TWM641828U - Substrate edge grinding system - Google Patents

Abstract

A substrate edge grinding system includes a fixing mechanism, a transfer mechanism, a grinding mechanism, a measuring unit and a control unit. The transfer mechanism is used for carrying the substrate. The grinding mechanism is relatively slid on the fixing mechanism and includes a base, an angle adjustment element and a grinding device. The angle adjustment element is used to drive the grinding device to rotate, and the grinding device moves relative to the base. The measuring unit is set on the fixing mechanism. The control unit is connected to the measurement unit and calculates the position of the substrate measured by the measurement unit before grinding to form at least one grinding path, and controls the position of the grinding device according to the grinding path, and controls the angle adjustment element to adjust the angle of the grinding device relative to the substrate, so that the grinding The device grinds the edges of the substrate.

Description

Substrate edge grinding system

The present disclosure relates to a substrate edge grinding system.

The conventional technology for grinding the edge of the base material cannot automatically adjust the angle, so it is often necessary to manually adjust the angle of the grinding wheel and re-calibrate the point to confirm the grinding accuracy. In this way, a lot of production time will be wasted and the production capacity will be reduced. , and due to the manual adjustment of the grinding wheel angle, the grinding accuracy is difficult to control. Moreover, the conventional technology has no means of measurement, calibration, and compensation, and it is difficult to control the accuracy of the workpiece. Of course, although grinding heads with different angles can be configured on the production line, the overall equipment length, tool cost and maintenance cost will be doubled; there is also a method of grinding the workpiece with a forming tool, although this method can quickly grind the workpiece Forming, but it is difficult to meet the requirements of multi-angle high-precision grinding as shown in Figure 5B; in addition, the workpiece is the glass substrate of the display panel as an example. The end face is ground into multiple angles to facilitate circuit wiring in the subsequent process, and the production of the forming tool and overcoming its own wear are also the bottleneck of its mass production.

In addition, conventional technology will be subject to external temperature changes, resulting in reduced grinding accuracy.

Therefore, how to improve and provide a substrate edge grinding system to avoid the above-mentioned problems is an issue to be solved in the industry.

The embodiment of the present disclosure provides a substrate edge grinding system, which can automatically adjust the angle, has the ability to adjust the dynamic grinding posture, and can improve the grinding accuracy.

A substrate edge grinding system according to an embodiment of the present disclosure includes a fixing mechanism, a transfer mechanism, at least one grinding mechanism, a measuring unit and a control unit. The transfer mechanism is used to carry a substrate, and the transfer mechanism moves relative to the fixing mechanism along a first direction. At least one grinding mechanism is relatively slidably arranged on the fixing mechanism. The grinding mechanism includes a base, an angle adjustment element and a grinding device. The grinding device moves along a second direction relative to the base. The grinding device moves along a second direction relative to the base. The third direction moves, the second direction and the third direction are respectively different from the first direction, and the angle adjustment element is used to drive the grinding device to rotate around the first direction to have multiple angles at different time points. The measuring unit is set on the fixing mechanism. When the transfer mechanism moves to the grinding mechanism along the first direction, the measuring unit can measure the position of the base material in the second direction and the third direction before grinding; and the control unit is connected with the measuring unit, and the control unit will measure The position calculation of the second direction and the third direction of the substrate measured by the measuring unit before grinding forms at least one grinding path, and the control unit can control the position of these grinding devices in the second direction and the third direction according to each grinding path position, and control the angle adjustment element to adjust the angle of the grinding device relative to the substrate, and the grinding device rotates relative to the substrate along the first direction, so that these grinding devices grind the edge of the substrate.

A substrate edge grinding system according to an embodiment of the present disclosure, the substrate edge grinding system includes a fixing mechanism, a transfer mechanism, at least one grinding mechanism and a temperature control mechanism. The transfer mechanism is used to carry a substrate, and the transfer mechanism moves relative to the fixing mechanism along a first direction. The grinding mechanism is relatively slidingly arranged on the fixing mechanism. The grinding mechanism includes a base, an angle adjustment element and a grinding device. Each grinding device moves along a second direction relative to the base. The grinding device is relatively When the base moves along a third direction, the second direction and the third direction are respectively different from the first direction, the angle adjustment element is used to drive the grinding device to rotate around the first direction to have multiple angles at different time points, these The grinding devices are rotated relative to the substrate in a first direction, causing the grinding devices to grind the edges of the substrate. The temperature control mechanism includes a thermal insulation element and an ice water machine element. The thermal insulation element is arranged on the outer surfaces of the fixing mechanism, the transfer mechanism and the grinding mechanism. The components of the chiller are connected to the grinding mechanism, and the components of the chiller are controlled by a coolant, which is provided to the transfer mechanism.

The substrate edge grinding system of the disclosed embodiment includes a fixing mechanism, a transfer mechanism, at least one grinding mechanism and a measuring unit. The transfer mechanism is used to carry a substrate, and the transfer mechanism moves relative to the fixing mechanism along a first direction. The grinding mechanism is relatively slidably arranged on the fixing mechanism, and the grinding mechanism includes a base, an angle adjustment element and a grinding device. The grinding device moves along a second direction relative to the base, the grinding device moves along a third direction relative to the base, the second direction and the third direction are respectively different from the first direction, and the angle adjustment element is used to drive the grinding device Rotating about a first direction with an angle at different points in time, the grinding devices are rotated relative to the substrate along the first direction such that the grinding devices grind the edge of the substrate. The measuring unit is arranged on the fixing mechanism, and the measuring unit includes a plurality of first measuring elements and a plurality of second measuring elements. The first measuring element is arranged on the grinding mechanism along the second direction, the second measuring element is arranged on the grinding mechanism along the third direction, and the first measuring element and the second measuring element are located on the upstream side of the grinding device, when When the transfer mechanism moves to the grinding mechanism along the first direction, the first measuring element and the second measuring element are capable of measuring the position of the substrate in the second direction and the third direction before grinding respectively.

In order to make the present disclosure more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

100,200: substrate edge grinding system

110: fixed mechanism

112: bed platform

114: Longmen

120: transfer mechanism

122,322: carrier

124: base

126: extension

130: Correction unit

140: grinding mechanism

141: base

142: Cylinder

144: Angle adjustment element

146: Grinding device

146A: Abrasive

150: Measuring unit

152,252: the first measuring element

154,254: Second measuring element

156,256: the third measuring element

158A: The first optical ruler

158B: Second optical ruler

160: control unit

170,270,370: temperature control mechanism

172: Insulation element

174: Chiller components

322A: Internal position

376: Cold water runner

378: Temperature control system

A: Angle

A1: area

B: Angle of inclination

C1: first chamfer

C2: second chamfer

C3: Third chamfer

K1: The first abrasive particle size

K2: Second abrasive grain size

L1: the first direction

L2: the second direction

L3: the third direction

M1: coolant

N1, N2: fluid insulation pipe

R: direction of rotation

ST: Substrate

ST1, ST2, ST11, ST12: Edge

ST3: upper surface

TE: Counterpoint mark

FIG. 1 is a schematic diagram of an embodiment of a substrate edge grinding system of the present disclosure.

FIG. 2 is a top view of an embodiment of the substrate edge grinding system of the present disclosure.

FIG. 3A is a schematic side view of an embodiment of the transfer mechanism of the present disclosure.

FIG. 3B is a schematic top view of an embodiment of the transfer mechanism of the present disclosure.

FIG. 3C is a schematic top view of the transfer mechanism of the present disclosure moving to the calibration unit.

FIG. 4A is a schematic side view of the transfer mechanism of the present disclosure moving to the measurement unit.

FIG. 4B is a schematic top view of the transfer mechanism of the present disclosure moving to the measurement unit.

FIG. 5A is a schematic diagram of an embodiment of the grinding process of the grinding mechanism of the present disclosure.

Fig. 5B is a partially enlarged schematic diagram of the area A1 in Fig. 5A.

FIG. 6A is a schematic diagram of an embodiment of the first measuring element and the second measuring element of the present disclosure.

FIG. 6B is a schematic diagram of the first measuring element and the second measuring element cooperating with the first optical ruler and the second optical ruler according to the present disclosure.

FIG. 6C is a schematic diagram of another embodiment of the first measuring element and the second measuring element of the present disclosure.

FIG. 7A is a schematic diagram of an embodiment of the third measuring element of the present disclosure.

FIG. 7B is a schematic diagram of another embodiment of the third measuring element of the present disclosure.

FIG. 8 is a schematic diagram of an embodiment of the abrasive material of the grinding device of the present disclosure.

FIG. 9 is a schematic diagram of an embodiment of a grinding device for double-grain size grinding according to the present disclosure.

FIG. 10 is a schematic diagram of another embodiment of the substrate edge grinding system of the present disclosure.

FIG. 11 is a schematic diagram of another embodiment of the disclosed temperature control mechanism.

FIG. 12 is a schematic diagram of another embodiment of the temperature control mechanism of the present disclosure.

Embodiments are listed below and described in detail with accompanying drawings, but the provided embodiments are not intended to limit the scope of the present disclosure. In addition, the drawings are for illustration purposes only and are not drawn to original scale. In order to facilitate understanding, the same elements will be described with the same symbols in the following description.

Terms such as "including", "comprising", and "having" mentioned in this disclosure are all open terms, that is, "including but not limited to".

In the description of various embodiments, when terms such as "first" and "second" are used to describe elements, they are only used to distinguish these elements from each other, and do not limit the order or importance of these elements.

In the description of various embodiments, the so-called "coupling" or "connection" may refer to two or more elements being in direct physical or electrical contact with each other, or indirect physical or electrical contact with each other, and "coupling" Connected or connected may also refer to two or more elements operating or acting with each other.

FIG. 1 is a schematic diagram of an embodiment of a substrate edge grinding system of the present disclosure. FIG. 2 is a top view of an embodiment of the substrate edge grinding system of the present disclosure. Please refer to FIG. 1 and FIG. 2, the substrate edge grinding system 100 of the present disclosure includes a fixing mechanism 110, a transfer mechanism 120, a calibration unit 130, and at least one grinding mechanism 140 (the grinding mechanism shown in FIG. 2 140 is two), a measurement unit 150, a control unit 160 and a temperature control mechanism 170, wherein the control unit 160 is connected to the measurement unit 150, the grinding mechanism 140 and the calibration unit 130, and the temperature control mechanism 170 is used to control The edge grinding system of substrate ST (as shown in Figure 3A) reduces the influence of product accuracy caused by temperature difference ring. It should be noted that the transfer mechanism 120 moves relative to the fixing mechanism 110 along the first direction L1, passing through the calibration unit 130, the measurement unit 150 and the grinding mechanism 140 in sequence. It can be seen that the calibration unit 130 is located at the measurement unit 150 The upstream side of the grinding mechanism 140, or the measuring unit 150 and the grinding mechanism 140 are located downstream of the calibration unit 130, and the direction from the "upstream side" to the "downstream side" is parallel to the first direction L1.

In this embodiment, the fixing mechanism 110 includes a bed platform 112 and a gantry 114 , the length of the bed platform 112 extends along the first direction L1 , and the gantry 114 is disposed on the bed platform 112 .

In this embodiment, two calibration units 130 are respectively provided on the fixing mechanism 110, and the two calibration units 130 are respectively movably provided on the gantry 114, and these two calibration units 130 can move relatively along the second direction L2, so that The transfer mechanism 120 can pass between the two calibration units 130 . In one embodiment, the calibration unit 130 is, for example, a Charge-coupled Device (CCD); in one embodiment, the calibration unit 130 can return the image of the substrate ST to the control unit 160 to calculate the substrate ST position, and then control the transfer mechanism 120 to adjust the position, so as to facilitate the operation on the downstream side; and, in another implementation, the correction unit 130 can be a contact-type position-guiding mechanism, that is, it can be used in the conveying direction The positioning pulleys arranged in a tapered manner guide the substrate ST.

In this embodiment, two grinding mechanisms 140 are relatively slidingly arranged on the fixing mechanism 110. Each grinding mechanism 140 is a multi-axis mechanism that can move relative to the bed 112. The grinding mechanism 140 includes a base 141, a The cylinder 142 , an angle adjusting element 144 and a grinding device 146 . The base 141 is arranged on the bed platform 112, a cylinder 142 is connected on the base 141, the angle adjustment element 144 is connected with the cylinder 142, and the grinding device 146 is arranged on the angle adjustment element 144, wherein the cylinder 142 is Can slide relative to the base 141, the angle adjustment element 144 can slide relative to the cylinder 142, that is, the two grinding devices 146 can be driven by the cylinder 142 relative to the base 141 moves along a second direction L2, and the angle adjustment element 144 and the grinding device 146 move relative to the cylinder 142 of the base 141 along a third direction L3, wherein the second direction L2 and the third direction L3 are respectively different from the first One direction L1. The angle adjusting element 144 is, for example, a direct drive motor (DD motor), which is used to drive the grinding device 146 to rotate around the first direction L1. In other embodiments, the angle adjustment element 144 can also be a swing module formed by a link mechanism to drive the grinding device 146 to adjust the angle relative to the substrate ST (as shown in FIG. 3A ), but it is not intended to be limit.

In this embodiment, the measuring unit 150 is arranged on the fixing mechanism 110, and the measuring unit 150 includes a plurality of first measuring elements 152 and a plurality of second measuring elements 154, and these first measuring elements 152 are arranged along the second The grinding mechanism 140 is arranged in the direction L2, and the second measuring elements 154 are arranged in the grinding mechanism 140 along the third direction L3. The first measuring elements 152 and the second measuring elements 154 are respectively located upstream of the grinding device 146 . The first measuring element 152 and the second measuring element 154 are, for example, probe gauges.

FIG. 3A is a schematic side view of an embodiment of the transfer mechanism of the present disclosure. FIG. 3B is a top view of an embodiment of the transfer mechanism of the present disclosure. Please refer to Figures 2 to 3B. The transfer mechanism 120 of the present disclosure is used to carry a substrate ST. Specifically, the transfer mechanism 120 includes a stage 122, a base 124 and an extension 126. The base 124 is movably arranged on the bed 112, the stage 122 is arranged on the base 124, and the substrate ST is located on the base 124. On the stage 122 , the substrate ST has two opposite edges ST1 , ST2 , and these two edges ST1 , ST2 respectively correspond to the grinding mechanism 140 as shown in FIG. 2 . In addition, there is at least one (eg, two) alignment marks TE on the substrate ST, and the type of the alignment marks TE can be adjusted according to the actual situation. In the present disclosure, the alignment marks TE can be set near the edges ST1 and ST2.

In one embodiment, the extension piece 126 is connected to one side of the base 124 , and the extension piece 126 is located at the front end of the stage 122 . In one embodiment, the measurement unit 150 includes a plurality of third Measuring elements 156 , these third measuring elements 156 are arranged at the front end of the stage 122 of the transfer mechanism 120 . The third measuring element 156 is, for example, a probe.

In one embodiment, the film feeding process at the upstream end: the substrate ST can be moved to the stage 122 of the transfer mechanism 120 by a claw or manually, and the substrate ST is absorbed and fixed by the stage 122 . Next, alignment process: the transfer mechanism 120 moves relative to the fixing mechanism 110 along the first direction L1 to move the substrate ST to the position of the calibration unit 130, as shown in FIG. 3C and with reference to FIG. 2, the transfer mechanism 120 transfers the substrate ST through the calibration unit 130, the calibration unit 130 can detect the alignment mark TE on the substrate ST, and the control unit 160 (Fig. 1) controls the transfer mechanism 120 to adjust according to the detection result of the calibration unit 130 The position of the substrate ST is convenient for measurement by the measurement unit 150 located on the downstream side. For example, the calibration unit 130 (such as a CCD) captures the alignment mark TE (such as a cross mark) at the corner of the substrate ST, and transmits the shooting result information to the control unit 160, and the control unit 160 controls the transfer mechanism after calculation 120 corrects the rotation displacement of the substrate ST to correct the error of the parallelism between the substrate ST and the first direction L1 after the film is placed, that is, the position of the substrate ST is corrected through the correction unit 130. Of course, the aforementioned transfer mechanism 120 is a multi-axis To the organization of the movement.

Next, the edge measurement process: the transfer mechanism 120 continues to move relative to the fixing mechanism 110 along the first direction L1, so as to move the substrate ST from the position of the calibration unit 130 to the position of the measurement unit 150, that is, the grinding mechanism 140 On the upstream side, as shown in Figure 4A and Figure 4B and with reference to Figure 2, when the transfer mechanism 120 moves to the grinding mechanism 140 along the first direction L1, the measuring unit 150 is the energy measuring substrate ST The positions of the second direction L2 and the third direction L3 before grinding. For example, the first measuring element 152 installed on the grinding mechanism 140 in the second direction L2 is used to measure the profile, parallelism or flatness of the end surface of the substrate ST, and installed on the grinding mechanism in the third direction L3 The second measuring element 154 of 140 is used to measure the height of the substrate ST, by the first measuring element 152 and the second measuring element 154 measure the curves of the edges ST1 and ST2 of the substrate ST. It should be noted that during the process of the substrate ST being moved along the first direction L1, the first measuring element 152 and the second measuring element 154 will continuously measure a plurality of points (you can specify how many points to measure ) and recorded and transmitted to the control unit 160 as the edge position information of the edge position of the substrate ST, that is, the shape of the edge of the substrate ST can be obtained.

Next, the angle grinding process: the control unit 160 (as shown in Figure 1) calculates the position information of the second direction L2 and the third direction L3 of the substrate ST measured by the measurement unit 150 before grinding to form one (or more) ) grinding path, and the control unit 160 can control the positions of these grinding devices 146 in the second direction L2 and the third direction L3 according to each grinding path, and control the angle adjustment element 144 to adjust the position of the grinding device 146 relative to the substrate ST Angle A, the angle adjustment element 144 is used to drive the grinding device to rotate around the first direction L1 to have a plurality of angles A at different time points, the grinding device 146 rotates along the first direction L1 with respect to the substrate ST in a rotation direction R, so that Grinding device 146 adjusts position and angle, grinds to conform to the shape of substrate ST, makes these grinding devices 146 grind the edge ST11, ST12 of substrate ST, because angle adjustment element 144 drives grinding device 146 to rotate around the first direction L1 and has different Multiple angles A at time points, that is to say, the angle adjusting element 144 of the present disclosure can automatically adjust the angle of the grinding device 146 to increase the production capacity.

It can be seen that the present disclosure can supplement the position of the substrate ST in the second direction L2 and the third direction L3 on the transfer mechanism 120 by measuring the substrate ST before grinding, thereby generating a grinding path and grinding The path can provide the adjustment of the dynamic grinding posture of the grinding device 146 during the grinding process, and can have the first chamfer C1, the second chamfer C2 and the third chamfer C3 with three different angles of the edge ST11 as shown in FIG. 5B For example, the angle adjusting element 144 can be adjusted to a first angle first, and the stage 122 can be moved along the first direction L1, so that the grinding device 146 can grind the substrate ST During the grinding process, the edge ST11 and ST12 of the substrate ST can be adjusted and compensated to update the edge position of the substrate ST according to the curve of the edge ST11 and ST12 of the substrate ST measured by the first measuring element 152 and the second measuring element 154 location information. Then adjust the angle adjustment unit 144 to the second angle and repeat the above steps until the third angle. After the substrate ST is ground, the stage 122 sends the substrate ST out along the first direction L1. In this way, as shown in FIG. 5B , the edge ST11 has three different angles of the first chamfer C1 , the second chamfer C2 and the third chamfer C3 , so that the end surface of the edge of the substrate ST is processed into a polygonal shape. In this way, when metal wires are arranged on the edge of the subsequent substrate ST, the wires are less likely to be broken due to the sharp angle of the substrate ST. Moreover, in another embodiment, during the feeding and grinding process of the substrate ST along the first direction L1, since the first measuring element 152 and the second measuring element 154 are relatively located on the upstream side of the grinding device 146 Therefore, the edge position information of the substrate ST can be measured first, and then sent to the control unit 160 in real time to calculate the grinding path corresponding to the measured position. When the measured position is fed to the grinding device 146, the The control unit 160 dynamically adjusts the grinding attitude of the grinding device 146 according to the grinding path. In addition, the following examples are not intended to be limiting. The disclosure can achieve multi-angle precision. In Figure 5B, the thickness specifications of the substrate ST can be 1.8mm, 1.6mm, 1.3mm, 1.1mm, One of 0.7mm, 0.55mm, 0.4mm and 0.33mm; and in the requirements of grinding and forming, the length of the first chamfer C1 is 10μm±1μm, the length of the second chamfer C2 is 11μm±1μm and the length of the second chamfer C2 The length of the triangular chamfer C3 is 12 μm±1 μm, and the angle adjustment unit 144 can be controlled to adjust the grinding angle of the grinding device 146 by the aforementioned method to achieve multi-angle grinding on the edge of the substrate ST.

It should be noted that after the above-mentioned first measuring element 152 and second measuring element 154 measure the substrate ST according to the actual grinding angles, multiple grinding paths are generated, or the first measuring element 152 and the second measuring element 152 After the second measuring element 154 measures once, a grinding path is generated, and then After grinding according to the grinding path, the substrate ST is measured again by the first measuring element 152 and the second measuring element 154 .

Further, as shown in FIG. 6A, the first measuring element 152 measures the edge ST1 of the substrate ST to measure the parallelism of the end surface of the substrate ST; the second measuring element 154 measures the edge ST1 of the substrate ST The surface ST3 is used to measure the height of the substrate ST. The present disclosure is not limited thereto. As shown in FIG. 6B, the measuring unit 150 further includes a first optical ruler 158A and a second optical ruler 158B. The first optical ruler 158A is adjacent to the first measuring element 152, and the first optical ruler 158A is adjacent to the first measuring element 152. The second optical ruler 158B is adjacent to the second measuring element 154, so it can be seen that the first optical ruler 158A and the second optical ruler 158B are respectively installed on the grinding mechanism 140 along the second direction L2 and the third direction L3 and can be used for measuring The feeding of the grinding device 146 . With the feedback information from the first optical scale 158A and the second optical scale 158B, the control unit 160 can control the grinding device 146 to grind the substrate according to the grinding path during the grinding process, thereby effectively controlling and improving the grinding accuracy. Moreover, since the first optical scale 158A and the second optical scale 158B have read heads, they do not rely on the values transmitted by the servo motor in the grinding mechanism 140 .

The above-mentioned first measuring element 152 and second measuring element 154 are contact probes, but this disclosure is not limited to this. As shown in FIG. 6C, the first measuring element 252 and the second measuring element 254 are non-contact Contact probes such as CCDs or range finders.

In addition, as shown in FIG. 7A, FIG. 2, FIG. 4A and FIG. 4B, when the transfer mechanism 120 is transported to the grinding mechanism 140 along the first direction L1, the third measuring elements 156 measure these grinding devices 146, and record the thickness of the grinding device 146, so as to compensate and adjust at least one grinding path. It can be seen from this that, by measuring the thickness of the abrasive 146A of the grinding device 146 before and after grinding, the wear of the material (such as the grinding wheel abrasive) of the grinding device 146 during the compensation is compensated to adjust the grinding path to ensure that the grinding device The 146 can grind in the correct position and the amount of grinding. The third measuring element 156 is a contact probe, but the present disclosure is not limited thereto. In FIG. 7B , the third measuring element 256 is a non-contact probe.

FIG. 8 is a schematic diagram of an embodiment of the abrasive material of the grinding device of the present disclosure. Please refer to FIG. 5A and FIG. 8, the abrasive 146A of the grinding device 146 of the present disclosure further includes a first abrasive grain size K1 and a second abrasive grain size K2, so that the grinding device 146 of the present disclosure is a composite grinding wheel, wherein the second abrasive grain size K2 is located at The periphery of the first abrasive grain size K1 thereby constitutes a grinding device 146 with two or more grain sizes. In one embodiment, the angular posture of the grinding device 146 relative to the substrate ST is controlled so that the abrasive 146A grinds the substrate ST in a partial area at the moment of grinding, and the particle size of the second abrasive particle size K2 is smaller than that of the first abrasive The particle size of the particle size K1 can be designed such that the first abrasive particle size K1 is used as coarse grinding, and the second abrasive particle size K2 is used as fine grinding, so that the substrate ST is fed from the inner ring of the abrasive 146A to the outer periphery during the relative movement. , can make the substrate ST achieve the effect of coarse grinding and fine grinding in the same grinding process, avoid cracks in the base material caused by only coarse grinding, and avoid insufficient cutting amount only by fine grinding, and can be simultaneously Taking into account the needs of production time and precision within a certain period of time. It is worth noting that, in other embodiments, the angle adjustment element 144 is used to drive the grinding device 146 to rotate around the first direction L1, wherein the grinding device 146 is at a certain angle relative to the first direction L1. The spatial posture of the angle is set, and the abrasive material 146A can grind the substrate ST in a partial area during the grinding process.

FIG. 9 is a schematic diagram of an embodiment of the grinding device used for double-grain grinding in the present disclosure. As shown in FIG. 9, the substrate ST is moved along the first direction L1, and the grinding device 146 is rotated around the second direction L2 An inclination angle B makes the edge ST1 of the substrate ST passing through the grinding device 146 (in other embodiments, the edge ST2 is also done in the same way), it can be first coarsely ground through the first abrasive particle size K1 shown in Fig. 8, so that cutting The amount is sufficient, and then through the fineness of the second abrasive grain size K2 Grinding, fine grinding can repair the cracks caused by coarse grinding, and the effect of coarse grinding and fine grinding can be achieved when the substrate ST is moved.

FIG. 10 is a schematic diagram of another embodiment of the substrate edge grinding system of the present disclosure. Please refer to FIG. 10, the temperature control mechanism 170 of the substrate edge grinding system 200 of the present disclosure includes a heat preservation element 172, and the heat preservation element 172 is arranged on the fixing mechanism 110, the transfer mechanism 120, the calibration unit 130, the grinding mechanism 140, the measuring The outer surfaces of the measuring unit 150 and the control unit 160. Since the fixing mechanism 110 and the transfer mechanism 120 are usually made of metal materials such as iron, aluminum, and stainless steel, and of course other materials, such as granite and other stone materials, the thermal deformation of the substrate ST, the fixing mechanism 110, and the transfer mechanism 120 Accumulation will deform with temperature changes. Therefore, the thermal insulation element 172 of the present disclosure is, for example, thermal insulation foam, which reduces the surface area of the substrate edge grinding system 200 in contact with air, thereby reducing the thermal deformation of the substrate edge grinding system 200 caused by room temperature changes or non-uniform distribution. In addition, through the heat preservation element 172 , the calibration unit 130 , the grinding mechanism 140 , and the measurement unit 150 have higher stability, and can have higher precision in measurement and compensation.

FIG. 11 is a schematic diagram of another embodiment of the disclosed temperature control mechanism. Please refer to Figure 11. In addition to the influence of uneven distribution or changes in room temperature, high frictional temperatures are generated during the grinding process. The grinding coolant can provide cooling and lubrication during grinding. If the temperature of the grinding coolant is the same as the temperature of the stage 122 The difference will also lead to thermal deformation during the grinding process, and if the water at the factory end is used, the temperature of the substrate may be different. Therefore, the temperature control mechanism 270 of the present disclosure includes a chiller component 174, and the chiller component 174 Connected to the grinding mechanism 140, the ice water machine element 174 is a temperature-controlled coolant M1, thereby controlling the temperature of the coolant M1 to be the same as the room temperature, and providing the coolant M1 through the pipeline and guiding it to the load of the transfer mechanism 120 On the platform 122, reducing the temperature drop causes the carrier platform 122 to have thermal expansion and cooling deformation, thereby improving the grinding accuracy; and, in another embodiment, the cooling provided by the chiller element 174 The temperature of coolant M1 can be dynamically adjusted according to the grinding speed, grinding time, or ST material of the base material, so as to reduce the influence of temperature factors on the grinding accuracy.

FIG. 12 is a schematic diagram of another embodiment of the temperature control mechanism of the present disclosure. Please refer to FIG. 12, the temperature control mechanism 370 of the present disclosure includes a cold water flow channel 376, the cold water flow channel 376 includes fluid insulation pipes N1, N2, and the fluid insulation pipes N1, N2 are arranged at the inner position 322A of the carrier 322, and the fluid insulation pipes N1 and N2 can provide gas or liquid to adjust the influence of the temperature rise on the stage 322 during the grinding process, and further cooperate with the temperature control system 378 to make the ambient temperature, the temperature of the stage 322 and the cooling water temperature for grinding as close to the same as possible , thereby improving the grinding accuracy.

In other embodiments, before and after grinding, brushes, air knives, and water knives can be used to clean the stage 322 and the substrate to remove the dirt particles remaining on the stage 322 and the substrate, which can make After the substrate is adsorbed, it has better flatness, which reduces the influence of dirt particles on the measurement results of the thickness of the substrate, thereby improving the grinding accuracy.

To sum up, the present disclosure can generate a grinding path by measuring the substrate before grinding, and the grinding path can provide the dynamic adjustment of the grinding posture of the grinding device during the grinding process, forming various angles on the edge of the substrate lead angle.

Furthermore, the angle adjustment element of the present disclosure can automatically adjust the angle of the grinding device, which can improve accuracy and reproducibility, and increase productivity compared with manual adjustment.

In addition, this disclosure measures the thickness of the substrate during the grinding process, and the thickness of the grinding device before and after grinding, and adjusts the grinding path to monitor the grinding quality and compensate, so as to ensure that the position of the grinding substrate is correct sex.

In addition, the grinding path calculated by measuring the base material in the present disclosure can cooperate with the optical scale to control the grinding accuracy.

On the other hand, the present disclosure reduces the surface area of the substrate edge grinding system in contact with the air through the heat preservation element, so as to reduce the thermal deformation caused by the change of room temperature to the substrate edge grinding system, and at the same time make the calibration unit, the grinding mechanism, the measuring The measuring unit has higher stability and can have higher accuracy in measurement and compensation.

In addition, this disclosure can also use the temperature-controlled coolant and the temperature-controlled air flow in the stage to cooperate with the temperature control system to make it close to the ambient temperature, reduce the deformation of the stage due to temperature differences, and thereby improve the grinding accuracy.

Although some embodiments of the present disclosure have been disclosed as above, they are not intended to limit the present disclosure. Anyone with ordinary knowledge in the technical field may make some changes without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of this disclosure should be defined by the scope of the appended patent application.

100: Substrate edge grinding system

110: fixed mechanism

120: transfer mechanism

130: Correction unit

140: grinding mechanism

150: Measuring unit

160: control unit

170: temperature control mechanism

L1: the first direction

L2: the second direction

L3: the third direction

Claims (12)

A substrate edge grinding system, comprising: a fixing mechanism; a transfer mechanism for carrying a substrate, the transfer mechanism moves relative to the fixing mechanism along a first direction; at least one grinding mechanism is relatively sliding In the fixing mechanism, each of the grinding mechanisms includes a base, an angle adjustment element and a grinding device, each of the grinding devices moves along a second direction relative to the base, and each of the grinding devices moves along a second direction relative to the base. moving in a third direction, the second direction and the third direction are respectively different from the first direction, and the angle adjustment element is used to drive the grinding device to rotate around the first direction to have multiple angles at different time points; A measuring unit, which is installed on the fixing mechanism, when the transfer mechanism moves to the grinding mechanism along the first direction, the measuring unit can measure the second direction before grinding the substrate and the position of the third direction; and a control unit connected to the measurement unit, the control unit measures the position of the base material measured by the measurement unit in the second direction and the position of the third direction before grinding to form at least A grinding path, and the control unit can control the positions of the grinding devices in the second direction and the third direction according to each grinding path, and control the angle adjustment element to adjust the angle of the grinding device relative to the substrate , the grinding devices rotate relative to the base material along the first direction, so that the grinding devices grind the edge of the base material. The substrate edge grinding system as described in claim 1 further includes: a temperature control mechanism, including: A thermal insulation element, which is arranged on the fixing mechanism, the transfer mechanism, the grinding mechanism and the outer surface of the measuring unit; and a chiller element, connected to the grinding mechanism, the chiller element is temperature controlled A coolant, and provide the coolant to the transfer mechanism. The substrate edge grinding system according to claim 1, wherein the measurement unit includes: a plurality of first measurement elements and a plurality of second measurement elements, and the first measurement elements are arranged along the second direction In the grinding mechanism, the second measuring elements are arranged on the grinding mechanism along the third direction, and the first measuring elements and the second measuring elements are located on the upstream side of the grinding device; and A third measuring element is arranged at the front end of the transfer mechanism. When the transfer mechanism is transported to the grinding mechanism along the first direction, the third measuring elements measure the thickness of the grinding devices, by This adjusts the at least one grinding path. The substrate edge grinding system as described in Claim 1, further comprising: a correction unit arranged on the fixing mechanism, and the grinding mechanism is located on the downstream side of the correction unit, and the transfer mechanism transfers the substrate through the correction unit, the calibration unit is able to detect at least the alignment mark on the substrate, and the control unit controls the transfer mechanism to adjust the position of the substrate according to the detection result of the calibration unit, so as to facilitate the The measurement unit performs measurement. A substrate edge grinding system, comprising: a fixing mechanism; a transfer mechanism for carrying a substrate, and the transfer mechanism moves relative to the fixing mechanism along a first direction; At least one grinding mechanism is relatively slidingly arranged on the fixing mechanism, each of the grinding mechanisms includes a base, an angle adjustment element and a grinding device, each of the grinding devices moves along a second direction relative to the base, and each of the grinding devices The grinding device moves along a third direction relative to the base, the second direction and the third direction are respectively different from the first direction, and the angle adjustment element is used to drive the grinding device to rotate around the first direction and has At multiple angles at different time points, the grinding devices rotate relative to the base material along the first direction, so that the grinding devices grind the edge of the base material; and a temperature control mechanism, including: a heat preservation element, which It is arranged on the outer surface of the fixing mechanism, the transfer mechanism and the grinding mechanism; and an ice water machine element is connected to the grinding mechanism, and the ice water machine element is a cooling liquid for temperature control, and the cooling liquid is provided to transfer mechanism. The substrate edge grinding system as described in claim 5, further comprising: a measuring unit, which is arranged on the fixing mechanism, and when the transfer mechanism moves to the grinding mechanism along the first direction, the amount The measuring unit is capable of measuring the position of the substrate in the second direction and the third direction before grinding; and a control unit is connected with the measuring unit, and the control unit grinds the substrate measured by the measuring unit The previous position calculations in the second direction and the third direction form at least one grinding path, and the control unit is capable of controlling the positions of the grinding devices in the second direction and the third direction according to each of the grinding paths, and controlling the angle adjustment element to adjust the angle of the grinding device relative to the substrate. The substrate edge grinding system as described in claim 6, wherein the measuring unit includes: A plurality of first measuring elements and a plurality of second measuring elements, the first measuring elements are arranged on the grinding mechanism along the second direction, and the second measuring elements are arranged on the grinding mechanism along the third direction The grinding mechanism, and the first measuring elements and the second measuring elements are located on the upstream side of the grinding device; and a plurality of third measuring elements are arranged at the front end of the transfer mechanism, when the transfer When the mechanism is transported to the grinding mechanism along the first direction, the third measuring elements measure the thickness of the grinding devices, thereby adjusting the at least one grinding path. The substrate edge grinding system as described in claim 6, further comprising: a correction unit arranged on the fixing mechanism, and the grinding mechanism is located on the downstream side of the correction unit, and the transfer mechanism transfers the substrate through the correction unit, the calibration unit is able to detect at least the alignment mark on the substrate, and the control unit controls the transfer mechanism to adjust the position of the substrate according to the detection result of the calibration unit, so as to facilitate the The measurement unit performs measurement. A substrate edge grinding system, comprising: a fixing mechanism; a transfer mechanism for carrying a substrate, the transfer mechanism moves relative to the fixing mechanism along a first direction; at least one grinding mechanism is relatively sliding In the fixing mechanism, each of the grinding mechanisms includes a base, an angle adjustment element and a grinding device, each of the grinding devices moves along a second direction relative to the base, and each of the grinding devices moves along a second direction relative to the base. moving in a third direction, the second direction and the third direction are respectively different from the first direction, the angle adjustment element is used to drive the grinding device to rotate around the first direction to have an angle at different time points, the the grinding devices rotate relative to the substrate along the first direction, causing the grinding devices to grind the edges of the substrate; A measuring unit, which is arranged on the fixing mechanism, the measuring unit includes: a plurality of first measuring elements and a plurality of second measuring elements, and the first measuring elements are arranged in the second direction along the The grinding mechanism, the second measuring elements are arranged on the grinding mechanism along the third direction, and the first measuring elements and the second measuring elements are located on the upstream side of the grinding device, when the moving When the carrying mechanism moves to the grinding mechanism along the first direction, the first measuring elements and the second measuring elements can respectively measure the second direction and the third The location of the direction. The substrate edge grinding system as described in claim 9, further comprising: a temperature control mechanism, including: a heat preservation element, which is arranged outside the fixing mechanism, the transfer mechanism, the grinding mechanism and the measuring unit surface; and an ice water machine element connected to the grinding mechanism, the ice water machine element is controlled by a cooling liquid, and provides the cooling liquid to the transfer mechanism. As described in claim 9, it further includes: a control unit connected to the measurement unit, the control unit calculates the position of the base material measured by the measurement unit in the second direction and the third direction before grinding At least one grinding path is formed, and the control unit can control the positions of the grinding devices in the second direction and the third direction according to each grinding path, and control the angle adjustment element to adjust the grinding device relative to the base material angle, wherein the measuring unit includes: a plurality of third measuring elements, arranged at the front end of the transfer mechanism, when the transfer mechanism is transported to the grinding mechanism along the first direction, the third measuring elements The element measures the thickness of the grinding devices, thereby adjusting the at least one grinding path. The substrate edge grinding system as described in claim 11, further comprising: A calibration unit is arranged on the fixing mechanism, and the grinding mechanism is located on the downstream side of the calibration unit, the transfer mechanism transfers the base material through the calibration unit, and the calibration unit can detect at least a pair of position mark, and the control unit controls the transfer mechanism to adjust the position of the base material according to the detection result of the calibration unit, so as to facilitate the measurement by the measurement unit located on the downstream side.

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