TWM641115U - Inner rib defect detection device for front-opening substrate transfer box - Google Patents
Inner rib defect detection device for front-opening substrate transfer box Download PDFInfo
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Abstract
本新型提供一種前開式基板傳送盒的內肋瑕疵檢測裝置,包括在一懸持臂上間隔佈建多個測元件而形成一懸持式的檢測面域,並且經由一控制單元驅動一雙軸驅動器用以帶動該懸持臂植入基板傳送盒之一盒體的多層式插槽內,驅使多個所述感測元件能依循一迴圈移動路徑而檢知各層插槽之間的多個內肋的多個準位,該控制單元並比對各該準位和所述內肋的一輪廓標準值而取得一瑕疵檢測結果,以利於檢知內肋存在瑕疵的盒體。The present invention provides a detection device for internal rib flaws of a front-opening substrate transfer box, which includes a plurality of measuring elements arranged at intervals on a suspension arm to form a suspended detection area, and a dual-axis is driven by a control unit. The driver is used to drive the cantilever arm to be implanted into the multi-layer slot of a box body of the substrate transfer box, and drive the plurality of sensing elements to detect the multiple slots between the slots of each layer following a circular movement path. A plurality of levels of the inner rib, the control unit compares each level with a profile standard value of the inner rib to obtain a defect detection result, so as to facilitate detection of boxes with inner rib defects.
Description
本新型涉及容置基板用的前開式傳送盒,特別是針對該傳送盒之內肋的準位實施瑕疵檢測的技術,尤其是一種前開式基板傳送盒的內肋瑕疵檢測裝置。 The present invention relates to a front-opening transfer box for accommodating substrates, in particular to a defect detection technology for the alignment of inner ribs of the transfer box, in particular to an inner rib defect detection device of a front-opening substrate transfer box.
前開式傳送盒(Front Opening Unified Pod,以下簡稱FOUP)是由一盒體的開口上結合可開啟及封閉該開口的一前蓋組成。所述FOUP可泛見於半導體製程中,用於容置及載運半導體晶元進行一系列的工序場合被應用,以確保半導體晶元的高精度製程良率;除此之外,所述FOUP也已經逐漸被推廣至用於容置及載運一般的基板(或稱載板),以確保基板的製程良率。所稱基板,可包含像是崁入式多晶片互連橋接(EMIB)用電路載板或使用ABF作為增層材料的電路載板等,這些高階電路載板的面域相對較傳統PCB大,且採用長方形的排版模式呈現,使得高階電路載板的硬度也相對較傳統PCB軟;當然,隨著需求端客製化的多樣性,所述基板也可包含大面域的PCB或其他板狀物件。 Front Opening Unified Pod (FOUP for short) is composed of an opening of a box body combined with a front cover capable of opening and closing the opening. The FOUP can be widely used in the semiconductor manufacturing process, and is used for accommodating and carrying semiconductor wafers for a series of process occasions to ensure the high-precision process yield of semiconductor wafers; in addition, the FOUP has also been It is gradually extended to accommodate and carry general substrates (or carrier boards) to ensure the process yield of the substrates. The so-called substrate may include circuit substrates such as Embedded Multi-chip Interconnect Bridge (EMIB) or circuit substrates using ABF as a build-up material. The area of these high-end circuit substrates is relatively larger than that of traditional PCBs. And it is presented in a rectangular typesetting mode, so that the hardness of the high-end circuit carrier board is relatively softer than that of the traditional PCB; of course, with the diversity of customization at the demand side, the substrate can also include large-area PCBs or other board-shaped object.
由於基板的面域相對較半導體晶元大,使得基板傳送盒與半導體晶元傳送盒之間存在盒體內肋構造上的差異;進一步的說,基板傳送盒的盒體內壁為了營造出多層式插槽(slot),必須於盒體內壁形成有多數個內肋,而組成所述內肋構造。所述內肋構造,除了包含該盒體的雙側內壁分層形成的邊肋之外,還包含由該盒體底壁中央分層凸伸形成的懸狀支撐肋,使雙側的邊肋能於各層插槽的雙底側充當容置基板時的導引肋,並且利用懸狀支撐肋穩定支撐於基板中央的底部;其中,雙側的邊肋和中置的懸狀支撐肋位在各層插槽中,是以相等層位高度的方式相互間隔對應的;然而,由於半導體晶元的面域並不大,因此在半導體晶元傳送盒內,並不需要中置的所述懸狀支撐肋的存在;由此可知,基板傳送盒的盒體內肋構造相對較半導體晶元傳送盒的盒體內肋構造複雜。 Since the area of the substrate is relatively larger than that of the semiconductor wafer, there is a difference in the inner rib structure between the substrate transfer box and the semiconductor wafer transfer box; The groove (slot) must be formed with several internal ribs on the inner wall of the box to form the internal rib structure. The internal rib structure, in addition to the side ribs formed by layers on the inner walls of the box body, also includes suspended support ribs formed by layered protrusions from the center of the bottom wall of the box body, so that the edges on both sides The ribs can be used as guide ribs for accommodating substrates on the double bottom side of each layer of slots, and are stably supported on the bottom of the center of the substrate by means of suspended support ribs; among them, the side ribs on both sides and the suspended support ribs in the middle are positioned In the slots of each layer, they are spaced and corresponded to each other in the manner of equal layer heights; however, since the area of the semiconductor wafer is not large, the suspension in the middle is not required in the semiconductor wafer transfer box. The existence of shaped support ribs; it can be seen that the inner rib structure of the substrate transfer box is relatively more complex than the inner rib structure of the semiconductor wafer transfer box.
另一方面,由於基板的製程與半導體晶元的製程中,通常都存在溫度和濕度等環境因素,因此當使用所述傳送盒載運基板或半導體晶元進行製程加工時,該盒體必然會遭受製程溫度和濕度的影響,特別是在耐久性地使用一段時間之後,該盒體內的所述邊肋和懸狀支撐肋較容易發生變形,其中特別是該懸狀支撐肋發生變形的機率相對較高;且知,一當所述邊肋或懸狀支撐肋發生變形後,勢必影響各層插槽的空間,而造成基板難以植入各層插槽,亦或基板卡持在插槽內而難以被取出的現象。因此,基板傳送盒在基板產線使用一段時間後,必須對盒體內的所述邊肋及懸狀支撐肋的準位,進行有或無偏位或變形的瑕疵檢測;惟,所述瑕疵檢測,截至目前,仍仰賴人工方式進行。 On the other hand, since there are usually environmental factors such as temperature and humidity in the manufacturing process of the substrate and the semiconductor wafer, when the transfer box is used to carry the substrate or semiconductor wafer for process processing, the box will inevitably suffer The impact of process temperature and humidity, especially after a period of durable use, the side ribs and the suspension-shaped support ribs in the box are more likely to be deformed, especially the probability of deformation of the suspension-shaped support ribs is relatively low. It is known that once the side ribs or the suspension support ribs are deformed, the space of the slots of each layer will be affected, making it difficult for the substrate to be inserted into the slots of each layer, or the substrate is stuck in the slot and difficult to be inserted into the slot. phenomenon of removal. Therefore, after the substrate transfer box has been used in the substrate production line for a period of time, it is necessary to check the alignment of the side ribs and the suspension support ribs in the box with or without deviation or deformation; however, the defect detection , so far, still rely on manual methods.
有鑑於此,本新型旨在針對所述前開式基板傳送盒的盒體,特別是該盒體的多個內肋的總體構造,提供出一種利於自動化施行的瑕疵檢測技術。 In view of this, the present invention aims to provide a defect detection technology that is conducive to automatic implementation for the box body of the front-opening substrate transfer box, especially the overall structure of the multiple inner ribs of the box body.
本新型一較佳實施例,在於提供一種前開式基板傳送盒的內肋瑕疵檢測裝置,用於檢測所述基板傳送盒的一盒體,該盒體具有一沿著一Y軸向開放的開口,且該盒體的所述開口內具有沿著一Y軸向延伸並且沿著一Z軸向間隔分佈的多個層列形式的插槽,多個所述插槽分別由該盒體內的多個內肋間隔形成,多個所述內肋包含沿著一X軸向相對凸伸的雙側邊肋和坐落於雙側所述邊肋之間並且沿著該Y軸向凸伸的一懸狀支撐肋;該瑕疵檢測裝置包括一懸持臂、多個感測元件及一控制單元;該懸持臂配置於一雙軸驅動器上,該雙軸驅動器能驅動該懸持臂執行該Y軸向及該Z軸向的雙向移動;多個所述感測元件沿該X軸向及Y軸向間隔佈建於該懸持臂上而形成該懸持臂上的一懸持式的檢測面域;該控制單元內建有多個所述內肋的一輪廓標準值,並且電連接於該雙軸驅動器和多個所述感測元件之間;該控制單元能驅動該雙軸驅動器而使該懸持臂植入於各層所述插槽內,驅使該檢測面域上的多個所述感測元件能逐層檢知多個所述邊肋和該懸狀支撐肋各自的一準位,該控制單元並比對各該準位和該輪廓標準值而取得 一瑕疵檢測結果;其中,該輪廓標準值包含各層所述插槽的多個邊肋和該懸狀支撐肋坐落在該X軸向、該Y軸向及該Z軸向的標準位置,該檢測面域沿該Y軸向逐層執行多個所述邊肋和至少一所述懸狀支撐肋的一測距移動,該檢測面域還沿該Z軸向逐層執行一換層式移動,其中在該測距移動及該換層式移動的過程中,多個所述感測元件排除接觸多個所述內肋,且所述準位包含多個所述邊肋的準位、該懸狀支撐肋的準位以及所述邊肋和該懸狀支撐肋之間的準位。 A preferred embodiment of the present invention is to provide a front-opening type substrate transfer box internal rib flaw detection device for detecting a box body of the substrate transfer box, the box body has an opening opened along a Y-axis , and the opening of the box body has a plurality of layered slots extending along a Y axis and distributed along a Z axis at intervals. A plurality of inner ribs are formed at intervals, and the plurality of inner ribs include two-sided side ribs protruding oppositely along an X-axis and an overhang that is located between the side ribs on both sides and protrudes along the Y-axis shaped support rib; the defect detection device includes a suspension arm, a plurality of sensing elements and a control unit; the suspension arm is configured on a biaxial driver, and the biaxial driver can drive the suspension arm to perform the Y-axis and the bidirectional movement of the Z axis; a plurality of the sensing elements are arranged on the suspension arm at intervals along the X axis and the Y axis to form a suspended detection surface on the suspension arm domain; the control unit is built with a profile standard value of a plurality of inner ribs, and is electrically connected between the biaxial driver and a plurality of sensing elements; the control unit can drive the biaxial driver so that The cantilever arm is implanted in the slots of each layer, so that the plurality of sensing elements on the detection area can detect a level of each of the plurality of side ribs and the suspension support rib layer by layer, The control unit compares each of the levels and the profile standard value to obtain A defect detection result; wherein, the contour standard value includes the multiple side ribs of the slots of each layer and the standard position of the suspension support rib located in the X-axis, the Y-axis and the Z-axis, the detection The area performs a distance-measuring movement of a plurality of side ribs and at least one of the suspension support ribs layer by layer along the Y axis, and the detection area also performs a layer-by-layer movement along the Z axis, Wherein in the process of the ranging movement and the layer-changing movement, the plurality of sensing elements are excluded from contacting the plurality of inner ribs, and the level includes the level of the plurality of side ribs, the suspension The position of the shaped support rib and the position between the side rib and the suspended support rib.
在進一步實施中,該內肋瑕疵檢測裝置還包含配置該雙軸驅動器的一機檯,該機檯還設有提供該盒體擺放至固定的一檯面,且該控制單元係配置於該機檯上。其中,該雙軸驅動器包含有:沿所述Y軸向固置於該機檯上的一對滑軌,傳動連結於該對滑軌上執行所述Y軸向移動的一滑檯,以及傳動連結於該滑檯上執行所述Z軸向移動的一滑座,且該懸持臂沿所述Y軸向架置於該滑座進而配置於該雙軸驅動器上,用以帶動該懸持臂上的多個所述感測元件同步執行該測距移動及該換層式移動。 In a further implementation, the inner rib defect detection device also includes a machine platform configured with the biaxial drive, the machine platform is also provided with a fixed surface for placing the box, and the control unit is configured on the machine on stage. Wherein, the biaxial driver includes: a pair of slide rails fixed on the machine table along the Y axis, a slide table connected to the pair of slide rails to perform the Y axis movement, and a drive A sliding seat that is connected to the sliding table to perform the Z-axis movement, and the suspension arm is mounted on the sliding seat along the Y-axis and then configured on the biaxial drive to drive the suspension The plurality of sensing elements on the arm perform the ranging movement and the layer-changing movement synchronously.
在進一步實施中,多個所述感測元件包含沿所述X軸向間隔配置的一對邊肋測距元件及一對支撐肋照射元件。其中,該懸持臂具有沿所述X軸向相互間隔的二臂部,多個所述感測元件分散地佈建於二所述臂部上而形成該檢測面域;各層所述插槽於所述X軸向區分成坐落於各該懸狀支撐肋雙側的二槽部,各該邊肋測距元件和各該支撐肋照射元件間隔配置於各該臂部上,用以植入各該槽部內執行所述測距移動。依此,能更進一步地實施下述內容:所述測距移動為該檢測面域以沿著所述Y軸向持續移動方式或多個定點的步進移動方式,驅使該對邊肋測距元件能在所述X軸向對各該邊肋投照及接收一測距光線,用以檢知各該邊肋的準位。 In a further implementation, the plurality of sensing elements include a pair of side rib ranging elements and a pair of supporting rib illuminating elements arranged at intervals along the X-axis. Wherein, the suspension arm has two arm portions spaced apart from each other along the X-axis, and a plurality of sensing elements are dispersedly arranged on the two arm portions to form the detection area; the slots of each layer The X-axis area is divided into two grooves located on both sides of each of the cantilevered support ribs, and each of the side rib distance measuring elements and each of the support rib irradiation elements are arranged at intervals on each of the arms for implantation Said ranging movement is performed within each of the slot portions. According to this, the following content can be further implemented: the distance measurement movement is that the detection area moves continuously along the Y axis or a stepwise movement of multiple fixed points to drive the pair of side ribs to measure distance The element can project and receive a distance-measuring light on each of the side ribs in the X-axis, so as to detect the position of each of the side ribs.
各該邊肋沿所述Z軸向凸伸形成有至少一丘部,所述測距移動為該檢測面域以沿著所述Y軸向持續移動方式或多個定點的步進移動方式,驅使該對邊肋測距元件能在所述X軸向投照及接收一測距光線,用以檢知各該邊肋、各該丘部的至少其中之一的準位。更進一步的,該對邊肋測 距元件分別在所述X軸向搭載一三稜鏡,各該三稜鏡能反射各該對邊肋測距元件在所述X軸向投照及回收的測距光線成為所述Z軸向的測距光線,各該邊肋、各該丘部的至少其中之一接受所述Z軸向的測距光線的投照而檢知各自的所述準位。 Each of the side ribs protrudes along the Z-axis to form at least one mound, and the distance-measuring movement is a continuous movement of the detection area along the Y-axis or a step-by-step movement of multiple fixed points, Driving the pair of side rib distance measuring elements to project and receive a distance measuring light in the X-axis to detect the position of at least one of the side ribs and the hills. Further, the side rib measurement The distance elements are respectively equipped with a three-axis beam on the X-axis, and each of the three beams can reflect the distance-measuring light projected and recovered by the pair of side-rib distance-measuring elements on the X-axis to become the Z-axis At least one of each of the side ribs and each of the hills receives the projection of the Z-axis distance measuring light to detect the respective positions.
各該邊肋沿所述Y軸向延伸或間隔分佈形成,所述測距移動為該檢測面域以沿著所述Y軸向持續移動方式或多個定點的步進移動方式,驅使該對邊肋測距元件能在所述測距移動過程中朝著所述X軸向對各該邊肋投照及接收一測距光線,用以檢知各該邊肋的準位。 Each of the side ribs extends along the Y axis or is formed at intervals, and the distance measurement movement is that the detection area moves continuously along the Y axis or in a stepwise movement of multiple fixed points to drive the pair The side rib distance-measuring element can project and receive a distance-measuring light toward each of the side ribs toward the X-axis during the distance-measuring movement, so as to detect the alignment of each of the side ribs.
該對支撐肋照射元件能在所述X軸向相互投射一對照式光線,各該懸狀支撐肋接受該對照式光線的投照而檢知準位。 The pair of supporting rib illuminating elements can mutually project a contrasting light on the X-axis, and each of the suspended supporting ribs receives the projection of the contrasting light to detect the position.
各該懸狀支撐肋沿所述Z軸向形成一弧凸部,該對支撐肋照射元件能在所述X軸向相互投射一對照式光線,用以檢知各該邊肋、各該丘部的至少其中之一的準位。 Each of the suspended supporting ribs forms an arc protrusion along the Z axis, and the pair of supporting rib illuminating elements can project a contrasting light to each other in the X axis to detect each of the side ribs, each of the hills at least one of the divisions.
所述邊肋和該懸狀支撐肋之間的準位,由該對邊肋測距元件檢知各該邊肋的準位以及由該對支撐肋照射元件檢知各該支撐肋的準位之後,經由該控制單元相互比對得知。 The alignment between the side rib and the suspended support rib, the alignment of each side rib is detected by the pair of side rib distance measuring elements and the alignment of each of the support ribs is detected by the pair of support rib illuminating elements Afterwards, they are compared with each other via the control unit.
此外,在進一步實施中,各該端肋的端側分別形成有一端壁,多個所述感測元件還包含沿所述X軸向配置用以檢知所述端壁的一對端壁測距元件,各該端壁測距元件配置於各該臂部上並且和各該邊肋測距元件,該檢測面域由該對邊肋測距元件、該對支撐肋照射元件及該對端壁測距元件相互間隔形成。 In addition, in a further implementation, an end wall is formed on the end side of each of the end ribs, and the plurality of sensing elements also include a pair of end wall sensors arranged along the X-axis to detect the end wall. Distance elements, each of the end wall distance measuring elements is arranged on each of the arm parts and each of the side rib distance measuring elements, the detection area is composed of the pair of side rib distance measuring elements, the pair of supporting rib irradiation elements and the opposite end The wall ranging elements are formed at intervals from each other.
在更進一步實施中,該檢測面域容許上述各該感測元件在所述Z軸向保有的一投光位差。 In a further implementation, the detection area allows a light projection potential difference of each of the sensing elements in the Z-axis.
在更進一步實施中,各層所述插槽於所述X軸向區分成坐落於各該懸狀支撐肋雙側的二槽部,各該端壁測距元件配置於各該臂部上,而和各該邊肋測距元件及各該支撐肋照射元件相互間隔,用以植入各該槽部內執行所述測距移動。 In a further implementation, the slots of each layer are divided into two grooves located on both sides of each of the suspension support ribs in the X-axis area, and each of the end wall distance measuring elements is arranged on each of the arms, and and each of the side rib ranging elements and each of the supporting rib illuminating elements are spaced apart from each other, and are used for implanting in each of the grooves to perform the distance measuring movement.
依據上述內容,本新型能應用於使用前開式基板傳送盒載運及傳送基板進行加工的自動化產線上,針對該盒體的多個所述內肋進行自動化的內肋瑕疵檢測,以利於檢知已經存在有偏位或變形之內肋的盒體,避免基板難以植入各層插槽,亦或基板卡持在插槽內而難以被取出的問題發生。 According to the above content, the present invention can be applied to an automatic production line that uses a front-opening substrate transfer box to carry and transfer substrates for processing, and to perform automatic detection of inner rib defects on multiple inner ribs of the box body, so as to facilitate the detection of existing defects. There is a box with offset or deformed inner ribs, which avoids the problem that the substrate is difficult to insert into the slots of each layer, or the substrate is stuck in the slot and difficult to be taken out.
此外,本新型提供的懸持式檢測面域,以及該檢測面域能執行的多種迴圈移動路徑,乃有助於適應前開式基板傳送盒之盒體的複雜性內肋構造,避免該檢測面域在移動檢測過程中碰撞或接觸多個所述內肋或容置艙四周的內壁,並有提升檢測速率的效用。 In addition, the suspended detection area provided by the new model, as well as the various circular movement paths that can be performed by the detection area, are helpful to adapt to the complex internal rib structure of the box body of the front-opening substrate transfer box, avoiding the detection During the movement detection process, the surface area collides with or touches multiple inner ribs or the inner walls around the accommodation compartment, and has the effect of increasing the detection rate.
為此,相關本新型實施上的詳實內容,將搭配圖式進一步說明於下。 For this reason, the detailed content related to the implementation of the present invention will be further explained below with accompanying drawings.
10:盒體 10: box body
11:開口 11: opening
12:容置艙 12: Storage compartment
13:內肋 13: inner rib
13a:邊肋 13a: side rib
13a’:丘部 13a': massif
13a”:端壁 13a": end wall
13b:懸狀支撐肋 13b: suspended support rib
13b’:弧凸部 13b': arc convex part
20:基板 20: Substrate
21:插槽 21: slot
21a,21b:槽部 21a, 21b: Groove
30:機檯 30:Machine
31:檯面 31: Mesa
32:定位柱 32: positioning column
40:懸持臂 40: Cantilever arm
41,42:臂部 41,42: arm
43:支撐部 43: support part
50:感測元件 50: Sensing element
51:邊肋測距元件 51: Rib ranging element
52:支撐肋照射元件 52:Support Rib Irradiation Element
53:三稜鏡 53: three 稜鏡
54:端壁測距元件 54: End wall ranging element
60:雙軸驅動器 60: Dual shaft drive
61:滑軌 61: slide rail
62:滑檯 62: sliding table
63:滑座 63: sliding seat
A,B,C,D,E,F:標點 A,B,C,D,E,F: punctuation
L:波形移動路徑 L:Waveform moving path
L1:測距移動 L1: ranging movement
L2:換層式移動 L2: layer-changing movement
M,N:蛇形移動路徑 M, N: Serpentine moving path
M1,N1:測距移動 M1, N1: ranging movement
M2,N3:換層式移動 M2, N3: layer-changing movement
N2:復位移動 N2: reset move
Q:檢測面域 Q: Detection area
T1,T2:間隙空間 T1, T2: Interstitial space
S1至S4:步驟 S1 to S4: steps
δ:投光位差 δ : light projection difference
圖1是本新型待檢測之前開式基板傳送盒的盒體的立體示意圖,說明該盒內形有建構多層式插槽用的內肋,用以容置基板。 Fig. 1 is a three-dimensional schematic diagram of the box body of the front-opening substrate transfer box to be tested, illustrating that the box has internal ribs for constructing multi-layer slots for accommodating substrates.
圖2是圖1所示內肋的俯視示意圖,說明所述內肋在Y軸向建構出一檢測面域。 FIG. 2 is a schematic top view of the inner rib shown in FIG. 1 , illustrating that the inner rib constructs a detection area in the Y-axis.
圖3是圖2所示內肋的前視示意圖,說明該檢測面域容許在Z軸向生成一投光位差。 FIG. 3 is a schematic front view of the inner rib shown in FIG. 2 , illustrating that the detection area is allowed to generate a light projection height difference in the Z-axis.
圖4是本新型瑕疵檢測裝置的立體配置示意圖。 Fig. 4 is a perspective view of the configuration of the new defect detection device.
圖5是圖4的前視示意圖,說明該前開式基板傳送盒的盒體能置放於該瑕疵檢測裝置中進行內肋的瑕疵檢測。 FIG. 5 is a schematic front view of FIG. 4 , illustrating that the box body of the front-loading substrate transfer box can be placed in the defect detection device for defect detection of inner ribs.
圖6是圖4所示邊肋測距元件搭載三稜鏡檢測丘部或邊肋之準位的立體放大示意圖。 FIG. 6 is a three-dimensional enlarged schematic view of the side rib ranging element shown in FIG. 4 equipped with a three-panel to detect the position of the mound or the side rib.
圖7是圖4所示邊肋測距元件搭載三稜鏡檢測丘部或邊肋之準位的平面放大示意圖。 FIG. 7 is a schematic enlarged plan view of the side rib ranging element shown in FIG. 4 equipped with a three-panel to detect the position of the mound or the side rib.
圖8是圖4所示支撐肋照射元件檢測懸狀支撐肋之準位的平面放大示意圖。 FIG. 8 is a schematic enlarged plan view of the level of the suspended support rib detected by the support rib illuminating element shown in FIG. 4 .
圖9是圖4所示邊肋測距元件檢測邊肋之準位的平面放大示意圖。 FIG. 9 is a schematic enlarged plan view of the detection of the alignment of the side rib by the side rib ranging element shown in FIG. 4 .
圖10是本新型瑕疵檢測方法的程序方塊圖。 FIG. 10 is a program block diagram of the novel defect detection method.
圖11是圖2的解說示意圖,說明本新型能針對所述內肋預設出多個待以檢測的標點。 FIG. 11 is an explanatory diagram of FIG. 2 , illustrating that the present invention can preset a plurality of marking points to be detected for the inner rib.
圖12是圖2所示檢測面域執行一波形移動路徑的迴圈移動路徑示意圖。 FIG. 12 is a schematic diagram of a circular moving path of the detection area shown in FIG. 2 executing a waveform moving path.
圖13是圖2所示檢測面域執行一蛇形移動路徑的迴圈移動路徑示意圖。 FIG. 13 is a schematic diagram of a circular moving path in which the detection area shown in FIG. 2 executes a serpentine moving path.
圖14是圖2所示檢測面域執行另一蛇形移動路徑的迴圈移動路徑示意圖。 FIG. 14 is a schematic diagram of a circular moving path in which the detection area shown in FIG. 2 executes another serpentine moving path.
首先,請參閱圖1,揭露出一種前開式基板傳送盒(即FOUP)的盒體10,為了方便說明,於圖1中已標示有一X軸向、一Y軸向及一Z軸向,所述軸向,依三維的直角座標系可知應包含各該X、Y或Z軸在正、負象限所指引的方向。該盒體具有可供一前蓋(圖未示)蓋合的一開口11,且該盒體10內還具有連通該開口11的一容置艙12,該容置艙12能提供多個基板20(或稱載板)沿著Y軸向自該開口11植入並以層列方式容置於該容置艙12內,使得一個傳送盒能容置並載運多個所述基板20進行必要的製程加工。
First, please refer to FIG. 1, which discloses a
進一步的,請合併參閱圖1至圖3,由圖1可知該盒體10之容置艙12四周的內壁形成有多個內肋13,用以建構出沿著Y軸向延伸並且沿著Z軸向間隔分佈的多個層列形式的插槽21(slot)。圖2及圖3分別揭露圖1所示各層插槽21中分佈的邊肋13a和懸狀支撐肋13b的態樣;進一步的說,各層所述插槽21,分別由沿著Y軸向延伸並且沿著X軸向相對凸伸的雙側邊肋13a,以及坐落於雙側所述邊肋13a之間並且沿著Y軸向凸伸的一懸狀支撐肋13b間隔形成。依此,各該邊肋13a和各該懸狀支撐肋13b皆能呈歧狀式的凸伸至容置艙12內,進而構築成該盒體10內的多個所述內肋13;其中,由圖2及圖3能更清楚的見悉各層插槽21中的所述邊肋13a和懸狀支撐肋13b彼此間隔分佈並且相互對應,使得各該基板20能容置於各該插槽21內,
憑藉雙側所述邊肋13a支撐基板20的雙側端邊,並且憑藉該懸狀支撐肋13b支撐基板20的底面中央,可避免當圖1所示的多個基板20分別容置於各該插槽21內時發生塌陷或相互干涉的現象。
Further, please refer to FIG. 1 to FIG. 3 together. It can be seen from FIG. 1 that a plurality of
接著,續參閱圖2及圖3可知,分佈各層插槽21中的邊肋13a和懸狀支撐肋13b,共同在X-Y軸向所建構的平面中分散陳列(如圖2所示),本新型乃依該X-Y軸向的平面定義出一檢測面域Q,且該檢測面域Q基於所述邊肋13a和懸狀支撐肋13b本身的厚度(或稱高度)而容許在Z軸向存在一投光位差δ(如圖3所示)。
Then, referring to Fig. 2 and Fig. 3, it can be seen that the
復圖2及圖3所示,還揭露在更進一步的實施中,可各該邊肋13a可沿所述Z軸向凸伸形成有至少一丘部13a’,此外,各該懸狀支撐肋13b亦能沿所述Z軸向形成弧凸部13b’,用以減少所述內肋在支撐基板時的接觸面積。
As shown in Figure 2 and Figure 3, it is also disclosed that in a further implementation, each of the
除此之外,上述盒體10內的所述邊肋13a和懸狀支撐肋13b,亦可依客製化的需求,而套用如TWI762273專利中所示物料盒之盒體內所稱的肋片(雷同上述邊肋13a)和支撐桿(雷同上述懸狀支撐肋13b)的態樣;其中特別的是,TWI762273專利中所稱的肋片(雷同上述邊肋13a)是製成沿著所述Y軸向間隔分佈的形態,再者,TWI762273專利中所稱的肋片(雷同上述邊肋13a)亦能以肋骨形態呈現,亦或將上述丘部13a’形成於所述肋片、邊肋或肋骨上,皆屬可接受本新型後述瑕疵檢測之盒體10的內肋態樣。
In addition, the
本新型乃針對上述盒體10的內肋13提供出一種瑕疵檢測裝置,用於檢測所述邊肋13a和所述懸狀支撐肋13b的既定位置(或稱準位)是否正確;因此該盒體10的內肋13即視為是本新型用以檢測的物件。
This new model provides a defect detection device for the
接著,請參閱圖4,揭露出本新型的瑕疵檢測裝置能以一機檯30的形式呈現,並且在該機檯30上配置有一懸持臂40,利用該懸持臂40來佈建多個感測元件50,且該機檯30內已知可配置一控制單元(圖未示),用以控制機檯上之所述懸持臂40及感測元件50的操作過程。
Next, please refer to FIG. 4 , which discloses that the defect detection device of the present invention can be presented in the form of a
此外,該機檯30上還可規劃出沿所述X-Y軸向佈建而能提供盒體10置放的一檯面31,該檯面31上分散設置有多個能嵌置盒體10的定位
柱32;依此,請搭配圖5所示,揭露待檢之盒體10可經由機械手臂、運輸設備或人工將其置放該檯面31上,該盒體10底部已開設有多個定位孔(圖未示)提供所述定位柱32對應嵌制,而使該盒體10能穩定的擺放於該檯面31上止動,其中當盒體10置放時,其開口11必須沿著所述Y軸向而朝向懸持臂40的配置位置開放,使該懸持臂40於施作時能由開口11植入盒體10的容置艙12內。
In addition, the machine table 30 can also be planned to be arranged along the X-Y axis to provide a table 31 for placing the
復如圖4及圖5所示,該懸持臂40能以H字形態而在X-Y軸向的平面呈現,使該懸持臂40具有沿所述X軸向相互間隔的兩臂部41、42,以及連接於兩臂部中間的支撐部43,該檢測面域Q佈建於該支撐部43及兩所述臂部41、42框圍的區域中,且該檢測面域Q在該懸持臂40上能呈現出被懸持的形態。此外,該機檯30配置有一雙軸驅動器60,使該懸持臂40能配置於該雙軸驅動器60上。該雙軸驅動器60包含有沿X軸向固置於該機檯30上的一對滑軌61,傳動連結於該對滑軌61上執行所述Y軸向移動的一滑檯62,以及傳動連結於該滑檯62上執行所述Z軸向移動的一滑座63;該懸持臂40的一端能沿所述Y軸向架置於該雙軸驅動器60的滑座63上,且懸持臂40的另一端能沿所述Y軸向懸持於該機檯30上方的空間中;依此配置,該懸持臂40能憑藉該滑檯62執行所述Y軸向的移動,並且能憑藉該滑座63而執行所述Z軸向的移動,以便懸持臂40能憑藉雙軸驅動器60的驅動,而植入盒體10內並且沿Y-Z軸向執行雙軸向移動,用以帶動該檢測面域Q逐層執行所述Y軸向的一測距移動以及逐層執行所述Z軸向的一換層式移動(容後詳述)。在本實施中,該雙軸驅動器60的滑軌61和滑檯62之間在Y軸向的傳動連結,或/及該滑檯62和滑座63之間在Z軸向的傳動連結,可憑藉一般的伺服馬達提供動力並且搭載Z軸向、或Y及Z軸向的光學尺而在傳動及檢知移動距離上取得較高的絕對精度;此外,該雙軸驅動器60雖未揭露可帶動該懸持臂40執行X軸向的第三軸向移動,但在X軸向附加實施單向的移動或雙向的往復移動,同屬本新型所思及而可簡易變換應用之技術範疇,並予陳明。
As shown in Figures 4 and 5, the
再者,由圖4所示實施中,多個所述感測元件50可沿X-Y軸向間隔地安裝於該懸持臂40的兩所述臂部41、42上;換個方式說,所述懸持式的檢測面域Q中還佈建有多個分佈於X-Y軸向的所述感測元件50。多個所述感測元件50包含沿所述X軸向間隔配置的一對邊肋測距元件51及一對支撐肋照射元件52。其中:請先參閱圖11,可知圖1所示的各層插槽21於所述X軸向區分形成有坐落於各該懸狀支撐肋13b雙側的二槽部21a、21b,各該對邊肋測距元件51及各該支撐肋照射元件52相互間隔地配置於各該臂部41、42上,用以植入各該槽部21a、21b內執行所述測距移動。
Furthermore, in the implementation shown in FIG. 4, a plurality of
如圖6所示,各該邊肋測距元件51在本實施中是以能夠投照雷射光線至物件並且接收該雷射經物件反射後的光線而偵測取得該物件距離的感測器為例,說明圖4中分設於該懸持臂40雙側而相互對外進行量測的雙側邊肋測距元件51,能在所述X軸向對各該邊肋13a投照及接收雷射的測距光線,用以檢知各該邊肋13a的準位;其中,由於該檢測面域Q容許在Z軸向存在圖3所示的投光位差δ,使得各該邊肋測距元件51能夠在該投光位差δ中投照及接收測距光線,換言之,各該邊肋測距元件51投照的測距光線能在Z軸向函蓋各層插槽21雙側的各該邊肋13a、各該丘部13a’的實際高度(或稱厚度)的位置,以便於檢知各層插槽21雙側的各該邊肋13a、各該丘部13a’至少其中之一的實際距離,並由所述控制單元計算及比對各該邊肋13a、各該丘部13a’的準位是否歪斜或變形,進而確知各層插槽21雙側的各該邊肋13a之間或/及各該丘部13a’之間,是否坐落在同一平面(即共面)。
As shown in FIG. 6 , each rib
更進一步的,請參照圖6及圖7所示,揭露各該邊肋測距元件51的相鄰側,還可在所述X軸向搭載能反射所述X軸向的測距光線成為所述Z軸向的測距光線的一三稜鏡53,並使該三稜鏡53沿著所述Z軸向而坐落於各該邊肋13a或各該丘部13a’的上方,該三稜鏡53具有一斜向鏡面的特徵,使該三稜鏡53的斜向鏡面能以例如是90度的反射角,將該邊肋測距元件51投照的雷射光線(以虛線箭頭表示)朝向Z軸向反射,以便於投照至各該丘部13a’,確知各層插槽21中沿著Y軸向間隔分佈的各該丘部13a’位在Z軸向的
高度是否一致,以判斷其是否有歪斜或變形;同理,各該邊肋測距元件51和該三稜鏡53的組合,亦可分點投照各層插槽21中的各該邊肋13a在Z軸向的高度是否一致,以判斷否有歪斜或變形(即檢知其準位是否達標),併予說明。
Furthermore, please refer to Fig. 6 and Fig. 7, the adjacent side of each side
另如圖8所示,揭露出該對支撐肋照射元件52在本實施中是以能夠在所述X軸向相互對物件投射出一對照式光線(即雷射光線)進而檢知該物件真實位置的感測器為例,說明各層插槽21中的懸狀支撐肋13b能接受該對照式光線的投照而檢知其是否歪斜或變形(即檢知其準位是否達標)。再者,該對支撐肋照射元件52投照的所述對照式光線可在Z軸向保有投光位差δ,因此能投照所述對照式光線的範圍包含各層插槽21中的懸狀支撐肋13b、弧凸部13b’的至少其中之一的實際高度(或稱厚度)的位置是否歪斜或變形(即檢知其準位是否達標)。
Also as shown in FIG. 8 , it is disclosed that the pair of supporting
此外,由圖6所示可知悉多個所述感測元件50還可包含沿X軸向配置的一對端壁測距元件54,該對端壁測距元件54同樣可為能夠投照雷射光而偵測物件距離的感測器,用以檢知如圖9所示各該邊肋13a之端側的端壁13a”的實際距離,或者該容置艙12之雙側內壁的實際距離,進而確知各該邊肋13a的端壁13a”或是容置艙12的雙側內壁是否歪斜或變形(即檢知其準位是否達標)。
In addition, as shown in FIG. 6, it can be seen that the plurality of
該控制單元內建有該盒體10之多個所述內肋13的一輪廓標準值,並且電連接於該雙軸驅動器60和多個所述感測元件50之間,使得該控制單元能下達所述驅動指令,用以驅動該雙軸驅動器60而帶動該懸持臂40植入於各層所述插槽21內,該檢測面域Q上的多個所述感測元件50能同步地沿著該Y軸向逐層執行所述測距移動,所述測距移動能以多個定點的步進移動方式或持續移動方式進行,用以檢知所述邊肋13a、所述丘部13a’、所述端壁13a”、所述懸狀支撐肋13b、所述弧凸部13b’位在Y軸向的多個準位;而且,該檢測面域Q上的多個所述感測元件50還能同步地沿著該Z軸向逐層執行所述換層式移動,用以接序於多次的測距移動之間,進而檢知各層位之內肋13的多個所述準位,該控制單元並比對各該準位和該輪廓標準
值而取得一瑕疵檢測結果。其中,該輪廓標準值包含多個所述邊肋13a、所述丘部13a’、所述端壁13a”、所述懸狀支撐肋13b、所述弧凸部13b’各自坐落在X軸向、Y軸向及Z軸向的標準位置,多個所述感測元件50;再者,在該測距移動及該換層式移動的過程中,多個所述感測元件排除接觸多個所述內肋。
The control unit is built with a profile standard value of the plurality of
另外,該控制單元可經由該對邊肋測距元件51檢知各層所述插槽21中之雙側邊肋13a的準位以及經由該對支撐肋照射元件52檢知各該中置的懸狀支撐肋13b的準位,進而和該輪廓標準值相互比對,以便得知雙側邊肋13a和中置懸狀支撐肋13b之間的準位。
In addition, the control unit can detect the position of the
本新型還提供一種前開式基板傳送盒的內肋瑕疵檢測方法,用於更具體的揭露檢測上述盒體10的內肋13的細節。請參閱圖10所示,揭露該瑕疵檢測方法的程序方塊圖,包括依序執行下列步驟S1至步驟S4:
The present invention also provides a method for detecting inner rib defects of a front-opening substrate transfer box, which is used to more specifically disclose and detect the details of the
步驟S1:建構盒體內肋的輪廓標準值 Step S1: Construct the standard value of the outline of the rib in the box
本步驟以圖1所示的盒體10結構的態樣為例,必須事先將該盒體10的標準輪廓內建於該控制單元內,所述標準輪廓是指由多個所述內肋13建構而成之多層式插槽21的多個所述邊肋13a和多個所述懸狀支撐肋13b分佈於容置艙12內的輪廓特徵。其中,當容置艙12的端壁13a”、各該邊肋13a存在有丘部13a’、各該懸狀支撐肋13b存在有弧凸部13b’的至少其中之一,有必要被選定作為瑕疵檢測的部位,該輪廓標準值亦當包含所述端壁13a”、丘部13a’、弧凸部13b’的至少其中之一的輪廓特徵。進言之,可由盒體設計端提供或自行量測取得多個所述內肋13坐落在X軸向、Y軸向及Z軸向之標準座標的電腦數位圖像或數值作為該內肋13的輪廓標準值,並且內建於該控制單元內。或者,由盒體設計端提供一通過三維軸向量測及校準過的盒體標準治具,先執行下述步驟S2至步驟S3,以事先建構出該盒體標準治具之內肋13坐落在X軸向、Y軸向及Z軸向之標準座標的電腦數位圖像或數值作為內肋13的輪廓標準值,並且內建於該控制單元內。
This step takes the structure of the
請續參閱圖11,說明本新型還能於該控制單元內針對該盒體內肋的輪廓標準值預設出多個待以檢測的標點A、B、C、D、E、F,圖11
中揭示在X-Y平面陳列的多個所述丘部13a’上設立所述標點A、B、C、D、E、F;其中,標點A、B位在X軸向共線,標點C、D位在X軸向共線,標點E、F位在X軸向共線,標點A、C、E位在Y軸向共線,且標點B、D、F位在Y軸向共線。依此,所述標點A、B、C、D、E、F能作為所述檢測面域Q在執行所述Y軸向的測距移動時,多個感測元件50(容後詳述)能確知啟動檢測的靶點。上述標點的預設位置並不以此為限,換言之,舉凡各該端壁13a”、各該邊肋13a、各該丘部13a’、各該懸狀支撐肋13b、各該弧凸部13b’皆可作為本新型設立所述標點的位置。
Please continue to refer to Figure 11, illustrating that the present invention can also preset a plurality of punctuation points A, B, C, D, E, and F to be detected for the contour standard value of the rib in the box in the control unit, Figure 11
discloses that the punctuation points A, B, C, D, E, and F are set up on a plurality of
此外,該控制單元還可依客製化需求,而預先設定出容許被檢測之多個所述內肋13在X軸向、Y軸向及Z軸向偏離該輪廓標準值的一特定誤差範圍的圖像或數值,且該特定誤差範圍的圖像或數值能以上述標點A、B、C、D、E、F的位置作為座標上的參考點。當控制單元檢知任一個所述標點(例如是標點B)的偏離量(或稱變形量)落入於該誤差範圍之內時,判定該盒體10的多個所述內肋13皆不存在有歪斜或變形的瑕疵時,即將該盒體10列為良品;當控制單元檢知任一個所述標點(例如是標點B)的偏離量不落入該誤差範圍之外時,判定該盒體10的多個所述內肋13中存在有至少一處內肋存在有歪斜或變形之瑕疵,而將該盒體10列為瑕疵品。
In addition, the control unit can also pre-set a specific error range that allows the plurality of
步驟S2:佈建懸持式的檢測面域 Step S2: Deploy the suspended detection area
本步驟可使用圖4及圖5中揭露的多個所述感測元件50來佈建出圖2及圖3所示的檢測面域Q,多個所述感測元件50可選用例如是雷射、紅外光或其它能釋放光線並且接收或辨知所述光線有或無被物件遮蔽、或物件距離的光感測器;由前述瑕疵檢測裝置的實施細節中可知,多個所述感測元件50特別包含該對邊肋測距元件51及該對支撐肋照射元件52,驅使多個所述感測元件50能以相互間隔分佈的形式佈建形成該檢測面域Q,且該檢測面域Q是經由該懸持臂40而呈現出懸持於空間中的態樣。
In this step,
步驟S3:驅動檢測面域檢知內肋的準位 Step S3: Drive the detection area to detect the level of the inner rib
本步驟可使用圖4及圖5中揭露的雙軸驅動器60,並且通過已經內建有該輪廓標準值的所述控制單元下達驅動指令至該雙軸驅動器60,
用以帶動該懸持臂40植入該盒體10的容置艙12內,令該檢測面域Q在該容置艙12內沿Y-Z軸向執行雙軸向移動,所述雙軸向移動特別包含前述的逐層執行所述Y軸向的測距移動以及逐層執行所述Z軸向的換層式移動,用以執行如圖6至圖9所示的檢知多個所述內肋13上各標點的所述測距移動和所述換層式移動,以及投照並接收所述測距光線光線和投照所述對照式光線的工序,以便能取得多個所述內肋13的準位。
In this step, the dual-
進一步的,以圖11揭示的所述標點A、B、C、D、E、F為例,說明圖6及圖7中所示搭載有三稜鏡53的該對邊肋測距元件51,在沿著Y軸向執行測距移動時,能依序同步地檢知多個所述丘部13a’位在標點A、B,標點C、D及標點E、F的準位,或/及依序同步地檢知多個所述丘部13a’位在標點E、F,標點C、D及標點A、B的準位,其中所述測距移動包含是以所述標點A、B、C、D、E、F作為定點進行投照及接收光線的步進移動方式,或者以所述標點A、B、C、D、E、F作為動態掃瞄的投照及接收光線的靶點(即所述持續移動方式);除此之外,所述測距移動亦可忽略所述標點的存在,而直接依據所內肋13的輪廓標準值逐層進行持續移動的動態投光掃描,以便於逐層取得多個所述丘部13a’的準位。所述測距移動是以持續移動的方式進行時,可區分出在檢測所述內肋13或其靶點時的移動速度相對較慢於在沒有檢測內肋13或其靶點時的測距移動速度,以便於能在確保檢測精度的情況下,提升測距移動的速率。
Further, taking the punctuation points A, B, C, D, E, and F disclosed in FIG. 11 as an example, the pair of side rib distance-measuring
另一方面,由圖11可知,二所述臂部41、42上除了各自配置有該邊肋測距元件51及該支撐肋照射元件52之外,還配置有該端壁測距元件54,以便於能和該邊肋測距元件51及該支撐肋照射元件52一起(即同步)植入各該槽部21a、21b內執行所述測距移動。
On the other hand, as can be seen from FIG. 11 , in addition to the side rib
在執行上述測距移動的過程中,不論所述標點是否存在或是否設立在各該邊肋13a或其丘部13a’上,由圖11可知圖6所示搭配有三稜鏡53的各該邊肋測距元件51,會跟隨檢測面域Q沿Y軸向步進或持續移動,進而同步檢知各該邊肋13a的準位;且,由圖11可知圖8所示的各該支撐肋照射元件52,會跟隨檢測面域Q沿Y軸向步進或持續移動,進而同步檢知各該
懸狀支撐肋13b、各該邊肋13a或/及各該弧凸部13b’的準位。同理,由圖11可知圖9所示的各該端壁測距元件54亦會跟隨檢測面域Q沿Y軸向步進或持續移動,進而同步檢知各該端壁13a”或容置艙12之雙側內壁的準位。此外,各該邊肋13a和各該懸狀支撐肋13b之間的準位,由該對邊肋測距元件51檢知各該邊肋13a的準位以及由該對支撐肋照射元件52檢知各該懸狀支撐肋13b的準位之後,經由所述控制單元依上述計算及相互比對方式各該邊肋13a和各該懸狀支撐肋13b之間的準位有或無落入該特定誤差範圍內,以判定各該邊肋13a和各該懸狀支撐肋13b之間的準位是否存在有歪斜或變形的瑕疵。
In the process of performing the above-mentioned ranging movement, no matter whether the punctuation exists or whether it is set up on each
在此一併說明的是,本新型之多個所述感測元件50之中,各該邊肋測距元件51和各該支撐肋照射元件52是不可缺少的必要構件,而各該三稜鏡53及各該端壁測距元件54是可依量測需求而附加搭載的元件。此外,以雷射、紅外光或其它能釋放光線並且接收或辨知所述光線有或無被物件遮蔽、或物件距離的光感測器所製成的各該邊肋測距元件51、各該支撐肋照射元件52及各該端壁測距元件54,在各自檢知所述內肋13的準位之後,能各自生成一類比或數位的準位信號並且傳遞至該控制單元內儲存,以便於接續後述步驟S4的比對工序。
It is also explained here that, among the plurality of
再者,當檢測面域Q上的各該邊肋測距元件51和各該支撐肋照射元件52,或各該邊肋測距元件51、各該支撐肋照射元件52及各該端壁測距元件54執行完一層測距移動後,圖4所示的雙軸驅動器60會驅動所述懸持臂40,使該檢測面域Q沿Z軸向朝上或下執行一層插槽21高度的,以便於接續進行另一層插槽21的測距移動(容後詳述)。
Furthermore, when each of the side
請續參閱圖12至圖14所示,依序揭露出檢測面域Q可實施的三種迴圈移動的路徑示意圖;其中:圖12揭露該盒體10內的多個所述邊肋13a分別是在所述Y軸向呈現間隔分佈(即非延伸分佈)的形態,使得每一單層之Y軸向上的多個邊肋13a之間,以及每一單層之Y軸向上最靠近容置艙12之底壁12a的邊肋13a和該底壁12a之間,分別間隔形成有一間隙空間T1。面對此種內肋的佈局,
可令該檢測面域Q在容置艙12內沿著Y-Z軸向的平面執行一種波形移動路徑L;所述波形移動路徑L是由沿Y軸向的所述測距移動L1串接沿Z軸向的所述換層式移動L2交互建構而成的迴圈移動路徑(圖12中虛線表示移動路徑,實心箭頭表示移動方向);其中,當檢測面域Q在沿Z軸向執行換層式移動L2時,該間隙空間T1可供各該單側的邊肋測距元件51、三稜鏡53沿Z軸向順利的移動通過,而不至於碰撞或接觸所述邊肋13a或底壁12a。
Please continue to refer to Fig. 12 to Fig. 14 , which sequentially reveal the schematic diagrams of three kinds of circular movements that can be implemented by the detection area Q; wherein: Fig. 12 discloses that the plurality of
圖13揭露該盒體10內的各個所述邊肋13a上間隔配置有多個丘部13a’,且各層雙側的邊肋13a是沿所述Y軸向呈現延伸分佈(即非間隔分佈)的形態,使得每一單層之Y軸向上的各個側單邊肋13a不存在間隙空間,且各個側單邊肋13a的末端和容置艙12的底壁12a之間也不存在間隙空間,或縱使有間隙空間但非常的小,不足以提供各該單側的邊肋測距元件51、三稜鏡53沿Z軸向順利移動通過。面對此種內肋的佈局,可令該檢測面域Q在容置艙12內沿著Y-Z軸向的平面執行另一種蛇形移動路徑M,所述蛇形移動路徑M是在各層插槽21的空間中往復(或稱來回)各執行一次沿Y軸向的所述測距移動M1之後串接所述換層式移動M2而交互建構成的迴圈移動路徑(圖13中虛線表示移動路徑,實心箭頭表示往前的順向移動方向,空心箭頭表示後退的復位移動方向),使得各該換層式移動M2能在容置艙12的開口11外執行。圖13所示沿Y軸向往復(或稱來回)各執行一次測距移動M1的過程,可視為該往復(或稱來回)測距移動M1是沿Y軸向的共線路徑執行的,而在容置艙12內不存在有所述Y軸向的換層式移動M2。依此,可避免各該單側的邊肋測距元件51、三稜鏡53在執行沿Z軸向順利的移動通過,而不至於碰撞或接觸所述邊肋13a或底壁12a。
Figure 13 discloses that a plurality of
圖14揭露該盒體10的內肋由多個分層列設的雙側丘部13a’構成(其中並不存在前述的邊肋13a),且各層單側的多個丘部13a’是在所述Y軸向呈現間隔分佈的形態,使得每一單層之Y軸向上的各個單側丘部13a’之間存在有間隙空間T2,可提供各該單側的邊肋測距元件51、三稜鏡53沿Z軸向順利移動通過。面對此種內肋的佈局,可令該檢測面域Q在容置艙12內沿著Y-Z軸向的平面執行另一種蛇形移動路徑N,所述蛇形移動路徑N是
在各層插槽21的空間中執行一次沿Y軸向的所述測距移動N1之後,續沿該Y軸向執行一回復移動N2,隨後串接在Z軸向執行所述換層式移動N3而交互建構成的迴圈移動路徑(圖14中虛線表示移動路徑,實心箭頭表示往前挺進的移動方向,空心箭頭表示後退的回復移動方向)。其中,各該回復移動N2包含當各層的所述測距移動N1至能檢知最接近容置艙之底壁12a位置的丘部13a’之後,隨即利用該間隙空間T2而沿Y軸向之共線路徑局部復位至相鄰的兩個丘部13a’之間,使得後續的所述換層式移動N3能於所述相鄰的兩個丘部13a’之間沿Z軸向執行;所述測距移動N1包含當在所述相鄰的兩個丘部13a’之間沿Z軸向執行完成所述換層式移動N3之後,接續沿Y軸向局部移動至最接近底壁12a的丘部13a’位置的過程;再者,各該復位移動N2還包含在各層中由最接近底壁12a的丘部13a’位置沿Y軸向復位移動至開口11外的過程,以利接續在開口11外執行的所述換層式移動N3。如此為之,可避免各該單側的邊肋測距元件51、三稜鏡53在容置艙12內能順利的執行沿Z軸向的所述換層式移動N3,而不至於碰撞或接觸所述丘部13a’或底壁12a。
Figure 14 discloses that the inner rib of the
上述中,相較於各該單側的邊肋測距元件51及三稜鏡53,圖11所示的各該端壁測距元件54在X-Z軸向的位置相對地更加遠離各該邊肋13a、各該丘部13a’及各該端壁13a”,因此當該檢測面域Q在執行上述波形移動路徑L或是執行上述兩種蛇形移動路徑M、N時,各該端壁測距元件54皆不會碰撞或接觸各該邊肋13a、各該丘部13a’及各該端壁13a”。同理,由於該對支撐肋照射元件52在X-Z軸向的位置是坐落於該懸狀支撐肋13b的雙側外圍,因此當該檢測面域Q在執行上述波形移動路徑L或是執行上述兩種蛇形移動路徑M、N時,該對支撐肋照射元件52亦不會碰撞或接觸各該懸狀支撐肋13b。
In the above, compared with the side rib
必須說明的是,圖13所示的蛇形移動路徑M以及圖14所示的蛇形移動路徑N,能分別實施於圖12所示的多個所述邊肋13a在Y軸向間隔分佈的盒體10檢測場合,同樣的能防止各該內肋13遭到碰撞或接觸。無論如何,圖12及圖13所示實施,僅說明檢測面域Q在執行所述迴圈移動路徑
過程不會碰撞或接觸各該內肋13的兩種可實施性;除此之外,起因於客製化需求而對各層邊肋13a位置作出前述以外的變化,自當會影響所述迴圈移動路徑的些微變動,本新型仍可由上述實施內容及精神而作出相應的移動路徑規劃,以防所述內肋13在瑕疵檢測過程遭遇碰撞或接觸。由此可知,本新型在執行驅動檢測面域Q檢知所述內肋13之準位的過程中,多個所述感測元件50確實能排除和多個所述內肋13相互碰撞或接觸,並且還能選擇最近或最佳路徑,進而提升檢測速率。
It must be noted that the serpentine moving path M shown in FIG. 13 and the serpentine moving path N shown in FIG. 14 can be respectively implemented in a plurality of
步驟S4:比對準位和輪廓標準值 Step S4: Compare alignment position and contour standard value
本步驟由已經內建有該輪廓標準值的所述控制單元執行,所述控制單元可選用一般周知的可程式邏輯控制器(PLC)、數值控制(NC)或/及微控制器(MCU)等編製而成一控制電路,使該控制單元內建包含有相互電性連接的一儲存體、一驅動控制器及一邏輯運算器。其中,該儲存體能儲存、轉換該輪廓標準值的電腦數位圖像或數值,並且還能儲存、轉換多個所述感測元件50所檢知的類比或數位的所述準位信號;該驅動控制器能依據該輪廓標準值的電腦數位圖像或數值,而下達所述驅動指令至該雙軸驅動器60,用以驅動所述懸持臂40上的檢測面域Q執行所述波形移動路徑L或所述兩種蛇形移動路徑M、N的迴圈移動;再者,本新型能由該邏輯運算器定義出該輪廓標準值的所述特定誤差範圍;所述特定誤差範圍能以各該內肋13位於X-Y-Z座標上的圖像或數值加入品管上容許的一正、負公差圖像或數值而定義形成,在定義過程中,能參考前述標點A、B、C、D、E、F的位置作為座標參考點並加入容許的正、負公差,或直接由容置艙12四周的內壁及多個所述內肋13的整體圖像的輪廓標準值定義所述特定誤差範圍;隨後,通過該邏輯運算器比對所述準位信號有無落入該特定誤差範圍之內,用以判定該盒體10的多個所述內肋13是否存在有歪斜或變形的瑕疵。其中,由多個所述感測元件50檢知的所述準位信號,是經由所述伺服馬達所搭載Z軸向、或Y及Z軸向的光學尺而取得準位信號的絕對值之後,才儲存於該儲存體內,用以提供該邏輯運算器比對;該邏輯運算器對於所
述準位信號和上述X-Y-Z座標上的圖像或數值的比對,為已知演算技術的簡單運用即可實現的技術範疇,故不加贅述。
This step is performed by the control unit that has built-in the standard value of the profile, and the control unit can be selected from a generally well-known programmable logic controller (PLC), numerical control (NC) or/and microcontroller (MCU) A control circuit is compiled such that the control unit is built-in to include a storage body, a drive controller and a logical arithmetic unit electrically connected to each other. Wherein, the storage body can store and convert the computer digital image or value of the contour standard value, and can also store and convert the analog or digital level signals detected by a plurality of
步驟S5:取得瑕疵檢測結果 Step S5: Obtain the defect detection result
如前所述,當控制單元檢知該盒體10內所述邊肋13a、所述丘部13a’、所述懸狀支撐肋13b、所述弧凸部13b’的至少其中之一的準位有落入該誤差範圍之內時,即判定該盒體10的內肋構造為良品,而可在產線繼續使用;當控制單元檢知該盒體10內所述邊肋13a、所述丘部13a’、所述懸狀支撐肋13b、所述弧凸部13b’的至少其中之一落入該誤差範圍之外時,即判定該盒體10的內肋構造為不良品,而應從產線剔除,以免於各層插槽21內容置基板時刮傷基板,或造成基板不易植入插槽內或不易自插槽內取出的問題。
As mentioned above, when the control unit detects the alignment of at least one of the
以上實施例僅為表達了本新型的較佳實施方式,但並不能因此而理解為對本新型專利範圍的限制。因此,本新型應以申請專利範圍中限定的請求項內容為準。 The above examples only express the preferred implementation modes of the present invention, but should not be understood as limiting the patent scope of the present invention. Therefore, the present invention shall be subject to the content of the claims defined in the scope of the patent application.
30:機檯 30:Machine
31:檯面 31: Mesa
32:定位柱 32: positioning column
40:懸持臂 40: Cantilever arm
41,42:臂部 41,42: arm
43:支撐部 43: support part
50:感測元件 50: Sensing element
51:邊肋測距元件 51: Rib ranging element
52:支撐肋照射元件 52:Support Rib Irradiation Element
60:雙軸驅動器 60: Dual shaft drive
61:滑軌 61: slide rail
62:滑檯 62: sliding table
63:滑座 63: sliding seat
Claims (16)
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TW112201390U TWM641115U (en) | 2023-02-17 | 2023-02-17 | Inner rib defect detection device for front-opening substrate transfer box |
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