TWM642895U - Circuit board and electronic device - Google Patents

Abstract

A circuit board and an electronic device, the circuit board includes a substrate body and a socket hole. The insertion hole runs through the substrate body and has a connected reaming portion and an insertion hole with a larger diameter than the reaming portion. The maximum aperture of the section. The electronic device includes the circuit board, and a socket plugged in the socket hole. The plug connector includes a terminal column, several protruding arm rods abutting against the upper side of the substrate body, and several protruding foot rods abutting against the lower side of the substrate body. The circuit board can provide good insertion and positioning of the connector through the reaming design of the insertion hole, which can improve product yield.

Description

Circuit boards and electronic devices

The present invention relates to a circuit board, in particular to a circuit board and an electronic device.

In addition to laying out several electronic circuits and several electronic components on a board body, a general circuit board also needs to be provided with a socket hole on the board body for a plug-in connector connected to the outside to be inserted and inserted, and then connected together. The purpose of electrical connection is achieved through the wave soldering process of the tin furnace.

However, since the current insertion hole is usually a round hole design, and the connector includes a terminal column inserted into the insertion hole, two flat protruding outwards from the terminal column and resting on the upper side of the circuit board. a protruding arm bar, and two protruding leg rods obliquely protruding upward from the terminal post and leaning against the lower side of the circuit board, the maximum distance between the opposite side edges of the protruding leg rods is greater than the aperture of the insertion hole. When the connector is inserted downward into the insertion hole of the circuit board, the protruding rods will be squeezed inward due to the size of the insertion hole, but the protruding rods will Poor resilience, it is not easy to rebound and open after passing through the socket hole, and it is easy to cause the hook to fail. When using the wave soldering process of the tin furnace, the tin liquid will push the connector upwards and dislocate or skew. Lead to poor soldering, affect the combination, and then reduce the yield of the circuit board.

Therefore, the object of the present invention is to provide a circuit board which at least overcomes the disadvantages of the prior art.

Therefore, the circuit board of the present invention includes a substrate body and an insertion hole. The substrate body has an upper surface and a lower surface spaced apart from each other. The insertion hole passes through the upper surface and the lower surface of the substrate body, the insertion hole has a reaming portion and an insertion hole portion connected together, and the insertion hole also has a radially through the insertion hole portion The center and the maximum aperture of the reaming portion, the maximum aperture is larger than the aperture of the insertion portion, the aperture of the insertion portion is larger than the aperture of the reaming portion.

Therefore, the object of the present invention is to provide an electronic device which can at least overcome the disadvantages of the prior art.

Therefore, the electronic device of the present invention includes the above-mentioned circuit board and a connector. The connector is plugged into the insertion hole of the circuit board, and the connector includes an axially extending terminal column, several radially outwardly protruding from the terminal column and resting on the substrate body. The protruding arm bar on the upper surface, and several protruding leg rods protruding obliquely from the terminal column and abutting against the lower surface of the substrate body, the maximum distance between the opposite side edges of the protruding leg rods is less than the The maximum aperture of the insertion hole is larger than the aperture of the insertion hole.

The effect of the present invention is that: the design of the reaming part is added to the insertion hole of the circuit board, which can provide good insertion and positioning of the connector, and can improve the product yield.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numerals.

Referring to FIGS. 1 and 2 , a first embodiment of the new electronic device includes a circuit board 1 , a connector 2 , and a solder body 3 .

The circuit board 1 of the first embodiment is a double-sided PCB, and the circuit board 1 includes a substrate body 11 and an insertion hole 12 . In terms of overall outline, the substrate body 11 has an upper surface 111 and a lower surface 112 spaced apart from each other. In view of the layered structure, the substrate body 11 has a base material layer 113 and two copper foil layers 114 covering the upper and lower sides of the base material layer 113 respectively. The substrate layer 113 of the first embodiment is a single layer, which is an insulating layer made of, for example but not limited to, Bakelite or glass fiber. The two opposite sides of the copper foil layers 114 are respectively the upper surface 111 and the The lower surface 112 . Of course, the circuit board 1 can also be a multi-layer PCB in practice. In this case, the substrate layer 113 is multi-layered, and multi-layer insulating layers and at least one copper foil layer not shown in the figure are stacked, and no detailed description will be given here.

The insertion hole 12 passes through the upper surface 111 and the lower surface 112 of the substrate body 11, and has a reaming portion 121 and a receptacle portion 122 connected together. The reaming portion is shown in FIG. 4 during manufacture. 121 is a small round hole and the insertion hole 122 is a large round hole, but after they are united and communicated, the reaming portion 121 and the insertion hole 122 are fan-shaped to overlap and open. Of course, the shape can also be changed in design. It is not limited to the first embodiment, for example, the reaming portion 121 may also be rectangular. The insertion hole 12 also has a maximum diameter D passing radially through the center of the insertion hole 122 and the reaming portion 121, the maximum diameter D is greater than the diameter d of the insertion hole 122, and the diameter d of the insertion hole 122 larger than the hole diameter of the reaming portion 121 .

In addition, in order to electrically connect the copper foil layers 114, the circuit board 1 of the first embodiment further includes a conductive layer 13 disposed in the insertion hole 12 and electrically connected to the copper foil layers 114. The conductive layer 13 There are two ring edge portions 131 respectively surrounding the insertion hole 12 and electroplated on the outside of the copper foil layers 114, and one electroplating on the wall surface 115 of the substrate body 11 surrounding and defining the insertion hole 12 and co-body The hole peripheral portion 132 connecting the ring portions 131 makes the insertion hole 12 a Plating Through Hole. It should also be noted that since the conductive layer 13 is a covering layer covering the periphery of the socket hole 12, in order to conveniently indicate the size relationship between the socket hole 12 and the socket connector 2, in each drawing Some of the indicated aperture ranges refer to the conductive layer 13 plated on the insertion hole 12 .

The plug connector 2 is plugged into the socket hole 12 of the circuit board 1, and the plug connector 2 includes an axially extending terminal post 21, two spaced apart from each other, protruding radially outward from the terminal post 21 and overlapping with each other. The protruding arm 22 leaning against the upper surface 111 of the substrate body 11, and two protrusions projecting obliquely outward and upward from the terminal column 21 and abutting against the lower surface 112 of the substrate body 11 at intervals from each other. foot bar 23. The maximum distance L between the opposite side edges of the protruding legs 23 is smaller than the maximum diameter D of the insertion hole 12 and greater than the diameter d of the insertion hole 122 . It should be noted that the number of the protruding arm rods 22 or the protruding leg rods 23 is not limited to two, and may be three or more according to actual needs.

The solder body 3 is welded between the connector 2 and the conductive layer 13 of the circuit board 1, that is, between the protruding arms 22 and the upper ring edge portion 131 of the conductive layer 13, the Between the terminal post 21 and the hole peripheral portion 132 of the conductive layer 13, the protruding legs 23 and the conductive layer 13 are located between the lower ring edge portion 131, so that the connector 2 and the circuit board 1 electrical connection.

Referring to FIG. 1, FIG. 3 and FIG. 4, in order to better understand the structure of the electronic device, the following is a further description of the manufacturing method of the electronic device, which includes the following steps:

a) Prepare the substrate body 11 and the connector 2, the substrate body 11 has the base material layer 113, and the copper foil layers 114, the connector 2 includes the terminal post 21, the protruding arms 22 , And these protruding foot rods 23.

b) The reaming part 121 is drilled on the substrate body 11, and the receptacle part 122 is partially overlapped on the side of the reaming part 121, so that the reaming part 121 and the receptacle part 122 are united communicate with and jointly form the socket hole 12;

c) The conductive layer 13 is formed by electroplating at the insertion hole 12 , the conductive layer 13 has the ring portions 131 and the hole peripheral portion 132 , so as to complete the manufacturing process of the circuit board 1 .

d) Next, make the connector 2 above the insertion hole 12, let the prongs 23 face the reaming portion 121 and the insertion hole 122 and insert them down through the maximum hole diameter D until The protruding arm rods 22 lean against the ring portion 131 on the upper side of the conductive layer 13, and the protruding leg rods 23 protrude downward from the insertion hole 12, and make the connector 2 move laterally to allow When the axial center of the terminal column 21 is aligned with the center of the socket portion 122, then rotate the connector 2 by an angle, so that the protruding rods 23 leave the maximum aperture D of the socket hole 12, and lean against the card. The ring edge portion 131 located at the lower side of the conductive layer 13 completes the plug-in assembly of the plug connector 2 .

e) Finally, the circuit board 1 inserted with the connector 2 is sent into a tin furnace (not shown) with molten solder body 3, so that the solder body 3 is filled with the socket hole 12, and soldered The plug connector 2 and the conductive layer 13 of the circuit board 1 are used to fix and electrically connect the plug connector 2 and the circuit board 1 .

Referring to Fig. 5 and Fig. 6, the structure of a second embodiment of the novel electronic device is roughly the same as that of the first embodiment, the difference being that the circuit board 1 of the second embodiment is a single-sided PCB, so the substrate The body 11 has only one copper foil layer 114 , the copper foil layer 114 covers the lower side of the base material layer 113 , and the upper side of the base material layer 113 is not covered with the copper foil layer 114 . In this way, the circuit board 1 of the second embodiment can omit the setting of the conductive layer 13 (see FIG. 2 ), and the solder body 3 is only welded between the protruding rods 23 and the copper foil layer 114 between.

Referring to FIG. 5, FIG. 7 and FIG. 8, the manufacturing method of the second embodiment of the novel electronic device is substantially the same as that of the first embodiment, the difference being that the substrate body 11 prepared in step a) only has The copper foil layer 114, and omit the electroplating process of step c) (see Figures 3 and 4), and finally in the soldering process of step e), the solder body 3 only welds the prongs 23 and the copper foil layer 114 .

To sum up, in the new circuit board and electronic device, the insertion hole 12 of the circuit board 1 is designed by adding the reaming part 121, so that the maximum aperture D of the insertion hole 12 is larger than the protrusions The maximum distance L between the opposite side edges of the rods 23, when the connector 2 is inserted, the protruding rods 23 can pass through the maximum aperture D of the insertion hole 12 easily and without bending, and then After being positioned by the angle of rotation, the hooking function of the protruding rods 23 can be ensured, so that the connector 2 is well inserted and positioned. When using the wave soldering process of the tin furnace, the connector 2 will not be pushed upward. Over time, the product yield and reliability can be improved, so the purpose of the present invention can indeed be achieved.

But the above-mentioned ones are only embodiments of the present invention, and should not limit the scope of implementation of the present invention with this. All simple equivalent changes and modifications made according to the patent scope of the present application and the content of the patent specification are still within the scope of the present invention. Within the scope covered by this patent.

1: circuit board 11: Substrate body 111: upper surface 112: lower surface 113: substrate layer 114: copper foil layer 115: hole wall 12: socket hole 121: Reaming part 122: jack part D: Maximum aperture d: Aperture diameter of jack 13: Conductive layer 131: ring edge 132: Perimeter of the hole 2: Connector 21: Terminal column 22: convex arm lever 23: protruding foot rod L: The maximum distance between the opposite side edges of the protruding legs 3: Solder body

Other features and functions of the present invention will be clearly presented in the implementation manner with reference to the drawings, wherein: Fig. 1 is an incomplete three-dimensional sectional exploded view, illustrating a first embodiment of the novel electronic device; Figure 2 is a fragmentary partial cross-sectional view illustrating the first embodiment; Figure 3 is a sectional view of a manufacturing process illustrating the first embodiment; Figure 4 is a top view of a manufacturing process illustrating the first embodiment; Fig. 5 is an incomplete three-dimensional sectional exploded view, illustrating a second embodiment of the novel electronic device; Figure 6 is a fragmentary partial cross-sectional view illustrating the second embodiment; Figure 7 is a sectional view of a manufacturing process illustrating the second embodiment; and Fig. 8 is a top view of a manufacturing flow illustrating the second embodiment.

1: circuit board

11: Substrate body

111: upper surface

112: lower surface

113: substrate layer

114: copper foil layer

12: socket hole

121: Reaming part

122: jack part

D: Maximum aperture

d: Aperture diameter of jack

13: Conductive layer

131: ring edge

132: Perimeter of the hole

2: Connector

21: Terminal column

22: convex arm lever

23: protruding foot rod

L: The maximum distance between the opposite side edges of the protruding legs

Claims (8)

A circuit board comprising: a substrate body having spaced apart upper and lower surfaces; and An insertion hole, which passes through the upper surface and the lower surface of the substrate body, the insertion hole has a reaming part and an insertion hole part connected together, and the insertion hole also has a radial direction through the insertion hole The center of the part and the maximum diameter of the reaming part, the maximum diameter is larger than the diameter of the insertion hole, and the diameter of the insertion hole is larger than the diameter of the reaming part. The circuit board according to claim 1, wherein the substrate body also has a base material layer, and two copper foil layers coated on the upper and lower sides of the base material layer respectively, and the opposite sides of the copper foil layers are respectively become the upper surface and the lower surface. The circuit board as claimed in claim 2, wherein the circuit board further comprises a conductive layer disposed on the socket hole and electrically connected to the copper foil layers, the conductive layer has two layers respectively surrounding the socket hole and electroplated on The ring edge part outside the copper foil layers, and a hole peripheral part electroplated on the wall surface of a hole defining the insertion hole of the substrate body and connected with the ring edge parts in one body. The circuit board as claimed in claim 1, wherein the substrate body also has a base material layer, and a copper foil layer coated only on the lower side of the base material layer, and the copper foil layer is away from the side of the base material layer becomes the lower surface. An electronic device comprising: the circuit board as described in claim 3; and A plug connector is plugged into the socket hole of the circuit board, the plug connector includes an axially extending terminal column, several radially outwardly protruding from the terminal column and resting on the substrate body The protruding arm bar on the upper surface, and several protruding leg rods protruding obliquely outward from the terminal post and abutting against the lower surface of the substrate body, the maximum distance between the opposite side edges of the protruding leg rods is less than The maximum aperture of the insertion hole is larger than the aperture of the insertion hole. The electronic device as claimed in claim 5, wherein the electronic device further comprises a solder body, and the solder body is soldered between the plug and the conductive layer of the circuit board. An electronic device comprising: The circuit board as described in Claim 4; and A connector is plugged into the insertion hole of the circuit board, and the connector includes a terminal column inserted into the insertion hole and protruding downward from the lower surface, several radially outwardly protruding from the terminal column A protruding arm rod extending and leaning against the upper surface of the substrate body, and several protruding leg rods protruding obliquely from the terminal column and abutting against the lower surface of the substrate body, the protruding leg rods The maximum distance between opposite side edges is smaller than the maximum aperture of the insertion hole and larger than the aperture of the insertion hole. The electronic device according to claim 7, wherein the electronic device further comprises a solder body, and the solder body is welded between the protruding rods of the plug connector and the copper foil layer on the lower side of the circuit board.

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