TWM637283U - Dust-proof telecommunication system - Google Patents

Abstract

A dust-proof telecommunication system is disclosed. The dust-proof telecommunication system includes a chassis, critical components located within the chassis, and a filter module located within the chassis near at least some of the critical components that need to be cooled. For example, the critical components include a central processing unit (CPU), a system on chip (SoC), a memory module, a PCIe card, and/or a chipset. The filter module has a filter cover that surrounds at least in part the critical components, a first air filter located at an inlet of an airflow, and a second air filter located at an outlet. The critical components located at a protective space within the chassis receive and are cooled by the airflow passing through the air filter.

Description

Dustproof Telecom Systems

The present invention relates generally to a dust-proof telecommunications system, and more particularly to a cooling pan/protective cover with a filter assembly.

Telecommunications devices, such as 5G equipment, cellular network base stations, and servers, often have compartments for holding various components, such as a printed circuit board assembly (PCBA), a central processing unit (central processing unit, CPU), a system chip (system on chip, SoC), a memory module, and an on-board chip (on-board chip). Since the telecommunication devices are generally placed in outdoor environments, the components are protected from adverse environmental conditions and unauthorized access by a protective cover/cooling plate/die-cast heat sink (HS) covering the compartment.

Furthermore, telecommunications installations in harsh locations face many challenges, including large amounts of dust, insufficient airflow, and extreme temperatures. Outdoor environments or infrequently accessed storage closets combined with poor airflow can introduce excessive dust into the server hardware, which can eventually lead to failure. Generally, a cooling plate or die-cast heat sink is designed with a fin structure or fins to dissipate the heat generated by the server hardware components.

When heat generated by components builds up inside the server hardware, it can lead to catastrophic failure over time. In general, electronic devices that require more power to operate generate more heat. If the ambient temperature exceeds the upper limit, parts may fail. Even if it is not malfunctioning, excess heat can negatively affect the performance of the component. Furthermore, when electronic components are exposed to excessive heat for more than a period of time, their lifespan is shortened. As electronic devices become more powerful and printed circuit boards become smaller, heat dissipation is more important than ever.

Dust has a negative effect on PCB cooling. Newer computers have less surface area, run faster and have more heat to dissipate in a smaller space. The result is higher temperatures, and a greater sensitivity to dirt and dirt trapping heat. Therefore, in computer or server hardware, a dust filtration system (such as a breathable dust filter) is necessary, as well as intake/cooling fans and/or vents.

Some units, such as edge servers enclosed in a cabinet or small closet, are designed as fanless products with a one-piece overhead heat sink (HS) for cooling. Usually edge servers are compact because they should fit in a limited space. Such devices usually provide a foreign body protection rating of 50 (Ingress Protection, IP or International Protection Rating). The foreign object protection level refers to the level of protection provided by an electronic enclosure against solid objects as well as liquids. In environments where dust or water may damage electronic components, a sealed enclosure is used to prevent such intrusion and securely house the electronic equipment. For cooling purposes, a central processing unit is usually designed as an embedded system chip soldered on a motherboard, and the memory is designed as on-board memory.

For example, in a 5G server, system performance is critical, and a central processing unit should be capable of achieving higher performance in a given environment. General-purpose central processing unit (such as Intel IceLake-SP, EagleStream-SP, or AMD SP3 series) may be equipped with an isolated CPU cooler. Universal central processing units can be produced according to customer requirements, so that they can be assembled into a server without changing the motherboard. If a system is designed with an isolated central processing unit radiator, a server shall be provided with an air filter in front of a chassis to meet the requirements of foreign object protection class 50.

Referring to FIG. 1A and FIG. 1B , in order to meet the foreign object protection class 50 requirement of a general server 100 , a front bezel 101 with a dust filter is attached to the front side of the server. When external air is introduced into the server 100, the front bezel 101 with the dust filter catches dust. However, when attached to the server 100, the front bezel 101 increases the depth of the server chassis. For example, a short depth servo 100 has a chassis with a depth of 400mm, as illustrated in FIG. 1A. When a dust filter bezel 101 having a depth of 45mm is attached to the server 100, the overall depth of the server with the filter becomes 445mm, as exemplified in FIG. 1B. However, due to the limitation of the telecom cabinet environment, some edge servers should be designed with a depth of 300mm~350mm. In this case, the main board (MB) configuration is too crowded to hold a filter module.

The term "under memory" is used to describe, for example, when the memory components of a dynamic random access memory (DRAM) device are physically soldered to a printed circuit board (PCB). This is an alternative to attaching dual in-line memory modules (DIMMs) to a system using mechanical connectors. Due to various constraints and usage models, memory allocations are often present in embedded platforms.

For upper one-piece heatsinks, a memory component in a server should Place the memory according to the following solution so that the memory components are in contact with the heat sink to dissipate heat. According to the memory solution, a DRAM chipset is attached to the motherboard. Therefore, the memory-down solution requires more space on the motherboard than a standard dual row of memory module sockets with the same memory capacity. In addition, the dual-row memory modules can be replaced for different capacities and servo requirements. However, due to insufficient height space in a server, the thermal conductivity of a dual-row memory module cannot effectively transfer heat to the upper heat sink. For example, a 1U server is a flat server that takes up one unit of space when mounted in a rack or tower server chassis. A 1U server is shaped like a pizza box and consists of a core processor, storage, memory slots, interfaces, and interfaces.

For telecom systems with dual-row memory modules, a one-piece die-cast finned heatsink is often provided for heat dissipation. For dual row memory module cooling, the air should flow through the dual row memory module. However, the prior art does not provide a dust-proof solution for such a die-cast finned heat sink.

Therefore, there exists a need for an improved frame/cooling plate or die cast fins to provide dust filtration for the air flowing through the dual row memory modules. Furthermore, adding an air filter to the telecommunications system should not affect the overall size of the telecommunications system. The present disclosure is directed to such a dustproof telecommunication system, providing a simple solution for dust filtration by providing a frame, a protective cover, or a cooling plate with replaceable/removable filter modules.

The terms of the embodiments and similar terms (eg, implementations, configurations, features, examples, and options) are intended to broadly refer to all of the subject matter of the present disclosure and The following claims apply for patent scope. Several statements containing these terms should be understood not to limit the meaning or scope of the subject matter described herein or to limit the scope of claims below. Embodiments of the disclosure covered herein are defined by the claims below, not the subject matter of the present invention. This novel summary is a high-level overview of various features of the disclosure and introduces some of the concepts more described in the description below. This novelty is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used on its own to determine the scope of the claimed subject matter. The subject matter should be understood by reference to the entire specification of the present disclosure, in due part, any or all drawings and claims of each application.

According to certain aspects of the present disclosure, a dustproof telecommunications system is disclosed. The dust-proof telecommunication system includes a chassis, a central processing unit or system chip located in the chassis, a central processing unit or system chip located in the chassis, and a filter module located in the chassis near the central processing unit or system chip. The filter module has a filter cover and a first air filter, the filter cover at least partially surrounds the central processing unit or the system chip, and the first air filter is located at an inlet of the airflow. The central processing unit or system die is cooled by airflow.

In some examples, the dust-proof telecommunication system further includes a cooling plate extending between the two side walls, the cooling plate and the side walls are arranged to form a protected space for protecting a plurality of computing components. In addition, a fin structure is formed on the cooling plate, and the fin structure extends outward from the protection space. In addition, an opening is formed on the cooling plate to receive the filter module, and when the filter module is placed in the opening, an upper surface of the filter cover is aligned with an upper surface of the fin structure.

In some examples, the first air filter is located between the upper surface and the lower surface of the filter cover. In some examples, the filter module further includes a second air filter The device is located between an outlet of the airflow and the upper surface and the lower surface of the filter cover. Additionally, the first air filter is on a first side of the filter cover, and the second air filter is on a second side of the filter cover opposite the first side.

In some examples, an opening is formed on the cooling plate to provide access to the protected space. Additionally, openings are formed adjacent to at least a portion of the CPU or system die and/or above at least a portion of the CPU or system die. In addition, a filter module is placed in the opening.

In some examples, the dust-proof telecommunication system further includes a memory module located in the chassis near the central processing unit or the system chip, and the opening is formed near at least a part of the central processing unit or the system chip and/or the central processing unit. At least a portion of the unit or system chip, and at least a portion of the memory module.

In some examples, a filter module positioned in the opening is alternatively secured to the cooling plate. In some examples, the filter module is secured by a fastening mechanism. For example, said fastening mechanism is provided by several removable screws which pass through the filter module and are received in the receiving part of the cooling plate. The filter module is configured to prevent airborne particles from entering the protected space.

According to certain aspects of the present disclosure, a telecommunications framework is disclosed for arranging a plurality of computing components. The telecommunications frame includes an airflow cooling device, an airflow opening, a protective space, and a replaceable filter module, the airflow opening cooling air flows through the airflow opening, the protective space is configured to enclose computing components, the replaceable filter module Has an air filter. Air filters are located near the airflow openings to prevent airborne particles from entering the protected space.

In some examples, the airflow opening is formed on an upper side of the airflow cooling device, so that when the filter module is removed from the airflow opening, at least one central processing unit or system The system chip and a memory module are visible or accessible through the airflow opening.

In some examples, the telecommunications frame further includes a fan array having a plurality of fans. Furthermore, the cooling air generated by the fan and filtered by the air filter leads to the dissipation of the heat generated in the protected space.

According to certain aspects of the present disclosure, a computing device is disclosed. The computing device includes a printed circuit board assembly, a central processing unit, a memory module, and a cooling plate, a plurality of computing components are installed on the printed circuit board assembly; the central processing unit is installed on the printed circuit board assembly; memory The module is placed on the printed circuit board assembly; the cooling plate covers the printed circuit board assembly. The cooling plate has a replaceable filter module. The filter module has an air filter. When the filter assembly is removed from the cooling plate, at least one of the central processing unit or the memory module is accessible.

In some examples, the computing device further includes a fan array having a plurality of fans. In addition, the cooling air generated by the fan and filtered by the air filter cools the central processing unit and the memory module, so that the heat generated by the central processing unit and the memory module is dissipated out of the computing device through the fan array or exhaust air. Additionally, an overall dimension of the computing device is the same whether the filter module is placed over or removed from an opening configured to receive the filter module.

The above novel content is not intended to present each embodiment or every feature of the present disclosure. Rather, the foregoing novelty merely provides examples of some of the novel features and characteristics set forth herein. The above and other features and advantages of the present disclosure will become apparent from the following detailed description of representative embodiments and modes for carrying out the present invention when taken in conjunction with the accompanying drawings and the appended claims. In view of the detailed description of various embodiments with reference to the accompanying drawings, a brief description of the symbols provided below, the present disclosure Additional features of the disclosure will be apparent to those of ordinary skill in the art.

100: server

101: table frame

200: Dust-proof telecommunication system

210: Chassis

220: central processing unit

230: Dual row memory module

240: fan array

250: Protective cover/cooling plate

260: opening

270: Filter module

270-1: filter cover

270-2: First Air Filter

270-3: Second air filter

270-4: screw

300: Chassis

The present disclosure and its advantages will be better understood from the following description of exemplary embodiments when taken in conjunction with the accompanying drawings. The drawings depict exemplary embodiments only, and therefore should not be considered limiting of the various embodiments or of the scope of the claims.

Figure 1A is a front view of a prior art server without a bezel.

Figure 1B is a front view of a prior art server with a bezel.

Figure 2A is an overall perspective view of a telecommunications frame without a protective cover in accordance with certain features of the present disclosure.

Figure 2B is an overall perspective view of a telecommunications frame with a protective cover having a filter module mounted thereon, in accordance with certain features of the present disclosure.

FIG. 2C is a general perspective view of the telecommunications frame shown in FIG. 2B with the filter module removed from the protective cover, according to certain aspects of the present disclosure.

FIG. 3 is an overall perspective view of a computing device showing components of the computing device according to certain aspects of the present disclosure.

FIG. 4 shows temperature distribution within a telecommunications system in accordance with certain features of the present disclosure.

The present invention is susceptible to various modifications and alternative forms. Some representative embodiments have been shown, by way of example, in the drawings and will be described in detail herein. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed. Rather, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the claims.

The present disclosure relates to a dustproof telecommunication system or telecommunication frame with a removable filter module. The filter module should be easily replaceable periodically or based on its condition. Furthermore, even if the filter module is assembled in the dust-proof telecommunication system or the telecommunication frame, the depth should not be affected so that the dust-proof telecommunication system or the telecommunication frame can be assembled where they need to be installed.

The various embodiments are described with reference to the drawings, wherein like reference characters are used to designate similar or equivalent elements throughout. The drawings are not drawn to scale and are provided merely to illustrate features and characteristics of the present disclosure. It should be understood that numerous specific details, relationships, and methods are set forth in order to provide a comprehensive understanding. However, it will be readily apparent to one of ordinary skill in the art that the various embodiments may be practiced without one or more of the specific details or otherwise. In some instances, well-known structures or operations are not shown in detail for illustrative purposes. The various embodiments are not limited by the order in which acts or events are presented, as some acts may occur in different orders and/or concurrently with other acts or events. In addition, not all shown acts or events may be required to implement some of the features and characteristics of the present disclosure.

For purposes of this embodiment, the singular includes the plural and vice versa unless expressly stated otherwise. The term "including" means "including without limitation". In addition, similar words such as "about (about, almost, substantially, approximately)" and similar words thereof may be used herein to mean, for example, "at (at)", "near, nearly at (near, nearly at)", "at 3% within 5% (within 3-5% of)", "within acceptable manufacturing tolerances manufacturing tolerances)” or any logical combination thereof. Similarly, the term "vertical" or "horizontal" is intended to additionally include "within 3-5%" of a vertical or horizontal direction, respectively. Additionally, directional words such as "top," "bottom," "left," "right," "above," and "below" are intended to relate to equivalent directions depicted in referenced drawings; understood from the context, for example, from the common location of an object or element; or other descriptions of such.

Referring to FIG. 2A , according to various embodiments of the present disclosure, a dustproof telecommunications system 200 has a chassis 210 and various components located within the chassis. For example, various components include key components such as a central processing unit (CPU) 220 or a system on chip (SoC). In some embodiments, the key components also include a memory module, a PCI Express card, and/or a chipset. Generally, such critical components cannot be cooled by a cooling plate placed on the chassis 210 . Further referring to FIG. 2A , the dustproof telecommunications system 200 also has a dual row memory module 230 and a fan array 240 . The CPU 220 and/or the dual-row memory module 230 are cooled by an airflow. Figure 2A shows the airflow direction. Depending on the system design, the direction of airflow may differ from that illustrated in Figure 2A. For example, the airflow direction is set by the fan array 240 .

Referring to FIG. 2B , the dust-proof telecommunication system 200 also has a protective cover 250 to protect the components (including the central processing unit 220 and the dual-row memory module 230 ) located in a protected space of the chassis 210 . According to various embodiments of the present disclosure, the protective cover 250 is configured as a cooling plate. In some embodiments, a fin structure is formed on the cooling plate and extends outward from the protected space. For example, a fin configuration includes a plurality of fins. For example, the cooling plate is a die-cast heat sink (HS). For example, die cast heat sinks are typically made of aluminum, zinc, or magnesium. As shown in FIG. 2C , an opening 260 is formed in the cooling plate/die cast heat sink 250 to receive a filter module 270 . Some components, such as the central processing unit 220 and the dual row memory module 230 are at least partially exposed through the opening 260 . Therefore, the CPU 220 and the dual-row memory module 230 can be accessed through the opening 260 for replacement or expansion. The opening 260 is sized to receive the filter module 270 and to fit snugly in the opening when the filter module is placed in the opening.

As shown in FIG. 2B and FIG. 2C, when the filter module 270 is assembled in the opening 260, the filter module is located near the key components that need to be cooled. For example, critical components include the central processing unit 220 and the dual-row memory module 230, and generally, these components are not sufficiently cooled by the cooling plate. As illustrated in FIGS. 2B, 2C, and 3, the filter module 270 has a filter cover 270-1 at least partially surrounding the central processing unit and/or other critical components that need to be cooled. That is, filter cap 270-1 is placed around critical components that need to be cooled. For example, filter cover 270-1 also surrounds components such as a system on chip (SoC), a memory module, a peripheral interconnect standard card, and/or a chipset that cannot be cooled by the cooling plate. As shown in FIG. 2B , when the filter module 270 is assembled in the opening 260 , the upper surface of the filter cover 270 - 1 is aligned with an upper surface of the protective cover 250 or the fin structure of the cooling plate. Although die-cast heat sinks are shown in FIGS. 2B and 2C , a different type of fin structure can be implemented for the protective cover 250 . It is worth noting that filter module 270 is different from conventional air filters that add to the overall length or depth of the chassis when attached to the chassis, even though filter module 270 is placed in opening 260 , the overall size of the chassis 210 will not change.

Referring to FIG. 3, the filter module 270 also has a first air filter 270-2 located at an inlet of the airflow. In some embodiments, the filter module 270 has an additional air filter (a second air filter 270-3) located at an outlet of the airflow. Both the first air filter 270-2 and the second air filter 270-3 are located between the upper side and the lower side of the filter cover 270-1. For example, the first air filter 270-2 is on a first side of the filter cover 270-1, and the second air filter 270-3 is on a second side of the filter cover 270-1 opposite to the first side. Figure 3 shows two air filters. In some embodiments, the number of filters may be 1, 2, 3, or 4.

In some embodiments, the filter module 270 is pre-assembled and can be used as a single replaceable module so that the entire filter module can be replaced periodically, or when the filter module is dirty or in a state of It can be replaced in bad condition, as shown in Fig. 2C. In some embodiments, the filter cover 270-1 is reusable, and only the first air filter 270-2 and the second air filter 270-3 are replaced. That is, the filter module 270 is removed from the opening 260, the first air filter 270-2 and the second air filter 270-3 are replaced with new air filters, and then there are new first and second air filters. The filter cap 270-1 of the air filter is inserted back into the opening. In some embodiments, the filter module 270 placed in the opening 260 is fixed to the protective cover 250 by a fastening mechanism. For example, the filter module 270 is fixed to the protective cover 250 by screws 270-4. In this case, the screw 270 - 4 passing through the filter module 270 is received at the receiving portion of the protective cover/cooling plate 250 . However, the fastening mechanism is not limited thereto, and other methods may also be used.

Referring to FIG. 3 , showing the direction of airflow, the cooling airflow entering the airflow inlet of the chassis 210 passes through at least one of the first air filter 270-2 or the second air filter 270-3, so that airborne particles are prevented from entering the protection. space. It is worth noting that, Depending on the design of the dust-proof telecommunications system 200, the direction of airflow may be different than that shown in FIG. 3 . The filtered cooling air passes through the CPU 220 radiator and the dual row memory modules 230, thereby cooling them. In addition, the heat generated by the components is finally dissipated through the airflow exhaust or the fan array 240 composed of a plurality of cooling fan units.

As shown in FIG. 3 , the placement of the filter module 270 does not affect the size of the dustproof telecommunications system 200 . Therefore, the dust-proof telecommunication system 200 with the filter module 270 can be assembled in a cabinet 300 without any problem in assembling into a rack or cabinet. Thus, the dustproof telecommunications system 200, according to various embodiments of the present disclosure, provides a very easy way to filter the cooling air being introduced into the chassis. That is, when used filter modules 270 need to be replaced, they can be discarded, and replacing them is easy. Therefore, it is very cost-effective, requiring only the filter module 270 instead of a table frame with a filter in conventional servers.

Figure 4 shows the results of the thermal simulation configuration. According to the results shown in FIG. 4 , the heat dissipation of the onboard components is efficiently conducted to the upper heat sink, and the CPU 220 and the dual-row memory module 230 are air-cooled. For example, the inlet temperature of the central processing unit 220 is 57° C., and the outlet temperature of the central processing unit 220 is 73.5° C., indicating that the cooling air takes away the heat generated by the central processing unit. In addition, a high velocity air flow passes through the heat sink of the CPU 220 and the dual-row memory module 230, thereby efficiently cooling them. These results clearly indicate that the airflow is not disturbed by the first air filter 270-2 and/or the second air filter 270-3 of the filter module 270, which prevents dust particles from entering the central processing unit 220 and the dual row memory The protected space in which the phantom set 230 is located.

The following are example specifications for filters used in filter module 270 . Pass The thickness of the filter is 5 mm, 10 mm, 15 mm, or 20 mm. The rated airflow of the filter is 1.5 m/s. The average capture rate of the filter is 65%, 70%, 80%, or 90%. The filter has an initial pressure drop (Pa) of 15, 18, 20, or 25 Pa. The final pressure drop (Pa) of the filter is 150, 180, 200, or 250. The filter has a dust holding capacity (g/m²) of 380, 400, 500, or 600. The specifications of the filter are not limited to the values stated above and can be changed as required.

While various embodiments of the present disclosure have been described above, it should be understood that they have been presented by way of example only, and not limitation. Various changes may be made in accordance with the disclosed embodiments of the present disclosure without departing from the spirit or scope of the present disclosure. Thus, the breadth and scope of the present disclosure should not be limited by any of the above-described embodiments. Instead, the scope of the disclosure should be defined in accordance with the following claims and their equivalents.

One or more elements or features or steps from any one or more of the following claims, or any part thereof, may be combined with one or more elements or features or steps from other one or more claims or combinations thereof, or any combination thereof to form one or more additional embodiments and/or claims of the present disclosure.

While examples of the present disclosure have been shown and described with respect to one or more implementations, equivalents and modifications will occur to others skilled in the art upon the reading and understanding of this specification and the annexed drawings. Additionally, while a particular feature of the present disclosure may have been disclosed with respect to only one of several embodiments, such feature may be combined with one or more of the other embodiments as may be desirable and advantageous for any given or particular application. combination of other features.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "one (a, an)" and "all "the" is intended to include the plural forms as well, unless the context clearly dictates otherwise. In addition, the terms "including (including, includes)", "having, has, with" or their variants used in the embodiments and/or scope of the patent application are intended to be similar to "comprising (comprising) )" is included.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. Furthermore, terms, such as those defined in commonly used dictionaries, shall be construed to have meanings consistent with their meanings in the relevant art, and unless expressly so defined, shall not be used herein in an idealized or overly formal sense explain.

200: Dust-proof telecommunication system

220: central processing unit

230: Dual row memory module

250: Protective cover/cooling plate

270: Filter module

270-1: filter cover

270-2: First Air Filter

270-3: Second air filter

270-4: screw

300: Chassis

Claims (8)

A dust-proof telecommunications system comprising: a chassis; a central processing unit or system chip located within the chassis, the central processing unit or system chip receiving and being cooled by an airflow; and a filter module located within the chassis . Near the central processing unit or system chip, the filter module has a filter cover at least partially surrounding the central processing unit or system chip, and the filter module further has a first air filter located at an inlet of the airflow. The dust-proof telecommunication system according to claim 1, further comprising: a cooling plate, a fin structure is formed on the cooling plate, and the fin structure extends outward from a protective space of the chassis. The dust-proof telecommunication system according to claim 2, wherein an opening is formed on the cooling plate to receive the filter module, and when the filter module is placed in the opening, an upper surface of the filter cover and the fin Align the upper surface of one of the sheet configurations. The dust-proof telecommunication system according to claim 3, wherein the first air filter is located between the upper surface and the lower surface of the filter cover. The dust-proof telecommunication system according to claim 4, wherein the filter module further includes a second air filter located between an outlet of the airflow and the upper surface and the lower surface of the filter cover. The dust-proof telecommunication system according to claim 2, wherein an opening is formed on the cooling plate for providing access to the protected space. The dust-proof telecommunication system according to claim 6, wherein the filter module is placed in the opening. The dust-proof telecommunication system as claimed in claim 7, wherein the filter module placed in the opening is replaceably fixed to the cooling plate.

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