JP2019096686A - Semiconductor substrate transportation device, transportation method for semiconductor substrate, and method of manufacturing semiconductor device - Google Patents

Abstract

To provide a semiconductor substrate transportation device and a transportation method for a semiconductor substrate capable of shortening a transportation time of the semiconductor substrate, and to provide a method of manufacturing a semiconductor device on the semiconductor substrate using the transportation method.SOLUTION: A semiconductor substrate transportation device 100 holds and transports a semiconductor substrate 2 with a wafer hand 3 at a part of which a tempered glass part 9 transmitting light is provided. In a state where the semiconductor substrate 2 is held by the wafer hand 3, a plane image of the semiconductor substrate 2 is acquired by a recognition camera 5, and a deviation amount from a predetermined position is detected on the basis of the plane image, and thereby, position correction is performed.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a semiconductor substrate transfer apparatus, a method of transferring a semiconductor substrate, and a method of manufacturing a semiconductor device using the transfer method.

  In the process of processing or inspection of a disk-shaped semiconductor substrate (also referred to as a wafer) having an outer peripheral discontinuous portion such as an orientation flat or a notch in the peripheral portion, the position of the outer peripheral discontinuous portion of the semiconductor substrate in the semiconductor substrate transport apparatus The position of the center or the like is specified, and the positional deviation is corrected and installed at a predetermined position, and then the processing proceeds to processing such as processing or inspection. The semiconductor substrate transfer apparatus is required to always maintain the installation position of the semiconductor substrate before processing and inspection processing constant in order to perform the subsequent processing and inspection with high accuracy.

  For example, in Patent Document 1 (in particular, refer to [Conventional technology]), a semiconductor substrate is photographed by a camera, and image processing is performed to specify positional deviations such as the central position of the semiconductor substrate and the direction of discontinuous portions in the outer periphery There is disclosed a technique for installing at a predetermined position.

JP 2000-505203 gazette

  However, in the method described in Patent Document 1, in order to specify the shape and position of the semiconductor substrate, it is time to set the semiconductor substrate on the support, take a flat image with a camera, and process the image is necessary. Therefore, it takes time to correct the positional deviation, and there is room for improvement in shortening the transfer time of the semiconductor substrate and shortening the construction period in the manufacture of the semiconductor device formed on the surface of the semiconductor substrate.

  In view of such circumstances, the present invention provides a semiconductor substrate transfer apparatus capable of shortening the time taken to transfer a semiconductor substrate, a semiconductor substrate transfer method, and a semiconductor device formed on the surface of the semiconductor substrate using the transfer method. The purpose is to provide a manufacturing method.

In order to solve the above-described problems, the present invention provides a semiconductor substrate transfer apparatus as described below.
That is, a semiconductor substrate transfer apparatus including a holder for holding and transporting a semiconductor substrate, wherein a part of the holder has a light transmitting portion, is a semiconductor substrate transfer apparatus.

The present invention also provides the following semiconductor substrate transfer method.
That is, a method of transporting a semiconductor substrate, wherein a planar image of the semiconductor substrate is acquired by a recognition camera in a state where the semiconductor substrate is held by a holder having a light transmitting portion in part, and predetermined based on the planar image. The semiconductor substrate transport method is characterized in that the amount of deviation from the position of (1) is detected and position correction is performed.

The present invention also provides a method of manufacturing a semiconductor device as described below.
That is, a method of manufacturing a semiconductor device formed on the surface of a semiconductor substrate, wherein the semiconductor substrate is transported using the above-described method of transporting a semiconductor substrate, and the semiconductor device is manufactured. I assume.

  According to the present invention, by acquiring the planar image of the semiconductor substrate while holding the semiconductor substrate by the holder, it is possible to perform the image processing of the planar image while the semiconductor substrate is moving, so that the semiconductor substrate can be transported. Such time can be shortened. Further, by adopting the semiconductor substrate transfer method, it is possible to manufacture a semiconductor device formed on the surface of the semiconductor substrate in a short construction period.

It is a top view which shows schematic structure for demonstrating the semiconductor substrate conveyance apparatus of embodiment of this invention. It is sectional drawing which shows schematic structure of the part along the dotted line arrow of the semiconductor substrate conveyance apparatus shown in FIG. It is a schematic diagram of the wafer hand of this embodiment. It is a flowchart figure which shows the semiconductor substrate conveyance method in the embodiment of the present invention.

  Hereinafter, embodiments of a semiconductor substrate transfer apparatus of the present invention will be described with reference to the drawings. Here, the description of the portion that performs processing such as processing and inspection of the semiconductor substrate and the mechanism thereof will be omitted. In the present embodiment, any processing such as processing or inspection is performed on the semiconductor substrate is optional, and the semiconductor substrate transfer device of the present embodiment can be applied to any processing. .

  FIG. 1 is a plan view showing a schematic configuration of a semiconductor substrate transfer apparatus 100 showing an embodiment of the present invention. The semiconductor substrate transfer apparatus 100 includes a case 8 and a wafer cassette 1a in which the semiconductor substrate 2 having the discontinuous portion 10 of the semiconductor substrate before processing such as processing and inspection is accommodated, and processing such as processing and inspection A wafer cassette 1b for housing the completed semiconductor substrate 2 and a rotatable rotary table 6 for mounting the semiconductor substrate 2 before processing or inspection and performing angle correction of the semiconductor substrate 2 in plan view (semiconductor A wafer transfer unit 11 for transferring the semiconductor substrate 2 by moving between the substrate setting unit), the wafer cassette 1a or the wafer cassette 1b and the rotary table 6, and a housing 8 at a position halfway along the transfer route of the semiconductor substrate 2. The light box 4 installed in the

  The wafer transfer unit 11 adjusts the wafer hand 3 (holder) for holding the semiconductor substrate 2 and the position and movement trajectory of the wafer hand 3 for taking out the semiconductor substrate 2 and installing the semiconductor substrate 2 at a predetermined position. And a transport arm 7 capable of Then, the semiconductor substrate 2 to be subjected to processing such as processing and inspection is taken out from the wafer cassette 1a, and placed on the rotary table 6 following a trajectory as shown by, for example, a dotted arrow. Further, after the processing such as processing and inspection is completed, the semiconductor substrate 2 returned to the rotary table 6 is taken out from the rotary table 6 and stored in the wafer cassette 1b.

  The transfer arm 7 has a plurality of joints and has a function of adjusting the planar position and height of the semiconductor substrate 2 held by the wafer hand 3 and may be any direction or position parallel or perpendicular to the paper surface. The semiconductor substrate 2 is moved to

  The wafer hand 3 supports and holds the semiconductor substrate 2 from the back surface while the wafer transfer unit 11 moves the semiconductor substrate 2 via the transfer arm 7. In addition, a strengthened glass portion 9 (light transmitting portion) is provided in a portion overlapping with the peripheral portion of the semiconductor substrate 2 in plan view between the front end portion of the wafer hand 3 and the transfer arm 7. The tempered glass portion 9 has a certain strength or more for holding the semiconductor substrate 2 and transmits light incident from the outside. The incident light may be in any form such as infrared light, laser, or visible light as needed to allow the semiconductor substrate 2 to be recognized.

  The light box 4 is embedded in the housing 8 at a predetermined position below the transfer path indicated by the dotted arrow of the semiconductor substrate 2 transferred by the wafer transfer unit 11. Then, when the semiconductor substrate 2 is positioned above, the semiconductor substrate 2 is irradiated with light, and a planar image of the semiconductor substrate 2 is projected on a recognition camera above the semiconductor substrate 2 not shown in FIG. The light box 4 only needs to be able to project the planar image of the semiconductor substrate 2 on the recognition camera at a position that does not prevent the movement of the semiconductor substrate 2, and the installation position may not be embedded in the housing 8. In addition, the light box 4 is disposed on the upper side of the track of the semiconductor substrate 2, emits light to the semiconductor substrate 2 located on the lower side, and projects a plane image on a recognition camera installed on the lower side of the semiconductor substrate 2. It may be of such a configuration.

  FIG. 2 is a cross-sectional view showing a schematic configuration of a portion of semiconductor substrate transfer apparatus 100 shown in FIG. 1 along the dotted arrow indicating the trajectory of semiconductor substrate 2. Semiconductor substrate 2 is located above light box 4. Showing the status. Here, the transfer arm 7 supporting the wafer hand 3 is omitted, and only the part related to the description of the present embodiment is shown.

  The wafer hand 3 supports and holds the semiconductor substrate 2 from the back side, and the tip on the right side of the paper surface of FIG. 2 is positioned inside one end on the right side of the paper surface in the peripheral portion of the semiconductor substrate 2 to the outside of the semiconductor substrate 2 Do not overhang. Further, the wafer hand 3 includes a strengthened glass portion 9 at a portion of the peripheral portion of the semiconductor substrate 2 located at the end on the left side of the drawing of FIG.

  The light box 4 is disposed below a predetermined position in the middle of the transport path of the semiconductor substrate 2 and irradiates light from the back surface to the semiconductor substrate 2 positioned above.

  The recognition camera 5 captures a planar image without a break at the peripheral edge portion of the semiconductor substrate 2 irradiated with the light of the light box 4 from below, converts it into digital electronic data, and takes it in. The recognition camera 5 only needs to recognize the shape of the entire semiconductor substrate 2 and does not need information such as the pattern shape and the color in the semiconductor substrate 2, so it may detect two values of light and dark.

  Here, the planar image having a break refers to an image in which the image of one that is not the semiconductor substrate 2 overlaps the peripheral edge of the planar image of the semiconductor substrate 2 captured by the recognition camera 5 and the peripheral edge is interrupted halfway. In the present embodiment, as described above, since the strengthened glass portion 9 is provided in the portion where the wafer hand 3 and the peripheral portion of the semiconductor substrate 2 overlap in plan view, the entire periphery of the semiconductor substrate 2 is photographed. It is possible to obtain a flat image with no cut at the peripheral edge.

  The image data arithmetic processing unit 15 corrects the position of the semiconductor substrate 2 to a predetermined position when the positional deviation of the semiconductor substrate 2 occurs based on the data of the planar image of the semiconductor substrate 2 sent from the recognition camera 5 The correction amount is calculated, and further includes an image processing unit 12 and an angle correction calculation unit 13 inside.

  From the data of the planar image of the semiconductor substrate 2 sent from the recognition camera 5, the image processing unit 12 identifies a circular portion in the peripheral portion of the semiconductor substrate 2 and a wafer outer periphery discontinuous portion 10 such as an orientation flat or notch. , And outputs the data to the angle correction operation unit 13. Further, to the wafer transfer control unit 14, position correction data for detecting the amount of planar positional deviation in the vertical and horizontal directions in the plan view of FIG. 1 from the predetermined position of the semiconductor substrate 2 is corrected. Output. For example, a circular reference image having the same radius as that of the semiconductor substrate 2 is prepared, and the vertical and horizontal dimensions of the reference image are minimized so that difference data when the reference image and the planar image of the semiconductor substrate 2 are superimposed is minimized. Adjust the horizontal position. Then, the amount of adjustment of the vertical and horizontal positions is taken as the amount of positional deviation from the predetermined position of the semiconductor substrate 2. Furthermore, after adjustment of the position of the semiconductor substrate 2, the portion of the semiconductor substrate 2 where the largest difference data is generated between the circular reference image and the semiconductor substrate 2 is taken as the wafer outer periphery discontinuous portion of the planar image of the semiconductor substrate 2, The other peripheral portion is a circular portion.

  The angle correction operation unit 13 specifies the center position of the semiconductor substrate 2 based on the data of the circular portion in the peripheral portion of the semiconductor substrate 2 sent from the image processing unit 12. For example, the position of one point having a circular portion may be selected, a second point such that the distance to the first point is maximized along the peripheral edge, and the middle point thereof may be set as the center position of the semiconductor substrate 2. Then, the positional relationship between the specified center position of the semiconductor substrate 2 and the discontinuous portion at the outer periphery of the semiconductor substrate is compared, and the angle at which the discontinuous portion 10 at the outer periphery of the semiconductor substrate is located in the plane of the semiconductor substrate 2 is calculated. Further, the angle of the semiconductor substrate peripheral discontinuous portion 10 is compared with a predetermined angle to be calculated, and the amount of angular deviation from the predetermined angle is calculated. Then, angle correction data for correcting the amount of angle deviation is output to the rotary table 6.

  The wafer transfer control unit 14 corrects the operation of the wafer transfer unit 11 on the basis of the position correction data sent from the image processing unit 12 in the portion which controls the operation of the wafer transfer unit 11 in FIG. The positional deviation in the vertical and horizontal directions in plan view of FIG. 1 is corrected.

  The rotating table 6 is a substrate setting unit for adsorbing and installing the semiconductor substrate 2 transferred from the wafer hand 3, and is rotatable around the center of the rotating table 6. The rotation angle can be controlled by external information such as the angle correction operation unit 13.

  The configuration of the wafer hand 3 according to the present embodiment will be described in more detail based on FIG. The wafer hand 3 is provided with a tempered glass portion 9 in a portion overlapping with the semiconductor substrate 2 in plan view. Since the semiconductor substrate 2 has a circular portion and a semiconductor substrate outer periphery discontinuous portion 10 such as an orientation flat at the peripheral portion, depending on the angle when the wafer hand 3 holds the semiconductor substrate 2, the circular portion and the semiconductor Both of the substrate outer peripheral discontinuous portions 10 may overlap with the wafer hand 3 in plan view. Therefore, the strengthened glass portion 9 is attached at such a position and width that the light from the light box 4 is irradiated to the peripheral portion of the semiconductor substrate 2 regardless of which is overlapped.

  Further, the tip portion supporting the semiconductor substrate 2 of the wafer hand 3 has a shape supporting the semiconductor substrate 2 in a region smaller than the region occupied by the semiconductor substrate 2 in plan view, and there is a portion projecting to the outside of the semiconductor substrate 2 do not do.

  With such a configuration, when light from the light box 4 is irradiated to the semiconductor substrate 2, the wafer hand 3 is all around the peripheral portion of the semiconductor substrate 2 no matter how the semiconductor substrate 2 is held. Does not block light.

  Next, the method of transporting a semiconductor substrate of the present embodiment will be described based on the flowchart of FIG.

  First, in the semiconductor substrate removal step (S101), when the wafer cassette 1a containing the semiconductor substrate 2 is placed in the housing 8 of FIG. 1, the wafer transfer unit 11 is not in any of the semiconductor substrates 2 in the wafer cassette 1a. Is taken out by the wafer hand 3. Specifically, wafer hand 3 stands still in front of wafer cassette 1a, moves linearly along the insertion direction of semiconductor substrate 2 in wafer cassette 1a, enters wafer cassette 1a, and holds semiconductor substrate 2 Do. Next, while holding the semiconductor substrate 2, the wafer hand 3 moves linearly along the direction opposite to the insertion direction of the semiconductor substrate 2 in the wafer cassette 1a, and the semiconductor substrate 2 moves out of the wafer cassette 1a. It comes to rest again when it comes out.

  Next, in the semiconductor substrate planar image photographing step (S 102), the semiconductor camera 2 which is held stationary while being taken out by the wafer hand 3 is photographed by the recognition camera 5. A light box 4 is provided below the position at which the wafer hand 3 takes the semiconductor substrate 2 out of the wafer carrier 1 a and is at rest, at a position above the semiconductor substrate 2 opposite to the light box 4 with respect to the semiconductor substrate 2. The recognition camera 5 is installed. Then, the light box 4 irradiates light to the semiconductor substrate 2 from the lower side, and projects a planar image of the entire surface of the semiconductor substrate 2 onto the recognition camera 5 installed on the upper side of the semiconductor substrate 2. The recognition camera 5 captures a planar image of the entire surface of the semiconductor substrate 2 and transfers the image data to the image processing unit 12. At this time, since the wafer hand 3 holding the semiconductor substrate 2 is provided with the strengthened glass portion 9 having the light transmitting portion, light is emitted to the entire peripheral portion of the semiconductor substrate 2 and projected on the recognition camera 5. Therefore, it is possible to obtain a planar image of the semiconductor substrate 2 having an unbroken peripheral portion.

  Next, in the semiconductor substrate planar image processing step (S103), the image processing unit 12 determines from the planar image of the semiconductor substrate 2 sent from the recognition camera 5 a circular portion in the peripheral portion of the semiconductor substrate 2, an orientation flat, a notch and the like. And the discontinuous portion 10 of the semiconductor substrate. Then, planar image data of the semiconductor substrate 2 in which the positions of the disc portion and the semiconductor substrate peripheral discontinuous portion 10 are specified is transferred to the angle correction operation unit 13. Further, the image processing unit 12 detects a planar positional deviation in the vertical and horizontal directions in plan view from a predetermined position of the semiconductor substrate 2, and outputs position correction data to the wafer conveyance control unit 14. The position correction data is used in a semiconductor substrate installation step (S105) described later.

  Next, in the semiconductor substrate rotation angle calculation step (S104), the angle correction operation unit 13 calculates the semiconductor substrate 2 based on the circular portion in the planar image of the semiconductor substrate 2 from the image data sent from the image processing unit 12. Identify the center position of Then, the positional relationship between the central position of the semiconductor substrate 2 and the semiconductor substrate outer periphery discontinuous portion 10 is compared, and the angle at which the semiconductor substrate outer periphery discontinuous portion 10 is located in the plane of the semiconductor substrate 2 is calculated. Then, the angle of the semiconductor substrate peripheral discontinuous portion 10 is compared with a predetermined angle, and the amount of angular deviation from the predetermined angle is calculated. Then, angle correction data for correcting the angle deviation is output to the rotary table 6 of FIG. The angle correction data is used in a semiconductor substrate installation angle correction step (S106) described later.

  Next, in the semiconductor substrate installation step (S 105), the semiconductor substrate 2 held by the wafer hand 3 is carried by the transfer arm 7 and moved onto the rotary table 6. Since the data communication and the calculation process are performed at high speed in the above-described semiconductor substrate plane image processing step (S103) and semiconductor substrate rotation angle calculation step (S104), movement of the semiconductor substrate 2 is not hindered and performed in parallel. , And ends before the semiconductor substrate installation step (S105). Then, in response to the position correction data in the vertical and horizontal directions in plan view outputted in the semiconductor substrate planar image processing step (S103), the wafer transport control unit 14 transmits the semiconductor substrate 2 from the wafer hand 3 through the transport arm 7. Correction of the position at the time of placing on the rotary table 6. By the above correction, the semiconductor substrate 2 is installed on the rotary table 6 at an accurate position, and positional deviation in the vertical and horizontal directions in plan view is suppressed.

  Next, in the semiconductor substrate installation angle correction step (S106), based on the angle correction data sent from the angle correction operation unit 13, the rotation table 6 on which the semiconductor substrate 2 is installed is divided by the angle at which the deviation is corrected. Only rotate. By the above correction, the angle at which the semiconductor substrate 2 rotates can be minimized to less than one rotation, so that the transport time before processing or inspection can be significantly shortened.

  Next, the semiconductor substrate 2 corrected to the desired angle is transferred from the rotary table 6, and processing such as processing and inspection is performed (not shown). Then, the semiconductor substrate 2 which has been subjected to processing such as processing and inspection is returned again to the rotary table 6, held by the wafer hand 3, and stored in the wafer cassette 1b by the transfer arm 7 (not shown). A series of processing is completed by performing the above-described transport processing and processing / inspection processing.

  Next, a method of manufacturing the semiconductor device of the present embodiment will be described. By manufacturing a semiconductor device using the transfer method shown in FIG. 4, the work period for manufacturing the semiconductor device can be shortened as compared with the related art. Therefore, it is possible to realize the cost reduction accompanying the shortening of the process time as well as the delivery of the semiconductor device in a short delivery time.

  The present invention is not limited to the above embodiment, and a flat image without a break in the peripheral portion of the semiconductor substrate is taken in the middle of the transport path of the semiconductor substrate, and the image processing is performed while the semiconductor substrate is moving. It goes without saying that various modifications can be made without departing from the spirit of the present invention in which the position correction is performed in a short time on the semiconductor substrate provided in the part.

  For example, in the above embodiment, the wafer transfer unit 11 is configured by the transfer arm 7 having a plurality of joints and the wafer hand 3 for holding the semiconductor substrate 2. Any form is acceptable. For example, the semiconductor substrate 2 may be held by a rail disposed between the wafer cassette 1a and the rotary table 6, and linearly transported along the rail.

  The wafer hand 3 holding the semiconductor substrate 2 may have any form as long as the wafer hand 3 can be generated without any break at the peripheral edge of the planar image of the semiconductor substrate 2. For example, in FIG. 3, the wafer hand 3 includes the tempered glass portion 9 in a portion overlapping the semiconductor substrate 2, but the tip portion supporting the semiconductor substrate 2 from the portion overlapping the semiconductor substrate 2 may be tempered glass . Alternatively, the entire wafer hand 3 may be tempered glass.

  Further, the tempered glass portion 9 may be made of a material which transmits light, and for example, a plastic or a resin material may be adopted.

  In the embodiment described above, the recognition camera 5 captures a planar image of the entire surface of the semiconductor substrate 2 at one time, but the image captured by moving the surface of the semiconductor substrate 2 in a planar manner and partially capturing the semiconductor substrate 2 is A method may be adopted in which the planar images of the entire surface of the semiconductor substrate 2 are formed by connecting them later. Alternatively, a method may be employed in which a plurality of recognition cameras are installed, a planar image of the semiconductor substrate 2 is partially captured by each of the recognition cameras, and the images are joined together later.

  Further, in the above embodiment, the specification of the center position in the planar image of the semiconductor substrate 2 obtained by the recognition camera 5 is calculated from the circular portion of the semiconductor substrate 2 in the angle correction operation unit 13. It is not a thing. For example, when the prepared circular reference image and the planar image of the semiconductor substrate 2 are superimposed so as to minimize difference data, the center position of the reference image specified in advance is taken as the center position of the semiconductor substrate 2. It does not matter how to do it.

  Moreover, in the said embodiment, although the light box 4 and the turntable 6 were installed in another position, the light box 4 may be installed so that the turntable 6 may be surrounded. The recognition camera 5 does not have to distinguish patterns in the semiconductor substrate 2, as long as it can recognize the outer shape of the semiconductor substrate 2, and the shape and the installation position of the light box 4 are not particularly limited.

  Further, when calculating the angular deviation of the semiconductor substrate 2, the prepared reference image having a discontinuous portion on the outer periphery of the semiconductor substrate is superimposed on the planar image of the semiconductor substrate 2 to shift the angle of the reference image. The difference data with the planar image may be calculated, and the angle at which the difference data is minimized may be adopted.

  In addition, the semiconductor substrate transfer device in the present embodiment is not limited to only the transfer processing of the semiconductor substrate before and after processing of the semiconductor substrate and inspection processing. For example, for a semiconductor substrate transfer machine used for the purpose of changing the arrangement order of a plurality of semiconductor substrates or dividing a semiconductor substrate group consisting of a plurality of semiconductor substrates into two or more semiconductor substrate groups, etc. The present embodiment can achieve the same effect.

1a, 1b Wafer cassette 2 Semiconductor substrate 3 Wafer hand 4 Light box 5 Recognition camera 6 Rotation table 7 Transfer arm 8 Case 9 Tempered glass part 10 Semiconductor substrate outer periphery discontinuous part 11 Wafer transfer part 12 Image processing part 13 Angle correction calculation Unit 14 Wafer transfer control unit 15 Image data arithmetic processing unit

Claims (7)

A semiconductor substrate transfer apparatus comprising a holder for holding and transferring a semiconductor substrate, the semiconductor substrate transfer apparatus comprising:
What is claimed is: 1. A semiconductor substrate transfer apparatus comprising a light transmission portion in a part of a holder.   The semiconductor substrate according to claim 1, wherein the light transmitting portion is a portion where at least the semiconductor substrate peripheral portion and the holder overlap in plan view when the holder holds the semiconductor substrate. Transport device. The holder;
A light box for irradiating the semiconductor substrate held by the holder with light;
A recognition camera installed at a position opposite to the light box with respect to the semiconductor substrate, for capturing planar image data of the semiconductor substrate;
An image data arithmetic processing unit that detects a displacement amount from a predetermined position with respect to the planar image data, and generates position correction data for correcting the displacement amount;
The semiconductor substrate transfer apparatus according to claim 1, further comprising: a semiconductor substrate setting unit capable of correcting the deviation amount based on the position correction data.   The semiconductor substrate transfer apparatus according to claim 3, wherein the semiconductor substrate installation unit includes a rotary table capable of controlling a rotation angle based on the position correction data. A method of transporting a semiconductor substrate, comprising
A planar image of the semiconductor substrate is acquired by a recognition camera in a state where the semiconductor substrate is held by a holder having a light transmitting portion in part, and the amount of deviation from a predetermined position is detected based on the planar image. A method of transporting a semiconductor substrate characterized by performing correction. A method of manufacturing a semiconductor device formed on a surface of a semiconductor substrate, comprising:
A method of manufacturing a semiconductor device, comprising the method of transferring a semiconductor substrate according to claim 5. A method of manufacturing a semiconductor device formed on a surface of a semiconductor substrate, comprising:
Holding and removing the semiconductor substrate in the first position by a holder having a light transmitting portion in part;
Obtaining a planar image of the semiconductor substrate having an unbroken peripheral portion by a recognition camera while holding the semiconductor substrate;
Detecting an amount of deviation from a predetermined position based on the planar image, and performing position correction;
Placing the semiconductor substrate, for which the position correction has been performed, at a second position;
A method of manufacturing a semiconductor device, comprising:

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