 a , 605 b and 617 a , 617 b might be either identical to each other or different from each other, containing different number of orifice groups, or orifice groups of various shapes, orientations, configurations and profiles. This allows to achieve uniform temperature distribution under uneven distribution of the intensity of heat exchange, eliminating possibility of local overheating within serviced equipment.
  • FIG. 15 shows a seventh heat exchanging apparatus which substantially corresponds to the first heat exchanging apparatus 100 .
  • the seventh heat exchanging apparatus 700 has elements substantially similar to those of the first heat exchanging apparatus 100 . Identical elements or elements having a similar function are indicated by identical last two numbers in the reference signs.
  • the seventh heat exchanging apparatus 700 has two housing plates 702 spaced apart by an enclosure element 708 forming an enclosure with an inlet manifold 703 and a chamber 704 .
  • An orifice plate 705 having one or more orifice groups 715 is provided to separate the inlet manifold 703 from the chamber 704 .
  • a supply port 710 is arranged at the enclosure element 708 which encompasses the chamber 704 and the inlet manifold 703 , while the discharge port 709 is also arranged substantially on an end opposite the enclosure element 708 .
  • control jet-streams C generated by the control orifices 707 cause a constant dynamic pressure imbalance with respect to the main jet-stream F. Since the control jet-streams C are close to the main jet stream F, the pressure imbalances interact with the main jet-stream F, so that the main jet stream F alternatively swings between stream paths 711 , 712 , 713 creating the swirling jet 714 .
  • the orifices may be tapered (cone-shaped) along the flowing direction of the heat carrier medium from the inlet manifold 703 to the chamber 704 , so that the inlet of each orifice has a larger cross-section than the outlet thereof.
  • the tapering of orifices can be applied to any of the orifices of the embodiments described herein.
  • only one of the main orifice 706 and the control orifices 707 can be tapered while the respective other one has a substantially cylindrical shape (cross-section parallel to flow direction).
  • FIG. 16 shows a cross-sectional view of the cutting plane indicated by A-A in FIG. 15 . It can be seen that each of the nozzles, i.e. the main orifice 706 and the control orifices 707 which are exemplarily shown with a circular shape, but not limited thereto, is provided with a cross-section narrowing towards the chamber 704 .
  • each of the corresponding orifices 706 , 707 can be directed in both ways either widening towards the chamber 704 or narrowing towards the chamber 704 depending on the effect to be achieved. If hydraulic resistance shall be decreased the orifices should widen towards the chamber 704 if the turbulization should be spread over a larger area of the heat transfer surface the orifices should narrowing towards the chamber 704 .
  • FIG. 17 shows an eighth heat exchanging apparatus 800 of the type of the third heat exchanging apparatus 300 of FIG. 9 .
  • the eighth heat exchanging apparatus 800 has elements substantially similar to those of the third heat exchanging apparatus 300 . Identical elements or elements having a similar function are indicated by identical last two numbers in the reference signs.
  • the eighth heat exchanging apparatus 800 has two housing plates 802 spaced apart by an enclosure element 808 forming an enclosure of a housing 801 with a first and a second inlet manifold 803 a , 803 b and a chamber 804 between the first and the second inlet manifold 803 a , 803 b .
  • a main orifice plate 805 a separates inlet manifold 803 a from a chamber 804 and contains one or more main orifices 806
  • a control orifice plate 805 b separates inlet manifold 803 b from a chamber 804 and contains at least two control orifices 807 for each main orifice 806 located in the main orifice plate 805 .
  • a first and a second supply port 810 a , 810 b are connected to the inlet manifolds 803 a , 803 b to supply heat carrier medium into the inlet manifolds.
  • a discharge port 809 is provided through one of the housing plates 802 opposite the heat transfer surface 820 to discharge the heat carrier medium from the chamber 804 .
  • the main orifices 806 are located in the main orifice plate 805 a and the control orifices 807 are located in control orifice plate 805 b , wherein the main orifice plate 805 a and the control orifice plate 805 b oppose each other.
  • One main orifice 806 and the associated control orifices 807 form one orifice group 815 as explained above. While the main orifice plate 805 a is supplied with the heat carrier medium through a first supply port 810 a through a first manifold 803 a , the control orifice plate 805 b is supplied with the heat carrier medium through a second supply port 810 b through a second manifold 803 b .
  • Orifice plates 805 a and 805 b are arranged in such a way that each main orifice located in the main orifice plate 805 a is located straight in between corresponding control orifices located in control orifice plate 805 b . This arrangement allows to achieve better control and elimination of local overheating spots when area of local overheating is comparable in size with cross-section of the created jet-stream itself.
  • main orifices 806 and the control orifices 807 are arranged opposite each other, so that a main jet-stream F and control jet-streams C are generated having opposite flowing directions while still interacting with each other causing the main jet-stream F to swirl as described in more detail in conjunction with the first heat exchanging apparatus 100 of FIG. 1 .
  • FIG. 18 a shows a cross-section of the first orifice plate 805 a along the plane A-A
  • FIG. 18 b shows a cross-section of the second orifice plate along the plane B-B. While the main orifice 806 is not tapered, the control orifices 807 have a tapered profile, wherein the outlet opening is widening towards the chamber 804 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Exhaust Gas After Treatment (AREA)
US14/416,445 2012-07-26 2013-07-26 Heat exchanging apparatus and method for transferring heat Expired - Fee Related US10168112B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/416,445 US10168112B2 (en) 2012-07-26 2013-07-26 Heat exchanging apparatus and method for transferring heat

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261676164P 2012-07-26 2012-07-26
PCT/US2013/052176 WO2014018824A1 (fr) 2012-07-26 2013-07-26 Appareil échangeur de chaleur et procédé permettant de transférer de la chaleur
US14/416,445 US10168112B2 (en) 2012-07-26 2013-07-26 Heat exchanging apparatus and method for transferring heat

Publications (2)

Publication Number Publication Date
US20150176927A1 US20150176927A1 (en) 2015-06-25
US10168112B2 true US10168112B2 (en) 2019-01-01

Family

ID=48953449

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/416,445 Expired - Fee Related US10168112B2 (en) 2012-07-26 2013-07-26 Heat exchanging apparatus and method for transferring heat

Country Status (4)

Country Link
US (1) US10168112B2 (fr)
EP (1) EP2878011B1 (fr)
CN (1) CN104662657A (fr)
WO (1) WO2014018824A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7124425B2 (ja) * 2018-05-02 2022-08-24 富士電機株式会社 冷却装置、半導体モジュールおよび車両

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2361150A (en) * 1941-01-24 1944-10-24 Mathieson Alkali Works Inc Method and apparatus for admitting chlorine to a liquid stream
US4264212A (en) * 1978-05-26 1981-04-28 Blue Circle Industries Limited Static mixer
US4734109A (en) * 1982-01-04 1988-03-29 Cox James P Effluent treatment apparatus and method of operating same
US5063476A (en) * 1989-12-05 1991-11-05 Digital Equipment Corporation Apparatus for controlled air-impingement module cooling
US5220804A (en) 1991-12-09 1993-06-22 Isothermal Systems Research, Inc High heat flux evaporative spray cooling
US5719444A (en) 1996-04-26 1998-02-17 Tilton; Charles L. Packaging and cooling system for power semi-conductor
US5814125A (en) * 1997-03-18 1998-09-29 Praxair Technology, Inc. Method for introducing gas into a liquid
US6105373A (en) * 1996-09-09 2000-08-22 Technova, Inc. Thermoelectric converter
US20030172669A1 (en) 2002-03-11 2003-09-18 Isothermal Systems Research, Inc. Spray cooling system for transverse thin-film evaporative spray cooling
US6973805B2 (en) * 2001-03-14 2005-12-13 Showa Denko K.K. Layered heat exchanger, layered evaporator for motor vehicle air conditioners and refrigeration system
US20070272392A1 (en) 2006-05-23 2007-11-29 Debashis Ghosh Impingement cooled heat sink with low pressure drop
US7490661B2 (en) * 2005-03-09 2009-02-17 Denso Corporation Heat exchanger
US7787248B2 (en) * 2006-06-26 2010-08-31 International Business Machines Corporation Multi-fluid cooling system, cooled electronics module, and methods of fabrication thereof
US20110042041A1 (en) 2009-08-20 2011-02-24 Ecologence, LLC Interlocked jets cooling method and apparatus
US20120048515A1 (en) * 2010-08-31 2012-03-01 Teledyne Scientific & Imaging, Llc High Power Module Cooling System
US9861942B1 (en) * 2016-06-20 2018-01-09 Rarelyte Corporation Virtual orifice bubble generator to produce custom foam

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040107718A1 (en) * 2002-12-06 2004-06-10 Michael Bowman Method, system and apparatus for cooling high power density devices
CN2632857Y (zh) * 2003-07-11 2004-08-11 北京工业大学 微射流阵列冷却热沉

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2361150A (en) * 1941-01-24 1944-10-24 Mathieson Alkali Works Inc Method and apparatus for admitting chlorine to a liquid stream
US4264212A (en) * 1978-05-26 1981-04-28 Blue Circle Industries Limited Static mixer
US4734109A (en) * 1982-01-04 1988-03-29 Cox James P Effluent treatment apparatus and method of operating same
US5063476A (en) * 1989-12-05 1991-11-05 Digital Equipment Corporation Apparatus for controlled air-impingement module cooling
US5220804A (en) 1991-12-09 1993-06-22 Isothermal Systems Research, Inc High heat flux evaporative spray cooling
US5719444A (en) 1996-04-26 1998-02-17 Tilton; Charles L. Packaging and cooling system for power semi-conductor
US6105373A (en) * 1996-09-09 2000-08-22 Technova, Inc. Thermoelectric converter
US5814125A (en) * 1997-03-18 1998-09-29 Praxair Technology, Inc. Method for introducing gas into a liquid
US6973805B2 (en) * 2001-03-14 2005-12-13 Showa Denko K.K. Layered heat exchanger, layered evaporator for motor vehicle air conditioners and refrigeration system
US20030172669A1 (en) 2002-03-11 2003-09-18 Isothermal Systems Research, Inc. Spray cooling system for transverse thin-film evaporative spray cooling
US7490661B2 (en) * 2005-03-09 2009-02-17 Denso Corporation Heat exchanger
US20070272392A1 (en) 2006-05-23 2007-11-29 Debashis Ghosh Impingement cooled heat sink with low pressure drop
US7787248B2 (en) * 2006-06-26 2010-08-31 International Business Machines Corporation Multi-fluid cooling system, cooled electronics module, and methods of fabrication thereof
US20110042041A1 (en) 2009-08-20 2011-02-24 Ecologence, LLC Interlocked jets cooling method and apparatus
US20120048515A1 (en) * 2010-08-31 2012-03-01 Teledyne Scientific & Imaging, Llc High Power Module Cooling System
US9861942B1 (en) * 2016-06-20 2018-01-09 Rarelyte Corporation Virtual orifice bubble generator to produce custom foam

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
International Search Report and Written Opinion completed Oct. 23, 2013, from corresponding International Application No. PCT/US2013/052176.

Also Published As

Publication number Publication date
WO2014018824A1 (fr) 2014-01-30
EP2878011A1 (fr) 2015-06-03
CN104662657A (zh) 2015-05-27
US20150176927A1 (en) 2015-06-25
EP2878011B1 (fr) 2018-05-30

Similar Documents

Publication Publication Date Title
US5270572A (en) Liquid impingement cooling module for semiconductor devices
US10422592B2 (en) Double-sided cooler
JP5137379B2 (ja) 衝突冷却器
US8490419B2 (en) Interlocked jets cooling method and apparatus
KR100619076B1 (ko) 전자소자 방열용 히트싱크장치
US7255153B2 (en) High performance integrated MLC cooling device for high power density ICS and method for manufacturing
EP1892494B1 (fr) Système et procédé pour transfert de chaleur bouillante utilisant le transport et la projection de refroidissement auto-induit
US9693487B2 (en) Heat management and removal assemblies for semiconductor devices
US20140284029A1 (en) Cooler
CN111052360A (zh) 散热片
JP2008507129A (ja) 熱交換器装置および冷却装置
JP2017004364A (ja) クーリングプレート及びクーリングプレートを備える情報処理装置
JP2014135396A (ja) 冷却ヘッド及び電子機器
JP4619387B2 (ja) 半導体素子の冷却装置
EP2151863A1 (fr) Système de refroidissement par projection de jet
CN102751250B (zh) 冷却装置
US20210130002A1 (en) Plate cooler for aircraft electronic components
JP2005045027A (ja) 半導体素子の冷却装置
US10168112B2 (en) Heat exchanging apparatus and method for transferring heat
CN113490394A (zh) 一种叶脉仿生微通道耦合射流换热系统
JPH06120387A (ja) ヒートシンク
EP2833403B1 (fr) Collecteur pour refroidisseur électronique
CN112788918B (zh) 一种多孔介质扰流射流冷却装置
JP2019079908A (ja) 冷却装置及びこれを備えた半導体モジュール
JP2015149361A (ja) 冷却器

Legal Events

Date Code Title Description
AS Assignment

Owner name: COOL TECHNOLOGY SOLUTIONS, INC., CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SPOKOYNY, MIKHAIL;ORTENBERG, NICK;REEL/FRAME:034790/0535

Effective date: 20141218

STCF Information on status: patent grant

Free format text: PATENTED CASE

FEPP Fee payment procedure

Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20230101