TWM631745U - Die-cast cooling device - Google Patents

Abstract

A die-cast cooling device for protecting a computer assembly is disclosed. The die-cast cooling device includes a cooling plate, a plurality of die-cast fins, an opening formed on the cooling plate, and a cover coupled to the cooling plate. The cooling plate extends between two side walls, and the cooling plate and the side walls are arranged to form a protective space for computing components. The plurality of die-cast fins are formed on the cooling plate, extending away from the protective space. The opening provides access to the protective space. The cover is movable between a closed position and an open position, the cover preventing access to the protective space in the closed position, and the cover providing access to the protective space in the open position.

Description

Die casting cooling device

The present invention generally relates to a die-casting fin, in particular to a die-casting fin having an opening and a cover.

Telecommunication devices 100 (eg, 5G equipment, base stations for cellular networks, and servers) generally have various components (eg, Printed Circuit Board Assembly (PCBA) 120 , memory modules) to hold various components. Compartment of group 130, on-board chip 140, and thermal pad 150, as shown in FIGS. 1B-1D). Since telecommunication devices are typically located in outdoor environments, the components are protected from adverse environmental conditions and unauthorized access by die-cast fins 110 (heat sinks, shown in Figure 1A) covering the compartments, As shown in Figure 1C and Figure 1D. Referring to Figures 1A-1D, generally speaking, die-cast fins 110 that transfer heat directly from a source (eg, on-board wafer 140 ) are secured to the compartment by fasteners (eg, screws 160 ) to enclose components and secure Component protection is not affected by external components. In such a configuration, thermal pads 150 are placed between the on-board wafer 140 and the die cast fins 110 to cool the heat generated from the on-board wafer. When the die cast fins 110 are decoupled from the printed circuit board assembly 120 and the compartment to When replacing a memory module 130 (eg, a Dual In-line Memory Module (DIMM)) mounted on a printed circuit board assembly, not only the dual in-line memory module, but also includes a thermal pad All other components of 150 are exposed. When the die-cast fins 110 are decoupled from the printed circuit board assembly 120 , other components on the printed circuit board assembly may obstruct access to the two-wire memory module 130 . For example, when the die-cast fins 110 are opened to expand or replace the dual-line memory module 130, the thermal pad 150 may be adversely affected or damaged, making expansion/replacement of the dual-line memory module difficult.

Therefore, a need arises for an improved die-cast fin that allows easy/direct access to two-wire memory modules without affecting other components. The present disclosure guides such die-cast fins that provide easy access to dual-line memory modules for expansion, modification, or replacement.

Example terms and similar terms (eg, implementations, configurations, features, examples, and options) are intended to refer broadly to all of the subject matter of the present disclosure and the scope of the claims that follow. Several statements containing these terms should be understood not to limit the meaning or scope of the subject matter described herein or to limit the scope of the claims below. The embodiments of the present disclosure covered herein are defined by the following claims, not the present disclosure. This novel content is a high-level overview of the various features of the present disclosure, and introduces some concepts that are more described in the implementation paragraphs below. This novel content is not intended to identify the key or essential components of the subject matter of the scope of the application, nor is it intended to be used independently to determine the patent application. The scope of the profit scope. This subject matter should be understood by reference to the entire specification of this disclosure, including all drawings in appropriate scale, and the scope of each application.

According to certain features of the present disclosure, a die-casting cooling device for protecting computer components is disclosed. The die casting cooling device includes a cooling plate, a plurality of die casting fins, openings formed in the cooling plate, and a cover coupled to the cooling plate. A cooling plate extends between the two side walls, and the cooling plate and the side walls are arranged to form a protective space for computing elements. A plurality of die-cast fins are formed on the cooling plate, extending away from the protective space. Openings provide access to protected spaces. The lid is movable between a closed position in which the lid prevents access to the protective space and an open position in which the lid provides access to the protective space.

In some examples, the cover is pivotally coupled to the cooling plate. In some examples, the lid has parallel sides and lid walls extending from each side of the lid such that the lid walls face each other. In some examples, protrusions are formed outwardly from each cover wall, and the openings have corresponding receiving portions configured to receive the protrusions. The lid wall is inserted in the opening in the closed position so that the opening is sealed by the lid. The top surface of the cover is aligned with the top surfaces of the plurality of die cast fins in the closed position.

In some examples, the die casting cooling device further includes fasteners inserted through the through holes of the cover. Additionally, the plurality of die cast fins include receiving portions by which fasteners are received to directly couple the cover to the cooling plate. A portion of the cover is recessed relative to the top surface of the cover such that when the fastener is received in the receiving portion, the top of the fastener is positioned below the top surface of the cover. Additionally, the receiving portion is recessed relative to the top surfaces of the plurality of die cast fins such that when the fastener is received in the receiving portion, the top of the fastener is positioned below the top surfaces of the plurality of die cast fins. A portion of the cover protrudes from the edge of the cover, and a side of the opening corresponding to the edge of the cover is recessed to receive The protruding part of the cover.

In some examples, the plurality of die cast fins and the cover are made of different materials. For example, the cover is made of synthetic polymer including plastic.

According to certain features of the present disclosure, a frame for enclosing a computing element includes a plurality of fins arranged in parallel, an opening, and a cover movable between a closed position and an open position to close or open the opening. In some examples, the plurality of fins includes fins of different lengths. In some examples, the frame further includes fasteners that pass through the through holes of the cover and are received by the receiving portions of the frame such that the cover is directly coupled to the frame by the fasteners.

According to certain features of the present disclosure, a computing device includes a printed circuit board assembly (PCBA), a memory module, and a die cast fin. A plurality of computing elements are mounted on the printed circuit board assembly. The memory module is mounted on the printed circuit board assembly. Die cast fins cover the printed circuit board assembly. The die cast fins have a cover that can be moved between an open position and a closed position. The lid covers the opening in the closed position. When the cover is in the open position, the memory module can be accessed.

In some examples, the cover is pivotally coupled to the die cast fins. When the cover is in the open position, the plurality of computing elements are not exposed, but the memory modules are exposed. In some examples, the cover includes a protrusion. The openings have corresponding receiving portions configured to receive the protrusions. The cover is configured to pivot about the axis of the protrusion.

The above novelty is not intended to represent every embodiment or every feature of the present disclosure. Rather, the foregoing novel disclosures provide only examples of some of the novel features and features set forth herein. The above features and advantages, as well as other features and advantages of the present disclosure, will be apparent from the following detailed description of representative embodiments and modes when taken in conjunction with the accompanying drawings and the appended claims. In view of the detailed description with reference to the drawings and various embodiments From the detailed description, additional features of the present disclosure will be apparent to those of ordinary skill in the art, and a brief description of the drawings is provided below.

100: Electrical device

110: Die-cast fins

120: Printed circuit board assemblies

130: Dual-line memory module/memory module

140: Onboard chip

150: Thermal pad

160: Screw

200: Telecommunications installations/devices

210: Die-cast fins

212: Cover

214: pin or screw

216: Through hole

218: Receive part

220: Protrusion

222: Receive part

230: Memory Module

A: Line

The advantages of the present disclosure and the accompanying drawings will be better understood from the following description of the embodiments in conjunction with the accompanying drawings. These drawings depict only exemplary embodiments and are therefore not to be considered limiting of the scope of the various embodiments or the scope of the claims.

Figure 1A is a front view of a prior art die cast fin.

Figure 1B is a front view of the compartment of the device with the die cast fins shown in Figure 1A removed.

Figure 1C is a cross-sectional view taken generally through the line A to A shown in Figure 1B.

1D is a schematic perspective view of a device having a die-cast fin of the prior art.

2 is a general perspective view of a die cast fin with an opening and a separate cover in accordance with certain features of the present disclosure.

FIG. 3 is an exploded view of the die cast fin of FIG. 2 showing the coupling mechanism between the die cast fin and the cover in accordance with certain features of the present disclosure.

4A-4C are general perspective views of die cast fins in open and closed configurations in accordance with certain features of the present disclosure.

FIGS. 5A-5C are general perspective views of a device having a dual-line memory module and a die-cast fin with a lid in an open and closed configuration in accordance with certain features of the present disclosure.

While the present disclosure is susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and will be described in further detail herein. It should be understood, however, that the present disclosure is not intended to be limited to the particular forms disclosed. On the contrary, the present disclosure is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosure as defined by the appended claims.

The present disclosure relates to a die-cast fin having an opening and a cover. The cover can be easily opened to allow easy access to components located under the die cast fins. Therefore, the die cast fins do not need to be removed from the device when it is necessary to access components of the device.

The various embodiments are described with reference to the accompanying drawings, wherein the same reference characters are used to designate similar or equivalent elements throughout. The drawings are not necessarily to scale and are provided only to illustrate the present invention. It should be understood that numerous specific details, relationships and methods are set forth to provide a thorough understanding. However, it will be readily apparent to those of ordinary skill in the art that various embodiments may be practiced without one or more of the specific details or in other ways. In other instances, well-known structures or operations are shown in detail in order to avoid obscuring certain features of the various embodiments. The various embodiments are not limited to the illustrated order of actions or events, eg, some actions may occur in different orders and/or concurrently with other actions or events. Furthermore, not all illustrated acts or events are required to implement methods in accordance with the present novel.

For the purposes of this embodiment, unless expressly stated otherwise, the singular includes the plural and vice versa. The noun "including" means "including but not limited to". In addition, approximate words such as "about, almost, substantially, approximately" and similar words may be used herein to mean, for example, "at", "near, near at", "at 3%" Within 5% (within 3-5% of)”, "within acceptable manufacturing tolerances" or any logical combination thereof. Similarly, the terms "vertical" or "horizontal" are intended to additionally include "within 3-5%" of the vertical or horizontal direction, respectively. In addition, directional words such as "top," "bottom," "left," "right," "above," and "below" are intended to be relative to the equivalent directions described in the referenced figures, from the referenced object or element. is understood in the context of an object or element, such as from the common location of an object or element, or as otherwise described herein.

Referring to FIG. 2 , a die-cast fin or cooling device 210 (referred to herein as a “die-cast fin”) according to an embodiment of the present disclosure has an opening that can be closed or opened by a cover 212 . Generally, die cast fins 210 have a cooling plate and a plurality of fins formed on the cooling plate to form a protective space for computing elements. In one embodiment, the cover 212 is coupled to the cooling plate. In Figure 2, the cover 212 is removed from the die-cast fins 210 for clarity.

2 , according to various embodiments of the present disclosure, openings are formed in a portion of the die-cast fins 210 such that the lengths of some fins are shortened by the openings compared to the lengths of fins that are not interrupted by the openings. In one embodiment, the shorter fins are formed on the first side of the opening of the die-cast fins 210, and the shorter fins extend perpendicular to the first side. In further embodiments, the longer fins are formed at or near the second side of the opening of the die cast fin 210, the second side is perpendicular to the first side, and the longer fins extend along the second side. In a further embodiment, no fins are formed on the third side of the opening of the die-cast fins 210, and the third side is parallel to the first side. In another further embodiment, no fins are formed or formed on the fourth side of the opening of the die-cast fins 210 parallel to the second side compared to the number of longer fins formed near the second side Fewer fins.

In one embodiment, the cover 212 coupled to the die cast fin 210 is provided by Coupling means or fasteners, such as pins or screws 214, which pass through through holes 216 in cover 212 and are inserted into receiving portions 218 formed in a portion of the die cast fins, are locked or unlocked. The receiving portion 218 may be a socket or a through hole. The coupling of the cover 212 to the die cast fins 210 will be discussed with reference to FIG. 3 .

According to various embodiments of the present disclosure, the through hole 216 is formed in a portion protruding from the side of the cover 212, as shown in FIGS. 2 to 5C. In one embodiment, the protruding portion is recessed relative to the top surface of the cover 212 . In one embodiment, the recessed protrusion of cover 212 is surrounded by a wall. In one embodiment, a gap is formed between one of the walls and the protruding portion of the cover 212 so that when the cover 212 is closed, a portion of the die cast fins 210 is visible through the gap. In one embodiment, the tops of the pins or screws 214 inserted into the receiving portions 218 of the die cast fins 210 are positioned below the top surface of the cover 212 in the closed configuration.

According to various embodiments of the present disclosure, the die-cast fin 210 has a recessed portion at one side of the opening. The recessed portion of the die-cast fin 210 is the size and shape of the recessed protruding portion that receives the cover 212 . According to an embodiment, the fins formed between the edge and the first side of the recessed portion of the die-cast fins 210 are even shorter than the shorter fins, so that the even shorter fins are located on one side of the plurality of shorter fins between the fins and a plurality of shorter fins on the other side. See Figures 2 through 5C.

Generally, the die-cast fins 210 are made of zinc, aluminum, or zinc-aluminum alloy. However, the material used to cast the fins 210 is not limited to zinc, aluminum, or zinc-aluminum alloy, and can be made of any material suitable for die casting. Although the cover 212 may be made of the same material as the die cast fins 210, it is preferred that the cover be made of a different material that is weather resistant/heat resistant/water resistant. For example, cover 212 is made of a polymer (eg, plastic) that can be easily and inexpensively formed into a desired shape. However, the material of cover 212 does not Limited to plastic, the cover can be made of any material that can be easily and inexpensively formed into the shape of the cover.

According to various embodiments of the present disclosure, the cover 212 has parallel walls facing each other, as shown in Figures 2, 3, 4B, 5A, and 5C. Each wall extends upright from a corresponding edge of cover 212 such that the wall is perpendicular to the top surface of the cover. The walls of the cover 212 are inserted into the openings of the die cast fins 210 when the cover is closed. In one embodiment, the heights of the two parallel walls are the same.

Referring to Figures 4A to 5C, the size of the opening of the die-cast fin 210 is such that when the lid is closed, there is no space or very little space between the wall of the lid 212 and the side of the opening of the die-cast fin to which the wall corresponds . Thus, when the cover 212 is closed, a seal is achieved, thereby protecting the elements beneath the die cast fins 210 from the outside. According to various embodiments of the present disclosure, the cover 212 has additional walls extending upright from the other edge of the cover such that the additional walls are perpendicular to the two parallel walls. In one embodiment, the height of the additional wall and the two parallel walls are the same. In another embodiment, the height of the additional wall is less than the height of the two parallel walls.

Various coupling mechanisms may be employed to couple the cover 212 to the die cast fins 210 . Referring to FIG. 3, for example, the cover 212 has protrusions 220 formed on two opposite sides near the edge of the cover. However, the positions of the protrusions 220 are not limited thereto, and the protrusions may be formed at different positions of the cover 212, such as near another edge or a middle portion of the cover. The die cast fin 210 has a receiving portion 222 formed near the opening or on the inner wall of the opening, and the receiving portion 222 is shaped to receive the protrusion 220 . The position of the receiving portion 222 is determined according to the position of the corresponding protrusion 220 . In one embodiment, the protrusions 220 of the cover 212 are inserted into corresponding receiving portions 222 of the die-cast fins 210 . Various hinge mechanisms may be employed to couple cover 212 and die cast fins 210 instead of the combination of protrusion 220 and receiving portion 222 described above. Lid 212 even when the lid is in the open configuration It is preferable not to completely remove from the die cast fins 210 . For example, protrusions may be formed on the die-cast fins 210 . Also, a receiving portion or a through hole for receiving a protrusion may be formed in the cover 212 .

In an alternative embodiment, the cover 212 is completely removed from the die cast fins 210 when the cover is in the open configuration. For example, the lid 212 has at least one handle such that the lid can be opened by pulling the handle away from the die cast fins 210 .

Referring to Figure 4A, when the lid 212 is in the closed position, the lid is directly coupled to the die cast fins 210 or locked by a locking mechanism. In one embodiment, a through hole 216 (shown in FIG. 3 ) is formed in a portion of the cover 212 . Additionally, pins or screws 214 passing through through holes 216 are received in receiving portions 218 formed in a portion of die cast fins 210 . Alternatively, instead of using pins or screws 214, the protrusions may be formed in a portion of the cover 212 where the through holes 216 are not required. When the lid 212 is in the closed configuration, the tabs can be inserted directly into the receiving portions 218 of the die cast fins 210 .

Referring to FIG. 4B , in order to open the cover 212 , the cover may be lifted by rotating about the axis of the protrusion 220 and the receiving portion 222 . Before the cover 212 is lifted, the pin or screw 214 needs to be unscrewed from the receiving portion 218 to prevent the cover 212 from being locked by the pin or screw 214, as shown in Figure 4A. In one embodiment, even when the cover is lifted and opened, once the cover 212 is unlocked, the pin or screw 214 may remain in the cover's through hole 216, as shown in Figure 4B.

Referring to FIG. 4C , the cover 212 is closed by rotating downward about the axes of the two protrusions 220 and the receiving portion 222 corresponding to the protrusions 220 . Once the lid 212 is closed, the lid 212 can be locked by inserting a pin or screw 214 into the receiving portion 218 , or by rotating the receiving portion 218 .

Referring to Figure 5A, in order to replace or augment the computing or telecommunications device 200 The memory module 230 can be connected to the memory module 230 mounted on the printed circuit board assembly through the opening of the die-cast fins 210 . This can be achieved by opening the cover 212 without removing the entire die cast fin 210 from the device 200 . Thus, referring to FIG. 5B , the memory module 230 can be replaced or expanded without damaging other components of the computing or telecommunications device 200 . 5C, once the memory module 230 is replaced, modified or expanded, the cover 212 is closed to avoid the possibility of damaging other components when the entire die cast fin 210 is removed from the computing or telecommunications device 200.

While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example and not limitation. Various changes may be made in accordance with the embodiments disclosed herein without departing from the spirit or scope of the present disclosure. Accordingly, the breadth and scope of the present invention should not be limited by any of the above-described embodiments. Instead, the scope of the present invention should be defined according to the following claims and their equivalents.

One or more elements or features or steps, or any part thereof, from any of the following claims may be combined with one or more elements or features or steps, or any part thereof, from any other claim, or any combination thereof: to form one or more additional embodiments and/or claims of the present disclosure.

While the invention has been shown and described with respect to one or more embodiments, equivalents and modifications will come to mind to those of ordinary skill in the art upon reading and understanding this specification and drawings. Additionally, although a particular feature of the present invention may have been disclosed with respect to only one of the several embodiments, for any given or particular application, such feature may be combined with one or more of the other embodiments as may be required and advantageous Other feature combinations.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used herein, the singular form "a (a, an, the)" is also intended to include the plural unless the context clearly dictates otherwise. In addition, the nouns "including, includes", "having, has, with" or their conjugations are used in the embodiments and/or the scope of the patent application, and such nouns are intended to be used with similar nouns "including" way is included.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. Furthermore, terms such as those defined in common dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technical field, and unless explicitly defined herein, are not to be interpreted as idealized or overly formalized.

210: Die-cast fins

212: Cover

214: pin or screw

216: Through hole

218: Receive part

Claims (8)

A die-casting cooling device for protecting a computer component, the die-casting cooling device comprising: a cooling plate extending between the two side walls, the cooling plate and the side walls arranged to form a protective space for computer components; a plurality of die-cast fins formed on the cooling plate and extending away from the protection space; an opening formed in the cooling plate to provide access to the protective space; and a cover coupled to the cooling plate and movable between a closed position in which the cover prevents access to the protective space and an open position, the cover providing access to the protective space in the open position catch. The die casting cooling device of claim 1, wherein the cover is pivotally coupled to the cooling plate. The die casting cooling device of claim 1, wherein the cover has parallel sides and a plurality of cover walls extending from each side of the cover such that the cover walls face each other. The die casting cooling device of claim 3, wherein a plurality of protrusions are formed outwardly from each of the cover walls, and the opening has a corresponding plurality of receiving portions configured to receive the protrusions. The die casting cooling device of claim 3, wherein the cover walls are inserted in the opening in the closed position such that the opening is sealed by the cover. The die casting cooling device of claim 5, wherein a top surface of the cover is aligned with a top surface of the plurality of die casting fins in the closed position. The die casting cooling device of claim 1, further comprising a fastener inserted through a through hole of the cover. The die-cast cooling device of claim 7, wherein the plurality of die-cast fins include a receiving portion by which the fastener is received to directly couple the cover to the cooling plate.

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