TW201211500A - System of 2D code detection and thickness measurement for glass substrate, and method of the same - Google Patents

Abstract

A system and a method for 2D code detection and thickness measurement of a glass substrate are provided to enable free measurement of the entire glass substrate by a contactless method for measuring the thickness of a glass substrate. A system for 2D code detection and thickness measurement of a glass substrate comprises a loading/unloading unit(100), a washing unit(200), a measuring unit(300), and a mounting unit(40), and a measuring terminal(400). The loading/unloading unit loads and unloads a glass substrate(20). The washing unit washes the glass substrate. The measuring unit detects 2D code of the glass substrate and measures the thickness thereof. The mounting unit is rotated b y a central rotary shaft(30). The measuring terminal automatically controls the operation of the mounting unit. The measuring terminal calculates the thickness of the glass substrates and detects the 2D code.

Description

201211500 VI. Description of the Invention: [Technical Leadership of Invention] [0001] The present invention relates to a thickness measurement of a glass substrate and a two-dimensional code (hereinafter referred to as "2D code,") detection system and method thereof, particularly It relates to a glass substrate thickness measurement and a 2D code detection system and method thereof for automatically performing loading and unloading of a glass substrate, cleaning operation, thickness, and 2D code measurement operation. [0002] A method for measuring the thickness of a glass substrate and a thickness of a glass substrate of a 2D code by means of a broadcast, and a method for detecting a color of a 2D code and a method thereof. ...:=.. .. [Prior Art] [Drawing At present, in the display industry of liquid crystal display (LCD), plasma display (pdp), organic light-emitting diode (0LED), digital camera, camera phone, etc., various glasses are widely used in the form of thinner substrates. In the manufacturing process, among them, glass wafers are mainly used as high-temperature polycrystalline germanium thin film transistor liquid crystal displays (tft_lcd), 〇led, digital cameras, camera phones, etc., which are being developed recently. Optical substrates and materials for optical communication are widely used in fields requiring high quality specifications. [0004] As well as bonding to germanium wafers, microelectromechanical systems (100130033 MEMS), fiber optic devices (fibers) 〇ptics device) microelectromechanical system (MEMS), biopharmaceutical (Bic)_medical) field, micromirror (micr〇_mirr〇r), polarized beam splitters, dichroic filter (dichr 〇ic 卜) substrate, micro glass-block and lens, digital compact disc (MD), continuous data protection (CDp), etc. Form No. A0101 Page 3 / Total 50 pages 1002050922-0 201211500 Glass wafers using various materials in the field of pickup-up prisms, etc. [0005] Such glass wafers are widely used in the fields of the rapidly developing display industry, optical communication, and precision optical components. The industry is an area that can be expected to continue to grow in the future. In order to continue to grow, it is required to continue the correct quality management and quality of the glass wafer. For this reason, it is required to specialize in the glass wafer. The correct evaluation and measurement technique for flatness and thickness variation. [0006] The method for determining the flatness of a glass wafer is to measure a glass wafer placed on a flat plate by a three-dimensional shape measuring instrument. The shape of the upper surface, thereby determining the flatness; and the use of a parallel beam to observe interference fringes of the same or larger than the reference plane of the glass wafer and the upper surface of the glass wafer using a fizeau interferometer, The method of measuring the flatness thereby. [0007] Only the shape of a straight line can be measured by a two-dimensional shape measuring instrument, and in order to obtain a two-dimensional shape, it is necessary to scan the entire area with a three-dimensional shape measuring instrument. Although there are many types of shape measuring instruments, most of them can only measure small areas. To measure glass chips of 200 mm or more, a large measuring instrument is required. However, the larger the analyzer, the lower the accuracy of the measurement and the higher the price. [0008] Fig. 1 is a photograph showing a product of a conventional commercial Fizeau interferometer manufactured to measure the flatness of a flat plate. [0009] Referring to Fig. 1, in order to determine the flatness of the flat plate, at least a reference lens of the same size is required. Therefore, the larger the size of the glass wafer becomes, the larger the device becomes. However, since the measuring device uses a laser beam, 100130033 Form No. A0101 Page 4/50 pages 1002050922-0 201211500 The interference distance is long, so when measuring the glass wafer as a transparent film, the upper surface of the Slope wafer is All interference fringes that occur between the reference surfaces will appear overlapping. Although suitable for the measurement of tantalum wafers, there are problems with the measurement of glass wafers. This problem is a problem in the general commercial Philippine interferometer. [0010] Fig. 2 is a view showing a Verifire MST interferometer of Zygo Corporation and a working principle of the interferometer, and Fig. 3 is a view showing measurement results of measuring a glass wafer by a Verifire MST interferometer of Zygo Corporation. Picture. [0011] Referring to Figures 2 and 3, Zygo's Verifire MST interferometer is an interference that eliminates the problem of overlapping all interference fringes that occur between the lower surface of the glass wafer and the reference surface by using a special algorithm. instrument. The Zygo Verifire MST meter can measure the flatness, thickness variation, and refractive index of the lower surface of a wafer. However, the measurable size (100 Å in diameter) of the Zyg〇 company's Verifire MST interferometer is smaller than the size of the glass wafer, and the thinner the thickness of the glass wafer, the more difficult it is to measure the thickness (the optical Q thickness is at least 1. 2 mm or more). It is measurable, and it is expensive, so it is difficult to use in the industrial sector. [0012] And, the conventional thickness measuring device for measuring the thickness of the sample is typically a micrometer having air for measuring the thickness by ejecting air of a predetermined pressure and using the outflow amount and the pressure change as a medium. A micrometer, or an electric micrometer that measures the thickness using a difference in electromagnetic properties between a coated film or a portion of a plated metal and a substrate. [0013] In the prior art, a micrometer is mainly used to measure the thickness of a glass plate. 100130033 Form No. A0101 1002050922-0 201211500 However, the micrometer measures the thickness of the glass plate according to the contact method, so there is a problem that the polished glass surface is injured or contaminated by interference. [0014] Further, the method for measuring the thickness of the glass plate using the micrometer is based on the measurement method manually by the measurer, so that the measurement operation is cumbersome and the reliability of the measurement value is low. [0015] Hereinafter, the prior art for measuring the shape and thickness of a glass substrate is as follows. [0016] Korean Laid-Open Patent Publication No. 2009-0031 852 (hereinafter referred to as "Prior Art 1") relates to a thickness of a large-area glass substrate which can continuously and rapidly measure the thickness of a large-area disk such as a substrate used for manufacturing a thin film transistor display. Measuring device and method. [0017] This prior art 1 is shown in FIG. 4 as a measuring device including a switching device having two cross-over units and two or more probes, and a control device and evaluation device for measuring transparency. As a device for the thickness of a flat substrate, an apparatus for measuring the thickness of a substrate is disclosed as follows. That is, the exchange unit is fixed with a probe that can move in a direction across the transfer direction of the glass disk on the substrate, the exchange unit can move independently of each other, and the control device controls the action of the exchange unit, The switching unit moves from the one edge position to the edge position on the opposite side in the direction of the substrate transfer direction in the phase of the phase shift, and the evaluation device writes the thickness profile information with reference to the probe data. [0018] Korean Patent Publication No. 2007-0 1 0061 8 (hereinafter referred to as "Prior Art 2") relates to glass substrate 100130033 which is thinned by chemical polishing treatment or the like. Form No. A0101 Page 6 of 50 page 1002050922 -0 201211500 [0019] Ο [0020]

[0021] A plate thickness measuring device for a glass substrate in which a plate thickness is accurately measured at the same time. As shown in FIG. 5, the prior art 2 discloses a flat panel display having the following features as a panel thickness measuring device for accommodating a glass substrate having a thinned glass substrate and measuring a plurality of dots on the glass substrate (Flat Panel Display) A plate thickness measuring device using a glass substrate. That is, the apparatus includes: a plurality of sets of sensors disposed perpendicularly to the transport path for transporting the glass substrate and disposed on the front side and the back side of the glass substrate; and calculating the sense based on an output signal from the sensor a first mechanism for separating the distance between the detector and the surface of the glass substrate; calculating the thickness of the glass substrate in the transport based on the calculated value of the first mechanism and a predetermined distance between the sensors Second institution. Korean Laid-Open Patent No. 0075514 (hereinafter referred to as "Prior Art 3") relates to the use of a non-contact method according to a clock shot to measure not only the surface of a reflexible object with high precision, but also a specular reflection such as glass. The surface of the object takes the accurate reflection angle into consideration, so that the mirror object such as glass is used as an object, and the shape and thickness of the specular object can be simultaneously determined according to the shape and thickness of the non-contact type of the mirror object. The prior art 3 discloses a non-contact type mirror surface shape and a thickness measuring system as shown in Fig. 6 as follows. That is, the laser oscillated according to the laser oscillator is condensed by the lens, and the light reflected according to the mirror surface is again reflected by the objective lens to the beam splitter and then input to the photodetector. The photodetector passes the detection input light. Calculate the light intensity distribution with the information of the shape of the object's roughness or height information. And, for example, 100130033 Form No. A0101 Page 7 / Total 50 Page 1002050922-0 201211500 The essence is transferred to the translation stage of the drive unit (translatl〇n 5 ring 6), then through the objective lens * laser with a predetermined reflection angle Light to the back of the glass mirror 1 The light reflecting the surface passes through the glass mirror and passes through the objective lens and the beam splitter, and returns to the photodetector, thereby being implemented by the knife to analyze the two signals detected by the different methods. The shape and thickness on the same axis of the test object are simultaneously measured. [0024] [0024] Korean Patent No. 086(10) (hereinafter referred to as "Prior Art 4") relates to the optical measurement of the thickness of a flat glass coated with a multilayer film (Thin Fum). Layer "Bou Sui Xu thickness device. The prior art 4, as shown in FIG. 7, discloses a thickness measuring garment for a multi-layer coated glass. The apparatus includes: having an inclined surface-supporting the lower end of the left and right sides of the glass sliding toward the front of the inclined platform; : mounting a fixed means for the support table for supporting the edge position of the left and right sides of the glass in front of the support table; outputting a holographic optical system of the wrong amount when the glass is at the focus; making the hologram The computer system forms a rectangular coordinate moving mechanism for moving the rectangular coordinate with respect to the glass, and programs the computer to process the focus error information received from the holographic optical system to calculate the thickness of the glass. Korean Patent No. 0908639 (hereinafter referred to as "Prior Art 5") relates to a method and apparatus for measuring the shape of a glass wafer by light in a non-contact manner. The prior art 5, as shown in FIG. 8, discloses a method for measuring a shape of a glass wafer, which comprises: a step of irradiating light from a light source to a glass wafer; and for reflecting from a lower surface of the glass wafer First light 100130033 Form No. A0101 Page 8 / Total 50 pages 1002050922-0 [0025] 201211500 ^ and interference fringe generation step of generating interference fringes by overlapping the first light emitted from the reference surface through the lower surface of the glass wafer a step of detecting the generated interference fringes by the meter detecting portion; calculating a flatness of the flat surface of the glass wafer based on the detected interference fringes [0026] However, the prior art discloses The method of measuring the thickness of the object to be tested such as a glass plate, but in order to determine the thickness of the object to be tested, it is necessary to manually set the object to be tested on the measuring device. Therefore, there is a need to spend a lot of work time, and it is inconvenient. The problem of °[〇〇27] and, in the prior art, never mentioned and disclosed simultaneously and automatically handles the loading and unloading of the object to be tested. Shen cleaning operations, two-dimensional code (2D - Code) that a thickness measurement system and method of operation. SUMMARY OF THE INVENTION [0028] In view of the above problems of the prior art, one of the objects of the present invention is to provide a simultaneous automatic loading and unloading, cleaning operation, thickness and two-dimensional code of a glass substrate (hereinafter referred to as "2D" Code") Measurement of the thickness of the glass substrate and the 2D code detection system and method thereof. Another object of the present invention is to provide a thickness measurement and 2D code detecting system and method for a glass substrate which automatically measures the thickness of a glass substrate by means of a laser in a non-contact manner. A further object of the present invention is to provide a thickness measurement and 2D code detection system and method for a glass substrate capable of reading a matrix while using a Trigger Signal of a two-dimensional matrix (Trigger Signal). 100130033 Form No. A0101 Page 9 / Total 50 Page 1002050922-0 201211500 [0031] Another object of the present invention is to provide a thickness measurement and 2D code detection system for a glass substrate capable of accurately measuring the thickness of a plate even if the thickness of the glass substrate is reduced. And its method. The technical problems to be solved by the present invention are not limited to the above-described cases, and other technical problems to be solved which are not mentioned will be clearly understood by those skilled in the art from the following description. [0033] As a means for solving the above technical problems, the thickness measurement and 2D code detection system of the glass substrate provided by the present invention includes: loading and unloading portion for loading and unloading a glass substrate; and cleaning portion 2 for cleaning the glass substrate 2 a measuring unit 3 that detects a 2D code of the glass substrate 20 and measures the thickness; three mounting stages that are rotated according to the central rotating shaft 30; for sequentially loading the loading and unloading unit 100 and the The cleaning unit 200 and the measurement unit 300 simultaneously transfer the glass substrate 20 and the measurement terminal unit 4, and automatically control the loading and unloading unit 100, the cleaning unit 2, the measuring unit 300, and the female unit 40. And performing image processing on the image and the 2D code captured by the first image sensor 321 of the measuring unit 3 to calculate the thickness of the glass substrate 20 and detecting the 2D code. [0034] The measuring unit includes: a first laser oscillator and a first image sensor upper measuring instrument, the first laser oscillator illuminating the upper surface of the glass substrate with incident light, the first image sense The detector reflects the reflected light or the laser beam reflected from the upper surface of the glass substrate as an image on the first reflection point and the second reflection point on the upper surface of the glass substrate; and has a second laser vibrator and a second image a sensor under the sensor, the second laser oscillator illuminates the incident light toward the lower surface of the glass substrate, and the second image sensor reflects the reflected light from the lower surface of the glass substrate or 100130033

Form No. A0101 Page 1 of 50 l〇〇S 201211500 Laser beam is imaged as the first reflection point and the second reflection point on the lower surface of the glass substrate; and has 2D code image sensor and illumination a 2D code detector for capturing a 2D code of the glass substrate, wherein the illumination device is configured to provide illumination to the 2D code portion of the glass substrate when the 21) code image sensor operates [0035] Moreover, the thickness measurement and 2D code detection system of the glass substrate provided by the present invention, when the laser of the first laser oscillator and the second laser oscillator is a diffusion laser, in the upper and lower analyzers The interior also has a first lens and a second lens that convert the diffusion laser into a collimated laser or a spot laser. And the measurement terminal includes: an input unit having a keyboard and a mouse for inputting the operation command of the thickness measurement and the 2D code detection system, and searching by adjusting the axis and the γ axis of the measurement unit a 2D code joystick; an output unit for monitoring H and a material, the monitor outputs a thickness measurement of the glass substrate and a 2D code detection program screen and an image captured by the first image and 2] code on the screen The communication port is configured to transmit and receive data information measured by the measurement terminal device through the communication network; and the control unit 'the control unit stores and drives the thickness measurement and 2d code detection program' and according to the command of the person input through the input unit Automatically controlling the loading and unloading portion, the cleaning portion, the portion, and the mounting table, and image processing the image captured by the first image sensor and 2 weights to calculate the thickness of the glass substrate And detecting the 21) code. [0037] 100130033 and the thickness measurement and 2_detection system perform image recording on the image captured on the upper portion and the lower portion of the glass substrate by the measurement terminal device, and calculate the sample as the measurement sample according to the following relational expression 1 Glass substrate page 11/total 50 page form number A0101 1002050922-0 201211500 [0038] [0040] [0043] 100130033 Page 12 of 50 The positional change of reflected light [Relationship 1] ^ δ x^os θ ^ δ d2 = δ x2cos θ 2 Here, the thickness of the glass substrate when <5 \ and <5 \ is compared with the thickness d of the reference glass substrate G The amount of change, which is the angle of incident light from the first misfirer and the second transducer to the glass substrate. [Relationship 2]

"t a f'OC/Q I 1 2 UT 0 x^os did X〇c〇s Θ 1 2 2 Here, d is the thickness of the reference glass substrate ^. Then, after calculating % and 2 based on the relational expression 1, the thickness t of the glass substrate 2 is obtained by the above-described relationship 2. And, as a means for solving the above problems, the thickness measurement and 2D code detection method of the glass substrate provided by the present invention include: (4) providing a thickness measurement tonne system (4), measuring the degree of material and (9) detecting system with placement a glass base (4) while rotating the loop back to the loading station, the cleaning section, and the three placement stages of the measuring section; (b) the step of placing the glass/plate female to the loading and unloading section; ((1) (4) rotating the female a step of "putting the glass substrate to the cleaning portion; (4) a step of cleaning the glass substrate in the cleaning portion; (e) a step of turning the mounting table to turn the broken plate into a step; (1) After the fixed portion is aligned and vacuum pressed the glass plate, the step of measuring the glass base table and simultaneously detecting the 2D code is determined; (1) simultaneously rotating the security 1002051 201211500 to transfer the glass substrate to the loading and unloading portion Step (h) performing the steps of unloading and visually inspecting the glass substrate at the loading and unloading portion. [0044] And, the method for measuring the thickness of the glass substrate in the step (f) is Calculate towards the glass The positional change amount of the reflected light reflected from the glass substrate by the upper surface and the lower surface of the substrate, [0045] [Relationship 1] 5 < 5 XjCos Θ j δ ά 2 = δ x2cos θ 2 [0046] Here, the 6' and 5d2 are thickness variations of the glass substrate when compared with the thickness d of the reference glass substrate, and the ^^ and ^! are from the first laser

The angle of the incident light incident by the 1 L oscillator and the second laser oscillator toward the glass substrate. [Relationship 2] .......... t=d+ δ άχ+ δ d =d+ δ x cos Θ + 5 x9cos Θ [0048] Here, 'this d is the reference glass substrate G Thickness d. And the thickness t of the glass substrate is determined by the relational expression 2. And the method of detecting the 2D code in the step (f) is to detect the 2D code by performing image processing on the image of the 2D code of the glass substrate. According to the above description, the mounting and unloading of the glass substrate, the cleaning operation, the thickness and the 2D code measurement operation are automatically performed at the same time as the present invention, which can greatly reduce the working time and improve the work efficiency. [0052] [Because of the use of the first laser oscillator 100130033 disposed on the upper portion of the glass substrate 20 Form No. A0101 Page 13 of 50 1002050922-0 201211500 [0054] [0055] [0056] Automatically set glass The substrate number is used to determine the thickness [0057] [0059] 100130033 The yummy 322 and the first-image sensor are determined to break the thickness of the non-contact type soil measuring board, so The location of all the glass substrates is not limited to a specific location. The problem of being exposed or contaminated from the polished glass surface, and having the heat on the right side, and having a thickness (five) to make the operation become automated, and the accuracy of the thickness measurement operation is greatly improved. The thickness of the laser can be utilized in a non-contact manner, and the effect of reading the matrix can be obtained by using the trigger signal of the two-dimensional matrix. The effects of the present invention are not limited to the above, and those skilled in the art can clearly understand the other effects that are not mentioned. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention can be embodied in various different forms and is not limited to the embodiments described herein. Further, in order to clearly explain the present invention, the parts that are not related to the description are omitted in the drawings, and the same reference numerals will be given to the like parts throughout the specification. Hereinafter, specific technical contents to be implemented by the present invention will be described in detail with reference to the accompanying drawings. <Measurement of thickness of glass substrate and two-dimensional code detecting system> Referring to Fig. 9 and Fig. 10, respectively, the thickness measurement of the glass substrate and the composition of the two-dimensional code detecting system of the preferred embodiment of the present invention are respectively Diagram and design drawings. Form No. A0101 Page 14/Total 50 Page 1〇〇201211500 LU_" As shown in Figs. 9 and 10, the thickness measurement and the two-dimensional code of the glass substrate according to the present invention (hereinafter referred to as "2D code,") The detecting system includes: a loading and unloading unit for loading and unloading the glass substrate 20; a cleaning unit 200 for cleaning the glass substrate 20; and a measuring unit 300 for measuring the thickness of the glass substrate 2 and the 2] code; The three mounting stages 40 are disposed on the central rotating shaft 3〇 and are rotated for sequentially transferring the glass substrate 2 to the loading and unloading unit 1 and the cleaning unit 200 and the measuring unit 300; The machine 400 automatically controls the loading and unloading unit 1〇〇, the cleaning unit 2〇〇, the measuring unit 300, and the setting unit 4〇, and the first 'shirt image feeling of the measuring unit 3 The image taken by the detector 3 21 (refer to the first image sensor 321 of FIG. 15) and the 2D code are subjected to image processing to calculate the thickness of the glass substrate 20 and detect the 2D code, [0061]

G The measurement terminal 400 includes an input unit 41A having a keyboard 411 and a mouse 412 for inputting an operation command of the thickness measurement and 2D code detection system, and by adjusting the measurement unit 3 The X-axis and the γ-axis search for the 2D code joystick 413; the monitor 431 and the communication port 432 output portion 430'. The monitor 431 outputs the thickness of the glass substrate 20 and the 2D code detection program screen. And the image and 2D code captured by the first image sensor 321 are used to transmit and receive the information information measured by the measurement terminal 400 through the communication network; the control unit 420 stores and drives the information The thickness measurement and the 2D code detection program automatically control the loading and unloading unit 100, the cleaning unit 2000, the measuring unit 300, and the placement table 40 according to a command input through the input unit 410. The image is processed by the first image sensor 321 and the 2D code is used to calculate the thickness of the glass substrate 2 and detect the 2D code. 100130033 Form No. A0101 Page 15 / Total 50 pages 1002050922-0 201211500 [0062] / Loading and Unloading Unit 1QQ is to load the glass base of the thickness of the work to the side of the table, and to the measuring unit. 3〇〇The thickness and the 2D horse's sloping glass substrate 2〇 are unloaded and inspected for appearance. The load carrying and unloading 100 is provided with a material (glass substrate) hanging rod and a light which can check foreign matter or the like before unloading the glass substrate 20. — when the equipment is unloaded and unloaded, when the handle member 1 () places the handle substrate on the placement table 40 (or when the measurement command is entered by the input portion 410 of the measurement terminal 400), the placement table 40 automatically rotates, and the glass earth plate 20 is transferred to the cleaning unit 2q. At this time, as shown in Fig. 9, the arrangement σ 40 is composed of two to be respectively located at the loading and unloading portion 1 and the π washing.卩200 and the measuring unit 3〇〇, and the three mounting tables 4〇 are simultaneously rotated according to the red shaft 3〇 placed at the center, thereby rotating the loop around the loading and unloading unit 1〇〇 and the cleaning unit 2〇〇 and the measurement unit. The side of the mounting table 40 is connected to the rotating shaft 30, and the other side of the mounting table 40 is formed in a fork shape in which the seating portions 41 are formed at predetermined intervals. The cleaning unit 2GG performs an operation of cleaning the glass substrate 20 that has just been transferred from the loading and unloading. After the cleaning operation is completed, the glass substrate 20 is transferred from the cleaning unit 2 to the measuring unit 3 according to the rotation of the mounting table 40. When the glass substrate 2 is transferred from the cleaning unit 200, the measuring unit 300 first aligns the X-axis and the x-axis of the glass substrate 20 in accordance with the X-axis and γ-axis aligning means 31A. And in the measuring unit 3, the 2D code is searched by the (9) code detector 340. At this time, if the 21) code is not found, the operator 10 uses the joystick 413 to shift the 2D code detector 34 to the X-axis and the γ-axis by 1002050922- to search for the 2D code. If the 2D code is found, then the 2D code detector 100130033 Form No. A0101 Page 6 / Total 50 pages 201211500 3 4 0 The 2 D Ma is taken as an image and taken by the control unit 4 2 〇 image processing The image of the 2D code to detect the 2D code. At this time, the detection method of the 2D code is a well-known technique, and the principle will not be described in detail herein. When the 2D code detector 340 captures the 2D code, the measuring unit 3 自动 automatically measures the thickness of the glass substrate 2 by the upper measuring instrument 3 20 and the lower measuring instrument 3 30 . In this case, a method of measuring the thickness of the glass substrate 2 will be described in detail in Figs. 15 to 20 which will be described later. [0067] When the measuring portion 300 completes the thickness of the glass substrate 2 and the 2D code measurement, the mounting table 40 automatically rotates to transfer the glass substrate 2 to the loading and unloading portion 100 〇 ' [0068] In the loading and unloading unit 100, the worker 1 visually inspects the glass substrate 20 transferred from the measuring unit 300 by visual inspection (unloading foreign matter, etc.) and then unloads 'the new one to be measured. The glass substrate 2 is loaded onto the mounting table 40. [0069] Thus, the thickness measurement of the glass substrate and the 2D code detection system according to the present invention can greatly shorten the operation time by simultaneously performing the loading and unloading of the glass substrate 20, the cleaning operation, the thickness, and the 2D code measurement operation. And the advantages of improving work efficiency. <Configuration Example of Measurement Unit 300> [0071] Referring to Fig. 11 is a configuration diagram of the measurement unit 300 shown in Fig. 9 and Fig. 1 of the present invention. [0072] As shown in FIG. 11, the measuring unit 300 includes: a first laser oscillator 100130033, a form number A0101, a 17th page, a total of 50 pages, 1002050922-0201211500 322, and a first image sensor 321 upper measuring instrument. 320. The first laser oscillator 322 illuminates the incident surface light G1 toward the upper surface G1 of the glass substrate 20. The first image sensor 321 reflects the reflected light L2 or the laser beam from the upper surface G1 of the glass substrate 20. The points SI, S2 reflected on the surface gi of the glass substrate 2 are taken as images; the second laser oscillator 332 and the second image sensor 331 are below the analyzer 330, and the second laser oscillator 332 faces The lower surface G2 of the glass substrate 20 illuminates the incident light L1, and the second image sensor 331 reflects the reflected light L2 or the laser beam reflected from the lower surface of the glass substrate 2 on the glass substrate 2 The points S1 and S2 reflected by the lower surface G2 are taken as images; the 2D code detector 340 having the 2D code image sensor 342 and the illumination device 341 is used to capture the 2D code of the glass substrate 20. The illumination device 341 is used in the 2D code image sensor 342 Broken glass toward the substrate when making the 2〇 2]) code portion to provide illumination. &lt;Measurement Position and 2D Code Position> Referring to Fig. 12, it is a view showing the measurement position and the 2D code position of the glass substrate 2 of the present invention. In the glass substrate 20, as shown in Fig. 12, a plurality of wafers 21 are arranged in the form of a matrix, and 21) codes 22 are formed on the outer corner of the wafer 21. Here, B refers to the thickness measurement position of the upper analyzer 320, and c refers to the sealing position (measurement pitch) of the upper analyzer 32. The 2D code 22 is a planarized 2D code in which data is arranged in two axes (X direction, γ direction), and the 2D code 22 is a lot number, a pre-order number, a receiver, and the number of other packages such as a shipping package for ships. Information, etc. 100130033 Form No. A0101 Page 18/Total 50 Page 1002050922-0 201211500 Contents are used in the category of Malay - not attached to the object or accompanying the object, when the material moves along with the movement of the object It can be said that the 2D code 22 is represented by a two-dimensional symbol (symbol), and it can be re-entered without hitting the keyboard in other computer systems. The advantage of the 2D code 22 is that a label (symb^) can contain large-capacity data 'capable of representing more data in a narrower area in a narrower area; space utilization is very high; even if it is symbolized The ability to recover from damage caused by contamination or damage can also be recovered by detecting errors, and the black and white element is not limited to the edge, so it is easy to print and read the symbol, and can be multi-directionally Read the symbol; it can represent all foreign languages including Korean and graphic information. The 2D code 22 is roughly classified into a stacked barcode (Matrix) and a matrix code (Matrix) according to the method of % data.

Code). [0078] The glass substrate 20 measured in the thickness measurement of the glass substrate and the two-dimensional flaw detection system may be at least 600 x 406 mm to a maximum of 699. 6 x ❹ 440 mm, but is not limited thereto. The thickness measurement and two-dimensional code detection system can measure all of the transparent and translucent material glass substrates 2, and in addition to the glass substrate 20, the thickness of the transparent or translucent material of other materials can be measured. &lt;First Embodiment of Thickness Measuring Instrument&gt; [0〇8〇] Refer to Fig. 13 and Fig. 14 for details of the thickness measuring instrument of the glass substrate A perspective view and a cross-sectional view of an embodiment. In addition, please refer to Fig. 15, which is an explanatory diagram of the internal structure and the thickness measuring method of the thickness measuring instrument of the glass substrate, which is the invention of the glass 100130033, the form number A0101, the 19th page, the 50th page, the 1002050922-0201211500 glass substrate. . [0081] The first embodiment of the thickness measuring instrument for the glass substrate, as shown in FIGS. 13 to 15, has one or more upper and lower portions on one side and the lower portion of the glass substrate 20, respectively. The analyzers 32, 330. The upper and lower measuring instruments 320, 330 are formed in the frame 301 so as to be vertically symmetrical and parallel. The distance s between the upper and lower measuring instruments 320 and 330 and the glass substrate 20 is preferably about 2 〇. The upper and lower measuring instruments 32A and 33B are respectively provided with the first laser oscillator 322 that irradiates the incident light L1 toward the upper surface G1 or the lower surface G2 of the glass substrate 20 as shown in FIG. And the second laser oscillator 332 and the reflected light L2 reflected from the upper surface G1 or the lower surface G2 of the glass substrate 20 or the point where the laser beam is reflected on the upper surface G1 or the lower surface G2 of the glass substrate 2 S2 is taken as the first image sensor 321 and the second image sensor 3 31 of the image. And the upper and lower measuring instruments 3 2 0 and 3 3 0 further have therein to convert the diffusion laser into a laser when the lasers of the first laser oscillator 322 and the second laser oscillator 332 are diffused lasers. A direct laser or a spot laser passes through the lenses 323, 333. [0083] Examples of the basic specifications of the upper and lower analyzers 320, 330 are as follows: Table 1 [0084] [Table 1] Accuracy ± 2 μιη Measurement time (glass thickness + 2D code) Head and head within 1 second Measure the object between about 20 minutes Form No. A0101 Page 20 / Total 50 Page 1002050922-0 100130033 201211500 Distance ^_ Measurement object thickness measurement area ---___ Thickness measurement position Laser -~~__ Measurement data -------- --- System head size 〇 · 2~1. 5mra~~~~ — Red light visible in the center, 1 mw computer automatic recording and processing 250x70x120 (mm3) Ο [〇〇86]<Measurement of the thickness of the glass substrate A Method [0088] Referring to Figure 16, it is an explanatory view of a first method for measuring the thickness of a glass substrate by a thickness measuring instrument for a glass substrate of the present invention. As shown in FIG. 16, the first method for measuring the thickness of the broken substrate by the thickness measuring instrument of the glass substrate is when the first laser oscillator 322 and the second laser oscillator 332 face the glass substrate 20 When the surface and the lower surface respectively illuminate the incident light, the incident light is on the upper surface of the glass substrate 20 and

The lower surface reflects 'and the reflected light is output to the first image sensor 321 and the second image sensor 331. At this time, the first image sensor 32 and the second image sensor 331 respectively image the reflected light incident on the glass substrate 20 and reflected by the transmission surface as The image 'the measurement terminal 400 ° &lt; ^ 21 and the second [0089] the measurement terminal 400 respectively performs image processing on the image captured by the first image sensor according to the image sensor 331 described below. \The lower surface inverse relationship 1 is calculated from the surface of the glass substrate 20, respectively, 1 〇〇 2 〇 5 〇 922 Ό 100130033 Form No. A0101 Page 21 / Total 50 pages 201211500 shot and incident on the first image sensor 3 21 and the amount of change in reflected light of the second image sensor 331. [Relational expression 1] 5 d}= ά XjCos θ } δ d2= δ x2cos θ 2 Here, the ratio d· and Jd are compared with the thickness d of the reference glass substrate G. The thickness variation of the substrate 20. In this case, the d and d may be larger or smaller than the thickness of the reference glass substrate G depending on the glass substrate, and may be the same as the thickness d of the reference glass substrate g. The θ and 0 are angles of incident light incident from the first laser vibrator 322 and the second pyroelectric vibrator toward the 2 glass substrate 20. [0092] According to the relational expression 1, the thickness and the thickness of the far-glass substrate 2〇 can be obtained by the following relational expression 2. [0093] [Relationship 2] t=d+ δά^ δ d2=d+ δχ cos0 A δ x cos θ 1 ώ 2 Here, the thickness d of the reference glass base is used as a reference value for storage before the thickness of the glass substrate 20 as the measurement sample. [0095] It is assumed in the relationship 2 that % and the (10)' are A and B as shown in the following section 3. At this time, 'the incident light of the incident on the glass substrate 2 is one, so the Λ and B have a certain value. [0096] [Relationship 3] A=cos Θ j B = cos θ 2 100130033 Form number Α0101 Page 22 of 50 page 1002050922-0 Ο !_』,?〇 When the relationship 3 is substituted into the relationship In the case of Equation 2, the truth is as follows [0098] Relation 4 [Relationship 4] t=d+5d1+&lt;5d=d + A5Xl+B^x2 1 u [0099] Here, the Ah and The amount of change in the position of the laser beam (reflected light) in the first image sensor 331 and the second image sensor 331 corresponding to the thickness variation of the sample is changed by the compensation to the thickness variation amount. 〇 1〇〇] If, in the relation 4, the Β5χ2 is assumed to be “Zero”, only the 5~ influence on the thickness variation of the sample. On the contrary, if the Λδχ is assumed to be ‘‘〇 (zero),’, then only the 65\ has an effect on the thickness of the sample. In the present invention, the first image sensor 321 and the second image sensor 331 are incident on the surface and the lower surface of the glass substrate 20 as samples. The amount of change in the reflected light can be simply obtained by determining the thickness t of the glass substrate 20 based on the relational expression 1 to the relational expression 4. Therefore, if the amount of change (<5d and (5d)) of the reflected light reflected by the incident light L1 on the upper surface of the glass substrate 2 and the lower surface G2 is known, the reference glass substrate stored in advance can be utilized. The thickness d of G is used to calculate the thickness of the glass substrate 20. This method is independent of the material of the object to be tested or transparent and translucent, and the thickness of all the objects to be tested can be determined. [0103] &lt;Measurement of glass substrate Second Method of Thickness&gt; 100130033 Form No. A0101 Page 23/Total 50 Page 1002050922-0 201211500 [0104] Please refer to FIG. 17 and FIG. 18, which are diagrams for describing the thickness of the substrate by the glass. An explanatory diagram of a second method for measuring the thickness of a glass substrate by a measuring instrument. [0105] A second method for measuring the thickness of a glass substrate by the thickness measuring instrument of the glass substrate is as shown in FIGS. 17 and 18, and the glass substrate 20 is shown. One of the upper portions or the lower portion is provided with one or more upper measuring instruments 320. The upper measuring instrument 320 is disposed on the frame 301, and is movable by ±20 mm in the X-axis and the Y-axis and the Z-axis direction according to the operating lever 413. ±50mm. The distance s between the measuring instrument 320 and the glass substrate 20 is preferably about 20 mm. [0106] As shown in FIG. 17, the upper measuring instrument 320 includes a first laser oscillator 322 facing the glass substrate 20 The surface G1 (or the lower surface G2) illuminates the incident light L1; the first image sensor 321, the first point S1 of the incident light L1 reflected on the upper surface G1 (or the lower surface G2) of the glass substrate 20 and the The incident light L1 is reflected from the lower surface G2 (or the upper surface G1) of the glass substrate 20 and is imaged as an image through the second point S2 of the upper surface G1 (or the lower surface G2) of the glass substrate 20. The upper meter 320 Further, when the laser of the first laser oscillator 322 is a diffused laser, the diffused laser is converted into a collimated laser or a spotted laser through the lens 323. [0107] The glass substrate 20 as the measurement sample is placed on In the state where the position is measured, when the operator 10 operates the input unit 410 to start measuring the thickness, the first laser oscillator 322 operates according to the control unit 420 to incline the incident light L1 by a predetermined angle 朝 toward the glass substrate. 20 above the surface G1 illumination. When the incident light L1 is irradiated onto the upper surface G1 of the glass substrate 20, the incident light L1 irradiated toward the upper surface G1 of the glass substrate 20 is divided into the first reflected light L2 directly reflected on the upper surface G1 of the glass substrate 20 and To the glass 100130033 Form No. A0101 Page 24 / Total 50 Page 1002050922-0 201211500 The internal refraction of the substrate 20 is reflected on the lower surface of the glass substrate 20 and is refracted toward the outside through the upper surface G1 of the glass substrate 2 Reflected light L3. At this time, on the upper surface G1 of the glass substrate 20, the first point S1 reflected by the incident light L1 and the second point S2 reflected by the reflected light L3 are displayed brighter [0108] The first image sensor 321 The first point S1 of the incident light L1 reflected on the upper surface G1 of the glass substrate 20 and the incident light L1 are reflected on the lower surface G2 of the glass substrate 20 and pass through the second point S2 of the upper surface G1 of the glass substrate 20. The distance k between them is taken as an image.控制[0109] The control unit 420 of the measurement terminal 400 performs image processing on the image captured by the first image sensor 321 to automatically measure the separation distance between the first point Si and the second point S2. . Then, the thickness t of the glass substrate 20 is calculated by using the following relational expression 5 as a medium. [Relationship 5] t=^XkXtan[sin J(nXsin(90 — Θj))] Ο [0111] Here, the π is the refractive index of the glass substrate 20 in an atmospheric state, and the θ 1 is The incident angle of the incident light L1. &lt;Third Method of Measuring Thickness of Glass Substrate&gt; [0113] Referring to FIG. 19 and FIG. 20, it is a description of the thickness of the glass substrate measured by a thickness gauge of a glass substrate. An illustration of the third method. [0114] Third party 100130033 for measuring the thickness of the glass substrate by the thickness gauge of the glass substrate Form No. 1010101 Page 25/Total 50 1 1002050922-0 201211500 As shown in Figs. 19 and 20, on the glass substrate 2 One or more upper gauges 32〇 are provided on one of the upper side or lower side of the crucible. The upper meter 3 2 06 is again placed in the frame 3 01, and can be moved by ±2〇mm~±5〇mm in the direction of the χ axis and the Y axis and the Z axis, respectively, according to the joystick 41 3 . The distance s between the upper measuring instrument 320 and the glass substrate 20 is preferably about 2 〇 mm. [0115] As shown in FIG. 19, the upper analyzer 320 includes a first laser oscillator 322 that illuminates the incident light L1 toward the upper surface G1 (or the lower surface G2) of the glass substrate 20; the screen 324 projects the incident The first reflected light [2] of the light L1 reflected on the upper surface G1 (or the lower surface G2) of the glass substrate 20 and the second reflection of the incident light L1 reflected by the glass substrate 2 on the lower surface G2 (or the upper surface G1) The light L3; the first image sensor 321 captures a point S3 of the first reflected light L2 projected to the screen 324 and a point S4 of the second reflected light L3 as an image. When the laser of the first laser oscillator 322 is a diffused laser, the upper measuring instrument 320 further includes a transmissive lens 323 which converts the diffused laser into a collimated laser or a spot laser. [0116] When the glass substrate 20 of the measurement sample is placed at the measurement position, when the worker 10 operates the input unit 410 to start measuring the thickness, the first laser oscillator 322 operates according to the control unit 420. The incident light L1 is irradiated to the upper surface G1 of the glass substrate 2 by tilting the incident light L1 by a predetermined angle 0. When the incident light L1 is irradiated onto the upper surface G1 of the glass substrate 20, the incident light L1 irradiated toward the upper surface G1 of the glass substrate 20 is divided into the first reflected light L2 directly reflected on the upper surface G1 of the glass substrate 20. And a second reflected light L3 that is refracted toward the inside of the glass substrate 20 and is reflected on the lower surface of the glass substrate 20 and refracted toward the outside through the upper surface G1 of the glass substrate 20. At this time, on the upper surface G1 of the glass substrate 20, the incident light L1 reflects 100130033. The first point S1 of the form number A0101 page 26/50 pages 1002050922-0 201211500 and the reflected light L3 are displayed through the second point S2. Brighter 0 [0117] 〇[0118] 〇[0119] [0120] In addition, the incident light L1 is reflected on the glass substrate 20 and the first reflected light L2 and the second reflected light L3 are projected to the setting. The screen 324 inside the upper meter 320. At this time, the third point S3 formed by the projection of the first reflected light L2 on the screen 324 and the fourth point S4 generated by the projection of the second reflected light L3 are formed on the glass substrate 20 The first point S1 and the second point S2 of the upper surface G1 are more apparent. Therefore, the control unit 420 can more accurately measure the distance between the points when performing image processing. However, the position between the third point S3 and the fourth point S4 will change with the position of the screen 324. Therefore, in order to accurately measure the thickness of the glass substrate, it is preferable to make the set angle 02 of the screen 324 and the irradiation angle of the incident light L1. Therefore, the direction of the first reflected light L2 and the second reflected light L3 reflected from the glass substrate 20 are arranged in parallel with each other in the direction of the optical axis of the first image sensor 321 directly capturing the screen 324. . The first image sensor 321 captures the distance X between the point S3 of the first reflected light L2 projected on the screen 324 and the point S4 of the second reflected light L3 as an image. The control unit 420 of the measurement terminal unit 4 performs image processing on the image captured by the first image sensor 321 and calculates the interval between the first point S1 and the second point S2 according to the following relational expression 6. Distance X. 100130033 [Relationship 6] Form No. A0101 Page 27/Total 50 Page 1002050922-0 [0121] 201211500 κ= XX sine ---------sin(18〇^(Qi + 02)) [0122] [0128] [0128] 100130033 By substituting the above relational expression 6 into the above-described number relational expression 5, the relational expression 7 below the thickness t of the glass substrate 20 can be calculated. Thus, the thickness t of the glass substrate 20 is calculated by using the following relational expression 7 as a medium. [Relationship 7]

(nX 8111(90-6^)] ΧΧβίηθ! ., two Xtanisin 8111 (180-(0^02)) Here, η is the refractive index of the glass substrate 2〇 in the atmospheric state, which is The incident angle of the incident light L1, which is the tilt angle of the screen 324. In the present invention, the glass substrate measured by the upper meter 320 can be measured by a communication network connected to the communication port 432 of the measurement terminal 400. The thickness of the 20 and the 2 D code information are transmitted to the outside. And the first laser oscillator 322 disposed on the upper portion of the glass substrate 20 and the first image sensor 321 can be used to measure the glass substrate in a non-contact manner. The thickness of each of the glass substrates 20 can be freely measured. The method for measuring the thickness of the glass plate according to the present invention is not limited to the thickness measurement of the glass plate, and is obviously applicable to the measurement. Thickness of sheet material of transparent material. &lt;Measurement of thickness of glass substrate and method for detecting 2D code&gt; Refer to Fig. 21, which is a measurement of thickness of a glass substrate and a method of detecting a 2D code according to a preferred embodiment of the present invention. Flow chart. No. A0101 Page 28 / Total 50 pages 1002050922-0 201211500 Liuzy" [0130] Ο [0133] First, as shown in FIG. 9, the present invention provides a glass for arranging When the three other mounting stages 40 of the substrate are simultaneously rotated and recirculated in the loading and unloading unit 1 , the cleaning unit 200, and the measuring unit 300, the thickness measurement of the loading and unloading, cleaning, thickness and 2D code measurement can be simultaneously performed. The two-dimensional code detecting system 厚度 the thickness measurement of the glass substrate according to the present invention and the 21) code detecting method are as shown in FIG. 21, after the glass substrate 20 is placed on the mounting table 4 of the loading and unloading unit 1 (step S100), the three placement stages 4 are simultaneously rotated to transfer the glass substrate 20 to the cleaning unit 2 (step sii). Then, after the cleaning unit 200 cleans the glass substrate 20 transferred from the loading and unloading unit 1 (step S12A), the three placement stages 40 are simultaneously rotated to transfer the glass substrate 2 to the The measuring unit 3 () (step S130). Then, after the measurement unit 300 is aligned and vacuum-presses the glass substrate 20 transferred from the cleaning unit 2 (step sl14), the code is searched for (10) (step S150). At this time, when the 2D code is found (YES in step s15), after the upper measuring instrument 320 detects the 2j) code of the glass substrate 2, the thickness of the glass substrate 20 is measured (step s17), when When the 2D code is not found (NO in step S150), the upper measuring instrument 320 is moved toward the X-axis and the γ-axis by the joystick 413 to search for the 2] code. The measuring unit 3 detects the After the glass substrate 2 is 21) coded and the thickness is measured (step S170), the three placement stages 4 are simultaneously rotated to transfer the glass substrate 20 to the loading and unloading unit 100 (step S180). Then, The loading and unloading unit 1 〇〇 whether the glass substrate 2 is adhered to 100130033 Form No. A0101 Page 29 / Total 50 pages 1002050922-0 201211500 Visual inspection of foreign matter, etc., and then unloading the glass substrate 2 (step S190) ' This step S100 to step si9〇 is repeated. [0136] The thickness measurement of the glass substrate and the 2] code detection system and method thereof according to the present invention can be automatically loaded and unloaded at the same time, and the first operation is performed. , 2D code detection and thickness measurement The technical problem of the present invention is solved by the above-described preferred embodiments of the present invention, which are disclosed in order to solve the technical problem, and if it is a person having ordinary knowledge (technician) in the technical field of the present invention, Various modifications, changes, additions and the like are made within the spirit and scope of the invention, but such modifications and the like should be considered as falling within the scope of the claims. The thickness measurement and 2D code detection system of the glass substrate of the present invention The method can be applied to the industrial field of manufacturing glass wafers, and can be applied as a technology for providing standardization of glass wafer measurement. [Simplified Schematic] FIG. 1 is a conventional commercial Fizo interference for measuring flatness of a flat plate of the present invention. Photograph of the product of the instrument; Fig. 2 is a diagram showing the operation of the Zyg〇 company's Ver iF ire MST interferometer and the working principle; and Fig. 3 is the VeriFire MST interferometer of the Zyg〇 company shown in the present invention. A graph for measuring the measurement results of the broken wafer; FIG. 4 is a configuration of the thickness measuring device for the large-area glass substrate according to the prior art of the present invention. Figure 5 is a structural diagram of a thickness measuring device for a sloping substrate according to the prior art; 100130033 Form No. A0101 Page 30 of 50 1002050922-0 201211500 Figure 6 is based on the present invention. The technical diagram of the shape and thickness measurement system of the mirror object according to the non-contact method of laser; FIG. 7 is a structural diagram of the thickness measuring device of the multilayer film-coated glass according to the prior art of the present invention; FIG. 9 is a structural diagram of a glass wafer shape measuring apparatus according to the prior art; FIG. 9 is a thickness measurement and a two-dimensional code (hereinafter referred to as "2D code") detection of a glass substrate according to a preferred embodiment of the present invention. System composition diagram

Fig. 10 is a plan view showing a thickness measurement and a 2D code detecting system of a glass substrate according to the present invention; and Fig. 11 is a measuring portion 3 shown in Fig. 9 and Fig. 1 of the present invention. FIG. 12 is a view showing the measurement position and position of the glass substrate 2 of the present invention; FIG. 13 is a first embodiment of the thickness gauge of the glass substrate schematically shown in the present invention. Fig. 14 is a cross-sectional view showing a first embodiment of a thickness measuring instrument for a glass substrate according to the present invention; and Fig. 15 is a thickness measuring instrument for explaining a glass substrate of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 16 is an explanatory view showing a first method for measuring the thickness of a glass substrate by a thickness measuring instrument for a glass substrate; FIG. 7 and FIG. The following is a description of a second method for determining the thickness of a glass substrate by a thickness measuring instrument for a glass substrate according to the present invention. 图 · Fig., 100130033 Form No. Ι0Ι01 Page 31/Total 50 Page 1002050922-0 201211500 Fig. 9 And 2nd 0 is an explanatory view for explaining a third method for measuring the thickness of a glass substrate by a thickness measuring instrument for a glass substrate, and FIG. 21 is a glass according to a preferred embodiment of the present invention. The working flow chart of the thickness measurement of the substrate and the 2D code detecting method. [Description of main component symbols] [0137] 1 〇: operator; 20: glass substrate; 21 · wafer, 22: two-dimensional code (hereinafter referred to as "2D code") (code); 30: rotary axis; 40: rotation Placement table; 41: Placement section; 50: Safety wall; 60: Packaged product; 100: Loading and unloading section; 200: Cleaning section; 300: Measuring section; 301: Frame; 310: X-axis and Y-axis alignment device; 320: glass substrate upper measuring instrument; 321 : first image sensor; 322: first laser oscillator; 323: first lens; 324: screen; 330: glass substrate lower measuring instrument; 100130033 Form No. A0101 Page 32 of 50 1002050922-0 201211500 331: Second Image Sensor; 332: Second Laser Oscillator; 333: Second Lens; 340: 2D Code Detector; 341: Illumination Device; : 2D code image sensor; 400: measurement terminal; 410: input; 411: keyboard; 412: mouse; 413: joystick; 420: control; 430: output; 431: monitor; Communication 埠; B: thickness measurement position of the glass substrate upper measuring instrument 320; C: glass substrate The sealing position of the measuring instrument 320 (measuring pitch); G: reference glass substrate; G1: upper surface of the glass substrate 20; G2: lower surface of the glass substrate 20; L1: incident light; L2: first reflected light; L3: Second reflected light; 51: a reflected point of the first reflected light L2 reflected to the upper surface G1; 52: a reflected point of the second reflected light L3 reflected to the upper surface G1; 53: a point at which the first reflected light L2 is projected onto the screen 324 100130033 Form No. A0101 Page 33 of 50 1002050922-0 201211500 s4: Point of projection of the second reflected light L3 to the screen 324; d: Thickness of the reference glass substrate G; k: Reflection of the first reflected light L2 to the upper surface The distance between the reflection point si of G1 and the reflection point S2 of the reflection light L3 reflected to the upper surface G1. t: the thickness of the glass substrate 20; a reflected light L3 X: the first reflected light L2 is projected onto the screen The distance between the point S3 of 324 and the point S4 projected to the screen 324; when comparing the line: the incident angle of the incident light L1; 02: the angle of inclination of the screen 324: the thickness d of the glass substrate 20 and the reference glass substrate G Increment in thickness; and &lt;5 d2 : glass substrate 20 and reference glass base The thickness variation of the thickness d G. When comparing 100130033 Form No. A0101 Page 34 of 50 1〇〇2〇5〇922~0

Claims (1)

201211500 VII. A patent scope: The thickness of the glass substrate (8) and the two-dimensional code (2 D code) inspection system includes: -« and (4) - the surface of the substrate is similar to the unloading portion; a cleaning of the glass substrate Cleaning section. Part-detecting the two-dimensional code (2D code) of the glass substrate and measuring the thickness of the three placement stages according to the rotation axis arranged in the center; sequentially loading and unloading the part And the cleaning unit and the measuring unit automatically control the loading and unloading unit, the cleaning unit, the measuring unit, and the mounting table on the glass substrate and the “# sending-measuring terminal unit”, and the measuring unit The image captured by the first image sensor and the two-dimensional code (^general code) are subjected to image processing to calculate the thickness of the glass substrate and to detect the two-dimensional code (2 D code). 2. The thickness measurement and two-dimensional code (2D code) detection system of the glass substrate according to claim 1, wherein the measuring unit comprises: a first laser oscillator and the first image sensing Above the analyzer, the first laser oscillator illuminates an upper surface of the glass substrate - incident light, and the first image sensor reflects one of the first reflected light or thunder from the upper surface of the glass substrate The first light reflection point and the second reflection point of the one surface of the glass substrate are taken as an image; one has a second laser oscillator and a second image sensor lower part meter 'the second The laser oscillator illuminates the incident light toward a lower surface of the glass substrate, and the second image sensor reflects the first reflected light or the laser beam reflected from the lower surface of the glass substrate on the lower surface of the glass substrate The first reflection point and the second reflection point are captured as images; and 100130033 Form No. A0101 Page 35 / Total 50 I 1002050922-0 201211500 One-dimensional code (2 D code) image sensor and illumination One--* code (2D code) detector for capturing a two-dimensional code (2D code) of the glass substrate, the illumination device being used for the two-dimensional code ( 2D code) The image sensor provides illumination to the two-dimensional code portion of the glass substrate during operation. The thickness measurement and _dimensional code (2D code) detection system of the glass substrate according to claim 2, wherein when the laser of the first laser oscillator and the second laser oscillator is a diffusion laser A first lens and a second lens that convert the diffusion laser into a _collimation laser or a spot laser are further provided inside the upper measuring instrument and the lower measuring instrument. The thickness measurement and the two-dimensional code (2D code) detection system of the glass substrate according to claim 1, wherein the measurement terminal comprises: an input portion having an input for inputting the glass substrate The thickness measurement and the two-dimensional code (2D code) detection system one of the action commands of the keyboard and a mouse and by adjusting the X-axis and the Y-axis of the measuring portion to search for the two-dimensional (2 d) code (2D code) a joystick; an output unit having a monitor and a communication port, the monitor outputs a thickness measurement and a two-dimensional code (2D code) detection program screen of the glass substrate and the first image sensor on a screen The captured image and the two-dimensional code (21) code) 'the communication port is used for transmitting and receiving information information measured by the measurement terminal device through the communication network; and a control unit that stores and drives the thickness measurement of the glass substrate And a two-dimensional (2D code) detection program, and automatically controls the loading and unloading portion, the cleaning portion, the measuring portion, and the placement table according to a command input through the input portion, and the image processing is performed by the first Image and 2D code (2D code) captured by the image sensor to calculate the thickness of the glass substrate and 100130033 Form No. A0101 Page 36 / Total 50 Page 1002050922-0 201211500 Detect the QR code (2D code) β The thickness measurement and two-dimensional code (2D code) detection system for a glass substrate according to any one of claims 1 to 4, wherein the thickness measurement of the glass substrate and the two-dimensional code (2D) The code detection system performs image processing on the image captured on the upper portion and the lower portion of the glass substrate by the measurement terminal device to calculate the position change amount of the reflected light of the glass substrate as the measurement sample according to the following relational expression 1, [Relationship 1] ^ COS Θ J ^ d2 = 5 x2cos Θ 2 where δ' and 5d2 are the thickness variations of the glass substrate when compared with the thickness (d) of the reference glass substrate, and 01 and 02 are slaves. The angle between the first misfire oscillator and the incident light of the second laser oscillator incident on the glass substrate, [Relationship 2] t=d+5d1+(5d2=d+(5xicos01+&lt;5x2cos02 where 'the d The thickness of the reference glass substrate (d) And after calculating the δ\ and &lt;5 d2 according to the relational expression 1, the thickness (t) of the glass substrate is obtained by the above relational expression 2. The thickness measurement of the glass substrate and the two-dimensional code (2D code) detection The method comprises the following steps: (a) providing a step of measuring a thickness of a glass substrate and a two-dimensional code (2D code) detecting system, wherein the thickness measurement of the glass substrate and the two-dimensional code (2D code) detecting system are provided with The glass substrate is simultaneously rotated and recirculated to a loading and unloading portion, a cleaning portion, and a measuring portion of the measuring portion; (b) the step of placing the glass substrate on the loading and unloading portion; 100130033 1002050922-0 Table Army No. A0101 Page 37/Total 5Q Page 201211500 (4) Simultaneously rotate the placement table to transfer the glass substrate to the cleaning unit; (4) Clear (4) the substrate step in the cleaning unit; (e) Turn the same vehicle The placement table is (4) the step of transferring the substrate to the measuring portion; (1) after the dam is aligned and vacuum-pressing the glass substrate, the thickness of the glass substrate is measured, and the two-dimensional code (10) code is simultaneously detected. Step; U) Simultaneously rotating the mounting table to transfer the glass substrate to the loading and unloading portion; and (h) the step of unloading and visually inspecting the glass substrate in the loaded unloading line. The method for measuring the thickness of a glass substrate and the method for detecting a two-dimensional code (2D code) as described in claim 6 wherein the method of coating the thickness of the glass substrate in the step (1) is 'by the relation! Calculating a positional change amount of the reflected light that is irradiated to the upper surface and the lower surface of the glass substrate and reflected from the glass substrate, [Relationship 1] δ 5 XjCos θ ι δ d = δ x0cos θ Ζ 2 2 where ' The amount of change in the thickness of the glass substrate when compared with the thickness (d) of the reference glass substrate, wherein the 0 and ^ are incident from the first 1 2 cone vibrator and the second laser oscillator toward the glass substrate Angle of incident light, [Relationship 2] t = d+ δά^ δ d2=d+ δ xiC〇s θ ^ δ x2cos θ 2 where 'this d is the thickness (d) of the reference glass substrate, and, using the off 100130033 Form No. A0101 Page 38/Total 50 Page 1002050922 201211500 Equation 2 Determine the thickness of the glass substrate 8. The method for measuring thickness and two-dimensional code (2D code) of a glass substrate according to claim 6, wherein the method of detecting the two-dimensional (2D) code in the step (f) is 'passing the pair' The image of the two-dimensional code (2D code) of the glass substrate is imaged for image processing to detect the two-dimensional code (2D code). 100130033 Form No. A0101 Page 39 of 50 1002050922-0