WO2021164343A1

WO2021164343A1 - Chip removing and mounting device and chip mounting machine

Info

Publication number: WO2021164343A1
Application number: PCT/CN2020/129359
Authority: WO
Inventors: 戴泳雄; 王敕; 唐秋明
Original assignee: 苏州艾科瑞思智能装备股份有限公司
Priority date: 2020-02-19
Filing date: 2020-11-17
Publication date: 2021-08-26
Also published as: CN111415895A; CN111415895B

Abstract

Provided in the present invention are a chip removing and mounting device and a chip mounting machine, which relate to the technical field of chip mounting machines. The chip removing and mounting device comprises: a chip feeding platform, a first rotating arm, a transfer platform, a correction lens, a second rotating arm, a welding head, and a drive device. The welding head is used for taking out a chip and placing the chip; the welding head comprises a first welding head and a second welding head; the second welding head can rotate clockwise and counterclockwise in a rotation plane of the second rotating arm; and the correction lens is arranged within a range covered by the rotation of the second rotating arm. After the transfer platform performs position correction on the chip, and the drive device obtains, according to the correction lens, a chip position of the chip on the second welding head after the second welding head takes out the chip, so as to achieve further correction of the angle of the chip. When the correction lens obtains the angle and position of a chip on a bottom surface of the second welding head along a top view angle direction, high-precision angular alignment of a chip with a logo or pattern for alignment existing on the back of the chip with a chip-mounting working station can be achieved.

Description

Film taking and loading device and loading machine

Technical field

The invention relates to the technical field of a film loading machine, in particular to a film taking and loading device and a film loading machine.

Background technique

In the packaging process of semiconductor devices such as IC, chip mounting is an extremely important link. The loading process is as follows: first, the dispensing mechanism (also called the dispensing module) dispenses glue on the mounting station of the substrate, and then the semiconductor chip is taken out from the wafer by the mounting swing arm of the mounting mechanism, and then transferred Go to the loading station where glue has been dispensed. The loading accuracy (that is, the alignment between the chip and the loading station) is an important index for evaluating the performance of the loading machine.

At present, the translation and rotation operations of the turntable can be used to correct the position of the chip transferred via the turntable, so as to improve the alignment between the chip and the chip loading station. However, as the size of the chip decreases, it is difficult for conventional chip mounting operations to ensure high-precision angular alignment of the chip and the chip mounting station. In addition, for some devices or chips, the marks or patterns used for alignment exist on the back (lower surface) of the device or chip. The conventional turntable operation with the top view angle cannot realize the alignment of such devices or chips. Quasi-operation.

Therefore, there is a need to provide a high-precision angular alignment of the chip and the mounting station, in particular, the high-precision angular alignment of the chip and the mounting station with the mark or pattern for alignment existing on the back of the chip. The film taking and loading device to improve the quality of the product.

Summary of the invention

The purpose of the present invention is to provide a chip picking and loading device and a chip loading machine in order to solve the problem of high-precision angular alignment of the chip and the chip loading station in view of the above-mentioned shortcomings of the prior art.

In order to achieve the above objectives, the technical solutions adopted by the present invention are as follows:

In the first aspect, the present invention provides a chip taking and loading device, including: a chip loading table, a first rotating arm, a transfer table, a correction lens, a second rotating arm, a welding head, and a driving device,

The chip loading table is used to place the chips to be loaded;

The first rotating arm is used to take out the chip from the chip loading platform, and place the chip on the transfer platform after rotating;

The transfer table is used for the transfer and position correction of the chip;

The second rotating arm is used to take out the chip on the turntable, and place the chip on the mounting substrate after rotating;

The welding head is used to take out the chip and place the chip. The welding head includes a first welding head arranged at one end of the first rotating arm and a second welding head arranged at one end of the second rotating arm. The first welding head and the second welding head It can move in a direction parallel to the rotation axis of the first rotating arm or the second rotating arm, and the second welding head can also rotate clockwise and counterclockwise in the rotation plane of the second rotating arm;

The correction lens is arranged within the rotation coverage of the second rotating arm, and the correction lens is used to obtain the chip position of the chip on the second welding head after the second welding head takes out the chip;

The driving device is used for driving the first rotating arm and/or the second rotating arm, and the driving device drives the second welding head to rotate in the rotation plane of the second rotating arm according to the chip position.

Optionally, the second welding head is coupled with one end of the second rotating arm through a rotatable mechanism.

Optionally, the correction lens is set close to the turntable.

Optionally, the lens is corrected along the upper viewing angle direction to obtain the angular position of the chip on the lower surface of the second welding head after the second welding head takes out the chip.

Optionally, the correction lens is an optical lens. After the second welding head takes out the chip, the correction lens captures the optical image of the chip on the lower surface of the second welding head along the upper viewing angle direction, and obtains the angle of the chip by analyzing the optical image Location.

Optionally, by comparing the glue dispensing position on the mounting substrate with the angular position of the chip, when it is determined that the angular position of the chip is not aligned with the glue dispensing position, the driving device drives the second bonding head to rotate until the chip The angular position of is aligned with the dispensing position.

Optionally, the chip loading platform includes a plurality of trays stacked in the loading rack and a protective cover provided on the top of the loading rack. Each tray contains multiple chips, and the output of the chip loading platform The feed opening is located at the bottom end of the loading rack.

Optionally, when the chip loading platform is discharging, the bottommost tray among the plurality of trays in the loading rack is driven to move out from the discharge port to a preset reclaiming position, so as to be used for being The first soldering head removes the chip from the tray.

Optionally, when all the chips in the tray at the reclaiming position are taken out, the tray is moved out of the reclaiming position to help the bottommost tray among the remaining trays in the plurality of trays. The tray is moved out to the reclaiming position.

In the second aspect, the present invention also provides a tablet loading machine, including a feeding device, a glue dispensing device, and the chip taking and loading device according to the first aspect.

The beneficial effects of the present invention include:

The chip taking and loading device provided by the present invention includes: a chip loading table, a first rotating arm, a transfer table, a correction lens, a second rotating arm, a soldering head, and a driving device. The chip loading table is used to place the chip to be loaded Chips; the first rotating arm is used to take out the chips from the chip loading platform, and place the chips on the turntable after rotating; the transfer table is used for chip transfer and position correction; the second rotating arm is used to take out the chips on the transfer table, After rotating, the chip is placed on the mounting substrate; the welding head is used to take out the chip and place the chip. The welding head includes a first welding head arranged at one end of the first rotating arm and a second welding head arranged at one end of the second rotating arm. The first welding head and the second welding head can move in a direction parallel to the rotation axis of the first rotating arm or the second rotating arm, and the second welding head can also move clockwise and in the rotation plane of the second rotating arm. Rotate counterclockwise; the correction lens is set in the rotation coverage of the second rotating arm, the correction lens is used to obtain the chip position of the chip on the second welding head after the second welding head takes out the chip; the driving device is used to drive the first rotation Arm and/or the second rotating arm, and the driving device drives the second welding head to rotate in the rotation plane of the second rotating arm according to the chip position. After the chip position is corrected by the turntable, the chip position of the chip on the second welding head after the second welding head is taken out through the correction lens is obtained. According to the chip position and the preset mounting station, the driving device drives the second welding head. The welding head rotates in the rotation plane of the second rotating arm to realize further correction of the angle of the chip, thereby realizing the problem of high-precision angular alignment between the chip and the mounting station.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are merely of the present invention. For some embodiments, those of ordinary skill in the art can obtain other drawings based on these drawings without creative work.

Figure 1 shows a schematic diagram of the structure of a film taking and loading device provided by an embodiment of the present invention;

FIG. 2 shows a schematic structural diagram of a film taking and loading device provided by another embodiment of the present invention;

FIG. 3 shows a schematic diagram of a structure for acquiring an image of a chip position after a second bonding head has taken a chip according to an embodiment of the present invention;

4A shows a schematic diagram of the alignment structure of the chip and the chip mounting station when the chip angle is not corrected;

4B shows a schematic diagram of the alignment structure of the chip and the chip mounting station after the chip angle is corrected;

FIG. 5 shows a schematic structural diagram of a chip loading platform provided by an embodiment of the present invention;

Fig. 6 shows a schematic structural diagram of the chip loading platform provided by an embodiment of the present invention after one discharge.

Icon: 101-chip loading platform; 1011-feeding rack; 1012, 1013, 1014-tray tray; 1015-protection cover; 102-first rotating arm; 1021-first welding head; 1022-first driving device; 103-Transition stage; 104-correction lens; 105-second rotating arm; 1051-second welding head; 1052-second driving device; 1053-third driving device; 106-chip; 107-mounting substrate; 108- Film loading station.

Detailed ways

In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are a part of the embodiments of the present invention, but not all of the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings herein may be arranged and designed in various different configurations.

Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

It should be noted that similar reference numerals and letters indicate similar items in the following figures. Therefore, once a certain item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated position or position relationship is based on the position or position relationship shown in the drawings, or the position or position relationship usually placed when the product of the invention is used, only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying The referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for distinguishing description, and cannot be understood as indicating or implying relative importance.

In the description of the present invention, it should also be noted that the terms "set", "installation", "connected", and "connected" should be interpreted broadly unless otherwise clearly specified and limited. For example, they may be fixed connections. It can also be detachably connected or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in the present invention can be understood in specific situations.

At present, the translation and rotation operations of the turntable can be used to correct the position of the chip transferred via the turntable, so as to improve the alignment between the chip and the chip loading station. However, as the size of the chip decreases, it is difficult for conventional chip mounting operations to ensure high-precision angular alignment of the chip and the chip mounting station.

Therefore, there is a need to provide a chip picking and chip loading device that can achieve high-precision angular alignment of the chip and the chip loading station to improve product quality.

Fig. 1 shows a schematic structural diagram of a film taking and loading device provided by an embodiment of the present invention. As shown in Figure 1, the chip picking and loading device provided by the embodiment of the present invention includes: a chip loading table 101, a first rotating arm 102, a transfer table 103, a correction lens 104, a second rotating arm 105, a welding head and a driving device , The chip loading table 101 is used to place the chip 106 to be loaded; the first rotating arm 102 is used to take out the chip 106 from the chip loading table 101, and place the chip 106 on the turntable 103 after rotating; the turntable 103 is used to The transfer and position correction of the chip 106; the second rotating arm 105 is used to take out the chip 106 on the transfer table 103, and the chip 106 is placed on the mounting substrate 107 after rotation; the welding head is used to take out the chip and place the chip, and the welding head includes A first welding head 1021 arranged at one end of the first rotating arm 102 and a second welding head 1051 arranged at one end of the second rotating arm 105, the first welding head 1021 and the second welding head 1051 can be parallel to the first rotating The arm 102 or the second rotating arm 105 moves in the direction of the rotation axis, and the second welding head 1051 can also rotate in the clockwise and counterclockwise directions within the rotation plane of the second rotating arm 105; the correction lens 104 is arranged on the second rotating arm 105, the correction lens 104 is used to obtain the chip position of the chip 106 on the second welding head 1051 after the second welding head 1051 is taken out; the driving device is used to drive the first rotating arm 102 and/or the second The rotating arm 105, and the driving device drives the second bonding head 1051 to rotate in the rotation plane of the second rotating arm 105 according to the chip position. Specifically, the driving device includes a first driving device 1022 for driving the first rotating arm 102, a second driving device 1052 for driving the second rotating arm 105, and a third driving device for rotating the second welding head 1051.装置 1053.

In Figure 1, the dashed diagram represents the position that the corresponding component can reach after moving. In practical applications, the chip 106 to be loaded is obtained on the chip loading table 101 by the first soldering head 1021 at one end of the first rotating arm 102, and the first rotating arm 102 is driven to rotate by the first driving device 1022, and the The chip 106 is transported to the turntable 103, and the turntable 103 performs the first correction on the position and angle of the chip 106. Then the second bonding head 1051 at one end of the second rotating arm 105 obtains the chip 106 after the first calibration position from the transfer table 103. While the chip 106 is held on the second bonding head 1051, the calibration lens 104 captures the chip 106 The chip position on the second bonding head 1051, and then, by analyzing the chip position, the third driving device 1053 drives the second bonding head 1051 to perform rotation correction in the rotation plane of the second rotating arm 105, so that the corrected rotation is The angle of the chip 106 is aligned with the position of the mounting station on the mounting substrate 107 with high precision. Finally, the second rotating arm 105 rotates under the driving of the second driving device 1052 to transport the chip 106 to the chip loading station on the chip loading substrate 107. Wherein, the mounting station (dispensing position) on the mounting substrate 107 can be known in advance.

To sum up, after the position correction of the chip is performed on the turntable, the chip position of the chip on the second welding head after the second welding head is taken out through the correction lens is obtained. According to the chip position and the preset mounting station, The driving device drives the second welding head to rotate in the rotation plane of the second rotating arm to realize further correction of the angle of the chip, thereby realizing the problem of high-precision angular alignment between the chip and the chip loading station.

Optionally, the second welding head 1051 is coupled with one end of the second rotating arm 105 through a rotatable mechanism.

Optionally, as shown in FIG. 2, the correction lens 104 is set close to the turntable 103. For example, the correcting lens 104 can be set on one side of the turntable 103, so that after the second bonding head 1051 obtains the chip 106 from the turntable 103, the correcting lens 104 can quickly capture the chip 106 on the lower surface of the second bonding head 1051. Without waiting for the second rotating arm 105 to rotate at a certain angle.

Optionally, as shown in FIG. 3, the lens 104 is corrected along the upper viewing angle direction to obtain the angular position of the chip 106 on the lower surface of the second bonding head 1051 after the chip 106 is taken out by the second bonding head 1051. Since the chip 106 is taken out by the second bonding head 1051, the chip 106 is located on the lower surface of the second bonding head 1051, and the angle position is obtained by setting the correction lens 104 below the horizontal position of the second bonding head 1051 and along the upper viewing angle direction , Can realize the high-precision angular alignment of the chip with the mark or pattern used for alignment on the back of the chip and the chip mounting station, and improve the accuracy of obtaining the chip position.

As the size of the chip 106 decreases, the chip 106 is directly placed on the chip loading station 108 on the chip loading substrate 107 after the first calibration only by the transfer table 103, and there may be a gap between the chip 106 and the chip loading station 108 The angle is misaligned to a certain extent, as shown in Figure 4A. After the correction lens 104 obtains the chip position image, and the second bonding head 1051 is driven by the third driving device 1053 to perform rotation correction, the chip 106 is then placed on the mounting station 108 on the mounting substrate 107 to realize the chip 106 The high-precision alignment with the loading station 108 is shown in FIG. 4B.

Optionally, the correcting lens 104 may be an optical lens. After the second soldering head 1051 takes out the chip 106 from the turntable 103, the correcting lens 104 photographs the optical image of the chip 106 on the lower surface of the second soldering head 1051 along the upper viewing angle direction. The angular position of the chip 106 is obtained by analyzing the optical image.

Optionally, by comparing the glue dispensing position on the chip mounting substrate 107 (ie, the chip mounting station 108) with the angular position of the chip 106, when it is determined that the angular position of the chip 106 is not aligned with the glue dispensing position, pass The driving device (specifically, the third driving device 1053) drives the second bonding head 1051 to rotate until the angular position of the chip 106 is aligned with the dispensing position.

The tray is also called the material tray, which is used to hold materials. When multiple trays are stacked for loading, the prior art can use a tray loading and unloading mechanism as described in the patent application number 201520435929.7: specifically, the tray loading and unloading mechanism includes a rack, and two racks are installed in the rack. A Tray disk platform capable of placing a stack of Tray disks and a platform driving mechanism for lifting the Tray disk platform are provided on the side; on both sides of the Tray disk platform, fixed stop posts are provided along the lifting direction of the Tray disk platform. The blocking column is matched with the corresponding chute provided on the Tray plate platform; it also includes a transfer platform, a slide rail, and a transfer platform drive mechanism; the slide rail is installed on the rack, and the two ends of the slide rail are respectively connected to both sides The Tray disk platform corresponds to each other; the transfer platform is installed on the slide rail, and can be driven by the transfer platform drive mechanism to move along the slide rail; the rack corresponding to the middle of the slide rail is also provided for orientation An article manipulator that puts articles in or takes out articles from the Tray disk; the Tray disk manipulators and corresponding sensor components are respectively installed on the racks corresponding to the Tray disk platforms on both sides, and the Tray disk manipulators are used for The Tray disk is transferred between the Tray disk platform and the transfer platform; the sensor assembly is used to detect the lifting height of the Tray disk platform, and feedback the detection result to the platform driving mechanism.

However, in the prior art, the material is discharged from the uppermost end of a plurality of stacked trays. In this way, when the uppermost tray is removed and the material is loaded, the lower tray is exposed and is easily contaminated by particles, dust, etc. in the air. .

The embodiment of the present invention provides a multi-tray tray stacking feeding platform that discharges from the lower end. Specifically, the chip loading platform 101 includes a plurality of

trays

1012, 1013, 1014 stacked in the loading rack 1011, and a protective cover 1015 provided on the top of the loading rack 1011, and each tray contains multiple trays. For chips, the discharge port of the chip loading platform 101 is located at the bottom end of the loading rack 1011. When the chip loading platform 101 discharges, the bottom tray among the plurality of trays in the loading rack 1011 (for example, the tray 1014 in FIG. 5) is driven to move out from the discharge port to the preset The reclaiming position is used to take out the chips from the tray 1014 by the first bonding head 1021. In this structure, since the unloaded tray is always protected by the protective cover 1015 at the top during the feeding process of the tray, the cleanliness of the feeding platform is improved and the product quality is improved.

Optionally, when all the chips in the tray at the reclaiming position are taken out, the tray is moved out of the reclaiming position to help the bottommost tray among the remaining trays in the plurality of trays. The tray (for example, the tray 1013 in FIG. 6) is moved out to the reclaiming position.

In addition, an embodiment of the present invention also provides a tablet loading machine, including a loading device, a glue dispensing device, and the chip picking and loading device provided according to the above embodiments of the present invention.

The above are only preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

A chip taking and loading device, which is characterized by comprising: a chip loading table, a first rotating arm, a transfer table, a correction lens, a second rotating arm, a welding head and a driving device,

The chip loading table is used for placing chips to be loaded;

The first rotating arm is used to take out the chip from the chip loading platform, and place the chip on the transfer platform after rotating;

The transfer table is used for transfer and position correction of the chip;

The second rotating arm is used to take out the chips on the transfer platform, and place the chips on the chip mounting substrate after rotating;

The welding head is used to take out the chip and place the chip. The welding head includes a first welding head arranged at one end of the first rotating arm and a second welding head arranged at one end of the second rotating arm, so The first welding head and the second welding head can move in a direction parallel to the rotation axis of the first rotating arm or the second rotating arm, and the second welding head can also move in the second rotating arm. Rotate clockwise and counterclockwise in the rotation plane of the arm;

The correction lens is arranged within the rotation coverage of the second rotating arm, and the correction lens is used to obtain the chip position of the chip on the second welding head after the second welding head takes out the chip;

The driving device is used to drive the first rotating arm and/or the second rotating arm, and the driving device drives the second welding head on the rotation plane of the second rotating arm according to the chip position Rotational movement within.
4. The chip taking and loading device according to claim 1, wherein the second welding head is connected to one end of the second rotating arm through a rotatable mechanism.
The film taking and loading device according to claim 1, wherein the correction lens is arranged close to the turntable.
The chip taking and loading device according to claim 1, wherein the correcting lens obtains the angle of the chip on the lower surface of the second welding head after the second welding head takes out the chip along the upper viewing angle direction Location.
The chip taking and loading device according to claim 4, wherein the correction lens is an optical lens, and after the chip is taken out by the second soldering head, the correction lens photographs the chip in the upper viewing angle direction. An optical image is placed on the lower surface of the second bonding head, and the angular position of the chip is obtained by analyzing the optical image.
The chip picking and chip loading device according to claim 5, characterized in that by comparing the glue dispensing position on the chip loading substrate with the angular position of the chip, the angular position of the chip is determined to be compared with the angular position of the chip. When the glue position is not aligned, the driving device drives the second welding head to rotate until the angular position of the chip is aligned with the glue dispensing position.
The chip taking and loading device according to claim 1, wherein the chip loading platform comprises a plurality of trays stacked in the loading rack and a protective cover provided on the top of the loading rack, each A plurality of chips are accommodated in each of the trays, and the discharge port of the chip loading platform is located at the bottom end of the loading rack.
The chip taking and loading device according to claim 7, characterized in that, when the chip loading platform is discharging, the bottom tray among the plurality of trays in the loading rack is driven to It is moved out from the discharge port to a preset retrieving position, so as to be used for taking out the chip from the tray by the first soldering head.
The chip taking and loading device according to claim 8, wherein when all the chips in the tray at the taking position are taken out, the tray is moved out of the taking position to help The bottom tray among the remaining trays among the plurality of trays is moved out to the reclaiming position.
A tablet loading machine, which is characterized by comprising a feeding device, a glue dispensing device, and the chip taking and loading device according to any one of claims 1 to 9.