TWM637372U - Chip inspection device - Google Patents

Abstract

The present invention provides a wafer detection device for detecting and classifying a wafer storage tray, comprising a drive track for transporting a wafer storage tray, and an upper detection module and a lower detection module arranged along the drive track, Not only can the wafer storage tray be detected quickly, comprehensively and accurately, reducing the burden of time and labor costs and human errors, but also can automatically and systematically inspect each wafer storage tray according to the detection results of the wafer storage tray Category storage.

Description

Wafer inspection device

A detection device, especially a wafer detection device.

With the development of science and technology and industry, the use of chips has also become popular. The applications of chips are closely related to the small electronic devices and common household appliances in the house, as well as to various industrial instruments and transportation equipment. In the trend of technology that emphasizes precision and intelligence, the specifications and qualification requirements for chips are also strict. However, in the process of wafer fabrication, most rely on manually confirming the specifications of the wafers and whether they meet the qualification requirements one by one, which is not only time-consuming but also often causes a burden on manpower under mass production. It is also very likely that there will be human negligence during manual screening, so that the chips that do not meet the standards or specifications are used in products, resulting in product quality problems.

In order to overcome the problems in the current wafer manufacturing and application fields that a wafer needs to rely on manual inspection specifications and qualification requirements, resulting in a large burden of time and labor costs and prone to human error, the present invention provides a wafer inspection device for inspection and classification. The wafer storage tray includes a transmission crawler for transporting a wafer storage tray, and an upper detection module and a lower detection module arranged along the transmission crawler.

Wherein, the upper detection module includes an upper camera placed above the transmission crawler and shoots downwards, the transmission crawler drives the wafer storage tray corresponding to the lower part of the upper camera, and two upper mirrors according to The position of the upper camera is placed on a pair of sides of the wafer storage tray with an angle. The mirror is reflected to the upper camera to capture images of the upper surface of the wafer storage disk and one of the opposite sides at the same time.

Wherein, the lower detection module includes a lower camera placed below the transmission track and shoots upwards, the transmission track drives the wafer storage tray to pass above the lower camera, and two lower reflectors according to the The position of the lower camera is placed at an angle corresponding to the other pair of sides of the wafer storage tray. When the wafer storage tray passes through the two lower reflectors, the surface on the other pair of sides passes through the two lower reflectors respectively. The reflection is captured by the lower camera, so that the lower camera captures images of the lower surface of the wafer storage tray and the other side of the wafer simultaneously.

Wherein, a steering mechanism is arranged between the upper inspection module and the lower inspection module, and the steering mechanism horizontally rotates the wafer storage tray by 90 degrees when the wafer storage tray passes by.

Among them, a control center is included. The control center receives and evaluates the image captured by the upper detection module and the lower detection module. The image includes the surface texture and marks of the wafer storage disk. The control center according to the preset An evaluation logic and an encoding logic are written to classify and judge the surface texture and the mark, and form a classification result, wherein the classification result can be distinguished according to whether the surface texture is damaged or the coding logic corresponding to the mark.

Wherein, a distributing mechanism is arranged at the starting end of the driving crawler, and the distributing mechanism is used to separate each of the wafer storage disks in a stacked wafer storage disk group one by one and transfer them to the driving crawler, including At least two correspondingly arranged supports, the detachable bumps correspond to the lower surface of the wafer storage tray One part of each support member supports the wafer storage tray group when it is correspondingly combined with the lowermost wafer storage tray, and a lifting device can be displaced up and down under each of the support members. When the lifting device moves upwards until it abuts against the lowermost wafer storage tray, the wafer storage tray group is lifted upwards via the lifting device, and each of the supports is disengaged, wherein at least two of the supports When combining the lowermost second wafer storage tray, the lowermost wafer storage tray is separated from the wafer storage tray group and left in the lifting device.

Wherein, the four corners of the lower surface of the wafer storage tray are respectively recessed with an engaging groove, and each of the engaging grooves extends toward one of the pair of sides of the wafer storage tray, and is formed on one of the pair of sides. There is an opening, and a group of two supporting members are respectively arranged on the side of one of the opposite sides of the wafer storage tray, and protrude toward each opening, wherein each supporting member can face the wafer The round storage disc is moved closer or farther away, and is selectively engaged with the concave and convex of each engaging groove through the opening.

Further, the lifting device is displaced downwards until each of the openings of the lowermost second wafer storage tray corresponds to each of the support members, and each of the support members approaches the lowermost second wafer storage tray, And enter the corresponding engaging grooves, so that the second wafer storage tray at the bottom and the stacked wafer storage trays above it are supported by the support members

Further, the two drive crawlers are arranged under each of the support members and spaced apart on both sides of the lifting device, and the distance formed by the two drive crawlers is greater than that of the lifting device and smaller than that of the wafer storage tray. The distance formed by a pair of sides, when the lifting device drives the lowermost wafer storage tray to move down until a level of the lifting device is lower than the two driving crawlers, the lowermost wafer storage tray stays Above the two transmission crawlers.

Further, an automatic arm transports the wafer storage tray group above each of the supports, and a transmission mechanism is arranged at one end of the transmission crawler, and when the wafer storage tray is displaced to the corresponding transmission mechanism through the transmission crawler The transfer mechanism gives the wafer storage tray a thrust towards a sorting area, so that the wafer storage tray is pushed toward the sorting area and stored.

Further, the control center drives the wafer storage tray to be displaced in the sorting area to a storage space corresponding to the sorting result.

The wafer inspection device proposed in the present invention can not only obtain the classification result quickly and accurately through the control center, reduce the burden of time and labor costs and reduce human errors, but also can be further extended based on the classification result, effectively according to the The sorting results are automatically sorted and stored in the wafer storage tray.

10:Wafer inspection device

11: Distributing mechanism

111: support

112: Lifting device

12: Testing agency

121: Upper detection module

1211: On the camera

1212: Upper reflector

122: Lower detection module

1221: Lower camera

1222: Lower reflector

13: Transmission mechanism

20: Chip storage equipment

21: Feeding area

22: Detection area

23: Classification area

24: Packing area

25: Discharge area

26: Automatic arm

A:Wafer storage tray

A’: Wafer storage disk group

A1: Snap slot

Fig. 1 is the three-dimensional schematic diagram of the preferred embodiment of the present invention

Fig. 2 is the partial structure schematic diagram of the preferred embodiment of the present invention

Fig. 3a is the first action diagram of the first station of the preferred embodiment of the present invention

Fig. 3b is the second action diagram of the first station in the preferred embodiment of the present invention

Fig. 3c is the third action diagram of the first station in the preferred embodiment of the present invention

Fig. 4 is the schematic diagram of the second station of the preferred embodiment of the present invention

Fig. 5 is the schematic diagram of the third station of the preferred embodiment of the present invention

Fig. 6 is the schematic diagram of the fourth station of the preferred embodiment of the present invention

Please refer to Fig. 1, which is a preferred embodiment of the application of the wafer detection device 10 provided by the present invention, the wafer detection device 10 is applied in a wafer storage device 20, the wafer storage device 20 preferably includes a feeding Area 21, a detection area 22, a classification area 23, a packaging area 24 and a discharge area 25. A wafer storage tray A can enter the wafer storage device 20 through the feeding area 21; perform appearance detection in the inspection area 22; classify and store in the classification area 23; Zone 25 exits the wafer storage facility 20 .

In this embodiment, the feeding area 21 includes several feeding spaces arranged in multiple layers, and more than two wafer storage trays A are stacked to form a wafer storage tray during the manufacturing process or when the manufacturing is completed. Group A' is stored in one of the feeding spaces of the feeding area 21 . The sorting area 23 includes several storage spaces arranged in multiple layers. When more than two wafer storage disks A pass through the detection area 22 to complete the detection, they are classified and stored in one of the storage spaces of the sorting area 23 in a stacked manner. . The way each wafer storage tray A enters the feeding area 21, the detecting area 22, the sorting area 23, the packaging area 24, and the discharging area 25 is not limited, and can be carried by manual, crawler or Realized by means of robotic arm and so on.

The wafer inspection device 10 is disposed in the inspection area 22 , and the wafer inspection device 10 is used for inspecting the surface and specification of each wafer storage tray A, and achieving the effect of classifying the wafer storage trays A. Further, a wafer corresponding to the specification is stored in the wafer storage tray A, and the wafer may be in a completed or semi-finished state.

Further, the wafer detection device 10 is not limited to be combined or applied in the wafer storage device 20, the wafer detection device 10 can also be an independent device, so that the wafer storage tray A passes through the wafer during each process. The detection device 10 detects and classifies, and continues the subsequent process.

Next please refer to FIG. 2 , the wafer storage tray A enters the inspection area 22 , so that the wafer inspection device 10 can detect and classify each of the wafer storage trays A. The manner in which each wafer storage tray A enters the wafer inspection device 10 is not limited. In this embodiment, the wafer storage device 20 also includes an automatic arm 26, and the automatic arm 26 sets the wafer storage tray A' Transfer to the wafer inspection apparatus 10 .

The wafer detection device 10 includes a distributing mechanism 11, a detection mechanism 12 and a conveying mechanism 13 arranged in sequence, wherein the distributing mechanism 11, the detecting mechanism 12 and the conveying mechanism 13 are connected through a transmission crawler, so that one of them The wafer storage tray A can go to the position of the distributing mechanism 11 to the detecting mechanism 12 and the conveying mechanism 13 sequentially via the transmission track.

Next, please refer to FIG. 3a to FIG. 3b to provide the wafer inspection device 10 with inspection methods for each of the wafer storage trays A. The distributing mechanism 11 is used to separate each of the wafer storage trays A from the wafer storage tray group A' one by one, and transfer each of the wafer storage trays A one by one through the drive belt, including at least two corresponding A supporting member 111 and a lifting device 112 are provided. The automatic arm 26 displaces the wafer storage tray group A' above the at least two supports 111, so that the lowermost wafer storage tray A can be supported by at least two corresponding support members 111.

Each of the wafer storage trays A is in the shape of a square disk, more preferably in the shape of a rectangular disk. In this embodiment, the four corners of the lower surface of the wafer storage tray A facing downward are respectively recessed with an engaging groove A1, and each of the engaging grooves A1 extends toward a pair of sides of the wafer storage tray A. , and an opening is respectively formed on one of the pair of sides. In this embodiment, the wafer storage tray A is in the shape of a rectangular disk, and the pair of sides is the opposite side of the long side of the wafer storage tray A, and the openings are respectively opened on the two long sides.

The four supporting members 111 are movably disposed corresponding to the openings of the engaging slots A1 . Wherein, a group of two support members 111 is arranged on the sides of the two long sides of the wafer storage tray A respectively, and the two support members 111 in the two groups face the two sides of the wafer storage tray A each on the long side Open mouth prominently set. Wherein, the two support members 111 are a group that can approach or move away from each of the long sides of the wafer storage tray A. When each of the support members 111 approaches the long side of the wafer storage tray A, each of the support members 111 enters into each engaging groove A1 through each corresponding opening, and engages with each engaging groove A1 correspondingly.

The lifting device 112 is used to move up and down to displace the wafer storage tray group A' disposed on each of the supports 111. The lifting device 112 is arranged below each of the supporting members 111. When the lifting device 112 When it is displaced upward until it touches the lowermost wafer storage tray A, the wafer storage tray group A' can be lifted upward through the lifting device 112, and each support member 111 is separated from the lowermost wafer storage tray A'. Each of the engaging slots A1 on the lower surface of the wafer storage tray A.

As shown in Fig. 3a, when the distributing mechanism 11 is in operation, the wafer storage tray group A' is supported by the supporting member 111.

Next, as shown in FIG. 3 b , the lifting device 112 lifts the wafer storage tray group A' upward, so that the lowermost wafer storage tray A is separated from each of the support members 111 . At this time, the two support members 111 are one group away from the two sides of the two long sides of the wafer storage tray A, so that the distance between the support members 111 between the two groups is greater than the two long sides of the wafer storage tray A. The distance formed by the sides.

Next, when the lifting device 112 is displaced downward until each of the openings of the lowermost second wafer storage tray A corresponds to each of the support members 111 . At this time, each of the support members 111 approaches the second wafer storage tray A at the bottom, and enters each of the engaging grooves A1 through its corresponding openings, and is connected with the second wafer storage tray A at the bottom. Each of the engaging grooves A1 of the disk A is concave and convex correspondingly engaged.

Then, the lifting device 112 continues to sink, and due to the structural relationship between the bottom second wafer storage tray A and each of the support members 111, the bottom second wafer storage tray A and its top Each of the stacked wafer storage trays A is supported by each of the support members 111 . Only the bottom crystal The round storage tray A sinks and displaces together with the lifting device 112, so that the lowermost wafer storage tray A in the wafer storage tray group A' can be sequentially separated one by one in this way.

Preferably, the lifting device 112 drives the lowermost wafer storage tray A to move down to the corresponding drive track, so that the drive track can drive the lowermost wafer storage tray A out of the lift according to the setting of the track. Lifting device 112 and running towards the detection mechanism 12.

In this embodiment, the two transmission crawlers are arranged below each of the support members 111 and spaced apart on both sides of the lifting device 112, and the distance formed by the two transmission crawlers is greater than that of the lifting device 112 and smaller than that of the lifting device 112. The distance formed by a pair of sides of the wafer storage tray A. In this way, the lifting device 112 can move up and down between the two driving crawlers. When the lifting device 112 drives the wafer storage tray A to move down until a level of the lifting device 112 is lower than that of the two driving crawlers. When driving the crawlers, the wafer storage tray A can stay above the two driving crawlers and be driven by the two driving crawlers.

Please refer to FIG. 4 and FIG. 5. The detection mechanism 12 is used to detect the lines and marks on the surface of the wafer storage tray A to observe and confirm the integrity of the wafer storage tray A and to classify the wafer storage trays according to the marks. A specification. Wherein, the mark can be a serial number including English, Roman numerals or symbols generated according to an encoding logic.

The detection mechanism 12 includes an upper detection module 121 and a lower detection module 122 . Wherein, the detecting mechanism 12 does not limit its relative position to the material distributing mechanism 11 , in this embodiment, the detecting mechanism 12 is arranged beside the material distributing mechanism 11 , and the two driving crawlers pass through it.

The upper detection module 121 includes an upper camera 1211 and two upper mirrors 1212, the upper camera 1211 is placed above the two driving tracks and shoots downwards, so that the two driving tracks can drive the wafer The storage disk A corresponds to pass directly under the upper camera 1211, and the two upper mirrors 1212 are respectively placed on the wafer storage with corresponding angles according to the position of the upper camera 1211. A pair of sides of the disk A is stored, so that when the wafer storage disk A passes through the two upper mirrors 1212, the surface lines or marks on one of the pair of sides can be reflected to the upper camera via the two upper mirrors 1212 respectively. Captured by Instrument 1211. In this way, the upper camera 1211 can simultaneously capture images of the upper surface of the wafer storage tray A and one of the opposite sides.

The lower inspection module 122 includes a lower camera 1221 and two lower reflectors 1222. The lower camera 1221 is placed under the two driving crawlers and shoots upwards, so that the two driving crawlers can drive the wafer. The storage tray A corresponds to pass directly above the lower camera 1221, and the two lower mirrors 1222 are placed on the other pair of sides of the wafer storage tray A corresponding to the angles according to the position of the lower camera 1221, so that the When the wafer storage tray A passes through the two lower reflectors 1222 , the surface textures or marks on the other pair of sides can be reflected by the two lower reflectors 1222 to the lower camera 1221 to capture. In this way, the lower camera 1221 can simultaneously capture images of the lower surface of the wafer storage tray A and the other opposite side.

Wherein, each of the upper reflectors 1212 and each of the lower reflectors 1222 is not limited to the way they are set, and each of the upper reflectors 1212 and each of the lower reflectors 1222 can be fixedly connected to two as described in the above paragraph. Beside the driving crawler, or along the edge of the wafer storage tray A, the movable displacement is in the detection mechanism 12 .

Next please refer to FIG. 5 , when the wafer storage tray A is continuously driven away from the detection mechanism 12 by the transmission track and moved to the transfer mechanism 13, the transfer mechanism 13 gives the wafer storage tray A a direction toward the sorting area 23. A pushing force, so that the wafer storage tray A is pushed toward the sorting area 23 and stored.

Further, in order not to affect the operation of the wafer storage tray A through the two transmission crawlers on the material distribution mechanism 11, the detection mechanism 12 and the transmission mechanism 13 and the wafer storage tray A passing through For the detection work of the upper detection module 121 and the lower detection module 122, the wafer detection device 10 can be provided with a steering mechanism as required, so that the wafer storage tray A can rotate horizontally on the transmission belt through the steering mechanism , or shift towards a second direction. In this embodiment, the steering mechanism is arranged between the upper detection module 121 and the lower detection module 122, so that the wafer storage tray A can be horizontally rotated by 90 degrees through the steering mechanism when passing by, so that the upper reflection The mirror 1212 and each of the lower reflecting mirrors 1222 can be fixedly arranged beside the two driving crawlers, so that the overall process is smoother.

Further, it includes a control center, which can selectively control the operation of the wafer inspection device 10 and the wafer storage device 20, wherein the control center receives and evaluates the image captured by the inspection mechanism 12, and according to the preset The written evaluation logic and the encoding logic classify and judge the surface integrity and marks of the wafer storage disk A, and form a classification result. Wherein, the classification result can be distinguished according to whether the surface of the wafer storage tray A is damaged or not and the coding logic.

Further, when the control center completes the classification judgment, the control center can drive the wafer storage tray A to move in the classification area 23, so that the wafer storage tray A can be stored in a storage space corresponding to the classification result In this way, the wafer storage tray A can not only obtain the fast and accurate classification result through the wafer inspection device 10 , but also can be further extended according to the classification result, and can be effectively classified and stored in the wafer storage device 20 .

10:Wafer inspection device

20: Chip storage equipment

21: Feeding area

22: Detection area

23: Classification area

24: Packing area

25: Discharge area

26: Automatic arm

Claims (8)

A wafer detection device for detecting and classifying a wafer storage tray, comprising a transmission track for transporting a wafer storage tray, and an upper detection module and a lower detection module arranged along the transmission track, wherein: the The upper inspection module includes an upper camera that is placed above the transmission track and shoots downwards. The transmission track drives the wafer storage tray to correspond to the lower part of the upper camera, and two upper mirrors according to the upper camera. The position of the instrument is placed with an angle corresponding to one of the two sides of the wafer storage tray. When the wafer storage tray passes through the two upper reflectors, the surface on one of the opposite sides is reflected to the Captured by the upper camera so that the upper camera simultaneously captures images of the upper surface of the wafer storage tray and one of the opposite sides; and the lower inspection module includes a lower camera placed under the drive track and Shooting upwards, the transmission track drives the wafer storage tray to pass above the lower camera, and the two lower mirrors correspond to the other pair of wafer storage trays with angles according to the position of the lower camera When the wafer storage tray is placed on one side, when the wafer storage tray passes through the two lower mirrors, the surface on the other pair of sides is reflected by the two lower mirrors to be captured by the lower camera, so that the lower camera simultaneously captures the The image of the lower surface of the wafer storage tray and the other opposite side. In the wafer inspection device described in Claim 1, a steering mechanism is arranged between the upper inspection module and the lower inspection module, and the steering mechanism horizontally rotates the wafer storage tray when the wafer storage tray passes by 90 degrees. The wafer inspection device as described in Claim 1, comprising a control center, the control center receives and evaluates the image captured by the upper inspection module and the lower inspection module, the image includes the surface of the wafer storage disk Textures and marks, the control center is based on a pre-written evaluation logic and a The coding logic classifies and judges the surface texture and the mark, and forms a classification result, wherein the classification result can be distinguished according to whether the surface texture is damaged or the coding logic corresponding to the mark. As for the wafer inspection device described in any one of claims 1 to 3, a distributing mechanism is arranged at the starting end of the transmission crawler, and the distributing mechanism is used to separate each of the wafers in a stacked wafer storage tray group The wafer storage trays are separated one by one and transferred to the drive belt, including: at least two correspondingly arranged supports, the detachable bumps correspond to a part of the lower surface of the wafer storage tray, each of the support members and the lowermost When the concavity and convexity of the wafer storage tray are combined correspondingly, the wafer storage tray group is supported, and a lifting device can be displaced up and down under each of the support members, and the lifting device moves upward until it abuts against the lowermost When the wafer storage tray is used, the wafer storage tray group is lifted upwards via the lifting device, and each of the support members is separated; wherein: at least two of the support members are combined with the lowermost second wafer storage tray , the lowermost wafer storage tray is separated from the wafer storage tray group and left on the lifting device. The wafer inspection device as described in Claim 4, wherein: the four corners of the lower surface of the wafer storage tray are respectively recessed with an engaging groove, and each of the engaging grooves extends toward a pair of sides of the wafer storage tray , and an opening is respectively formed on one of the opposite sides; and two of the support members are set as a group and are respectively arranged on the side of one of the opposite sides of the wafer storage tray, and protrude toward each of the openings , wherein, each of the support members can approach or move away from the wafer storage tray, and selectively engage with the concave and convex of each of the engaging grooves through the opening. The wafer inspection device as described in Claim 5, wherein: The lifting device moves downwards until each opening of the lowermost second wafer storage tray corresponds to each of the support members, and each of the support members approaches the lowermost second wafer storage tray and enters into the corresponding opening. Each of the engaging grooves, so that the second wafer storage tray at the bottom and each of the wafer storage trays stacked above it are supported by each of the support members; and the two transmission crawlers are arranged on each of the wafer storage trays. The position below the support member and spaced apart are on both sides of the lifting device. The distance formed by the two driving crawlers is greater than the distance formed by the lifting device and smaller than the distance formed by a pair of sides of the wafer storage tray. When the lifting device The device drives the lowermost wafer storage tray to move downward until a level of the lifting device is lower than the two transmission crawlers, and the lowermost wafer storage tray stays above the two transmission crawlers. The wafer detection device as described in claim 3, comprising: an automatic arm transports a stacked set of wafer storage trays to a starting end of the drive crawler, and a distributing mechanism places the wafer storage tray at the starting end Each of the wafer storage trays stacked in the group is separated one by one and transferred to the transmission crawler; and a transmission mechanism is arranged at one end of the transmission crawler, and when the wafer storage tray is displaced to the corresponding transmission mechanism through the transmission crawler The transfer mechanism gives the wafer storage tray a thrust towards a sorting area, so that the wafer storage tray is pushed toward the sorting area and stored. The wafer inspection device according to claim 7, wherein the control center drives the wafer storage tray to be displaced in the classification area to a storage space corresponding to the classification result.

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