TWM641590U - Integrated cooling module structure - Google Patents

Abstract

An integrated heat dissipation module structure at least includes: a metal upper cover plate, including a heat dissipation outer surface and a condensation inner surface; the heat dissipation outer surface has a plurality of columnar heat dissipation structures, and the condensation inner surface has a plurality of upper grooves arranged in parallel with each other. The metal lower cover plate includes a heat-absorbing outer surface and an evaporating inner surface; the heat-absorbing outer surface has a screw hole for locking the exothermic electronic components; the evaporating inner surface has a plurality of lower grooves arranged in parallel with each other, and the protrusions are between the lower grooves A plurality of supporting structures, and the screw hole protrusions corresponding to the screw holes; the working space, the airtight space formed by the joint of the upper frame and the lower frame; the air extraction channel, corresponding to the upper channel groove and the lower channel groove Composed of joints; the capillary structure is arranged in the lower groove or in the upper groove and the lower groove; the working fluid exists in the working space and the capillary structure.

Description

Integrated cooling module structure

This creation is about a heat dissipation module structure, especially an integrated heat dissipation module structure.

High-power electronic components are a new generation of semiconductor components, especially in high-speed rail transportation, smart grids or new energy electric vehicles, and have gradually become the mainstream of applications. For example, an insulated gate bipolar transistor (Insulated Gate Bipolar Transistor, IGBT) is used in high-frequency and high-power fields because of its low driving voltage, high operating voltage, and high switching frequency. However, the operation of high-power electronic components is inevitably accompanied by the generation of a large amount of heat due to their high power density. If the heat accumulated in the power components cannot be dissipated effectively and in a timely manner, the reliability of electronic components will be greatly affected. , which limits the development of its application.

Common power component heat dissipation module structure, its power component or chip (IGBT/Diode) is assembled on one surface of a ceramic substrate (for example: copper-clad ceramic substrate or DBC substrate) with metal layers on both sides by welding In general, the commonly used ceramic materials are alumina and aluminum nitride, while the metal layer is mainly used for wiring layout, heat conduction and heat dissipation. Then, the other side of the ceramic substrate is soldered and bonded to a copper base plate through solder, and the other side of the copper base plate is coated with a layer of heat-conducting paste or heat-conducting silicone grease and then bonded to a heat sink.

When the power components are running, a large amount of heat will be generated. In this power module structure, the large amount of heat will be transmitted to the copper base plate through the ceramic substrate, and then through the thermal conductive paste or thermal grease, the heat will be further conducted to the Radiator, and quickly dissipate heat through the radiator. However, due to the large difference in thermal expansion coefficient between the ceramic substrate and the copper base plate, coupled with the insufficient heat conduction efficiency of thermal conductive paste or thermal grease to transfer the heat from the copper base plate to the radiator in time, the heat that cannot be removed in time is accumulated in the heat sink. The copper base plate causes the temperature to rise, and the difference in thermal expansion coefficient between the base plate and the base plate will produce different degrees of deformation, which often causes the welding surface between the two to be damaged, and the heat conduction is also hindered, which eventually leads to excessive temperature. Integral component failure.

In view of the above problems, some operators (such as: Semikron) have developed another heat dissipation module, which removes the original copper base plate, and allows the ceramic substrate assembled with power components or chips to be directly attached to the heat sink through thermal paste or thermal grease. heat sink to avoid anomalies caused by differences in thermal expansion coefficients. However, considering the difficulty of processing and material properties, most heat sinks use aluminum or aluminum alloys as materials, and adopt extrusion processing to form heat sinks. The thermal diffusivity of aluminum or aluminum alloy is much smaller than that of copper. When the small-volume power components generate fast and large amounts of concentrated heat without the rapid lateral diffusion of the copper base plate, the heat will not spread quickly to the entire radiator, making the radiator unable to function Heat dissipation efficiency for maximum area.

In another type of heat dissipation module, in order to quickly spread the heat generated in a large amount and in a concentrated manner to a larger area on the radiator, the industry replaces the original copper base plate with a copper vapor chamber, and the heat-generating power components and The ceramic substrate is welded or bonded to the heat-absorbing surface of the vapor chamber, and the radiator is pasted on the heat-dissipating surface of the vapor chamber through thermal paste. When a large amount of heat is rapidly generated from the power element and transferred to the vapor chamber, the working fluid existing in the inner space of the vapor chamber will quickly absorb heat and quickly vaporize to form steam. The other side of the vapor chamber is connected to a radiator, so when the vapor rises rapidly and touches the cooler surface connected to the radiator, the vapor will condense into a working fluid, and quickly absorb and release a large amount of gas through this cycle of phase change hot. Compared with the traditional use of copper bottom plate, the vapor chamber can spread the concentrated heat source to a larger area of the radiator more quickly, so as to obtain a larger effective heat dissipation area and faster heat dissipation.

The vapor chamber uses the phase change of the working fluid in its closed working chamber to quickly dissipate heat, and is the most efficient heat dissipation method at this stage. The purpose of rapid heat dissipation is achieved by using a large amount of latent heat of vaporization involved in the rapid vaporization and condensation process of the working liquid in the near-vacuum chamber. The heat conduction efficiency of the vapor chamber can reach more than 10000 W/(m ² ∙°C), which is dozens of times higher than the heat conduction efficiency of traditional air convection or liquid convection. , the thermal paste coated between the vapor chamber and the radiator becomes a large thermal resistance, and the high thermal conductivity of the vapor chamber cannot be effectively utilized.

In view of the above problems, the author proposes an integrated heat dissipation module structure, which is an efficient heat dissipation module structure through the integration of the radiator and the vapor chamber. To further explain, the integrated heat dissipation module structure of this creation is manufactured by integrating the heat dissipation structure of the radiator and the metal upper cover plate of the vapor chamber with the same metal sheet, so as to eliminate the heat vapor chamber and radiator Due to the thermal resistance of the thermal paste with low thermal conductivity, to improve the heat dissipation efficiency. At the same time, due to the improvement of heat dissipation efficiency, the deformation stress caused by temperature between the ceramic substrate and the vapor chamber will also be effectively reduced. The integrated heat dissipation module structure proposed in this creation integrates the radiator and the vapor chamber into one, eliminating the original interface between the radiator and the vapor chamber, and eliminating the thermal resistance caused by the use of thermal paste. In addition, the integrated heat dissipation module structure of this creation can directly lock power components or ceramic substrates on the heat-absorbing surface of the vapor chamber, eliminating the need for heat transfer media such as thermal paste to further eliminate the gap between the heat source and the heat dissipation module. Thermal resistance, more effectively improve heat dissipation efficiency.

The integrated heat dissipation module structure of this creation can not only be manufactured by stamping, extrusion, milling machine, casting, forging and other metal processing methods, but also metal sheets/blocks (such as copper) can be processed by cold forging Processing forming, which is characterized in that the cold forging processing forming method is used in the forging process, and the metal does not need to be pre-heated forging and then annealed as in the general forging method. Therefore, the internal grain structure of the metal processed by cold forging will not cause holes due to annealing. , Tissue hypertrophy and reduce thermal conductivity. That is to say, the metal processed by cold forging can still maintain a fairly dense internal grain structure because it has not undergone a heating process, and the metal after forging has the advantages of improved rigidity and compactness. After testing, its The thermal conductivity and thermal diffusivity of the metal can be further improved.

According to an embodiment of the present invention, an integrated heat dissipation module structure is proposed, which at least includes: a metal upper cover, a metal lower cover, a working space, an air extraction channel, a capillary structure, and a working fluid. The metal upper cover plate includes a heat dissipation outer surface and a condensation inner surface; the heat dissipation outer surface has a plurality of columnar heat dissipation structures, and the inner surface of the condensation is provided with an upper frame of an appropriate height, and the upper frame is provided with an upper channel groove, and the condensation inner surface And it has a plurality of upper grooves arranged parallel to each other. The metal lower cover plate includes a heat-absorbing outer surface and an evaporating inner surface; the heat-absorbing outer surface has screw holes for locking exothermic electronic components; the evaporating inner surface is provided with a lower frame of appropriate height, and the lower frame is provided with a lower channel groove ; The evaporation inner surface has a plurality of lower grooves arranged parallel to each other, a plurality of support structures protruding between the lower grooves, and a screw hole protrusion corresponding to the screw hole; the screw hole protrusion is formed by the heat-absorbing outer surface The inner surface of the evaporator is recessed and raised on the inner surface of the evaporator but does not penetrate, and the height of the screw hole protrusion is not greater than the height of the supporting structure; the working space is composed of the upper frame of the metal upper cover plate and the metal lower cover plate An airtight space formed by jointing the lower frames, wherein the condensing inner surface of the metal upper cover plate and the evaporating inner surface of the metal lower cover plate are opposite to each other, and the arrangement of the upper groove and the lower groove can be mapped and aligned with each other; a plurality of The support structure protrudes from the evaporating inner surface and touches between the grooves on the condensing inner surface to support the working space; the air extraction channel is formed by the corresponding joint of the upper channel groove and the lower channel groove, which can be used to extract air from the working space ; The capillary structure is arranged in the lower groove or the upper and lower grooves; the working fluid exists in the working space and the capillary structure.

According to an embodiment of the present invention, an integrated heat dissipation module structure is proposed, which at least includes: a metal upper cover, a metal lower cover, a working space, an air extraction channel, a capillary structure, and a working fluid. The metal upper cover plate includes a heat dissipation outer surface and a condensation inner surface. The heat dissipation outer surface has a plurality of columnar heat dissipation structures. And it has a plurality of upper grooves arranged parallel to each other. The metal lower cover plate includes a heat-absorbing outer surface and an evaporating inner surface. The heat-absorbing outer surface has a plurality of screw holes for locking a plurality of exothermic electronic components. There are lower channel grooves; the evaporation inner surface has a plurality of lower grooves arranged in parallel with each other and a plurality of screw hole protrusions corresponding to the plurality of screw holes. The screw hole protrusions are recessed and raised from the heat-absorbing outer surface to the evaporation inner surface Evaporates the inner surface but does not penetrate; the working space is an airtight space formed by the upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate. The evaporating inner surface of the metal lower cover plate is opposite to each other, and the arrangement of the upper groove and the lower groove can be overlapped and aligned with each other. A plurality of screw hole protrusions protrude from the evaporating inner surface and contact the condensing inner surface to support the working space ; The air extraction channel is formed by the corresponding joint of the upper channel groove and the lower channel groove, which can be used to pump air to the working space; the capillary structure is arranged in the lower groove or in the upper groove and the lower groove; the working fluid exists in the working space and capillary structure.

The following will refer to the relevant drawings to illustrate the embodiment of the integrated heat dissipation module structure of the present invention. For the sake of clarity and convenience of illustration, the size and proportion of the components in the drawings may be exaggerated or reduced. . In the following description and/or scope of patent application, the technical terms used should be interpreted with the usual meanings commonly used by those skilled in the art. For ease of understanding, the same elements in the following embodiments are referred to as the same The symbol marks to explain. In this specification, the word "about" usually means that the actual value is within plus or minus 10%, 5%, 1% or 0.5% of a specific value or range. The term "about" used herein indicates that the actual value falls within acceptable standard error of the mean, as considered by one of ordinary skill in the art to which this creation pertains. Except for the examples, or unless otherwise expressly stated, it should be understood that ranges, amounts, values and percentages used herein are modified by "about". Therefore, unless otherwise stated, the numerical values or parameters disclosed in this specification and the appended patent claims are approximate numerical values and may be changed as required.

Please refer to FIG. 1 to FIG. 4 , which are schematic diagrams of an integrated cooling module structure 10 according to an embodiment of the present invention. As shown in the figure, the integrated heat dissipation module structure 10 of the present invention at least includes: a metal upper cover plate 100, including a heat dissipation outer surface 110 and a condensation inner surface 120, and the heat dissipation outer surface 110 has a plurality of columnar heat dissipation structures 111, and An upper frame 122 of appropriate height is provided around the inner condensing surface 120, an upper channel groove 123 is arranged on the upper frame, and a plurality of upper grooves 121 arranged parallel to each other are arranged on the inner condensing surface 120; the metal lower cover plate 200 includes a heat-absorbing outer Surface 210 and evaporating inner surface 220, the heat-absorbing outer surface 210 has a screw hole 211 for locking the exothermic electronic components, the surrounding of the evaporating inner surface 220 is provided with a lower frame 222 of appropriate height, and the lower frame 222 is provided with a lower channel groove 223 , and the evaporation inner surface 220 has a plurality of lower grooves 221 arranged parallel to each other, a plurality of support structures 224 protruding between the lower grooves 221, and a screw hole protrusion 225 corresponding to the screw hole 211, the screw hole protrusion The part 225 is recessed from the heat-absorbing outer surface 210 to the evaporating inner surface 220 and protrudes on the evaporating inner surface 220 but does not penetrate, and the height of the screw hole raised part 225 is not greater than the height of the supporting structure 224; the working space 300, which is It is an airtight space formed by the upper frame 122 of the metal upper cover 100 and the lower frame 222 of the metal lower cover 200. The inner surfaces 220 are opposite to each other, and the arrangement of the upper grooves 121 and the lower grooves 221 can be overlapped and aligned with each other. A plurality of support structures 224 protrude from the evaporating inner surface 220 and contact between the grooves 121 on the condensing inner surface 120, so as to Support the working space 300; the air extraction channel 400 is composed of the corresponding joint of the upper channel groove 123 and the lower channel groove 223, which can be used to extract air from the working space 300; the capillary structure 500 is arranged in the lower groove 221 or the upper groove 121 and In the lower groove 221 ; the working fluid exists in the working space 300 and the capillary structure 500 .

In one embodiment, the upper frame 122 and the lower frame 222 of the integrated heat dissipation module structure 10 of the present invention further have a welding groove 1010 for welding the metal upper cover plate 100 and the metal lower cover plate 200 to form The integrated cooling module structure 10 of this creation.

Please refer to Figures 2 and 3. In one embodiment, the integrated heat dissipation module structure 10 of the present invention is characterized in that the shape and columnar heat dissipation structure 111 included in the metal upper cover plate 100 are directly The same metal sheet (or metal block) is integrally formed instead of externally connected, that is to say, the metal upper cover plate 100 is integrally formed by a metal sheet (or metal block) to obtain the above-mentioned shape and structure characteristics. To further illustrate, the metal upper cover plate 100 of the integrated heat dissipation module structure 10 of this embodiment has a plurality of columnar heat dissipation structures 111 on the heat dissipation outer surface 110, which are directly formed on the heat dissipation outer surface 110, and the metal upper cover plate 100 The heat dissipation outer surface 110 is inseparable, and there is no heterogeneous or homogeneous interface. It is not like the common prior art that the heat sink is glued to the heat dissipation surface of the vapor chamber with heat dissipation paste, nor is the heat dissipation structure welded Or sintered on the heat dissipation surface of the vapor chamber. In other words, the integrated heat dissipation module of this creation generates the heat dissipation structure directly on the metal upper cover of the vapor chamber, thereby eliminating the heterogeneous interface between the radiator and the vapor chamber and its thermal resistance. To improve heat dissipation efficiency.

Please refer to FIG. 2 and FIG. 4. In one embodiment, the integrated heat dissipation module structure 10 of the present invention is characterized in that the shape and structural features included in the metal lower cover plate 200 are directly made of the same metal Sheets (or metal blocks) are integrally formed. In other words, the metal lower cover plate 200 of the integrated heat dissipation module structure 10 of this embodiment has a plurality of supporting structures 224 and screw hole protrusions 225 on the evaporating inner surface 220 directly formed on the evaporating inner surface 220, The evaporating inner surface 220 of the metal lower cover plate 200 is the same metal and cannot be separated, and there is no heterogeneous or homogeneous interface. The supporting structure 224 is not sintered on the evaporating inner surface 220 through sintering as in the common prior art.

Generally speaking, the method of manufacturing the integrally formed metal upper cover plate 100 and metal lower cover plate 200 of the integrated heat dissipation module 10 of the above-mentioned invention can adopt an etching process or a composite processing process (for example: integrating a milling machine and stamping or extruding compression process). The advantage of the etching process is that it can etch out more complex structures, which are generally used for products that are difficult to manufacture with traditional processing processes. The advantage of the composite processing process is that most of the used manufacturing methods are mature and can be produced without too much development. However, the etching process takes a long time and has the problem that the processed surface is uneven and requires secondary processing, while the composite processing process requires more steps and time for production.

In one embodiment, the integrated heat dissipation module structure 10 of the present invention adopts cold forging to manufacture the shape and structure of the metal upper cover 100 and the metal lower cover 200 , which can be modified with CNC process. The difference from the etching process or composite processing process is that the cold forging method uses the metal sheet (or metal block) to be processed to be placed in a female die, and then the metal sheet is continuously forged with a male die at room temperature. to give it shape. Those skilled in the art should be able to understand that the cold forging method does not require the metal to be pre-heated, softened and annealed in the forging process as in the general stamping process, so the internal grain structure of the forged metal will not be caused by annealing. Holes and tissue hypertrophy reduce the thermal conductivity. After cold forging, the internal grain structure of the metal can still be quite dense because it has not undergone a heating process, and internal defects such as pores can be reduced. After forging, the metal surface is smoother, more rigid and dense. It has the advantages of improved performance and less deformation. After testing, the thermal conductivity and thermal diffusivity of the metal after forging are higher than those before forging. That is, in this embodiment, the heat dissipation efficiency of the integrated heat dissipation module structure of this creation is higher than Generally, the traditional process is higher.

In one embodiment, the metal upper cover plate 100 of the integrated heat dissipation module structure 10 of the present invention is made by cold forging, and it is characterized in that the shape and structural features of the metal upper cover plate 100 are directly It is formed on the same metal sheet by cold forging, including a plurality of columnar heat dissipation structures 111 on the heat dissipation outer surface 110 of the metal upper cover plate 100 .

In one embodiment, the metal lower cover plate 200 of the integrated heat dissipation module structure 10 of the present invention is made by cold forging, which is characterized in that the shape and structural features of the metal lower cover plate 200 are directly Formed on the same metal sheet by cold forging, including a plurality of raised support structures 224 and screw hole protrusions 225 on the evaporation inner surface 220 of the metal lower cover plate 200, that is, like the metal upper cover plate 100, the metal lower cover plate 200 The plurality of protruding supporting structures 224 on the evaporation inner surface 220 of the cover plate 200 are not formed by external connection or conventional sintering method, but are integrally formed and forged with the lower metal cover plate. In one embodiment, the plurality of protruding supporting structures 224 are columnar structures.

In any embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the integrated heat dissipation module structure 10 of the present invention use metal sheets with high thermal conductivity and thermal diffusivity (for example: pure copper) by cold forging Integral molding forms the above structure. In one embodiment, the metal sheet is pure copper.

Those skilled in the art should be able to understand that in the above-mentioned embodiment, when pure copper is used as the material and the metal upper cover plate 100 and the metal lower cover plate 200 are made by cold forging, since the pure copper material is at room temperature, After continuous forging and forming, the physical properties of the obtained metal upper cover plate 100 and metal lower cover plate 200, such as Vickers hardness, thermal conductivity and thermal diffusivity, will be higher than those without cold forging. The pure copper material is also higher than the metal upper cover plate 100 and the metal lower cover plate 200 produced by other manufacturing methods (such as etching, stamping, extrusion or general forging processes). In other words, when the pure copper material is cold forged, it will have higher physical properties such as Vickers hardness, thermal conductivity, and thermal diffusivity, which are different from the properties of materials through other processing methods.

For example, in another disclosure, the author used cold forging to make the metal upper cover and metal lower cover of the vapor chamber, and entrusted a third-party measurement unit (Yuanhe Company; Yuanhe Company; YUANHE) measured physical properties such as Vickers hardness, thermal conductivity and thermal diffusivity, and compared the obtained values with the material properties after traditional composite processing (combined with traditional stamping and CNC processes), as shown in the following table (1). Those with ordinary knowledge in the field should understand that the cold forging method will endow the material with higher physical properties such as Vickers hardness, thermal conductivity and thermal diffusivity due to the characteristics of the manufacturing process. It should be understood that the degree of improvement of these physical properties and the material required After the cold forging process, the number of times of forging and the force are related. The more times of forging and the greater the force, the higher the above values will be. Therefore, after cold forging, the above values will be better than those of unprocessed or normal It is a traditional processing material, and it has more significant advantages compared with the traditional compound processing method. Table I): cold forging Traditional composite processing Vickers Hardness (HV) 115 ~ 117 85 ~ 87 Thermal conductivity (W/ m∙K ) about 430 about 395 Thermal diffusivity (mm ² /sec) 115 ~ 117 85 ~ 87

In one embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the integrated heat dissipation module structure 10 of the present invention are made of pure copper with high thermal conductivity and thermal diffusivity, and are manufactured after cold forging The resulting metal upper cover plate 100 and metal lower cover plate 200 have a Vickers hardness not less than 90HV, 95HV, 100HV or 105HV.

In another embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the integrated heat dissipation module structure 10 of the present invention are made of pure copper with high thermal conductivity and thermal diffusivity, and are formed after cold forging The manufactured metal upper cover plate 100 and metal lower cover plate 200 have thermal conductivity not less than 400W/(m∙K), 405W/(m∙K), 408W/(m∙K) or 410W/(m∙K) .

In another embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the integrated heat dissipation module structure 10 of the present invention are made of pure copper with high thermal conductivity and thermal diffusivity, and are formed after cold forging The manufactured metal upper cover 100 and metal lower cover 200 have thermal diffusivity not less than 90 mm ² /sec, 95 mm ² /sec, 100 mm ² /sec or 105 mm ² /sec.

Please refer to the integrated heat dissipation module structure 20 in Figure 5, which is another embodiment of the integrated heat dissipation module structure 10 in Figure 1 of this invention, wherein the heat-absorbing outer surface 210 of the metal lower cover plate 201 further has multiple A plurality of screw holes 211 are used to lock a plurality of exothermic electronic components in contact with the heat-absorbing outer surface 210, and the plurality of screw holes 211 are recessed from the heat-absorbing outer surface 210 to the evaporating inner surface 220 and protrude on the evaporating inner surface 220 , forming a plurality of screw hole protrusions 225 but not penetrating, and the height of the screw hole protrusions 225 is not greater than the height of the support structure 224 . In one embodiment, when a plurality of exothermic electronic components are fixed on the heat-absorbing outer surface 210 with screws passing through the screw holes 211 , the exothermic electronic components can be closely bonded to the heat-absorbing outer surface 210 to improve heat dissipation efficiency. Certainly, a heat-conducting material with good heat-conducting efficiency can also be added between the heat-dissipating electronic component and the heat-absorbing outer surface 210 to reduce thermal resistance caused by uneven contact surfaces, such as heat-conducting paste or graphite flakes.

In any of the above embodiments, in the integrated heat dissipation module structure 10 or 20, the metal upper cover plate 100 or 101 and the metal lower cover plate 200 or 201 are bonded to each other and then combined by welding.

In any of the above embodiments, the working fluid used in the integrated heat dissipation module structure 10 or 20 of the present invention is pure water.

In any of the above embodiments, the air pressure of the working space 300 described in the integrated heat dissipation module structure 10 or 20 of the present invention is less than 1×10 ⁻³ torr, 1×10 ⁻⁴ torr or 1×10 ⁻⁵ torr after being pumped.

Please refer to FIG. 7, which is an integrated cooling module structure 30 of another embodiment of the present invention. As shown in the figure, the integrated heat dissipation module structure 30 of the present invention at least includes: a metal upper cover plate 101, including a heat dissipation outer surface 110 and a condensation inner surface 120, and the heat dissipation outer surface 110 has a plurality of columnar heat dissipation structures 111, and An upper frame 122 of appropriate height is provided around the inner surface of condensation 120, and an upper channel groove 123 is arranged on the upper frame. Surface 210 and evaporative inner surface 220. The heat-absorbing outer surface 210 has a plurality of screw holes 211 for locking a plurality of exothermic electronic components. A lower frame 222 of appropriate height is provided around the evaporating inner surface 220, and a lower frame 222 is provided on the lower frame 222. channel groove 223, and the evaporating inner surface 220 has a plurality of lower grooves 221 arranged parallel to each other and a plurality of screw hole protrusions 225 corresponding to the plurality of screw holes 211, and the screw hole protrusions 225 are directed from the heat-absorbing outer surface 210 to The evaporating inner surface 220 is concave and protruding from the evaporating inner surface 220 but does not penetrate; the working space 300 is formed by joining the upper frame 122 of the metal upper cover plate 101 and the lower frame 222 of the metal lower cover plate 202 In an airtight space, the condensing inner surface 120 of the metal upper cover 101 and the evaporating inner surface 220 of the metal lower cover 202 are opposite to each other, and the arrangement of the upper groove 121 and the lower groove 221 can be mutually mapped and aligned, and a plurality of screw holes The protrusion 225 protrudes from the evaporating inner surface 220 and contacts the condensing inner surface 120 to support the working space 300; the air extraction channel 400 is formed by the corresponding engagement of the upper channel groove 123 and the lower channel groove 223, which can be used for The space 300 is used for pumping air; the capillary structure 500 is disposed in the lower groove 221 or the upper groove 121 and the lower groove 221 ; the working fluid exists in the working space 300 and the capillary structure 500 .

In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the metal upper cover plate 101 as a whole includes a columnar heat dissipation structure 111, which is integrally formed by a metal sheet (or metal block), and the metal The lower cover 202 as a whole includes a plurality of screw hole protrusions which are integrally formed by a metal sheet.

In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, there are at least 10 screw holes 211 , corresponding to the same number of screw hole protrusions 225 .

In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the metal upper cover plate 101 and the metal lower cover plate 202 are made of pure copper.

In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the metal upper cover plate 101 and the metal lower cover plate 202 are joined together by welding.

In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the working fluid is pure water.

In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the air pressure in the working space 300 is less than 1×10 ⁻³ torr, 1×10 ⁻⁴ torr or 1×10 ⁻⁵ torr.

Certainly, the above-mentioned embodiments are only for illustration and not limiting the scope of the invention, and any equivalent modification or change made according to the structure of the integrated cooling module of the above-mentioned embodiments should still be included in the patent scope of the invention.

It is worth mentioning that most of the existing heat dissipation modules use external heat sinks. Such a combination will add a thermal resistance of the heat conduction interface in front of the heat sink and reduce heat dissipation efficiency. The integrated heat dissipation module structure of this creation integrates the upper cover of the vapor chamber and the radiator into one piece, so that the ultra-high heat dissipation efficiency of the vapor chamber is no longer limited by the thermal resistance of the conduction interface, but can Further improve heat dissipation efficiency. Furthermore, the integrated heat dissipation module structure of this creation can be produced by cold forging in addition to etching process or compound processing process (for example: casting, forging, milling machine, stamping or extrusion, etc.) to make the material crystallized. The grain structure is finer and the internal pore defects are reduced, so the material can obtain excellent mechanical properties such as higher strength, deformation resistance and fatigue resistance, and can improve the thermal conductivity and thermal diffusion efficiency of the material. The integrated heat dissipation module made In terms of heat dissipation efficiency, durability, and reliability, it is also superior to general heat dissipation modules with similar structures.

It can be seen that this creation has indeed achieved the desired effect after breaking through the previous technology, and it is not easy for those who are familiar with this technology to think about it. Its progress and practicality obviously meet the requirements for patent application. ￠I filed a patent application in accordance with the law, and I sincerely request your bureau to approve this application for a new model patent to encourage creation. I really appreciate it.

The above descriptions are illustrative only, not restrictive. Any other equivalent modifications or changes that do not deviate from the spirit and scope of this creation should be included in the scope of the attached patent application.

10, 20, 30: Integrated cooling module structure 100, 101: metal upper cover 110: heat dissipation outer surface 111: columnar cooling structure 120: condensation inner surface 121: upper groove 122: upper frame 123: upper channel slot 200, 201, 202: metal bottom cover 210: heat-absorbing outer surface 211: screw hole 220: evaporation inner surface 221: lower groove 222: Bottom border 223: lower channel slot 224:Support structure 225: screw hole boss 300: workspace 400: suction channel 500: capillary structure 1010: welding groove

Figure 1 shows the structure of an integrated heat dissipation module of an embodiment of the invention. Fig. 2 is a cross-sectional view of the structure of an integrated heat dissipation module according to an embodiment of the invention. Figure 3 is a structure diagram of the metal upper cover plate of the integrated heat dissipation module structure of an embodiment of the invention. Figure 4 is a structure diagram of the metal lower cover plate of the integrated heat dissipation module structure of an embodiment of the invention. Figure 5 shows the structure of an integrated heat dissipation module of another embodiment of the invention. Figure 6 is a structure diagram of the metal lower cover plate of the integrated heat dissipation module structure of another embodiment of the present invention. Figure 7 shows the structure of an integrated heat dissipation module of another embodiment of the invention.

10: Integrated cooling module structure

100: metal upper cover

110: heat dissipation outer surface

111: columnar cooling structure

200: metal bottom cover

220: evaporation inner surface

221: lower groove

222: Bottom border

223: lower channel slot

224:Support structure

225: screw hole boss

400: suction channel

1010: welding groove

Claims (18)

An integrated cooling module structure, including: A metal upper cover plate, including a heat dissipation outer surface and a condensation inner surface, the heat dissipation outer surface has a plurality of columnar heat dissipation structures, and an upper frame of appropriate height is provided around the condensation inner surface, and an upper frame is provided on the upper frame The upper channel groove, the condensing inner surface has a plurality of upper grooves arranged in parallel with each other; A metal lower cover plate, including a heat-absorbing outer surface and an evaporating inner surface, the heat-absorbing outer surface has a screw hole for locking heat-radiating electronic components, a lower frame of appropriate height is provided around the evaporating inner surface, the lower frame A channel groove is provided on the top, and the evaporation inner surface has a plurality of lower grooves arranged in parallel with each other, a plurality of support structures protruding between the lower grooves, and a screw hole protrusion corresponding to the screw hole, The screw hole protrusion is recessed from the heat-absorbing outer surface to the evaporation inner surface and protrudes from the evaporation inner surface but does not penetrate, and the height of the screw hole protrusion is not greater than the height of the supporting structure; A working space is an airtight space formed by the jointing of the upper frame of the metal upper cover and the lower frame of the metal lower cover, wherein the condensation inner surface of the metal upper cover and the The evaporating inner surface of the metal lower cover plate is opposite to each other, and the arrangement of the upper groove and the lower groove can be aligned with each other, and the supporting structures protrude from the evaporating inner surface and contact the upper groove of the condensing inner surface between slots to support the workspace; an air extraction channel, which is formed by the corresponding engagement of the upper channel groove and the lower channel groove, and can be used to extract air from the working space; a capillary structure disposed in the lower groove or in the upper groove and the lower groove; A working fluid exists in the working space and the capillary structure. The integrated heat dissipation module structure as described in claim 1, wherein the metal upper cover as a whole includes the columnar heat dissipation structure as a whole by cold forging a metal sheet, and the metal lower cover as a whole includes The supporting structure and the protrusion of the screw hole are integrally formed by forging a metal sheet by cold forging. The integrated heat dissipation module structure according to claim 2, wherein the metal sheet is pure copper. The integrated heat dissipation module structure according to claim 2, wherein the metal sheet is pure copper, and the metal upper cover and the metal lower cover have a Vickers hardness of not less than 90 HV. The integrated heat dissipation module structure as described in Claim 2, wherein the metal sheet is pure copper, and the metal upper cover and the metal lower cover have a thermal conductivity of not less than 400 W/(m∙K). The integrated heat dissipation module structure according to claim 2, wherein the metal sheet is pure copper, and the metal upper cover and the metal lower cover have a thermal diffusivity of not less than 90 mm ² /sec. The integrated cooling module structure according to claim 2, wherein the supporting structure is a columnar structure. The integrated heat dissipation module structure according to claim 2, wherein the metal upper cover plate and the metal lower cover plate are joined together and then combined by welding. The integrated heat dissipation module structure according to claim 2, wherein the working fluid is pure water. The integrated heat dissipation module structure as described in Claim 2, wherein the air pressure in the working space is less than 1x10 ^-3 torr. The integrated heat dissipation module structure as described in Claim 1, wherein the heat-absorbing outer surface of the metal lower cover plate further has a plurality of the screw holes for locking a plurality of the exothermic electronic components, and the evaporating inner surface has a plurality of screw holes A plurality of screw hole protrusions corresponding to the screw holes, the screw hole protrusions are recessed from the heat-absorbing outer surface to the evaporating inner surface and protrude from the evaporating inner surface but do not penetrate, and the screw holes The height of the hole protrusion is not greater than the height of the support structure. An integrated cooling module structure, including: A metal upper cover plate, including a heat dissipation outer surface and a condensation inner surface, the heat dissipation outer surface has a plurality of columnar heat dissipation structures, and an upper frame of appropriate height is provided around the condensation inner surface, and an upper frame is provided on the upper frame The upper channel groove, the condensing inner surface has a plurality of upper grooves arranged in parallel with each other; A lower metal cover plate includes a heat-absorbing outer surface and an evaporating inner surface. The heat-absorbing outer surface has a plurality of screw holes for locking a plurality of exothermic electronic components. A lower frame of appropriate height is provided around the evaporating inner surface. The lower frame is provided with a channel groove, and the evaporating inner surface has a plurality of lower grooves arranged in parallel with each other and a plurality of screw hole protrusions corresponding to the plurality of screw holes, and the screw hole protrusions are formed by the heat absorber. The outer surface is concave to the evaporative inner surface and protrudes from the evaporative inner surface but does not penetrate; A working space is an airtight space formed by the jointing of the upper frame of the metal upper cover and the lower frame of the metal lower cover, wherein the condensation inner surface of the metal upper cover and the The evaporating inner surface of the metal lower cover plate is opposite to each other, and the arrangement of the upper groove and the lower groove can be aligned with each other, and the screw hole protrusions protrude from the evaporating inner surface and contact the condensing inner surface , to support the workspace; an air extraction channel, which is formed by the corresponding engagement of the upper channel groove and the lower channel groove, and can be used to extract air from the working space; a capillary structure disposed in the lower groove or in the upper groove and the lower groove; A working fluid exists in the working space and the capillary structure. The integrated heat dissipation module structure as described in claim 12, wherein the metal upper cover as a whole includes the columnar heat dissipation structure which is integrally formed from a metal sheet, and the metal lower cover as a whole includes the screw holes The protruding part is integrally formed by a metal sheet. The integrated heat dissipation module structure according to claim 12, wherein there are at least 10 screw holes corresponding to the same number of screw hole protrusions. The integrated heat dissipation module structure according to claim 12, wherein the metal upper cover and the metal lower cover are made of pure copper. The integrated heat dissipation module structure according to claim 12, wherein the metal upper cover plate and the metal lower cover plate are bonded to each other and combined by welding. The integrated cooling module structure according to claim 12, wherein the working fluid is pure water. The integrated cooling module structure according to claim 12, wherein the air pressure in the working space is less than 1x10 ^-3 torr.

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