CN108287165A - Defect inspection method and defect inspection system - Google Patents

Defect inspection method and defect inspection system Download PDF

Info

Publication number
CN108287165A
CN108287165A CN201810044244.8A CN201810044244A CN108287165A CN 108287165 A CN108287165 A CN 108287165A CN 201810044244 A CN201810044244 A CN 201810044244A CN 108287165 A CN108287165 A CN 108287165A
Authority
CN
China
Prior art keywords
image
defect
thin film
grayscale value
optical thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810044244.8A
Other languages
Chinese (zh)
Inventor
林宽宏
吴柏徵
洪嘉嬬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumika Technology Co Ltd
Original Assignee
Sumika Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumika Technology Co Ltd filed Critical Sumika Technology Co Ltd
Publication of CN108287165A publication Critical patent/CN108287165A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8809Adjustment for highlighting flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9511Optical elements other than lenses, e.g. mirrors

Abstract

A defect inspection method and a defect inspection system. The defect inspection method comprises an image acquisition step and a conversion step. The image capturing step includes shooting a surface of an optical film to generate a two-dimensional image. The converting step includes converting the two-dimensional image into a gray-scale curve. The gray scale value curve includes a defect gray scale value curve corresponding to a concave-convex defect portion of the optical film.

Description

Defect detecting method and defect detecting system
Technical field
The invention relates to a kind of defect detecting method and defect detecting systems, and in particular to for optically thin The concave-convex defect detecting method of film.
Background technology
With the development of science and technology the requirement of the various optical modules used for liquid crystal display is also high.However, in In the production process of optical module, but it is easy to generate flaw because of various factors, and then reduce and show quality.Therefore, in optics It is the defective detecting system of configuration in the production system of component, to exclude to have defective optical module early.
Invention content
The present invention is about a kind of defect detecting method and defect detecting system.
According to an aspect of the invention, it is proposed that a kind of defect detecting method, including an image capture step are walked with a conversion Suddenly.Image capture step includes carrying out shooting action to a surface of an optical thin film to generate a bidimensional image.Switch process Including bidimensional image is converted into a grayscale value curve.Grayscale value curve includes a concave-convex defect part of corresponding optical thin film Defect grayscale value curve.
According to another aspect of the invention, it is proposed that a kind of defect detecting method, including image capture step and switch process. Image capture step includes carrying out shooting action to a surface of an optical thin film to generate a bidimensional image.Switch process includes By according to the data conversion of bidimensional image at a three-dimensional data.The concave-convex defect part that three-dimensional data report includes optical thin film is opposite In a height difference of a flat.
Another aspect according to the present invention proposes a kind of defect detecting system.Defect detecting system is for detecting a light Learn film.Defect detecting system includes a light source, an image capturing device and a slit plate.Light source is configured at optical thin film Side.Image capturing device is configured at the other side of optical thin film.Slit plate has a slit.Slit plate is configured at light source and light Between learning film, so that an incident ray passes through slit.Image capturing device system offsets from light source and the extension of slit is online.When When the image sensor of image capturing device is online in alignment with the extension of light source and slit, the image brilliance sensed is I0. When image capturing device is online in the extension for offsetting from light source and slit on the moving direction of collimating optics film, sensed Image brilliance be I1.I1/I0 is a defective locations point of 0.5~0.9 Observable optical thin film.
More preferably understand in order to which the above-mentioned and other aspect to the present invention has, special embodiment below, and coordinates institute's attached drawing Detailed description are as follows for formula:
Description of the drawings
Fig. 1 is painted the defect detecting method according to one embodiment of the invention concept.
Fig. 2 is painted the defect detecting system according to one embodiment of the invention concept.
Fig. 3 is to carry out the bidimensional image obtained by image capture step to optical thin film in an embodiment.
Fig. 4 is the bidimensional image obtained after converted step in an embodiment.
Fig. 5 is grayscale value of the defect image of bidimensional image obtained by converted step in an embodiment corresponding to the hatching Relation curve.
Fig. 6 shows the relationship of its grayscale value of concave-convex defect part integral and substantive height value in an embodiment.
Fig. 7 is the image of concave-convex defect part in an embodiment.
Fig. 8 is the curve of the profile position respective heights value of concave-convex defect part in an embodiment.
Wherein, reference numeral:
10:Optical thin film
11:Roller
12:Image processing unit
13:Control unit
14:Periodic signal generates unit
17:Display unit
100:Defect detecting system
110:Light source
110a:Light-emitting surface
120:Image capturing device
130:Slit plate
130s:Slit
250:Bidimensional image
252:Defect image
254:Flat image
256:First pixel portion
258:Second pixel portion
350:Reinforce bidimensional image
471、473:Image
D1:Moving direction
LA:Optical axis
Li:Incident ray
Ls:Scattering light
P:Region
S901:Image capture step
S902:Switch process
S903:Show step
S904:Judgment step
S9021:Signal reinforces step
S9022:First switch process
S9023:Second switch process
Specific implementation mode
Fig. 1 is please referred to, the defect detecting method of the optical thin film according to one embodiment of the invention concept is painted, method can Including image capture step S901, switch process S902, display step S903 and judgment step S904.
In one embodiment, defect detecting method can be painted the execution of defect detecting system 100 using Fig. 2.Fig. 2 is please referred to, is lacked Fall into detecting system 100 and can be used for detecting the optical thin film 10 transferred, optical thin film 10 production online via roller 11 along One moving direction D1 and be handled upside down, defect can be distinguished in real time by defect detecting system 100, to exclude to have defective portion early Point.In one embodiment, the present invention can be used for detecting optics film coil or sheet-form optical film.
Defect detecting system 100 is applicable to various optical thin films 10.For example, optical thin film 10 can be a single layer or Multilayer Film, may be, for example, a polaroid, phase difference film, brightness enhancement film or other to optical gain, orientation, compensation, steering, straight The helpful diaphragm such as friendship, diffusion, protection, anti-stick, scratch resistance, anti-dizzy, reflection suppression, high refractive index;In aforementioned polaroid At least one side is attached with the polarizer of protective film, phase-contrast film etc.;Protective film, material for example can be selected from:It is cellulose-based Resin, acrylic resin, amorphism polyolefin-based resins, polyester based resin, polycarbonate-based resin and combinations thereof, but this Exposure is not limited to these films.
Defect detecting system 100 includes a light source 110 and an image capturing device 120.It can be for example fluorescent lamp, metal Halogen lamp or LED light, light source 110 have a light-emitting surface 110a.In a preferred embodiment, light source 110 is LED light.Image Capture device 120 can be line scan camera, and with image sensor, image sensor is, for example, photosensitive coupling component (Charge Coupled Device, CCD) or any element with photoelectric conversion capacity.
As shown in Fig. 2, light source 110 and image capturing device 120 are configured at opposite two sides for the optical thin film 10 transferred. Specifically, light source 110 is the side irradiation light from optical thin film 10, and image capturing device 120 is in the another of optical thin film 10 Side receives the transmitted light images for the light for penetrating optical thin film 10.In this exposure, the irradiating angle of light is simultaneously not particularly limited. In one embodiment, light source 110 be in the side of optical thin film 10 vertically irradiation light, also that is, along light source 110 light-emitting surface The incident ray Li of the optical axis L A of 110a is irradiated perpendicular to the surface of optical thin film 10.In this, the optical axis L A is a vacation Think line, is the normal of light-emitting surface 110a.In one embodiment, image capturing device 120 is the table for facing optical thin film 10 Face filmed image, that is to say, that optical axis L A of 120 system of image capturing device towards the light-emitting surface 110a that is parallel to light source 110 Direction shoots optical thin film 10, that is, the angle shot optical thin film 10 that image capturing device 120 is not inclined.
In one embodiment, defect detecting system 100 has more a slit plate 130, and slit plate 130 can be by metal, ceramics Or made by high molecular material.Slit plate 130 is configured between light source 110 and optical thin film 10, to limit to light traveling Angle.In one embodiment, the extension of the central axes (not indicating) of the optical axis L A and slit 130s of the light-emitting surface 110a of light source 110 Online system is perpendicular to the surface of optical thin film 10, to limit the incident ray Li across slit 130s perpendicular to optical thin film 10 Surface is irradiated.
Image capturing device 120 can move on the moving direction D1 for being parallel to optical thin film 10, such as can be by a movement Unit controls the movement of image capturing device 120, so that image capturing device 120 deviates prolonging for light source 110 and slit 130s Stretch online configuration.In another embodiment, also image capturing device 120 can be made fixed, and light source 110 is same with slit plate 130 When integrally in moving (or opposite direction) on the moving direction D1 of collimating optics film 10 so that image capturing device 120 is inclined It is moved from light source 110 and the extension of slit 130s is online.
Due to will produce diffraction effect when incident ray Li passes through slit 130s, will produce on optical thin film 10 bright Secretly interference fringe staggeredly, with the brightness change caused by the concave-convex defect being more convenient for detecting on optical thin film 10.In addition, working as When passing through the region P of will have local variations in thickness on optical thin film 10, i.e. concave-convex defect across the incident ray Li of slit 130s, light It will produce scattering.Since 120 system of image capturing device offsets from light source 110 and the extension of slit 130s is online, therefore image captures Equipment 120 can receive the scattering light Ls of a part, and influence the light quantity that image capturing device 120 is received.On the other hand, when In the case of without concave-convex defect, due to not will produce scattering light, therefore the light quantity that image capturing device 120 is received will not Variation.Whereby, as long as incident ray Li passes through the concave-convex defect on optical thin film 10, light to will produce scattering and influence image The light quantity that capture device 120 is received, in contrast with the region not with concave-convex defect, image capturing device 120 is received Image brilliance can change, therefore the image contrast of concave-convex defect area can be promoted, and can more easily detected whether scarce It falls into and exists.
Wherein, online in alignment with light source 110 and the extension of slit 130s when the image sensor of image capturing device 120 When, the image brilliance sensed is I0.Then, if image capturing device 120 is in the moving direction D1 of collimating optics film 10 Upper movement and when the online extension for offsetting from light source 110 and slit 130s, the image brilliance sensed drops to I1.Originally it is taking off In dew, the offset of image capturing device 120 or optical thin film 10 can be adjusted according to the ratio range of I1/I0.When I1/I0's Range is fallen between 0.5~0.9, and preferable range I1/I0 can be enough to observe optical thin film 10 when between 0.8~0.85 Concave-convex defect caused by brightness change, and position and fall vacant sunken location point.It in one embodiment, can be in this processing procedure, simultaneously Mark this concave-convex defective locations point on optical thin film 10.
In addition, defect detecting system 100 further includes an image processing unit 12, a periodic signal generates unit 14, one and controls 13 and one display unit 17 of unit processed.Image processing unit 12 can receive and handle the image transmitted by image capturing device 120 Signal, to carry out image procossing to signal, image processing unit 12 may be, for example, Frame Grabber.Periodic signal generates unit 14 A periodic signal can be sent according to the screen of optical thin film 10, may be, for example, encoder.Control unit 13 can be coupled to figure As processing unit 12 and display unit 17, and the periodic signal for generating unit 14 from periodic signal is received, and image is caught It obtains equipment 120 and transmits image pickup signal, control unit 13 may be, for example, computer.Whereby, operating personnel is able to from control unit 13 And display unit 17 obtains the transmitted light images (information) captured by image capturing device 120, with detect in image whether defect. Display unit 17 may include any display equipment, such as liquid crystal display, light-emitting diode display etc. that image can be shown to user of service Deng, also can have for user of service with the touch function of touch control manner operate interface.
As shown in figure 3, in an embodiment, the bidimensional image obtained by image capture step S901 is carried out to optical thin film 10 250, i.e. video signal transmitted by image capturing device 120.Bidimensional image 250 includes the thickness for corresponding to optical thin film 10 respectively The region of localized variation, i.e., the defect image 252 and flat of concave-convex defect part, the i.e. non-defective part of surfacing A flat image 254.In one embodiment, in the bidimensional image 250 obtained by image capture step S901, defect image 252 Pixel gray level of the pixel gray level different from flat image 254.As shown in figure 3, defect image 252 include the first pixel portion 256 with Second pixel portion 258, wherein the first pixel portion 256 is bright pixel part, the second pixel portion 258 is dark pixel part. The pixel gray level of bright pixel part can be higher than the pixel gray level of flat image 254.The pixel gray level of dark pixel part can be less than flat Face as 254 pixel gray level.
The two dimension deformation of concave-convex defect part is only able to display out by the bidimensional image 250 obtained by image capture step S901 Amount, i.e., visual angle just face optical thin film 10 flat direction when can detect length, width, diameter, radius, area Equal deflections.But in some cases, for the quality evaluation of optical thin film 10, the third d type variable of concave-convex defect part, I.e. high deformation data have prior reference value than two dimensional surface deformation data.
Therefore, according to the embodiment concept of this exposure, concave-convex lack can be learnt by switch process S902, display step S903 Concave portion split-phase degree concave for flat, raised, such as concave, elevated regions height values, and detection is significantly increased The precision of the quality of optical thin film 10.
It is that can be obtained by switch process S902, display step S903 according to the embodiment concept of this exposure in one embodiment Know the degree that concave-convex defect part is concave relative to flat, raised, such as concave, elevated regions maximum height values.
It is that switch process S902, judgment step S904 are executed by control unit 13 in one embodiment, and it can be by display unit 17 execute display step S903.
In embodiment, optionally first carries out a signal and reinforce step S9021, bidimensional image 250 is converted into one Reinforce bidimensional image 350.
In one embodiment, signal is reinforced step S9021 and be may include bidimensional image 250 as shown in Figure 3 according to pixel ash Rank is converted into the reinforcement bidimensional image 350 of the grayscale display pixel shown in such as Fig. 4.
In one embodiment, it is the grayscale value on the basis of the setting of flat image 254 that signal, which reinforces step S9021, and with benchmark Grayscale value corresponds to the grayscale value of modulation defect image 252.As shown in figure 4, can be by flat image 254 from original benchmark grayscale value Pixel is converted to the lower dark-background image of grayscale value, to strengthen the grey scale between flat image 254 and defect image 252 It is different, the range of defect image 252 is further highlighted, can more accurately capture defect image 252, reinforces two to generate Tie up image 350.
Then, switch process S902 is executed.Switch process S902 includes one first switch process S9022, the first conversion step Rapid S9022 includes that will reinforce bidimensional image 350 to be converted into a grayscale value curve, as shown in Figure 5.For example, image can be passed through Processing method is converted.Such as grayscale value on the basis of capable of being set by flat image 254, and modulation is corresponded to benchmark grayscale value and is lacked The grayscale value for falling into image 252, will reinforce the grayscale value of each position of the defect image 252 of bidimensional image 350 along hatching AB forms a corresponding grayscale value curve.
In one embodiment, as shown in figure 5, display step S903 can show the reinforcement two dimension shadow after generating in display unit 17 As 350 grayscale value curve of the defect image 252 corresponding to the hatching AB.
For example, in grayscale value curve, the grayscale value of the first pixel portion 256 of defect image 252 is more than benchmark The grayscale value of grayscale value 128, the second pixel portion 258 is less than benchmark grayscale value 128.Benchmark grayscale value is not limited to shown in Fig. 5 Numerical value 128, other numerical value are also defined as in other embodiment.
In one embodiment, it can also omit aforementioned signal and reinforce step S9021, and directly execute the first switch process S9022, Make defect image 252 grayscale value curve along hatching AB corresponding to of the conversion for bidimensional image 250.First switch process As described in the previous embodiment, details are not described herein.
But the grayscale value curve of Fig. 5 can represent the degree that defect is concave, raised, still can not directly correspond to and represent bumps The actual height numerical value of defect part.
Therefore, in an embodiment, switch process S902 more may include one second switch process S9023, will be as shown in Figure 5 Grayscale value Curve transform at a three-dimensional data, wherein three-dimensional data report includes the concave-convex defect part of optical thin film 10 relative to flat The actual height difference of smooth part.
In one embodiment, the second switch process S9023 includes:One calculation step and a comparison step.Such as the ash to Fig. 5 After rank value curve first carries out a calculation step, then through comparing step to generate a three-dimensional data.
In one embodiment, calculation step includes that grayscale value difference, grayscale value ratio, the grayscale value based on grayscale value curve are micro- Point, grayscale value integral or combinations of the above carry out operation, but not limited to this, other statisticals also can be used and carry out operations Analysis.Second switch process of following embodiment is using grayscale value integral as illustrating in a manner of operation, but the present invention is not As limit.
Comparing step includes:By calculation step as a result, such as corresponding actual defects sample data of gray scale curve integral, with Obtain the three-dimensional data of an actual defects height.
In one embodiment, the collection mode of actual defects sample data, referring to Fig. 7 and Fig. 8.Fig. 7 is prior with Fig. 8 The practical three-dimensional data that defect sample is measured using surface profile measuring instrument, to obtain the three-dimensional data of defect sample.
Fig. 7 is please referred to, in one embodiment, three-dimensional data report includes the image 471 and display color that height is shown with color The image 473 of corresponding height value.In one embodiment, image 471 can indicate the concave-convex defect part of optical thin film 10 and attached The distribution profile of nearly flat is highly more than wherein height is flat for 0 part, is as recessed less than 0 part Convex defect part, and relative to flat, i.e. the values of disparity of numerical value 0 is that concave-convex defect part is actually concave or raised Height number.User can be directly acquainted with by this data the concave-convex defect part of optical thin film 10 relative to flat it is concave or The substantive height value of protrusion.
It is to integrate maximum height shown in Fig. 7 and substantive height value as gray scale curve shown in fig. 6 in one embodiment Relationship in respective heights.
Please refer to Fig. 8, in another embodiment, three-dimensional data report includes the profile position of concave-convex defect part and corresponding height The relation curve of difference.User can be directly acquainted with the concave-convex defect part of optical thin film 10 relative to flat by this data Concave or raised substantive height value.
It, can be with maximum height value shown in Fig. 8 as gray scale curve shown in fig. 6 integral and essence height in one embodiment Respective heights in the relationship of value.
Described in presenting, after the second switch process S9023, gray scale curve integral as shown in FIG. 6 and essence can get The relational graph of height value.
Then, in an embodiment, judgment step S904 can judge optically thin according to the substantive height value of concave-convex defect part The deformation degree of film 10 simultaneously sets product turnout specification level.In one embodiment, as shown in Figure 6, for example, using essence The setting specification of height value is used as assessment foundation.For example, substantive height value is more than the concave-convex defect part of setting specification It can be used as assessing whether optical thin film 10 can then neglect as the foundation of product turnout, the concave-convex defect part less than setting specification Slightly disregard.
In one embodiment, setting specification can only set single a numerical value, or use different numbers according to different evaluation criterias Value.In one embodiment, specification is set as 5 μm, if optical thin film 10 finds that 6 or more substantive height values are more than in 1cm2 areas The concave-convex defect part of this setting specification, indicates that the packing density of defect is excessively high, then judges that 10 mass of optical thin film is bad, can not As product turnout.In another embodiment, specification is set as 7 μm, if the discovery of optical thin film 10 has substantive height value to be set more than this Establish rules lattice concave-convex defect part, no matter defects count how much, all judge 10 mass of optical thin film it is bad, can not go out as product Goods.Judgment step S904 is not limited to utilize 13 automatization judgement of control unit.In other embodiment, under some cases, also may be used Artificially judged by the information shown by display unit 17 by operating personnel.This exposure is without being limited thereto, can be according to reality Demand uses other appraisal procedures.
It is that will can only provide two dimensional surface size obtained by image capture step according to the above, in the embodiment of the present invention The defect image of information, be converted by switch process include defect essence height value three-dimensional information, and defect height can be passed through Degree information judges the deformation extent of the concave-convex defect part of optical thin film in height, therefore can more precisely assess optical thin film Quality.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe Various corresponding change and deformations, but these corresponding change and deformations can be made according to the present invention by knowing those skilled in the art The protection domain of the claims in the present invention should all be belonged to.

Claims (11)

1. a kind of defect detecting method, which is characterized in that including:
One image capture step includes carrying out shooting action to a surface of an optical thin film to generate a bidimensional image;And
One switch process, including the bidimensional image is converted into a grayscale value curve, which includes the corresponding optics The defect grayscale value curve of the concave-convex defect part of the one of film.
2. defect detecting method according to claim 1, which is characterized in that the switch process includes walking the image capture Rapid gained bidimensional image is converted into the grayscale value curve according to pixel gray level.
3. defect detecting method according to claim 1, which is characterized in that the bidimensional image includes corresponding to the optics respectively The bumps defect part of film and the defect image and flat image of a flat,
Pixel gray level of the pixel gray level system of the defect image different from the flat image.
4. defect detecting method according to claim 1, which is characterized in that further include a data displaying, including will The grayscale value curve is shown in a display unit, wherein the datagram shown includes the section position of the defect image of the bidimensional image It sets and the relation curve of corresponding grayscale value.
5. defect detecting method according to claim 1, which is characterized in that further include a judgment step, including basis should Defect grayscale value curve judges the deformation situation of the bumps defect part of the optical thin film.
6. a kind of defect detecting method, which is characterized in that including:
One image capture step includes carrying out shooting action to a surface of an optical thin film to generate a bidimensional image;
One switch process includes by according to the data conversion of the bidimensional image, at a three-dimensional data, which includes the light Learn a height difference of the concave-convex defect part of film relative to a flat.
7. defect detecting method according to claim 6, which is characterized in that further include before the switch process, carry out one Signal reinforces step, and the wherein signal reinforces step so that benchmark grayscale value corresponds to the modulation bidimensional image and forms a grayscale and shows The image of pixel.
8. defect detecting method according to claim 6, which is characterized in that the switch process includes:
The bidimensional image is converted into a grayscale value curve;And
By the grayscale value Curve transform at the three-dimensional data.
9. defect detecting method according to claim 8, which is characterized in that by the grayscale value Curve transform at three dimension It is included according to report and operation is done based on grayscale value difference, grayscale value ratio, grayscale value differential, grayscale value integral or combinations of the above.
10. defect detecting method according to claim 6, which is characterized in that further include a judgment step, including basis should Height difference judges the deformation degree of the optical thin film.
11. a kind of defect detecting system, which is characterized in that for detecting an optical thin film, and include:
One light source is configured at the side of the optical thin film;
One image capturing device is configured at the other side of the optical thin film;And
One slit plate has a slit, which is configured between the light source and the optical thin film, so that an incident ray is worn Cross the slit;
Wherein, the extension which offsets from the light source and the slit is online, wherein when the image capturing device Image sensor it is online in alignment with the extension of the light source and the slit when, the image brilliance sensed is I0;
When the image capturing device joins in the extension for offsetting from the light source and the slit on the moving direction of the parallel optical thin film When machine, the image brilliance sensed is I1;And
Wherein, I1/I0 is a defective locations point of 0.5~0.9 Observable optical thin film.
CN201810044244.8A 2017-11-24 2018-01-17 Defect inspection method and defect inspection system Pending CN108287165A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW106141065 2017-11-24
TW106141065A TWI629665B (en) 2017-11-24 2017-11-24 Defect inspection method and defect inspection system

Publications (1)

Publication Number Publication Date
CN108287165A true CN108287165A (en) 2018-07-17

Family

ID=62835233

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810044244.8A Pending CN108287165A (en) 2017-11-24 2018-01-17 Defect inspection method and defect inspection system

Country Status (2)

Country Link
CN (1) CN108287165A (en)
TW (1) TWI629665B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108961252A (en) * 2018-07-27 2018-12-07 Oppo(重庆)智能科技有限公司 It detects logo and pastes undesirable method, electronic device and computer readable storage medium
CN109799237A (en) * 2019-01-21 2019-05-24 深圳市南科燃料电池有限公司 Defect detection device and detection method
CN109884811A (en) * 2019-03-21 2019-06-14 深圳市华星光电技术有限公司 Defects of display panel height detection method
CN110715941A (en) * 2018-12-06 2020-01-21 住华科技股份有限公司 Automatic optical detection method and automatic optical detection system using same
CN111024707A (en) * 2019-03-12 2020-04-17 住华科技股份有限公司 Optical film detection device and detection method of optical film

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI724590B (en) * 2019-10-25 2021-04-11 精信精密工業股份有限公司 Automatic defect inspection system and inspecting method
TWI748828B (en) * 2020-12-29 2021-12-01 鴻海精密工業股份有限公司 Method for detecting defects of product, computer device and storage medium

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1815138A (en) * 2005-02-04 2006-08-09 欧姆龙株式会社 Thin film inspection apparatus and thin film inspection method
CN101110125A (en) * 2007-07-25 2008-01-23 西北师范大学 Method for constructing metal surface three-dimensional macroscopical feature based on digital picture technology
CN101968895A (en) * 2009-07-27 2011-02-09 鸿富锦精密工业(深圳)有限公司 Two-dimensional image conversion system and method
US20130250127A1 (en) * 2012-03-26 2013-09-26 Wen-Lung Huang Method for Checking Camera
TW201514474A (en) * 2013-10-15 2015-04-16 Benq Materials Corp Method of detecting defect on optical film with periodic structure and device thereof
TW201516958A (en) * 2013-10-31 2015-05-01 Univ Nat Taipei Technology Method of 2D-to-3D depth image construction and device thereof
TW201702586A (en) * 2015-07-03 2017-01-16 元智大學 桃園市中壢區遠東路 135 號 Optical film defect detection method and system thereof
CN106530291A (en) * 2016-10-28 2017-03-22 重庆工商职业学院 Polished surface detection method and system based on image processing
CN106896113A (en) * 2016-12-27 2017-06-27 住华科技股份有限公司 Defect detection system and method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6650410B2 (en) * 2000-03-08 2003-11-18 Fuji Photo Film Co., Ltd. Apparatus, system and method for checking film for defects
CN105334217A (en) * 2014-07-08 2016-02-17 上海和辉光电有限公司 Optical thin film detection device and defect detection method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1815138A (en) * 2005-02-04 2006-08-09 欧姆龙株式会社 Thin film inspection apparatus and thin film inspection method
CN101110125A (en) * 2007-07-25 2008-01-23 西北师范大学 Method for constructing metal surface three-dimensional macroscopical feature based on digital picture technology
CN101968895A (en) * 2009-07-27 2011-02-09 鸿富锦精密工业(深圳)有限公司 Two-dimensional image conversion system and method
US20130250127A1 (en) * 2012-03-26 2013-09-26 Wen-Lung Huang Method for Checking Camera
TW201514474A (en) * 2013-10-15 2015-04-16 Benq Materials Corp Method of detecting defect on optical film with periodic structure and device thereof
TW201516958A (en) * 2013-10-31 2015-05-01 Univ Nat Taipei Technology Method of 2D-to-3D depth image construction and device thereof
TW201702586A (en) * 2015-07-03 2017-01-16 元智大學 桃園市中壢區遠東路 135 號 Optical film defect detection method and system thereof
CN106530291A (en) * 2016-10-28 2017-03-22 重庆工商职业学院 Polished surface detection method and system based on image processing
CN106896113A (en) * 2016-12-27 2017-06-27 住华科技股份有限公司 Defect detection system and method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
沈庭芝: "数字图像处理及模式识别(第二版)", 《数字图像处理及模式识别(第二版) *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108961252A (en) * 2018-07-27 2018-12-07 Oppo(重庆)智能科技有限公司 It detects logo and pastes undesirable method, electronic device and computer readable storage medium
CN108961252B (en) * 2018-07-27 2021-06-08 Oppo(重庆)智能科技有限公司 Method for detecting logo paste failure, electronic device and computer readable storage medium
CN110715941A (en) * 2018-12-06 2020-01-21 住华科技股份有限公司 Automatic optical detection method and automatic optical detection system using same
CN110715941B (en) * 2018-12-06 2022-04-29 住华科技股份有限公司 Automatic optical detection method and automatic optical detection system using same
CN109799237A (en) * 2019-01-21 2019-05-24 深圳市南科燃料电池有限公司 Defect detection device and detection method
CN111024707A (en) * 2019-03-12 2020-04-17 住华科技股份有限公司 Optical film detection device and detection method of optical film
CN111024707B (en) * 2019-03-12 2022-11-18 住华科技股份有限公司 Optical film detection device and detection method of optical film
CN109884811A (en) * 2019-03-21 2019-06-14 深圳市华星光电技术有限公司 Defects of display panel height detection method

Also Published As

Publication number Publication date
TWI629665B (en) 2018-07-11
TW201926247A (en) 2019-07-01

Similar Documents

Publication Publication Date Title
CN108287165A (en) Defect inspection method and defect inspection system
CN106226157B (en) Concrete structure member crevices automatic detection device and method
JP6394514B2 (en) Surface defect detection method, surface defect detection apparatus, and steel material manufacturing method
CN105960569B (en) The method of three-dimension object is checked using two dimensional image processing
JP7339643B2 (en) Systems and methods for testing the refractive power and thickness of ophthalmic lenses immersed in solutions
US9891168B2 (en) Device and method for sensing at least one partially specular surface with column-by-column analysis of the global or local intensity maximum
CN102630299A (en) Image processing device for defect inspection and image processing method for defect inspection
CN102308201A (en) Method for the non-destructive inspection of a mechanical part
CN106018431A (en) Solid wood plate surface crack detecting system and detecting method
CN104094104A (en) Device and method for identifying defects within the volume of a transparent pane and use of the device
JP2012215486A (en) Surface property measuring apparatus and comprehensive evaluation method for surface property
CN103885168A (en) Method For Self-calibration Of A Microscope Apparatus
CN110186937A (en) Reject mirror article surface two-dimensional defect detection method and system that dust influences
CN206990338U (en) A kind of experimental system that Young's modulus of elasticity is measured using digital laser speckle method
CN103630554A (en) Detection device and method for defects on double faces of lens
KR101094968B1 (en) System for Inspecting Defects on Glass Substrate Using Contrast Value, and Method of the same
CN104180772A (en) Visual inspection device
JP4523310B2 (en) Foreign matter identification method and foreign matter identification device
JP2001124538A (en) Method and device for detecting defect in surface of object
JP2000121499A (en) Method and apparatus for measuring internal refractive index distribution of optical fiber base material
JP7362324B2 (en) Inspection method, manufacturing method and inspection device for image display device
TW201809592A (en) Automated 3-D measurement
TWI493177B (en) Method of detecting defect on optical film with periodic structure and device thereof
Safizadeh et al. Automated detection of inner surface defects in pipes using image processing algorithms
JP2021004748A (en) Appearance inspection management system, appearance inspection management device, appearance inspection management method, and program

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20180717