KR100878027B1 - Case for electric elememts with cooling function - Google Patents

Abstract

A case for electronic device having cooling function capable of improving heating function is provided to prevent damage of inner parts due to rainwater. A case for electronic device having cooling function capable of improving heating function comprises a door part(100a) and a body part(100b). In the door part, a door part heat sink(101) is formed in order to protrude a contact surface. The body part includes a substrate(105a) and a heat spreader(102). A heating part is mounted on the substrate. The heat spreader is positioned on a front surface of the substrate.

Description

CASE FOR ELECTRIC ELEMEMTS WITH COOLING FUNCTION}

The present invention relates to an electronic device housing, and more particularly, to an electronic device housing having a cooling function for improving the storage efficiency and heat generation function when the communication and broadcasting equipment is stored and stored therein.

Telecom and broadcast repeaters or system equipment consists mainly of various electronic components, including high-power amplifiers, to realize their functions, and the enclosure protects the internal components from the external environment (dust, rain, humidity, human access, etc.). The forced heat or natural convection cooling is carried out by heat sink or heat exchanger formed outside the enclosure by heat from several W to hundreds of W generated by each power loss to increase the temperature inside the enclosure and the temperature of each component. It prevents the reduction of product life and reliability, and makes the system operate stably.

1 to 4 show a prior art enclosure, FIG. 1 is a plan view of an open state of a prior art enclosure, FIG. 2 is a front view of an open state of the enclosure of FIG. 1, and FIG. 3 is a closed view of the enclosure of FIG. FIG. 4 is a bottom view of the enclosure of FIG. 1 in the closed state. FIG.

As shown in FIGS. 1 to 4, the wall-mounted enclosure 10 according to the related art forms a heat sink 16 in the body portion 10b in the application of a heat dissipation structure, or a door part to secure a heat dissipation area. Also in (10a), a method of forming a heat sink (11) and fixing the heat generating parts 13 to the heat sinks 11 or 16 is used for heat transfer. In addition, the external connector 22 connected to the system is mainly located at the bottom (bottom portion) of the enclosure 10 in order to prevent flooding due to rainwater, but when the enclosure 10 is miniaturized, it is inevitably external as shown in FIG. 2. The connector 22 may be located on the bottom (bottom) of the door part 10a.

The structure of such a prior art enclosure 10 should be connected to the cable 21 for the connection of power, optical, coaxial communication lines, etc. as the heating element 13 attached to the door portion 10a as shown in FIG. The opening of (10a) should be long enough to avoid problems with the swing and flexible materials should be used. Therefore, when the door part 10a is closed, the cable 21 is caught in the gap between the door part 10a and the body part 10b, so that the door part 10a is not completely closed and a gap is generated. In this case, inundation may occur during rainy weather, and the power and communication lines may be disconnected, causing a failure.

In addition, in case of a coaxial communication line and an optical fiber, the radius of rotation is small when it is suddenly bent, which may cause a loss. That is, when the external connector 22 for external connection is placed at the bottom of the door part 10a, the connection cable moves together according to the swing of the door part 10a when the door part 10a is opened and closed. It has a problem to consider the swing of the cable (swing).

In addition, the aforementioned prior art enclosure requires the application of effective cooling techniques considering heat generation of each component in designing the structure of the enclosure 10. Among them, in the case of forced air cooling using a fan, cooling noise, power consumption, The disadvantages of management problems due to the life of the fan and the fact that natural air cooling requires a relatively large contact area with air, so the heat sink or enclosure has to be increased in proportion to the amount of heat generated.

In addition, when the heat generating part 13 is divided and assembled into the door part 10a to which the heat sink 13 is attached, a problem arises that assembly is complicated and the structure becomes complicated.

In addition, when the door part 10a is opened, rain rains into the enclosure and causes internal parts to be damaged.

Therefore, the present invention is to solve the problems of the prior art enclosures, which is divided into a body portion and a door portion in a housing structure in which the door portion is opened, the heat sink mounted on the door portion of the heat generating parts mounted on the body portion Cooling performance of the inside of the enclosure can be improved by conducting cooling by conduction to the inside of the enclosure. When opening the door part, the door part is opened upward and fixed to prevent the door part from flowing into the body during rainy weather, thereby preventing the damage of the internal parts due to the rain. Its purpose is to provide.

An electronic device accommodating housing having a cooling function of the present invention for achieving the above object includes a door portion in which a door portion heat dissipation plate is formed to protrude a contact surface toward a body portion on an inner surface thereof; A body part including a substrate on which a heat generating part is mounted, and a heat spreader positioned at the front of the substrate such that the heat generating surface of the heat generating part is in thermal contact with the rear surface and the door part is in thermal contact with the front surface when the door part is closed; It consists of.

In the above-described configuration, the inner surface of the door part is configured to be lit when the door part is opened to perform a lighting function for the body part.

The door part and the body part are coupled by a torque hinge at the rear side edges of the upper part facing the door part and the body part, and the door part and the body part are incised across the respective sides of the door part and the body part. When the door bar-shaped door stopper is attached and the door part is closed to the body part, the boundary surface of the side where the door part and the body part meet is at the bottom vertex in the front direction at the bottom of the side at the upper vertex of the side of the enclosure. It is formed to have a diagonal diagonal. In addition, the bottom of the body portion is provided with a connection portion where the external connectors are arranged so that the external connectors are formed only on the bottom surface of the body portion.

Next, the heat spreader has a through hole formed in at least one position corresponding to the slider formed in the body portion, and a heat generating surface of the heat generating component is formed at a position corresponding to a heat generating surface of the heat generating component mounted on the substrate. The groove is inserted into the heat contact is formed.

And a support protrusion protrudes from an inner side of the wall side of the body portion at a position corresponding to the through hole formed in the heat spreader, and a slider inserted into the through hole at an end portion of the door portion side of the support protrusion. The elastic member is inserted into the outer circumferential surface of the slider.

In the above-described configuration, a heat conduction pad is positioned between the heat spreader and the heat generating part to improve heat transfer efficiency from the heat generating part to the heat spreader, and a heat conduction sheet is positioned between the heat spreader and the door heat sink. It is configured to improve the heat transfer efficiency to the door heat sink.

The electronic device accommodating housing having the cooling function of the present invention having the above-described configuration constitutes a door heat dissipation plate only in the door part and excludes the configuration of the heat dissipation plate in the body part, thereby increasing the component mounting rate of the body part, and thus all parts It is possible to mount all the body to the remarkably easy to place the parts inside the enclosure, it is possible to reduce the size of the enclosure, to reduce the manufacturing cost of the enclosure.

In addition, all wiring such as electric wires, communication lines, etc. for connecting the components mounted to the enclosure are positioned in the body so that the wires are not interposed between the door and the body and do not interfere with the closing function of the door when the door is closed.

In addition, the interface between the door and the body forms an oblique line in the vertical direction to increase the area of the bottom of the body, and attaches all external connectors to the bottom of the wider body to form a connection to connect the external device to the bottom of the body. In order to be able to perform all in the so that the external device can be connected to the enclosure regardless of opening and closing of the door.

In addition, since the lamp is turned on while the door part is opened upwards with respect to the body part when the door part is opened, and the lamp is turned on during rainy weather, when the door part is opened in a rainy weather, the rainwater is prevented from entering into the body part by the door part. By the lighting of the lamp, the operation can be easily performed even in a dark place.

The enclosure of the present invention having the above-described configuration facilitates the mounting of the heat generating parts on the body by removing the configuration of the heat sink from the body portion without deteriorating the heat dissipation performance, thereby making it possible to miniaturize the enclosure, thereby producing the cost of the enclosure. Provides the effect of reducing

In addition, the enclosure of the present invention described above does not swing the power line, the optical path, the coaxial communication line according to the opening and closing of the door (Swing), the prior art provides an effect that solves the problem of cable jamming (Cable) problem.

In addition, the above-mentioned enclosure of the present invention provides an effect of improving the work efficiency by preventing the rainwater to enter the body portion when opening the door portion to perform the installation installation even in rainy weather.

Hereinafter, with reference to the accompanying drawings showing an embodiment of the present invention will be described in more detail the present invention.

5 is a partial plan view from above of a top view of an enclosure for an electronic device having a cooling function according to an embodiment of the present invention, FIG. 6 is a plan view of the enclosure of FIG. 5, FIG. 7 is a front view of the enclosure of FIG. 5, and FIG. 8. 5 is a bottom view of the enclosure of FIG. 5, FIG. 9 is a right side view of the enclosure of FIG. 5, and FIG. 10 is a right side view of an open state of the door part of the enclosure of FIG. 5.

5 to 6 as shown in Figure 6 to the electronic device housing having a cooling function according to an embodiment of the present invention (hereinafter referred to as "the housing 100") is attached to the wall surface, is installed on the front The door portion 100a having the heat dissipation fins 108 formed therein, the body portion 100b having the heat dissipation fins formed on the rear surface, and the support bracket 100c attached to the rear of the body portion 100b in a 'c' shape to perform a function of a pedestal. It is composed of

In the above-described configuration, the door part 100a and the body part 100b are coupled to each other by the torque hinge 112 along the rear side side of the upper portion as shown in FIG. 10, and the door part in which the torque hinge 112 is formed. The side of the body portion (100a) and the body portion (100b) is a folding bar-shaped door stopper 111 that supports to be fixed while making an angle of about 90 ° with respect to the body portion (100b) when the door portion (100a) is opened An end is hinged to the door part 100a and the other end is hinged to the body part 100b and attached to the door part 100a and the body part 100b. At this time, the door stopper 111 maintains the open state of the door part 100a, and the torque hinge 112 prevents the sudden closing of the door part 100a. The latch 115 is attached to the door part 100a and the body part 100b to maintain a closed state.

When the door part 100a is opened by setting the enclosure 100 so that the bottom face downward as shown in FIG. 10 by the coupling structure of the door part 100a and the body part 100b as described above, The door part 100a is fixed while forming an angle of about 90 ° by the rear door stopper 111 upward in the body part 100b that is vertically placed. Accordingly, when it rains, the door part 100a performs a function of the blocking film, thereby preventing rainwater from flowing into the body part 100b.

In addition, when the door part 100a is closed, the door part 100a and the body part 100b have a boundary surface 109 formed at the side of the door part 100a and the body part 100b, as shown in FIG. 9. ) Is inclined diagonally so that the bottom surface of the door portion (100a) is narrow, the bottom surface of the body portion (100b) is wide. In addition, only the bottom surface of the body part 100b forms a connection part 120 on which external connectors such as an RJ45 connector 116, a control dial 117, a coaxial cable connector 118, and an optical cable connector 119 are installed. As a result, the external device may be easily connected to the enclosure 100 by using a connection part formed on the bottom surface of the body part 100b regardless of the opening of the door part 100a.

As shown in FIG. 10, a lamp 113 is attached to an inner surface of the door part 100a to perform illumination when the door part 100a is opened upward.

Next, the internal structure of the enclosure 100 will be described.

As shown in FIG. 5, the door part 100a includes a door part heat dissipation plate 101 which is mounted such that the contact surface protrudes toward the body part 100b from the inner side of the door part 100a opposite to the surface on which the heat dissipation fins 108 are formed. Is formed. The door heat dissipation plate 101 may be formed by recessing the surface of the door part 100a so as to have a flat surface in the direction from the outer side to the inner side.

When the door part 100a is closed to the body part 100b, the body part 100b may have a heat spreader 102 in close contact with the door part heat dissipation plate 101, and a heat generating surface may contact the rear surface of the heat spreader 102. The necessary components separate from the substrate 105a on which the heat generating parts are mounted are mounted. In addition, in order to increase the heat transfer efficiency of the door portion heat sink 101 and the heat spreader 102 in contact when the door portion 100a is closed, a heat conductive sheet 104 is provided between the door portion heat sink 101 and the heat spreader 102. In this case, the thermally conductive sheet 104 is attached to either the door heat dissipation plate 101 or the heat spreader 102.

In addition, the body portion (100b) is formed with a plurality of support protrusions (103a) protruding in the form of a cylindrical, square pillar on the inner surface of the wall side of the body portion (100b) for the installation of the heat spreader 102, the support A slider 103 is formed to protrude from an end portion of the protrusion 103a on the side of the door portion 100a, and an elastic member 107 is inserted into the outer surface of the slider 103. A through hole corresponding to the slider 103 is formed in the heat spreader 102, and the heat spreader 102 is mounted on the substrate 105 a on the rear surface of the heat spreader 102 facing the mounting surface of the heat generating component 105 of the substrate 105 a. Each heat generating part 105 is inserted into a position corresponding to each of the heat generating parts 105 so that the heat generating surfaces of the heat generating parts 105 having different heights can be easily contacted with the heat spreader 102. Grooves 102a are formed to be in contact with the surface of the spreader 102.

The heat spreader 102 having the above-described configuration has a slider 103 through a through-hole so that the substrate 1105a on which the heat generating component 105 is mounted on the body portion 100b can be moved back and forth in the slider 103. It is coupled to and installed in the front of the substrate 105a. At this time, the heat generating surface of the heat generating part 105 is inserted into the groove 012a formed in the back surface of the corresponding heat spreader 102, respectively, and is in contact with the back surface of the heat spreader 102. In this process, the heat conduction pad 106 is installed between the heat generating part 105 and the heat spreader 102 so that the heat generating part 105 and the heat spreader 102 have good thermal contact.

The elastic member 107 fitted to the slider 103 supports the heat spreader 102 at the bottom of the heat spreader 102 to provide the heat spreader 102 with an elastic force directed toward the door portion 100a. When the part 100a is closed, the front surface of the door part heat sink 101 and the heat spreader 102 are brought into close contact with each other, and the door part 100a is closed in an inclined state without being parallel to the surface of the heat spreader 102. Moreover, each portion of the heat spreader 102 is moved by the elastic member 107 to have different positions on the slider 103 so that the contact between the door radiating plate 101 and the heat spreader 102 is improved. Here, the elastic member 107 may be implemented with rubber, coil springs or leaf springs.

Enclosure 100 according to the present invention having the above-described configuration is mounted on the door portion heat radiating plate 101 only in the door portion (100a) and the heat spreader 102 in thermal contact with the heat generating parts without mounting the heat sink in the body portion (100b) When the door part 100a is closed, the heat spreader 102 in contact with the heat radiating part 101 of the door part heat sink 101 of the door part 100a and the heat generating part 105 are in thermal contact with each other to heat the door. By discharging to the outside through the heat dissipation plate 101 and the heat dissipation fins 108 formed on the outside, the inside of the enclosure 100 is cooled.

According to such a configuration, since the body portion 100b does not need to install a separate heat sink, the component mounting space is enlarged so that all the components to be installed in the door portion 100a can be mounted on the body portion 100b.

In addition, since the lines for communication and power supply connecting the parts are all arranged inside the body portion 100b, when the door portion 100a is closed, the lines are sandwiched between the door portion 100a and the body portion 100b. Breakage or loss of signal transmission is prevented.

And by forming a connecting portion on the bottom of the body portion (100b) so that the external device can be connected to the housing 100 regardless of opening and closing of the door portion (100a).

1 is a plan view of an open state of a prior art enclosure;

2 is a front view of the open state of the enclosure of FIG.

3 is a right side view of the enclosure of FIG. 1 in a closed state;

4 is a bottom view of the enclosure of FIG. 1 in a closed state;

5 is a partial plan view from the top of the electronic device housing having a cooling function according to an embodiment of the present invention,

6 is a plan view of the enclosure of FIG.

7 is a front view of the enclosure of FIG. 5;

8 is a bottom view of the enclosure of FIG. 5, FIG.

9 is a right side view of the enclosure of FIG. 5;

10 is a right side view of the door of the enclosure of FIG. 5 in an open state.

Description of the main symbols in the drawings

100: enclosure 100a: door part

100b: body portion 100c: support bracket

101: door heat sink

102: heat spreader

103: slider 104: thermal conductive sheet

105: heat generating component 106: thermal conductive pad

107: elastic member 108: heat dissipation fin

109: interface 111: door stopper

112: torque hinge 113: lamp

115: latch

Claims (10)

A door part having a door part heat dissipation plate formed on an inner surface thereof such that a contact surface protrudes toward the body part; A body part including a substrate on which a heat generating part is mounted, and a heat spreader positioned at the front of the substrate such that the heat generating surface of the heat generating part is in thermal contact with the rear surface and the door part is in thermal contact with the front surface when the door part is closed; Electronic device housing having a cooling function, characterized in that consisting of. The enclosure for an electronic device having a cooling function according to claim 1, wherein the door part and the body part are coupled by a torque hinge at an upper back side edge of the door part and the body part facing each other. The enclosure for an electronic device having a cooling function according to claim 2, wherein the door part and the body part are attached to both side surfaces thereof with a folding bar-shaped door stopper that extends across the side of the door part and the body part. According to claim 2, The door portion and the body portion is formed so that the interface between the interface between the door portion and the body portion from the upper rear vertex of the side of the enclosure has a diagonal diagonal to the front vertex of the bottom of the side Electronic device housing having a cooling function, characterized in that. The housing of claim 4, wherein the bottom surface of the body portion includes a connection portion in which external connectors are formed. The method according to claim 1, wherein the heat spreader, Through-holes are formed in at least one position corresponding to the slider formed in the body portion, and the heat generating surface of the heat generating parts is inserted into the rear surface at a position corresponding to the heat generating surface of the heat generating parts mounted on the substrate. The housing for an electronic device having a cooling function, characterized in that the groove is formed in contact with the back of the heat processing. The support body of claim 1, wherein a support protrusion protrudes from an inner side of a wall at a position corresponding to a through hole formed in the heat spreader, and is inserted into the through hole in a cross section of the door side of the support protrusion. The slider is formed, the housing for an electronic device having a cooling function, characterized in that the elastic member is inserted into the outer peripheral surface of the slider. The enclosure for an electronic device having a cooling function according to any one of claims 1 to 7, wherein a heat conductive pad is positioned between the heat spreader and the heat generating part. The enclosure for electronic equipment according to any one of claims 1 to 7, wherein a heat conductive sheet is positioned between the heat spreader and the door heat dissipation plate. The enclosure for an electronic device having a cooling function according to any one of claims 1 to 7, wherein a lamp is provided on an inner surface of the door part.

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