TW201306165A - Alignment device and alignment method - Google Patents
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- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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Abstract
Description
本發明係關於一種校準裝置及校準方法，更詳細而言，係關於一種具備吸附旋轉手段的校準裝置、及使用吸附旋轉手段的校準方法。 The present invention relates to a calibration apparatus and a calibration method, and more particularly to a calibration apparatus including an adsorption rotation means and a calibration method using an adsorption rotation means.
在對基板等進行精密加工時，於加工前預先進行加工對象的基板等之校準(位置調整)係為有用。例如，專利文獻1所記載針對黏貼有切割膠帶的基板，藉由在切割前進行校準，便可非常成功地進行切割。 When performing precision machining on a substrate or the like, it is useful to perform calibration (position adjustment) of a substrate or the like to be processed in advance before processing. For example, Patent Document 1 discloses that a substrate to which a dicing tape is adhered can be cut very successfully by performing calibration before cutting.
校準用的校準裝置存在有多個種類。其中之一，存在有使校準對象物(例如基板)進行旋轉，檢測旋轉中校準對象物的位置，根據目標位置與所檢測到位置之差而使校準對象物移動，藉此進行校準的校準裝置。 There are several types of calibration devices for calibration. One of the calibration devices is a device that rotates a calibration object (for example, a substrate), detects a position of the calibration object during rotation, and moves the calibration object based on the difference between the target position and the detected position. .
針對上述校準裝置進行詳細地說明。於上述校準裝置中，首先旋轉卡盤吸附基板(校準對象物)的中央附近，並使該基板旋轉。然後，從基板的表面側對上述基板照射光，藉由在背面側檢測光，而判定光所照射的位置是否有基板存在。因為上述基板係進行旋轉，因此藉由持續進行上述光的照射與檢測，便可確認上述基板整體的位置。上述校準裝置係如上述，藉由檢測上述基板的位置，並根據目標位置與所檢測到位置之差而使校準對象物移動，從而進行校準。 The above calibration apparatus will be described in detail. In the above calibration apparatus, first, the vicinity of the center of the chuck suction substrate (alignment object) is rotated, and the substrate is rotated. Then, the substrate is irradiated with light from the surface side of the substrate, and by detecting light on the back side, it is determined whether or not the substrate is present at the position where the light is irradiated. Since the substrate is rotated, the position of the entire substrate can be confirmed by continuously performing the irradiation and detection of the light. As described above, the calibration apparatus performs calibration by detecting the position of the substrate and moving the calibration object based on the difference between the target position and the detected position.
然而，上述校準裝置會有校準精度降低的情況。 However, the above calibration apparatus may have a case where the calibration accuracy is lowered.
即，因為旋轉卡盤通常僅吸附校準對象物的中央附近，因此在校準對象物的外周部分會有因自重而造成曲撓等變形的情況發生。於此情況下，因為隨上述變形會導致校準對象物端部的位置等偏移，因此造成上述校準裝置無法正確地檢測上述基板的位置。因此，校準的精度會降低。 In other words, since the spin chuck normally only attracts the vicinity of the center of the calibration object, the outer peripheral portion of the calibration object may be deformed by bending or the like due to its own weight. In this case, since the position of the end portion of the calibration object is shifted due to the above deformation, the calibration apparatus cannot accurately detect the position of the substrate. Therefore, the accuracy of the calibration will be reduced.
尤其，如專利文獻1所記載之黏貼有切割膠帶的基板，僅由切割膠帶所構成的部分會因自重而容易曲撓，導致此問題趨於明顯。所以，於專利文獻2中提案有設置從從背側支撐切割膠帶外周部的支撐手段。 In particular, as described in Patent Document 1, a substrate having a dicing tape adhered thereto, and only a portion composed of the dicing tape is easily bent by its own weight, and this problem tends to be conspicuous. Therefore, Patent Document 2 proposes a support means for supporting the outer peripheral portion of the dicing tape from the back side.
然而，因為專利文獻2的支撐手段會接觸到切割膠帶的背面且呈靜止，因此在校準對象物進行旋轉時會出現摩擦作用，導致對旋轉卡盤施加負荷，存在有消耗電力變大的問題。 However, since the supporting means of Patent Document 2 comes into contact with the back surface of the dicing tape and is stationary, a frictional action occurs when the object to be calibrated is rotated, causing a load on the spin chuck, and there is a problem that power consumption is increased.
[專利文獻1]日本專利特開2006-135272號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-135272
[專利文獻2]日本專利特開2011-3837號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2011-3837
本發明係有鑑於上述問題而完成者，目的在於提供一種抑制校準對象物變形、以低負荷進行高精度校準的校準技術。 The present invention has been made in view of the above problems, and it is an object of the invention to provide a calibration technique for suppressing deformation of a calibration object and performing high-precision calibration with a low load.
本發明的校準裝置，具備有吸附旋轉手段與支撐手段。吸附旋轉手段係吸附校準對象物並進行旋轉。支撐手段係在與上述吸附旋轉手段所吸附位置不同的位置，支撐進行旋轉的上述校準對象物。而且，本發明的校準裝置的特徵在於構成為上述支撐手段與上述校準對象物同步進行旋轉。 The calibration device of the present invention includes an adsorption rotation means and a support means. The adsorption rotation means adsorbs the calibration object and rotates it. The supporting means supports the object to be calibrated which is rotated at a position different from the position at which the adsorption rotating means is adsorbed. Further, the calibration apparatus of the present invention is characterized in that the support means rotates in synchronization with the calibration target.
又，本發明的校準方法包括有吸附步驟、旋轉步驟、位置檢測步驟、及位置調整步驟；該吸附步驟係利用吸附旋轉手段吸附校準對象物；該旋轉步驟係藉由使上述吸附旋轉手段旋轉，而使上述校準對象物旋轉；該位置檢測步驟係檢測進行旋轉的上述校準對象物位置；該位置調整步驟係使上述校準對象物移動。而且，本發明的校準方法，其特徵在於在上述旋轉步驟中，利用支撐手段在與上述吸附旋轉手段所吸附位置不同的位置，一邊支撐上述校準對象物，一邊使上述支撐手段亦與上述校準對象物同步進行旋轉。 Moreover, the calibration method of the present invention includes an adsorption step, a rotation step, a position detection step, and a position adjustment step; the adsorption step is to adsorb the calibration object by the adsorption rotation means; the rotation step is performed by rotating the adsorption rotation means, The calibration object is rotated; the position detecting step detects the position of the calibration object to be rotated; and the position adjustment step moves the calibration object. Further, in the above-described rotation method, the support means and the calibration object are supported by the support means at a position different from the position where the adsorption/rotation means is adsorbed by the support means while supporting the calibration object. The object is rotated synchronously.
根據本發明，利用支撐手段支撐校準對象物未被吸附旋轉手段所吸附的部分，可抑制該部分發生因校準對象物的自重所造成的曲撓等變形。又，藉由支撐手段與校準對象物同步進行旋轉，幾乎不會產生作用於校準對象物的摩擦，可減輕對吸附旋轉手段所施加的負荷。 According to the present invention, the portion to which the calibration object is not adsorbed by the adsorption rotating means is supported by the supporting means, and deformation such as distortion due to the self-weight of the calibration object can be suppressed in the portion. Further, by the support means rotating in synchronization with the object to be aligned, the friction acting on the object to be calibrated is hardly generated, and the load applied to the adsorption rotating means can be reduced.
根據本發明，可抑制校準對象物的變形，俾能以低負荷進行高精度的校準。 According to the present invention, it is possible to suppress deformation of the object to be calibrated, and it is possible to perform high-precision calibration with a low load.
針對本發明一實施形態的校準裝置，參照圖1~圖5進行說明。校準裝置100係進行校準對象物10之校準(對位)的裝置。圖1係示意性地表示校準裝置100的概略構造之剖面圖。圖2係示意性地表示校準裝置100的概略構造之俯視圖，(A)係呈現未搭載校準對象物10的狀態，(B)係呈現搭載有校準對象物10的狀態。 A calibration apparatus according to an embodiment of the present invention will be described with reference to Figs. 1 to 5 . The calibration device 100 is a device that performs calibration (alignment) of the calibration object 10. FIG. 1 is a cross-sectional view schematically showing a schematic configuration of a calibration apparatus 100. FIG. 2 is a plan view schematically showing a schematic configuration of the calibration apparatus 100. (A) shows a state in which the calibration object 10 is not mounted, and (B) shows a state in which the calibration object 10 is mounted.
如圖1所示，校準裝置100的框體101具備有吸附校準對象物10並使其旋轉的旋轉卡盤(吸附旋轉手段)110。 As shown in FIG. 1, the housing 101 of the calibration apparatus 100 is provided with a spin chuck (adsorption rotation means) 110 that sucks and rotates the calibration object 10.
在框體101中更設有支撐取像部120之構造體即橋部102。取像部120係構成在框體101內所設置之主控制部150(未圖示)的影像辨識部156之校準對象物10(嚴格而言為基板11)的位置檢測手段。影像辨識部156係辨識取像部120所取像的影像，而檢測校準對象物10的位置。 In the casing 101, a bridge portion 102 that is a structure that supports the image capturing portion 120 is further provided. The image capturing unit 120 is a position detecting means for arranging the object 10 to be calibrated (strictly, the substrate 11) of the image recognition unit 156 of the main control unit 150 (not shown) provided in the casing 101. The image recognition unit 156 recognizes the image captured by the image capturing unit 120 and detects the position of the calibration object 10.
校準裝置100進一步具備有在與旋轉卡盤110所吸附位置不同的位置，支撐旋轉中之校準對象物10的支撐構件(支撐手段)130。支撐構件130係如圖1、圖2(A)、(B)所示，成為周圍較其內側更高而形成的盆狀。支撐構件130係在中心設有安裝孔130A，並在安裝孔130A中裝設有旋轉卡盤110。換言之，支撐構件130係固定於旋轉卡盤110的外周。藉此，支撐構件130成為與旋轉卡盤110一起旋轉。支撐構件130係成為利用外周的接觸部130B從下方支撐校準對象 物10的外周部分。 The calibration apparatus 100 further includes a support member (support means) 130 that supports the calibration target 10 that is rotating at a position different from the position where the spin chuck 110 is attracted. As shown in FIGS. 1 and 2 (A) and (B), the support member 130 has a basin shape in which the periphery is formed higher than the inner side. The support member 130 is provided with a mounting hole 130A at the center, and a spin chuck 110 is mounted in the mounting hole 130A. In other words, the support member 130 is fixed to the outer circumference of the spin chuck 110. Thereby, the support member 130 is rotated together with the spin chuck 110. The support member 130 is configured to support the calibration object from below by the contact portion 130B on the outer circumference. The peripheral portion of the object 10.
因為校準裝置100具備有此一支撐構件130，因此支撐在進行旋轉的校準對象物10中未被旋轉卡盤110所吸附之外周部分，可抑制該部分因校準對象物10的自重而造成曲撓等變形。藉此，校準裝置100可避免因校準對象物的變形所導致在校準對象物10的位置檢測時的精度降低，俾可進行高精度的校準。 Since the calibration device 100 is provided with the support member 130, it is supported by the outer peripheral portion of the calibration object 10 that is rotated without being adsorbed by the spin chuck 110, and the portion can be prevented from being bent due to the self-weight of the calibration object 10. And other deformations. Thereby, the calibration apparatus 100 can avoid the deterioration of the accuracy at the time of detecting the position of the calibration object 10 due to the deformation of the calibration object, and can perform high-precision calibration.
如圖1所示，本實施形態的校準對象物10係具有基板11黏貼於較基板11更大的切割膠帶(薄膜)12之構造，切割膠帶12係由外框即切割框13所保持(以上參照圖1與圖2(A)、(B))。因此，如圖2(B)所示，支撐構件130較佳為至少支撐在切割膠帶12中沒有黏貼基板11的部分，而切割框13係按押該支撐部分。藉此，可支撐柔軟且容易產生變形的切割膠帶12，從而抑制校準對象物10的變形。 As shown in FIG. 1, the calibration object 10 of the present embodiment has a structure in which the substrate 11 is adhered to a larger dicing tape (film) 12 than the substrate 11, and the dicing tape 12 is held by the outer frame, that is, the dicing frame 13 (above). 1 and 2 (A), (B)). Therefore, as shown in Fig. 2(B), the support member 130 preferably supports at least a portion of the dicing tape 12 where the substrate 11 is not adhered, and the cutting frame 13 is pressed against the support portion. Thereby, the dicing tape 12 which is soft and easily deformed can be supported, and deformation of the calibration object 10 can be suppressed.
如上所示，校準裝置100藉由位置檢測手段採用取像部120與影像辨識部156，即便位置檢測對象即基板11之素材為玻璃或矽(依情況亦可為玻璃與矽的積層基板)均可對應。又，由於並非為光學性的位置檢測，因此切割膠帶12亦可為不透光的素材、或顏色。 As described above, the calibration apparatus 100 employs the image capturing unit 120 and the image recognition unit 156 by the position detecting means, and the material of the substrate 11 which is the position detection target is glass or germanium (may be a laminated substrate of glass and germanium, as the case may be). Can correspond. Moreover, since it is not an optical position detection, the dicing tape 12 may be an opaque material or a color.
旋轉卡盤110只要為能利用真空泵等機構真空吸附校準對象物10，並使處於吸附狀態的校準對象物10朝吸附面的面內方向旋轉者即可。例如，可使用由一般的真空吸盤與馬 達所構成的旋轉卡盤。 The spin chuck 110 may be configured such that the calibration object 10 can be vacuum-adsorbed by a mechanism such as a vacuum pump, and the calibration target 10 in the adsorbed state can be rotated in the in-plane direction of the adsorption surface. For example, you can use a general vacuum chuck with a horse The rotating chuck formed by the camera.
又，校準裝置100具備有使旋轉卡盤110朝上述吸附面的面內方向移動之旋轉卡盤位置調整部111。校準裝置100係根據位置檢測手段所檢測到校準對象物10的位置，利用旋轉卡盤位置調整部111使旋轉卡盤110移動，藉此將校準對象物10校準至目標的位置。 Further, the calibration apparatus 100 includes a spin chuck position adjusting unit 111 that moves the spin chuck 110 in the in-plane direction of the suction surface. The calibration apparatus 100 detects the position of the calibration object 10 based on the position detecting means, and moves the spin chuck 110 by the spin chuck position adjusting unit 111, thereby aligning the calibration object 10 to the target position.
如圖3所示，對校準裝置100之校準對象物10的搬送係使用機器臂50而進行。機器臂50係利用吸盤等保持校準對象物10邊緣的切割框13部分，將校準對象物10從前一步驟的處理裝置搬送至校準裝置100。 As shown in FIG. 3, the conveyance system of the calibration object 10 of the calibration apparatus 100 is performed using the robot arm 50. The robot arm 50 holds the portion of the cutting frame 13 at the edge of the calibration object 10 by a suction cup or the like, and transports the calibration object 10 from the processing device of the previous step to the calibration device 100.
圖4係示意性地表示旋轉卡盤位置調整部111的概略構造之俯視圖。作為旋轉卡盤位置調整部111係可列舉例如圖4所示，具備有支撐旋轉卡盤110的托盤115、將托盤115水平地支撐的L形可動板114、使可動板114朝上述吸附面的面內方向(沿紙面的方向)之第1方向(x軸方向)進行直線移動的第1直線移動手段112、以及使可動板114朝第2方向(y軸方向)方向移動的第2直線移動手段113之構成。若依照此一旋轉卡盤位置調整部111，利用第1直線移動手段112與第2直線移動手段113使可動板114朝x軸方向與y軸方向進行直線移動，藉此與可動板114之移動同步地配合其移動距離使由托盤115所支撐的旋轉卡盤110朝吸附面的面內方向移動。 FIG. 4 is a plan view schematically showing a schematic configuration of the spin chuck position adjusting unit 111. For example, as shown in FIG. 4, the rotary chuck position adjusting unit 111 includes a tray 115 that supports the spin chuck 110, an L-shaped movable plate 114 that supports the tray 115 horizontally, and a movable plate 114 that faces the suction surface. The first linear moving means 112 that linearly moves in the first direction (the x-axis direction) in the in-plane direction (the direction along the paper surface) and the second linear moving that moves the movable plate 114 in the second direction (y-axis direction) The composition of means 113. According to the rotary chuck position adjusting unit 111, the first linear moving means 112 and the second linear moving means 113 linearly move the movable plate 114 in the x-axis direction and the y-axis direction, thereby moving the movable plate 114. The rotating chuck 110 supported by the tray 115 is moved in the in-plane direction of the suction surface in synchronization with the moving distance.
如上述，檢測校準對象物10位置的位置檢測手段係含有取像部120與影像辨識部156而構成。取像部120係設置於橋部102，從上方對校準對象物10取像。 As described above, the position detecting means for detecting the position of the calibration target 10 includes the image capturing unit 120 and the image recognition unit 156. The image capturing unit 120 is provided in the bridge portion 102, and images the calibration object 10 from above.
本實施形態中，取像部120係對包含校準對象物10之基板11邊緣的區域取像。又，取像部120係對在基板11上所設置之定向平面等角度檢測用標記取像。影像辨識部156係根據取像部120所取像的影像，計算出校準對象物10的中心、與旋轉中心(即旋轉卡盤110的旋轉中心)之偏移，以及旋轉角度。藉此，可檢測出校準對象物10的位置。 In the present embodiment, the image capturing unit 120 takes an image of a region including the edge of the substrate 11 of the calibration object 10. Further, the image capturing unit 120 picks up an image for detecting an angle such as an orientation flat surface provided on the substrate 11. The image recognition unit 156 calculates the offset between the center of the calibration object 10 and the center of rotation (that is, the rotation center of the spin chuck 110) and the rotation angle based on the image captured by the image capturing unit 120. Thereby, the position of the calibration object 10 can be detected.
以下說明校準裝置100的概略動作。圖5係示意性地說明校準裝置的概略功能之方塊圖。如圖5所示，校準裝置100的主控制部150具備有旋轉卡盤控制部154及影像辨識部156。 The outline operation of the calibration apparatus 100 will be described below. Figure 5 is a block diagram schematically illustrating the schematic function of the calibration device. As shown in FIG. 5, the main control unit 150 of the calibration apparatus 100 includes a spin chuck control unit 154 and an image recognition unit 156.
首先，若將校準對象物10搬入至校準裝置100中，旋轉卡盤控制部154就會使校準對象物10吸附於旋轉卡盤110並進行旋轉。此時，旋轉卡盤110亦與支撐構件130一起旋轉。支撐構件130係支撐校準對象物10的外周部，防止校準對象物10變形。又，藉由支撐構件130與校準對象物10同步進行旋轉，幾乎不會產生作用於校準對象物10的摩擦，可減輕對旋轉卡盤110所施加的負荷。 First, when the calibration object 10 is carried into the calibration apparatus 100, the spin chuck control unit 154 causes the calibration object 10 to be adsorbed to the spin chuck 110 and rotated. At this time, the spin chuck 110 also rotates together with the support member 130. The support member 130 supports the outer peripheral portion of the calibration object 10 to prevent the calibration object 10 from being deformed. Further, when the support member 130 rotates in synchronization with the calibration object 10, friction acting on the calibration object 10 is hardly generated, and the load applied to the spin chuck 110 can be reduced.
接著，影像辨識部156係利用取像部120對基板11進行取像。影像辨識部156係取得取像部120所取像的影像，根 據該影像，計算出校準對象物10的位置、與預先輸入主控制部150的校準目標位置之差，並將表示該差的資訊傳送至旋轉卡盤控制部154。旋轉卡盤控制部154係控制旋轉卡盤110與旋轉卡盤位置調整部111，以解除所接收之上述差。藉此，校準裝置100便可進行校準對象物10的校準。 Next, the image recognition unit 156 acquires the substrate 11 by the image capturing unit 120. The image recognition unit 156 acquires an image captured by the image capturing unit 120, and the root Based on the image, the difference between the position of the calibration object 10 and the calibration target position input to the main control unit 150 in advance is calculated, and information indicating the difference is transmitted to the spin chuck control unit 154. The spin chuck control unit 154 controls the spin chuck 110 and the spin chuck position adjusting unit 111 to cancel the received difference. Thereby, the calibration apparatus 100 can perform calibration of the calibration object 10.
校準裝置100的主控制部150係由硬體邏輯所構成即可。或者，如下述，亦可使用CPU(Central Processing Unit；中央處理單元)並利用軟體實現。 The main control unit 150 of the calibration apparatus 100 may be configured by hardware logic. Alternatively, as described below, a CPU (Central Processing Unit) may be used and implemented by software.
即，主控制部150具備有：執行實現各功能之程式指令的MPU(Micro Processing Unit；微處理單元)等的CPU、儲存此程式的ROM(Read Only Memory；唯讀記憶體)、將上述程式展開為可執行之形式的RAM(Random Access Memory；隨機存取記憶體)、以及儲存上述程式與各種資料的記憶體等之記憶裝置(記憶媒體)。 In other words, the main control unit 150 includes a CPU such as an MPU (Micro Processing Unit) that executes a program command for realizing each function, a ROM (Read Only Memory) that stores the program, and the program. A memory device (memory medium) such as a RAM (Random Access Memory) that can be executed in an executable form, and a memory that stores the program and various materials.
而且，本發明之目的並不僅侷限於固定地載持於主控制部150的程式記憶體中的情況，亦可將記錄有上述程式的程式碼(執行形式程式、中間碼程式、或原始程式)的記錄媒體供應給裝置，由裝置讀取出並執行記錄於上述記錄媒體的上述程式碼而達成。 Furthermore, the object of the present invention is not limited to the case where it is fixedly held in the program memory of the main control unit 150, and the program code (execution format program, intermediate code program, or original program) on which the program is recorded may be recorded. The recording medium is supplied to the device, and is realized by the device reading out and executing the above-described code recorded on the recording medium.
上述實施形態的說明均僅為例示，並應認為非限制本發明者。本發明範圍並非由上述實施形態，而是如申請專利範圍所示。而且，本發明之範圍亦涵蓋與申請專利範圍具均等含 義與範圍內的所有變更。 The description of the above embodiments is merely illustrative and is not intended to limit the invention. The scope of the present invention is not limited to the above embodiments, but is as shown in the claims. Moreover, the scope of the present invention also covers the same as the scope of the patent application. All changes within the meaning and scope.
10‧‧‧校準對象物 10‧‧‧ Calibration object
11‧‧‧基板 11‧‧‧Substrate
12‧‧‧切割膠帶(薄膜) 12‧‧‧Cut Tape (Film)
13‧‧‧切割框 13‧‧‧cut box
50‧‧‧機器臂 50‧‧‧ machine arm
100‧‧‧校準裝置 100‧‧‧ calibration device
101‧‧‧框體 101‧‧‧ frame
102‧‧‧橋部 102‧‧ ‧Bridge
110‧‧‧旋轉卡盤(吸附旋轉手段) 110‧‧‧Rotary chuck (adsorption rotation means)
111‧‧‧旋轉卡盤位置調整部 111‧‧‧Rotary chuck position adjustment unit
112‧‧‧第1直線移動手段 112‧‧‧1st linear movement means
113‧‧‧第2直線移動手段 113‧‧‧2nd linear moving means
114‧‧‧可動板 114‧‧‧ movable plate
115‧‧‧托盤 115‧‧‧Tray
120‧‧‧取像部 120‧‧‧Image Department
130‧‧‧支撐構件(支撐手段) 130‧‧‧Support members (support means)
130A‧‧‧安裝孔 130A‧‧‧Mounting holes
130B‧‧‧接觸部 130B‧‧Contacts
150‧‧‧主控制部 150‧‧‧Main Control Department
154‧‧‧旋轉卡盤控制部 154‧‧‧Rotary Chuck Control
156‧‧‧影像辨識部 156‧‧‧Image Identification Department
圖1係示意性地表示本發明一實施形態的校準裝置的概略構造之剖面圖。 Fig. 1 is a cross-sectional view schematically showing a schematic configuration of a calibration apparatus according to an embodiment of the present invention.
圖2係示意性地表示校準裝置100的概略構造之俯視圖，圖2(A)係呈現未搭載校準對象物10的狀態，圖2(B)係呈現搭載有校準對象物10的狀態。 FIG. 2 is a plan view schematically showing a schematic configuration of the calibration apparatus 100. FIG. 2(A) shows a state in which the calibration object 10 is not mounted, and FIG. 2(B) shows a state in which the calibration object 10 is mounted.
圖3係示意性地表示對本發明一實施形態的校準裝置搬送校準對象物的概略動作之剖面圖。 Fig. 3 is a cross-sectional view schematically showing a schematic operation of transporting a calibration object to a calibration apparatus according to an embodiment of the present invention.
圖4係示意性地表示本發明一實施形態的校準裝置的旋轉卡盤位置調整部的概略構造之俯視圖。 FIG. 4 is a plan view schematically showing a schematic configuration of a spin chuck position adjusting unit of the calibration apparatus according to the embodiment of the present invention.
圖5係示意性地說明本發明一實施形態的校準裝置的概略功能之方塊圖。 Fig. 5 is a block diagram schematically showing a schematic function of a calibration apparatus according to an embodiment of the present invention.
10‧‧‧校準對象物 10‧‧‧ Calibration object
11‧‧‧基板 11‧‧‧Substrate
12‧‧‧切割膠帶(薄膜) 12‧‧‧Cut Tape (Film)
13‧‧‧切割框 13‧‧‧cut box
100‧‧‧校準裝置 100‧‧‧ calibration device
101‧‧‧框體 101‧‧‧ frame
102‧‧‧橋部 102‧‧ ‧Bridge
110‧‧‧旋轉卡盤(吸附旋轉手段) 110‧‧‧Rotary chuck (adsorption rotation means)
120‧‧‧取像部 120‧‧‧Image Department
130‧‧‧支撐構件(支撐手段) 130‧‧‧Support members (support means)
130A‧‧‧安裝孔 130A‧‧‧Mounting holes
130B‧‧‧接觸部 130B‧‧Contacts
Claims (5)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011123891 | 2011-06-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201306165A true TW201306165A (en) | 2013-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101118921A TW201306165A (en) | 2011-06-02 | 2012-05-28 | Alignment device and alignment method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5763759B2 (en) |
| KR (1) | KR20140025513A (en) |
| TW (1) | TW201306165A (en) |
| WO (1) | WO2012165141A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI633621B (en) * | 2016-07-29 | 2018-08-21 | 上海微電子裝備（集團）股份有限公司 | Substrate docking device and docking method |
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|---|---|---|---|---|
| CN106486406B (en) * | 2016-10-21 | 2019-05-14 | 杭州长川科技股份有限公司 | The pre- alignment device of IC wafers and pre- alignment method |
| KR102377036B1 (en) * | 2020-02-24 | 2022-03-22 | 피에스케이홀딩스 (주) | Alignment apparatus, and substrate processing apparatus comprising the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2002329769A (en) * | 2001-04-27 | 2002-11-15 | Lintec Corp | Alignment equipment |
| JP2010021281A (en) * | 2008-07-09 | 2010-01-28 | Olympus Corp | Substrate holding device, substrate inspecting device, and substrate holding method |
| JP5384220B2 (en) * | 2009-06-22 | 2014-01-08 | 東京応化工業株式会社 | Alignment apparatus and alignment method |
-
2012
- 2012-05-16 WO PCT/JP2012/062479 patent/WO2012165141A1/en active Application Filing
- 2012-05-16 JP JP2013517950A patent/JP5763759B2/en active Active
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| TWI633621B (en) * | 2016-07-29 | 2018-08-21 | 上海微電子裝備（集團）股份有限公司 | Substrate docking device and docking method |
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| Publication number | Publication date |
|---|---|
| JPWO2012165141A1 (en) | 2015-02-23 |
| WO2012165141A1 (en) | 2012-12-06 |
| JP5763759B2 (en) | 2015-08-12 |
| KR20140025513A (en) | 2014-03-04 |
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