TWM642196U - Grinding trimmer for two-side use - Google Patents

Abstract

The creation discloses a grinding and trimming device used on both sides, which includes a carrier, a plurality of grinding blocks and a bonding material. The carrier has an opposite upper surface and a lower surface, and has a plurality of opening structures distributed at intervals around the center of the carrier. A plurality of grinding blocks are respectively arranged in the plurality of opening structures of the carrier, wherein each grinding block has a first grinding surface exposed on the upper surface of the carrier and a second grinding surface exposed on the lower surface of the carrier. The bonding material is filled into the plurality of opening structures to fix the plurality of grinding blocks. Therefore, the grinding trimmer used on both sides of the invention has the advantages of longer service life, less material consumption, lower cost, more convenient and flexible use and maintenance.

Description

Abrasive dresser for double-sided use

This creation relates to a grinding tool, in particular to a grinding and trimmer used on both sides, which can be widely used in the processing of brittle and hard materials such as ceramics, metals, glass, wafers and the like.

In the semiconductor manufacturing process, the wafer is continuously deposited, exposed, developed, and etched to form layers of microcircuits; if each layer of microcircuits is uneven, it will inevitably affect the superposition between layers, so it must be flat to a certain extent Only then can there be a way to make an integrated circuit with good performance.

Chemical Mechanical Polishing (CMP) is one of the common planarization technologies in the semiconductor manufacturing process. It uses a polishing pad (Pad) to contact the wafer (or other semiconductor components), and uses a polishing liquid as needed to make the Polishing pads remove impurities or uneven structures on the wafer surface through chemical reactions and physical and mechanical forces. When the polishing pad is used for a period of time, the grinding debris generated during the grinding process tends to accumulate on the surface of the polishing pad, resulting in a reduction in the grinding effect and efficiency. In top condition.

However, in the existing dressers, the grinding unit (such as the grinding block) with abrasive grains is fixed to the carrier by the non-working surface, that is to say, only one side can actually play a role, and the abrasive grains that really participate in the dressing of the polishing pad Very limited; this not only causes a waste of abrasive grains, but also shortens the service life of the dresser. In addition, when a part of the grinding unit of the existing dresser loses the dressing ability due to operational defects or wear and tear, the whole dresser can only be replaced.

The technical problem to be solved by this creation is to provide a two-sided abrasive dresser for the deficiencies of the prior art, and its front and back sides can be used to dress the polishing pad, such as removing the waste accumulated on the surface of the polishing pad to maintain good processing quality and efficiency.

In order to solve the above-mentioned technical problems, one of the technical solutions adopted in the present invention is to provide a double-sided abrasive dresser, which includes a carrier, a plurality of abrasive blocks and a bonding material. The carrier has an upper surface and a lower surface opposite to the upper surface, and has a center of the carrier and a plurality of opening structures distributed at intervals around the center of the carrier. A plurality of grinding blocks are respectively arranged in a plurality of the opening structures, wherein each of the grinding blocks has a first grinding surface exposed on the upper surface of the carrier and the first grinding surface exposed on the carrier. A second grinding surface of the lower surface. The bonding material is filled into the plurality of opening structures to fix the plurality of grinding blocks.

In an embodiment of the present invention, each of the opening structures has a hollow portion and at least one supporting portion disposed around the hollow portion. Each of the grinding blocks includes a grinding portion and at least one wing disposed around the grinding portion, the grinding portion is accommodated in the hollow portion of the corresponding opening structure, and the first grinding surface and The second grinding surfaces are formed on the grinding part opposite to each other, and at least one wing part abuts against at least one supporting part of the corresponding opening structure. The bonding material is configured such that at least one wing portion of each grinding block is integrally connected with at least one abutting portion of the corresponding opening structure.

In an embodiment of the present invention, at least one wing portion of each grinding block is fixed on at least one supporting portion of the corresponding opening structure by a part of the bonding material.

In an embodiment of the present invention, at least one wing portion of each grinding block has at least one through hole, and another part of the bonding material passes through at least one through hole to contact the corresponding opening At least one of the bearing portions of the structure.

In an embodiment of the present invention, at least one of the supporting portions completely surrounds the hollow portion.

In an embodiment of the present invention, the carrier has a plurality of first fixing holes that do not overlap with the plurality of opening structures, and the plurality of first fixing holes are adjacent to the edge of the carrier.

In an embodiment of the present creation, the abrasive dresser for use on both sides further includes a mounting gasket, the mounting gasket is fixed on the upper surface or the lower surface of the carrier, and avoids many The location of the opening structure.

In an embodiment of the present invention, the thickness of the mounting pad is greater than the height of the first grinding surface relative to the upper surface of the carrier, or greater than the height of the second grinding surface relative to the carrier. the height of the lower surface.

In an embodiment of the present invention, the carrier has a plurality of first fixing holes that do not overlap with the plurality of opening structures, and the plurality of first fixing holes are adjacent to the edge of the carrier. In addition, the installation spacer has a plurality of first installation holes corresponding to the positions of the plurality of first fixing holes.

In an embodiment of the present invention, each of the abrasive blocks includes a plurality of abrasive grains, and the plurality of abrasive grains are diamond grains or cubic boron nitride grains. Alternatively, each grinding block includes a cemented carbide body and a grinding layer coated on an outer surface of the cemented carbide body.

In an embodiment of the present invention, the carrier is in the shape of a disc, and the number of the plurality of opening structures is four and distributed at uniform intervals around the center of the carrier.

One of the beneficial effects of this creation is that by virtue of "a plurality of grinding blocks are respectively arranged in a plurality of opening structures of the carrier, wherein each grinding block has a first grinding surface exposed on the upper surface of the carrier and a lower surface exposed on the carrier The technical features of "the second grinding surface of the carrier" and "the bonding material is filled into the multiple opening structures of the carrier to fix multiple grinding blocks". When the passivation loses the trimming ability, it only needs to be turned over to change to the other side for trimming. In addition, multiple grinding blocks exist independently, and grinding blocks that do not meet the work requirements (such as damaged grinding blocks) can be directly removed from the carrier for replacement without replacing the entire dresser.

In order to further understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings about this creation. However, the provided drawings are only for reference and explanation, and are not used to limit this creation.

The following is a description of the implementation of the "Grinding and Dressing Device Used on Both Sides" disclosed in this creation through specific specific examples. Those skilled in the art can understand the advantages and effects of this creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the idea of this creation. In addition, the drawings of this creation are only for simple illustration, not according to the actual size of the depiction, prior statement. The following embodiments will further describe the relevant technical content of this creation in detail, but the disclosed content is not intended to limit the protection scope of this creation. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

Unless otherwise defined, terms used herein have the same meaning as commonly understood by those skilled in the art. The materials involved in each embodiment are commercially available or prepared according to the prior art unless otherwise specified.

[first embodiment]

Referring to FIGS. 1 to 4 , the first embodiment of the present invention provides a grinding dresser Z, which mainly includes a carrier 1 , a plurality of grinding blocks 2 and a bonding material 3 . The carrier 1 has an upper surface 101 and a lower surface 102 opposite to it, and has a carrier center 1c and a plurality of opening structures 11 distributed at intervals around the carrier center 1c. A plurality of grinding blocks 2 are respectively arranged in a plurality of opening structures 11, wherein each grinding block 2 has a first grinding surface 201 exposed on the upper surface 101 of the carrier 1 and a second grinding surface exposed on the lower surface 102 of the carrier 1. Grinding surface 202 . The bonding material 3 is filled into the plurality of opening structures 11 to fix the plurality of grinding blocks 2 . Therefore, the front and back sides of the abrasive dresser Z of this creation can be used to dress the polishing pad, such as removing the waste accumulated on the surface of the polishing pad, so that the surface of the polishing pad has a certain roughness to maintain good processing quality and efficiency .

Further speaking, both the first grinding surface 201 and the second grinding surface 202 of a plurality of grinding blocks 2 can be used as working surfaces. Turning over the carrier 1 can change the second grinding surface 202 of multiple grinding blocks 2 to carry out the finishing work.

It should be noted that although the dressing of the wafer polishing pad is used as an example in this article to describe the characteristics of the grinding and dressing device Z of this creation, the grinding and dressing device Z of this invention can also be used in other finishing processes. Objects of brittle and hard materials such as ceramics, metals, glass, wafers, etc. are trimmed.

In this embodiment, the carrier 1 can be configured to hold a plurality of grinding blocks 2 on the driving head (not shown in the figure) of a polishing machine, so that the plurality of grinding blocks 2 can be driven by the driving head to perform polishing on the polishing pad. Conditioning work to restore the surface topography of the polishing pad and remove accumulated waste from the surface of the polishing pad. The carrier 1 can be a metal carrier such as a metal disc, but not limited thereto; the outer diameter of the carrier 1 can be 9 cm to 50 cm, and the thickness can be 0.2 cm to 3 cm. However, the outer diameter and thickness of the carrier 1 can be elastically adjusted according to actual application requirements. In some embodiments, the carrier 1 can also be a hard plastic carrier.

In addition, the carrier 1 may have a plurality of first fixing holes 1h1, and a plurality of fixing members F such as screws or bolts may respectively pass through the plurality of first fixing holes 1h1, so as to realize the connection between the carrier 1 and the driving head of the polishing machine. Fixed connection. Furthermore, the plurality of first fixing holes 1h1 are set to avoid the plurality of opening structures 11, that is, the positions of the plurality of first fixing holes 1h1 and the plurality of opening structures 11 do not overlap each other, and the plurality of first fixing holes 1h1 Adjacent to the edge of the carrier 1 .

Optionally, the carrier 1 can also have a plurality of second fixing holes 1h2 to adapt to machines of different manufacturers and models, or fixing pieces of different structures and sizes. Furthermore, the plurality of second fixing holes 1h2 are set to avoid the plurality of opening structures 11 and the plurality of first fixing holes 1h1, that is, the plurality of second fixing holes 1h2 are connected with the plurality of opening structures 11 and the plurality of first fixing holes. The positions of the holes 1h1 do not overlap each other, and the positions of the plurality of second fixing holes 1h2 are closer to the center 1c of the carrier than the plurality of first fixing holes 1h1 .

As shown in Figures 2 and 4, in order to skillfully and compactly combine a plurality of grinding blocks 2 on the carrier 1, each opening structure 11 of the carrier 1 has a hollow part 111 and at least one bearing arranged around the hollow part 111. Rely on part 112; each grinding block 2 includes a grinding part 21 and at least one wing 22 arranged around the grinding part 21, wherein the grinding part 21 is accommodated in the hollow part 111 of the corresponding opening structure 11, and the first grinding surface 201 and the second grinding surface 202 are formed on the grinding portion 21 opposite to each other, and at least one wing portion 22 abuts against at least one supporting portion 112 of the corresponding opening structure 11 . In addition, the bonding material 3 is configured such that at least one wing portion 22 of each grinding block 2 is integrally connected with at least one supporting portion 112 of the corresponding opening structure 11 . Furthermore, at least one wing portion 22 of each grinding block 2 is fixed on at least one supporting portion 112 of the corresponding opening structure 11 by a part of the bonding material 3 .

In practical application, a plurality of opening structures 11 may have substantially the same directionality relative to the carrier center 1c, and in each opening structure 11, at least one supporting portion 112 may completely surround the hollow portion 111; the hollow portion 111 may be For a hollow groove, the number of at least one supporting portion 112 may be one and formed in a ring shape. The bonding material 3 can be an adhesive material such as synthetic resin composition, which has good adhesion to the carrier 1 . However, the above descriptions are only possible implementations and are not intended to limit the present invention.

As shown in Fig. 4, in order to make the fixing effect of the bonding material 3 to a plurality of grinding blocks 2 better, the wings 22 of the grinding block 2 can have at least one through hole 22h, and part of the bonding material 3 can pass through at least one through hole 22h to Contacting the supporting portion 112 below produces an effect similar to locking.

Please refer to FIG. 11 , in this embodiment, the abrasive block 2 may include a hard alloy main body 21a and an abrasive layer 21b covering the outer surface of the hard alloy main body 21a. The cemented carbide main body 21a is used as the basis of the grinding block 2, and a three-dimensional pattern with ups and downs is arranged on the outer surface; the cemented carbide can be tungsten carbide, silicon carbide or other hard metals, and the grinding layer 21b can be a diamond film layer, but this creation is not limited in the example above.

In some embodiments, the grinding block 2 can include a bonding agent and abrasive grains, and the molding method of the grinding block 2 can include hot pressing or cold pressing forming steps, sintering, coating steps and fine processing steps (that is, processing out grinding part 21 and wing part 22). The bonding agent can be resin, metal or ceramic bonding agent; the abrasive particles can be diamond abrasive particles or cubic boron nitride abrasive particles, and their size can be micron or nanometer.

Please refer to Fig. 7 to Fig. 10 again. It should be noted that the grinding trimmer Z of this invention can modify the objects of different brittle and hard materials by changing the number, shape and arrangement of multiple grinding blocks 2. ; In addition, it is also possible to change the size and type of abrasive grains in a plurality of grinding blocks 2 at the same time.

[Second embodiment]

Referring to FIG. 5 and FIG. 6 , the second embodiment of the present invention provides a grinding dresser Z, which includes a carrier 1 , a plurality of grinding blocks 2 , a bonding material 3 and a mounting gasket 4 . The carrier 1 has an upper surface 101 and a lower surface 102 opposite to the upper surface 101, and has a carrier center 1c and a plurality of opening structures 11 distributed at intervals around the carrier center 1c. A plurality of grinding blocks 2 are respectively arranged in a plurality of opening structures 11, wherein each grinding block 2 has a first grinding surface 201 exposed on the upper surface 101 of the carrier 1 and a second grinding surface exposed on the lower surface 102 of the carrier 1. Grinding surface 202 . The bonding material 3 is filled into the plurality of opening structures 11 to fix the plurality of grinding blocks 2 . The mounting gasket 4 can be fixed on the upper surface 101 or the lower surface 102 of the carrier 1 and avoid the positions where the plurality of opening structures 11 are located, so as to prevent the first grinding surface 201 or the second grinding surface 202 of the plurality of grinding blocks 2 from being damaged. crushed and damaged.

Furthermore, in the trimming process of the wafer polishing pad, a fixed connection can be formed between the carrier 1 and the driving head (not shown in the figure) of the polishing machine through the mounting pad 4, so that the driving head can drive the carrier 1, so that multiple A grinding block 2 uses one of the first grinding surface 201 and the second grinding surface 202 to dress the polishing pad, and in the presence of the mounting gasket 4, the other of the first grinding surface 201 and the second grinding surface 202 One side can keep a safe distance from the drive head.

In practice, the thickness of the mounting pad 4 is greater than the height of the first grinding surface 201 relative to the upper surface 101 of the carrier 1 , or greater than the height of the second grinding surface 202 relative to the lower surface 102 of the carrier 1 . In addition, the mounting spacer 4 has a plurality of first mounting holes 4h1 , the number and position of which correspond to the plurality of first fixing holes 1h1 of the carrier 1 . When in use, the fixing member F such as a screw or a bolt can be sequentially passed through the first fixing hole 1h1 and the first installation hole 4h1, and locked into the driving head of the polishing machine. In order to adapt to different fixtures or machines, the mounting pad 4 may also have a plurality of second mounting holes 4h2 , the number and position of which correspond to the multiple second fixing holes 1h2 of the carrier 1 .

The relevant technical details mentioned in the first embodiment are still valid in this embodiment, and will not be repeated here to reduce repetition. Likewise, the related technical details mentioned in this embodiment can also be applied in the first embodiment.

[Advantageous Effects of Embodiment]

One of the beneficial effects of this creation is that by virtue of "a plurality of grinding blocks are respectively arranged in a plurality of opening structures of the carrier, wherein each grinding block has a first grinding surface exposed on the upper surface of the carrier and a lower surface exposed on the carrier The technical features of "the second grinding surface of the carrier" and "the bonding material is filled into the multiple opening structures of the carrier to fix multiple grinding blocks". When the passivation loses the trimming ability, it only needs to be turned over to change to the other side for trimming. In addition, multiple grinding blocks exist independently, and grinding blocks that do not meet the work requirements (such as damaged grinding blocks) can be directly removed from the carrier for replacement without replacing the entire dresser.

In addition, the grinding and trimming device of the present invention can fix the mounting gasket on the upper surface or the lower surface of the carrier when in use, so as to prevent the first grinding surface or the second grinding surface of multiple grinding blocks from being squeezed and damaged .

Furthermore, the grinding and trimming device of this invention has the advantages of longer service life, less material consumption, lower cost, more convenient and flexible use and maintenance, and the like.

The content disclosed above is only the preferred feasible embodiment of this creation, and does not limit the scope of patent application for this creation. Therefore, all equivalent technical changes made by using the instructions and drawings of this creation are included in the application of this creation. within the scope of the patent.

Z: grinding dresser 1: carrier 1c: Carrier center 1h1: First fixing hole 1h2: Second fixing hole 101: upper surface 102: lower surface 11:Open structure 111: hollow out part 112: Supporting part 2: Grinding block 201: the first grinding surface 202: the second grinding surface 21: Grinding department 21a: Carbide body 21b: grinding layer 22: wing 22h: Through hole 3: Combined material 4: Install gasket 4h1: The first mounting hole 4h2: Second mounting hole F:Fixer

FIG. 1 is a three-dimensional schematic diagram of a grinding and trimming device assembly according to the first embodiment of the present invention.

FIG. 2 is a partially exploded three-dimensional schematic diagram of the grinding and trimming device according to the first embodiment of the present invention.

FIG. 3 is a schematic top view of the grinding and trimming device according to the first embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view along line IV-IV in FIG. 3 , showing a sintered abrasive block.

FIG. 5 is a three-dimensional schematic diagram of a grinding and trimmer assembly according to a second embodiment of the present invention.

FIG. 6 is a partially exploded three-dimensional schematic diagram of a grinding and trimming device according to a second embodiment of the present invention.

FIG. 7 to FIG. 10 are schematic diagrams of different implementation aspects of the grinding and trimming device according to the first and second embodiments of the present invention.

FIG. 11 is another schematic cross-sectional view along line IV-IV in FIG. 3 , showing the abrasive block in the form of a coating.

Z: grinding dresser

1: carrier

1c: Carrier center

1h1: First fixing hole

1h2: Second fixing hole

101: upper surface

102: lower surface

11:Open structure

111: hollow out part

112: Supporting part

2: Grinding block

21: Grinding department

22: wing

22h: Through hole

3: Combined material

Claims (11)

A reversible abrasive dresser comprising: A carrier having an upper surface and a lower surface opposite to the upper surface, wherein the carrier has a center of the carrier and a plurality of opening structures distributed at intervals around the center of the carrier; A plurality of grinding blocks are respectively arranged in a plurality of the opening structures, wherein each of the grinding blocks has a first grinding surface exposed on the upper surface of the carrier and a first grinding surface exposed on the lower surface of the carrier a second abrasive surface of the surface; and A bonding material is filled into the plurality of opening structures to fix the plurality of grinding blocks. The grinding and trimming device used on both sides according to claim 1, wherein each of the opening structures has a hollow part and at least one supporting part arranged around the hollow part; each of the grinding blocks includes a grinding part and at least one wing part arranged around the grinding part, the grinding part is accommodated in the hollow part of the corresponding opening structure, and the first grinding surface and the second grinding surface are opposite to each other Formed on the grinding part, and at least one of the wings abuts against at least one of the supporting parts of the corresponding opening structure; the bonding material is configured so that at least one of each of the grinding blocks One of the wing parts is integrally connected with at least one of the supporting parts of the corresponding opening structure. The abrasive dresser used on both sides according to claim 2, wherein at least one wing of each abrasive block is fixed to at least one bearing of the corresponding opening structure by a part of the bonding material Lean on top. The abrasive dresser used on both sides as claimed in claim 3, wherein at least one wing portion of each abrasive block has at least one through hole, and another part of the bonding material passes through at least one through hole to The at least one abutting portion is in contact with the corresponding opening structure. The abrasive dresser for double-sided use as claimed in claim 2, wherein at least one of the abutment parts completely surrounds the hollow part. The abrasive dresser used on both sides according to claim 1, wherein the carrier has a plurality of first fixing holes that do not overlap with the positions of the plurality of opening structures, and the plurality of first fixing holes are adjacent to edge of the carrier. The abrasive dresser used on both sides as described in claim 6 further includes a mounting pad, the mounting pad is fixed on the upper surface or the lower surface of the carrier, and avoids a plurality of the Where the opening structure is located. The grinding dresser used on both sides according to claim 7, wherein the thickness of the mounting pad is greater than the height of the first grinding surface relative to the upper surface of the carrier, or greater than the height of the second grinding surface. For the height of the lower surface of the carrier. The abrasive dresser used on both sides according to claim 7, wherein the carrier has a plurality of first fixing holes that do not overlap with the positions of the plurality of opening structures, and the plurality of first fixing holes are adjacent to The edge of the carrier; the installation spacer has a plurality of first installation holes corresponding to the positions of the plurality of first fixing holes. The abrasive dresser for both sides as claimed in claim 1, wherein each of the abrasive blocks contains a plurality of abrasive grains, and the plurality of abrasive grains are diamond grains or cubic boron nitride grains. The grinding dresser for both sides as claimed in claim 1, wherein each of the grinding blocks comprises a hard alloy main body and an abrasive layer coated on an outer surface of the hard alloy main body.

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