JP3242782U - Integrated heat dissipation module structure - Google Patents

Abstract

An integrated heat dissipation module structure is provided, which is a highly efficient heat dissipation module structure in which a heat sink and a vapor chamber are integrally integrated. An integrated heat-dissipating module structure includes a heat-dissipating outer surface and a condensing inner surface, the heat-dissipating outer surface having a plurality of columnar heat-dissipating structures on the heat-dissipating outer surface, the metal upper cover plate having a plurality of upper grooves arranged parallel to each other on the condensing inner surface, a heat-absorbing outer surface and an evaporating inner surface, the heat-absorbing outer surface having screw holes for fixing heat-dissipating electronic components, a plurality of lower grooves arranged parallel to each other on the evaporating inner surface, and a plurality of protrusions between the lower grooves. and a metal lower cover plate having screw hole projections 225 corresponding to the screw holes, a working space that is an airtight space formed by joining the upper frame and the lower frame 222 to each other, an intake channel 400 configured by joining the upper channel groove and the lower channel groove 223 correspondingly, a capillary structure, and a working fluid existing in the working space and the capillary structure. [Selection drawing] Fig. 1

Description

The present invention relates to a heat dissipation module structure, particularly to an integrated heat dissipation module structure.

High-power electronic components are a new generation of semiconductor components, especially in high-speed rail transportation, smart grids or new energy electric vehicles, etc., which are gradually becoming mainstream applications. For example, Insulated Gate Bipolar Transistors (IGBTs) have low drive voltage, high operating voltage tolerance, and high switching frequency tolerance, but are not widely used in high frequency and high power applications. be done. However, the operation of high-power electronic components inevitably involves the generation of a large amount of heat due to their high power density. It has a great impact on the reliability of the operation of the device and limits the development of its application.

A typical power device heat dissipation module structure is that the power device or chip (IGBT/diode) is mounted on one side of a ceramic substrate (such as a copper clad ceramic substrate or DBC substrate) coated with metal layers on both sides by welding. The commonly used ceramic materials are aluminum oxide and aluminum nitride, and the metal layer is mainly used for wiring layout, heat conduction and heat dissipation. The other side of the ceramic substrate is then welded to a copper baseplate with solder, and the other side of the copper baseplate is coated with a layer of thermally conductive paste or thermally conductive silicone grease before bonding the heatsink.

A large amount of heat is generated during the operation of the power elements, and in this power module structure, these large amounts of heat are conducted through the ceramic substrate to the copper base plate, and then through the thermal conductive paste or thermal conductive silicone grease, the heat is further transferred to the heat sink. and the heat is quickly dissipated by the heat sink. However, the material thermal expansion coefficient difference between the ceramic substrate and the copper base plate is large, and the thermal conductivity efficiency of the thermal conductive paste or thermal conductive silicone grease is insufficient, so that the heat of the copper base plate can be properly dissipated into the heat sink. , the amount of heat that cannot be dissipated will be accumulated in the copper base plate, causing the temperature to rise, and the substrate and bake plate will deform to different degrees due to the difference in thermal expansion coefficient, and the weld surface between the two will constantly is destroyed, the conduction of heat is also impeded, and eventually the temperature becomes too high, causing the entire member to fail.

In view of the above problems, some vendors (e.g. Semikron) have developed another heat dissipation module, removing the original copper baseplate and replacing the ceramic substrate with the embedded power device or chip for heat conduction. Paste or thermally conductive silicone grease is applied directly to the heat sink to avoid abnormalities due to differences in thermal expansion coefficients. However, considering the difficulty of processing and the problem of material properties, most heat sinks use aluminum or aluminum alloy as the material and adopt extrusion to form the heat sink. The thermal diffusion coefficient of aluminum or aluminum alloy is much smaller than that of copper, and a small volume power element can concentrate a large amount of heat rapidly, and the rapid lateral diffusion of the copper base plate is required. Otherwise, the amount of heat cannot be quickly diffused over the entire heat sink, and the heat sink cannot exhibit the maximum area heat dissipation efficiency.

In another type of heat dissipation module, in order to quickly dissipate the large and concentrated amount of heat generated over a larger area of the heatsink, manufacturers replace the original copper baseplate with a copper vapor chamber, which heats up the power elements and The ceramic substrate is welded or attached to the heat absorption surface of the vapor chamber, and the heat sink is adhered to the heat dissipation surface of the vapor chamber via thermal conductive paste. When a large amount of heat is rapidly generated from the power element and conducted to the vapor chamber, the working fluid existing in the interior space of the vapor chamber rapidly absorbs heat and vaporizes rapidly to form vapor. The vapor chamber, on the one hand, is connected to a heat sink, so that when the vapor rises rapidly and contacts the relatively cool surface of an externally mounted heat sink, it condenses into a working fluid, and this phase change circulation Absorbs and releases large amounts of heat. Compared to the use of traditional copper baseplates, the vapor chamber can spread a more rapidly concentrating mass heat source to a larger area of the heat sink, gaining a larger heat dissipation area for faster heat dissipation. .

Vapor chambers utilize the phase change of the working fluid in a sealed working chamber to quickly dissipate heat and are currently the most efficient method of heat dissipation. The purpose of rapid heat dissipation is achieved by using the large amount of latent heat of vaporization involved in the process of rapid vaporization and condensation of the working liquid in the near-vacuum chamber. The heat conduction efficiency of the vapor chamber reaches more than 10000 W/(m ² ·°C), which is more than tens of times higher than the heat conduction efficiency of conventional air convection or liquid convection. , the thermal paste applied between the vapor chamber and the heat sink causes a large thermal resistance, and the high thermal conductivity coefficient of the vapor chamber cannot be effectively exhibited.

In view of the above problems, the present invention provides an integrated heat dissipation module structure, which is a high-efficiency heat dissipation module structure that integrally integrates the heat sink and the vapor chamber. In further explanation, the integrated heat dissipation module structure of the present invention is manufactured by integrally molding the heat dissipation structure of the heat sink and the metal upper cover plate of the vapor chamber by the same metal sheet, so that the vapor chamber and the heat sink are separated. Eliminates the thermal resistance present in thermal paste with low thermal conductivity, and improves heat dissipation efficiency. At the same time, due to the improved heat dissipation efficiency, the deformation stress due to temperature between the ceramic substrate and the vapor chamber is also effectively reduced. The integrated heat dissipation module structure provided by the present invention integrates the heat sink and the vapor chamber into one, eliminates the existing interface between the heat sink and the heat vapor chamber, and reduces the thermal resistance due to the use of thermal paste. Exclude. In addition, the integrated heat-dissipating module structure of the present invention can directly fix the power element or the ceramic substrate to the heat-absorbing surface of the vapor chamber, so there is no need for a heat-conducting medium such as heat-conducting paste, so that the heat-generating source and the heat-dissipating module are connected. The heat resistance between them can be further eliminated, and the heat dissipation efficiency can be improved more effectively.

The integrated heat dissipation module structure of the present invention is not only manufactured by metal processing methods such as stamping, extrusion, milling, casting, forging, etc., but also by cold forging processing forming method for metal sheet/block (e.g. copper). It is possible to process and form by cold forging. The internal crystal grain structure of the metal does not reduce the thermal conductivity coefficient by causing pores and enlargement of the structure by annealing. That is, since the metal after cold forging has not undergone a heating process, the crystal grain structure inside it still maintains a considerable degree of denseness, and the metal after forging has the advantage of improved rigidity and denseness. and can further improve the thermal conductivity and thermal diffusion coefficients of the metal after testing.

According to one embodiment of the present invention, an integrated heat dissipation module structure is provided, comprising at least a metal top plate, a metal bottom plate, a working space, an intake channel, a capillary structure and a working fluid. The metal upper cover plate includes a heat-dissipating outer surface and a condensing inner surface, and has a plurality of columnar heat-dissipating structures on the heat-dissipating outer surface. A channel groove is provided and has a plurality of upper grooves arranged parallel to each other on the condensing inner surface. The metal lower lid plate includes a heat absorbing outer surface and an evaporating inner surface, the heat absorbing outer surface having a screw hole for fixing the heat dissipation electronic member, a lower frame having a suitable height around the evaporating inner surface, and the lower A frame is provided with a lower channel groove, and has a plurality of lower grooves arranged parallel to each other on the evaporation inner surface, a plurality of supporting structures protruding between the lower grooves, and screw hole protrusions corresponding to the screw holes. and the screw hole protrusions are recessed from the heat absorption outer surface toward the evaporation inner surface and protrude into the evaporation inner surface but do not penetrate the evaporation inner surface, and the height of the screw hole protrusions is equal to or less than the height of the support structure. is. The working space is an airtight space formed by joining the upper frame of the upper metal cover plate and the lower frame of the lower metal cover plate to each other, and the condensation inner surface of the metal upper cover plate and the lower metal cover plate are separated from each other. The evaporating inner surface of the cover plate faces each other, and the arrangement of the upper groove and the lower groove can be mapped and superimposed and aligned with each other, and a plurality of support structures protrude and extend from the evaporating inner surface. , abutting and supporting between said upper grooves of said condensing inner surface. An intake channel is formed by correspondingly joining the upper channel groove and the lower channel groove to provide intake air to the work space. A capillary structure is located in the lower groove or in the upper groove and the lower groove. A working fluid is present in the working space and the capillary structure.

According to one embodiment of the present invention, an integrated heat dissipation module structure is provided, comprising at least a metal top plate, a metal bottom plate, a working space, an intake channel, a capillary structure and a working fluid. The metal upper cover plate includes a heat-dissipating outer surface and a condensing inner surface, and has a plurality of columnar heat-dissipating structures on the heat-dissipating outer surface. A channel groove is provided and has a plurality of upper grooves arranged parallel to each other on the condensing inner surface. The metal lower cover plate includes a heat absorbing outer surface and an evaporating inner surface, the heat absorbing outer surface having a plurality of screw holes for fixing a plurality of heat dissipating electronic components, and a lower frame of suitable height around the evaporating inner surface. the lower frame has a lower channel groove, a plurality of lower grooves arranged parallel to each other on the evaporation inner surface, and a plurality of screw hole protrusions corresponding to the plurality of screw holes; The hole protrusions are recessed from the heat absorption outer surface toward the evaporation inner surface and protrude into the evaporation inner surface, but do not penetrate. The working space is an airtight space formed by joining the upper frame of the upper metal cover plate and the lower frame of the lower metal cover plate to each other, and the condensation inner surface of the metal upper cover plate and the lower metal cover plate are separated from each other. The evaporating inner surface of the cover plate faces each other, and the arrangement of the upper groove and the lower groove can be mapped and superimposed and aligned with each other, and a plurality of screw hole protrusions protrude from the evaporating inner surface. It is stretched and abuts and supports the condensing inner surface. An intake channel is formed by correspondingly joining the upper channel groove and the lower channel groove to provide intake air to the work space. A capillary structure is located in the lower groove or in the upper groove and the lower groove. A working fluid is present in the working space and the capillary structure.

The integrated heat dissipation module structure of the present invention is manufactured by integrally molding the heat dissipation structure of the heat sink and the metal cover plate of the vapor chamber with the same metal sheet, so that the heat transfer efficiency between the vapor chamber and the heat sink is improved. Eliminates the thermal resistance present in thermally conductive pastes with low thermal conductivity and improves heat dissipation efficiency. At the same time, due to the improved heat dissipation efficiency, the deformation stress due to temperature between the ceramic substrate and the vapor chamber is also effectively reduced. The integrated heat dissipation module structure provided by the present invention integrates the heat sink and the vapor chamber into one, eliminates the existing interface between the heat sink and the heat vapor chamber, and reduces the thermal resistance due to the use of thermal paste. Exclude. In addition, the integrated heat-dissipating module structure of the present invention can directly fix the power element or the ceramic substrate to the heat-absorbing surface of the vapor chamber, so there is no need for a heat-conducting medium such as heat-conducting paste, so that the heat-generating source and the heat-dissipating module are connected. The heat resistance between them can be further eliminated, and the heat dissipation efficiency can be improved more effectively.

1 is an integrated heat dissipation module structure according to one embodiment of the present invention; 1 is a cross-sectional view of an integrated heat dissipation module structure according to an embodiment of the present invention; FIG. FIG. 4 is a structural diagram of the metal cover plate of the integrated heat dissipation module structure of one embodiment of the present invention; 1 is a structural diagram of a metal bottom cover plate of an integrated heat dissipation module structure according to an embodiment of the present invention; FIG. 4 is an integrated heat dissipation module structure of another embodiment of the present invention; FIG. 4 is a structural diagram of the metal bottom cover plate of the integrated heat dissipation module structure of another embodiment of the present invention; 4 is an integrated heat dissipation module structure of another embodiment of the present invention;

Hereinafter, the embodiments of the integrated heat dissipation module structure of the present invention will be described with reference to the relevant drawings, and the dimensions and proportions of each member in the drawings are exaggerated or reduced for clarity and convenience in describing the drawings. Sometimes. The technical terms used in the following description and/or the claims of the utility model registration should be interpreted in the meanings commonly known and commonly used in the general knowledge of this technical field. The same members therein are labeled with the same reference numerals and explained. The term "about" as used herein generally means that the actual numerical value is within ±10%, 5%, 1% or 0.5% of the specified numerical value or range. The term "about," as used herein, refers to the actual order of magnitude within an acceptable standard error of the mean, as determined by those skilled in the art. Except for embodiments or unless explicitly stated otherwise, all ranges, quantities, numerical values and percentages used herein are to be understood as being subject to the modification of "about"; Unless otherwise stated, any numerical values or parameters disclosed in this specification and utility model claims are approximate numerical values and may be changed as necessary.

1 to 4 are schematic diagrams of an integrated heat dissipation module structure 10 according to one embodiment of the present invention. As shown, the integrated heat dissipation module structure 10 of the present invention includes at least a heat dissipation outer surface 110 and a condensation inner surface 120 , with a plurality of columnar heat dissipation structures 111 on the heat dissipation outer surface 110 , and around the condensation inner surface 120 . A metal top plate 100 provided with an upper frame 122 of suitable height, with upper channel grooves 123 in the upper frame, a plurality of upper grooves 121 arranged parallel to each other on the condensing inner surface 120, and an endothermic outer surface 210. and an evaporative inner surface 220, the heat-absorbing outer surface 210 has a screw hole 211 for fixing the heat-dissipating electronic member, and a lower frame 222 with a suitable height is provided around the evaporative inner surface 220, and the lower frame 222 has a lower channel groove. 223 , and has a plurality of lower grooves 221 arranged parallel to each other on the evaporation inner surface 220 , a plurality of support structures 224 projecting between the lower grooves 221 , and screw hole protrusions 225 corresponding to the screw holes 211 . , the threaded hole projections 225 are recessed from the heat absorption outer surface 210 toward the evaporation inner surface 220 and protrude into the evaporation inner surface 220 but do not penetrate, and the height of the screw hole projections 225 is equal to or less than the height of the support structure 224. A metal lower cover plate 200, the upper frame 122 of the metal upper cover plate 100, and the lower frame 222 of the metal lower cover plate 200 are joined together to form an airtight space. and the evaporation inner surface 220 of the metal lower cover plate 200 are opposed to each other, and the arrangement of the upper groove 121 and the lower groove 221 can be mapped and superimposed and aligned with each other, and a plurality of support structures 224 are aligned with the evaporation inner surface 220 The working space 300 projecting from and extending from and abutting and supporting between the upper grooves 121 of the condensing inner surface 120, and the upper channel groove 123 and the lower channel groove 223 are correspondingly joined to form the working space 300. It comprises an intake channel 400 for intake, a capillary structure 500 located in the lower groove 221 or within the upper groove 121 and the lower groove 221 , and a working fluid present in the working space 300 and the capillary structure 500 .

In one embodiment, the upper frame 122 and the lower frame 222 of the integrated heat dissipation module structure 10 of the present invention are further soldered with the metal upper cover plate 100 and the metal lower cover plate 200 to form the integrated heat dissipation module structure of the present invention. 10 has solder joint grooves 1010 for forming 10;

2 and 3, in one embodiment, the feature of the integrated heat dissipation module structure 10 of the present invention lies in the shape provided by the metal cover plate 100 and the columnar heat dissipation structure 111, which is not externally attached but directly the same. Integrally formed from a metal sheet (or metal block), that is, the entire metal top cover plate 100 has the aforementioned shape and structural characteristics, which are manufactured by integrally molding the metal sheet (or metal block). . In more detail, the heat dissipation outer surface 110 of the metal cover plate 100 of the integrated heat dissipation module structure 10 of this embodiment has a plurality of columnar heat dissipation structures 111 directly formed on the heat dissipation outer surface 110 so that the metal cover plate 100 can dissipate heat. It is inseparable from the outer surface 110, does not have any heterogeneous or homogenous interface, and welds or welds the heat dissipation structure rather than sticking the heat sink to the heat dissipation surface of the vapor chamber with heat dissipation paste as is common in the prior art. Nor is it formed on the heat dissipation surface of the vapor chamber by sintering. In other words, the integrated heat-dissipating module of the present invention directly forms the heat-dissipating structure on the metal top plate of the vapor chamber, so that there is a heterogeneous interface between the heat sink and the vapor chamber and it has To improve heat dissipation efficiency without heat resistance.

2 and 4, in one embodiment, the integrated heat dissipation module structure 10 of the present invention is characterized by the shape and structural features provided by the metal bottom cover plate 200, and the same metal sheet (or metal block) is directly and integrally formed. In other words, the plurality of supporting structures 224 and the screw hole projections 225 of the evaporation inner surface 220 of the metal lower cover plate 200 of the integrated heat dissipation module structure 10 of the present embodiment are directly formed on the evaporation inner surface 220, and the metal lower cover plate sintering the support structure 224 to the evaporative inner surface 220 by common prior art sintering that cannot be separated by the same metal as the evaporative inner surface 220 of 200, does not have any heterogeneous or homogenous interfaces, and isn't it.

Generally speaking, the method for manufacturing the integrally formed metal top plate 100 and the metal bottom plate 200 of the integrated heat dissipation module structure 10 of the present invention as described above can be either an etching process or a compound processing process (e.g., milling and stamping or extrusion process integration) can be employed. The advantage of etching processes is that they can etch more complex structures and are generally used for products that are difficult to manufacture with conventional fabrication processes. The advantage of the multi-tasking process is that most of the manufacturing methods used are mature and can be produced without having to go through a lot of development. However, the etching process is relatively time-consuming and causes the problem that the processing surface is not flat and requires secondary processing, and the compound processing process requires relatively many steps and time for production and manufacturing. .

In one embodiment, the integrated heat dissipation module structure 10 of the present invention adopts cold forging to fabricate the shape and structure of the metal upper cover plate 100 and the metal lower cover plate 200, and combines and modifies the CNC process. can be done. In contrast to the etching process or compound processing process, the cold forging method puts the metal sheet (or metal block) to be worked into a female mold, and then continuously forges said metal sheet in a male mold at room temperature to form a shape. Let Those skilled in the art will know that the cold forging method does not require pre-heating, softening and annealing of the metal during the forging process as in the general stamping process, so the internal grain structure of the metal after forging will be pitted, Induce tissue enlargement and reduce heat transfer coefficient. Since the metal after cold forging has not undergone the heating process, its internal grain structure can still maintain a considerable density, and the defects such as internal pores can be reduced. It has the advantage of making the metal surface of the metal flatter, further improving the rigidity and denseness, and not easily deformed. That is, in this embodiment, the heat dissipation efficiency of the integrated heat dissipation module structure of the present invention is higher than that of the general conventional process.

In one embodiment, the metal top plate 100 of the integrated heat dissipation module structure 10 of the present invention is manufactured by cold forging, and its features are the shape and structural features included in the metal top plate 100 described above. is formed on the same metal sheet by direct cold forging, and includes a plurality of columnar heat-dissipating structures 111 on the heat-dissipating outer surface 110 of the metal cover plate 100 .

In one embodiment, the metal bottom cover plate 200 of the integrated heat dissipation module structure 10 of the present invention is manufactured by cold forging, and its features are similar to the shape and structural features included in the metal bottom cover plate 200 described above. are formed on the same metal sheet by direct cold forging, and include a plurality of protruding support structures 224 and screw hole projections 225 on the evaporative inner surface 220 of the metal lower cover plate 200, i.e. the same metal upper cover plate 100 Similarly, the plurality of protruding support structures 224 on the evaporative inner surface 220 of the metal lower cover plate 200 are not externally attached or produced by conventional sintering methods, but are integrally formed with the metal upper cover plate by forging. be done. In one embodiment, the support structure 224 of the plurality of protrusions is a columnar structure.

In one embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the integrated heat dissipation module structure 10 of the present invention are made of metal sheets with high thermal conductivity and thermal diffusion coefficients (eg, pure copper). The above structure is integrally formed by forging. In one embodiment, said metal sheet is pure copper.

As can be understood by those skilled in the art, in the above embodiment, when pure copper is used as a raw material and the metal upper cover plate 100 and the metal lower cover plate 200 are manufactured by cold forging, pure copper material is used in a mold at room temperature. The physical properties of the materials of the metal upper cover plate 100 and the metal lower cover plate 200 obtained by continuous forging are, for example, values such as Vickers hardness, thermal conductivity coefficient, and thermal diffusion coefficient. It is higher than pure copper material that has not undergone forging, and at the same time higher than metal top plate 100 and metal bottom plate 200 obtained by other manufacturing methods (eg, etching, stamping, extrusion or general forging processes). In other words, after the pure copper material undergoes cold forging, it has relatively high physical properties such as Vickers hardness, thermal conductivity coefficient, thermal diffusion coefficient, etc. These physical properties are different from the material properties by other processing means. different.

For example, in another disclosure, the inventor of the present invention uses cold forging to manufacture the metal upper and lower metal lid plates of the vapor chamber, and the material properties after cold forging are measured by a YUANHE) to measure the physical properties such as Vickers hardness, heat conduction coefficient and heat diffusion coefficient, and compare the obtained values with the conventional composite processing process (combining conventional stamping and CNC process) were as shown in Table (1) below. As will be appreciated by those skilled in the art, cold forging, due to the nature of the process, imparts to the material physical properties such as relatively high Vickers hardness, thermal conductivity and thermal diffusion coefficients, and these The degree of increase in the physical properties of the material is related to the number of forgings and the magnitude of force in the cold forging process required by the material. After inter-forging, the above figures are both superior to raw or conventionally processed materials, and have greater advantages compared to conventional composite processing methods.

In one embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the integrated heat dissipation module structure 10 of the present invention are made of pure copper with relatively high thermal conductivity and thermal diffusion coefficients, and are manufactured after cold forging. The metal upper cover plate 100 and the metal lower cover plate 200 which are formed have a Vickers hardness of 90 HV or more, for example, 90 HV, 95 HV, 100 HV or 105 HV.

In another embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the integrated heat dissipation module structure 10 of the present invention are made of pure copper with relatively high heat conduction coefficient and heat diffusion coefficient, and are The manufactured metal upper cover plate 100 and metal lower cover plate 200 are 400 W/(mK) or more, for example, 400 W/(mK), 405 W/(mK), 408 W/(mK). Or has a heat conduction coefficient of 410 W/(m·K).

In another embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the integrated heat dissipation module structure 10 of the present invention are made of pure copper with relatively high heat conduction coefficient and heat diffusion coefficient, and are The manufactured metal upper cover plate 100 and metal lower cover plate 200 have a thermal diffusion coefficient of 90 mm ² /sec or more, for example, 90 mm ² /sec, 95 mm ² /sec, 100 mm ² /sec or 105 mm ² /sec.

The integrated heat dissipation module structure 20 of FIG. 5 is another embodiment of the integrated heat dissipation module structure 10 of FIG. It further has a plurality of screw holes 211 for fastening the heat-dissipating electronic component, the plurality of screw holes 211 are recessed from the heat-absorbing outer surface 210 toward the evaporation inner surface 220 and protrude toward the evaporation inner surface 220 to form a plurality of screw holes. Protrusions 225 are formed but do not penetrate and the height of the screw hole protrusions 225 is less than or equal to the height of the support structure 224 . In one embodiment, when a plurality of heat-dissipating electronic members are screwed to the heat-absorbing outer surface 210 through the screw holes 211, the heat-dissipating electronic members are in close contact with the heat-absorbing outer surface 210 to improve heat dissipation efficiency. Of course, a heat-conducting material with good heat-conducting efficiency, such as heat-conducting paste or graphite flakes, can be added between the heat-dissipating electronic component and the heat-absorbing outer surface 210 to reduce the thermal resistance caused by the uneven contact surface. can.

In one of the above embodiments, the integrated heat dissipation module structure 10 or 20 is joined by welding after the metal top plate 100 or 101 and the metal bottom plate 200 or 201 are bonded together.

In one embodiment of any of the above, the working fluid used in the integrated heat dissipation module structure 10 or 20 of the present invention is pure water.

In one embodiment of any of the above, the working space 300 according to the integrated heat dissipation module structure 10 or 20 of the present invention has an air pressure of less than 1×10 ⁻³ Torr, such as 1×10 ⁻³ Torr after intake. , 1×10 ⁻⁴ Torr or 1×10 ⁻⁵ Torr.

FIG. 7 shows an integrated heat dissipation module structure 30 of another embodiment of the present invention. As shown, the integrated heat dissipation module structure 30 of the present invention includes a heat dissipation outer surface 110 and a condensing inner surface 120 , with a plurality of columnar heat dissipation structures 111 on the heat dissipating outer surface 110 , and around the condensing inner surface 120 appropriate A metal top plate 101 having a height upper frame 122 provided with upper channel grooves 123 in the upper frame 122 and having a plurality of upper grooves 121 arranged parallel to each other on the condensing inner surface 120, an endothermic outer surface 210 and The heat-absorbing outer surface 210 includes a plurality of screw holes 211 for fixing a plurality of heat-dissipating electronic components. A lower channel groove 223 is provided, and a plurality of lower grooves 221 arranged parallel to each other on the evaporation inner surface 220 and a plurality of screw hole projections 225 corresponding to the plurality of screw holes 211 are provided, and the screw hole projections 225 are , the metal lower cover plate 202 which is recessed from the heat absorption outer surface 210 toward the evaporation inner surface 220 and protrudes into the evaporation inner surface 220 but does not penetrate the evaporation inner surface 220, and the upper frame 122 of the metal upper cover plate 101 and the lower frame 222 of the metal lower cover plate 202 mutually. The condensing inner surface 120 of the metal upper cover plate 101 and the evaporation inner surface 220 of the metal lower cover plate 202 face each other, and the arrangement of the upper groove 121 and the lower groove 221 are mapped to each other. a plurality of threaded hole projections 225 projecting and extending from the evaporating inner surface 220 to abut and support the condensing inner surface 120, the workspace 300, the upper channel groove 123 and the lower channel. An intake channel 400 configured with correspondingly joined grooves 223 to intake air into the working space 300; and a working fluid residing within structure 500 .

In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the metal cover plate 101 includes a columnar structure 111 integrally formed by a metal sheet (or metal block), and The entire metal lower cover plate 202 includes a plurality of screw hole protrusions integrally formed from a metal sheet.

In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the screw holes 211 have at least 10 and correspondingly the same number of the screw hole protrusions 225 .

In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the material of the metal upper cover plate 101 and the metal lower cover plate 202 is pure copper.

In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the metal upper cover plate 101 and the metal lower cover plate 202 are joined together and then welded together.

In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the working fluid is pure water.

In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the air pressure in the working space 300 is less than 1×10 ⁻³ Torr, such as 1×10 ⁻³ Torr, 1×10 ⁻⁴ Torr or 1×10 Torr. ^-5 torr.

Of course, the above embodiments are for illustration only and are not intended to limit the scope of the present invention, and equivalent modifications or alterations based on the integrated heat dissipation module structure of the above embodiments can still be applied to the present invention. should be included in the scope of protection of

In addition, most of the conventional heat dissipation modules adopt an external heat sink, and such a combination adds the thermal resistance of the heat-conducting interface in front of the heat sink to reduce the heat dissipation efficiency. In the integrated heat dissipation module structure of the present invention, the upper cover of the vapor chamber and the heat sink are integrally formed, so that the ultra-high heat dissipation efficiency of the vapor chamber is no longer limited by the thermal resistance of the conductive interface, and the heat dissipation efficiency can be further improved. In addition, the integrated heat dissipation module structure of the present invention can be manufactured by cold forging, in addition to being manufactured by etching process or compound processing process (such as casting, forging, milling, stamping or extrusion, etc.), The grain structure of the material is finer, the defects of the internal pores are reduced, the material has relatively high strength, deformation resistance, fatigue resistance and other excellent mechanical properties, and the material's heat conduction efficiency and The heat dissipation efficiency can be improved, and the formed integrated heat dissipation module is superior to general heat dissipation modules of similar structure in terms of heat dissipation performance, durability and reliability.

From the above, it can be concluded that the present invention overcomes the problems of the prior art, achieves the desired effect, is not easily conceived by a person skilled in the art, has inventive step and practicality, and can be claimed for utility model registration. If you find that it meets the requirements of the above, please file a utility model application according to the law, and sincerely request your office to approve the registration of the utility model application for the present invention in order to encourage innovation.

The descriptions above are intended to be illustrative, not limiting. Other equivalent modifications or alterations that do not depart from the spirit and scope of the present invention should be included in the utility model claims below.

REFERENCE SIGNS LIST 10 integrated heat dissipation module structure 20 integrated heat dissipation module structure 30 integrated heat dissipation module structure 100 metal top cover plate 101 metal top cover plate 110 heat dissipation outer surface 111 columnar heat dissipation structure 120 condensation inner surface 121 upper groove 122 upper frame 123 upper channel groove 200 metal bottom cover plate 201 metal lower cover plate 202 metal lower cover plate 210 heat absorption outer surface 211 screw hole 220 evaporator inner surface 221 lower groove 222 lower frame 223 lower channel groove 224 support structure 225 screw hole protrusion 300 workspace 400 air intake channel 500 capillary structure 1010 solder joint groove

Claims (18)

comprising a heat-dissipating outer surface and a condensing inner surface, wherein the heat-dissipating outer surface has a plurality of columnar heat-dissipating structures, and an upper frame with a suitable height is provided around the condensing inner surface, the upper frame is provided with an upper channel groove; a metal top plate having a plurality of upper grooves arranged parallel to each other on the condensing inner surface;
a heat-absorbing outer surface and an evaporating inner surface, the heat-absorbing outer surface having a screw hole for fixing a heat-dissipating electronic member, a lower frame having a suitable height around the evaporating inner surface, and a lower channel groove in the lower frame; a plurality of lower grooves arranged parallel to each other on the evaporation inner surface; a plurality of support structures protruding between the lower grooves; and screw hole projections corresponding to the screw holes; a metal lower cover plate recessed from the heat absorption outer surface toward the evaporation inner surface to protrude into the evaporation inner surface but do not penetrate the evaporation inner surface, and the height of the screw hole protrusion is equal to or less than the height of the support structure; and,
an airtight space formed by joining the upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate to each other, wherein the condensed inner surface of the metal upper cover plate and the condensed inner surface of the metal lower cover plate are airtight spaces; The inner evaporating surfaces are opposed to each other and the arrangement of the upper and lower grooves may be in superimposed and aligned mapping with each other, the support structure extending protrudingly from the inner evaporating surface and extending over the inner condensing surface. a work space abutting and supporting between the upper grooves;
an intake channel configured by correspondingly joining the upper channel groove and the lower channel groove to provide intake air to the work space;
a capillary structure located within the lower groove or within the upper groove and the lower groove;
a working fluid residing within the working space and the capillary structure;
with an integrated heat dissipation module structure. The entire metal upper cover plate includes the columnar structure and is formed by integrally forming and forging a metal sheet by cold forging, and the entire metal lower cover plate includes the support structure and the screw hole projection. The integrated heat dissipation module structure according to claim 1, comprising a part, which is formed by integrally forming and forging a metal sheet by cold forging. 3. The integrated heat dissipation module structure of claim 2, wherein the metal sheet is pure copper. 3. The integrated heat dissipation module structure of claim 2, wherein the metal sheet is pure copper, and the metal top plate and the metal bottom plate have a Vickers hardness greater than or equal to 90HV. 3. The integrated heat dissipation module structure of claim 2, wherein the metal sheet is pure copper, and the metal upper cover plate and the metal lower cover plate have a thermal conductivity coefficient of 400W/(mK) or more. The integrated heat dissipation module structure of claim 2, wherein the metal sheet is pure copper, and the metal upper cover plate and the metal lower cover plate have a thermal diffusion coefficient of ^90mm2 /s or more. 3. The integrated heat dissipation module structure of claim 2, wherein the support structure is a columnar structure. The integrated heat dissipation module structure of claim 2, wherein the metal upper cover plate and the metal lower cover plate are joined together and then joined by welding. 3. The integrated heat dissipation module structure of claim 2, wherein the working fluid is pure water. 3. The integrated heat dissipation module structure as claimed in claim 2, wherein the air pressure of said working space is less than ^1x10-3 Torr. The heat-absorbing outer surface of the metal lower cover plate further has a plurality of screw holes for fixing a plurality of the heat-dissipating electronic members, and the evaporation inner surface has a plurality of screw-hole protrusions corresponding to the screw holes. , the threaded hole protrusions are recessed from the heat absorption outer surface toward the evaporation inner surface and protrude into the evaporation inner surface but do not penetrate, and the height of the screw hole protrusions is equal to or less than the height of the support structure. The integrated heat dissipation module structure of claim 1, comprising: comprising a heat-dissipating outer surface and a condensing inner surface, wherein the heat-dissipating outer surface has a plurality of columnar heat-dissipating structures, and an upper frame with a suitable height is provided around the condensing inner surface, the upper frame is provided with an upper channel groove; a metal top plate having a plurality of upper grooves arranged parallel to each other on the condensing inner surface;
a heat-absorbing outer surface and an evaporating inner surface, the heat-absorbing outer surface having a plurality of screw holes for fixing a plurality of heat-dissipating electronic components; a lower frame having a suitable height around the evaporating inner surface; A lower channel groove is provided, and a plurality of lower grooves arranged parallel to each other on the evaporation inner surface and a plurality of screw hole projections corresponding to the plurality of screw holes, the screw hole projections corresponding to the heat absorption a metal lower lid plate that is recessed from the outer surface toward the evaporation inner surface and protrudes from the evaporation inner surface but does not penetrate through the evaporation inner surface;
an airtight space formed by joining the upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate to each other, wherein the condensed inner surface of the metal upper cover plate and the condensed inner surface of the metal lower cover plate are airtight spaces; The evaporating inner surfaces are opposed to each other, and the arrangement of the upper groove and the lower groove can be mapped to overlap and align with each other, and the threaded hole protrusions extend protruding from the evaporating inner surface to allow the condensing a workspace that abuts and supports the inner surface;
an intake channel configured by correspondingly joining the upper channel groove and the lower channel groove to provide intake air to the work space;
a capillary structure located within the lower groove or within the upper groove and the lower groove;
a working fluid residing within the working space and the capillary structure;
with an integrated heat dissipation module structure. The entire metal upper cover plate includes the columnar structure formed by integrally forming a metal sheet, and the entire metal lower cover plate is formed by integrally forming the metal sheet. 13. The integrated heat dissipation module structure of claim 12, comprising hole projections. 13. The integrated heat dissipation module structure as claimed in claim 12, wherein said screw holes have at least ten and correspondingly the same number of said screw hole protrusions. 13. The integrated heat dissipation module structure of claim 12, wherein the material of the metal upper cover plate and the metal lower cover plate is pure copper. The integrated heat dissipation module structure of claim 12, wherein the metal upper cover plate and the metal lower cover plate are joined together and then joined by welding. 13. The integrated heat dissipation module structure of claim 12, wherein the working fluid is pure water. 13. The integrated heat dissipation module structure as claimed in claim 12, wherein the air pressure of said working space is less than ^1x10-3 Torr.

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