CN110062526B - PCB circuit board based on safe paster electronic component - Google Patents
PCB circuit board based on safe paster electronic component Download PDFInfo
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- CN110062526B CN110062526B CN201910331531.1A CN201910331531A CN110062526B CN 110062526 B CN110062526 B CN 110062526B CN 201910331531 A CN201910331531 A CN 201910331531A CN 110062526 B CN110062526 B CN 110062526B
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- Prior art keywords
- groove
- circuit board
- patch
- electronic component
- pcb circuit
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Abstract
The invention discloses a PCB circuit board based on a safe patch electronic element, which comprises a PCB circuit board (4) and a patch electronic element (7), wherein the PCB circuit board (4) is provided with an element fixing area (11), a first welding disc (5) and a second welding disc (6) are arranged on the element fixing area (11), the bottom (10) of the patch electronic element (7) is provided with a first electrode area (8) and a second electrode area (9), and the outer surface of the patch electronic element (7) except the first electrode area (8) and the second electrode area (9) is wrapped with an insulating layer; and the first bonding pad (5) and the second bonding pad (6) are covered by the corresponding patch electronic element (7). The invention can effectively prevent short circuit between the surface-mounted electronic element and the surface-mounted electronic element, and between the surface-mounted electronic element and the shell, ensures the circuit safety, and can also make the surface-mounted electronic element densely distributed, thereby realizing the miniaturization of the PCB.
Description
Technical Field
The invention relates to a safe patch electronic element and a PCB (printed circuit board), belonging to the technical field of electronic components.
Background
As shown in fig. 1, two ends of a chip electronic component 1 are set to be an electrode region three 2 and an electrode region four 3, five surfaces of the electrode region three 2 and the electrode region four 3 are conductors, and after the chip electronic component is welded on a circuit board 4, areas of a pad one 5 and a pad two 6 on the circuit board 4 are larger than projection areas of the electrode region three 2 and the electrode region four 3 of the chip electronic component 1 on the circuit board 4, and the electrode region three 2, the electrode region four 3, the pad one 5 and the pad two 6 are exposed outside, so that short circuits are easily caused between the chip electronic component and the chip electronic component, between the chip electronic component and a housing, between the pad and the housing, and finally, a fire phenomenon is caused. As electronic products are now miniaturized, the density of the chip electronic components on the PCB is becoming more and more dense, and this short circuit phenomenon is more likely to occur. For example, many smart phones are designed to be thin and light, so that the layout of the chip electronic components is dense, and the electrode regions exposed outside are prone to short circuit, so that a mobile phone fire happens sometimes.
Disclosure of Invention
The purpose of the invention is as follows: in order to overcome the defects in the prior art, the invention provides the PCB based on the safe patch electronic element, which can effectively prevent short circuit between the patch electronic element and the patch electronic element, between the patch electronic element and the shell, and between the bonding pad and the shell, so that the patch electronic element can be densely distributed, and the miniaturization of the PCB is realized.
The technical scheme is as follows: in order to achieve the purpose, the invention adopts the technical scheme that:
a PCB circuit board based on safe patch electronic components comprises a PCB circuit board and patch electronic components, wherein the PCB circuit board is provided with an element fixing area, the element fixing area corresponds to one patch electronic component, a first welding disc and a second welding disc are arranged on the element fixing area, a first electrode area and a second electrode area are arranged at the bottom of the patch electronic component, areas occupied by the first electrode area and the second electrode area are located in the bottom area of the patch electronic component, and the outer surface of the patch electronic component except the first electrode area and the second electrode area is wrapped with an insulating layer; the first electrode area is a first groove, the second electrode area is a second groove, and conductor layers are coated on the inner walls of the first groove and the second groove; the first groove is welded on the corresponding first bonding pad, the second groove is welded on the corresponding second bonding pad, and the first bonding pad and the second bonding pad are both covered by the corresponding patch electronic element.
Further: and the inner wall of the first groove is provided with a first annular groove.
Further: and the inner wall of the second groove is provided with a second annular groove.
Preferably: the cross section of the groove perpendicular to the axial direction is sequentially reduced inwards along the groove opening.
Preferably: the section of the second groove perpendicular to the axial direction is inwards reduced along the groove opening in sequence.
Preferably: the first groove is welded on the corresponding first bonding pad through soldering tin.
Preferably: one end of the soldering tin is welded with the first bonding pad, the other end of the soldering tin is welded with the conductor layer of the first groove, and the soldering tin is at least filled in one fifth of the volume of the first groove.
Preferably: and the second groove is welded on the corresponding second bonding pad through soldering tin.
Preferably: one end of the soldering tin is welded with the second bonding pad, the other end of the soldering tin is welded with the conductor layer of the second groove, and the soldering tin is at least filled in one fifth of the volume of the second groove.
Preferably: the depth of the first groove is 0-1 mm, and the depth of the second groove is 0-1 mm.
Preferably: the chip electronic element comprises one of a chip resistor, a chip capacitor, a chip inductor and a chip diode.
Compared with the prior art, the invention has the following beneficial effects:
in the 6 outer surfaces of the paster electronic element, except the first electrode area and the second electrode area at the bottom, the outer surfaces of the rest parts are coated with insulating layers, so the exposed electrode areas of the paster electronic element are hidden, and accidents such as short circuit are prevented, therefore, the paster electronic element can be densely distributed on a PCB circuit board without worrying about short circuit phenomena easily caused by too close distances between the paster electronic element and the paster electronic element, between the paster electronic element and a shell, and between a welding disc and the shell, the area of the PCB circuit board can be effectively reduced, and the circuit is developed towards miniaturization and microminiaturization. In addition, the first electrode area and the second electrode area are both arranged in a groove shape, so that on one hand, the solder paste extruded between the pad and the chip electronic element can be accommodated, and the soldering flux in the solder paste during reflow soldering can be accommodated, and the poor tin beads and the poor tombstone can be prevented. On the other hand, the firm welding of the components on the PCB can be ensured.
Drawings
FIG. 1 is a diagram illustrating a conventional soldering of a chip electronic component on a PCB;
FIG. 2 is a top view of the patch electronic component of the present invention;
FIG. 3 is a bottom view of the patch electronic component of the present invention;
FIG. 4 illustrates a soldering condition 1 of the SMD electronic components on the PCB circuit board according to the present invention;
FIG. 5 is a diagram of a soldering condition 2 of the SMD electronic components on the PCB circuit board according to the present invention;
FIG. 6 shows a soldering condition 3 of the SMD electronic components on the PCB of the present invention;
fig. 7 shows the close-packed layout of the electronic components on the PCB according to the present invention.
Detailed Description
The present invention is further illustrated by the following description in conjunction with the accompanying drawings and the specific embodiments, it is to be understood that these examples are given solely for the purpose of illustration and are not intended as a definition of the limits of the invention, since various equivalent modifications will occur to those skilled in the art upon reading the present invention and fall within the limits of the appended claims.
A PCB circuit board based on safe patch electronic components is shown in figures 4 and 7 and comprises a PCB circuit board 4 and a patch electronic component 7, wherein the patch electronic component 7 comprises one of a patch resistor, a patch capacitor, a patch inductor and a patch diode. The PCB circuit board 4 is provided with an element fixing area 11, one element fixing area 11 corresponds to one patch electronic element 7, a first bonding pad 5 and a second bonding pad 6 are arranged on the element fixing area 11, the bottom 10 of the patch electronic element 7 is provided with a first electrode area 8 and a second electrode area 9, the areas occupied by the first electrode area 8 and the second electrode area 9 are both positioned in the bottom area 10 of the patch electronic element 7, and the outer surface of the patch electronic element 7 except the first electrode area 8 and the second electrode area 9 is coated with an insulating layer; electrode area 8 is recess one, electrode area two 9 is recess two, this can solve when the welding because the tin thick liquid leads to the problem appearance that overflows too much, too much tin thick liquid can enter into recess one, in the recess two, on the other hand, because the tin thick liquid can enter into recess one, in the recess two, can be fine with recess one, recess two is fixed on pad one 5 and pad two 6, prevent the hourglass, recess one, recess two degree of depth set up to be greater than 0 and are less than 1mm, this embodiment sets up the optimum degree of depth and is 0.5mm degree of depth. Conductor layers are coated on the inner walls of the first groove and the second groove, and the conductors are coated on the inner walls of the first groove and the second groove, so that the conductors are prevented from being exposed on the surface of the surface-mounted electronic element 7, and short circuit can be effectively prevented; the inner wall of the first groove is provided with a first annular groove, and the inner wall of the second groove is provided with a second annular groove. The section of the first groove perpendicular to the axial direction is sequentially reduced inwards along the groove opening, and the section of the second groove perpendicular to the axial direction is sequentially reduced inwards along the groove opening; the first groove is welded on the corresponding first pad 5 through soldering tin, one end of the soldering tin is welded with the first pad 5, the other end of the soldering tin is welded with the first groove conductor layer, the soldering tin at least fills one fifth of the volume of the first groove, the soldering tin can be welded on the first annular groove, meanwhile, due to the existence of the first groove, the two types of welding are arranged, the welding surface is increased, more soldering tin is contained, false welding is not prone to occurring, welding is firmer, namely, one 8 electrode area is welded firmly with one 5 pad, and communication is stable. And the second groove is welded on the corresponding second bonding pad 6 through soldering tin. Soldering tin one end and two 6 welding of pad, the other end welds with the conductor layer of recess two, and soldering tin fills up one fifth of two volumes of recess at least for soldering tin can weld on ring channel two, simultaneously because the existence of recess two, these two kinds of settings have increased the face of weld, have held more soldering tin, and the rosin joint is difficult for appearing, and the welding is more firm, and electrode zone two 9 welds firmly with two 6 welding of pad promptly, and the communication is stable. The first bonding pad 5 and the second bonding pad 6 are covered by the corresponding chip electronic elements 7, and short circuit can be effectively prevented.
The main reason for causing the short circuit fire is that the three electrode regions 2 and the four electrode regions 3 of the patch electronic element are exposed outside, and the problem can be solved only by hiding the three electrode regions 2 and the four electrode regions 3 exposed outside. The chip electronic component 7 of the present embodiment is illustrated by taking a chip resistor as an example, and the present invention is by no means limited to the chip resistor, and the present invention should also include a chip capacitor, a chip inductor, a chip diode, and the like, as shown in fig. 3. The electrode area I8 and the electrode area II 9 of the chip resistor are arranged at the bottom 10 of the chip resistor. Therefore, except for the first electrode area 8 and the second electrode area 9, other areas on 6 outer surfaces of the chip resistor are coated with insulating layers, the actual resistor is hidden inside the chip resistor, the first electrode area 8 and the second electrode area 9 are only two end leads of the resistor, in the embodiment, the first electrode area 8 and the second electrode area 9 are a first groove and a second groove, and the inner walls of the first groove and the second groove are coated with conductor layers, namely the two end leads of the resistor are connected with the conductor layers.
The design principle of the invention is as follows: the electrode area of the paster electronic element is arranged at the bottom of the paster electronic element, the groove is arranged at the bottom to serve as the electrode area, and the electrode area is hidden by the PCB when the paster electronic element is welded, so that accidents such as short circuit are effectively prevented, and the paster electronic element can be densely distributed on the PCB.
The method of soldering the chip resistor on the PCB 4 is shown in fig. 4, 5 and 6. Firstly, soldering paste is printed or coated on a first bonding pad 5 and a second bonding pad 6, then the chip resistor is placed on an element fixing area 11 of the PCB, an electrode area I8 and an electrode area II 9 of the chip resistor are aligned with the bonding pad I5 and the bonding pad II 6 of the PCB, in the process of extruding the chip resistor and the bonding pad, redundant soldering tin automatically enters the corresponding groove I and the groove II, the soldering paste at least fills one fifth of the volume of the groove I, so that the soldering tin can be welded on the first annular groove, and the soldering paste at least fills one fifth of the volume of the groove II, so that the soldering tin can be welded on the second annular groove. The solder paste is then melted by reflow soldering or a heat gun so that the chip resistor is soldered to the PCB 4. The final situation of the chip electronic element welded on the PCB is shown in FIG. 6, at this time, 5 outer surfaces of the chip resistor exposed outside are all covered with insulating layers and are not conductive, and the first bonding pad 5 and the second bonding pad 6 on the PCB are also covered by the bottom 10 of the chip resistor and are hidden, so that the chip resistor can avoid the phenomena of short circuit fire and the like caused by the fact that the bonding pads and the electrode areas are exposed outside, and even if the chip electronic element on the PCB is tightly arranged, the short circuit phenomenon cannot be caused, as shown in FIG. 7. This can further promote the development of electronic products towards miniaturization and miniaturization, and the circuit is safer.
The above description is only of the preferred embodiments of the present invention, and it should be noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the invention and these are intended to be within the scope of the invention.
Claims (10)
1. The utility model provides a PCB circuit board based on safe paster electronic component, includes PCB circuit board (4), paster electronic component (7), PCB circuit board (4) are provided with component fixed area (11), and component fixed area (11) correspond a paster electronic component (7), are provided with pad one (5) and pad two (6), its characterized in that on component fixed area (11): the bottom (10) of the paster electronic element (7) is provided with a first electrode region (8) and a second electrode region (9), the regions occupied by the first electrode region (8) and the second electrode region (9) are both positioned in the bottom region (10) of the paster electronic element (7), the outer surface of the paster electronic element (7) except the first electrode region (8) and the second electrode region (9) is wrapped with insulating layers, and the exposed electrode regions of the paster electronic element are hidden; the first electrode area (8) is a first groove, the second electrode area (9) is a second groove, and conductor layers are coated on the inner walls of the first groove and the second groove; the first groove and the second groove are used for accommodating the extruded solder paste between the bonding pad and the surface mounted electronic element and accommodating the soldering flux in the solder paste during reflow soldering; the first groove is welded on the corresponding first bonding pad (5), the second groove is welded on the corresponding second bonding pad (6), and the first bonding pad (5) and the second bonding pad (6) are both covered by the corresponding patch electronic element (7).
2. A PCB circuit board based on a secure patch electronic component according to claim 1, wherein: and the inner wall of the first groove is provided with a first annular groove.
3. A PCB circuit board based on a secure patch electronic component according to claim 2, wherein: and the inner wall of the second groove is provided with a second annular groove.
4. A PCB circuit board based on a secure patch electronic component according to claim 3, wherein: the section of the first groove perpendicular to the axial direction is sequentially reduced inwards along the opening of the groove; the section of the second groove perpendicular to the axial direction is inwards reduced along the groove opening in sequence.
5. A PCB circuit board based on a safe patch electronic component according to claim 4, characterized in that: the first groove is welded on the corresponding first bonding pad (5) through soldering tin.
6. A PCB circuit board based on a safe patch electronic component according to claim 5, characterized in that: one end of the soldering tin is welded with the first welding pad (5), the other end of the soldering tin is welded with the conductor layer of the first groove, and the soldering tin is at least filled in one fifth of the volume of the first groove.
7. A PCB circuit board based on a safe patch electronic component of claim 6, wherein: and the second groove is welded on the corresponding second bonding pad (6) through soldering tin.
8. A PCB circuit board based on a secure patch electronic component according to claim 7, wherein: one end of the soldering tin is welded with the second bonding pad (6), the other end of the soldering tin is welded with the conductor layer of the second groove, and the soldering tin is at least filled in one fifth of the volume of the second groove.
9. A PCB circuit board based on a secure patch electronic component according to claim 8, wherein: the depth of the first groove is 0-1 mm, and the depth of the second groove is 0-1 mm.
10. A PCB circuit board based on a secure patch electronic component according to claim 9, wherein: the patch electronic element (7) comprises one of a patch resistor, a patch capacitor, a patch inductor and a patch diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910331531.1A CN110062526B (en) | 2019-04-24 | 2019-04-24 | PCB circuit board based on safe paster electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910331531.1A CN110062526B (en) | 2019-04-24 | 2019-04-24 | PCB circuit board based on safe paster electronic component |
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| Publication Number | Publication Date |
|---|---|
| CN110062526A CN110062526A (en) | 2019-07-26 |
| CN110062526B true CN110062526B (en) | 2021-10-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910331531.1A Active CN110062526B (en) | 2019-04-24 | 2019-04-24 | PCB circuit board based on safe paster electronic component |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111863459B (en) * | 2020-06-28 | 2021-10-08 | 华中科技大学 | Preparation method and application of patch type micro filter capacitor |
| CN114531791B (en) * | 2022-03-04 | 2023-04-14 | 深圳市晶世界透明显示技术股份有限公司 | Manufacturing method of LED die bonding transparent display screen, storage medium and electronic equipment |
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| CN103281876A (en) * | 2013-05-28 | 2013-09-04 | 中国电子科技集团公司第十研究所 | Pit embedded circuit board three-dimensional assembling method |
| JP2014067756A (en) * | 2012-09-24 | 2014-04-17 | Sharp Corp | Surface mounting structure of circuit board, and printed board equipped with surface mounting structure |
| CN204206612U (en) * | 2014-10-20 | 2015-03-11 | 惠州市康冠科技有限公司 | A kind of anti-printed circuit board (PCB) connecting tin |
| CN204616192U (en) * | 2015-06-03 | 2015-09-02 | 李树祥 | Without the PCB of soldering |
| CN105072821A (en) * | 2015-07-21 | 2015-11-18 | 深圳市辰驹电子科技有限公司 | Commutator for converting direct-insertion electronic element into vertical surface mount element and mounting structure thereof |
| CN207638976U (en) * | 2017-11-21 | 2018-07-20 | 佛山市顺德区骏达电子有限公司 | A kind of circuit board of anti-dropout |
-
2019
- 2019-04-24 CN CN201910331531.1A patent/CN110062526B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09260794A (en) * | 1996-03-19 | 1997-10-03 | Tokin Corp | Electronic circuit board |
| JP2005327895A (en) * | 2004-05-14 | 2005-11-24 | Olympus Corp | Printed wiring board |
| CN101069456A (en) * | 2005-03-29 | 2007-11-07 | 株式会社村田制作所 | Mounting structure for electronic component |
| CN102523682A (en) * | 2011-12-09 | 2012-06-27 | 华为技术有限公司 | Circuit board assembly and electronic apparatus |
| CN202565326U (en) * | 2012-03-27 | 2012-11-28 | 深圳市鸿宇顺科技有限公司 | Circuit board for lowering main board noise and mobile phone |
| JP2014067756A (en) * | 2012-09-24 | 2014-04-17 | Sharp Corp | Surface mounting structure of circuit board, and printed board equipped with surface mounting structure |
| CN103281876A (en) * | 2013-05-28 | 2013-09-04 | 中国电子科技集团公司第十研究所 | Pit embedded circuit board three-dimensional assembling method |
| CN204206612U (en) * | 2014-10-20 | 2015-03-11 | 惠州市康冠科技有限公司 | A kind of anti-printed circuit board (PCB) connecting tin |
| CN204616192U (en) * | 2015-06-03 | 2015-09-02 | 李树祥 | Without the PCB of soldering |
| CN105072821A (en) * | 2015-07-21 | 2015-11-18 | 深圳市辰驹电子科技有限公司 | Commutator for converting direct-insertion electronic element into vertical surface mount element and mounting structure thereof |
| CN207638976U (en) * | 2017-11-21 | 2018-07-20 | 佛山市顺德区骏达电子有限公司 | A kind of circuit board of anti-dropout |
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| CN110062526A (en) | 2019-07-26 |
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Effective date of registration: 20230801 Address after: 200137 building C, No. 888, Huanhu West 2nd Road, Lingang New Area, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Patentee after: Shanghai ruishenglian Information Technology Co.,Ltd. Address before: 1 No. 211167 Jiangsu city of Nanjing province Jiangning Science Park Hongjing Road Patentee before: NANJING INSTITUTE OF TECHNOLOGY Effective date of registration: 20230801 Address after: No. 1 Workshop, Group 16 and Group 17, Wannan Village, Wanping, Hengfan, East Taihu Lake Ecological Tourism Resort (Taihu New Town), Wujiang District, Suzhou City, Jiangsu Province, 215000 Patentee after: Jinyun Intelligent Electronics (Suzhou) Co.,Ltd. Address before: 200137 building C, No. 888, Huanhu West 2nd Road, Lingang New Area, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Patentee before: Shanghai ruishenglian Information Technology Co.,Ltd. |