TWI829533B - Internal rib defect detection device and method thereof of foup for substrate used - Google Patents
Internal rib defect detection device and method thereof of foup for substrate used Download PDFInfo
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Abstract
Description
本發明涉及容置基板用的前開式傳送盒,特別是針對該傳送盒之內肋的準位實施瑕疵檢測的技術,尤其是一種前開式基板傳送盒的內肋瑕疵檢測裝置及其方法。 The present invention relates to a front-opening transfer box for accommodating substrates, and in particular to a technology for detecting defects on the alignment of inner ribs of the transfer box. In particular, the invention relates to a device and method for detecting inner rib defects of a front-opening substrate transfer box.
前開式傳送盒(Front Opening Unified Pod,以下簡稱FOUP)是由一盒體的開口上結合可開啟及封閉該開口的一前蓋組成。所述FOUP可泛見於半導體製程中,用於容置及載運半導體晶元進行一系列的工序場合被應用,以確保半導體晶元的高精度製程良率;除此之外,所述FOUP也已經逐漸被推廣至用於容置及載運一般的基板(或稱載板),以確保基板的製程良率。所稱基板,可包含像是崁入式多晶片互連橋接(EMIB)用電路載板或使用ABF作為增層材料的電路載板等,這些高階電路載板的面域相對較傳統PCB大,且採用長方形的排版模式呈現,使得高階電路載板的硬度也相對較傳統PCB軟;當然,隨著需求端客製化的多樣性,所述基板也可包含大面域的PCB或其他板狀物件。 Front Opening Unified Pod (hereinafter referred to as FOUP) is composed of an opening of a box body combined with a front cover that can open and close the opening. The FOUP can be commonly seen in semiconductor manufacturing processes and is used to accommodate and carry semiconductor wafers for a series of processes to ensure the high-precision process yield of semiconductor wafers; in addition, the FOUP has also been It is gradually being promoted to accommodate and carry general substrates (or carrier boards) to ensure the process yield of the substrates. The so-called substrate can include circuit carrier boards such as embedded multi-chip interconnect bridges (EMIB) or circuit carrier boards using ABF as build-up materials. The area of these high-end circuit carrier boards is relatively larger than that of traditional PCBs. And it is presented in a rectangular layout mode, making the hardness of high-end circuit carrier boards relatively softer than traditional PCBs; of course, with the diversity of demand-side customization, the substrates can also include large-area PCBs or other plate shapes. object.
由於基板的面域相對較半導體晶元大,使得基板傳送盒與半導體晶元傳送盒之間存在盒體內肋構造上的差異;進一步的說,基板傳送盒的盒體內壁為了營造出多層式插槽(slot),必須於盒體內壁形成有多數個內肋,而組成所述內肋構造。所述內肋構造,除了包含該盒體的雙側內壁分層形成的邊肋之外,還包含由該盒體底壁中央分層凸伸形成的懸狀支撐肋,使雙側的邊肋能於各層插槽的雙底側充當容置基板時的導引肋,並且利用懸狀支撐肋穩定支撐於基板中央的底部;其中,雙側的邊肋和中置的懸狀支撐肋位在各層插槽中,是以相等層位高度的方式相互間隔對應的;然而,由於半導體晶元的面域並不大,因此在半導體晶元傳送盒內,並不 需要中置的所述懸狀支撐肋的存在;由此可知,基板傳送盒的盒體內肋構造相對較半導體晶元傳送盒的盒體內肋構造複雜。 Since the area of the substrate is relatively larger than that of the semiconductor wafer, there is a difference in the structure of the inner ribs between the substrate transfer box and the semiconductor wafer transfer box; furthermore, in order to create a multi-layer plug-in structure, the inner wall of the substrate transfer box Slots must be formed with a plurality of internal ribs on the inner wall of the box to form the internal rib structure. The inner rib structure, in addition to the side ribs formed in layers on both sides of the inner wall of the box, also includes a suspended support rib formed in layers on the center of the bottom wall of the box, so that the sides on both sides The ribs can act as guide ribs on the double bottom sides of each layer of slots when accommodating the substrate, and use suspended support ribs to stably support the bottom of the center of the substrate; among them, the side ribs on both sides and the central suspended support rib are In each layer of slots, they are spaced corresponding to each other with equal layer height; however, since the area of the semiconductor wafer is not large, there are no slots in the semiconductor wafer transfer box. The presence of the suspended supporting rib in the middle is required; from this, it can be seen that the inner rib structure of the box of the substrate transfer box is relatively more complicated than the inner rib structure of the semiconductor wafer transfer box.
另一方面,由於基板的製程與半導體晶元的製程中,通常都存在溫度和濕度等環境因素,因此當使用所述傳送盒載運基板或半導體晶元進行製程加工時,該盒體必然會遭受製程溫度和濕度的影響,特別是在耐久性地使用一段時間之後,該盒體內的所述邊肋和懸狀支撐肋較容易發生變形,其中特別是該懸狀支撐肋發生變形的機率相對較高;且知,一當所述邊肋或懸狀支撐肋發生變形後,勢必影響各層插槽的空間,而造成基板難以植入各層插槽,亦或基板卡持在插槽內而難以被取出的現象。因此,基板傳送盒在基板產線使用一段時間後,必須對盒體內的所述邊肋及懸狀支撐肋的準位,進行有或無偏位或變形的瑕疵檢測;惟,所述瑕疵檢測,截至目前,仍仰賴人工方式進行。 On the other hand, since environmental factors such as temperature and humidity usually exist in the substrate manufacturing process and the semiconductor wafer manufacturing process, when the transfer box is used to carry the substrate or semiconductor wafer for processing, the box will inevitably be subjected to Due to the influence of process temperature and humidity, especially after long-term use for a period of time, the side ribs and suspended support ribs in the box are more likely to deform, and the probability of deformation of the suspended support ribs is relatively high. High; and it is known that once the side ribs or suspended support ribs are deformed, the space of the slots on each layer will inevitably be affected, making it difficult for the substrate to be implanted into the slots on each layer, or the substrate will be stuck in the slot and difficult to be inserted. The phenomenon of taking out. Therefore, after the substrate transfer box has been used in the substrate production line for a period of time, the alignment of the side ribs and suspended support ribs in the box must be inspected for defects with or without deflection or deformation; however, the defect detection , up to now, still rely on manual methods.
有鑑於此,本發明旨在針對所述前開式基板傳送盒的盒體,特別是該盒體的多個內肋的總體構造,提供出一種利於自動化施行的瑕疵檢測技術。 In view of this, the present invention aims to provide a defect detection technology that is conducive to automated implementation of the box body of the front-opening substrate transfer box, especially the overall structure of the multiple inner ribs of the box body.
本發明一較佳實施例,在於提供一種前開式基板傳送盒的內肋瑕疵檢測裝置,用於檢測所述基板傳送盒的一盒體,該盒體具有一沿著一Y軸向開放的開口,且該盒體的所述開口內具有沿著一Y軸向延伸並且沿著一Z軸向間隔分佈的多個層列形式的插槽,多個所述插槽分別由該盒體內的多個內肋間隔形成,多個所述內肋包含沿著一X軸向相對凸伸的雙側邊肋和坐落於雙側所述邊肋之間並且沿著該Y軸向凸伸的一懸狀支撐肋;該瑕疵檢測裝置包括一懸持臂、多個感測元件及一控制單元;該懸持臂配置於一雙軸驅動器上,該雙軸驅動器能驅動該懸持臂執行該Y軸向及該Z軸向的雙向移動;多個所述感測元件沿該X軸向及Y軸向間隔佈建於該懸持臂上而形成該懸持臂上的一懸持式的檢測面域;該控制單元內建有多個所述內肋的一輪廓標準值,並且電連接於該雙軸驅動器和多個所述感測元件之間;該控制單元能驅動該雙軸驅動器而使該懸持臂植入於各層所述插槽內, 驅使該檢測面域上的多個所述感測元件能逐層檢知多個所述邊肋和該懸狀支撐肋各自的一準位,該控制單元並比對各該準位和該輪廓標準值而取得一瑕疵檢測結果;其中,該輪廓標準值包含各層所述插槽的多個邊肋和該懸狀支撐肋坐落在該X軸向、該Y軸向及該Z軸向的標準位置,該檢測面域沿該Y軸向逐層執行多個所述邊肋和至少一所述懸狀支撐肋的一測距移動,該檢測面域還沿該Z軸向逐層執行一換層式移動,其中在該測距移動及該換層式移動的過程中,多個所述感測元件排除接觸多個所述內肋,且所述準位包含多個所述邊肋的準位、該懸狀支撐肋的準位以及所述邊肋和該懸狀支撐肋之間的準位。 A preferred embodiment of the present invention is to provide an inner rib defect detection device of a front-opening substrate transfer box, which is used to detect a box body of the substrate transfer box. The box body has an opening opening along a Y-axis direction. , and the opening of the box body has a plurality of slots extending along a Y-axis and spaced apart along a Z-axis. The plurality of slots are respectively composed of multiple slots in the box. A plurality of internal ribs are formed at intervals, and the plurality of internal ribs include two side ribs protruding relatively along an X-axis direction and an overhang located between the two side side ribs and protruding along the Y-axis direction shaped support rib; the flaw detection device includes a suspension arm, a plurality of sensing elements and a control unit; the suspension arm is configured on a dual-axis driver, and the dual-axis driver can drive the suspension arm to execute the Y-axis Bidirectional movement in the Z-axis direction; a plurality of sensing elements are arranged on the suspension arm at intervals along the X-axis direction and the Y-axis direction to form a suspended detection surface on the suspension arm domain; the control unit is built with a contour standard value of a plurality of inner ribs, and is electrically connected between the dual-axis driver and the plurality of sensing elements; the control unit can drive the dual-axis driver to cause The suspension arm is implanted in the slot on each layer, The plurality of sensing elements on the detection area are driven to detect a level of each of the plurality of side ribs and the suspended support rib layer by layer, and the control unit compares each level with the contour standard. value to obtain a defect detection result; wherein, the profile standard value includes the standard positions of the plurality of side ribs of the slots in each layer and the suspended support ribs located in the X-axis, the Y-axis and the Z-axis. , the detection area performs a distance measurement movement of a plurality of side ribs and at least one suspended support rib layer by layer along the Y-axis direction, and the detection area also performs a layer change layer by layer along the Z-axis direction. type movement, wherein during the ranging movement and the layer-changing movement, a plurality of the sensing elements are excluded from contacting a plurality of the inner ribs, and the level includes the level of a plurality of the side ribs , the position of the suspended support rib and the position between the side rib and the suspended support rib.
在進一步實施中,該內肋瑕疵檢測裝置還包含配置該雙軸驅動器的一機檯,該機檯還設有提供該盒體擺放至固定的一檯面,且該控制單元係配置於該機檯上。其中,該雙軸驅動器包含有:沿所述Y軸向固置於該機檯上的一對滑軌,傳動連結於該對滑軌上執行所述Y軸向移動的一滑檯,以及傳動連結於該滑檯上執行所述Z軸向移動的一滑座,且該懸持臂沿所述Y軸向架置於該滑座進而配置於該雙軸驅動器上,用以帶動該懸持臂上的多個所述感測元件同步執行該測距移動及該換層式移動。 In further implementation, the inner rib defect detection device further includes a machine equipped with the dual-axis driver. The machine is also provided with a fixed surface for placing the box, and the control unit is configured on the machine. On stage. Wherein, the dual-axis driver includes: a pair of slide rails fixed on the machine table along the Y-axis direction, a slide table that is transmission-connected to the pair of slide rails to perform the Y-axis movement, and a transmission A slide is connected to the slide to perform the Z-axis movement, and the suspension arm is placed on the slide along the Y-axis and is then configured on the dual-axis driver to drive the suspension The plurality of sensing elements on the arm execute the ranging movement and the layer-changing movement synchronously.
在進一步實施中,多個所述感測元件包含沿所述X軸向間隔配置的一對邊肋測距元件及一對支撐肋照射元件。其中,該懸持臂具有沿所述X軸向相互間隔的二臂部,多個所述感測元件分散地佈建於二所述臂部上而形成該檢測面域;各層所述插槽於所述X軸向區分成坐落於各該懸狀支撐肋雙側的二槽部,各該邊肋測距元件和各該支撐肋照射元件間隔配置於各該臂部上,用以植入各該槽部內執行所述測距移動。依此,能更進一步地實施下述內容:所述測距移動為該檢測面域以沿著所述Y軸向持續移動方式或多個定點的步進移動方式,驅使該對邊肋測距元件能在所述X軸向對各該邊肋投照及接收一測距光線,用以檢知各該邊肋的準位。 In a further implementation, the plurality of sensing elements include a pair of edge rib distance measuring elements and a pair of support rib illumination elements spaced apart along the X-axis direction. Wherein, the suspension arm has two arm parts spaced apart from each other along the X-axis direction, and a plurality of the sensing elements are dispersedly arranged on the two arm parts to form the detection area; the slots at each layer The X-axis area is divided into two grooves located on both sides of each suspended support rib. Each side rib distance measuring element and each support rib irradiation element are spaced on each arm for implantation. The ranging movement is performed in each groove portion. Accordingly, the following content can be further implemented: the distance measurement movement is a continuous movement of the detection area along the Y-axis direction or a step movement of multiple fixed points, driving the pair of side ribs to measure distance. The element can project and receive a distance measuring light on each side rib in the X-axis direction to detect the position of each side rib.
各該邊肋沿所述Z軸向凸伸形成有至少一丘部,所述測距移動為該檢測面域以沿著所述Y軸向持續移動方式或多個定點的步進移動方 式,驅使該對邊肋測距元件能在所述X軸向投照及接收一測距光線,用以檢知各該邊肋、各該丘部的至少其中之一的準位。更進一步的,該對邊肋測距元件分別在所述X軸向搭載一三稜鏡,各該三稜鏡能反射各該對邊肋測距元件在所述X軸向投照及回收的測距光線成為所述Z軸向的測距光線,各該邊肋、各該丘部的至少其中之一接受所述Z軸向的測距光線的投照而檢知各自的所述準位。 Each side rib protrudes along the Z-axis direction to form at least one hill portion, and the distance measurement movement is a continuous movement of the detection area along the Y-axis direction or a step movement method of multiple fixed points. The formula drives the pair of side rib distance measuring elements to project and receive a distance measuring light in the X-axis direction to detect the position of at least one of the side ribs and the mounds. Furthermore, the pair of side rib distance-measuring elements are respectively equipped with a triangular lens in the X-axis direction, and each of the three ribs can reflect the light projected and recovered by the pair of side-rib distance-measuring elements in the X-axis direction. The ranging light becomes the Z-axis ranging light, and at least one of each of the ribs and the mounds is illuminated by the Z-axis ranging light to detect the respective levels. .
各該邊肋沿所述Y軸向延伸或間隔分佈形成,所述測距移動為該檢測面域以沿著所述Y軸向持續移動方式或多個定點的步進移動方式,驅使該對邊肋測距元件能在所述測距移動過程中朝著所述X軸向對各該邊肋投照及接收一測距光線,用以檢知各該邊肋的準位。 Each of the ribs extends along the Y-axis direction or is formed at intervals. The distance measurement movement is a continuous movement of the detection area along the Y-axis direction or a stepwise movement of multiple fixed points, driving the pair of The side rib distance measuring element can project and receive a distance measuring light toward each side rib in the X-axis direction during the distance measurement movement process, so as to detect the position of each side rib.
該對支撐肋照射元件能在所述X軸向相互投射一對照式光線,各該懸狀支撐肋接受該對照式光線的投照而檢知準位。 The pair of supporting rib irradiating elements can project a contrasting light to each other in the X-axis direction, and each suspended support rib receives the projection of the contrasting light to detect the level.
各該懸狀支撐肋沿所述Z軸向形成一弧凸部,該對支撐肋照射元件能在所述X軸向相互投射一對照式光線,用以檢知各該邊肋、各該丘部的至少其中之一的準位。 Each suspended support rib forms an arc convex portion along the Z-axis direction, and the pair of support rib irradiation elements can project a contrasting light beam to each other in the X-axis direction to detect each side rib and each hill. The level of at least one of the parts.
所述邊肋和該懸狀支撐肋之間的準位,由該對邊肋測距元件檢知各該邊肋的準位以及由該對支撐肋照射元件檢知各該支撐肋的準位之後,經由該控制單元相互比對得知。 The level between the side ribs and the suspended support rib is detected by the pair of side rib distance measuring elements and the level of each of the support ribs by the pair of support rib irradiation elements. Afterwards, the control unit compares each other and knows.
此外,在進一步實施中,各該邊肋的端側分別形成有一端壁,多個所述感測元件還包含沿所述X軸向配置用以檢知所述端壁的一對端壁測距元件,各該端壁測距元件配置於各該臂部上並且和各該邊肋測距元件,該檢測面域由該對邊肋測距元件、該對支撐肋照射元件及該對端壁測距元件相互間隔形成。 In addition, in a further implementation, an end wall is formed on the end side of each side rib, and the plurality of sensing elements further include a pair of end wall detectors arranged along the X-axis direction for detecting the end wall. distance element, each end wall distance measuring element is arranged on each arm and with each side rib distance measuring element, the detection area is composed of the pair of side rib distance measuring elements, the pair of support rib irradiation elements and the pair of end Wall ranging elements are formed spaced apart from each other.
在更進一步實施中,該檢測面域容許上述各該感測元件在所述Z軸向保有的一投光位差。 In a further implementation, the detection area allows a projection light position difference maintained by each of the above-mentioned sensing elements in the Z-axis direction.
在更進一步實施中,各層所述插槽於所述X軸向區分成坐落於各該懸狀支撐肋雙側的二槽部,各該端壁測距元件配置於各該臂部上, 而和各該邊肋測距元件及各該支撐肋照射元件相互間隔,用以植入各該槽部內執行所述測距移動。 In a further implementation, the slots of each layer are divided into two groove parts located on both sides of each suspended support rib in the X-axis direction, and each end wall distance measuring element is arranged on each arm part, The distance-measuring elements of each of the side ribs and the irradiating elements of each of the support ribs are spaced apart from each other, so as to be implanted in each of the grooves to perform the distance-measuring movement.
本發明另一較佳實施例,在於提供一種前開式基板傳送盒的內肋瑕疵檢測方法,能依據上述檢測裝置而具體實施,該內肋瑕疵檢測方法包括:建構該盒體之內肋輪廓的一輪廓標準值,並且使用多個感測元件間隔佈建出一懸持式的檢測面域,用以驅動該檢測面域植入於各層所述插槽內,令多個所述感測元件逐層檢知各該邊肋和各該懸狀支撐肋的一準位,並且比對各該準位和所述輪廓標準值而取得一瑕疵檢測結果;其中,該輪廓標準值包含各層插槽的多個所述邊肋和該懸狀支撐肋坐落在該X軸向、該Y軸向及該Z軸向的標準座標,多個所述感測元件沿該Y軸向分佈形成該檢測面域,該檢測面域沿該Y軸向逐層執行多個所述邊肋和至少一所述懸狀支撐肋的一測距移動,該檢測面域並沿該Z軸向逐層執行一換層式移動,其中在該測距移動及該換層式移動的過程中,多個所述感測元件排除接觸多個所述內肋,且多個所述準位包含逐層檢知多個所述邊肋的準位、該懸狀支撐肋的準位以及所述邊肋和該懸狀支撐肋之間的準位。 Another preferred embodiment of the present invention provides a method for detecting inner rib defects of a front-opening substrate transfer box, which can be implemented based on the above-mentioned detection device. The method for detecting inner rib defects includes: constructing the inner rib contour of the box body. a contour standard value, and use multiple sensing elements to be spaced apart to build a suspended detection area, which is used to drive the detection area to be implanted in the slots of each layer, so that the multiple sensing elements Detect a level of each side rib and each suspended support rib layer by layer, and compare each level with the profile standard value to obtain a defect detection result; wherein the profile standard value includes the slots of each layer The plurality of side ribs and the suspended support rib are located at the standard coordinates of the X-axis, the Y-axis and the Z-axis, and the plurality of sensing elements are distributed along the Y-axis to form the detection surface The detection area performs a distance measurement movement of a plurality of side ribs and at least one suspended support rib layer by layer along the Y-axis direction, and the detection area performs a distance measurement movement layer by layer along the Z-axis direction. A layer-by-layer movement, wherein during the ranging movement and the layer-changing movement, a plurality of the sensing elements are excluded from contacting a plurality of the inner ribs, and the plurality of levels include detecting a plurality of all the inner ribs layer by layer. The level of the side rib, the level of the suspended support rib, and the level between the side rib and the suspended support rib.
在進一步實施中,該內肋瑕疵檢測方法還包含能依該盒體之多個所述邊肋的佈局變化,而驅動該檢測面域選擇執行多種迴圈移動路徑,以利進行該盒體內之多個所述內肋的瑕疵檢測,所述多種迴圈移動路徑包含:一波形移動路徑及一蛇形移動路徑;其中,當多個所述邊肋沿該Y軸向間隔分佈時,該波形移動路徑是由該檢測面域的所述測距移動串接所述換層式移動而交互建構形成;另當多個所述邊肋沿該Y軸向延伸分佈時,該蛇形移動路徑是由該檢測面域執行一往復式的所述測距移動並串接所述換層式移動而交互建構成。 In further implementation, the inner rib defect detection method also includes driving the detection area to select and execute a variety of loop movement paths according to the layout changes of the plurality of side ribs of the box, so as to facilitate the inspection inside the box. For defect detection of multiple internal ribs, the multiple circular movement paths include: a waveform movement path and a serpentine movement path; wherein, when a plurality of the side ribs are spaced apart along the Y-axis, the waveform The movement path is formed by the ranging movement of the detection area in series with the layer-changing movement; in addition, when a plurality of the side ribs are extended and distributed along the Y-axis, the serpentine movement path is The detection area performs a reciprocating ranging movement and is connected in series with the layer-changing movement to interactively construct the detection area.
依據上述內容,本發明能應用於使用前開式基板傳送盒載運及傳送基板進行加工的自動化產線上,針對該盒體的多個所述內肋進行自動化的內肋瑕疵檢測,以利於檢知已經存在有偏位或變形之內肋的盒體,避免基板難以植入各層插槽,亦或基板卡持在插槽內而難以被取出的問題發生。 Based on the above, the present invention can be applied to automated production lines that use front-opening substrate transfer boxes to carry and transfer substrates for processing, and perform automated internal rib defect detection on multiple internal ribs of the box to facilitate detection of defects that have been The existence of a box body with internal ribs that is offset or deformed avoids the problem that the substrate is difficult to implant into the slots on each layer, or the substrate is stuck in the slot and is difficult to take out.
此外,本發明提供的懸持式檢測面域,以及該檢測面域能執行的多種迴圈移動路徑,乃有助於適應前開式基板傳送盒之盒體的複雜性內肋構造,避免該檢測面域在移動檢測過程中碰撞或接觸多個所述內肋或容置艙四周的內壁,並有提升檢測速率的效用。 In addition, the suspended detection area provided by the present invention and the various loop movement paths that the detection area can perform are helpful to adapt to the complex inner rib structure of the box body of the front-opening substrate transfer box and avoid the detection The area collides or contacts multiple inner ribs or inner walls around the accommodation cabin during the movement detection process, and has the effect of increasing the detection speed.
為此,相關本發明實施上的詳實內容,將搭配圖式進一步說明於下。 To this end, the details related to the implementation of the present invention will be further described below with accompanying drawings.
10:盒體 10:Box body
11:開口 11: Open your mouth
12:容置腔 12: Accommodation cavity
13:內肋 13: Inner ribs
13a:邊肋 13a:Rib
13a’:丘部 13a’: Hillside
13a”:端壁 13a”: End wall
13b:懸狀支撐肋 13b:Suspended support rib
13b’:弧凸部 13b’: Arc convex part
20:基板 20:Substrate
21:插槽 21:Slot
21a,21b:槽部 21a,21b: Groove
30:機檯 30:Machine
31:檯面 31: Countertop
32:定位柱 32: Positioning column
40:懸持臂 40:Suspended arm
41,42:臂部 41,42:Arm
43:支撐部 43:Support part
50:感測元件 50: Sensing element
51:邊肋測距元件 51: Side rib distance measuring element
52:支撐肋照射元件 52: Support rib irradiation element
53:三稜鏡 53:三稜鏡
54:端壁測距元件 54: End wall distance measuring element
60:雙軸驅動器 60: Dual axis drive
61:滑軌 61:Slide rail
62:滑檯 62:Slide
63:滑座 63:Sliding seat
A,B,C,D,E,F:標點 A,B,C,D,E,F: punctuation
L:波形移動路徑 L: waveform movement path
L1:測距移動 L1: ranging movement
L2:換層式移動 L2: Level-changing movement
M,N:蛇形移動路徑 M,N: Snake moving path
M1,N1:測距移動 M1, N1: ranging movement
M2,N2:換層式移動 M2, N2: Level-changing movement
N2:復位移動 N2: Reset movement
Q:檢測面域 Q: Detection area
T1,T2:間隙空間 T1, T2: gap space
S1至S4:步驟 S1 to S4: Steps
T1,T2:間隙空間 T1, T2: gap space
δ:投光位差 δ : illumination position difference
圖1是本發明待檢測之前開式基板傳送盒的盒體的立體示意圖,說明該盒內形有建構多層式插槽用的內肋,用以容置基板。 Figure 1 is a schematic three-dimensional view of the box body of an open substrate transfer box before inspection according to the present invention. It illustrates that the box has inner ribs for constructing multi-layer slots to accommodate substrates.
圖2是圖1所示內肋的俯視示意圖,說明所述內肋在Y軸向建構出一檢測面域。 FIG. 2 is a schematic top view of the inner rib shown in FIG. 1 , illustrating that the inner rib constructs a detection area in the Y-axis direction.
圖3是圖2所示內肋的前視示意圖,說明該檢測面域容許在Z軸向生成一投光位差。 Figure 3 is a schematic front view of the inner rib shown in Figure 2, illustrating that the detection area allows a projection light position difference to be generated in the Z-axis direction.
圖4是本發明瑕疵檢測裝置的立體配置示意圖。 Figure 4 is a schematic three-dimensional configuration diagram of the defect detection device of the present invention.
圖5是圖4的前視示意圖,說明該前開式基板傳送盒的盒體能置放於該瑕疵檢測裝置中進行內肋的瑕疵檢測。 FIG. 5 is a schematic front view of FIG. 4 , illustrating that the box body of the front-opening substrate transfer box can be placed in the defect detection device to detect defects in inner ribs.
圖6是圖4所示邊肋測距元件搭載三稜鏡檢測丘部或邊肋之準位的立體放大示意圖。 FIG. 6 is a three-dimensional enlarged schematic diagram of the edge rib distance measuring element shown in FIG. 4 equipped with a three-dimensional sensor to detect the level of the mound or edge rib.
圖7是圖4所示邊肋測距元件搭載三稜鏡檢測丘部或邊肋之準位的平面放大示意圖。 FIG. 7 is an enlarged plan view of the edge rib distance measuring element shown in FIG. 4 equipped with a three-dimensional detector to detect the level of the mound or edge rib.
圖8是圖4所示支撐肋照射元件檢測懸狀支撐肋之準位的平面放大示意圖。 FIG. 8 is an enlarged plan view of the support rib irradiation element shown in FIG. 4 for detecting the level of the suspended support rib.
圖9是圖4所示邊肋測距元件檢測邊肋之準位的平面放大示意圖。 FIG. 9 is an enlarged plan view of the edge rib distance measuring element shown in FIG. 4 for detecting the level of the edge ribs.
圖10是本發明瑕疵檢測方法的程序方塊圖。 Figure 10 is a program block diagram of the defect detection method of the present invention.
圖11是圖2的解說示意圖,說明本發明能針對所述內肋預設出多個待以檢測的標點。 FIG. 11 is an explanatory diagram of FIG. 2 , illustrating that the present invention can preset multiple marking points to be detected for the inner rib.
圖12是圖2所示檢測面域執行一波形移動路徑的迴圈移動路徑示意圖。 FIG. 12 is a schematic diagram of a circular movement path in which the detection area shown in FIG. 2 executes a waveform movement path.
圖13是圖2所示檢測面域執行一蛇形移動路徑的迴圈移動路徑示意圖。 FIG. 13 is a schematic diagram of a circular movement path in which the detection area shown in FIG. 2 executes a serpentine movement path.
圖14是圖2所示檢測面域執行另一蛇形移動路徑的迴圈移動路徑示意圖。 FIG. 14 is a schematic diagram of the circular movement path of the detection area shown in FIG. 2 executing another serpentine movement path.
首先,請參閱圖1,揭露出一種前開式基板傳送盒(即FOUP)的盒體10,為了方便說明,於圖1中已標示有一X軸向、一Y軸向及一Z軸向,所述軸向,依三維的直角座標系可知應包含各該X、Y或Z軸在正、負象限所指引的方向。該盒體具有可供一前蓋(圖未示)蓋合的一開口11,且該盒體10內還具有連通該開口11的一容置艙12,該容置艙12能提供多個基板20(或稱載板)沿著Y軸向自該開口11植入並以層列方式容置於該容置艙12內,使得一個傳送盒能容置並載運多個所述基板20進行必要的製程加工。
First, please refer to Figure 1, which discloses a
進一步的,請合併參閱圖1至圖3,由圖1可知該盒體10之容置艙12四周的內壁形成有多個內肋13,用以建構出沿著Y軸向延伸並且沿著Z軸向間隔分佈的多個層列形式的插槽21(slot)。圖2及圖3分別揭露圖1所示各層插槽21中分佈的邊肋13a和懸狀支撐肋13b的態樣;進一步的說,各層所述插槽21,分別由沿著Y軸向延伸並且沿著X軸向相對凸伸的雙側邊肋13a,以及坐落於雙側所述邊肋13a之間並且沿著Y軸向凸伸的一懸狀支撐肋13b間隔形成。依此,各該邊肋13a和各該懸狀支撐肋13b皆能呈歧狀式的凸伸至容置腔12內,進而構築成該盒體10內的多個所述內肋13;其中,由圖2及圖3能更清楚的見悉各層插槽21中的所述邊肋13和懸狀支撐肋13b彼此間隔分佈並且相互對應,使得各該基板20能容置於各該插槽21內,憑藉雙側所述邊肋13a支撐基板20的雙側端邊,並且憑藉該懸狀支撐肋13b支撐基板20的底面中央,可避免當圖1所示的多個基板20分別容置於各該插槽21內時發生塌陷或相互干涉的現象。
Further, please refer to FIGS. 1 to 3 together. It can be seen from FIG. 1 that a plurality of
接著,續參閱圖2及圖3可知,分佈各層插槽21中的邊肋13a和懸狀支撐肋13b,共同在X-Y軸向所建構的平面中分散陳列(如圖2所示),本發明乃依該X-Y軸向的平面定義出一檢測面域Q,且該檢測面域Q基於所
述邊肋13a和懸狀支撐肋13b本身的厚度(或稱高度)而容許在Z軸向存在一投光位差δ(如圖3所示)。
Next, with continued reference to Figures 2 and 3, it can be seen that the
復圖2及圖3所示,還揭露在更進一步的實施中,可各該邊肋13a可沿所述Z軸向凸伸形成有至少一丘部13a’,此外,各該懸狀支撐肋13b亦能沿所述Z軸向形成弧凸部13b’,用以減少所述內肋在支撐基板時的接觸面積。
As shown in Figures 2 and 3, it is also disclosed that in a further implementation, each of the
除此之外,上述盒體10內的所述邊肋13a和懸狀支撐肋13b,亦可依客製化的需求,而套用如TWI762273專利中所示物料盒之盒體內所稱的肋片(雷同上述邊肋13a)和支撐桿(雷同上述懸狀支撐肋13b)的態樣;其中特別的是,TWI762273專利中所稱的肋片(雷同上述邊肋13a)是製成沿著所述Y軸向間隔分佈的形態,再者,TWI762273專利中所稱的肋片(雷同上述邊肋13a)亦能以肋骨形態呈現,亦或將上述丘部13a’形成於所述肋片、邊肋或肋骨上,皆屬可接受本發明後述瑕疵檢測之盒體10的內肋態樣。
In addition, the
本發明乃針對上述盒體10的內肋13提供出一種瑕疵檢測裝置,用於檢測所述邊肋13a和所述懸狀支撐肋13b的既定位置(或稱準位)是否正確;因此該盒體10的內肋13即視為是本發明用以檢測的物件。
The present invention provides a defect detection device for the
接著,請參閱圖4,揭露出本發明的瑕疵檢測裝置能以一機檯30的形式呈現,並且在該機檯30上配置有一懸持臂40,利用該懸持臂40來佈建多個感測元件50,且該機檯30內已知可配置一控制單元(圖未示),用以控制機檯上之所述懸持臂40及感測元件50的操作過程。
Next, please refer to Figure 4, which reveals that the defect detection device of the present invention can be presented in the form of a
此外,該機檯30上還可規劃出沿所述X-Y軸向佈建而能提供盒體10置放的一檯面31,該檯面31上分散設置有多個能嵌置盒體10的定位柱32;依此,請搭配圖5所示,揭露待檢之盒體10可經由機械手臂、運輸設備或人工將其置放該檯面31上,該盒體10底部已開設有多個定位孔(圖未示)提供所述定位柱32對應嵌制,而使該盒體10能穩定的擺放於該檯面31上止動,其中當盒體10置放時,其開口11必須沿著所述Y軸向而朝向懸持臂40的配置位置開放,使該懸持臂40於施作時能由開口11植入盒體10的容置艙12內。
In addition, a table 31 arranged along the X-Y axis for placing the
復如圖4及圖5所示,該懸持臂40能以H字形態而在X-Y軸向的平面呈現,使該懸持臂40具有沿所述X軸向相互間隔的兩臂部41、42,以及連接於兩臂部中間的支撐部43,該檢測面域Q佈建於該支撐部43及兩所述臂部41、42框圍的區域中,且該檢測面域Q在該懸持臂40上能呈現出被懸持的形態。此外,該機檯30配置有一雙軸驅動器60,使該懸持臂40能配置於該雙軸驅動器60上。該雙軸驅動器60包含有沿X軸向固置於該機檯30上的一對滑軌61,傳動連結於該對滑軌61上執行所述Y軸向移動的一滑檯62,以及傳動連結於該滑檯62上執行所述Z軸向移動的一滑座63;該懸持臂40的一端能沿所述Y軸向架置於該雙軸驅動器60的滑座63上,且懸持臂40的另一端能沿所述Y軸向懸持於該機檯30上方的空間中;依此配置,該懸持臂40能憑藉該滑檯62執行所述Y軸向的移動,並且能憑藉該滑座63而執行所述Z軸向的移動,以便懸持臂40能憑藉雙軸驅動器60的驅動,而植入盒體10內並且沿Y-Z軸向執行雙軸向移動,用以帶動該檢測面域Q逐層執行所述Y軸向的一測距移動以及逐層執行所述Z軸向的一換層式移動(容後詳述)。在本實施中,該雙軸驅動器60的滑軌61和滑檯62之間在Y軸向的傳動連結,或/及該滑檯62和滑座63之間在Z軸向的傳動連結,可憑藉一般的伺服馬達提供動力並且搭載Z軸向、或Y及Z軸向的光學尺而在傳動及檢知移動距離上取得較高的絕對精度;此外,該雙軸驅動器60雖未揭露可帶動該懸持臂40執行X軸向的第三軸向移動,但在X軸向附加實施單向的移動或雙向的往復移動,同屬本發明所思及而可簡易變換應用之技術範疇,並予陳明。
As shown in FIGS. 4 and 5 , the
再者,由圖4所示實施中,多個所述感測元件50可沿X-Y軸向間隔地安裝於該懸持臂40的兩所述臂部41、42上;換個方式說,所述懸持式的檢測面域Q中還佈建有多個分佈於X-Y軸向的所述感測元件50。多個所述感測元件50包含沿所述X軸向間隔配置的一對邊肋測距元件51及一對支撐肋照射元件52。其中:
請先參閱圖11,可知圖1所示的各層插槽21於所述X軸向區分形成有坐落於各該懸狀支撐肋13b雙側的二槽部21a、21b,各該對邊肋測
距元件51及各該支撐肋照射元件52相互間隔地配置於各該臂部41、42上,用以植入各該槽部21a、21b內執行所述測距移動。
Furthermore, in the implementation shown in FIG. 4 , a plurality of the
如圖6所示,各該邊肋測距元件51在本實施中是以能夠投照雷射光線至物件並且接收該雷射經物件反射後的光線而偵測取得該物件距離的感測器為例,說明圖4中分設於該懸持臂40雙側而相互對外進行量測的雙側邊肋測距元件51,能在所述X軸向對各該邊肋13a投照及接收雷射的測距光線,用以檢知各該邊肋13a的準位;其中,由於該檢測面域Q容許在Z軸向存在圖3所示的投光位差δ,使得各該邊肋測距元件51能夠在該投光位差δ中投照及接收測距光線,換言之,各該邊肋測距元件51投照的測距光線能在Z軸向函蓋各層插槽21雙側的各該邊肋13a、各該丘部13a’的實際高度(或稱厚度)的位置,以便於檢知各層插槽21雙側的各該邊肋13a、各該丘部13a’至少其中之一的實際距離,並由所述控制單元計算及比對各該邊肋13a、各該丘部13a’的準位是否歪斜或變形,進而確知各層插槽21雙側的各該邊肋13a之間或/及各該丘部13a’之間,是否坐落在同一平面(即共面)。
As shown in FIG. 6 , each side rib
更進一步的,請參照圖6及圖7所示,揭露各該邊肋測距元件51的相鄰側,還可在所述X軸向搭載能反射所述X軸向的測距光線成為所述Z軸向的測距光線的一三稜鏡53,並使該三稜鏡53沿著所述Z軸向而坐落於各該邊肋13a或各該丘部13a’的上方,該三稜鏡53具有一斜向鏡面的特徵,使該三稜鏡53的斜向鏡面能以例如是90度的反射角,將該邊肋測距元件51投照的雷射光線(以虛線箭頭表示)朝向Z軸向反射,以便於投照至各該丘部13a’,確知各層插槽21中沿著Y軸向間隔分佈的各該丘部13a’位在Z軸向的高度是否一致,以判斷其是否有歪斜或變形;同理,各該邊肋測距元件51和該三稜鏡53的組合,亦可分點投照各層插槽21中的各該邊肋13a在Z軸向的高度是否一致,以判斷否有歪斜或變形(即檢知其準位是否達標),併予說明。
Furthermore, please refer to FIG. 6 and FIG. 7 to reveal that the adjacent side of each side rib
另如圖8所示,揭露出該對支撐肋照射元件52在本實施中是以能夠在所述X軸向相互對物件投射出一對照式光線(即雷射光線)進而檢知該物件真實位置的感測器為例,說明各層插槽21中的懸狀支撐肋13b能
接受該對照式光線的投照而檢知其是否歪斜或變形(即檢知其準位是否達標)。再者,該對支撐肋照射元件52投照的所述對照式光線可在Z軸向保有投光位差δ,因此能投照所述對照式光線的範圍包含各層插槽21中的懸狀支撐肋13b、弧凸部13b’的至少其中之一的實際高度(或稱厚度)的位置是否歪斜或變形(即檢知其準位是否達標)。
As shown in FIG. 8 , it is revealed that the pair of support
此外,由圖6所示可知悉多個所述感測元件50還可包含沿X軸向配置的一對端壁測距元件54,該對端壁測距元件54同樣可為能夠投照雷射光而偵測物件距離的感測器,用以檢知如圖9所示各該邊肋13a之端側的端壁13a”的實際距離,或者該容置艙12之雙側內壁的實際距離,進而確知各該邊肋13a的端壁13a”或是容置艙12的雙側內壁是否歪斜或變形(即檢知其準位是否達標)。
In addition, as shown in FIG. 6 , it can be seen that the plurality of
該控制單元內建有該盒體10之多個所述內肋13的一輪廓標準值,並且電連接於該雙軸驅動器60和多個所述感測元件50之間,使得該控制單元能下達所述驅動指令,用以驅動該雙軸驅動器60而帶動該懸持臂40植入於各層所述插槽21內,該檢測面域Q上的多個所述感測元件50能同步地沿著該Y軸向逐層執行所述測距移動,所述測距移動能以多個定點的步進移動方式或持續移動方式進行,用以檢知所述邊肋13a、所述丘部13a’、所述端壁13a”、所述懸狀支撐肋13b、所述弧凸部13b’位在Y軸向的多個準位;而且,該檢測面域Q上的多個所述感測元件50還能同步地沿著該Z軸向逐層執行所述換層式移動,用以接序於多次的測距移動之間,進而檢知各層位之內肋13的多個所述準位,該控制單元並比對各該準位和該輪廓標準值而取得一瑕疵檢測結果。其中,該輪廓標準值包含多個所述邊肋13a、所述丘部13a’、所述端壁13a”、所述懸狀支撐肋13b、所述弧凸部13b’各自坐落在X軸向、Y軸向及Z軸向的標準位置,多個所述感測元件50;再者,在該測距移動及該換層式移動的過程中,多個所述感測元件排除接觸多個所述內肋。
The control unit is built with a profile standard value of the
另外,該控制單元可經由該對邊肋測距元件51檢知各層所述插槽21中之雙側邊肋13a的準位以及經由該對支撐肋照射元件52檢知各該
中置的懸狀支撐肋13b的準位,進而和該輪廓標準值相互比對,以便得知雙側邊肋13a和中置懸狀支撐肋13b之間的準位。
In addition, the control unit can detect the level of the
本發明還提供一種前開式基板傳送盒的內肋瑕疵檢測方法,用於更具體的揭露檢測上述盒體10的內肋13的細節。請參閱圖10所示,揭露該瑕疵檢測方法的程序方塊圖,包括依序執行下列步驟S1至步驟S4:
The present invention also provides a method for detecting inner rib defects of a front-opening substrate transfer box, which is used to more specifically disclose the details of detecting the
步驟S1:建構盒體內肋的輪廓標準值 Step S1: Construct the outline standard value of the inner rib of the box
本步驟以圖1所示的盒體10結構的態樣為例,必須事先將該盒體10的標準輪廓內建於該控制單元內,所述標準輪廓是指由多個所述內肋13建構而成之多層式插槽21的多個所述邊肋13a和多個所述懸狀支撐肋13b分佈於容置艙12內的輪廓特徵。其中,當容置艙12的端壁13a”、各該邊肋13a存在有丘部13a’、各該懸狀支撐肋13b存在有弧凸部13b’的至少其中之一,有必要被選定作為瑕疵檢測的部位,該輪廓標準值亦當包含所述端壁13a”、丘部13a’、弧凸部13b’的至少其中之一的輪廓特徵。進言之,可由盒體設計端提供或自行量測取得多個所述內肋13坐落在X軸向、Y軸向及Z軸向之標準座標的電腦數位圖像或數值作為該內肋13的輪廓標準值,並且內建於該控制單元內。或者,由盒體設計端提供一通過三維軸向量測及校準過的盒體標準治具,先執行下述步驟S2至步驟S3,以事先建構出該盒體標準治具之內肋13坐落在X軸向、Y軸向及Z軸向之標準座標的電腦數位圖像或數值作為內肋13的輪廓標準值,並且內建於該控制單元內。
This step takes the structure of the
請續參閱圖11,說明本發明還能於該控制單元內針對該盒體內肋的輪廓標準值預設出多個待以檢測的標點A、B、C、D、E、F,圖11中揭示在X-Y平面陳列的多個所述丘部13a’上設立所述標點A、B、C、D、E、F;其中,標點A、B位在X軸向共線,標點C、D位在X軸向共線,標點E、F位在X軸向共線,標點A、C、E位在Y軸向共線,且標點B、D、F位在Y軸向共線。依此,所述標點A、B、C、D、E、F能作為所述檢測面域Q在執行所述Y軸向的測距移動時,多個感測元件50(容後詳述)能確知啟動檢測的靶點。上述標點的預設位置並不以此為限,換言之,舉凡各該端壁13a”、
各該邊肋13a、各該丘部13a’、各該懸狀支撐肋13b、各該弧凸部13b’皆可作為本發明設立所述標點的位置。
Please continue to refer to Figure 11, which illustrates that the present invention can also preset a plurality of marking points A, B, C, D, E, F to be detected in the control unit according to the outline standard value of the inner rib of the box. In Figure 11 It is disclosed that the marking points A, B, C, D, E, and F are set up on the plurality of
此外,該控制單元還可依客製化需求,而預先設定出容許被檢測之多個所述內肋13在X軸向、Y軸向及Z軸向偏離該輪廓標準值的一特定誤差範圍的圖像或數值,且該特定誤差範圍的圖像或數值能以上述標點A、B、C、D、E、F的位置作為座標上的參考點。當控制單元檢知任一個所述標點(例如是標點B)的偏離量(或稱變形量)落入於該誤差範圍之內時,判定該盒體10的多個所述內肋13皆不存在有歪斜或變形的瑕疵時,即將該盒體10列為良品;當控制單元檢知任一個所述標點(例如是標點B)的偏離量不落入該誤差範圍之外時,判定該盒體10的多個所述內肋13中存在有至少一處內肋存在有歪斜或變形之瑕疵,而將該盒體10列為瑕疵品。
In addition, the control unit can also pre-set a specific error range that allows the detected
步驟S2:佈建懸持式的檢測面域 Step S2: Deploy a suspended detection area
本步驟可使用圖4及圖5中揭露的多個所述感測元件50來佈建出圖2及圖3所示的檢測面域Q,多個所述感測元件50可選用例如是雷射、紅外光或其它能釋放光線並且接收或辨知所述光線有或無被物件遮蔽、或物件距離的光感測器;由前述瑕疵檢測裝置的實施細節中可知,多個所述感測元件50特別包含該對邊肋測距元件51及該對支撐肋照射元件52,驅使多個所述感測元件50能以相互間隔分佈的形式佈建形成該檢測面域Q,且該檢測面域Q是經由該懸持臂40而呈現出懸持於空間中的態樣。
In this step,
步驟S3:驅動檢測面域檢知內肋的準位 Step S3: Drive the detection area to detect the level of the inner ribs
本步驟可使用圖4及圖5中揭露的雙軸驅動器60,並且通過已經內建有該輪廓標準值的所述控制單元下達驅動指令至該雙軸驅動器60,用以帶動該懸持臂40植入該盒體10的容置艙12內,令該檢測面域Q在該容置艙12內沿Y-Z軸向執行雙軸向移動,所述雙軸向移動特別包含前述的逐層執行所述Y軸向的測距移動以及逐層執行所述Z軸向的換層式移動,用以執行如圖6至圖9所示的檢知多個所述內肋13上各標點的所述測距移動和所述換層式移動,以及投照並接收所述測距光線光線和投照所述對照式光線的工序,以便能取得多個所述內肋13的準位。
In this step, the dual-
進一步的,以圖11揭示的所述標點A、B、C、D、E、F為例,說明圖6及圖7中所示搭載有三稜鏡53的該對邊肋測距元件51,在沿著Y軸向執行測距移動時,能依序同步地檢知多個所述丘部13a’位在標點A、B,標點C、D及標點E、F的準位,或/及依序同步地檢知多個所述丘部13a’位在標點E、F,標點C、D及標點A、B的準位,其中所述測距移動包含是以所述標點A、B、C、D、E、F作為定點進行投照及接收光線的步進移動方式,或者以所述標點A、B、C、D、E、F作為動態掃瞄的投照及接收光線的靶點(即所述持續移動方式);除此之外,所述測距移動亦可忽略所述標點的存在,而直接依據所內肋13的輪廓標準值逐層進行持續移動的動態投光掃描,以便於逐層取得多個所述丘部13a’的準位。所述測距移動是以持續移動的方式進行時,可區分出在檢測所述內肋13或其靶點時的移動速度相對較慢於在沒有檢測內肋13或其靶點時的測距移動速度,以便於能在確保檢測精度的情況下,提升測距移動的速率。
Further, taking the punctuation points A, B, C, D, E, and F disclosed in FIG. 11 as an example, the pair of side rib
另一方面,由圖11可知,二所述臂部41、42上除了各自配置有該邊肋測距元件51及該支撐肋照射元件52之外,還配置有該端壁測距元件54,以便於能和該邊肋測距元件51及該支撐肋照射元件52一起(即同步)植入各該槽部21a、21b內執行所述測距移動。
On the other hand, as can be seen from Figure 11, in addition to the side rib
在執行上述測距移動的過程中,不論所述標點是否存在或是否設立在各該邊肋13a或其丘部13a’上,由圖11可知圖6所示搭配有三稜鏡53的各該邊肋測距元件51,會跟隨檢測面域Q沿Y軸向步進或持續移動,進而同步檢知各該邊肋13a的準位;且,由圖11可知圖8所示的各該支撐肋照射元件52,會跟隨檢測面域Q沿Y軸向步進或持續移動,進而同步檢知各該懸狀支撐肋13b、各該邊肋13a或/及各該弧凸部13b’的準位。同理,由圖11可知圖9所示的各該端壁測距元件54亦會跟隨檢測面域Q沿Y軸向步進或持續移動,進而同步檢知各該端壁13a”或容置艙12之雙側內壁的準位。此外,各該邊肋13a和各該懸狀支撐肋13b之間的準位,由該對邊肋測距元件51檢知各該邊肋13a的準位以及由該對支撐肋照射元件52檢知各該懸狀支撐肋13b的準位之後,經由所述控制單元依上述計算及相互比對方式各該邊肋
13a和各該懸狀支撐肋13b之間的準位有或無落入該特定誤差範圍內,以判定各該邊肋13a和各該懸狀支撐肋13b之間的準位是否存在有歪斜或變形的瑕疵。
During the process of performing the above ranging movement, regardless of whether the mark exists or is set up on each
在此一併說明的是,本發明之多個所述感測元件50之中,各該邊肋測距元件51和各該支撐肋照射元件52是不可缺少的必要構件,而各該三稜鏡53及各該端壁測距元件54是可依量測需求而附加搭載的元件。此外,以雷射、紅外光或其它能釋放光線並且接收或辨知所述光線有或無被物件遮蔽、或物件距離的光感測器所製成的各該邊肋測距元件51、各該支撐肋照射元件52及各該端壁測距元件54,在各自檢知所述內肋13的準位之後,能各自生成一類比或數位的準位信號並且傳遞至該控制單元內儲存,以便於接續後述步驟S4的比對工序。
It is also explained here that among the plurality of
再者,當檢測面域Q上的各該邊肋測距元件51和各該支撐肋照射元件52,或各該邊肋測距元件51、各該支撐肋照射元件52及各該端壁測距元件54執行完一層測距移動後,圖4所示的雙軸驅動器60會驅動所述懸持臂40,使該檢測面域Q沿Z軸向朝上或下執行一層插槽21高度的,以便於接續進行另一層插槽21的測距移動(容後詳述)。
Furthermore, when detecting each side rib
請續參閱圖12至圖14所示,依序揭露出檢測面域Q可實施的三種迴圈移動的路徑示意圖;其中:圖12揭露該盒體10內的多個所述邊肋13a分別是在所述Y軸向呈現間隔分佈(即非延伸分佈)的形態,使得每一單層之Y軸向上的多個邊肋13a之間,以及每一單層之Y軸向上最靠近容置艙12之底壁12a的邊肋13a和該底壁12a之間,分別間隔形成有一間隙空間T1。面對此種內肋的佈局,可令該檢測面域Q在容置艙12內沿著Y-Z軸向的平面執行一種波形移動路徑L;所述波形移動路徑L是由沿Y軸向的所述測距移動L1串接沿Z軸向的所述換層式移動L2交互建構而成的迴圈移動路徑(圖12中虛線表示移動路徑,實心箭頭表示移動方向);其中,當檢測面域Q在沿Z軸向執行換層式移動L2時,該間隙空間T1可供各該單側的邊肋測距元件51、三稜鏡53沿Z軸向順利的移動通過,而不至於碰撞或接觸所述邊肋13a或底壁12a。
Please continue to refer to Figures 12 to 14, which sequentially reveal the schematic diagrams of three circular movements that can be implemented in the detection area Q; wherein: Figure 12 reveals that the plurality of
圖13揭露該盒體10內的各個所述邊肋13a上間隔配置有多個弧凸部13a’,且各層雙側的邊肋13a是沿所述Y軸向呈現延伸分佈(即非間隔分佈)的形態,使得每一單層之Y軸向上的各個側單邊肋13a不存在間隙空間,且各個側單邊肋13a的末端和容置艙12的底壁12a之間也不存在間隙空間,或縱使有間隙空間但非常的小,不足以提供各該單側的邊肋測距元件51、三稜鏡53沿Z軸向順利移動通過。面對此種內肋的佈局,可令該檢測面域Q在容置艙12內沿著Y-Z軸向的平面執行另一種蛇形移動路徑M,所述蛇形移動路徑M是在各層插槽21的空間中往復(或稱來回)各執行一次沿Y軸向的所述測距移動M1之後串接所述換層式移動M2而交互建構成的迴圈移動路徑(圖13中虛線表示移動路徑,實心箭頭表示往前的順向移動方向,空心箭頭表示後退的復位移動方向),使得各該換層式移動M2能在容置艙12的開口11外執行。圖13所示沿Y軸向往復(或稱來回)各執行一次測距移動M1的過程,可視為該往復(或稱來回)測距移動M1是沿Y軸向的共線路徑執行的,而在容置艙12內不存在有所述Y軸向的換層式移動M2。依此,可避免各該單側的邊肋測距元件51、三稜鏡53在執行沿Z軸向順利的移動通過,而不至於碰撞或接觸所述邊肋13a或底壁12a。
Figure 13 reveals that each of the
圖14揭露該盒體10的內肋由多個分層列設的雙側弧凸部13a’構成(其中並不存在前述的邊肋13a),且各層單側的多個弧凸部13a’是在所述Y軸向呈現間隔分佈的形態,使得每一單層之Y軸向上的各個單側弧凸部13a’之間存在有間隙空間T2,可提供各該單側的邊肋測距元件51、三稜鏡53沿Z軸向順利移動通過。面對此種內肋的佈局,可令該檢測面域Q在容置艙12內沿著Y-Z軸向的平面執行另一種蛇形移動路徑N,所述蛇形移動路徑N是在各層插槽21的空間中執行一次沿Y軸向的所述測距移動N1之後,續沿該Y軸向執行一回復移動N2,隨後串接在Z軸向執行所述換層式移動N3而交互建構成的迴圈移動路徑(圖14中虛線表示移動路徑,實心箭頭表示往前挺進的移動方向,空心箭頭表示後退的回復移動方向)。其中,各該回復移動N2包含當各層的所述測距移動N1至能檢知最接近容置艙之底壁12a位置的弧凸部13a’之後,隨即利用該間隙空間T2而沿Y軸向之共線路
徑局部復位至相鄰的兩個弧凸部13a’之間,使得後續的所述換層式移動N3能於所述相鄰的兩個弧凸部13a’之間沿Z軸向執行;所述測距移動N1包含當在所述相鄰的兩個弧凸部13a’之間沿Z軸向執行完成所述換層式移動N3之後,接續沿Y軸向局部移動至最接近底壁12a的弧凸部13a’位置的過程;再者,各該復位移動N2還包含在各層中由最接近底壁12a的弧凸部13a’位置沿Y軸向復位移動至開口11外的過程,以利接續在開口11外執行的所述換層式移動N3。如此為之,可避免各該單側的邊肋測距元件51、三稜鏡53在容置艙12內能順利的執行沿Z軸向的所述換層式移動N3,而不至於碰撞或接觸所述弧凸部13a’或底壁12a。
Figure 14 reveals that the inner ribs of the
上述中,相較於各該單側的邊肋測距元件51及三稜鏡53,圖11所示的各該端壁測距元件54在X-Z軸向的位置相對地更加遠離各該邊肋13a、各該弧凸部13a’及各該端壁13a”,因此當該檢測面域Q在執行上述波形移動路徑L或是執行上述兩種蛇形移動路徑M、N時,各該端壁測距元件54皆不會碰撞或接觸各該邊肋13a、各該弧凸部13a’及各該端壁13a”。同理,由於該對支撐肋照射元件52在X-Z軸向的位置是坐落於該懸狀支撐肋13b的雙側外圍,因此當該檢測面域Q在執行上述波形移動路徑L或是執行上述兩種蛇形移動路徑M、N時,該對支撐肋照射元件52亦不會碰撞或接觸各該懸狀支撐肋13b。
Among the above, compared with the single-sided side rib
必須說明的是,圖13所示的蛇形移動路徑M以及圖14所示的蛇形移動路徑N,能分別實施於圖12所示的多個所述邊肋13a在Y軸向間隔分佈的盒體10檢測場合,同樣的能防止各該內肋13遭到碰撞或接觸。無論如何,圖12及圖13所示實施,僅說明檢測面域Q在執行所述迴圈移動路徑過程不會碰撞或接觸各該內肋13的兩種可實施性;除此之外,起因於客製化需求而對各層邊肋13a位置作出前述以外的變化,自當會影響所述迴圈移動路徑的些微變動,本發明仍可由上述實施內容及精神而作出相應的移動路徑規劃,以防所述內肋13在瑕疵檢測過程遭遇碰撞或接觸。由此可知,本發明在執行驅動檢測面域Q檢知所述內肋13之準位的過程中,多個所述
感測元件50確實能排除和多個所述內肋13相互碰撞或接觸,並且還能選擇最近或最佳路徑,進而提升檢測速率。
It must be noted that the serpentine movement path M shown in FIG. 13 and the serpentine movement path N shown in FIG. 14 can be respectively implemented in a plurality of
步驟S4:比對準位和輪廓標準值 Step S4: Compare alignment and contour standard values
本步驟由已經內建有該輪廓標準值的所述控制單元執行,所述控制單元可選用一般周知的可程式邏輯控制器(PLC)、數值控制(NC)或/及微控制器(MCU)等編製而成一控制電路,使該控制單元內建包含有相互電性連接的一儲存體、一驅動控制器及一邏輯運算器。其中,該儲存體能儲存、轉換該輪廓標準值的電腦數位圖像或數值,並且還能儲存、轉換多個所述感測元件50所檢知的類比或數位的所述準位信號;該驅動控制器能依據該輪廓標準值的電腦數位圖像或數值,而下達所述驅動指令至該雙軸驅動器60,用以驅動所述懸持臂40上的檢測面域Q執行所述波形移動路徑L或所述兩種蛇形移動路徑M、N的迴圈移動;再者,本發明能由該邏輯運算器定義出該輪廓標準值的所述特定誤差範圍;所述特定誤差範圍能以各該內肋13位於X-Y-Z座標上的圖像或數值加入品管上容許的一正、負公差圖像或數值而定義形成,在定義過程中,能參考前述標點A、B、C、D、E、F的位置作為座標參考點並加入容許的正、負公差,或直接由容置艙12四周的內壁及多個所述內肋13的整體圖像的輪廓標準值定義所述特定誤差範圍;隨後,通過該邏輯運算器比對所述準位信號有無落入該特定誤差範圍之內,用以判定該盒體10的多個所述內肋13是否存在有歪斜或變形的瑕疵。其中,由多個所述感測元件50檢知的所述準位信號,是經由所述伺服馬達所搭載Z軸向、或Y及Z軸向的光學尺而取得準位信號的絕對值之後,才儲存於該儲存體內,用以提供該邏輯運算器比對;該邏輯運算器對於所述準位信號和上述X-Y-Z座標上的圖像或數值的比對,為已知演算技術的簡單運用即可實現的技術範疇,故不加贅述。
This step is performed by the control unit that has built-in the contour standard value. The control unit can be a commonly known programmable logic controller (PLC), numerical control (NC) or/and microcontroller (MCU). etc. are compiled into a control circuit, so that the control unit includes a storage body, a drive controller and a logic operator that are electrically connected to each other. Wherein, the storage body can store and convert computer digital images or values of the contour standard value, and can also store and convert multiple analog or digital level signals detected by the
步驟S5:取得瑕疵檢測結果 Step S5: Obtain defect detection results
如前所述,當控制單元檢知該盒體10內所述邊肋13a、所述丘部13a’、所述懸狀支撐肋13b、所述弧凸部13b’的至少其中之一的準位有落入該誤差範圍之內時,即判定該盒體10的內肋構造為良品,而可在產線
繼續使用;當控制單元檢知該盒體10內所述邊肋13a、所述丘部13a’、所述懸狀支撐肋13b、所述弧凸部13b’的至少其中之一落入該誤差範圍之外時,即判定該盒體10的內肋構造為不良品,而應從產線剔除,以免於各層插槽21內容置基板時刮傷基板,或造成基板不易植入插槽內或不易自插槽內取出的問題。
As mentioned above, when the control unit detects the alignment of at least one of the
以上實施例僅為表達了本發明的較佳實施方式,但並不能因此而理解為對本發明專利範圍的限制。因此,本發明應以申請專利範圍中限定的請求項內容為準。 The above embodiments only express the preferred embodiments of the present invention, but should not be construed as limiting the patent scope of the present invention. Therefore, the present invention shall be subject to the content of the claims defined in the scope of the patent application.
30:機檯 30:Machine
31:檯面 31: Countertop
32:定位柱 32: Positioning column
40:懸持臂 40:Suspended arm
41,42:臂部 41,42:Arm
43:支撐部 43:Support part
50:感測元件 50: Sensing element
51:邊肋測距元件 51: Side rib distance measuring element
52:支撐肋照射元件 52: Support rib irradiation element
60:雙軸驅動器 60: Dual axis drive
61:滑軌 61:Slide rail
62:滑檯 62:Slide
63:滑座 63:Sliding seat
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TWM606479U (en) * | 2020-09-14 | 2021-01-11 | 鴻績工業股份有限公司 | Wafer box inspection device |
CN113252704A (en) * | 2021-05-12 | 2021-08-13 | 江阴市建设工程质量检测中心有限公司 | Robot for coating and detecting U-rib angle weld of orthotropic steel box girder |
CN113737645A (en) * | 2021-09-17 | 2021-12-03 | 江阴市建设工程质量检测中心有限公司 | Bridge steel box girder U rib detection robot |
JP2022080365A (en) * | 2020-11-18 | 2022-05-30 | 信越半導体株式会社 | Inspection device and inspection method |
TWM634937U (en) * | 2022-07-19 | 2022-12-01 | 普思半導體股份有限公司 | Front opening unified pod |
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TWM606479U (en) * | 2020-09-14 | 2021-01-11 | 鴻績工業股份有限公司 | Wafer box inspection device |
JP2022080365A (en) * | 2020-11-18 | 2022-05-30 | 信越半導体株式会社 | Inspection device and inspection method |
CN113252704A (en) * | 2021-05-12 | 2021-08-13 | 江阴市建设工程质量检测中心有限公司 | Robot for coating and detecting U-rib angle weld of orthotropic steel box girder |
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