KR101033855B1 - System of 2d code detection and thickness measurement for glass substrate, and method of the same - Google Patents

System of 2d code detection and thickness measurement for glass substrate, and method of the same Download PDF

Info

Publication number
KR101033855B1
KR101033855B1 KR1020100085897A KR20100085897A KR101033855B1 KR 101033855 B1 KR101033855 B1 KR 101033855B1 KR 1020100085897 A KR1020100085897 A KR 1020100085897A KR 20100085897 A KR20100085897 A KR 20100085897A KR 101033855 B1 KR101033855 B1 KR 101033855B1
Authority
KR
South Korea
Prior art keywords
glass substrate
thickness
code
unit
measurement
Prior art date
Application number
KR1020100085897A
Other languages
Korean (ko)
Inventor
김태진
김현석
이상주
황용운
Original Assignee
노바테크 (주)
주식회사 투아이스펙트라
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 노바테크 (주), 주식회사 투아이스펙트라 filed Critical 노바테크 (주)
Priority to KR1020100085897A priority Critical patent/KR101033855B1/en
Application granted granted Critical
Publication of KR101033855B1 publication Critical patent/KR101033855B1/en
Priority to CN201110180119.8A priority patent/CN102384722B/en
Priority to TW100130033A priority patent/TWI445919B/en

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02—Testing optical properties
    • G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
    • G01M11/025—Testing optical properties by measuring geometrical properties or aberrations by determining the shape of the object to be tested
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/14—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
    • G06K7/1404—Methods for optical code recognition
    • G06K7/1408—Methods for optical code recognition the method being specifically adapted for the type of code
    • G06K7/1417—2D bar codes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Geometry (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Artificial Intelligence (AREA)
  • Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)

Abstract

PURPOSE: A system and a method for 2D code detection and thickness measurement of a glass substrate are provided to enable free measurement of the entire glass substrate by a contactless method for measuring the thickness of a glass substrate. CONSTITUTION: A system for 2D code detection and thickness measurement of a glass substrate comprises a loading/unloading unit(100), a washing unit(200), a measuring unit(300), and a mounting unit(40), and a measuring terminal(400). The loading/unloading unit loads and unloads a glass substrate(20). The washing unit washes the glass substrate. The measuring unit detects 2D code of the glass substrate and measures the thickness thereof. The mounting unit is rotated b y a central rotary shaft(30). The measuring terminal automatically controls the operation of the mounting unit. The measuring terminal calculates the thickness of the glass substrates and detects the 2D code.

Description

System of 2D code detection and Thickness measurement for glass substrate, and method of the same}

The present invention relates to a thickness measurement and two-dimensional code (hereinafter referred to as '2D code') detection system and method of the glass substrate, and more particularly, loading, unloading, cleaning operations of the glass substrate The present invention relates to a glass substrate thickness measurement and 2D code detection system and method for automatically and simultaneously performing thickness and 2D code measurement.

The present invention also relates to a glass substrate thickness measurement and 2D code detection system and method for automatically measuring the thickness and 2D code of a glass substrate using a laser.

In the display industry, such as liquid crystal displays (LCDs), plasma display panels (PDPs), organic light emitting diodes (OLEDs), digital cameras, and mobile phone cameras, various glass is widely used in the manufacturing process in the form of thin substrates. Among them, glass substrates (wafers) are widely used in the field of high quality poly TFT-LCD, OLED, digital cameras, mobile phone cameras, and other optical filter substrates and optical communication materials. have.

In addition, bonding to silicon wafers, MEMS, MEMS of fiber optics devices, bio-medical fields, micro-mirrors, polarized beam splitters, dichroic filter substrates, micro glass blocks and pick-ups of lenses, DVD, CDP, etc. Glass wafers of various materials are used in the up prism field.

As such, glass wafers are widely used in the rapidly growing display industry, optical communication, and precision optical devices, and are expected to continue to grow at a high level. In order to maintain continuous growth, accurate quality control and quality improvement are always required for glass wafers. To this end, accurate evaluation and measurement techniques for glass wafer characteristics, that is, flatness and thickness change, are required.

Conventional measuring method of flatness of glass wafer is to measure the flatness of the upper surface of the glass wafer placed on the flat plate by using 3D shape measuring device to measure the flatness and using the parallel beam with Fizeau interferometer. There is a method of measuring the flatness by observing the interference fringes of the reference flat and the upper surface of the glass wafer of the same or larger size than the glass wafer.

Only a straight shape can be measured with a 2D shape measuring instrument. To obtain a 2D shape, the entire area must be scanned with a 3D shape measuring instrument. There are many types of shape measuring instruments, but most can measure only small areas, and large measuring instruments are required to measure glass wafers larger than 200 mm. However, the larger the size, the less accurate the measurement and the higher the price.

1 is a product photograph showing a conventional commercial Fizeau interferometer made for measuring flatness of a plate.

Referring to FIG. 1, a reference lens of at least the same size is required to measure flatness of a flat plate. Therefore, the larger the size of the glass wafer, the larger the measuring device. However, since the measuring device uses a laser beam, when the glass wafer, which is a transparent thin film, is measured because the interference distance is long, all interference patterns generated between the upper and lower surfaces of the glass wafer and the reference plane appear to overlap. Suitable for silicon wafer measurement, but glass wafer measurement is problematic. This problem is a common problem in all commercial Fizeau interferometers.

2 is a view showing the VeriFire MST interferometer of Zygo Inc. and the operating principle of the interferometer, Figure 3 is a view showing a measurement result of measuring the glass wafer with the VeriFire MST interferometer of Zygo.

2 and 3, Zygo's VeriFire MST interferometer is an interferometer for eliminating the problem that all interference fringes appearing between the upper and lower surfaces of the glass wafer and the reference plane by using a special algorithm. Zygo's VeriFire MST interferometer can measure many things such as flatness, thickness change and refractive index of the upper and lower surfaces of the wafer. However, Zygo's VeriFire MST interferometers currently have a measurable size (100 mm in diameter) compared to the size of glass wafers, and the thinner the glass wafer, the more difficult it is to measure thickness (the optical thickness must be at least 1.2 mm). This is expensive and difficult to use in industry.

In addition, as a conventional thickness measuring device for measuring the thickness of a sample, a micrometer is typical, and an air micrometer that emits a constant pressure of air and measures the thickness by means of a flow rate and a pressure change, An electric micrometer etc. which measure thickness using the difference of the electromagnetic property of a coating film, a plating part, and a base material are mentioned.

Conventionally, the thickness of plate glass is measured mainly using a micrometer. However, since the micrometer measures the thickness of the plate glass by a contact method, there is a problem in that the polished glass surface is damaged or soiled by interference.

In addition, since the thickness measuring method of the plate glass using the micrometer is a measuring method by manual measurement by a measurer, not only the measurement work is troublesome, but also the reliability of the measured value is low.

Hereinafter, the conventional prior art for measuring the shape and thickness of the glass substrate is as follows.

Korean Patent Laid-Open Publication No. 2009-0031852 (hereinafter referred to as 'prior art 1') is a large-area glass capable of continuously and rapidly measuring the thickness of a large-area disk such as that used as a substrate for manufacturing a TFT-display. An apparatus and method for measuring thickness of a substrate.

The prior art 1 is a transparent and flat substrate, as shown in FIG. 4, comprising one cross-over device with two cross-over units and two or more measuring heads, and one control device and an evaluation device. An apparatus for measuring the thickness of a cross-over unit, the measuring head being fixed to the cross-over unit, the cross-over unit can move transversely with respect to the conveying direction of the glass disc over the substrate, the cross-over units being Move independently of each other, and the control device controls the operation of the cross-over unit so that the cross-over unit moves from one edge to the opposite edge in the transverse direction with respect to the transfer direction of the substrate with the phase shifted during operation. The evaluation device then creates a thickness profile with reference to the data of the measuring head. Disclosed is a device for measuring the thickness of a substrate configured to be formed.

Korean Laid-Open Patent Publication No. 2007-0100618 (hereinafter referred to as "Prior Art 2") relates to a plate thickness measuring apparatus for a glass substrate that can accurately measure the thickness of a glass substrate while conveying a thin glass substrate by a chemical polishing process or the like. .

The prior art 2, as shown in Figure 5, is a plate thickness measuring device for receiving a thin glass substrate and measuring the thickness of a plurality of spots with respect to the glass substrate, orthogonal to the conveyance path to which the glass substrate is conveyed A plurality of sets of sensors arranged on the front and rear surfaces of the glass substrate, first means for calculating a separation distance between each sensor and the surface of the glass substrate based on an output signal from the sensor, and the first means. And a second means for calculating the plate thickness of the glass substrate being conveyed based on the calculated value of and a separation distance of a pair of sensors previously specified. Is disclosed.

Korean Patent Publication No. 0074514 (hereinafter referred to as 'prior art 3') can measure with high precision on the surface of a diffuse reflection object by using a non-contact method using a laser, as well as on the surface of a specular reflection object such as glass. The present invention relates to a system for measuring the shape and thickness of a non-contact mirrored object by a laser capable of simultaneously measuring the thickness of the mirrored object and measuring the thickness of the mirrored object such as glass.

In the prior art 3, as shown in FIG. 6, after the laser light oscillated by the laser oscillator is focused on the mirror surface through the lens and the light reflected by the mirror surface is reflected back to the beam splitter through the objective lens, the photodetector Is entered. The light detector detects input light and calculates a light intensity distribution having information on the shape of the object, that is, roughness or height. In addition, if the translation stage corresponding to the driving part is precisely transferred, the laser light having a certain angle of reflection through the objective lens is focused on the back side of the glass mirror, and the light reflected on the back side passes through the mirror mirror again, and then moves the objective lens and the beam splitter. And then return to the photo detector to be detected. A system for measuring the shape and thickness of a non-contact mirror surface object which simultaneously analyzes two detected signals and simultaneously measures the shape and thickness on the same axis of the measurement object is disclosed.

Korean Registered Patent No. 0867197 (hereinafter referred to as “Prior Art 4”) relates to a thickness measuring apparatus of a multilayer coating glass for optically measuring the thickness of a flat glass coated with a multilayer thin film. .

The prior art 4 is a pair of pedestals having an inclined surface for supporting the left and right lower ends of the glass to slide forward, as shown in Figure 7, and vertical to support the left and right edges of the glass on the front of the pedestal Fastening means composed of a pair of supports mounted in such a way as to be mounted, a hologram optical system for outputting a focus error signal when the glass is positioned at a focal point, and orthogonal coordinate movement means for performing a rectangular coordinate movement of the holographic optical system with respect to the glass; And a thickness measuring apparatus for a multilayer coating glass comprising a computer for processing a focus error signal from the holographic optical system by a program to calculate the thickness of the glass.

Korean Patent No. 0908639 (hereinafter referred to as “Prior Art 5”) relates to a method and apparatus for measuring the shape of a glass wafer in a non-contact manner using light.

The prior art 5, as shown in Figure 8, the light irradiation step of irradiating the glass wafer with the light emitted from the light source, the first light reflected from the lower surface of the glass wafer and the lower surface of the glass wafer through the reference plane An interference fringe generation step of overlapping the reflected second light to generate an interference fringe, a detection step of detecting the generated interference fringe with a light detector, and a flatness of a bottom surface of the glass wafer based on the detected interference fringe Disclosed is a glass wafer shape measuring method comprising a calculating step of calculating.

However, the related arts disclose a method of non-contact measurement of the thickness of an object to be measured, such as a glass plate. However, in order to measure the thickness of the object to be measured, it is necessary to manually set the object to be measured manually. Because of the long time-consuming and inconvenient problem.

In addition, in the prior art, there is no mention or disclosure of a system and a method for automatically processing loading and unloading of objects to be measured, cleaning operations, thicknesses, and 2D code measurement operations simultaneously.

The technical problem to be solved by the present invention is to measure the thickness of the glass substrate is automatically performed at the same time loading and unloading, cleaning, thickness and 2D code measurement of the glass substrate and To present a 2D code detection system and method thereof.

In addition, another technical problem to be achieved by the present invention is to provide a thickness measurement and 2D code detection system and method of the glass substrate that can automatically measure the thickness of the glass substrate using a laser (non-contact).

In addition, another technical problem to be achieved by the present invention is a glass substrate thickness measurement and 2D code detection system that can read the matrix at the same time as the thickness measurement using the trigger signal (Trigger Signal) of the 2D matrix (Matrix) and To show you how.

In addition, another technical problem to be achieved by the present invention is to provide a thickness measurement and 2D code detection system and method of the glass substrate that can accurately measure the thickness of the glass substrate even if thin.

The problem of the present invention is not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

As a means for solving the above-described technical problem, the invention described in claim 2, "The loading and unloading unit 100 for loading and unloading the glass substrate 20 in the thickness measurement and 2D code detection system of the glass substrate ), A cleaning unit 200 for cleaning the glass substrate 20, a measuring unit 300 for detecting and measuring a thickness of the 2D code of the glass substrate 20, and the loading and unloading unit 100. ) And three seating tables 40 rotated by a central rotating shaft 30 so as to sequentially transport the glass substrate 20 to the cleaning unit 200 and the measurement unit 300 at the same time. Automatically control operations of the unloading unit 100, the cleaning unit 200, the measuring unit 300, and the seating table 40, and images captured by the image sensor 321 of the measuring unit 300. Image measuring 2D code to calculate the thickness of the glass substrate 20 and to measure the 2D code The measuring unit 300 includes: a laser oscillator 322 for irradiating incident light L1 to the upper surface G1 of the glass substrate 20, and an upper surface of the glass substrate 20. An upper measuring device having an image sensor 321 for photographing the reflection light L2 reflected by G1 or a point S1, S2 on which the laser beam is reflected on the upper surface G1 of the glass substrate 20. 320, a laser oscillator 332 irradiating incident light L1 to the bottom surface G2 of the glass substrate 20, and reflected light L2 reflected from the bottom surface G2 of the glass substrate 20, or the A lower measuring unit 330 having an image sensor 331 for capturing images of the points S1 and S2 on which the laser beam is reflected on the bottom surface G2 of the glass substrate 20; And a 2D code image sensor 342 photographing a 2D code of the glass substrate 20, and an illumination device that illuminates the 2D code portion of the glass substrate 20 when the 2D code image sensor 342 is operated. 2D code detector 340 having a 341; and a 2D code detection system.

delete

The invention as set forth in claim 3, "The method of claim 2, wherein when the laser of the laser oscillator (322,332) is an extended laser, the extended laser is converted into a straight line (dot) laser inside the upper and lower measuring devices 320,330. And a 2D code detection system for measuring the thickness of the glass substrate, further comprising a transmission lens (323, 333).

According to the invention of claim 4, "The measurement terminal 400 according to claim 2 includes: a keyboard 411 and a mouse 412 for inputting an operation command of the thickness and 2D code automatic measurement system, and the measurement unit An input unit 410 having a joystick 413 which finds the 2D code by adjusting the X and Y axes of 300; The thickness of the glass substrate 20 and the 2D code automatic measurement program screen, the monitor 431 for outputting the image image and the 2D code taken by the image sensor 321 on the screen, and measured by the measurement terminal 400 An output unit 430 having a communication port 432 for transmitting and receiving data information through a communication network; And the loading and unloading unit 100, the cleaning unit 200, and the measuring unit 300 by storing and driving the thickness and 2D code automatic measurement program and by a command input through the input unit 410. Automatically controlling the operation of the seat 40, the image sensor 321 and the 2D code image sensor to process the image images respectively to calculate the thickness of the glass substrate 20 and to measure the 2D code Control unit 420; and a thickness measurement and 2D code detection system of a glass substrate.

According to the invention of claim 5, "The thickness and 2D code automatic measuring system according to any one of claims 2 to 4 is: In the measuring terminal, photographed from the upper and lower portions of the glass substrate 20, respectively Image processing is performed on the resulting video image, and the position change amount of the reflected light of the glass substrate 20 as a measurement sample is calculated by the following Equation 1,

(Equation 1)

Figure 112010057079564-pat00001

Where

Figure 112011018591224-pat00002
And
Figure 112011018591224-pat00003
Is the thickness variation of the glass substrate 20 as compared with the thickness d of the reference glass substrate K,
Figure 112011018591224-pat00004
And
Figure 112011018591224-pat00005
Is an angle of incident light incident on the glass substrate 20 from the image sensors 321 and 331.)

(Equation 2)

Figure 112010057079564-pat00006

Where

Figure 112010057079564-pat00007
Is the thickness d of the reference glass substrate K.)

The above Equation 1

Figure 112011018591224-pat00008
And
Figure 112011018591224-pat00009
Next, the thickness t of the glass substrate 20 is obtained as in Equation 2 above, and the thickness measurement and 2D code detection system of the glass substrate.

In addition, as a means for solving the above-described technical problem, the invention described in claim 6, "In the method of measuring the thickness of the glass substrate and the 2D code detection method, (a) the loading and unloading unit by mounting the glass substrate 20 (100), providing a thickness and 2D code automatic measurement system having three seating stages 40 for rotating and rotating the cleaning unit 200 and the measurement unit 300 at the same time; (b) mounting the glass substrate 20 on a seat 40 of the loading and unloading unit 100; (c) transferring the glass substrate 20 to the cleaning unit 200 by simultaneously rotating the seating table 40; (d) cleaning the glass substrate 20 in the cleaning unit 200; (e) transferring the glass substrate 20 to the measurement unit 300 by simultaneously rotating the seating table 40; (f) measuring the thickness of the glass substrate 20 after aligning and vacuum-compressing the glass substrate 20 in the measuring unit 300 and simultaneously detecting a 2D code; (g) transferring the glass substrate 20 to the loading and unloading unit 100 by simultaneously rotating the seating table 40; (h) unloading and inspecting the appearance of the glass substrate 20 in the loading and unloading unit 100; And (i) repeating the steps (b) to (h); and a method for measuring the thickness of the glass substrate and detecting the 2D code.

The method according to claim 7, wherein the method of measuring the thickness of the glass substrate 20 in the step (f) is: irradiating a laser beam to the upper and lower surfaces of the glass substrate 20 Calculate the position change of the reflected light reflected from the glass substrate 20 from Equation 1 below,

(Equation 1)

Figure 112010057079564-pat00010

Where

Figure 112011018591224-pat00011
And
Figure 112011018591224-pat00012
Is the thickness variation of the glass substrate 20 as compared with the thickness d of the reference glass substrate K,
Figure 112011018591224-pat00013
And
Figure 112011018591224-pat00014
Is an angle of incident light incident from the image sensors 321 and 331 to the glass substrate 20.)

(Equation 2)

Figure 112010057079564-pat00015

Where

Figure 112010057079564-pat00016
Is the thickness d of the reference glass substrate K.)

It provides a thickness measurement and 2D code detection method of the glass substrate, characterized in that to obtain the thickness (t) of the glass substrate 20 using the above equation (2).

According to claim 8, the method according to claim 6, wherein the method for detecting the 2D code in the step (f) comprises: detecting the 2D code by performing image processing on an image image of the 2D code of the glass substrate. The thickness measurement of a glass substrate and a 2D code detection method. "

According to the present invention, since the loading and unloading of the glass substrate, the cleaning operation, the thickness and the 2D code measurement operation are automatically performed at the same time, the work time can be greatly reduced and the work efficiency can be improved.

In addition, by using a method of measuring the thickness of the glass substrate in a non-contact manner using a laser oscillator and an image sensor disposed on the glass substrate, it is possible to freely measure the thickness of all parts of the glass substrate without being limited to a specific position. .

In addition, the problem that the finely polished glass surface is damaged or soiled by interference does not occur, and the thickness measurement operation can be automated, and the accuracy of the thickness measurement operation is greatly improved.

In addition, it is possible to automatically measure the thickness of the glass substrate by using a laser in a non-contact manner, and to read the matrix simultaneously with the thickness measurement by using the trigger signal of the 2D matrix. There is.

The effects of the present invention are not limited to those mentioned above, and other effects that are not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a product photograph of a commercial Fizeau interferometer for measuring conventional flatness flatness.
2 is a view showing the VeriFire MST interferometer and operating principle of Zygo
3 is a view showing the measurement results of measuring the glass wafer with Zygo VeriFire MST interferometer
4 is a block diagram of a thickness measuring device of a large-area glass substrate according to the prior art
5 is a configuration diagram of a plate thickness measuring apparatus of a glass substrate according to the prior art
6 is a configuration diagram of a shape and thickness measurement system of a non-contact mirror surface object by a laser according to the prior art
7 is a block diagram of a thickness measuring device of a multilayer film coated glass according to the prior art
8 is a block diagram of a glass wafer shape measuring apparatus according to the prior art
9 is a block diagram of a thickness measurement and two-dimensional code detection system of a glass substrate according to a preferred embodiment of the present invention
10 is a schematic drawing of the thickness measurement and two-dimensional code detection system of a glass substrate according to the present invention
11 is a configuration diagram of the measuring unit 300 shown in FIGS. 9 and 10.
12 is a view showing a measurement position and the 2D code position of the glass substrate 20.
13 and 14 are a perspective view and a cross-sectional view schematically showing a first embodiment of the thickness measurement and 2D code detector of the glass substrate
15 is an explanatory diagram for explaining the thickness measurement of a glass substrate, the internal structure of the 2D code detector, and a thickness measuring method;
FIG. 16 is an explanatory diagram for explaining a first method of measuring a thickness of a glass substrate and a thickness of the glass substrate in a 2D code detector; FIG.
17 and 18 are explanatory views for explaining a second method of measuring the thickness of the glass substrate and the thickness of the glass substrate in the 2D code detector.
19 and 20 are explanatory diagrams for explaining a third method of measuring the thickness of the glass substrate and the thickness of the glass substrate in the 2D code detector.
21 is a flowchart illustrating a method of measuring a thickness of a glass substrate and detecting a 2D code according to an exemplary embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Glass substrate thickness measurement and two-dimensional code detection system

9 and 10 are schematic and design diagrams of a thickness measurement and two-dimensional code detection system of a glass substrate according to a preferred embodiment of the present invention.

The thickness measurement and 2D code detection system of the glass substrate according to the present invention, as shown in Figure 9 and 10, the loading and unloading unit 100 for loading and unloading the glass substrate 20, and the glass substrate The cleaning unit 200 for cleaning the 20, the measuring unit 300 for measuring the thickness and 2D code of the glass substrate 20, the loading and unloading unit 100 and Three mounting tables 40 rotated by a central rotating shaft 30 to sequentially and simultaneously transport the glass substrate 20 to the cleaning unit 200 and the measurement unit 300, and the loading and unloading. The operation of the unit 100, the cleaning unit 200, the measuring unit 300, and the seating table 40 is automatically controlled and photographed by the image sensor of the measuring unit 300 (see 321 of FIG. 14). And a measurement terminal 400 which image-processes an image image and a 2D code to calculate a thickness of the glass substrate 20 and detects the 2D code. The.

The measurement terminal 400 adjusts the X-axis and the Y-axis of the keyboard 411 and the mouse 412 and the measurement unit 300 to input operation commands of the thickness and 2D code automatic measurement system. An input unit 410 having a joystick 413 for searching for; The thickness of the glass substrate 20 and the 2D code automatic measurement program screen, the monitor 431 for outputting the image image and the 2D code taken by the image sensor 321 on the screen, and measured by the measurement terminal 400 An output unit 430 having a communication port 432 for transmitting and receiving data information through a communication network, and storing and driving the thickness and 2D code automatic measurement program and loading the data by a command input through the input unit 410. And automatically control operations of the unloading unit 100, the cleaning unit 200, the measuring unit 300, and the seating table 40, and displays the image image and the 2D code captured by the image sensor 321. The image processing unit includes a control unit 420 for calculating the thickness of the glass substrate 20 and detecting the 2D code.

The loading and unloading unit 100 loads the glass substrate 20 on which the operator 10 intends to measure the thickness to the seating table 40, and the thickness and 2D codes of the measuring unit 300. This is a place for unloading and visual inspection of the glass substrate 20 in which the measurement is completed. The loading and unloading unit 100 is provided with a material (glass substrate) holder and a light for inspecting foreign matters before unloading the glass substrate 20.

When the operator 10 seats the glass substrate 20 on the seating table 40 in the loading and unloading unit 100 (or a measurement command through the input unit 410 of the measurement terminal 400). If the input) the seat 40 is automatically rotated to transfer the glass substrate 20 to the cleaning unit 200. In this case, as shown in Figure 9, the seat 40 is composed of three so as to be located in each of the loading and unloading unit 100, the cleaning unit 200 and the measuring unit 300, respectively, The three seats 40 are rotated at the same time by the central rotation shaft 30 to rotate and rotate the loading and unloading unit 100, the cleaning unit 200, and the measuring unit 300. The seat 40 is one side is connected to the rotary shaft 30 and the other side has a fork shape formed with a seating leg 41 at regular intervals.

The cleaning unit 200 cleans the glass substrate 20 transferred from the loading and unloading unit 100. After the cleaning operation is completed, the glass substrate 20 is transferred from the cleaning unit 200 to the measurement unit 300 by the rotation of the mounting table 40.

When the glass substrate 20 is transferred from the cleaning unit 200 in the measuring unit 300, first, the X and Y axes of the glass substrate 20 are aligned by the XY alignment device 310. In addition, the measurement unit 300 finds a 2D code through the 2D code detector 340. In this case, if the 2D code is not found, the worker 20 searches for the 2D code while moving the 2D code detector 340 along the X and Y axes using the joystick 413. When the 2D code is found, the 2D code detector 340 captures the 2D code as an image image and detects the 2D code by image processing the image image of the 2D code photographed by the controller 420. At this time, the detection method of the 2D code is a known technique, and the principle thereof will not be described in detail here.

When the 2D code is photographed by the 2D code detector 340, the measurement unit 300 automatically measures the thickness of the glass substrate 20 using the upper measuring unit 320 and the lower measuring unit 330. In this case, a method of measuring the thickness of the glass substrate 20 will be described in detail later with reference to FIGS. 15 to 20.

When the thickness of the glass substrate 20 and 2D code measurement are completed in the measurement unit 300, the seating table 40 automatically rotates to transfer the glass substrate 20 to the loading and unloading unit 100. Done.

In the loading and unloading unit 100, the operator 10 visually inspects the glass substrate 20 transferred from the measuring unit 300, and then unloads it. Then, the new glass substrate 20 to measure the thickness is loaded (Loading) to the seating table (40).

As described above, the thickness measurement and 2D code detection system of the glass substrate according to the present invention greatly reduces the working time because the loading and unloading, the cleaning operation, the thickness and the 2D code measurement operation of the glass substrate 20 are performed automatically at the same time. It has the advantage of being able to improve work efficiency.

Of the measuring unit 300  Configuration example

FIG. 11 is a configuration diagram of the measuring unit 300 illustrated in FIGS. 9 and 10.

As illustrated in FIG. 11, the measurement unit 300 includes a laser oscillator 322 for irradiating incident light L1 to the upper surface G1 of the glass substrate 20, and an upper surface of the glass substrate 20 ( Upper measuring unit 320 having an image sensor 321 for photographing the reflection light (L2) reflected from G1 or the point (S1, S2) that the laser beam is reflected on the upper surface (G1) of the glass substrate 20 as an image ), A laser oscillator 332 for irradiating incident light L1 to the lower surface G2 of the glass substrate 20, and the reflected light L2 or the glass reflected from the lower surface G2 of the glass substrate 20. A lower meter 330 having an image sensor 331 for capturing images S1 and S2 at which the laser beam is reflected on the bottom surface G2 of the substrate 20, and a 2D code of the glass substrate 20. 2D code image sensor 342 for photographing the illumination device for illuminating the light to the 2D code portion of the glass substrate 20 during the operation of the 2D code image sensor 342 (3 And a 2D code detector 340 having 41).

Measurement position and 2D code position

12 is a view showing a measurement position and the 2D code position of the glass substrate 20.

As shown in FIG. 12, a plurality of cells 21 are arranged in a matrix form on the glass substrate 20, and a 2D code 22 is formed between the cells 21 and 21. It is. Here, B represents the thickness measurement position of the measuring unit 320, C represents the sealing position (measurement interval) of the measuring unit 320.

The 2D code 22 is flattened by arranging data on both axes (X direction and Y direction), and expresses various contents such as lot numbers, purchase order numbers, recipients, quantity and other information in a bar code like a shipping package. Therefore, it is possible to express a lot of data when the data is accompanied with movement of the object by attaching or accompanying the object. The 2D code 22 is represented by a two-dimensional symbol and can be re-entered without hitting a keyboard on another computer system.

Advantages of the 2D code 22 include that a large amount of data can be included in one symbol, a large amount of data can be represented in a small area in a high density, a space utilization is very high, and a symbol is contaminated or damaged. The ability to detect and recover errors even if the data is damaged is excellent. Also, since the black and white elements are not bound to the sides, it is easy to print and read symbols, and the symbols can be read in various directions. It has the advantage of expressing foreign language and graphic information. The 2D code 22 is largely divided into a stacked bar code and a matrix code according to a method of organizing data.

The glass substrate 20 measured in the thickness measurement and two-dimensional code detection system of the glass substrate may be from 660 × 406 mm to 699.6 × 440 mm, but is not limited thereto. The thickness and two-dimensional code automatic measurement system can measure both the glass substrate 20 made of a transparent or translucent material, and can measure the thickness of the transparent and translucent material of other materials in addition to the glass substrate 20.

First Embodiment of Thickness Measurement and 2D Code Detector

13 and 14 are perspective views and cross-sectional views schematically illustrating a thickness measurement of a glass substrate and a first embodiment of a 2D code detector, and FIG. 15 illustrates a thickness measurement of a glass substrate and an internal configuration and a thickness measuring method of the 2D code detector. It is explanatory drawing for the following.

As shown in FIGS. 13 to 15, the thickness measurement of the glass substrate and the first embodiment of the 2D code detector may include one or two or more upper and lower measuring instruments on one side of the upper and lower sides of the glass substrate 20. 320 and 330, respectively. The upper and lower measuring devices 320 and 330 are vertically and symmetrically parallel to the frame 301, and are moved by ± 20 mm to ± 50 mm in the X, Y, and Z directions by the joystick 413, respectively. This is possible. The distance s between the upper and lower measuring instruments 320 and 330 and the glass substrate 20 is preferably about 20 mm.

As shown in FIG. 15, the upper and lower measuring devices 320 and 330 are laser oscillators 322 and 332 which irradiate incident light L1 to the upper surface G1 or the lower surface G2 of the glass substrate 20, and the glass substrate. Reflected light L2 reflected from the upper surface G1 or the lower surface G2 of the 20 or the point S1 at which the incident light L1 is reflected on the upper surface G1 or the lower surface G2 of the glass substrate 20. Image sensors 321 and 331 for photographing S2) as images are respectively provided therein. In addition, the upper and lower measuring devices 320 and 330 further include transmissive lenses 323 and 333 for converting the extended laser into a straight line laser when the lasers of the laser oscillators 322 and 332 are extended lasers.

Examples of basic specifications of the upper and lower measuring devices 320 and 330 are shown in the following table.

Figure 112010057079564-pat00017

16 is an explanatory diagram for explaining a first method of measuring the thickness of the glass substrate and the thickness of the glass substrate in the 2D code detector.

In the first method of measuring the thickness of the glass substrate and measuring the thickness of the glass substrate in the 2D code detector, as shown in FIG. 16, incident light is emitted from the laser oscillators 322 and 332 to the upper and lower surfaces of the glass substrate 20, respectively. When irradiated, the incident light is reflected on the upper and lower surfaces of the glass substrate 20, and the reflected light is output to the image sensors 321 and 331. In this case, the image sensors 321 and 331 capture the reflected light incident on the upper and lower surfaces of the glass substrate 20 as an image image and send the image to the measurement terminal 400.

The measurement terminal 400 performs image processing on the image images photographed by the image sensors 321 and 331, respectively, and reflects the amount of change of reflected light reflected from the upper and lower surfaces of the glass substrate 20 and incident to the image sensors 321 and 331. It is calculated by Equation 1 below.

Figure 112010057079564-pat00018

Where

Figure 112011018591224-pat00019
And
Figure 112011018591224-pat00020
Is the thickness variation of the glass substrate 20 as compared with the thickness d of the reference glass substrate K. At this time,
Figure 112011018591224-pat00021
And
Figure 112011018591224-pat00022
According to the glass substrate may be greater than or less than the thickness (d) of the reference glass substrate (K) may be the same. remind
Figure 112011018591224-pat00023
And
Figure 112011018591224-pat00024
Is an angle of incident light incident from the image sensors 321 and 331 to the glass substrate 20.

The above Equation 1

Figure 112011018591224-pat00025
And
Figure 112011018591224-pat00026
If is obtained, the thickness t of the glass substrate 20 can be obtained as shown in Equation 2 below.

Figure 112010057079564-pat00027

Where

Figure 112011018591224-pat00028
Is a thickness d of the reference glass substrate K, and is a reference value previously stored before measuring the thickness of the glass substrate 20 as a measurement sample.

In Equation 2 above

Figure 112011018591224-pat00029
And said
Figure 112011018591224-pat00030
As shown in Equation 3 below
Figure 112011018591224-pat00031
,
Figure 112011018591224-pat00032
Assume At this time,
Figure 112011018591224-pat00033
,
Figure 112011018591224-pat00034
Since the incident light incident on the glass substrate 20 is constant, it has a constant value.

Figure 112010057079564-pat00035

Substituting Equation 3 into Equation 2 may be arranged as in Equation 4 below.

Figure 112010057079564-pat00036

Where

Figure 112010057079564-pat00037
And
Figure 112010057079564-pat00038
Denotes the amount of change in the position of the laser beam (reflected light) in the image sensors 321 and 331 corresponding to the amount of change in thickness of the sample, and is changed to the thickness change through correction.

If, in the equation (4)

Figure 112010057079564-pat00039
Is assumed to be "0 (zero)",
Figure 112010057079564-pat00040
Only contributes to the sample thickness change. On the contrary,
Figure 112010057079564-pat00041
Is assumed to be "zero",
Figure 112010057079564-pat00042
Only contributes to the sample thickness change.

As described above, in the present invention, the thickness t of the glass substrate 20 is detected by detecting a change amount of reflected light reflected from the upper and lower surfaces of the glass substrate 20 as a sample and incident on the image sensors 321 and 331. It can be simply obtained by the equations (1) through (4).

Therefore, the amount of change of reflected light reflected by the incident light L1 on the upper surface G1 and the lower surface G2 of the glass substrate 20 (

Figure 112010057079564-pat00043
And
Figure 112010057079564-pat00044
), The thickness of the glass substrate 20 can be calculated using the thickness d of the reference glass substrate K stored in advance. This method can measure the thickness of all the measurement objects in the form of a flat plate regardless of the material of the measurement object or transparent and translucent.

17 and 18 are explanatory views for explaining a second method of measuring the thickness of the glass substrate and the thickness of the glass substrate in the 2D code detector.

The second method of measuring the thickness of the glass substrate and the thickness of the glass substrate in the 2D code detector includes one or two upper or lower sides of one side of the glass substrate 20 as shown in FIGS. 17 and 18. The measuring device 320 is provided. The measuring unit 320 is installed in the frame 301, and the joystick 413 is movable in the X-axis, Y-axis and Z-axis direction ± 20 mm to ± 50 mm, respectively. The distance s between the measuring device 320 and the glass substrate 20 is preferably about 20 mm.

As illustrated in FIG. 17, the measuring unit 320 includes a laser oscillator 322 for irradiating incident light L1 to an upper surface G1 (or a lower surface G2) of the glass substrate 20, and the glass substrate ( The first point S1 on which the incident light L1 is reflected on the upper surface G1 (or lower surface G2) of the 20 and the incident light L1 are on the lower surface G2 (or the upper surface of the glass substrate 20). It includes an image sensor 321 for reflecting the second point (S2) reflected by the (G1)} passing through the upper surface (G1) (or lower surface (G2)) of the glass substrate 20 as an image image, When the laser of the laser oscillator 322 is an extended laser, a transmission lens 323 for converting the extended laser into a straight line (dot) laser is further provided inside the measuring device 320.

When the operator 10 starts the thickness measurement by operating the input unit 410 while the glass substrate 20 serving as the measurement sample is placed at the measurement position, the laser oscillator 322 is the control unit 420. It is operated by the to thereby irradiate the incident light (L1) to the upper surface (G1) of the glass substrate 20 inclined by a predetermined angle (θ). As such, when the incident light L1 is irradiated onto the upper surface G1 of the glass substrate 20, the incident light L1 irradiated onto the upper surface G1 of the glass substrate 20 is the upper surface (of the glass substrate 20). The first reflected light L2 directly reflected by G1 and the upper surface G1 of the glass substrate 20 are refracted into the glass substrate 20 and reflected on the bottom surface G2 of the glass substrate 20. Through the second reflected light (L3) refracted to the outside. In this case, the first point S1 on which the incident light L1 is reflected and the second point S2 on which the reflected light L3 passes are brightly displayed on the upper surface G1 of the glass substrate 20.

The image sensor 321 has a first point S1 at which the incident light L1 is reflected on the upper surface G1 of the glass substrate 20, and the incident light L1 is disposed on the bottom surface of the glass substrate 20 ( The separation distance k of the second point S2 reflected by G2 and passing through the upper surface G1 of the glass substrate 20 is photographed as an image image.

The control unit 400 of the measurement terminal 400 automatically processes an image image captured by the image sensor 321 to automatically determine a separation distance k between the first point S1 and the second point S2. Measure Then, the thickness t of the glass substrate 20 is calculated through Equation 5 below.

Figure 112010057079564-pat00045

Here, n is the refractive index of the glass substrate 20 in the atmospheric state,

Figure 112010057079564-pat00046
1 is an incident angle of the incident light L1.

19 and 20 are explanatory diagrams for explaining a third method of measuring the thickness of the glass substrate and the thickness of the glass substrate in the 2D code detector.

The third method of measuring the thickness of the glass substrate and the thickness of the glass substrate in the 2D code detector includes one or two upper or lower sides of one side of the glass substrate 20 as shown in FIGS. 19 and 20. The measuring device 320 is provided. The measuring unit 320 is installed in the frame 301, and the joystick 413 is movable in the X-axis, Y-axis and Z-axis direction ± 20 mm to ± 50 mm, respectively. The distance s between the measuring device 320 and the glass substrate 20 is preferably about 20 mm.

As shown in FIG. 19, the measuring unit 320 includes a laser oscillator 322 for irradiating incident light L1 to the upper surface G1 (or lower surface G2) of the glass substrate 20, and the glass substrate ( The first reflected light L2 reflecting the incident light L1 on the upper surface G1 (or the lower surface G2) of the 20 and the incident light L1 through the glass substrate 20 (G2) {or The screen 324 on which the second reflected light L3 reflected on the upper surface G1} is projected, the point S3 of the first reflected light L2 projected on the screen 324, and the second reflected light L3. It includes an image sensor 321 for taking a point (S4) of the image as an image image, and when the laser of the laser oscillator 322 is an expansion laser, the extension laser is a straight line (point) inside the measuring unit 320 A transmission lens 323 is converted into a laser.

When the operator 10 starts the thickness measurement by operating the input unit 410 while the glass substrate 20 serving as the measurement sample is placed at the measurement position, the laser oscillator 322 is the control unit 420. It is operated by the to thereby irradiate the incident light (L1) to the upper surface (G1) of the glass substrate 20 to be inclined by a predetermined angle (θ). As such, when the incident light L1 is irradiated onto the upper surface G1 of the glass substrate 20, the incident light L1 irradiated onto the upper surface G1 of the glass substrate 20 is the upper surface (of the glass substrate 20). The first reflected light L2 directly reflected by G1 and the upper surface G1 of the glass substrate 20 are refracted into the glass substrate 20 and reflected on the bottom surface G2 of the glass substrate 20. Through the second reflected light (L3) refracted to the outside. In this case, the first point S1 on which the incident light L1 is reflected and the second point S2 on which the reflected light L3 passes are brightly displayed on the upper surface G1 of the glass substrate 20.

Meanwhile, the first reflected light L2 and the second reflected light L3 reflecting the incident light L1 from the glass substrate 20 are projected onto the screen 324 installed inside the measuring unit 320. In this case, a third point S3 on which the first reflected light L2 is formed on the screen 324 and a fourth point S4 on which the second reflected light L3 is projected are the glass substrate 20. Compared to the first point S1 and the second point S2 formed on the upper surface G1 of, it is very clear. Therefore, the controller 420 can more accurately measure the distance between points during image processing.

However, in this method, the positions of the third point S3 and the fourth point S4 are changed according to the position of the screen 324. Therefore, in order to accurately measure the thickness of the glass substrate 20, it is preferable to match the arrangement angle θ2 of the screen 324 with the irradiation angle θ1 of the incident light L1. Accordingly, the directions of the first reflected light L2 and the second reflected light L3 reflected from the glass substrate 20 and the direction of the optical axis of the image sensor 321 for directly photographing the screen 324. Are aligned parallel to each other.

In the image sensor 321, the separation distance x between the point S3 of the first reflected light L2 and the point S4 of the second reflected light L3 projected on the screen 324 is an image image. Shoot.

The control unit 400 of the measurement terminal 400 processes the video image photographed by the image sensor 321 to determine a separation distance x between the first point S1 and the second point S2 below. It calculates by (6).

Figure 112010057079564-pat00047

Substituting Equation 6 into Equation 5, Equation 7 below to calculate the thickness t of the glass substrate 20 can be obtained. As a result, the thickness t of the glass substrate 20 is calculated through Equation 7 below.

Figure 112010057079564-pat00048

Here, n is the refractive index of the glass substrate 20 in the atmospheric state,

Figure 112010057079564-pat00049
1 is an incident angle of the incident light L1, and
Figure 112010057079564-pat00050
2 is the inclination angle of the screen 324.

In the present invention, through the communication network connected to the communication port 432 of the measurement terminal 400, the thickness and 2D code information of the glass substrate 20 measured by the measuring unit 320 can be transmitted to the outside. The thickness of the glass substrate 20 may be measured in a non-contact manner using the laser oscillator 322 and the image sensor 321 disposed on the glass substrate 20, and the glass substrate 20 may be measured. You can freely measure the thickness anywhere.

The plate glass thickness measuring method according to the present invention is not limited to use only for measuring the thickness of the plate glass, it can be applied to measure the plate thickness of the transparent material, of course.

21 is a flowchart illustrating a method of measuring a thickness of a glass substrate and detecting a 2D code according to a preferred embodiment of the present invention.

First, in the present invention, as described with reference to Figure 9, the three seating table 40 seated on the glass substrate 20 rotates the loading and unloading unit 100, the cleaning unit 200, the measuring unit 300 at the same time The present invention provides a glass substrate thickness measurement and two-dimensional code detection system that can simultaneously perform loading and unloading, cleaning, thickness, and 2D code measurement.

The thickness measurement and 2D code detection method of the glass substrate according to the present invention, as shown in Figure 21, after the glass substrate 20 is seated on the seating table 40 of the loading and unloading unit 100 (step S100) by rotating the three seating table 40 at the same time to transfer the glass substrate 20 to the cleaning unit 200 (step S110).

Then, the cleaning unit 200 cleans the glass substrate 20 transferred from the loading and unloading unit 100 (step S120), and then rotates the three seats 40 at the same time. The glass substrate 20 is transferred to the measurement unit 300 (step S130).

Next, after the alignment and vacuum compression of the glass substrate 20 transferred from the cleaning unit 200 in the measuring unit 300 (step S140), a 2D code is found (step S150). At this time, if the 2D code is found (YES in step S150), the measuring unit 300 detects the 2D code of the glass substrate 20, and then measures the thickness of the glass substrate 20 (step S170). If the 2D code is not found (NO in step S150), the joystick 413 finds the 2D code while moving the measuring device 300 along the X and Y axes.

After detecting the 2D code of the glass substrate 20 in the measurement unit 300 and measuring the thickness (step S170), by rotating the three seating table 40 at the same time loading the glass substrate 20 And transfer to the unloading unit 100 (step S180).

Then, the surface of the loading and unloading unit 100 is inspected for foreign matter or the like on the glass substrate 20 and then unloaded the glass substrate 20 (step S190), and the steps S100 to. Step S190 is repeated.

The thickness measurement and 2D code detection system and method of the glass substrate according to the present invention configured as described above are automatically performed simultaneously with loading and unloading, cleaning, 2D code detection and thickness measurement of the glass substrate. By doing so, the technical problem of the present invention can be solved.

Preferred embodiments of the present invention described above are disclosed to solve the technical problem, and those skilled in the art to which the present invention pertains (man skilled in the art) various modifications, changes, additions, etc. within the spirit and scope of the present invention. It will be possible to, and such modifications, changes, etc. will be considered to be within the scope of the following claims.

The thickness measurement and 2D code detection system and method of the glass substrate of the present invention can be used in the industrial field of manufacturing glass wafers, and can be used as a technique for providing standardization related to glass wafer measurement.

10: operator 20: glass substrate or object to be measured
21: cell 22: 2D code
30: rotating shaft 40: rotating seat
41: seating legs 50: safety wall
60: packaged product 100: loading and unloading unit
200: washing unit 300: measuring unit
301: frame 310: XY alignment device
320: thickness measurement of the glass substrate and 2D code detector or upper measuring instrument
321: image sensor or video input
322 laser oscillator 323 transmission lens
324: Screen
330: thickness measurement of the glass substrate and 2D code detector or lower measuring instrument
331: image sensor or video input
332: laser oscillator 333: transmission lens
340: 2D code detector 341: luminaire
342: 2D coded image sensor
400: measuring terminal 410: input unit
411: Keyboard 412: Mouse
413: joystick 420: control unit
430: output unit 431: monitor
432: communication port

Claims (8)

delete In the thickness measurement and 2D code detection system of glass substrate,
A loading and unloading unit 100 for loading and unloading the glass substrate 20, a cleaning unit 200 for cleaning the glass substrate 20, and a 2D code of the glass substrate 20 are detected and thicknessed. The rotating shaft of the center to sequentially convey the glass substrate 20 to the measuring unit 300, the loading and unloading unit 100 and the cleaning unit 200 and the measuring unit 300 to measure simultaneously ( 30 control the operation of the three mounting table 40, the loading and unloading unit 100, the cleaning unit 200, the measurement unit 300 and the seating table 40 rotated by And a measurement terminal 400 which processes the image image captured by the image sensor 321 of the measurement unit 300 and the 2D code to calculate the thickness of the glass substrate 20 and detect the 2D code. ,
The measuring unit 300 is:
Laser oscillator 322 for irradiating incident light L1 to the upper surface G1 of the glass substrate 20, and reflected light L2 reflected from the upper surface G1 of the glass substrate 20 or the glass substrate 20. An upper measuring unit 320 having an image sensor 321 for photographing the points S1 and S2 at which the laser beam is reflected on an upper surface G1 of the upper surface G1;
The laser oscillator 332 irradiates the incident light L1 to the lower surface G2 of the glass substrate 20, and the reflected light L2 reflected from the lower surface G2 of the glass substrate 20 or the glass substrate 20. A lower measuring device 330 having an image sensor 331 for capturing the points S1 and S2 at which the laser beam is reflected on the lower surface G2 of the image; And
2D code image sensor 342 for photographing the 2D code of the glass substrate 20, and the illumination device for irradiating the light to the 2D code portion of the glass substrate 20 during operation of the 2D code image sensor 342 ( 2D code detector 340 with 341;
Thickness measurement and 2D code detection system of the glass substrate comprising a.
The method of claim 2,
When the laser of the laser oscillator (322,332) is an extended laser, the glass further comprises a transmission lens (323, 333) for converting the extended laser into a straight line (dot) laser inside the upper and lower measuring devices (320,330) Substrate thickness measurement and 2D code detection system.
The method of claim 2, wherein the measurement terminal 400 is:
A keyboard 411 and a mouse 412 for inputting an operation command of the thickness and 2D code automatic measurement system, and a joystick 413 for adjusting the X and Y axes of the measurement unit 300 to find the 2D code. An input unit 410;
The thickness of the glass substrate 20 and the 2D code automatic measurement program screen, the monitor 431 for outputting the image image and the 2D code taken by the image sensor 321 on the screen, and measured by the measurement terminal 400 An output unit 430 having a communication port 432 for transmitting and receiving data information through a communication network; And
The loading and unloading unit 100, the cleaning unit 200, the measuring unit 300, and the loading and unloading unit 100 are stored and driven by the thickness and 2D code automatic measurement program. Control unit for automatically controlling the operation of the seat 40, the image sensor 321 and the 2D code image sensor image processing to calculate the thickness of the glass substrate 20 and to measure the 2D code 420;
Thickness measurement and 2D code detection system of the glass substrate comprising a.
The method according to any one of claims 2 to 4,
The thickness and 2D code automatic measurement system is:
In the measurement terminal, by processing the image image taken from the upper and lower portions of the glass substrate 20, the position change amount of the reflected light of the glass substrate 20 as the measurement sample is calculated by Equation 1 below. ,
(Equation 1)
Figure 112011018591224-pat00051

Where
Figure 112011018591224-pat00052
And
Figure 112011018591224-pat00053
Is the thickness variation of the glass substrate 20 as compared with the thickness d of the reference glass substrate K,
Figure 112011018591224-pat00054
And
Figure 112011018591224-pat00055
Is an angle of incident light incident on the glass substrate 20 from the image sensors 321 and 331.)
(Equation 2)
Figure 112011018591224-pat00056

Where
Figure 112011018591224-pat00057
Is the thickness d of the reference glass substrate K.)
The above Equation 1
Figure 112011018591224-pat00058
And
Figure 112011018591224-pat00059
And calculating the thickness t of the glass substrate 20 as shown in Equation 2 above.
In the thickness measurement and 2D code detection method of the glass substrate,
(a) Thickness and 2D code provided with three mounting tables 40 for rotating and simultaneously rotating the loading and unloading unit 100, the cleaning unit 200, and the measuring unit 300 by mounting the glass substrate 20. Providing an automated measurement system;
(b) mounting the glass substrate 20 on a seat 40 of the loading and unloading unit 100;
(c) transferring the glass substrate 20 to the cleaning unit 200 by simultaneously rotating the seating table 40;
(d) cleaning the glass substrate 20 in the cleaning unit 200;
(e) transferring the glass substrate 20 to the measurement unit 300 by simultaneously rotating the seating table 40;
(f) measuring the thickness of the glass substrate 20 after aligning and vacuum-compressing the glass substrate 20 in the measuring unit 300 and simultaneously detecting a 2D code;
(g) transferring the glass substrate 20 to the loading and unloading unit 100 by simultaneously rotating the seating table 40;
(h) unloading and inspecting the appearance of the glass substrate 20 in the loading and unloading unit 100; And
(i) repeating steps (b) to (h);
Thickness measurement and 2D code detection method of the glass substrate comprising a.
The method according to claim 6,
The method of measuring the thickness of the glass substrate 20 in the step (f):
By irradiating a laser beam to the upper and lower surfaces of the glass substrate 20 to calculate the position change of the reflected light reflected from the glass substrate 20 from the following equation 1,
(Equation 1)
Figure 112011018591224-pat00060

Where
Figure 112011018591224-pat00061
And
Figure 112011018591224-pat00062
Is the thickness variation of the glass substrate 20 as compared with the thickness d of the reference glass substrate K,
Figure 112011018591224-pat00063
And
Figure 112011018591224-pat00064
Is an angle of incident light incident from the image sensors 321 and 331 to the glass substrate 20.)
(Equation 2)
Figure 112011018591224-pat00065

Where
Figure 112011018591224-pat00066
Is the thickness d of the reference glass substrate K.)
The thickness t and the 2D code detection method of the glass substrate, characterized in that to obtain the thickness (t) of the glass substrate (20) using the equation (2).
The method of claim 6, wherein the detecting of the 2D code in (f) comprises:
The thickness measurement and 2D code detection method of the glass substrate, characterized in that for detecting the 2D code by image processing the image image photographing the 2D code of the glass substrate.
KR1020100085897A 2010-09-02 2010-09-02 System of 2d code detection and thickness measurement for glass substrate, and method of the same KR101033855B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020100085897A KR101033855B1 (en) 2010-09-02 2010-09-02 System of 2d code detection and thickness measurement for glass substrate, and method of the same
CN201110180119.8A CN102384722B (en) 2010-09-02 2011-06-24 System of 2D code detection and thickness measurement for glass substrate, and method of the same
TW100130033A TWI445919B (en) 2010-09-02 2011-08-22 System of 2d code detection and thickness measurement for glass substrate, and method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100085897A KR101033855B1 (en) 2010-09-02 2010-09-02 System of 2d code detection and thickness measurement for glass substrate, and method of the same

Publications (1)

Publication Number Publication Date
KR101033855B1 true KR101033855B1 (en) 2011-05-16

Family

ID=44365843

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100085897A KR101033855B1 (en) 2010-09-02 2010-09-02 System of 2d code detection and thickness measurement for glass substrate, and method of the same

Country Status (3)

Country Link
KR (1) KR101033855B1 (en)
CN (1) CN102384722B (en)
TW (1) TWI445919B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102818538A (en) * 2012-09-14 2012-12-12 洛阳兰迪玻璃机器股份有限公司 Detection system based on modulated glass thread structure laser image
KR101441439B1 (en) 2013-01-30 2014-09-17 니탄 밸브 가부시키가이샤 Workpiece inspection equipment
KR20170000936A (en) * 2015-06-25 2017-01-04 세메스 주식회사 Apparatus for aligning measuring head of spectroscope
CN109029274A (en) * 2018-08-24 2018-12-18 芜湖凯兴汽车电子有限公司 Portable type measurement unit is used in a kind of processing of plastic plate
KR102558478B1 (en) * 2022-12-05 2023-07-21 (주)에스와이이엔지 Semiconductor wafer thickness meaturing system

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105043291B (en) * 2015-06-01 2017-11-28 杭州朝阳橡胶有限公司 A kind of online scanning means of tyre surface section
TWI509215B (en) * 2015-07-02 2015-11-21 Ta Jen Kuo A high accuracy apparatus and method of photoelectric glass substrate in real-time identification
JP6656200B2 (en) * 2017-04-12 2020-03-04 東京エレクトロン株式会社 Position detection system and processing device
KR102199313B1 (en) * 2018-12-19 2021-01-06 (주) 인텍플러스 Apparatus for inspecting cover glass
CN109515012B (en) * 2018-12-27 2023-06-09 杭州瓦良格智造有限公司 High-temperature glass digital ink-jet printer
CN110986801A (en) * 2019-11-15 2020-04-10 富泰华精密电子（郑州）有限公司 Detection device, detection equipment and detection method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060132289A1 (en) * 2004-12-20 2006-06-22 Stmicroelectronics Sa Electromagnetic transponder with no autonomous power supply

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6132289A (en) * 1998-03-31 2000-10-17 Lam Research Corporation Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
JP3867724B2 (en) * 2004-02-27 2007-01-10 オムロン株式会社 Surface condition inspection method, surface condition inspection apparatus and substrate inspection apparatus using the method
CN100533132C (en) * 2004-09-06 2009-08-26 欧姆龙株式会社 Substrate inspection method and apparatus
JP4389982B2 (en) * 2007-08-09 2009-12-24 オムロン株式会社 Substrate visual inspection device
KR100942236B1 (en) * 2008-04-08 2010-02-16 충북대학교 산학협력단 Measurement error correcting method for the thick of glass panel

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060132289A1 (en) * 2004-12-20 2006-06-22 Stmicroelectronics Sa Electromagnetic transponder with no autonomous power supply

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102818538A (en) * 2012-09-14 2012-12-12 洛阳兰迪玻璃机器股份有限公司 Detection system based on modulated glass thread structure laser image
KR101441439B1 (en) 2013-01-30 2014-09-17 니탄 밸브 가부시키가이샤 Workpiece inspection equipment
KR20170000936A (en) * 2015-06-25 2017-01-04 세메스 주식회사 Apparatus for aligning measuring head of spectroscope
KR102257311B1 (en) 2015-06-25 2021-05-31 세메스 주식회사 Apparatus for aligning measuring head of spectroscope
CN109029274A (en) * 2018-08-24 2018-12-18 芜湖凯兴汽车电子有限公司 Portable type measurement unit is used in a kind of processing of plastic plate
KR102558478B1 (en) * 2022-12-05 2023-07-21 (주)에스와이이엔지 Semiconductor wafer thickness meaturing system
KR102603605B1 (en) * 2022-12-05 2023-11-17 (주)에스와이이엔지 Semiconductor wafer measurement system based on voltage displacement detection

Also Published As

Publication number Publication date
CN102384722B (en) 2014-06-25
TWI445919B (en) 2014-07-21
TW201211500A (en) 2012-03-16
CN102384722A (en) 2012-03-21

Similar Documents

Publication Publication Date Title
KR101033855B1 (en) System of 2d code detection and thickness measurement for glass substrate, and method of the same
TWI413823B (en) Image inspection system for correcting focal position in autofocusing
JP6027673B2 (en) Specular reflection surface shape measurement
KR100709156B1 (en) Inspection equipment
JP5840677B2 (en) Inspection apparatus and method for moving semiconductor wafer
US7499156B2 (en) Closed region defect detection system
US8654353B2 (en) Measuring method for topography of moving specimen and a measuring apparatus thereof
KR101808388B1 (en) Probe apparatus and probe method
CN110044293A (en) A kind of three-dimensional reconfiguration system and three-dimensional reconstruction method
KR102119492B1 (en) Surface defect inspection apparatus
US20090195786A1 (en) Device for inspecting semi-conductor wafers
CN105103027B (en) The measurement of focus and other features in optical system
US6734978B2 (en) Profile measuring method and measurement apparatus using interference of light
US20080291468A1 (en) Apparatus and method for measuring height of protuberances
US10598604B1 (en) Normal incidence phase-shifted deflectometry sensor, system, and method for inspecting a surface of a specimen
JP2017053775A (en) Apparatus for imaging inside of light-transmissive object, and inspection apparatus
CN111398295B (en) Defect detection device and method thereof
JP5240980B2 (en) Three-dimensional measuring device and inspection device
EP3861279B1 (en) Laser triangulation apparatus and calibration method
JP2005069942A (en) Measurement method and device by phase shift method
CN112857264A (en) Simple oblique illumination type color confocal measurement system and detection method
KR20190036320A (en) Film inspection apparatus and film inspection method
TW201105953A (en) Extraneous matter examination system and its method
JPH0519450A (en) Phase shift reticle inspecting device
JPH11183318A (en) Lens inspecting method and its device

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20140530

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20150501

Year of fee payment: 5

LAPS Lapse due to unpaid annual fee