JP2003092482A - Heat dissipation structure for communication equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a miniaturized heat dissipation structure. SOLUTION: A lower contact plate 25 for releasing heat dissipated at a lower heat radiation panel 26 to a lower case 1b is fixed respectively to both sides of the lower heat dissipation panel 26. A pair of the lower contact plates 25 are brought into strong press contact with an inner side face of the lower case 1b in a state of being fixed to both sides of the lower heat dissipation panel 26, and thus the heat radiated at the lower heat dissipation panel 26 is transmitted to the lower case 1b and dissipated. By the constitution, since the heat is efficiently radiated by the lower case 1b, a radio access point 1 is miniaturized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation structure for communication equipment such as a wireless access point to which a CATV signal is input.

[0002]

2. Description of the Related Art In recent years, broadband communication services have become popular, and C is one of the broadband communication services.
There is an ATV two-way communication service. To receive this CATV two-way communication service, the CAT must be sent to the subscriber's house.
It is necessary to pull in the V cable. However, in an existing apartment house such as a condominium, it is difficult to newly install the CATV cable because approval of the board of directors is required. Therefore, there has been proposed a method of providing a CATV two-way communication service without newly constructing a CATV cable.

A schematic configuration of this method is shown in FIG. CAT
The V cable is laid via a telephone pole, and one end of the CATV cable is drawn into the wireless access point 101. The structure of this wireless access point 101 is shown in FIG. CATV signal is wireless access point 10
When input to 1, the CATV signal is supplied to the input unit 103 as an RF input as shown in FIG. A level adjustment or the like is performed in the input unit 103, and a CATV signal from the input unit 103 is sent to the cable modem 1
04. CA in the cable modem 104
A signal in a predetermined band is extracted from the TV signal and converted into baseband packet data. The packet data is supplied to the wireless router 105. In this case, the cable modem 104 and the wireless router 105 are
LA of Ethernet (IEEE802.3) which is the standard of N
It has an N interface.

The wireless router 105 is a device for connecting LANs to each other and LANs to WANs (Wide Area Networks), and performs packet relay processing in the network layer of the OSI basic reference model. Also, TCP /
In the IP network, the relay route is controlled by looking at the IP address. Then, the wireless router 105 outputs an RF signal subjected to SS-DS (direct spectrum spread) modulation. This RF signal is radiated from the antenna 102 toward the housing complex 100. The subscriber in the housing complex 100 receives the radio wave radiated from the antenna 102, so that the subscriber can receive the packet data transmitted through the CATV line. When the subscriber sends packet data, the packet data is sent to the CATV line by a route opposite to the above route. Also,
Power is supplied to the wireless access point 101 from a power supply input, and this power is supplied to the power supply unit 106, and the power supply unit 106 supplies power to the cable modem 104 and the wireless router 105.

[0005]

By the way, the cable modem 104 and the wireless router 105 built in the wireless access point 101 are provided with a CPU (Central Processing Uni) for performing respective processes. . Although the CPU depends on its function, it generally needs to be provided with heat radiating means because it generally generates heat. Therefore, there is a problem that the wireless access point 101 having the configuration as shown in FIG. 10 cannot be housed in a small closed space and cannot be downsized.

Therefore, an object of the present invention is to provide a heat dissipation structure which can downsize communication equipment such as a wireless access point.

[0007]

In order to achieve the above object, the heat dissipation structure of the communication device of the present invention has a circuit means in a hermetically sealed space formed by fitting an upper case and a lower case together. Is a heat dissipation structure for communication equipment in which
Lower contact plates having an L-shaped cross section are fixed to both sides of a lower heat radiation panel held on the upper part of the lower case, and a surface of the lower contact plate facing the inner surface of the lower case is bent in two steps. The lower part of the facing surface is pressed against the inner surface of the lower case, whereby the heat of the lower heat radiation panel is transferred to the lower case via the lower contact plate.

In the heat dissipation structure of the communication device of the present invention, a plurality of slits may be formed on the facing surfaces of the lower contact plate. Further, in the heat dissipation structure of the communication device of the present invention, the lower heat dissipation panel is rotatable with respect to the lower case with one side of the lower heat dissipation panel as a pivot, and a lower portion of the lower contact plate. Even if the lower contact plate does not come into contact with the upper edge of the lower case when the lower heat dissipation panel is rotated and stored in the lower case, Good.

Further, in the heat dissipation structure of the communication device of the present invention, upper contact plates having an L-shaped cross section are fixed to both sides of the upper heat dissipation panel held in the lower part of the upper case, and the upper contact plates are attached. The surface of the plate facing the inner surface of the upper case is pressed against the inner surface of the upper case, so that the heat of the upper heat dissipation panel is transferred to the upper case via the upper contact plate. Good. Furthermore, in the heat dissipation structure of the communication device of the present invention, a plurality of slits may be formed on the facing surfaces of the lower contact plate and the upper contact plate.

According to the present invention, the heat of the lower radiating panel is transmitted to the lower case through the lower contact plate pressed against the inner surface of the lower case, so that the heat radiating effect is improved. You can Therefore, the communication device can be downsized even if the circuit unit that generates heat is housed in the lower case. Further, by providing the lower contact plate with a plurality of slits, the lower contact plate is separated into a plurality of pieces, and each contact piece comes into contact with the inner surface of the lower case independently. Therefore, even if one piece floats from the inner surface of the lower case for some reason, the other contact piece can conduct heat to the lower case. Furthermore, since the lower corner of the lower contact plate is bent inward, the lower contact plate contacts the upper edge of the lower case when the lower heat dissipation panel is rotated and stored in the lower case. It becomes possible to store easily without doing.

Furthermore, if the heat of the upper heat dissipation panel is transmitted to the upper case via the upper contact plate that is in contact with the inner surface of the upper case, the heat dissipation effect can be further improved. Therefore, the communication device can be downsized even if the circuit means that generates heat is housed in the upper case. Furthermore, by providing a plurality of slits on the upper contact plate, heat can be surely conducted to the upper case as described above. Furthermore, since the lower contact plate comes into contact with the inner surface of the lower case and the upper contact plate comes into contact with the inner surface of the upper case, the ground potential of the stored circuit means is the same as the ground potentials of the upper and lower cases. Therefore, the circuit means can be stably operated.

[0012]

1 and 2 are sectional views showing the overall structure of a wireless access point, which is an embodiment to which a heat dissipation structure of a communication device of the present invention is applied. However, FIG. 1 is a plan sectional view of the wireless access point, and FIG. 2 is a side sectional view thereof. The wireless access point 1 shown in these figures includes a housing including a lower case 1b which is an aluminum die cast case and an upper case 1a which is an aluminum die cast case fitted to the lower case 1b. ing. In this case, a ring-shaped groove 2a is formed on the upper surface of the peripheral edge of the lower case 1b, and an O-ring is housed in the groove 2a and the upper case 1a is fitted therein to form a closed space. The inside of the housing has a waterproof structure. The input unit 3, the cable modem and the power supply unit 22 are housed inside the lower case 1b.
The cable modem is incorporated on the lower board 24. In addition, inside the lower case 1b, the wireless access point 1
Of the display element substrate 23 showing the operating state of the LED by the lighting state of the LED
Is provided. The lighting state of the LED on the display element substrate 23 depends on the window 2 formed on the side surface of the lower case 1b.
It can be observed through b. The window 2b is closed by a transparent member so that the case is kept watertight.

A cable modem is a C that performs modem processing.
A PU is provided, and a lower heat radiation panel 26 for cooling the CPU that generates heat when executing this modem processing is arranged on the upper portion of the lower case 1b. The wireless router housed in the upper case 1a also includes a CPU for executing router processing and the like, and the upper heat dissipation panel 14 for cooling the CPU that generates heat when executing this router processing.
Are arranged in the lower part of the upper case 1a. Further, the power supply unit 22 is fixed to a lower panel 21 provided in the lower portion of the lower case 1b, and when the power supply unit 22 generates heat, the lower panel 21 and the lower case 1b in contact with the lower panel 21 are used. It is designed to dissipate heat. Further, an upper panel 11 is provided on the upper case 1a, and an upper substrate 12 incorporating a wireless router is provided substantially parallel to the upper panel 11.

The characteristic structure of the wireless access point 1 according to the embodiment of the present invention is that the lower heat radiation panel 26 is provided.
The lower contact plates 25 for releasing the heat radiated by the lower case 1b are fixed to both sides of the lower heat radiating panel 26, respectively. The pair of lower contact plates 25 are strongly pressed against the inner surface of the lower case 1b in a state where they are fixed to both sides of the lower heat dissipation panel 26, so that the lower heat dissipation panel 26 dissipates heat. The generated heat is conducted to the lower case 1b and radiated. With this configuration, heat can be efficiently dissipated by the lower case 1b, so that the wireless access point 1 including circuit means for generating heat in the closed space can be downsized. Further, in the wireless access point 1 according to the embodiment of the present invention, the upper contact plates 13 for releasing the heat radiated by the upper heat dissipation panel 14 to the upper case 1a are fixed to both sides of the upper heat dissipation panel 14, respectively. It also features the configuration. The pair of upper contact plates 13 are pressed against the inner surface of the upper case 1a as shown in FIG. 2 in a state of being fixed to both sides of the upper heat dissipation panel 14, whereby heat is dissipated by the upper heat dissipation panel 14. Heat is generated in upper case 1a
It will be conducted to and dissipated. With this configuration,
Since the upper case 1a can efficiently dissipate heat, the wireless access point 1 can be downsized.

Since the lower contact plates 25 contacting the inner surface of the lower case 1b are fixed to both sides of the lower heat radiation panel 26, the earth potential of the cable modem incorporated in the lower board 24 is surely fixed to the lower case. It can be the same potential as the ground potential of 1b. Similarly, the upper contact plate 1 that contacts the inner surface of the upper case 1a on both sides of the upper heat dissipation panel 14
Since the three substrates are fixed to each other, the upper substrate 12
The ground potential of the wireless router incorporated in the can be reliably made to be the same as the ground potential of the upper case 1a. As a result, each circuit of the wireless access point 1 operates stably.

The detailed structure of the lower contact plate 25 is shown in FIG.
Shown in (b) and (c). However, the lower contact plate 2 is shown in FIG.
5 is a front view of FIG. 5, FIG. 3 (b) is a plan view thereof, and FIG. 3 (c) is a side view thereof. As shown in these figures, the lower contact plate 25 is formed into an elongated shape by processing an aluminum plate having a thickness of about 1 mm into an L-shaped cross section. Lower contact plate 2
Mounting part 25a having a plurality of mounting holes 25e
The bent portion 25b stands upright. Mounting hole 25e
Is a screw insertion hole for attaching to the lower heat radiation panel 26, and is, for example, four. In this case, the mounting portion 25
The angle between a and the bent portion 25b is an obtuse angle, and the contact portion 25c is formed to extend from the tip of the bent portion 25b.

The contact portion 25c and the mounting portion 25a form an angle of substantially right angle. That is, the mounting portion 2
From 5a, the bent portion 25b and the contact portion 25 are bent in two stages.
c is stretched. With this configuration, the contact surface formed by the contact portion 25c comes into strong pressure contact with the inner surface of the lower case 1b as described later. A plurality of slits 25d, for example, three slits 25d are formed in the contact portion 25c up to the middle of the bent portion 25b, and the contact surface formed by the contact portion 25c is divided into four contact pieces. Since these divided contact pieces have elasticity independently of each other, even if an unexpected protrusion or the like is formed on the inner surface of the lower case 1b, the divided contact piece corresponding to the protrusion is not affected. Except for this, the contact portion 25c surely comes into contact with the inner surface of the lower case 1b. Therefore, the heat of the lower heat radiation panel 26 can be surely radiated to the lower case 1b via the lower contact plate 25. Since heat is transferred to the case 1b via the lower contact plate 25, the thickness of the lower contact plate 25 is made somewhat thick (about 1 mm or more).

By the way, as shown in FIG. 1, the block composed of the lower substrate 24 and the lower heat radiation panel 26 is rotatably supported at one end by a pivot 27a provided on the supporting portion 27. That is, the block including the lower substrate 24 and the lower heat dissipation panel 26 can be opened around the pivot 27a with respect to the lower case 1b as shown in FIG. As a result, the power supply unit 22 and the display element board 23 provided under the block composed of the lower board 24 and the lower heat dissipation panel 26 can be easily maintained, and the cable modem incorporated in the lower board 24 can be maintained. You will be able to do it. Then, from the state shown in FIG. 6, the block composed of the lower substrate 24 and the lower heat radiation panel 26 is rotated and closed, and the screw 29 inserted into the tip of the lower heat radiation panel 26 is moved as shown in FIGS. 1 and 2. As shown in FIG. 7, a block composed of the lower substrate 24 and the lower heat radiation panel 26 can be housed in the lower case 1b by screwing the mounting piece fixed to the lower panel 21.

When rotating and storing, the lower heat radiation panel 26
The pair of lower contact plates 25 fixed to both sides of the lower case 1b come into sliding contact with the inner surface of the lower case 1b while being strongly pressed. In this case, since the contact portion 25c of the lower contact plate 25 is formed so as to project slightly outward from the mounting portion 25a as shown in FIG. 3, the corner of the lower contact plate 25 contacts the upper edge of the lower case 1b. There may be a case where the block including the lower substrate 24 and the lower heat radiation panel 26 cannot be smoothly stored in the lower case 1b. Therefore, a corner bent portion 25f bent inward is formed at the corner portion of the lower contact plate 25 as shown in FIG. Then, the lower substrate 2
When the block composed of the lower heat dissipating panel 4 and the lower heat dissipating panel 26 is housed by rotating, the corner bent portion 25f allows the corner of the lower contact plate 25 to smoothly contact the upper edge of the lower case 1b without contacting the upper edge thereof. You will be able to store it inside.

The lower contact plate 25 has a contact portion 25 on the bent portion 25b formed at an obtuse angle with respect to the mounting portion 25a.
Since c is formed, when the mounting portion 25a is mounted on the lower radiating panel 26, the contact portion 25c projects outward. Therefore, as shown in FIG. 6, when the mounting portion 25a is attached to the lower heat dissipation panel 26 in a state where the block including the lower substrate 24 and the lower heat dissipation panel 26 is not housed in the lower case 1b, the lower contact plate 25 is used. A plurality of mounting screws 28 shown in FIG.
Loosen. Then, as shown in FIG. 7, the block composed of the lower substrate 24 and the lower heat dissipation panel 26 is a lower case 1b.
When it is stored in, the mounting screw 28 is tightened to the state shown in FIG. By tightening the mounting screw 28 in this manner, the contact portion 25c of the lower contact plate 25 can be strongly pressed against the inner surface of the lower case 1b.

As described above, when the block consisting of the lower substrate 24 and the lower heat radiation panel 26 is rotated with the mounting screw 28 loosened, the corner of the lower contact plate 25 contacts the upper edge of the lower case 1b. Sometimes I don't touch, so
As shown in FIG. 8, the shape of the lower contact plate 25 may be the lower contact plate 25 in which the corner bent portion 25f is not formed.
The upper contact plate 13 has substantially the same structure as the lower contact plate 25, but the upper heat dissipation panel 14 to which the upper contact plate 13 is fixed is fixed.
Cannot rotate with respect to the upper case 1a,
There is no need to provide a corner bend. Further, since the upper contact plate 13 is fixed to the upper heat radiating panel 14 after the upper heat radiating panel 14 is fixed to the upper case 1a, there is no need to provide a bent portion at a contact portion that is substantially right angle to the mounting portion. It may be provided. The upper contact plate 13, the upper heat dissipation panel 14, the lower contact plate 25, and the lower heat dissipation panel 26 described above are
It is preferable to process and create an aluminum plate or a copper plate having excellent thermal conductivity.

[0022]

As described above, according to the heat dissipation structure of the communication device of the present invention, the heat of the lower heat dissipation panel is transmitted to the lower case through the lower contact plate pressed against the inner surface of the lower case. The heat dissipation effect can be improved. Therefore, even if the circuit means that generates heat is stored in the lower case,
The communication device can be downsized. Also,
By providing a plurality of slits in the lower contact plate, the lower contact plate is separated into a plurality of pieces, and each contact piece comes into contact with the inner surface of the lower case independently. Therefore, even if one piece floats from the inner surface of the lower case for some reason, the other contact piece can conduct heat to the lower case. Furthermore, since the lower corner of the lower contact plate is bent inward, the lower contact plate contacts the upper edge of the lower case when the lower heat dissipation panel is rotated and stored in the lower case. It becomes possible to store easily without doing.

Furthermore, if the heat of the upper heat dissipation panel is transmitted to the upper case via the upper contact plate that is in contact with the inner surface of the upper case, the heat dissipation effect can be further improved. Therefore, the communication device can be downsized even if the circuit means that generates heat is housed in the upper case. Furthermore, by providing a plurality of slits on the upper contact plate, heat can be surely conducted to the upper case as described above. Furthermore, since the lower contact plate comes into contact with the inner surface of the lower case and the upper contact plate comes into contact with the inner surface of the upper case, the ground potential of the stored circuit means is the same as the ground potentials of the upper and lower cases. Therefore, the circuit means can be stably operated.

[Brief description of drawings]

FIG. 1 is a plan sectional view showing an overall configuration of a wireless access point, which is an embodiment to which a heat dissipation structure of a communication device of the present invention is applied.

FIG. 2 is a side sectional view showing an overall configuration of a wireless access point which is an embodiment to which a heat dissipation structure of a communication device of the present invention is applied.

FIG. 3 is a diagram showing a detailed configuration of a lower contact plate in the heat dissipation structure of the communication device according to the exemplary embodiment of the present invention.

FIG. 4 is a diagram showing a method of attaching the lower contact plate in the heat dissipation structure of the communication device according to the exemplary embodiment of the present invention.

FIG. 5 is a diagram showing a state in which a lower contact plate is attached in the heat dissipation structure of the communication device according to the exemplary embodiment of the present invention.

FIG. 6 is a diagram showing a state in which a block including a lower substrate and a lower heat dissipation panel is opened in the heat dissipation structure of the communication device according to the exemplary embodiment of the present invention.

FIG. 7 is a diagram showing a state in which a block composed of a lower substrate and a lower heat radiation panel is housed in the heat radiation structure of the communication device according to the exemplary embodiment of the present invention.

FIG. 8 is a diagram showing another detailed configuration of the lower contact plate in the heat dissipation structure of the communication device according to the exemplary embodiment of the present invention.

FIG. 9 is a diagram showing a schematic configuration of a proposed two-way communication service.

FIG. 10 is a diagram showing a configuration of a wireless access point used in a two-way communication service.

[Explanation of symbols]

1 wireless access point, 1a upper case, 1b lower case, 2a groove, 2b window, 3 input unit, 1
1 upper panel, 12 upper substrate, 13 upper contact plate, 14
Upper heat dissipation panel, 21 lower panel, 22 power supply unit,
23 display element substrate, 24 lower substrate, 25 lower contact plate,
25a mounting part, 25b bent part, 25c contact part, 25
d slit, 25e mounting hole, 25f corner bent portion, 26 lower heat radiation panel, 27 support portion, 27a pivot,
28 mounting screws, 29 screws, 100 apartments, 10
1 wireless access point, 102 antennas, 103
Input unit, 104 cable modem, 105 wireless router, 106 power supply unit

Claims (5)

[Claims] 1. A heat dissipation structure for a communication device, wherein circuit means is housed in a hermetically sealed space formed by fitting an upper case and a lower case, and is held on an upper part of the lower case. A lower contact plate having an L-shaped cross section is fixed to both sides of the lower heat dissipation panel, and a surface of the lower contact plate facing the inner surface of the lower case is bent in two steps to form a lower portion of the facing surface. Is pressed against the inner surface of the lower case so that the heat of the lower heat radiation panel is transferred to the lower case via the lower contact plate. 2. The heat dissipation structure for a communication device according to claim 1, wherein a plurality of slits are formed on the facing surfaces of the lower contact plate. 3. One side of the lower heat dissipation panel is used as a pivot,
The lower heat dissipation panel is rotatable with respect to the lower case, and a lower corner portion of the lower contact plate is bent inward. The lower heat dissipation panel is rotated to rotate the lower case. 2. The heat dissipation structure for a communication device according to claim 1, wherein the lower contact plate is prevented from abutting on the upper edge of the lower case when housed inside. 4. An upper contact plate having an L-shaped cross section is fixed to both sides of an upper heat dissipation panel held at a lower portion of the upper case, and a surface of the upper contact plate facing the inner surface of the upper case is fixed. The communication device according to claim 1, wherein the heat of the upper heat dissipation panel is transferred to the upper case through the upper contact plate by being pressed against the inner surface of the upper case. Heat dissipation structure. 5. The heat dissipation structure for a communication device according to claim 4, wherein the lower contact plate and the upper contact plate have a plurality of slits formed on the opposite surfaces.