TWM649510U - Wafer notch positioning machine - Google Patents

Abstract

The new model is a wafer notch positioning machine, which includes a base. A moving platform is provided on the top surface of the base. The moving platform can move and rotate relative to the base; a laser positioning device is installed on the top surface of the base. ; A visual positioning device, which is installed on the top surface of the base; when used, an ultra-thin wafer with a gap and covered with a layer of wafer warpage control film is placed on the moving table, and the moving table absorbs the wafer , move the wafer to a position close to the bottom of the sensing lens of the visual positioning device, capture the image of the wafer through the sensing lens and determine the position of the gap, and then use the moving stage to rotate the wafer to the predetermined position, thereby achieving precision The function of positioning the wafer.

Description

Wafer notch positioning machine

The present invention relates to a positioning device, in particular to a wafer gap positioning machine for detecting the position of a wafer gap.

When processing wafers in the prior art, in order to help subsequent processing determine the placement of the wafer, a notch will be formed on the side of the wafer for positioning, and the notch is used as a reference point to determine the direction of the wafer. Specifically, Referring to FIG. 6 , a wafer 90 is placed on a positioning machine 91 . The positioning machine 91 is provided with a laser positioner 92 , and the laser positioner 92 faces the wafer 90 from top to bottom. The edge of the wafer 90 projects a laser light. At this time, the positioning machine 91 will rotate the wafer 90 until the laser light passes through the gap position of the wafer 90. Then the current placement direction of the wafer 90 can be confirmed and the wafer 90 can be positioned.

However, some of today's wafers 90 are transparent, ultra-thick, ultra-thin, and warped. Especially the ultra-thin wafer 90 will cause warping when it is placed on the positioning machine 91. In short, the wafer 90 will not be horizontal when viewed from the side, that is, it will not be a perfect circle as a whole, so there will be an undulating appearance around it. In this way, when the laser light is projected onto the wafer 90, it will produce Positioning errors or even inability to position. In order to solve the aforementioned problems, a layer of wafer warpage control film (not shown in the figure) is usually attached to the wafer 90 to reduce the deformation of the wafer 90 after packaging. However, due to the installation of the wafer warpage control film, the laser light will be reflected and the position of the notch cannot be effectively located; therefore, the aforementioned problems need to be improved.

In view of the shortcomings and shortcomings of the existing technology, the present invention provides a wafer notch positioning machine, which achieves the purpose of identifying and positioning the wafer with images by providing a visual positioning device on the base.

In order to achieve the above creative purpose, the technical means used in this new model is to design a wafer notch positioning machine, which includes: A base with a top surface, the top surface is provided with a moving platform, the moving platform can move and rotate relative to the base; A laser positioning device, which is disposed on the top surface of the base, and the position of the laser positioning device corresponds to the position of the mobile platform; A visual positioning device is provided on the top surface of the base, and the position of the visual positioning device corresponds to the position of the mobile platform.

Furthermore, in the wafer gap positioning machine, the visual positioning device includes a support frame and a sensing lens. The support frame is disposed on the top surface of the base, and the sensing lens is disposed on the support frame. superior.

Furthermore, in the wafer notch positioning machine, the sensing lens is a CCD lens.

Furthermore, in the wafer notch positioning machine, the laser positioning device includes a laser fixture and a laser detector, the laser fixture is disposed on the top surface of the base, and the laser The laser detector is fixed on the laser fixture.

Furthermore, in the wafer notch positioning machine, the moving platform is a wafer suction disk with suction and rotation functions.

The advantage of this new method is that when the wafer is an ultra-thin wafer that is coated with a layer of wafer warpage control film and has a gap, the moving stage can be used to absorb the wafer and then move the wafer close to the visual positioning device. Under the sensing lens, the sensing lens captures the image of the wafer and determines the position of the notch, and then uses the moving stage to rotate the wafer to a predetermined position, thereby achieving the effect of positioning the wafer; when the wafer is small For large and hard wafers, the outer edge of the wafer will not be concave because it is placed on the moving table, or if the concave phenomenon is very slight, a laser positioning device or a visual positioning device can be used separately according to the needs. The wafer performs positioning action, which has the advantages of improved machine integration and convenience.

The technical means adopted by the present invention to achieve the predetermined creative purpose will be further described below with reference to the drawings and preferred embodiments of the present invention.

Please refer to FIG. 1 . The new wafer notch positioning machine of the present invention includes a base 10 , a laser positioning device 20 and a visual positioning device 30 .

Please refer to Figures 1 and 2. The base 10 has a top surface 11. The top surface 11 is provided with a moving platform 12. The moving platform 12 can move and rotate relative to the base 10. The moving platform 12 can move and rotate. The mechanism is an application of existing technology, so it will not be described in detail. In this embodiment, the mobile platform 12 is a wafer suction disc with adsorption and rotation functions, but it is not limited to this. The form of the mobile platform 12 can be based on the user's needs. make changes.

Please refer to FIGS. 1 to 3 . The laser positioning device 20 includes a laser fixing bracket 21 and a laser detector 22 . The laser fixing bracket 21 is disposed on the top surface 11 of the base 10 . The device 22 is fixed on the laser fixing frame 21, and the position of the laser positioning device 20 corresponds to the position of the mobile platform 12. The foregoing corresponding position indicates that the laser light projected by the laser detector 22 can effectively aim at the target. Regarding the position of the object, in this embodiment, the laser detector 22 projects laser light downward, but it is not limited to this, and its arrangement can be changed according to the user's needs.

The visual positioning device 30 includes a supporting frame 31 and a sensing lens 32. The supporting frame 31 is arranged on the top surface 11 of the base 10. The sensing lens 32 is a CCD lens, which is arranged on the supporting frame 31. The visual positioning device 30 The position corresponds to the position of the moving platform 12. The aforementioned position corresponds to the sensing lens 32 that can effectively capture the image of the object placed on the moving platform 12. In this embodiment, the sensing lens 32 is facing downward, but Not limited to this, the setting method can be changed according to the user's needs.

When using the present invention, please refer to Figures 4 and 5, taking the positioning of the ultra-thin wafer 40 with the notch 41 as an example, but it is not limited to this, because the wafer 40 is ultra-thin, so A layer of wafer warpage control film (not shown in the figure) will be affixed to the wafer 40 to reduce its warpage. After the wafer 40 is placed on the moving stage 12 and adsorbed and fixed, the moving stage 12 moves the wafer 40 to Close to the position below the sensing lens 32 of the visual positioning device 30, the sensing lens 32 captures the image of the wafer 40 and determines the position of the notch 41, and then uses the moving stage 12 to rotate the wafer 40 to a predetermined position. The effect of positioning the wafer 40 is achieved, thereby solving the problem of inability to position the wafer due to the pasting of the wafer warpage control film in the previous technology.

In the foregoing process, when the wafer 40 is a small-sized and hard wafer 40, the outer edge of the wafer 40 will not be concave because it is placed on the moving stage 12, or when the concave phenomenon is very slight, it can be based on It is necessary to separately use the laser positioning device 20 or the visual positioning device 30 to position the wafer 40, which has the advantages of improved machine integration and convenience.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Although the present invention has been disclosed above with preferred embodiments, they are not intended to limit the present invention. Any technical field that has A person with ordinary knowledge, without departing from the scope of the technical solution of the present invention, can use the technical content disclosed above to make some changes or modifications as equivalent embodiments of equivalent changes. However, any content that does not depart from the technical solution of the present invention shall be based on this Novel Technical Substance Any simple modifications, equivalent changes and modifications made to the above embodiments still fall within the scope of the new technical solution.

10: base 11:Top surface 12:Mobile station 20:Laser positioning device 21:Laser holder 22:Laser detector 30:Visual positioning device 31: Support frame 32: Sensing lens 40:wafer 41: Gap 90:wafer 91: Positioning machine 92:Laser locator

Figure 1 is a three-dimensional appearance view of the new model. Figure 2 is a partially exploded view of the new model. Figure 3 is another partially exploded view of the present invention. Figure 4 is a schematic diagram of the use of this new type. Figure 5 is another usage diagram of this new type. Figure 6 is a schematic diagram of the prior art.

10: base

11:Top surface

12:Mobile station

20:Laser positioning device

30:Visual positioning device

Claims (5)

A wafer notch positioning machine, which includes: A base with a top surface, the top surface is provided with a moving platform, the moving platform can move and rotate relative to the base; A laser positioning device, which is disposed on the top surface of the base, and the position of the laser positioning device corresponds to the position of the mobile platform; A visual positioning device is provided on the top surface of the base, and the position of the visual positioning device corresponds to the position of the mobile platform. The wafer gap positioning machine according to claim 1, wherein the visual positioning device includes a support frame and a sensing lens. The support frame is disposed on the top surface of the base, and the sensing lens is disposed on the support frame. superior. The wafer notch positioning machine as described in claim 2, wherein the sensing lens is a CCD lens. The wafer notch positioning machine as described in any one of claims 1 to 3, wherein the laser positioning device includes a laser holder and a laser detector, and the laser holder is installed on the base On the top surface, the laser detector is fixed on the laser fixing frame. The wafer notch positioning machine as described in claim 4, wherein the mobile platform is a wafer suction disk with suction and rotation functions.

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